Datasheet 2.7V to 5.5V Input, 3A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9A301MUV-LB General Description Key Specifications This is the product guarantees long time support in Industrial market. BD9A301MUV-LB is a synchronous buck switching regulator with built-in low on-resistance power MOSFETs. It is capable of providing current up to 3A.The SLLMTM control provides excellent efficiency characteristics in light-load conditions which make the product ideal for equipment and devices that demand minimal standby power consumption. The oscillating frequency is high at 1MHz using a small value of inductance. It is a current mode control DC/DC converter and features high-speed transient response. Phase compensation can also be set easily. Input Voltage Range: 2.7V to 5.5V Output Voltage Range: 0.8V to VPVIN×0.7V Average Output Current: 3A(Max) Switching Frequency: 1MHz(Typ) High-Side MOSFET On-Resistance: 60mΩ (Typ) Low-Side MOSFET On-Resistance: 60mΩ (Typ) Standby Current: 0μA (Typ) Package VQFN016V3030 W(Typ) x D(Typ) x H(Max) 3.00mm x 3.00mm x 1.00mm Features Long Time Support Product for Industrial Application Synchronous Single DC/DC Converter. SLLMTM (Simple Light Load Mode) Control. Over Current Protection. Short Circuit Protection. Thermal Shutdown Protection. Under Voltage Lockout Protection. Adjustable Soft start Function. Power Good Output. VQFN016V3030 Package (Backside Heat Dissipation) VQFN016V3030 Applications Industrial Equipment, Step-Down Power Supply for DSPs, FPGAs, Microprocessors, etc. Storage Devices (HDDs/SSDs). Printers, OA Equipment. Distributed Power Supply, Secondary Power Supply. Typical Application Circuit Figure 1. Application Circuit 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Pin Configuration PVIN 1 PVIN 2 AVIN EN PGD BOOT (TOP VIEW) 16 15 14 13 12 SW 11 SW E-Pad FIN PGND 4 9 SS 5 6 7 8 MODE SW ITH 10 FB 3 AGND PGND Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name 1, 2 PVIN 3, 4 PGND 5 AGND 6 FB 7 ITH 8 MODE 9 SS 10, 11, 12 SW 13 BOOT 14 PGD 15 EN 16 AVIN - E-Pad Function Power supply terminals for the switching regulator. These terminals supply power to the output stage of the switching regulator. Connecting a 10µF ceramic capacitor is recommended. Ground terminals for the output stage of the switching regulator. Ground terminal for the control circuit. An inverting input node for the gm error amplifier. See page 23 for how to calculate the resistance of the output voltage setting. An input terminal for the gm error amplifier output and the output switch current comparator. Connect a frequency phase compensation component to this terminal. See page 24 for how to calculate the resistance and capacitance for phase compensation. Turning this terminal signal Low (0.2V or lower) forces the device to operate in the fixed frequency PWM mode. Turning this terminal signal High (0.8V or higher) enables the SLLM control and the mode is automatically switched between the SLLM control and fixed frequency PWM mode. Terminal for setting the soft start time. The rise time of the output voltage can be specified by connecting a capacitor to this terminal. See page 23 for how to calculate the capacitance. Switch nodes. These terminals are connected to the source of the high-side MOSFET and drain of the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between these terminals and BOOT terminals. In addition, connect an inductor of 1.5µH considering the direct current superimposition characteristic. Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminals. The voltage of this capacitor is the gate drive voltage of the high-side MOSFET. A “Power Good” terminal, an open drain output. Use of pull up resistor is needed. See page 18 for how to specify the resistance. When the FB terminal voltage reaches within ±7% of 0.8V (Typ), the internal Nch MOSFET turns off and the output turns High. Turning this terminal signal low (0.8V or lower) forces the device to enter the shutdown mode. Turning this terminal signal high (2.0V or higher) enables the device. This terminal must be terminated. Supplies power to the control circuit of the switching regulator. Connecting a 0.1µF ceramic capacitor is recommended. A backside heat dissipation pad. Connecting to the internal PCB ground plane by using multiple vias provides excellent heat dissipation characteristics. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Block Diagram Current Comparator gm Amplifier Figure 3. Block Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Description of Blocks 1. VREF The VREF block generates the internal reference voltage. 2. UVLO The UVLO block is for under voltage lockout protection. It will shut down the IC when the VIN falls to 2.45V (Typ) or lower. The threshold voltage has a hysteresis of 100mV (Typ). 3. SCP After the soft start is completed and when the feedback voltage of the output voltage has fallen below 0.4V (Typ) for 1msec (Typ), the SCP stops the operation for 16msec (Typ) and subsequently initiates restart. 4. OVP Over voltage protection function (OVP) compares FB terminal voltage with the internal standard voltage VREF. When the FB terminal voltage exceeds 0.88V (Typ) it turns MOSFET of output part MOSFET off. After output voltage drop it returns with hysteresis. 5. TSD The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal temperature of IC rises to 175C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25°C (Typ). 6. SOFT START The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. A built-in soft start function is provided and a soft start is initiated in 1msec (Typ) when the SS terminal is open. 7. gm Amplifier The gm Amplifier block compares the reference voltage with the feedback voltage of the output voltage. The error and the ITH terminal voltage determine the switching duty. A soft start is applied at startup. The ITH terminal voltage is limited by the internal slope voltage. 8. Current Comparator The Current Comparator block compares the output ITH terminal voltage of the error amplifier and the slope block signal to determine the switching duty. In the event of over current, the current that flows through the high-side MOSFET is limited at each cycle of the switching frequency. 9. OSC This block generates the oscillating frequency. 10. DRIVER LOGIC This block is a DC/DC driver. A signal from current comparator is applied to drive the MOSFETs. 11. PGOOD When the FB terminal voltage reaches 0.8V (Typ) within ±7%, the Nch MOSFET of the built-in open drain output turns off and the output turns high. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Absolute Maximum Ratings (Ta = 25°C) Parameter Supply Voltage EN Voltage Symbol Rating Unit VPVIN, VAVIN -0.3 to +7 V VEN -0.3 to +7 V MODE Voltage VMODE -0.3 to +7 V PGD Voltage VPGD -0.3 to +7 V Voltage from GND to BOOT VBOOT -0.3 to +14 V Voltage from SW to BOOT ⊿VBOOT -0.3 to +7 V FB Voltage VFB -0.3 to +7 V ITH Voltage VITH -0.3 to +7 V VSW -0.3 to VPVIN + 0.3 V SW Voltage Allowable Power Dissipation (Note 1) Maximum Junction Temperature Storage Temperature Range Pd 2.66 W Tjmax 150 °C Tstg -55 to 150 °C (Note 1) When mounted on a 70mm x 70mm x 1.6mm 4-layer glass epoxy board (copper foil area: 70 mm x 70 mm) Derate by 21.3mW when operating above 25C. Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution2: Long-term reliability may be influenced when operated at or near the absolute maximum rating. Recommended Operating Conditions Parameter Supply Voltage Output Current(Note 2) Output Voltage Range Operating Junction Temperature Range Symbol Min Typ Max Unit VPVIN, VAVIN IOUT 2.7 - 5.5 V - - 3 A VRANGE 0.8 - VPVIN × 0.7 V Tj -40 - +125 °C (Note 2) Pd,ASO should not be exceeded. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Electrical Characteristics (Unless otherwise specified Ta = 25°C, VAVIN = VPVIN, = 5V, VEN = 5V) Parameter Symbol Min Typ Max Unit Conditions Standby Supply Current ISTB - 0 10 µA Operating Supply Current ICC - 350 500 µA UVLO Detection Voltage VUVLO1 2.35 2.45 2.55 V EN= GND IOUT= 0mA Non-switching VIN falling UVLO Release Voltage VUVLO2 2.425 2.55 2.7 V VIN rising EN Threshold Voltage High VENH 2.0 - - V EN Threshold Voltage Low VENL - - 0.8 V IEN - 5 10 µA VMODEH 0.2 0.4 0.8 V IMODE - 10 20 µA FB Terminal Voltage VFB 0.792 0.8 0.808 V FB Input Current IFB - 0 1 µA AVIN PIN ENABLE EN Input Current EN= 5V MODE MODE Threshold Voltage MODE Input Current MODE= 5V Reference Voltage, Error Amplifier FB= 0.8V ITH Sink Current ITHSI 10 20 40 µA FB= 0.9V ITH Source Current ITHSO 10 20 40 µA FB= 0.7V Soft Start Time TSS 0.5 1.0 2.0 ms With internal constant Soft Start Current ISS 0.9 1.8 3.6 µA FOSC 800 1000 1200 kHz Falling (Fault) Voltage VPGDFF 87 90 93 % OUTPUT voltage falling Rising (Good) Voltage VPGDRG 90 93 96 % OUTPUT voltage rising Rising (Fault) Voltage VPGDRF 107 110 113 % OUTPUT voltage rising Falling (Good) Voltage VPGDFG 104 107 110 % OUTPUT voltage falling PGD Output Leakage Current ILKPGD - 0 5 µA PGD= 5V Power Good ON Resistance RPGD - 100 200 Ω Power Good Low Level Voltage PGDVL - 0.1 0.2 V SWITCHING FREQUENCY Switching Frequency POWER GOOD IPGD= 1mA SWITCH MOSFET High Side FET ON Resistance RONH - 60 120 mΩ Low Side FET ON Resistance RONL - 60 120 mΩ High Side Output Leakage Current RILH - 0 10 µA Non-switching Low Side Output Leakage Current RILL - 0 10 µA Non-switching VSCP 0.28 0.4 0.52 V SCP Short Circuit Protection Detection Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/32 BOOT – SW= 5V TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves 5.0 800 4.5 700 4.0 3.5 VIN = 5.5V 3.0 500 Istb[µA] Icc[µA] 600 400 2.5 2.0 1.5 300 VIN = 2.7V 200 0.5 100 0.0 -40 -20 0 20 40 60 80 -40 100 120 -20 0 20 40 60 80 100 120 Temperature[°C] Temperature[°C] Figure 5. Stand-by Current vs Temperature Figure 4. Operating Current vs Temperature 1.20 0.808 1.15 0.806 VIN = 2.7V 1.10 0.804 1.05 0.802 VFB[V] FOSC [MHz] VIN = 5.5V VIN = 2.7V 1.0 1.00 0.95 VIN = 2.7V 0.800 0.798 0.90 0.796 VIN = 5.0V 0.85 0.794 0.80 0.792 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 6. Switching Frequency vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VIN = 5.0V Figure 7. FB Voltage vs Temperature 7/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves - continued 40 40 35 35 VIN = 5.0V 30 VIN = 5.0V Isource[µA] Isink[µA] 30 25 25 20 20 VIN = 2.7V VIN = 2.7V 15 15 10 10 -40 -20 0 20 40 60 80 -40 100 120 -20 0 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 8. ITH Sink Current vs Temperature Figure 9. ITH Source Current vs Temperature 20 0.8 VIN = 5.0V 18 0.7 16 MODE = 5.0V 14 Imode[µA] 0.6 Vmode[µA] 20 0.5 0.4 12 10 8 6 4 0.3 MODE = 2.7V 2 0.2 0 -40 -20 0 20 40 60 80 100 120 Temperature[℃] -20 0 20 40 60 80 100 120 Temperature[℃] Figure 10. Mode Threshold vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 11. Mode Input Current vs Temperature 