bd8253efv m e

Datasheet
System Motor Driver for CD/DVD/BD Players
6ch System Motor Driver
for Car AV
BD8253EFV-M
Key Specifications
General Description





BD8253EFV-M is a 6-ch motor driver system developed
for driving coil actuator (2ch), SLED motor (2ch), loading
motor and three phase motor for spindle.
It can drive motor and coil of the DVD drive.
Features
Ron(Spindle):
Ron(SLED):
Ron(Actuator):
Ron(Loading):
Driver Temperature Range
1.0Ω(Typ)
2.2Ω(Typ)
2.2Ω(Typ)
2.2Ω(Typ)
-40°C to +85°C
(Note 1)
 AEC-Q100 Qualified
 Two Control Pins For Each Driver ON/OFF, Standby
Mode And Brake Mode For Spindle
 High Efficiency At 180° PWM For Spindle Driver
 Built In Current Limit, Hall Bias, FG and Reverse
Protect Circuit For Spindle
 Built-in 2-channel Stepping Motor Driver For SLED
 Built-in VCC Short And GND Short Circuit Protection
For Loading Driver
 Built-in Over Current Protection Circuit For Actuator
Driver
Package
W(Typ) x D(Typ) x H(Max)
18.50mm x 9.50mm x 1.00mm
HTSSOP-B54
(Note 1) Grade3
Applications
 Car Navigation
 Car AV
HTSSOP-B54
Typical Application Circuit
SL2IN
PRTT
PRTOUT
FG
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
PREGND
TEST1
PRTF
7
SL1IN
TEST2
6
TKIN
5
ACTMUTE
4
LDIN
3
VCC
2
LDO+
1
LDO-
PRTLIM
28
VC
29
SLRNF2
30
TEST3
31
SLRNF1
FCO+
32
CTL2
FCO-
33
TEST4
TKO+
34
CTL1
TKO-
35
FCIN
PGND
36
SLO2-
VMFCRNF
37
SLO2+
VMTKRNF
38
SLO1-
TKCDET
39
SLO1+
FCCDET
40
PGND
SPCNF
41
W_OUT
SPIN
42
V_OUT
43
U_OUT
44
HALL_VC
45
HU+
46
HU-
47
HV+
48
HV-
49
HW+
50
HW-
51
SPVM
52
SPRNF
53
BHLD
54
VM_S
TRACKING FOCUS LOADING
COIL
COIL
MOTOR
M
HALL1
HALL2
HALL3
BD8253EFV-M
M
SPINDLE
MOTOR
SLED
MOTOR
Figure 1. Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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BD8253EFV-M
Contents
General Description ...................................................................................................................................................................... 1
Features ......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................. 1
Key Specifications ........................................................................................................................................................................ 1
Package ......................................................................................................................................................................................... 1
Typical Application Circuit ........................................................................................................................................................... 1
Pin Configuration .......................................................................................................................................................................... 3
Block Diagram............................................................................................................................................................................... 3
Pin Description ............................................................................................................................................................................. 3
Absolute Maximum Ratings ......................................................................................................................................................... 4
Recommended Operating Conditions......................................................................................................................................... 4
Thermal Resistance ...................................................................................................................................................................... 4
Electrical Characteristics ............................................................................................................................................................. 5
Typical Performance Curves ........................................................................................................................................................ 6
Application Information.............................................................................................................................................................. 10
1. Driver Logic control terminal (CTL1, CTL2 & ACTMUTE) (Pin 19, 20, 38) ...................................................................... 10
2. VCC Drop Mute (UVLO) ...................................................................................................................................................... 10
3. VC Drop Mute (VC DROP MUTE) ........................................................................................................................................ 10
4. Thermal Shutdown Circuit (TSD) ....................................................................................................................................... 10
5. Polarity of Output Pin ......................................................................................................................................................... 10
6. Actuator Driver (Focus/Tracking)....................................................................................................................................... 11
7. Loading Driver ..................................................................................................................................................................... 15
8. SLED Driver ......................................................................................................................................................................... 16
9. Spindle Driver ...................................................................................................................................................................... 18
Noise Suppression ..................................................................................................................................................................... 24
Power Supply System ................................................................................................................................................................ 27
Typical Application Circuit ......................................................................................................................................................... 28
Terminal Equivalent Circuit........................................................................................................................................................ 30
Operational Notes ....................................................................................................................................................................... 33
Ordering Information .................................................................................................................................................................. 35
Marking Diagrams ....................................................................................................................................................................... 35
Physical Dimension, Tape and Reel Information ..................................................................................................................... 36
Revision History ......................................................................................................................................................................... 37
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TSZ22111 • 15 • 001
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BD8253EFV-M
Pin Configuration (TOP VIEW)
Block Diagram
BHLD
HW-
4
51
FCCDET
HW+
5
50
TKCDET
HV-
6
49
VMTKRNF
2
SPVM
3
SPVM
FCCDET
4
51
HW+
5
HV-
7
48
6
VMFCRNF
7
HU-
HU-
8
47
PGND
8
HU+
HU+
9
46
TKO-
HALL_VC
10
45
TKO+
U_OUT
11
44
FCO-
V_OUT
12
43
FCO+
W_OUT
13
42
LDO-
PGND
14
41
LDO+
SLO1+
15
40
VCC
SLO1-
16
39
LDIN
SLO1-
ACTMUTE
SLO2+
SLO2-
10
U_OUT
12
W_OUT
PGND
SPVM
SLO1+
CTL2
20
35
TKIN
CTL2
SLRNF1
21
34
TEST3
SLRNF1
SLRNF2
22
33
VC
SLRNF2
PRTLIM
23
32
TEST2
PRTLIM
PRTF
24
31
SL1IN
PRTF
18
29
SL2IN
28
PREGND
38
FCIN
37
36
TKIN
35
LIMIT
20
22
23
PRTT
PRTOUT
27
Figure 2. Pin Configuration
34
VC
33
TEST2
32
SL1IN
31
TEST1
30
SL2IN
29
PREGND
FG
26
FG
TEST3
LIMIT
21
25
27
39
TEST4
24
26
41
LDIN
19
TEST1
42
LDO+
ACTMUTE
17
CTL1
43
40
PRE
LOGIC
16
TEST4
44
FCO+
VCC
15
36
45
LDO-
14
19
46
TKO+
FCO-
13
CTL1
FG
47
TKO-
MATRIX
V_OUT
FCIN
PRTOUT
48
11
37
30
VMFCRNF
HALL
BIAS
HALL_VC
18
25
49
9
SLO2-
PRTT
VMTKRNF
PGND
PRE
LOGIC
38
50
CTL
17
TKCDET
OVER CURRENT
PROTECTION
SLO2+
52
HW-
HV+
HV+
53
SPCNF
LEVEL
SHIFT
SPCNF
LEVEL
SHIFT
SPIN
52
LEVEL
SHIFT
53
3
OSC
2
SPVM
54
SPIN
FF
SPRNF
VM_S
1
SPRNF
DUTY
CONTROL
VM_S
FF
54
CURRENT
DETECTOR
1
HALL AMP
REVERSE PROTECTION
BHLD
28
Figure 3. Block Diagram
Pin Description
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Symbol
BHLD
SPRNF
SPVM
HWHW+
HVHV+
HUHU+
HALL_VC
U_OUT
V_OUT
W_OUT
PGND
SLO1+
SLO1SLO2+
SLO2CTL1
CTL2
SLRNF1
SLRNF2
PRTLIM
PRTF
PRTT
PRTOUT
FG
Function
Spindle current sense bottom hold
Spindle driver current sense input
Spindle driver power supply
Hall amplifier W negative input
Hall amplifier W positive input
Hall amplifier V negative input
Hall amplifier V positive input
Hall amplifier U negative input
Hall amplifier U positive input
Hall Bias
Spindle driver U output
Spindle driver V output
Spindle driver W output
Spindle and SLED power ground
SLED driver 1 positive output
SLED driver 1 negative output
SLED driver 2 positive output
SLED driver 2 negative output
Driver logic control input 1
Driver logic control input 2
SLED 1 power supply and current sense
SLED 2 power supply and current sense
Actuator Over current Protect Limit setting
Protect Time setting for focus
Protect Time setting for tracking
Protect output
FG output
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TSZ22111 • 15 • 001
Pin
No.
