Datasheet 7.0V to 36V Input, 2.5A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9E300EFJ-LB General Description Key Specifications This is the product guarantees long time support in Industrial market. BD9E300EFJ-LB is a synchronous buck switching regulator with built-in power MOSFETs. It is capable of an output current of up to 2.5A. It has a high oscillation frequency of 1MHz while using small inductance value. It is a current mode control DC/DC converter and features high-speed transient response. Phase compensation can also be set easily. Input Voltage Range: 7.0V to 36V Output Voltage Range: 1.0V to VIN×0.7V Output Current: 2.5A (Max) Switching Frequency: 1MHz (Typ) High-Side MOSFET ON-Resistance: 170mΩ (Typ) Low-Side MOSFET ON-Resistance: 140mΩ (Typ) Standby Current: 0μA (Typ) Package HTSOP-J8 W (Typ) x D (Typ) x H (Max) 4.90mm x 6.00mm x 1.00mm Features Long Time Support Product for Industrial Applications. Synchronous single DC/DC converter. Over-Current Protection. Short Circuit Protection. Thermal Shutdown Protection. Undervoltage Lockout Protection. Soft Start. HTSOP-J8 package (Exposed Pad). Applications Industrial Equipment. Power supply for FA’s industrial device using 24V bass. Consumer applications such as home appliance. Distribution type power supply system for 12V, and 24V. HTSOP-J8 Typical Application Circuit VIN 24V 2 VIN BD9E300EFJ-LB BOOT 1 10µF 0.1μF VOUT SW 8 4.7μH Enable 3 EN 22μF×2 COMP AGND PGND FB 6 4 7 5 12kΩ 30kΩ 3kΩ 4700pF Figure 1. Application circuit ○Product structure：Silicon monolithic integrated circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays. 1/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Pin Configuration (TOP VIEW) BOOT 1 VIN 2 8 SW 7 PGND E-Pad EN 3 6 COMP AGND 4 5 FB Figure 2. Pin assignment Pin Description(s) Pin No Pin Name Description 1 BOOT 2 VIN Power supply terminal for the switching regulator and control circuit. Connecting a 10µF ceramic capacitor is recommended. 3 EN Turning this terminal signal low-level (0.8V or lower) forces the device to enter the shut down mode. Turning this terminal signal high-level (2.5V or higher) enables the device. This terminal must be terminated. 4 AGND 5 FB Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminal. The voltage of this capacitor is the gate drive voltage of the high-side MOSFET. Ground terminal for the control circuit. Inverting input node for the gm error amplifier. See page 22 on how to calculate the resistance of the output voltage setting. 6 COMP Input terminal for the gm error amplifier output and the output switch current comparator. Connect a frequency phase compensation component to this terminal. See page 23 on how to calculate the resistance and capacitance for phase compensation. 7 PGND Ground terminal for the output stage of the switching regulator. 8 SW - E-Pad Switch node. This terminal is connected to the source of the high-side MOSFET and drain of the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between this terminal and BOOT terminal. In addition, connect an inductor considering the direct current superimposition characteristic. Exposed pad. Connecting this to the internal PCB ground plane using multiple vias provides excellent heat dissipation characteristics. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 2/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Block Diagram EN 3 3V 5V VREG3 1 BOOTREG VREG BOOT SCP OVP UVLO OSC VIN OCP TSD 2 RCP VIN S VOUT DRIVER 8 ERR SW LOGIC FB 5 SLOPE COMP PWM R 6 7 PGND SOFT START 4 AGND Figure 3. Block diagram www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 3/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Description of Block VREG3 Block creating internal reference voltage 3V (Typ). VREG Block creating internal reference voltage 5V (Typ). BOOTREG Block creating gate drive voltage. TSD This is the thermal shutdown block. Thermal shutdown circuit shuts down the whole system if temperature exceeds 175°C (Typ). When the temperature decreases, it returns to normal operation with hysteresis of 25°C (Typ). UVLO This is the under voltage lock-out block. IC shuts down when VIN is under 6.4V (Typ). The threshold voltage has a hysteresis of 200mV (Typ). ERR This circuit compares the feedback voltage at the output to the reference voltage. The output of this circuit is the COMP terminal voltage and this determines the switching duty. Also, because of soft start during start-up, COMP terminal voltage is controlled by internal slope voltage. OSC Block generating oscillation frequency. SLOPE This circuit creates a triangular wave from generated clock in OSC. The voltage converted from current sense signal of high side MOSFET and the triangular wave is sent to PWM comparator. PWM This block determines the switching duty by comparing the output COMP terminal voltage of error amplifier and output of SLOPE block. DRIVER LOGIC This is the DC/DC driver block. Input to this block is signal from PWM and output drives the MOSFETs. SOFT START This circuit prevents the overshoot of output voltage and In-rush current by forcing the output voltage to rise slowly, thus, avoiding surges in current during start-up. OCP This block limits the current flowing in high side MOSFET for each cycle of switching frequency during over-current. RCP This block limits the current flowing in low side MOSFET for each cycle of switching frequency during over-current. SCP The short circuit protection block compares the FB terminal voltage with the internal standard voltage VREF. When the FB terminal voltage has fallen below 0.85V (Typ) and remained in that state for 1.0msec (Typ), SCP activates and stops the operation for 16msec (Typ) and subsequently initiates a restart. OVP Over voltage protection function (OVP) compares FB terminal voltage with the internal standard voltage VREF. When the FB terminal voltage exceeds 1.30V (Typ), it turns output MOSFETs off. When output voltage drops until it reaches the hysteresis, it will return to normal operation. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 4/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Supply Voltage VIN -0.3 to +40 V EN Input Voltage VEN -0.3 to +40 V VBOOT -0.3 to +45 V ⊿VBOOT -0.3 to +7 V VFB -0.3 to +7 V VCOMP -0.3 to +7 V VSW -0.5 to VIN + 0.3 V Allowable Power Dissipation Pd 3.75 (Note 1) W Operating Junction Temperature Range Tj -40 to +150 C Tstg -55 to +150 C Voltage from GND to BOOT Voltage from SW to BOOT FB Input Voltage COMP Input Voltage SW Input Voltage Storage Temperature Range (Note 1) Derating in done 30.08 mW/°C for operating above Ta≧25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board) Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution2: Reliability is decreased at junction temperature greater than 125C. Recommended Operating Conditions Parameter Symbol Supply Voltage VIN Output Current IOUT Output Voltage Range VRANGE Min Rating Typ Max 7.0 - 36 V 0 - 2.5 A - VIN × 0.7 V (Note 2) 1.0 Unit (Note 2) Please use it in I/O voltage setting of which output pulse width does not become 150nsec (Typ) or less. See the page 22 for how to calculate the resistance of the output voltage setting. Electrical Characteristics (Unless otherwise specified VIN=24V VEN=3V Ta=25°C) Parameter Symbol Min Limit Typ Max Unit Conditions Supply Current in Operating IOPR - 1.5 2.5 mA VFB = 1.1V No switching Supply Current in Standby ISTBY - 0 10 µA VEN = 0V Reference Voltage VFB 0.98 1.00 1.02 V FB Input Current IFB -1 0 1 µA Switching frequency FOSC 0.85 1.00 1.15 MHz Maximum Duty ratio Maxduty 85 90 95 % High-side FET on-resistance RONH - 170 - mΩ ISW = 100mA Low-side FET on-resistance RONL - 140 - mΩ ISW = 100mA Over Current limit ILIMIT - 5.0 - A UVLO detection voltage VUVLO 6.1 6.4 6.7 V UVLO hysteresis voltage VUVLOHYS 100 200 300 mV EN high-level input voltage VENH 2.5 - VIN V EN low-level input voltage VENL - - 0.8 V EN Input current IEN 2.1 4.2 8.4 µA Soft Start time TSS 1.5 3.0 6.0 msec ● ● VFB = 0V VIN falling VEN = 3V EN rising to FB=0.85V VFB : FB Input Voltage. VEN : EN Input Voltage. Pd should not be exceeded. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 5/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves 3.0 1.0 VIN =36V 0.8 VIN=24V Stand by Current[µA] Operating Current[mA] 2.5 2.0 1.5 1.0 VIN =12V VIN =7V VIN =36V 0.6 VIN =24V VIN =12V 0.4 VIN =7V 0.2 0.5 0.0 0.0 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature[℃] 20 40 60 80 100 120 Temperature[℃] Figure 5. Stand-by Current vs Junction Temperature Figure 4. Operating Current vs Junction Temperature 1.0 1.02 VIN =24V VIN =36V 0.8 VIN =24V FB Input Current[µA] Voltage Reference[V] 0.6 1.01 1.00 VIN =7V 0.99 VIN =12V 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 0.98 -1.0 -40 -20 0 20 40 60 80 100 120 -40 Temperature[℃] 0 20 40 60 80 100 120 Temperature[℃] Figure 6. FB Voltage Reference vs Junction Temperature www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 6/30 Figure 7. FB Input Current vs Junction Temperature TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued 1.15 95 VIN =7V 94 VIN =12V 93 VIN =24V VIN =36V VIN =7V Maximum Duty[%] Switching Frequency[MHz] 1.10 1.05 VIN =36V 1.00 0.95 92 VIN =12V VIN =24V 91 90 89 88 87 0.90 86 85 0.85 -40 -20 0 20 40 60 80 -40 100 120 -20 0 20 60 80 100 120 Temperature[℃] Temperature[℃] Figure 8. Switching Frequency vs Junction Temperature Figure 9. Maximum Duty vs Junction Temperature 300 350 VIN =24V Low Side MOSFET ON-Resistance[mΩ] VIN =24V High Side MOSFET ON-Resistance[mΩ] 40 300 250 200 150 100 250 200 150 100 50 0 50 -40 -20 0 20 40 60 80 -40 100 120 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 10. High Side MOSFET ON - Resistance vs Junction Temperature www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 11. Low Side MOSFET ON -Resistance vs Junction Temperature 7/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued 6.9 6.5 VOUT =5V Tj =-40°C 6.0 6.8 VIN Sweep up 6.7 VIN Input Voltage[V] Current limit[A] 5.5 5.0 4.5 Tj =150°C 4.0 Tj =25°C 3.5 6.6 6.5 6.4 VIN Sweep down 6.3 3.0 6.2 2.5 6.1 6 9 12 15 18 21 24 27 30 33 36 -40 -20 0 Input Voltage[V] 20 40 60 80 100 120 Temperature[℃] Figure 12. Current Limit vs Input Voltage Figure 13. UVLO Threshold vs Junction Temperature 300 2.4 275 2.2 EN Sweep up VEN Input Voltage[V] UVLO Hysteresis[mV] 250 225 200 175 150 2.0 1.8 1.6 1.4 EN Sweep down 1.2 125 1.0 100 0.8 -40 -20 0 20 40 60 80 100 120 -40 Temperature[℃] 0 20 40 60 80 100 120 Temperature[℃] Figure 14. UVLO Hysteresis vs Junction Temperature www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 15. EN Threshold vs Junction Temperature 8/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued 5.0 8.0 VIN =36V EN=3V VIN =24V 7.0 VIN =12V Soft Start Time[ms] EN Input Current[µA] 4.0 6.0 5.0 4.0 VIN =7V 3.0 2.0 3.0 1.0 2.0 -40 -20 0 20 40 60 80 -40 100 120 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 16. EN Input Current vs Junction Temperature www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 17. Soft Start Time vs Junction Temperature 9/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB - continued 100 100 90 90 80 80 70 VIN =7V 60 VIN =12V 70 Efficiency[%] Efficiency[%] Typical Performance Curves 50 VIN =18V 40 60 50 30 20 20 EN=3V VOUT =3.3V VIN =24V 40 30 10 VIN =12V EN=3V VOUT =5.0V 10 0 