8/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves - continued 2.0 3.0 Css = OPEN 2.5 VIN = 2.7V 1.5 VIN = 5.5V 2.0 ISS[µA] TSS[msec] VIN = 2.7V 1.0 1.5 VIN = 5.0V 0.5 1.0 0.0 0.5 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature[℃] 60 80 100 120 Figure 13. Soft Start Terminal Current vs Temperature 120 120 110 110 100 100 90 90 R ONL[mΩ] R ONH [mΩ] 40 Temperature[℃] Figure 12. Soft Start Time vs Temperature VIN = 2.7V 80 20 70 60 VIN = 2.7V 80 70 60 VIN = 5.0V VIN = 3.3V 50 VIN = 5.0V 50 40 VIN = 3.3V 40 30 30 -40 -20 0 20 40 60 80 100 120 Temperature[℃] -20 0 20 40 60 80 100 120 Temperature[℃] Figure 14. High side FET ON-Resistance vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 9/32 Figure 15. Low side FET ON-Resistance vs Temperature TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves - continued -6 14 VIN = 5.0V -7 -8 12 Good -9 Fault 11 VPGD[%] VPGD[%] VIN = 5.0V 13 -10 -11 10 9 Fault -12 8 -13 7 -14 6 -40 -20 0 20 40 60 80 100 Good -40 120 -20 0 Temperature[℃] 40 60 80 100 120 Temperature[℃] Figure 17. PGD Voltage vs Temperature Figure 16. PGD Voltage vs Temperature 3.0 100 2.9 90 2.8 80 2.7 VUVLO[V] VIN = 2.7V 70 RPGD[Ω] 20 60 VIN = 5.0V 50 Release 2.6 2.5 2.4 2.3 40 Detect 2.2 30 2.1 20 2.0 -40 -20 0 20 40 60 80 100 120 Temperature[℃] -20 0 20 40 60 80 100 120 Temperature[℃] Figure 19. UVLO Threshold vs Temperature Figure 18. PGD ON-Resistance vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 10/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves - continued 2.0 7.0 6.5 1.8 6.0 UP 1.6 5.5 IEN[µA] VEN[V] EN = 5.0V 1.4 5.0 4.5 1.2 4.0 DOWN 1.0 3.5 0.8 3.0 -40 -20 0 20 40 60 80 100 120 Temperature[℃] -20 0 20 40 60 80 100 120 Temperature[℃] Figure 20. EN Threshold vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 21. EN Input Current vs Temperature 11/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves (Application) 100 100 MODE = H 90 90 80 80 70 70 60 60 Efficiency[%] 50 MODE = L 40 50 MODE = L 40 30 30 20 20 VIN =5.0V VOUT =1.8V 10 VIN =5.0V VOUT =1.8V 10 0 0 0.001 0.01 0.1 1 10 0.001 0.01 Output_Current [A] 1 10 Output_Current [A] Figure 23. Efficiency vs Load Current (VIN=3.3V, VOUT=1.8V, L=1.5μH) Figure 22. Efficiency vs Load Current (VIN=5V, VOUT=1.8V, L=1.5μH) 100 80 90 180 VIN=5V VOUT=1.8V 60 80 135 phase 40 70 60 VOUT =1.8V 50 90 VOUT =3.3V VOUT =1.2V Gain[dB] Efficiency[%] 0.1 20 45 0 0 gain 40 -20 30 -40 -90 -60 -135 -80 -180 20 10 VCC = 5.0V 0 0 0.5 1 1.5 2 2.5 1K 3 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10K 100K 1M Frequency[Hz] Output_Current [A] Figure 24. Efficiency vs Load Current (VIN = 5.0V, MODE = 5.0V, L=1.5μH) -45 Phase[deg] Efficiency[%] MODE = H Figure 25. Closed Loop Response (VIN=5V, VOUT=1.8V, IOUT=1A, L=1.5μH, COUT=Ceramic 44μF) 12/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves (Application) - continued VIN=5V/div VIN=5V/div EN=5V/div EN=5V/div Time=1ms/div Time=1ms/div VOUT=1V/div VOUT=1V/div SW=5V/div SW=5V/div Figure 27. Power Down (VIN = EN) Figure 26. Power Up (VIN = EN) VIN=5V/div VIN=5V/div EN=5V/div EN=5V/div Time=1ms/div Time=1ms/div VOUT=1V/div VOUT=1V/div SW=5V/div SW=5V/div Figure 28. Power Up (EN = 0V→5V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 29. Power Down (EN = 5V→0V) 13/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves (Application) - continued VOUT= 20mV/div SW= 2V/div VOUT= 20mV/div SW= 2V/div Time= 0.5ms/div Figure 31. Output Ripple (VIN = 5V, VOUT = 1.8V, IOUT = 3A) Figure 30. Output Ripple (VIN = 5V, VOUT = 1.8V, IOUT = 0A) VIN=50mV/div VIN=50mV/div SW=2V/div Time=20ms/div SW=2V/div Figure 32. Input Ripple (VIN = 5V, VOUT = 1.8V, IOUT = 