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
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Symbol
PREGND
SL2IN
TEST1
SL1IN
TEST2
VC
TEST3
TKIN
TEST4
FCIN
ACTMUTE
LDIN
VCC
LDO+
LDOFCO+
FCOTKOTKO+
PGND
VMFCRNF
VMTKRNF
TKCDET
FCCDET
SPCNF
SPIN
VM_S
Function
Pre block ground
SLED driver 2 control input
Test terminal(Leave Open)
SLED driver 1 control input
Test terminal(Leave Open)
Reference voltage input
Test terminal(Leave Open)
Tracking control input
Test terminal(Leave Open)
Focus control input
Mute terminal for Focus/Tracking
Loading driver input
Power supply for pre driver and loading
Loading driver positive output
Loading driver negative output
Focus driver positive output
Focus driver negative output
Tracking driver positive output
Tracking driver negative output
Actuator and Loading power ground
Focus power supply and current sense
Tracking power supply and current sense
Current detect for tracking driver
Current detect for focus driver
Spindle driver loop filter
Spindle driver input
Spindle/SLED control block power supply
TSZ02201-0H5H0BK01730-1-2
26.Jan.2016 Rev.001
BD8253EFV-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VVCC, VVM_S
12
V
VSPVM,VSPRNF, VSLRNF1, VSLRNF2
VVM_S
V
VVMTKRNF,VVMFCRNF
VVCC
V
Pre / Loading Driver Power Supply Voltage
Spindle and SLED Driver Output Power Supply Voltage
Actuator Output Power Supply Voltage
VIN1
(Note1)
VVCC
V
Input Terminal Voltage 2
VIN2
(Note2)
VVM_S
V
Output Terminal Voltage
VOUT
(Note3)
12
V
Input Terminal Voltage 1
Operating Temperature Range
Topr
-40 to +85
°C
Junction Temperature Range
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
(Note 1) CTL1, CTL2, VC, LDIN, ACTMUTE, TKIN, FCIN
(Note 2) HU+, HU-, HV+, HV-, HW+, HW-,SL1IN, SL2IN, SPIN, FKCDET, TCCDET
(Note 3) FG, U_OUT, V_OUT, W_OUT, SLO1+, SLO1-, SLO2+, SLO2-, PRTOUT, LDO+, LDO-, FCO+, FCO-, TKO+, TKOCaution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to +85°C)
Parameter
Pre / Loading Driver Power Supply Voltage
Spindle/SLED control block power supply
Spindle Driver Power Supply Voltage
SLED Driver Power Supply Voltage
(Note1)
Typ
Max
Unit
VVCC
6
8
10
V
6
8
VVCC
V
VSPVM, VSPRNF
-
VVM_S
-
V
VSLRNF1, VSLRNF2
-
VVM_S
-
V
VVMFCRNF, VVMTKRNF
4
8
VVCC
V
(Note1) (Note2)
(Note1) (Note2)
Actuator Driver Power Supply Voltage
Min
VVM_S
(Note1)
(Note1) (Note2)
Symbol
(Note 1) Consider power dissipation when deciding power supply voltage.
(Note 2) Detection resistance is needed between SPVM, SPRNF, SLRNF1, SLRNF2 and VM_S, and between VMFCRNF, VMTKRNF and AVM.
Thermal Resistance
Parameter
Symbol
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
Thermal Resistance
1s
(Note 3)
(Note 1)
2s2p
(Note 4)
Unit
θJA
66.8
20.1
°C/W
ΨJT
2
2
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Thermal Via (Note 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Pitch
1.20mm
Diameter
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers..
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BD8253EFV-M
Electrical Characteristics
(Unless otherwise specified, Ta=25°C, V VCC =V SPVM =V SLRNF1 =V SLRNF2 =V VM_S =8V, V VMFCRNF =V VMTKRNF =8V,
V VC =1.25V, RL=8Ω, RLSP=2Ω, RSPRNF=0.165Ω, RSLRNF1=RSLRNF2=0.5Ω)
Parameter
Circuit Current
Hall
Bias
Hall
Amplifier
Spindle
Motor
Driver
Quiescent Current
Standby Current
IQ
IST
Min
-
Hall Bias Voltage
VHB
0.45
Input Bias Current
Input Level
Common Mode Input Range
Input Dead Zone (One Side)
Input-Output Gain
Output ON Resistance (Total Sum)
Spindle
Torque
Input and Output Limit Current
Output
Input Impedance
PWM Frequency
FG
Low Level Voltage
Output
Input Dead Zone (One Side)
Input Impedance
Input-Output Gain
SLED Motor Driver
Output ON Resistance (Total Sum)
Output Limit Current
Actuator Driver
Loading Driver
Actuator Protection
Circuit
Actuator Protection
Flag Output
ACTMUTE
CTL1, CTL2
Function
Symbol
PWM Frequency
Output Offset Voltage
Output ON Resistance (Total Sum)
Input Impedance
Input-Output Gain
Output Offset Voltage
Output ON Resistance (Total Sum)
Input Impedance
Input-Output Gain
PRTT/PRTF Default Voltage
PRTT/PRTF Protect Detection Voltage
PRTLIM Voltage
Detection Amplifier Input Offset Voltage
PRTOUT Low Level Output Voltage
L Input Voltage
H Input Voltage
High Level Input Current
VC Drop Mute Voltage
VCC Drop Mute Voltage
VC Input Current
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TSZ22111 • 15 • 001
IHIB
VHIM
VHICM
VDZSP
gmSP
RONSP
ILIMSP
RINSP
fOSC
Limits
Typ Max
12.5 25
0.22 1.0
0.9
Unit
mA
mA
1.35
V
-
0.1
0.3
V
VDZSL
RINSL
gmSL
RONSL
fOSC
VOFACT
RONACT
RINACT
GVACT
VOFLD
RONLD
RINLD
GVLD
VPRTREF
VPRTDET
VPRTLIM
VOFDET
5
35
0.51
0.42
(0.21)
-50
37
16
-75
35
14.2
1.00
2.82
500
-5
30
47
0.66
2.2
0.5
(0.25)
100
0
2.2
50
17.5
0
2.2
47
15.6
1.06
3.00
530
0
55
59
0.81
3.7
0.58
(0.29)
50
3.7
63
19
75
3.7
59
16.9
1.12
3.18
560
5
mV
kΩ
A/V
Ω
A
(V)
kHz
mV
Ω
kΩ
dB
mV
Ω
kΩ
dB
V
V
mV
mV
VOL1
-
0.1
0.3
V
VICTL
VICTH
ICTH
VMVC
VMVCC
IVC
2
0.4
3.4
-
50
0.7
3.8
4
0.8
100
1
4.2
8
V
V
μA
V
V
μA
5/37
At no-load, VCTL2=H
VCTL1=VCTL2=L
IHB=10mA
-5
5
μA
50
mVpp
1
6
V
0
10
40
mV
1.59 2.05 2.46 A/V RSPRNF=0.165Ω, RLSP=2Ω
1
1.8
Ω
IL=500mA
1.2
1.5
1.8
A
RSPRNF=0.165Ω
(0.198) (0.247) (0.297) (V)
35
47
59
kΩ
100
kHz
VFGL
ILIMSL
Conditions
10KΩ pull-up (3.3V)
RSLRNF1, RSLRNF2=0.5Ω
IL=500mA
RSLRNF1, RSLRNF2=0.5Ω
RL=8Ω
IL=500mA
RL=8Ω
RL=8Ω
IL=500mA
RL =8Ω
33kΩ pull-up (3.3V)
VCTL1, VCTL2, VACTMUTE = 3.3V
VVC=1.25V
TSZ02201-0H5H0BK01730-1-2
26.Jan.2016 Rev.001
BD8253EFV-M
Typical Performance Curves
2.0
