Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 15 June 2016, 09:39 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 10 September 2010 [Approved on 15 June 2016, 09:36 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Material group Other inorganic materials Sn-Pb solder % w/w of material in the part 0.06000% 0.03000% EP (Epoxy resin) 41.58000% Substances in the material CAS Number % w/w of substance in the material Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Dow corning 3110 63394-02-5 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% Tetrabromobisphenol A 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Leadfinish Tin plating 0.48000% Tin 7440-31-5 100.00000% Leadframe Copper (e.g. copper amounts in cable harnesses) 57.85000% Copper 7440-50-8 100.00000% Attached parts list Part number Part name Part Mass Part Mass UoM TO-263AB Diode/Transistor Power 1.8 g Page 1 Report generated: 15 June 2016, 09:39 GMT