HS-3182 ® Data Sheet May 30, 2008 ARINC 429 Bus Interface Line Driver Circuit FN2963.3 Features The HS-3182 is a monolithic dielectric ally isolated bipolar differential line driver designed to meet the specifications of ARINC 429. This device is intended to be used with a companion chip, HS-3282 CMOS ARINC Bus Interface Circuit, which provides the data formatting and processor interface function. All logic inputs are TTL and CMOS compatible. In addition to the DATA (A) and DATA (B) inputs, there are also inputs for CLOCK and SYNC signals which are AND’d with the DATA inputs. This feature enhances system performance and allows the HS-3182 to be used with devices other than the HS-3182. Three power supplies are necessary to operate the HS-3182: +V = +15V ±10%, -V = -15V ±10%, and V1 = 5V ±5%. VREF is used to program the differential output voltage swing such that VOUT (DIFF) = ±2VREF. Typically, VREF = V1 = 5V ±5%, but a separate power supply may be used for VREF which should not exceed 6V. • RoHS/Pb-free Available for SBDIP Package (100% Gold Termination Finish) • TTL and CMOS Compatible Inputs • Adjustable Rise and Fall Times via Two External Capacitors • Programmable Output Differential Voltage via VREF Input • Operates at Data Rates Up to 100k Bits/s • Output Short Circuit Proof and Contains Overvoltage Protection • Outputs are Inhibited (0V) If DATA (A) and DATA (B) Inputs are Both in the “Logic One” State • DATA (A) and DATA (B) Signals are “AND’d” with Clock and Sync Signals • Full Military Temperature Range Pinouts HS-3182 (16 LD SBDIP) TOP VIEW The driver output impedance is 75Ω ±20% at +25°C. Driver output rise and fall times are independently programmed through the use of two external capacitors connected to the CA and CB inputs. Typical capacitor values are CA = CB = 75pF for high-speed operation (100kBPS), and CA = CB = 300pF for low-speed operation (12kBPS to 14.5kBPS). The outputs are protected against overvoltage and short circuit as shown in the Block Diagram. The HS-3182 is designed to operate over an ambient temperature range of -55°C to +125°C, or -40°C to +85°C. VREF 1 16 V1 GND 2 15 NC 14 CLK SYNC 3 13 DATA (B) DATA (A) 4 CA 5 12 CB AOUT 6 11 BOUT -V 7 10 NC GND 8 9 +V TABLE 1. TRUTH TABLE 0V 0V Null L X X X 0V 0V Null H H L L 0V 0V Null H H L H -VREF +VREF Low H H H L +VREF -VREF High H H H H 0V 0V Null HS-3182 (28 LD CLCC) TOP VIEW 4 3 2 1 NC X V1 X NC L VREF X NC COMMENTS GND BOUT SYNC SYNC CLK DATA (A) DATA (B) AOUT 28 27 26 NC 5 25 CLK DATA (A) 6 24 NC NC 7 23 DATA (B) NC 8 22 CB CA 9 21 NC NC 10 20 NC NC 11 19 NC 1 NC BOUT +V GND -V AOUT NC 12 13 14 15 16 17 18 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1997, 2007, 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HS-3182 Ordering Information PART NUMBER ORDERING NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HS1-3182-8 5962-8687901EA HS1-3182-8 RD -55 to +125 16 Ld SBDIP, Solder Seal (Pb-free) D16.3 HS1-3182-9+ HS1-3182-9+ HS1-3182-9+ RD -40 to +85 16 Ld SBDIP, Solder Seal (Pb-free) D16.3 HS4-3182-8 5962-86879013A HS4- 3182-8 RD -55 to +125 28 Ld TER CLCC, Solder Seal J28.A NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Block Diagram (9) (5) +V CA (4) OUTPUT DRIVER (A) LEVEL SHIFTER AND SLOPE CONTROL (A) DATA (A) FA (6) AOUT ROUT/2 (14) CLOCK (8) (1) VREF GND CL RL (3) OUTPUT DRIVER ROUT/2 (B) SYNC LEVEL SHIFTER AND SLOPE CONTROL (B) (13) DATA (B) FB BOUT (11) (16) V1 (2) CURRENT REGULATOR -V (7) OVER-VOLTAGE PROTECTION CB (12) Typical Application (9) PIN NUMBERS INDICATED BY ( ) +5V +15V CA (16) (14) (3) (1) (5) V1 VREF CB (12) CA CB +V CLOCK SYNC AOUT BOUT HS-3182 ARINC DRIVER CIRCUIT 31 429D0 HS-3282 CMOS ARINC CIRCUIT 429D0 TO BUS (SEE NOTE) (4) DATA (A) 32 (13) DATA (B) 16 LEAD DIP GND (2) GND (8) -V (7) PIN NUMBER 10, 15 = NC -15V NOTE: The rise and fall time of the outputs are set to ARINC specified values by CA and CB. Typical CA = CB = 75pF for high speed and 300pF for low speed operation. The output HI and low levels are set to ARINC specifications by VREF. 2 FN2963.3 May 30, 2008 HS-3182 Absolute Maximum Ratings Thermal Information Voltage Between +V and -V Terminals . . . . . . . . . . . . . . . . . . . .40V V1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V VREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6V Logic Input Voltage . . . . . . . . . . . . . . . . . . . GND -0.3V to V1 +0.3V Output Short Circuit Duration. . . . . . . . . . . . . . . . . . . . . . . . (Note 3) Output Overvoltage Protection. . . . . . . . . . . . . . . . . . . . . . . (Note 4) Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) SBDIP Package . . . . . . . . . . . . . . . . . . 68 12 CLCC Package . . . . . . . . . . . . . . . . . . 54 10 Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +175°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Die Characteristics Operating Voltage +V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V ±10% -V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15V ±10% V1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±5% VREF (For ARINC 429) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±5% Operating Temperature Range HS-3182-9+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C HS-3182-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C Number of Transistors or Gates . . . . . . . . . . . . . . . . . . . . . . . . . 133 CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. θJC, the “case temp” location is the center of the package underside. 3. Heat sink may be required for 100k bits/s at +125°C and output short circuit at +125°C. 4. The fuses used for output overvoltage protection may be blown by a fault at each output of greater than ±6.5V relative to GND. DC Electrical Specifications Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. DC PARAMETER CONDITIONS (Note 5) SYMBOL MIN MAX UNITS Supply Current +V (Operating) ICCOP (+V) No Load (0k to 100k bits/s) - 16 mA Supply Current -V (Operating) ICCOP (-V) No Load (0k to 100k bits/s) -16 - mA Supply Current V1 (Operating) ICCOP (V1) No Load (0k to 100k bits/s) - 975 µA ICCOP (VREF) No Load (0k to 100k bits/s) -1.0 - mA Supply Current VREF (Operating) Logic “1” Input Voltage VIH 2.0 - V Logic “0” Input Voltage VIL - 0.5 V Output Voltage High (Output to GND) VOH No Load (0k to 100k bits/s) VREF (-250mV) VREF (+250mV) Output Voltage Low (Output to GND) VOL No Load (0k to 100k bits/s) -VREF (-250mV) -VREF (+250mV) VNULL No Load (0k to 100k bits/s) -250 +250 mV Output Voltage Null Input Current (Input Low) IIL -20 - mA Input Current (Input High) IIH - 10 mA Output Short Circuit Current (Output High) IOHSC Short to GND - -80 mA Output Short Circuit Current (Output Low) IOLSC Short to GND 80 - mA TA = +25°C 60 90 Ω Output Impedance ZO NOTES: 5. +V = +15V ±10%, -V = -15V ±10%, V1 = VREF = 5V ±5%, unless otherwise specified TA = -40°C to +85°C for HS-3182-9+ and TA = -55°C to +125°C for HS-3182-8. 