Spindle Ron V_OUT : RONSP [Ω]
Spindle Ron U_OUT : RONSP [Ω]
2.0
1.5
1.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSPIN=3.3V
IL=500mA
0.5
0.0
1.5
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 4. Spindle Motor Driver
U_OUT Output ON Resistance (total sum) : RONSP
-25
0
25
50
Temparature [°C]
75
100
Figure 5. Spindle Motor Driver
V_OUT Output ON Resistance (Total Sum) : RONSP
4.0
SLED Ron SLO1+ : RONSL [Ω]
2.0
Spindle Ron W_OUT : RONSP [Ω]
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSPIN=3.3V
IL=500mA
0.5
1.5
1.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSPIN=3.3V
IL=500mA
0.5
0.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSL1IN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 6. Spindle Motor Driver
W_OUT Output ON Resistance (Total Sum) : RONSP
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TSZ22111 • 15 • 001
-25
0
25
50
Temparature [°C]
75
100
Figure 7. SLED Motor Driver
SLO1+ Output ON Resistance (Total Sum) : RONSL
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BD8253EFV-M
Typical Performance Curves
- continued
4.0
SLED Ron SLO2+ : RONSL [Ω]
SLED Ron SLO1- : RONSL [Ω]
4.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSL1IN=0V, 3.3V
IL=500mA
1.0
0.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSL2IN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 8. SLED Motor Driver
SLO1- Output ON Resistance (Total Sum) : RONSL
-25
0
25
50
Temparature [°C]
75
100
Figure 9. SLED Motor Driver
SLO2+ Output ON Resistance (Total Sum) : RONSL
4.0
Focus Ron FCO+ : RONACT [Ω]
4.0
SLED Ron SLO2- : RONSL [Ω]
3.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VSL2IN=0V, 3.3V
IL=500mA
1.0
0.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VFCIN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 10. SLED Motor Driver
SLO2- Output ON Resistance (Total Sum) : RONSL
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TSZ22111 • 15 • 001
-25
0
25
50
Temparature [°C]
75
100
Figure 11. Actuator Driver
FCO+ Output ON Resistance (Total Sum) : RONACT
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TSZ02201-0H5H0BK01730-1-2
26.Jan.2016 Rev.001
BD8253EFV-M
Typical Performance Curves
- continued
4.0
Tracking Ron TKO+ : RONACT [Ω]
Focus Ron FCO- : RONACT [Ω]
4.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VFCIN=0V, 3.3V
IL=500mA
1.0
0.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VTKIN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 12. Actuator Driver
FCO- Output ON Resistance (Total Sum) : RONACT
-25
0
25
50
Temparature [°C]
75
100
Figure 13. Actuator Driver
TKO+ Output ON Resistance (Total Sum) : RONACT
4.0
Loading Ron LDO+ : RONLD [Ω]
4.0
Tracking Ron TKO- : RONACT [Ω]
3.0
3.0
2.0
VVCC=VVM_S=8V
VCTL2=3.3V
VVC=1.65V
VTKIN=0V, 3.3V
IL=500mA
1.0
0.0
3.0
2.0
VVCC=VVM_S=8V
VCTL1=3.3V
VVC=1.65V
VLDIN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
-50
Figure 14. Actuator Driver
TKO- Output ON Resistance (Total Sum) : RONACT
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-25
0
25
50
Temparature [°C]
75
100
Figure 15. Loading Driver
LDO+ Output ON Resistance (Total Sum) : RONLD
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Typical Performance Curves
- continued
Loading Ron LDO- : RONLD [Ω]
4.0
3.0
2.0
VVCC=VVM_S=8V
VCTL1=3.3V
VVC=1.65V
VLDIN=0V, 3.3V
IL=500mA
1.0
0.0
-50
-25
0
25
50
Temparature [°C]
75
100
Figure 16. Loading Driver
LDO- Output ON Resistance (Total Sum) : RONLD
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Application Information
1. Driver Logic control terminal (CTL1, CTL2 & ACTMUTE) (Pin 19, 20, 38)
All driver's and spindle driver's brake mode can be switched ON/OFF by inputting H level (2V or more) or L levels (0.8V or
less) to these terminals. ACTMUTE can be used individually to Turn ON/OFF Actuator.
ACTMUTE Pin and VCC Pin can be short-circuited if the control logic with the control pin (CTL2) is ok.
▼ Driver Logic (Normal Operation)
CTL1
CTL2
(Pin 19)
(Pin 20)
L
L
H
L
H
H
ACTMUTE
(Pin 38)
H
L
SPINDLE
Output
Hi-Z
Hi-Z
(Note 2)
ACTIVE
(Note 2)
ACTIVE
SLED
Output
Hi-Z
ACTIVE
ACTIVE
ACTIVE
ACTUATOR
Output
Hi-Z
(Note 1)
MUTE
ACTIVE
(Note 1)
MUTE
LOADING
Output
Hi-Z
ACTIVE
(Note 1)
MUTE
(Note 1)
MUTE
(Note 1) Positive and Negative output of the driver output pull-up to Power/2 (=VREF)
(Note 2) Active state of spindle output is described in the following table (1-1).
▼Spindle Driver Logic table
CTL1
CTL2
(Pin 19)
(Pin 20)
L
H
H
H
ACTMUTE
(Pin 38)
-
SPIN > VC
SPIN < VC
Forward Mode
Forward Mode
Reverse Braking Mode
Short Braking Mode
▼ Driver Logic (UVLO, VC Protection Operation, TSD)
CTL1
CTL2
ACTMUTE
SPINDLE
(Pin 19)
(Pin 20)
(Pin 38)
Output
L
L
Hi-Z
Other Condition
Hi-Z
SLED
Output
Hi-Z
Hi-Z
ACTUATOR
Output
Hi-Z
(note 1)
Mute
LOADING
Output
Hi-Z
(note 1)
Mute
(Note 1) Positive and Negative output of the driver output pull-up to Power/2 (=VREF)
2. VCC Drop Mute (UVLO)
If VCC pin voltage becomes 3.8V (typ) or less, output of all channels turns OFF.
If VCC pin voltage becomes 4.0V (typ) or high, output of all channels turns ON again.
Please refer to the above table for the details of Output status.
3. VC Drop Mute (VC DROP MUTE)
If VC pin voltage becomes 0.7V (typ) or less, output of all channels turns OFF.
Please set this value to a minimum of 1.2V for normal use.
Please refer to the above table for the details of Output status
4. Thermal Shutdown Circuit (TSD)
In order to prevent the IC from thermal destruction, IC has built in thermal shutdown circuit.