0A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Time= 1µs/div Time=1µs/div Figure 33. Input Ripple (VIN = 5V, VOUT = 1.8V, IOUT = 3A) 14/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Typical Performance Curves (Application) - continued IL= 1A/div IL= 1A/div Time= 1µs/div SW= 2V/div Time= 1µs/div SW= 2V/div Figure 35. Switching Waveform (VIN = 5.0V, VOUT = 1.8V, IOUT = 1A, L=1.5µH) Figure 34. Switching Waveform (VIN = 3.3V, VOUT = 1.8V, IOUT = 1A, L=1.5µH) IL= 500mA/div Time= 10µs/div SW= 2V/div SLLM TM Control TM Figure 36. Switching Waveform with SLLM (VIN = 3.3V, VOUT = 1.8V, IOUT = 30mA, L=1.5µH) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB 0.4 0.4 0.3 0.3 Output Voltage Deviation [%] Output Voltage Deviation[%] Typical Performance Curves (Application) - continued 0.2 0.1 0.0 -0.1 -0.2 0.2 0.1 0 -0.1 -0.2 VOUT=1.8V -0.3 VIN=5.0V VOUT=1.8V -0.3 -0.4 2.5 3.0 3.5 4.0 4.5 5.0 -0.4 5.5 0 VIN Input Voltage[V] 1 2 3 Output Current [A] Figure 38. Load Regulation vs Load Current Figure 37. Line Regulation vs Input Voltage VOUT= 50mV/div VOUT= 50mV/div Time= 1ms/div Time= 1ms/div IOUT= 1A/div IOUT= 1A/div Figure 39. Load Transient Response IOUT= 0.75A to 2.25A load step (VIN= 5V, VOUT= 1.8V, COUT= Ceramic 44μF) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 40. Load Transient Response IOUT=0A to 3A load step (VIN= 5V, VOUT= 1.8V, COUT= Ceramic 44μF) 16/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB 1. Function Explanations (1) DC/DC converter operation BD9A301MUV-LB is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes SLLM (Simple Light Load Mode) control for lighter load to improve efficiency. Efficiency η[%] ① SLLMTM control ② PWM control Output current IOUT [A] Figure 41. Efficiency (SLLMTM control and PWM control) ①SLLM TM ②PWM control control VOUT =50mV/div VOUT =50mV/div Time=5µs/div Time=5µs/div SW=2V/div SW=2V/div Figure 42. SW Waveform (SLLMTM control) (VIN = 5.0V, VOUT = 1.8V, IOUT = 50mA) Figure 43. SW Waveform (PWM control) (VIN = 5.0V, VOUT = 1.8V, IOUT = 1A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB (2) Enable Control The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 1.5V (Typ), the internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown interval (Low level interval of EN) must be set to 100µs or longer. VEN EN terminal VENH VENL 0 t VOUT Output setting voltage 0 t Soft start 1 msec (Typ) Figure 44. Start Up and Down with Enable (3) Power Good When the output voltage reaches outside ±10% of the voltage setting, the open drain N-ch MOSFET internally connected to the PGD terminal turns on and the PGD terminal is pulled down with an impedance of 100Ω (Typ). A hysteresis of 3% applies to resetting. Connecting a pull up resistor (10kΩ to 100kΩ) is recommended. +10% +7% VOUT -7% -10% PGD Figure 45. PGD Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB 2. Protection The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them for continuous protective operation. (1) Short Circuit Protection (SCP) The short circuit protection block compares the FB terminal voltage with the internal reference voltage VREF. When the FB terminal voltage has fallen below 0.4V (Typ) and remained there for 1msec (Typ), SCP stops the operation for 16msec (Typ) and subsequently initiates a restart. EN Terminal 2.0V or higher FB Terminal ＜0.4V(Typ) ＞0.4V(Typ) 0.8V or lower - Short Circuit Protection Enabled Disabled Short Circuit Protection Operation ON OFF OFF Figure 46. Short Circuit Protection (SCP) timing chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB (2) Under Voltage Lockout Protection (UVLO) The Under Voltage