MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP24 NB CASE 565AL−01 ISSUE O DATE 06 JUL 2010 SCALE 1:1 0.20 C D D 2X A 0.20 C D L2 ÉÉ ÉÉ E1 PIN 1 REFERENCE e D 13 24 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT INLCUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 PER SIDE. D AND E1 ARE DETERMINED AT DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. E L DETAIL A 1 12 B GAUGE PLANE C SEATING PLANE 0.25 C D 24X TOP VIEW b 0.25 A 2X 12 TIPS M C A-B D A2 H 0.10 C h x 45° M 0.10 C 24X A1 SIDE VIEW C SEATING PLANE c END VIEW 24X 24 24X 13 XXXXXXXXXG AWLYYWW 1.12 XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 6.40 1 0.65 PITCH 12 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: STATUS: ON SEMICONDUCTOR STANDARD 1 NEW STANDARD: October, DESCRIPTION: 2002 − Rev. 0 *This information is generic. Please refer to device data sheet for actual part marking. 98AON52092E © Semiconductor Components Industries, LLC, 2002 SSOP24 NB MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 1.25 1.50 0.20 0.30 0.19 0.25 8.65 BSC 6.00 BSC 3.90 BSC 0.65 BSC 0.22 0.50 0.40 1.27 0.25 BSC 0_ 8_ GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT 0.42 DETAIL A DIM A A1 A2 b c D E E1 e h L L2 M http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON52092E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY B. MARQUIS. DATE 06 JUL 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 July, 2010 − Rev. 01O Case Outline Number: 565AL