3 FN2963.3 May 30, 2008 HS-3182 AC Electrical Specifications AC PARAMETER CONDITIONS (Note 6) SYMBOL Rise Time (AOUT, BOUT) tR MIN MAX UNITS 1 2 µs 0.9 2.4 µs CA = CB = 300pF, (Note 7) 3 9 µs CA = CB = 75pF, (Note 8) 1 2 µs 0.9 2.4 µs CA = CB = 300pF, (Note 8) 3 9 µs CA = CB = 75pF, (Note 7) (at TA = -55°C Only) Fall Time (AOUT, BOUT) tF (at TA = -55°C Only) Propagation Delay Input to Output tPLH CA = CB = 75pF, No Load - 3.3 µs Propagation Delay Input to Output tPHL CA = CB = 75pF, No Load - 3.3 µs NOTES: 6. +V = +15V, -V = -15V, V1 = VREF = 5V, unless otherwise specified TA = -40°C to +85°C for HS-3182-9+ and TA = -55°C to +125°C for HS-3182-8. 7. tR measured 50% to 90% x 2, no load. 8. tF measured 50% to 10% x 2, no load. Electrical Specifications PARAMETER CONDITIONS (NOTE 9) SYMBOL Input Capacitance CIN MIN MAX UNITS TA = +25°C - 15 pF Supply Current +V (Short Circuit) ISC (+V) Short to GND, TA = +25°C - 150 mA Supply Current -V (Short Circuit) ISC (-V) Short to GND, TA = +25°C -150 - mA NOTES: 9. Limits established by characterization and are not production tested. Power Specifications Nominal Power at +25°C, +V = +15V, -V = -15V, V1 = VREF = 5V, Notes 10, 12 DATA RATE (k BITS/s) +V V- V1 CHIP POWER POWER DISSIPATION IN LOAD No Load 11mA -10mA 600µA 325mW 0 12.5 to 14 Full Load, Note 11 24mA -24mA 600µA 660mW 60mW 100 Full Load, Note 11 46mA -46mA 600µA 1 Watt 325mW 0 to 100 LOAD NOTES: 10. Heat sink may be required for 100k bits/s at +125°C and output short circuit at +125°C. Thermal characteristics: T(CASE) = T(Junction) - θ(Junction - Case) P(Dissipation). Where: T(Junction Max) = +175°C θ(Junction - Case) = 10.9°C/W (6.1°C/W for LCC) θ(Junction - Ambient) = 73.5°C/W (54.0°C/W for LCC) 11. Full Load for ARINC 429: RL = 400Ω and CL = 30,000pF in parallel between AOUT and BOUT (See “Block Diagram” on page 2). 12. Output Overvoltage Protection: The fuses used for output overvoltage protection may be blown by a fault at each output of greater than ±6.5V relative to GND. 4 FN2963.3 May 30, 2008 HS-3182 Driver Waveforms 5V 0V 50% DATA (A) 0V 5V 0V 50% DATA (B) 0V ADJ. BY CB VREF +4.75V TO +5.25V AOUT 0V ADJ. BY CA tPHL -4.75V TO -5.25V VREF +4.75V TO +5.25V 50% BOUT 0V -VREF 50% tPLH tR DIFFERENTIAL OUTPUT -VREF -4.75V TO -5.25V 2VREF HIGH AOUT - BOUT +9.5V TO +10.5V NULL 0V -2VREF NOTE: OUTPUTS UNLOADED -9.5V TO -10.5V LOW tF NOTES: When the Data (A) input is in the Logic One state and the Data (B) input is in the Logic Zero state, AOUT is equal to VREF and BOUT is equal to -VREF. This constitutes the Output High state. Data (A) and Data (B) both in the Logic Zero state causes both AOUT and BOUT to be equal to 0V which designates the output Null state. Data (A) in the Logic Zero state and Data (B) in the Logic One state causes AOUT to be equal to -VREF and BOUT to be equal to VREF which is the Output