Lockout Protection circuit monitors the AVIN terminal voltage. The operation enters standby when the AVIN terminal voltage is 2.45V (Typ) or lower. The operation starts when the AVIN terminal voltage is 2.55V (Typ) or higher. Figure 47. UVLO Timing Chart (3) Thermal Shutdown When the chip temperature exceeds Tj = 175C, the DC/DC converter output is stopped. The thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax = 150C. It is not meant to protect or guarantee the soundness of the application. Do not use the function of this circuit for application protection design. (4) Over Current Protection The Over Current Protection function operates by using the current mode control to limit the current that flows through the high-side MOSFET at each cycle of the switching frequency. The designed over current limit value is 6.0A (Typ). (5) Over Voltage Protection (OVP) Over voltage protection function (OVP) compares FB terminal voltage with internal standard voltage VREF and when FB terminal voltage exceeds 0.88V (Typ) it turns MOSFET of output part MOSFET off. After output voltage drop it returns with hysteresis. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Application Example Figure 48. Application Circuit Table 1. Recommended Component Values Output Voltage Reference Designator 1.1V 1.2V 1.5V 1.8V 3.3V R3 8.2kΩ 8.2kΩ 9.1kΩ 9.1kΩ 18kΩ - R5 100kΩ 100kΩ 100kΩ 100kΩ 100kΩ - R7 10kΩ 10kΩ 16kΩ 30kΩ 75kΩ - R8 27kΩ 20kΩ 18kΩ 24kΩ 24kΩ - C2 10μF 10μF 10μF 10μF 10μF 10V, X5R, 3216 C4 0.1μF 0.1μF 0.1μF 0.1μF 0.1μF 25V, X5R, 1608 C6 2700pF 2700pF 2700pF 2700pF 2700pF - C7 0.01μF 0.01μF 0.01μF 0.01μF 0.01μF - C8 0.1μF 0.1μF 0.1μF 0.1μF 0.1μF - C9 22μF 22μF 22μF 22μF 22μF 10V, X5R, 3225 C10 22μF 22μF 22μF 22μF 22μF 10V, X5R, 3225 L1 1.5μH 1.5μH 1.5μH 1.5μH 1.5μH TOKO, FDSD0630 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/32 Description TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Selection of Components Externally Connected 1. Output LC Filter Constant The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the TM load. BD9A301MUV-LB is returned to the IC and IL ripple current flowing through the inductor for SLLM control. This feedback current, Inductance value is the behavior of the best when the 1.5µH. Therefore, the inductor to use is recommended 1.5µH. IL Inductor saturation current > IOUTMAX +⊿IL /2 IOUTMAX ⊿IL Average inductor current t Figure 49. Waveform of current through inductor Figure 50. Output LC filter circuit Computation with VIN = 5V, VOUT = 1.8V, L=1.5µH, and the switching frequency FOSC = 1MHz, the method is as below. Inductor ripple current ∆IL ΔI L VOUT V IN -VOUT 1 FOSC V IN 768 mA L The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ripple current ∆IL. The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the required ripple voltage characteristics. The output ripple voltage can be represented by the following equation. ΔV RPL ΔI L R ESR 1 8 C OUT FOSC [V ] RESR is the Equivalent Series Resistance (ESR) of the output capacitor. With COUT = 44µF, RESR = 10mΩ the output ripple voltage is calculated as ΔV RPL 0.768 10m 8 1 44μ 1MHz 9.8 mV *Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT. Use maximum additional capacitor CLOAD(max.) condition which satisfies the following method. Maximum starting inductor ripple current ILSTART Over Current limit 3.8 A min Maximum starting inductor ripple current ILSTART can be expressed in the following method. ILSTART Maximum starting output current I OMAX www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/32 Charge current to output capacitor I CAP ΔI L 2 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Charge current to output capacitor ICAP can be expressed in the following method. I CAP C OUT C LOAD TSS VOUT [A ] Computation with VIN= 5V, VOUT= 3.3V, L= 1.5µH, switching frequency FOSC= 800kHz(Min), Output capacitor COUT= 44µF, Soft Start time TSS= 0.5ms(Min), load current during soft start IOSS= 2A the method is as below. 