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 2.0 2.5 Output Current[A] Output Current[A] Figure 18. Efficiency vs Output Current (VOUT = 3.3V, L = 4.7µH) Figure 19. Efficiency vs Output Current (VOUT = 5.0V, L = 4.7µH) 100 90 80 VIN =18V Efficiency[%] 70 VIN =24V 60 50 VIN =36V 40 30 20 EN=3V VOUT=12V 10 0 0.0 0.5 1.0 1.5 2.0 2.5 Output Current[A] Figure 20. Efficiency vs Output Current (VOUT = 12V, L = 4.7µH) www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 10/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued Time=1ms/div Time=1ms/div VIN=10V/div VIN=10V/div EN=10V/div EN=10V/div VOUT=2V/div VOUT=2V/div SW=10V/div SW=10V/div Figure 21. Power Up (VIN = EN) (VOUT = 5.0V) Figure 22. Power Down (VIN = EN) (VOUT = 5.0V) Time=1ms/div Time=1ms/div VIN=10V/div VIN=10V/div EN=2V/div EN=2V/div VOUT=2V/div VOUT=2V/div SW=10V/div SW=10V/div Figure 23. Power Up (EN = 0V→5V) (VOUT = 5.0V) www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 24. Power Down (EN = 5V→0V) (VOUT = 5.0V) 11/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued Time=500ns/div Time=500ns/div VOUT=20mV/div VOUT=20mV/div SW=10V/div SW=10V/div Figure 25. VOUT Ripple (VIN = 24V, VOUT = 5V, IOUT = 0A) Figure 26. VOUT Ripple (VIN = 24V, VOUT = 5V, IOUT = 2.5A) Time=500ns/div Time=500ns/div VIN=50mV/div VIN=50mV/div SW=10V/div SW=10V/div Figure 27. VIN Ripple (VIN = 24V, VOUT = 5V, IOUT = 0A) www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 28. VIN Ripple (VIN = 24V, VOUT = 5V, IOUT = 2.5A) 12/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves - continued Time=500ns/div Time=500ns/div IL=1.0A/div IL=1.0A/div SW=5V/div SW=5V/div Figure 29. Switching Waveform (VIN = 12V, VOUT = 5V, IOUT = 2.5A) www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 30. Switching Waveform (VIN = 24V, VOUT = 5V, IOUT = 2.5A) 13/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB - continued 2.0 2.0 1.5 1.5 Output Voltage Change[%] Output Voltage Change[%] Typical Performance Curves 1.0 IOUT=0A 0.5 0.0 -0.5 IOUT=2.5A -1.0 1.0 IOUT=0A 0.5 0.0 -0.5 IOUT=2.5A -1.0 VOUT=3.3V -1.5 VOUT=5.0V -1.5 -2.0 -2.0 6 8 10 12 14 16 18 20 22 24 26 VIN Input Voltage[V] 6 9 12 15 18 21 24 27 30 33 36 VIN Input Voltage[V] Figure 31. VOUT Line Regulation Figure 32. VOUT Line Regulation 2.0 Output Voltage Change[%] 1.5 1.0 IOUT=0A 0.5 0.0 -0.5 IOUT=2.5A -1.0 VOUT=12V -1.5 -2.0 14 16 18 20 22 24 26 28 30 32 34 36 VIN Input Voltage[V] Figure 33. VOUT Line Regulation www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 14/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB - continued 2.0 2.0 1.5 1.5 Output Voltage Change[%] Output Voltage Change[%] Typical Performance Curves 1.0 0.5 0.0 -0.5 -1.0 VIN=18V VOUT=3.3V -1.5 1.0 0.5 0.0 -0.5 -1.0 VIN=24V VOUT=5.0V -1.5 -2.0 -2.0 0.0 0.5 1.0 1.5 2.0 2.5 Output Current[A] 0.0 0.5 1.0 1.5 2.0 2.5 Output Current[A] Figure 35. VOUT Load Regulation Figure 34. VOUT Load Regulation 2.0 Output Voltage Change[%] 1.5 1.0 0.5 0.0 -0.5 -1.0 VIN=24V VOUT=12V -1.5 -2.0 0.0 0.5 1.0 1.5 2.0 2.5 Output Current[A] Figure 36. VOUT Load Regulation www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 15/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Typical Performance Curves – continued 80 180 VIN=12V VOUT=3.3V 60 80 135 phase 180 VIN=24V VOUT=5V 60 135 90 40 90 20 45 20 45 0 0 0 0 -20 -45 gain -20 -45 gain -40 -90 -40 -90 -60 -135 -60 -135 -180 -80 -80 100 1K 10K 100K -180 100 1M 1K 10K 100K 1M Frequency[Hz] Frequency[Hz] Figure 37. Loop Response (VIN=12V, VOUT=3.3V, IOUT=2.5A, COUT=Ceramic22μF×2) Figure 38. Loop Response (VIN=24V, VOUT=5V, IOUT=2.5A, COUT=Ceramic22μF×2) Time=1ms/div Time=1ms/div VOUT=100mV/div VOUT=100mV/div IOUT=1.0A/div IOUT=1.0A/div Figure 39. Load Transient Response IOUT=0A – 2.5A (VIN=12V, VOUT=3.3V, COUT=Ceramic22μF×2) 