MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 11 March 2016, 10:02 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 1 May 2009 [Approved on 11 March 2016, 10:04 GMT]
Materials and substances
% w/w of
material
in the part
Use/Location
Material
group
Chip (die)
Other
inorganic
materials
0.50000%
Gold plating
0.12000%
Die attach
Encapsulation
EP (Epoxy
resin)
52.10000%
Substances in the material
CAS Number
% w/w of
substance
in the
material
Gold
7440-57-5
8.50000%
ALUMINIUM
7429-90-5
12.00000%
Silicon
7440-21-3
79.50000%
Tin
7440-31-5
20.00000%
Gold
7440-57-5
80.00000%
Carbon black
1333-86-4
0.30000%
ANTIMONY TRIOXIDE
1309-64-4
0.80000%
2,2-Bis(4(2',3'1675-54-3
epoxypropoxy)phenyl)propane
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Inner preparation
Gold
0.04500%
Gold
7440-57-5
100.00000%
Leadfinish
Tin plating
0.90000%
Tin
7440-31-5
100.00000%
Silver
7440-22-4
0.48000%
Leadframe
Copper (e.g.
copper
amounts in
cable
harnesses)
Copper
7440-50-8
0.95000%
Iron
7439-89-6
98.57000%
46.33500%
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
TO-92
TO-92
0.18
g
Page 1
Report generated: 11 March 2016, 10:02 GMT