Thermal shutdown circuit is designed to turn OFF all output channels when the junction temperature (Tj) reaches 175°C
(Typ). IC operation begins again when the junction temperature decreases to 150°C (Typ) or less. Please refer the table (2)
above for detail of the output state. However, in this state also where the thermal shutdown is operating, and if heat is
applied from the outside continuously, thermal run-away may be carried out and it may result in destruction of IC.
5. Polarity of Output Pin
Positive and negative output of Actuator, Loading and SLED driver means the polarity of each inputs (FCIN, TKIN,LDIN,
SL1IN, SL2IN)
For example, FCO+>FCO- at FCIN>VC and FCO+<FCO- at FCIN<VC.
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6. Actuator Driver (Focus/Tracking)
(1) Voltage Gain Calculation
The output voltage is set by the input voltage (difference voltage of FCIN/TKIN and VC) x voltage gain (GVACT).
Voltage gain can be adjusted by an external input resistor RIN.
100k
VIN
VC
RIN
VREF +
VO+
50k
+
Level
Shift
IN
VO+
×2
VREF
×2
-
VO-
VO-
VC
VREF -
100kΩ
×0.94×2×(VIN-VC)
RIN + 50kΩ
×2
VO = (VO+) - (VO-)　→　4 times between output
×0.94
100k
RIN + 50k
100kΩ
×0.94×2×(VIN-VC)
RIN + 50kΩ
Figure 17. Actuator (Focus/Tracking) Closed Loop Voltage Gain Calculation Diagram
Voltage Gain expression is given by following formula
𝑉𝑂
𝐺𝑉𝐴𝐶𝑇 = 𝑉𝐼𝑁 = 𝑅
100k
𝐼𝑁 +50k
× 0.94 × 2 × 2 [dB]
When RIN = 0
𝑉𝑂
𝐺𝑉𝐴𝐶𝑇 = 𝑉𝐼𝑁 =
100k
50k
× 0.94 × 2 × 2 = 17.5 [dB]
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(2) Actuator Over Current Protection Function (OCP)
This is the protect function for the actuator if it detects an over current state in a certain amount of time.
PRTT, PRTF
(Timer)
> 3.0V
PRTOUT
(Flag)
L to H
< 1.1V
H to L
Actuator Output
Active
Active
The current threshold set by the external load is assumed to be 0, where in the capacitor current is charged and
discharged proportional to the load current value.
The time for the protection to activate (PRTOUT=H) is determined by the resistor values connected to the terminals:
VMTKRNF, VMFCRNF, TKCDET, FCCDET, PRTLIM and the capacitors connected to the terminals: PRTT, PRTF. The
default voltage value of the PRTT and PRTF terminals is 1.06V (Typ). Capacitor is charged by the over current and
protection activates (PRTOUT=H) when PRTT and PRTF are about 3.0V (Typ). If PRTT and PRTF is below 1.1V, the
protection will be released (PRTOUT=L). Regardless of PRTOUT, if ACTMUTE input terminal is set low the actuator can
be muted.
Driver
Ready
Mute
Active
Active
Ready
Mute
Active
Active
Ready
Active
Discharge Charge
Voltage of Capacitor Current of Capacitor
Threshold Current
3.0V(Typ)
Protection
Detection Voltage
1.1V(Typ)
1.06V(Typ)
ACTMUTE
(Low : MUTE)
PRTOUT
(High : Over Current)
PRTT/PRTF
Drive Current
Protect Circuit
Active
ACTMUTE=High → Driver Active
ACTMUTE=Low → Driver MUTE
PRTOUT=High → Driver No Change
Figure 18. ACT_OCP Timing Chart
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(3) Configuration of Actuator Over Current Protection Circuit
AVM
IO
VOFDET:0mV(Typ)
RRNF
RDET
VMFCRNF / VMTKRNF
FCO+/TKO +
3.3V
10kΩ
PRTOUT
FCO-/TKO-
PGND
FCDET / TKDET
VI
Conversion
I SOURCE
PRTF/PRTT
I SINK
VI
3V or 1.1V
Conversion
C
PRTLIM
VPRTLIM :
RPRTLIM
530mV(Typ)
PREGND
VPRTREF:1.06V(Typ)
VPRTDET:3.00V(Typ)
Figure 19. Over Current Protection Circuit
The capacitor’s charge and discharge current ISINK and ISOURCE, can be computed using the following:
𝑉
𝐼𝑆𝐼𝑁𝐾 = 𝑅𝑃𝑅𝑇𝐿𝐼𝑀 , 𝐼𝑆𝑂𝑈𝑅𝐶𝐸 =
𝑅𝑅𝑁𝐹 ×𝐼𝑂
𝑃𝑅𝑇𝐿𝐼𝑀
𝑅𝐷𝐸𝑇
Initial Detection of Over current and load current It (Threshold current), if ISINK = ISOURCE current, can be computed using the
following:
𝐼𝑆𝐼𝑁𝐾 = 𝐼𝑆𝑂𝑈𝑅𝐶𝐸
𝑉𝑃𝑅𝑇𝐿𝐼𝑀
𝑅𝑃𝑅𝑇𝐿𝐼𝑀
𝐼𝑡 = 𝑅
=
𝑅𝑅𝑁𝐹 ×𝐼𝑡
𝑅𝐷𝐸𝑇
𝑅𝐷𝐸𝑇
𝑃𝑅𝑇𝐿𝐼𝑀
×
𝑉𝑃𝑅𝑇𝐿𝐼𝑀
𝑅𝑅𝑁𝐹
If ISINK < ISOURCE, the time for error detect flag td: time until PRTF / PRTT voltage reaches 3.0V (Typ) can be computed using
the following equations:
𝐶 × 𝑉𝑑 = (𝐼𝑆𝑂𝑈𝑅𝐶𝐸 − 𝐼𝑆𝐼𝑁𝐾 ) × 𝑡𝑑
𝑡𝑑 = 𝐼
𝑡𝑑 =
𝐶×𝑉𝑑
𝑆𝑂𝑈𝑅𝐶𝐸 −𝐼𝑆𝐼𝑁𝐾
𝐶 × 𝑉𝑑
𝑅𝑅𝑁𝐹 × 𝐼𝑂 𝑉𝑃𝑅𝑇𝐿𝐼𝑀
𝑅𝐷𝐸𝑇 − 𝑅𝑃𝑅𝑇𝐿𝐼𝑀
If (Vd = VPRTDET − VPRTREF = 3.0 − 1.06 = 1.94 V)
Ex) td = 100ms, IO = 200mA, It = 100mA, RNF = 0.5Ω, R2 = 47kΩ, R1 and C are:
𝑅𝐷𝐸𝑇 =
𝑅𝑃𝑅𝑇𝐿𝐼𝑀 ×𝑅𝑅𝑁𝐹
𝑡
𝑉𝑃𝑅𝑇𝐿𝐼𝑀
𝑅𝑅𝑁𝐹 ×𝐼𝑂
𝐶 = 𝑉𝑑 × (
𝑑
𝑅𝐷𝐸𝑇
× 𝐼𝑡 =
47k×0.5
0.53
𝑉
− 𝑅𝑃𝑅𝑇𝐿𝐼𝑀 ) =
𝑃𝑅𝑇𝐿𝐼𝑀
× 100m = 4.4 [kΩ]
100m
1.94
×(
0.5×200m
4.4k
0.53
− 47k ) = 0.59 [μF]
After the protection detection, the time tdc that the PRTF/PRTT capacitor voltage takes to discharge to the default 1.06V,
can be computed using the following equations:
𝐶 × 𝑉𝑑 = 𝐼𝑆𝐼𝑁𝐾 × 𝑡𝑑𝑐
𝐶×𝑉𝑑
𝑡𝑑𝑐 = 𝐼
𝑆𝐼𝑁𝐾
=
𝐶×(𝑉𝑃𝑅𝑇𝐷𝐸𝑇 −𝑉𝑃𝑅𝑇𝑅𝐸𝐹 )𝑅𝑃𝑅𝑇𝐿𝐼𝑀
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𝑉𝑃𝑅𝑇𝐿𝐼𝑀
=
13/37
0.59×(3.00−1.06)×47k
0.53
= 102 [ms]
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BD8253EFV-M
If Actuator Over current protection function is not in use, then it is recommended that each terminal is set as follows.