0μF×3) www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Phase[deg] 40 Phase[deg] Gain[dB] Gain[dB] phase Figure 40. Load Transient Response IOUT=0A – 2.5A (VIN=24V, VOUT=5.0V, COUT=Ceramic22μF×2) =Ceramic10μF×3) 16/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Function Description 1. Enable Control The IC shutdown can be controlled by the voltage applied to the EN terminal. When EN voltage reaches 2.5V (Typ), the internal circuit is activated and the IC starts up. Setting the shutdown interval (Low Level interval) of EN to 100µs or longer will enable the shutdown control with the EN terminal. VEN EN terminal VENH VENL t 0 VOUT Output Voltage VOUT×0.85 t 0 TSS Figure 41. Timing Chart with Enable Control 2. Protective Functions The protective circuits are intended for the prevention of damages caused by unexpected accidents. Do not use them for continuous protective operation. (1) Short Circuit Protection (SCP) The short circuit protection block compares the FB terminal voltage with the internal reference voltage VREF. When the FB terminal voltage has fallen below 0.85V (Typ) and remained in that state for 1.0msec (Typ), SCP activates and stops the operation for 16msec (Typ) and subsequently initiates a restart. Table 1. Short Circuit Protection Function EN pin FB pin Short circuit protection Switching Frequency 0.30V (Typ)≧FB 2.5V or higher 0.125MHz (Typ) 0.30V (Typ)＞B≧0.85V (Typ) Enabled 0.250MHz (Typ) FB＞0.85V (Typ) 0.8V or lower 1.0MHz (Typ) - Disabled OFF Soft start 3.0msec (typ.) VOUT SCP detection time 1.0msec (typ.) SCP detection time 1.0msec (typ.) 1.0V FB terminal SCP threshold voltage： 0.85Ｖ(typ.) SCP detection released Upper MOSFET gate LOW Lower MOSFET gate LOW OCP Threshold Inductor current IC internal SCP signal 16msec (typ.) SCP reset Figure 42. Short Circuit Protection (SCP) Timing Chart www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 17/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB (2) Under Voltage Lockout Protection (UVLO) The under voltage lockout protection circuit monitors the VIN terminal voltage. The operation enters standby when the VIN terminal voltage is 6.4V (Typ) or lower. The operation starts when the VIN terminal voltage is 6.6V (Typ) or higher. VIN UVLO OFF hys UVLO ON 0V VOUT Soft start FB terminal High-side MOSFET gate Low-side MOSFET gate Normal operation UVLO Normal operation Figure 43. UVLO Timing Chart (3) Thermal Shutdown (TSD) When the chip temperature exceeds Tj = 175C, the DC/DC converter output is stopped. The thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax = 150C. It is not meant to protect or guarantee the soundness of the application. Do not use the function of this circuit for application protection design. (4) Over Current Protection (OCP) The over-current protection function is realized by using the current mode control to limit the current that flows through the high-side MOSFET at each cycle of the switching frequency. (5) Reverse Current Protection (RCP) The reverse current protection function is realized by using the current mode control to limit the current that flows through the low-side MOSFET at each cycle of the switching frequency. (6) Over Voltage Protection (OVP) Over voltage protection function (OVP) compares FB terminal voltage with internal standard voltage VREF. When the FB terminal voltage exceeds 1.30V (Typ), it turns output MOSFETs off. When output voltage drops until it reaches the hysteresis, it will return to normal operation. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 18/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Application Example CBOOT L 1 BOOT 2 VIN 3 EN SW 8 PGND 7 COMP 6 FB 5 COUT VOUT VIN BD9E300EFJ-LB C2 R3 R1 CIN 4 AGND C1 R2 Figure 44. Application Circuit Table 2. Recommendation Component Valves VIN VOUT CIN CBOOT L R1 R2 R3 C1 C2 COUT 10μF 0.1μF 3.3μH 6.8kΩ 3.0kΩ 12kΩ 6800pF 12V 3.3V 10μF 0.1μF 3.3μH 6.8kΩ 3.0kΩ 12kΩ 6800pF Ceramic 22μF×2 Ceramic 10μF×3 www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 10μF 0.1μF 3.3μH 6.8kΩ 3.0kΩ 12kΩ 6800pF Ceramic 10μF and Aluminum 100μF 19/30 10μF 0.1μF 4.7μH 12kΩ 3.0kΩ 30kΩ 4700pF 24V 5V 10μF 0.1μF 4.7μH 12kΩ 3.0kΩ 30kΩ 4700pF Ceramic 22μF×2 Ceramic 10μF×3 10μF 0.1μF 4.7μH 12kΩ 3.0kΩ 30kΩ 4700pF Ceramic 10μF and Aluminum 100μF TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Selection of Components Externally Connected 1. Output LC Filter The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the load. Selecting an inductor with a large inductance causes the ripple current ∆IL that flows into the inductor to be small, decreasing the ripple voltage generated in the output voltage, but it is not advantageous in terms of the load transient response characteristic. Selecting an inductor with a small inductance improves the transient response characteristic but causes the inductor ripple current to be large, which increases the ripple voltage in the output voltage, showing a trade-off relationship. Here, select an inductance so that the size of the ripple current component of the inductor will be 20% to 50% of the average output current (average inductor current). VIN IL Inductor saturation current > IOUTMAX +⊿IL /2 ⊿IL IOUTMAX L Driver VOUT COUT Average inductor current Figure 45. Waveform of current through inductor Figure 46. Output LC filter circuit Computation with VIN = 24V, VOUT = 5V, L = 4.7μH, switching frequency FOSC = 1MHz, the method is as below. Inductor ripple current ΔIL = V OUT × (V IN - V OUT ) × 1 = 842 [mA] V IN × FOSC × L where : ΔIL is the inductor ripple current FOSC is the swithing frequency L is the inductor V IN is the input voltage V OUT is the output voltage Also for saturation current of inductor, select the one with larger current than maximum output current added by 1/2 of inductor ripple current ∆IL. Output capacitor COUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple voltage characteristics are satisfied. Output ripple voltage can be expressed in the following method. ΔV RPL = ΔI L × (RESR + 1 8 × C OUT × FOSC ) [V] where : ΔV RPL is the output ripple voltage RESR is the serial equivalent series resistance C OUT is the output capacitor With COUT = 44µF, RESR = 10mΩ the output ripple voltage is calculated as www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 20/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB ΔV RPL = 0.84 × (10m + 1 ) = 11 [mV] 8 × 44μ × 1M * When selecting the value of the output capacitor COUT, please note that the value of capacitor CLOAD will add up to the value of COUT to be connected to VOUT. Charging current to flow through the CLOAD, COUT and the IC startup, must be completed within the soft-start time this charge. Over-current protection circuit operates when charging is continued beyond the soft-start time, the IC may not start. Please consider in the calculation the condition that the lower maximum value capacitor CLOAD that can be connected to VOUT (max) is other than COUT . Inductor ripple current maximum value of start-up (ILSTART) < Over Current Protection Threshold 3.8 [A](min) Inductor ripple current maximum value of start-up (ILSTART) can be expressed in the following method. ILSTART = Output maximum load current(IOMAX) + Charging current to the output capacitor (ICAP) + ⊿IL 2 [mV] Charging current to the output capacitor (ICAP) can be expressed in the following method. I CAP = (C OUT + C LOAD ) × V OUT [A] T SS where : C OUT is the output capacitance C LOAD is the output load capacitance T SS is the soft start time From the above equation, VIN = 24V, VOUT = 5V, L = 4.7μH, IOMAX = 2.5A (max), switching frequency FOSC = 850kHz (min), the output capacitor COUT = 44μF, TSS = 1.5ms soft-start time (min), it becomes the following equation when calculating the maximum output load capacitance CLOAD (max) that can be connected to VOUT. C LOAD (max) < (3.8 - I OMAX - ΔI L /2) × T SS - C OUT = 197 [ μF] V OUT www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 21/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB 2. Output Voltage Set Point The output voltage value can be set by the feedback resistance ratio. V OUT = VOUT R1 － FB R2 R1 + R 2 × 1.0 [V] R2 ※ Minimum pulse range that can be produced at the output stably through all the load area is 150nsec for BD9E300EFJ-LB. Use input/output condition which satisfies the following method. ERR ＋ 1.0V V OUT 150(nsec) ≤ V IN × FOSC Figure 47. Feedback Resistor Circuit 3. Input voltage start-up VIN VIN ≧ UVLO release （6.6Vtyp.) VOUT×0.85 0.7 VOUT VOUT×0.85 TSS Figure 48. Input Voltage Start-up Time Soft-start function is designed for the IC so that the output voltage will start according to the time it was decided internally. After UVLO release, the output voltage range will be less than 70% of the input voltage at soft-start operation. Please be sure that the input voltage of the soft-start after startup is as follows. V × 0.85 V IN ≥ OUT [V] 0.7 www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 22/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB 4. Phase Compensation A current mode control buck DC/DC converter is a two-pole, one-zero system. The two poles are formed by an error amplifier and load and the one zero point is added by the phase compensation. The phase compensation resistor RCMP determines the crossover frequency FCRS where the total loop gain of the DC/DC converter is 0 dB. The high value of this crossover frequency FCRS provides a good load transient response characteristic but inferior stability. Conversely, specifying a low value for the crossover frequency FCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired. (1) Selection of Phase Compensation Resistor RCMP The phase compensation resistance RCMP can be determined by using the following equation. RCMP = 2π × V OUT × FCRS × C OUT [Ω] V FB × G MP × G MA where : V OUT is the output voltage FCRS is the crossover frequency C OUT is the output capacitance V FB is the feedback reference voltage (1.0 V (Typ)) G MP is the current sense gain (7 A/V (Typ)) G MA is the error amplifier transconductance (150 μA/V (Typ)) (2) Selection of phase compensation capacitance CCMP For stable operation of the DC/DC converter, inserting a zero point under 1/6 of the zero crossover frequency cancels the phase delay due to the pole formed by the load often, thus, providing favorable characteristics. The phase compensation capacitance CCMP can be determined by using the following equation. C CMP = 1 [F] 2π × RCMP × FZ where FZ is the Zero point inserted (3) Loop stability To ensure the stability of the DC/DC converter, make sure that a sufficient phase margin is provided. Phase margin of at least 45 degrees in the worst conditions is recommended. The feed forward capacitor CRUP is used for the purpose of forming a zero point together with the resistor RUP to increase the phase margin within the limited frequency range. Using a CRUP is effective when the RUP resistance is larger than the combined parallel resistance of RUP and RDW. VOUT A (a) Gain [dB] RUP CRUP FB RDW GBW(b) 【dB】 COMP 0 Phase[deg] CCMP 1.0V Phase 【°】 RCMP －90 －90° PHASE MARGIN －180° －180 f Figure 49. Phase compensation circuit www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 f FCRS 0 Figure 50. Bode plot 23/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB PCB Layout Design In buck DC/DC