MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 25 February 2016, 14:48 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 1 May 2009 [Approved on 25 February 2016, 14:49 GMT]
Materials and substances
Use/Location
Chip (die)
Die attach
Encapsulation
Material group
Other inorganic
materials
Lead and Lead
alloys
EP (Epoxy resin)
% w/w of
material in
the part
0.40000%
0.20000%
44.90000%
Substances in the
material
CAS Number
% w/w of
substance
in the
material
Nickel
7440-02-0
0.95000%
Gold
7440-57-5
10.95000%
Polydimethylsiloxane
rubber
63394-02-5
25.20000%
Silicon
7440-21-3
62.90000%
Silver
7440-22-4
1.50000%
Tin
7440-31-5
5.29700%
Lead
7439-92-1
93.20300%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol
A (TBBPA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Leadfinish
Tin plating
2.20000%
Tin
7440-31-5
100.00000%
Leadframe
Copper (e.g. copper
amounts in cable
harnesses)
52.30000%
Copper
7440-50-8
100.00000%
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
D 8 x 7.5
Diode axial
1.3
g
Page 1
Report generated: 25 February 2016, 14:48 GMT