However, there will be no problem if we connect RPRTLIM of PRTLIM terminal.
OPEN
FCDET / TKDET
VI
Conversion
VMFCRNF / VMTKRNF
FCO+/TKO +
FCO-/TKO-
OPEN
PRTOUT
PRTF/PRTT
OPEN
VI
Conversion
PRTLIM
OPEN
3V or 1.1V
PGND
PREGND
Figure 20. Configuration Example when OCP is not in use
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7. Loading Driver
(1) Loading driver basic operation description
This is the single input BTL drive system.
Loading driver will be active when CTL1=High and CTL2=Low.
Output will be Hi-z when VC<0.7V
Loading function table:
INPUT
OUTPUT
LDIN＞VC
Forward
LDIN＜VC
Reverse
LDIN=VC
Brake [(VCC-Vf)/2]
(2) Voltage Gain Calculation
The output Voltage is set by Input voltage (LDIN – VC) x Voltage gain (GVLD)
Voltage can be adjusted by external input resistor Rin.
70.5k
VIN
VC
VREF +
VO+
47k
RIN
70.5kΩ
×1×2×(VIN-VC)
RIN + 47kΩ
+
Level
Shift
IN
VO+
×2
VREF
×2
-
VO-
VO-
VC
VREF -
×1
70.5k
RIN + 47k
70.5kΩ
×1×2×(VIN-VC)
RIN + 47kΩ
×2
VO = (VO+) - (VO-)　→　4 times between outputs
Figure 21.Loading Closed Loop Voltage Gain Calculation Diagram
Voltage gain is given by following formula
𝑉𝑂
𝐺𝑉𝐿𝐷 = 𝑉𝐼𝑁 = 𝑅
70.5k
𝐼𝑁 +47k
× 1 × 2 × 2 [dB]
When RIN = 0
𝑉𝑂
𝐺𝑉𝐿𝐷 = 𝑉𝐼𝑁 =
70.5k
47k
× 1 × 2 × 2 = 15.6 [dB]
(3) Loading driver VCC-short or GND-Short protection function
The IC has the ability to prevent the destruction of the POWER MOS output when destructive conditions happen.
(a) When the low side power MOS is ON, it is VCC-short protected when the output pin voltage is more than (power -2Vf),
and when current at VCC short is detected at the same time. During this time, output goes OFF and after 100us, output
become active to check if short persists. If VCC-short mode continues, Output goes OFF again.
2Vf = around 1.4V(Typ).
(b)When the high side power MOS is ON , when output pin voltage is less than 2V f , and detects a ground fault current, a
ground fault protection is done, and output goes OFF. After 100us, output become active. If short mode continues,
Output goes OFF again. Also, the current depends on the output voltage ground fault sensing
Supply and GND fault protection circuit has a built in filter to remove high frequency noise of 20us.
Driving current is limited according to the truth table below:
Drive Condition
OUTPUT Voltage
OUTPUT Short
Current
Detect Condition
OUTPUT Mode
Low Side Output Power
MOS ON
High Side Output Power
MOS ON
Greater Than
VCC-2Vf
Flow
VCC – Short
Active to MUTE
Less Than 2Vf
Flow
GND – Short
Active to MUTE
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8. SLED Driver
(1) Input-Output Gain, Output Current Limit
The relation between the input voltage (VSL1IN, VSL2IN) and the output current detection terminals input voltage
(VVM_S-VSLRNF) is expressed as shown below:
VVMS-VSLRNF
REV
FWD
I LIMSL
Slope : gmSL
Dead Zone+
Dead Zone-
VSL1IN,VSL2IN
VC
Figure 22.SLED Motor input –Output Characteristic
The Input-Output Gain (gmSL) and the output-limit current (ILIMSL) depend on the resistance of RSLRNF1,2 (output current
detection resistor).
The gain for SLED motor can be adjusted by input resistance (Rin).
Please refer to the following formula.
▼Input-Output Gain, Output Current Limit (Typ)
𝑔𝑚𝑆𝐿 = 0.33⁄𝑅𝑆𝐿𝑅𝑁𝐹 [A/V]
Input-Output Gain
𝐼𝐿𝐼𝑀𝑆𝐿 = 0.25⁄𝑅𝑆𝐿𝑅𝑁𝐹 [A]
Output-limit current
𝑔𝑚𝑆𝐿 = (47k⁄(𝑅𝐼𝑁 + 47k)) × (0.33⁄𝑅𝑆𝐿𝑅𝑁𝐹 ) [A/V]
Input-Output Gain With Resistor
Connected
(RIN =External Input Resistance)
(2)SLED Input-Output Gain Formula
Iopeak
RSLRNF Io:
Io
SLRNF
47k
RL
47k
VIN
RIN
－
M
IN
SLO+ SLO＋
Figure 23.SLED Motor Input-Output Gain calculation
Input-Output Gain calculation expression is given by the following formula.
𝑔𝑚𝑆𝐿 =
𝑉𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
𝐼𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
=𝑅
=
47k
𝐼𝑁 +47k
47k
𝑅𝐼𝑁 +47k
×𝑅
×
0.33
𝑆𝐿𝑅𝑁𝐹
0.33
𝑅𝑆𝐿𝑅𝑁𝐹
× 𝑅𝐿
[A/V]
[V/V]
It will be given by the following formula if you do not use the RIN.
𝑔𝑚𝑆𝐿 =
𝐼𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
=𝑅
0.33
𝑆𝐿𝑅𝑁𝐹
[A/V]
(3) Output Pin State
Output State of SLED motor when input dead zone detected and current limit detected is given below
▼ Output Pin State
Input Dead Zone Detected
Short Brake
(Note1)
Current Limit Detected
Short Brake
(Note1)
(Note 1) Short brake is the state where both the Positive and negative output of the driver will be pulled to high
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(4) SLED Driver Operation Description
VM_S
AMP
RSLRNF
COMP
SLRNF
SLIN
SLO+
M
LIMIT
OSC
SLOPRE
LOGIC
PGND
Figure 24.SLED Motor Block Diagram
State1
State2
Reset
VM_S
IO
ON
RSLRNF
SLRNF
OFF
SLO+
VM_S
RSLRNF
SLRNF
M
OFF
IO
ON
SLO-
SLO+
ON
M
ON
SLO-
OFF
OFF
Set
PGND
PGND
Figure 25. Set[State 1], Reset[State 2] to Current Load
PWM
Clock
Proportionate
Current Value to
Driver Input or
Limit Current
Value
Current for
Motor
set
State 1
reset
State 2
set
State 1
reset
State 2
set
State 1
reset
State 2
Figure 26. SLED Motor Driver Operation Timing Chart
Set [State1] ：As PWM clock starts pulsing, the output turns ON and load current is supplied by VCC.
Reset[State2]：The output turns OFF when the increasing load current reaches the current value proportional to driver
input or limit current value. The increase in the load current is caused by the L component of the motor
when operating during this state as shown in Figure 25. State 2.