converters, a large pulsed current flows in two loops. The first loop is the one into which the current flows when the High Side FET is turned on. The flow starts from the input capacitor CIN, runs through the FET, inductor L and output capacitor COUT and back to ground of CIN via ground of COUT. The second loop is the one into which the current flows when the Low Side FET is turned on. The flow starts from the Low Side FET, runs through the inductor L and output capacitor COUT and back to ground of the Low Side FET via ground of COUT. Tracing these two loops as thick and short as possible allows noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors, in particular, to the ground plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat generation, noise and efficiency characteristics. VIN MOS FET CIN VOUT L COUT Figure 51. Current Loop of Buck Converter Accordingly, design the PCB layout with particular attention paid to the following points. Provide the input capacitor as close to the VIN terminal as possible on the same plane as the IC. If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist in heat dissipation from the IC and the surrounding components. Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the inductor as thick and as short as possible. Provide lines connected to FB and COMP as far as possible from the SW node. Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. COUT VOUT GND L CIN CBOOT SW R1 C2 VIN R2 R3 EN Top Layer Bottom Layer Figure 52. Example of Sample Board Layout Pattern www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 24/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Power Dissipation When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. 4.0 Power dissipation: Pd [W] 3.75W 3.0 θJA=33.3°C/W 4 layer board (back side copper foil area:70mm×70mm) 2.0 1.0 0 0 25 50 75 85 100 125 150 Temperature:Ta [°C] Figure 53. Power Dissipation (HTSOP-J8) I/O equivalence circuit(s) 1. BOOT 8. SW 3. EN BOOTREG EN 280kΩ BOOT VIN 294kΩ 146kΩ SW REG AGND PGND 5. FB 6. COMP VREG FB COMP AGND AGND AGND AGND Figure 54. I/O Equivalent Circuit Chart www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 25/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 26/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Operational Notes – continued 11. Unused Input Terminals Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by avoided. Figure 55. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 27/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Ordering Information B D 9 E 3 0 0 Part Number B D E F J - Package EFJ: HTSOP-J8 9 E 3 Part Number 0 0 E F J Package EFJ: HTSOP-J8 LBH2 Product class LB: for Industrial applications Packaging and forming specification H2: Embossed tape and 18cm reel (Quantity : 250pcs) - LBE2 Product class LB: for Industrial applications Packaging and forming specification E2: Embossed tape and 32.8cm reel (Quantity : 2500pcs) Marking Diagrams HTSOP-J8 (TOP VIEW) Part Number Marking D 9 E 3 0 0 LOT Number 1PIN MARK www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 28/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Physical Dimension, Tape and Reel Information Package Name www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 HTSOP-J8 29/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 BD9E300EFJ-LB Revision History Date Draft 01.Nov.2013 001 21.Feb.2014 002 14.May.2014 003 Changes New Release Delete sentence “and log life cycle” in General Description and Futures. Change “Packaging and forming specification” from E2 to H2. Add E2 rank of “Packaging and forming specification” www.rohm.co © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 30/30 TSZ02201-0J3J0AJ00220-1-2 14.May.2014 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001