3.8 ‐ I OSS ‐ ΔI L /2 VOUT C LOAD max TSS ‐ C OUT 157.9 μF If the value of CLOAD is large, and cannot meet the above equation, 1.5 ‐ I OSS ‐ ΔI L /2 VOUT I SS C LOAD max V FB C SS ‐ C OUT Adjust the value of the capacitor CSS to meet the above formula. (Refer to the following items (3) Soft Start Setting equation of time TSS and soft-start value of the capacitor to be connected to the CSS.) Computation with VIN = 5V, VOUT = 3.3V, L = 1.5µH, load current during soft start IOSS = 2A, switching frequency FOSC= 800kHz (Min), Output capacitor COUT = 44µF, VFB = 0.792V(Max), ISS = 3.6µA(Max), A capacitor connected to the CSS if you want to connect the CLOAD = 220uF is the following equation. V OUT I SS 3.8 ‐ I OSS ‐ ΔI L /2 C SS 2. V FB C LOAD C OUT 2.97 [nF ] Output Voltage Setting The output voltage value can be set by the feedback resistance ratio. VOUT R1 gm Amp FB － R2 VOUT ＋ R1 R2 R2 0.8 [V ] 0.8V Figure 51. Feedback Resistor Circuit 3. Soft Start Setting Turning the EN terminal signal high activates the soft start function. This causes the output voltage to rise gradually while the current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush current. The rise time depends on the value of the capacitor connected to the SS terminal. TSS C SS V FB /I SS TSS : Soft Start Time C SS : Capacitor connected to Soft Start Time Termina l V FB : FB Terminal Voltage (0.8V (Typ)) I SS : Soft Start Terminal Source Current (1.8μA(Typ)) with C SS TSS 0.01μF, 0.010 [μF] 0.8 [ V ]) /1.8 [μA ] 4.44 [msec ] Turning the EN terminal signal high with the SS terminal open (no capacitor connected) or with the terminal signal high causes the output voltage to rise in 1msec (Typ). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB 4. Phase Compensation Component A current mode control buck DC/DC converter is a one-pole, one-zero system. One poles are formed by an error amplifier and load and the one zero point is added by phase compensation. The phase compensation resistor RITH determines the crossover frequency FCRS where the total loop gain of the DC/DC converter is 0dB. A high value crossover frequency FCRS provides a good load transient response characteristic but inferior stability. Conversely, a low value crossover frequency FCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired. (1) Selection of Phase Compensation Resistor RITH The Phase Compensation Resistance RITH can be determined by using the following equation. 2π R ITH VOUT FCRS C OUT [Ω] V FB G MP G MA ] VOUT : Output Voltage[V F CRS: Crossover Frequency [Hz] C OUT : Output Capacitance[F] V FB : Feedback Reference Voltage (0.8V (Typ)) G MP : Current Sense Gain (13A/V (Typ)) G MA : Error Amplifier Trans conductanc e (260μA /V (Typ)) (2) Selection of Phase Compensation Capacitance CITH For stable operation of the DC/DC converter, zero for compensation cancels the phase delay due to the pole formed by the load. The phase compensation capacitance CITH can be determined by using the following equation. C OUT R ITH C ITH (3) VOUT [F] I OUT Loop stability To ensure the stability of the DC/DC converter, make sure that a sufficient phase margin is provided. A phase margin of at least 45º in the worst conditions is recommended. VOUT A (a) Gain [dB] RUP FB RDW － GBW(b) ITH 0 ＋ RITH 0.8V CITH －90 f FCRS 0 Phase[deg] －90° PHASE MARGIN －180° －180 f Figure 52. Phase Compensation Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 53. Bode Plot 24/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB PCB Layout Design In the buck DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current flows when the high-side FET is turned on. The flow starts from the input capacitor CIN, runs through the FET, inductor L and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current flows when the low-side FET is turned on. The flow starts from the low-side FET, runs through the inductor L and output capacitor COUT and back to GND of the low-side FET via GND of COUT. Route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors directly to the GND plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat generation, noise and efficiency characteristics. VIN MOS FET CIN VOUT L COUT Figure 54. Current Loop of Buck DC/DC Converter Accordingly, design the PCB layout considering the following points. Connect an input capacitor as close as possible to the IC PVIN terminal on the same plane as the IC. If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from the IC and the surrounding components. Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as thick and as short as possible. Provide lines connected to FB and ITH far from the SW nodes. Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. EN VIN CIN L VOUT GND GND COUT Top Layer Bottom Layer Figure 55. Example of evaluation board layout www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Power Dissipation When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. This package incorporates an exposed thermal pad. Solder directly to the PCB ground plane. After soldering, the PCB can be used as a heatsink. The exposed thermal pad dimensions for this package are shown in page 31. 4.0 Allowable power dissipation: Pd [W] 3.0 2.0 1.0 (1)4-layer board (surface heat dissipation copper foil 5505mm2) (copper foil laminated on each layer) JA=47.0°C/W (2) 4-layer board (surface heat dissipation copper foil 6.28mm2) (copper foil laminated on each layer) JA=70.62°C/W (3) 1-layer board (surface heat dissipation copper foil 6.28mm2) JA=201.6°C/W (4) IC only JA=462.9°C/W ①2.66W ②1.77W ③0.62W ④0.27W 0 0 25 50 75 85 100 125 150 Ambient temperature: Ta [°C]] Figure 56. Thermal Derating Characteristics (VQFN016V3030) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB I/O equivalence circuits 6. FB 7. ITH 8. MODE 9. SS MODE 10Ω 10kΩ AGND 500kΩ AGND 10.11.12. SW13. BOOT 14. PGD PGD 60Ω AGND AGND 15. EN EN 430kΩ 10kΩ AGND 570kΩ AGND www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 AGND 27/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm 4-layer glass epoxy board. In case of exceeding this absolute maximum rating increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 56. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Ordering Information B D 9 A 3 0 Part Number 1 M U V Package VQFN016V3030 - LBE2 Product class LB: for Industrial applications Packaging and forming specification E2: Embossed tape and reel Marking Diagrams VQFN016V3030 (TOP VIEW) Part Number Marking D9A LOT Number 3 0 1 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Physical Dimension, Tape and Reel Information Package Name VQFN016V3030 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 31/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet BD9A301MUV-LB Revision History Date Revision 20.Aug.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/32 TSZ02201-0J3J0AJ00680-1-2 20.Aug.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001