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9. Spindle Driver
(1) Input-Output Gain, Output Current Limit
The relation between the torque command input voltage (VSPIN) and the output current detection terminals input voltage
(VVM_S-VSPRNF) is expressed as shown below:
VVM_S - VSPRNF
REV
FWD
I LIMSP
Slope : gmSP
Dead Zone+
Dead Zone -
SPIN
VC
Figure 27. Spindle Input-Output Characteristics
The Input-Output Gain (gmSP) and the output-limit current (ILIMSP) depend on the resistance of RSPRNF (output current
detection resistor).
The gain for Spindle motor can be adjusted by input resistance (Rin).
Please refer to the following formula.
▼Input-Output Gain, Output Current Limit (Typ)
𝑔𝑚𝑆𝑃 = 0.339⁄𝑅𝑆𝑃𝑅𝑁𝐹 [A/V]
Input-Output Gain
𝑔𝑚𝑆𝑃 = (47k⁄(𝑅𝐼𝑁 + 47k)) × (0.339⁄𝑅𝑆𝑃𝑅𝑁𝐹 ) [A/V]
Input-Output Gain With Resistor
Connected
(RIN =External Input Resistance)
Output-Limit Current
𝐼𝐿𝐼𝑀𝑆𝑃 = 0.247⁄𝑅𝑆𝑃𝑅𝑁𝐹 [A]
(2)Spindle Input-Output Gain Formula
Iopeak
RSPRNF Io:
SPVM
Io
47k
RIN
V_OUT
RL
47k
VIN
－
IN
U_OUT
W_OUT
＋
PGND
Figure 28. Spindle Driver Load Current Path
Input-Output Gain calculation expression is given by the following formula.
𝑔𝑚𝑆𝑃 =
𝑉𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
𝐼𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
=𝑅
=𝑅
47k
47k
𝐼𝑁
0.339
×𝑅
+47k
0.339
𝐼𝑁 +47k
×𝑅
𝑆𝑃𝑅𝑁𝐹
𝑆𝑃𝑅𝑁𝐹
[A/V]
× 𝑅𝐿 [V/V]
It will be given by the following formula if you do not use the RIN.
𝑔𝑚𝑆𝑃 =
𝐼𝑜𝑝𝑒𝑎𝑘
𝑉𝐼𝑁
0.339
=𝑅
𝑆𝑃𝑅𝑁𝐹
[A/V]
(3) Output Pin State
Output State of Spindle motor when input dead zone detected and current limit detected is given below
▼ Output Pin State
Input Dead Zone Detected
Short Brake
(Note1)
Current Limit Detected
Short Brake
(Note1)
(Note 1) In short brake mode outputs U_OUT, V_OUT, and W_OUT voltages will be low.
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26.Jan.2016 Rev.001
BD8253EFV-M
(4) Input / Output Timing Chart of Spindle Driver
HU+
HUHVHV+
HW+
HWSource
U_OUT
Sink
Source
V_OUT
Sink
Source
W_OUT
Sink
High
FG
Low
状態
State
A
B
C
D
E
F
(a)
Rotation Mode
(a) Forward
正転モード
(SPIN>VC)
Short Brake Mode
(b)(b)
ショートブレーキモード
(SPIN<VC, CTL1=CTL2=H)
HU+
HUHVHV+
HW+
HWSource
U_OUT
Sink
Source
V_OUT
Sink
Source
W_OUT
Sink
High
FG
Low
状態
State
G
H
I
J
K
L
(c) Reverse
Rotation Brake Mode
(c) 逆転ブレーキモード
(SPIN<VC, CTL1=L, CTL2=H, 逆転検出前)
Before Reverse Detection)
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(d) Reverse
Protection Mode
(d) 逆転防止モード
(SPIN<VC, CTL1=L, CTL2=H, 逆転検出後)
After Reverse Detection)
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BD8253EFV-M
(5) Spindle Driver Input-Output Specifications
Figure 29. shows the input and output characteristics of the peak current detection control and the average current
detection control. This IC uses the peak current detection output control. Comparing Figure 29. (a) and (b), the linearity of
the input-output characteristic has been improved compared to the average current detection method.
10000
10000
Rotation[rpm]
12000
Rotation [rpm]
12000
8000
6000
8000
6000
4000
4000
2000
2000
0
0
0.1
0.2
0.3
0.4
Input Voltage [V]
0.5
0.6
0
0
0.1
0.2
0.3
Input Voltage [V]
0.4
0.5
0.6
(a) Peak Current Control (BD8253EFV-M)
(b) Average Current Control
Figure 29. Spindle Driver Input-Output Specifications
The difference between the input and output characteristics caused by the change in the detection control method can be
explained as follows:
The coil of the motor is not only composed of pure inductance, also includes an impedance component. Here, when the
peak value of the output pulse is VO, current IO flowing through the motor at the output ON pulse is expressed as follows:
IO, V O
R
IO
L
VO
IO
VO
t
Figure 30. Current Waveform Including Impedance Elements
𝑉𝑂 = 𝐼𝑂 (𝑡) × 𝑅 + 𝐿 ×
𝐼𝑂 =
𝑉𝑂
𝑅
𝑑𝐼𝑂 (𝑡)
𝑑𝑡
𝑅
(1 − 𝑒 − 𝐿 𝑡 )
It can be seen from the above equation that the curve of the natural logarithm is the current flowing through the motor, IO.
The figure above shows the characteristic of the input voltage versus the current flowing through the motor control.
The speed of the spindle motor is proportional to the current flowing through the motor. In the case of the PWM driver, the
current through the motor is equal to the peak current supplied by the driver and regenerated electrical current.
The average value of the current from the power supply (the integral value of the supply current) is proportional to the input
voltage in the average current control method. The input current flowing through the motor (number of revolutions) is
approximated by the curve of the natural logarithm (Figure 31.(b)). Therefore, the gain is higher in the low-speed rotation
area.
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Vo , Io
Vo
Vo , Io
Vo
Io
Io
Increase rate is
same of Current
square
( Integral )
Increase rate
is same of
peak current
t
t
(a) Peak Current Control
(b) Average Current Control
Figure 31: Input Voltage Versus Motor Current
(6) Current Limit Operation
Figure 32 shows the operation timing chart.
With this IC, the flip-flop is operated based on the clock generated from the built-in triangular wave, generating a PWM
pulse. Spindle driver starts the operation with the rising edge of the clock. When the peak current due to the limit current or
gain is detected, it enters short break state, and there is no output pulse until the next clock is entered. This operates by
PWM oscillation frequency based on the same internal clock in either limit current detection or normal peak current
detection.
VM_S
Voltage , Current
SPRNF
Dotted line : BHDL(No Capacitor Case)
BHLD
Charge
Charge
Charge
SPCNF
Peak Current Detection by Limit Current or Gain.
Io PEAK (Negative Peak
Current)
Io (Negative Current)
Inside Clock
( 100kHz Stability )
Inside Clock Start
Output State
Active
Short
Brake
Active
Short
Brake
Active
Short
Brake
Active
Time
Figure 32. Spindle Driver Timing Chart
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(7) Role of BHLD Pin, SPCNF Pin Capacitor
The block diagram of spindle driver is shown in the Figure 33.
This IC utilizes the current control system peak by the hold capacitor, CBHLD, to monitor through the pin SPRNF the IO load
current flowing through the spindle motor which is connected to the BHLD terminal. The charging time of the BHLD
terminal is the time constant determined by the 50kΩ (Typ) internal resistance and the capacitor C BHLD.
CSPCNF, the capacitor of SPCNF pin, affects the cut-off frequency (fC) of the spindle driver control loop. fC is computed in the
following equation: (where RERROUT=700Ω (Typ) which is the internal error amplifier output impedance).
