MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP24 NB EP CASE 940AK ISSUE O DATE 24 APR 2012 SCALE 1:1 2X 0.20 C A-B NOTE 4 NOTE 6 D D A 2X 24 L1 H 13 L2 0.20 C NOTE 5 GAUGE PLANE ÉÉÉ ÉÉÉ E1 PIN 1 REFERENCE e E L DETAIL A A1 C NOTE 7 1 12 B 24X NOTE 6 TOP VIEW SEATING PLANE 0.20 C b 0.12 A 2X 12 TIPS M C A-B D DETAIL A A2 h h 0.10 C M 0.10 C 24X SIDE VIEW 0.15 M C A-B D A1 C SEATING PLANE c END VIEW NOTE 8 D2 0.15 E2 M C A-B D NOTE 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL BE 0.10 MAX. AT MMC. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. DIMENSION b APPLIES TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H. 5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED AT DATUM PLANE H. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. CONTOURS OF THE THERMAL PAD ARE UNCONTROLLED WITHIN THE REGION DEFINED BY DIMENSIONS D2 AND E2. DIM A A1 A2 b c D D2 E E1 E2 e h L L1 L2 M MILLIMETERS MIN MAX --1.70 0.00 0.10 1.10 1.65 0.19 0.30 0.09 0.20 8.64 BSC 5.28 5.58 6.00 BSC 3.90 BSC 2.44 2.64 0.65 BSC 0.25 0.50 0.40 0.85 1.00 REF 0.25 BSC 0_ 8_ GENERIC MARKING DIAGRAM* BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT XXXXXXXXXG AWLYYWW 5.63 XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 24X 1.15 2.84 6.40 1 24X 0.65 PITCH 0.40 *This information is generic. Please refer to device data sheet for actual part marking. DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: STATUS: 98AON79998E ON SEMICONDUCTOR STANDARD 1 NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SSOP24 NB EP http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON79998E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY B. FONTES. DATE 24 APR 2012 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. O Case Outline Number: 940AK