Low state. tR measured 50% to 90% x 2 tF measured 50% to 10% x 2 VIH = 5V VOL = -4.75V to -5.25V VIL = 0V VOH = 4.75V to 5.25V Burn-In Schematic V1 DATA (B) +V VIH C3 16 15 1 2 14 13 12 11 HS-3182 3 4 5 6 A 10 9 7 8 R C1 DATA (A) VIH B C2 -V VIL VIL GND NOTES: Ambient Temp. Max. = +125°C. R = 400Ω ± 5% Package = 16 Lead Side Brazed DIP. C1 = 0.03mF ± 20% Pulse Conditions = A & B = 6.25kHz ±10%. B is delayed one-half cycle and in sync with A. C2 = C3 = 500pF, NPO +V = +15.5V ± 0.5V VIH = 2.0V Min. -V = -15.5V ± 0.5V VIL = 0.5V Max. V1 = +5.5V ± 0.5V A 0.0mF decoupling capacitor is required on each of the three supply lines (+V, -V and V1) at every 3rd Burn-In socket. 5 FN2963.3 May 30, 2008 HS-3182 Ceramic Leadless Chip Carrier Packages (CLCC) J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 SYMBOL j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- B1 L e -H- L3 MILLIMETERS MAX MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 0.050 0.088 1.27 2.23 - B - - - - - B1 0.022 0.028 0.56 0.71 2, 4 B2 0.072 REF 1.83 REF - B3 0.006 0.022 0.15 0.56 - D 0.442 0.460 11.23 11.68 - D1 0.300 BSC 7.62 BSC - D2 0.150 BSC 3.81 BSC - D3 - 0.460 E 0.442 0.460 11.23 11.68 2 11.68 - E1 0.300 BSC 7.62 BSC - E2 0.150 BSC 3.81 BSC - E3 e - 0.460 0.050 BSC 0.015 - - 11.68 2 1.27 BSC 0.38 - 2 h 0.040 REF 1.02 REF 5 j 0.020 REF 0.51 REF 5 L 0.045 0.055 1.14 1.40 - L1 0.045 0.055 1.14 1.40 - L2 0.075 0.095 1.90 2.41 - L3 0.003 0.015 0.08 0.038 - ND 7 7 3 NE 7 7 3 N 28 28 -F- 3 Rev. 0 5/18/94 B3 E1 E2 MIN A1 e1 0.007 M E F S H S MIN 1. Metallized castellations shall be connected to plane 1 terminals and extend toward plane 2 across at least two layers of ceramic or completely across all of the ceramic layers to make electrical connection with the optional plane 2 terminals. L2 B2 L1 D2 e1 D1 NOTES: 2. Unless otherwise specified, a minimum clearance of 0.015 inch (0.38mm) shall be maintained between all metallized features (e.g., lid, castellations, terminals, thermal pads, etc.) 3. Symbol “N” is the maximum number of terminals. Symbols “ND” and “NE” are the number of terminals along the sides of length “D” and “E”, respectively. 4. The required plane 1 terminals and optional plane 2 terminals (if used) shall be electrically connected. 5. The corner shape (square, notch, radius, etc.) may vary at the manufacturer’s option, from that shown on the drawing. 6. Chip carriers shall be constructed of a minimum of two ceramic layers. 7. Dimension “A” controls the overall package thickness. The maximum “A” dimension is package height before being solder dipped. 8. Dimensioning and tolerancing per ANSI Y14.5M-1982. 9. Controlling dimension: INCH. 6 FN2963.3 May 30, 2008 HS-3182 Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH c1 -A- 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S (c) SECTION A-A D S D BASE PLANE Q S2 -C- SEATING PLANE A L S1 eA A A b2 b e eA/2 c aaa M C A - B S D S ccc M C A - B S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. INCHES SYMBOL MIN MILLIMETERS MAX MIN MAX NOTES A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.840 - 21.34 - E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N 16 16 8 Rev. 0 4/94 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 7 FN2963.3 May 30, 2008