𝑓𝑐 =
1
2π𝐶𝑆𝑃𝐶𝑁𝐹 𝑅𝑂 𝐸𝑅𝑅
VM_S
CBHLD(External）
BHLD(Pin1)
VM_S
BD8253EFV
VM_S
Current IO Flowing Through the
Spindle Motor
RSPRNF(External)
50kΩ
SPRNF(Pin2)
Amp.
SPVM(Pin3)
Output Current
Waveform
Error Amplifier
VC
Amp.
U_OUT
Amp.
SPIN(Pin53)
Amplitude
Control
SPCNF(Pin52)
CSPCNF(External）
H+
Limit Current
Reference
Voltage
Comp.
Limit Detection
Signal
amp.
Hall Signal
Comp.
H-
PWM
Duty Control ,
Short Brake
Control at Limit
Detect
V_OUT
W_OUT
Triangular ( Internal Oscillator )
Figure 33. Spindle Driver Block Diagram
(8) Setting of Spindle Hall Signal
In this IC, Low noise (Silent) is achieved by controlling the output current in sine wave shape as shown in Figure 33. The
output current is controlled by using a Hall signal which is amplified in response to SPIN input. If the amplitude of a hall
signal is too small, the amplitude of output current may also become small and number of rotations may fall. Therefore, the
input level of a hall signal shall be 50 mV or more (hall amplifier input level: VHIM) like Figure 34. Moreover, please make
the hall signal waveform near a sine wave.
HU+
HU+
50mV
50mV
50mV
HU50mV
HU-
Figure 34. Minimum Value of Hall Input Amplitude (Example of HU+ and HU- Input)
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(9) Hall Inputs (Pin 4to9) and Hall Bias (Pin 10) (For Spindle)
Hall elements can be connected either in series or parallel connection as shown in the Figure 35. Set the hall input voltage
to 1.0V to 6.0V (Hall amplifier in phase input voltage range: VHICM).
HVCC
HVCC
HU
HU
HV
HW
HV
HW
HALL_VC
(Pin10)
<Parallel Connection>
HALL_VC
(Pin10)
<Series Connection>
Figure 35. Connection Example: Hall Element
(10) FG Pulse
3FG is the output of FG terminal. Set FG pull-up resistance to 3.3kΩ or less. If the resistance is more than 3.3kΩ, there is a
possibility that the FG voltage become high to low when the Spindle output change to Hi-Z.
Because the output signal generated from the Hall signal, FG, may have a noise component riding it and the FG output
pulse may have jitter noise. It is recommended to insert a capacitor (about 0.01μF) between the positive and negative Hall
signal to prevent noise radiation from the flexible cable or from the board pattern.
(11) Reverse Brake Mode
When reverse brake is done, from high speed, take note of the counter-electromotive force. Also, consider the speed of
motor rotation to ensure sufficient output current when using reverse brake.
(12) Capacitor Between SPVM-PGND
There is change in voltage and current because of the steep drive PWM. The capacitor between SPVM and PGND is
placed in order to suppress the fluctuations due to the SPVM voltage. However, the capacitor effect is reduced if this
capacitor is placed far from IC due to the effect of the line impedance. Therefore, this capacitor should be placed very
close to the IC.
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Noise Suppression
The following are possible causes of noise of the PWM driver.
A. Noise from the power line or GND line.
B. Radiated noise
1. Countermeasures Against A
(1) Reduce the wiring impedance on Power Supply and GND lines where high current flows. Make sure that they are
separated from power supply lines of other devices so that they do not have common impedance. (Figure 36)
8V
47 µ F
GND
0. 1 µ F
47 µ F
5V
0. 1 µ F
Except Driver
Driver IC
(BD8253EFV-M)
Need to be
Separated Close to
the root of Power
Supply as much as
possible
Figure 36. Example Pattern
(2) Provide a low ESR electrolytic capacitor between the power terminal and the ground terminal of the driver to achieve
strong stabilization. Provide a ceramic capacitor with good high frequency property next to the IC. Also provide a ceramic
capacitor with good high frequency property between SPRNF and GND. (Figure 37)
This can reduce power supply ripple due to PWM switching caused by the rotation of the spindle motor.
8V
0.1µF
RSLRNF
0.1µF
PGND
(Pin14)
SLRNF
8V
0.1µF
RSPRNF
0.1µF
PGND
(Pin14)
SPVM
M
PGND
(Pin14)
SPVM:Stabilize by
電源：電解コンデンサ
Electrolytic
Capacitor
で強力に安定
PGND
8V
(Pin14)
Or more
47µF以上
0.1µF
0.1µF PGND
PGND
(Pin14)
(Pin14)
RSPRNF
3
PGND
(Pin14)
SPVM
2
2 Pin pattern:
SPRNFの
SPRNF Pin2配線はR
Connect
at the root of
根元に接続
SPRNF
BD8253EFV-M
(a)SLED
(b)Spindle
(c)Around Spindle Power Supply
Figure 37. Position of Ceramic Capacitor
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(3) If there’s no improvement with the condition (1) and (2), another way is to insert an LC filter in the power line or GND
line.
Example:
47μF
0.1μF
PWM
DRIVER
IC
47μF
0.1μF
PWM
DRIVER
IC
120μH
47μF
120μH
0.1μF
PWM
DRIVER
IC
120μH
120μH
Figure 38. Example of LC Filter
(4) Another way is to add a capacitor of around 2200 pF between each output and the ground. In this case, ensure that the
GND wiring should not have any common impedance with other signals. If a large capacitor is connected between output
and GND, for some reasons when VCC is short circuited with OV or GND, the current from the charged capacitor flows to
the output and it may be destroyed. Setting a capacitor between output and GND should be 0.1μF or less.
PWM
OUTPUT+
M
PWM
OUTPUT2200pF
Figure 39. Snubber Circuit
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2. Countermeasures Against B
(1) Ensure certain distance between RF signal line and PWM-drive output line. If it’s not possible to provide space between
these lines, shield the RF signal line with a stable GND except power GND.
(2) Same as (1), flexible cable for pickup should be shielded with GND in order to separate noise between the signal line and
the actuator drive output line.
(3) Separate the flexible cable for the motor and for the pickup.
(4) Since the FG pulse is generated from the Hall signal, to avoid noise radiation on the flexible cable and the substrate
pattern, the wiring stable GND or other low impedance ,Put shield between the PWM output and the Hall signal.
RF
PICK
UP
(2)GNDShield
(1)GNDShield
GND
(3)PICKUP Flexible Cable
FCO,
TKO
(3)Make sure to separate from GND of
Driver and Motor PCB
STEPPING
(3)Motor by freq
BD8253EFV
SPINDLE Output
(4)GNDShield
Hall Signal
Figure 40. Countermeasure for RF Noise
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Power Supply System
SPVM=8V
RSPRNF：0.165Ω
2200pF
54
VM_S
1
3
2
11 U_OUT
SP
PWM
SP
Predrive
SP
OUTPUT
12 V_OUT
13 W_OUT
RSLRNF：0.5Ω
21,22
15
SL
INPUT
SL
Predrive
SL
OUTPUT
18
PREGND
28
POWGND for Spindle
and Sled
14
VCC=8V
40
41
LD
Predrive
LD
OUTPUT
42
AVM = 5 V
0.5Ω
RVMFCRNF
RVMTKRNF
48,49
FC, TK
Predrive
FC , TK
OUTPUT
43
46
47
POWGND
for ACT and LD
Figure 41. Internal Block Power Supply and GND Connection
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Typical Application Circuit
53
52
2
3
SPCNF
PREGND
PREGND
HW-
FCCDET
51
C SPCNF
HW+
TKCDET
50
CSPVM
SPVM
SPIN
4
RSPRNF
PGND
SPRNF
5
8V
VM_S
CVM_S
CSPRNF
PGND
BHLD
54
1
CBHLD
RTKCDET
HV+
VMFCRNF
8
HU-
PGND
47
HU+
TKO-
46
49
VMTKRNF
6
HV-
9
HALL3
48
7
HALL2
R FCCDET
CAVM
PGND
R VMTKRNF
8V
R VMFCRNF
PGND
HALL1
10
HALL_VC
TKO+
45
U_OUT
FCO-
44
8V
TRACKING
COIL
11
RHVCC
RHALLVC
18
SLO2-
19
CTL1
20
CTL2
21
SLRNF1
22
SLRNF2
23
PRTLIM
24
PRTF
SL1IN
PRTT
TEST1
30
PRTOUT
SL2IN
29
FG
ACTMUTE
FCIN
TEST4
TKIN
41
40
39
38
LDIN
CVCC PGND
PREGND
8V
37
VCC
LOADING
MOTOR
36
LDO+
35
CSLRNF1
43
17
SLO2+
PGND
LDO-
42
16
SLO1-
Thermal PAD
12
13
14
15
SLO1+
M
PGND
25
SLED
MOTOR
W_OUT
26
PGND
FCO+
M
SPINDLE
MOTOR
V_OUT
27
FOCUS
COIL
TEST2
33
VC
32
PGND
CSLRNF2
PREGND
C PRTF
PREGND
TEST3
31
R SLRNF1
R SLRNF2
34
PGND
CPRTT
PREGND
3.3V
3.3V
RFG
PREGND
28
RPRTOUT
PREGND
Figure 42. Application Circuit Example
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▼Recommended Values
Component Name
Component Value
0.1μF
Product Name
GCM188R11H Series
Manufacturer
murata
47μF
0.1μF
UCD1E470MCL
GCM188R11H Series
Nichicon
murata
2200pF
0.1μF
GCM188R11H Series
GCM188R11H Series
murata
murata
RSPRNF
47μF
0.165Ω
UCD1E470MCL
MCR100 Series
Nichicon
Rohm
CSPRNF
CSPCNF
0.1μF
0.01μF
GCM188R11H Series
GCM188R11H Series
murata
murata
CAVM
0.1μF
47μF
GCM188R11H Series
UCD1E470MCL
murata
Nichicon
RTKRNF
RTKCDET
0.5Ω
10kΩ
MCR100 Series
MCR03 Series
Rohm
Rohm
RFCRNF
RFCCDET
0.5Ω
10kΩ
MCR100 Series
MCR03 Series
Rohm
Rohm
CPRTT
CPRTF
0.1μF
0.1μF
GCM188R11H Series
GCM188R11H Series
murata
murata
RSLRNF1
RSLRNF2
0.56Ω
0.56Ω
MCR100 Series
MCR100 Series
Rohm
Rohm
CSLRNF1
CSLRNF2
0.1μF
0.1μF
GCM188R11H Series
GCM188R11H Series
murata
murata
RHVCC
RHALLVC
100Ω
100Ω
MCR03 Series
MCR03 Series
Rohm
Rohm
RPRTLIM
RFG
47kΩ
33kΩ
MCR03 Series
MCR03 Series
Rohm
Rohm
RPRTOUT
33kΩ
MCR03 Series
Rohm
CVCC
CVM_S
CBHLD
CSPVM
1.
2.
3.
VMTKRNF, VMFCRNF, VCC, SPRNF, SPVM, SLRNF1, and SLRNF2: These pins are power supply of large currents. So,
use Capacitor between PGND to these pins.
VM_S, SPCNF, PRTF, PRTT: Since it is a small signal path , please insert the capacitor against PREGND.
The VCC terminal is a power supply terminal of the loading part. Since high current flows when carrying out loading
operation, please insert a capacitor to PGND. When not carrying out loading operation and operating other spindles,
SLED motor, and an actuator, a VCC terminal becomes a power supply of the Pre stage of these circuits.
In this case, since high current does not flow, please insert a capacitor to PREGND.
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Terminal Equivalent Circuit (The value of resistors and capacitors are typical value)
1.BHLD
Pin5 4
Pin5 4
2.SPRNF
Pin5 4
50k
Pin5 4
Pin5 4
5k
5k
Pin 1
Pin 2
100
1k
Pin5 4
Pin5 4
Pin2 8
Pin2 8
2k
5k
Pin2 8
Pin2 8
Pin2 8
Pin28
Pin2 8
4.HW-, 5.HW+, 6HV-, 7HV+, 8.HU-, 9HU+
Pin28
10.HALL_VC
Pin54
Pin1 0
Pin4, 5, 6, 7, 8, 9
Pin54
50k
Pin28
Pin28 Pin28 Pin28
Pin28 Pin28
4p
11.U_OUT, 12.V_OUT, 13.W_OUT
15.SLO1+, 16.SLO1Pin21
Pin3
Pin15, 16
Pin11, 12, 13
Pin14 Pin14
Pin14 Pin14
17.SLO2+, 18.SLO2-
19.CTL1, 20.CTL2, 38.ACTMUTE
Pin22
Pin19, 20, 38
Pin17, 1 8
50k
50k
Pin28 Pin28
Pin28
Pin14 Pin14
21.SLRNF1, 22.SLRNF2
23.PRTLIM
Pin54
Pin4 0
10p
Pin21, 2 2
30k
1k
Pin2 3
Pin2 8
1k
Pin14 Pin14
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24.PRTF, 25.PRTT
26.PRTOUT
Pin4 0
Pin26
500
1k
727
Pin2 8
Pin24, 25
10k
500
10k
20k
Pin28 Pin28
Pin2 8
Pin2 8
Pin28
Pin2 8
27.FG
29.SL2IN, 31.SL1IN, 39.LDIN, 53.SPIN
Pin2 7
Pin29, 31, 39, 53
47k
229
Pin28 Pin28
Pin2 8
Pin28 Pin28
33.VC
35.TKIN, 37.FCIN
50k
47 k
Pin33
×2
Pin35, 37
×4
50k
Pin28
33k
10k
150k
10 k
180k
Pin28 Pin28
Pin2 8
×2
Pin28
Pin28 Pin28
Pin2 8
Pin28
41.LDO+, 42.LDO-
43.FCO+, 44.FCO-
Pin40
Pin48
10k
10k
Pin41, 42
50k
Pin43, 44
50k
50k
50k
Pin47 Pin47
Pin47 Pin47
45.TKO+, 46TKO-
48.VMFCRNF, 49.VMTKRNF
Pin49
Pin40
Pin48, 49
50k
Pin45, 46
10k
50k
Pin47 Pin47
Pin28 Pin28
Pin47 Pin47
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50.TKCDET, 51.FCCDET
52.SPCNF
Pin40
Pin5 4
Pin5 4
10k
10k
Pin50, 51
Pin5 2
1k
500
Pin28 Pin28
500
10k
500
Pin2 8
Pin28 Pin28
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 43. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD8253EFV-M
Ordering Information
B
D
8
2
5
Part Number
3
E
F
V
-
M
Package
EFV : HTSSOP-B54
E
2
Product Rank
M : for Automotive
Packaging Specification
E2 : Embossed tape and reel
Marking Diagrams
HTSSOP-B54 (TOP VIEW)
Part Number Marking
BD8253EFV
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
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BD8253EFV-M
Revision History
Date
Revision
2016.1.26
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001