DATASHEET Radiation Hardened High Frequency Half Bridge Drivers IS-2100ARH, IS-2100AEH Features The radiation hardened IS-2100ARH, IS-2100AEH are high frequency, 130V half bridge N-Channel MOSFET driver ICs, which are functionally similar to industry standard 2110 types. The low-side and high-side gate drivers are independently controlled. This gives the user maximum flexibility in dead time selection and driver protocol. • Electrically screened to DLA SMD # 5962-99536 In addition, the devices have on-chip error detection and correction circuitry, which monitors the state of the high-side latch and compares it to the HIN signal. If they disagree, a set or reset pulse is generated to correct the high-side latch. This feature protects the high-side latch from single event upsets (SEUs). Applications • QML qualified per MIL-PRF-38535 requirements • Radiation environment - Maximum total dose . . . . . . . . . . . . . . . . . . . . . 300krad(Si) - DI RSG process provides latch-up immunity - SEU rating . . . . . . . . . . . . . . . . . . . . . . . . . . 82MeV/mg/cm2 - Vertical device architecture reduces sensitivity to low dose rates • Bootstrap supply maximum voltage to 150V • Drives 1000pF load at 1MHz with rise and fall times of 30ns (typical) • 1.5A (typical) peak output current • High frequency switch-mode power supplies • Independent inputs for non-half bridge topologies • Drivers for inductive loads • Low DC power consumption . . . . . . . . . . . . . . 60mW (typical) • DC motor drivers • Operates with VDD = VCC over 12V to 20V range Pin Configuration • Low-side supply undervoltage protection IS-2100ARH, IS-2100AEH FLATPACK (CDFP4-F16) TOP VIEW LO 1 16 NC COM 2 15 VSS VCC 3 14 LIN NC 4 13 SD NC 5 12 HIN VS 6 11 VDD VB 7 10 NC HO 8 9 NC May 10, 2016 FN9037.3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2002, 2012, 2016. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. IS-2100ARH, IS-2100AEH Ordering Information ORDERING SMD NUMBER (Note 2) PART NUMBER (Note 1) TEMP RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # 5962F9953602V9A IS0-2100ARH-Q -55 to +125 Die 5962F9953602VXC IS9-2100ARH-Q -55 to +125 16 Ld Flatpack K16.A 5962F9953602QXC IS9-2100ARH-8 -55 to +125 16 Ld Flatpack K16.A N/A IS9-2100ARH/Proto -55 to +125 16 Ld Flatpack K16.A 5962F9953603VXC IS9-2100AEH-Q -55 to +125 16 Ld Flatpack K16.A 5962F9953603V9A IS0-2100AEH-Q -55 to +125 Die NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering. Submit Document Feedback 2 FN9037.3 May 10, 2016 IS-2100ARH, IS-2100AEH Die Characteristics DIE DIMENSIONS: Backside Finish: 4820µm x 3300µm (190 mils x 130 mils) Thickness: 483µm 25.4µm (19 mils 1 mil) INTERFACE MATERIALS: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Glassivation: Unbiased (DI) Type: PSG (Phosphorous Silicon Glass) Thickness: 8.0kÅ 1.0kÅ ADDITIONAL INFORMATION: Worst Case Current Density: Top Metallization: <2.0 x 105 A/cm2 Type: ALSiCu Thickness: 16.0kÅ 2kÅ Transistor Count: 542 Substrate: Radiation Hardened Silicon Gate, Dielectric Isolation Metallization Mask Layout IS-2100ARH, IS-2100AEH SD (13) HIN (12) LIN (14) VSS (15) VDD (11) LO (1) HO (8) COM (2) VB (7) VCC (3) VS (6) Submit Document Feedback 3 FN9037.3 May 10, 2016 IS-2100ARH, IS-2100AEH TABLE 1. IS-2100ARH, ISL-2100AEH DIE LAYOUT X-Y COORDINATES PAD CENTER PAD SIZE PAD NUMBER PAD NAME X (µm) Y (µm) DX (µm) DY (µm) 3 VCC 296.5 270 109 280 6 VS 4561 284.5 109 280 7 VB 4561 711 109 280 8 HO 4561 1079 109 280 11 VDD 4645.5 1500 109 109 12 HIN 4627.5 2817 109 109 13 SD 302 3064.5 109 109 14 LIN 237.5 2040 109 109 15 VSS 239 1719 109 109 1 LO 296.5 1095 109 280 2 COM 296.5 697 109 280 NOTE: Origin of coordinates is the lower left corner of the die. 3500 3000 2500 2000 1500 1000 500 0 0 1000 2000 3000 4000 5000 FIGURE 1. XY PAD CENTER Submit Document Feedback 4 FN9037.3 May 10, 2016 IS-2100ARH, IS-2100AEH Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION May 10, 2016 FN9037.3 CHANGE Updated Ordering information table by applying new standards and adding Notes 1 and 2. Added Table 1 on page 4. Added Package Outline Drawing K16.A. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 5 FN9037.3 May 10, 2016 IS-2100ARH, IS-2100AEH Package Outline Drawing K16.A 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 2, 1/10 0.015 (0.38) 0.008 (0.20) PIN NO. 1 ID OPTIONAL 1 2 0.050 (1.27 BSC) PIN NO. 1 ID AREA TOP VIEW 0.022 (0.56) 0.015 (0.38) 0.115 (2.92) 0.045 (1.14) 0.440 (11.18) MAX 0.005 (0.13) MIN 4 0.045 (1.14) 0.026 (0.66) -C- 6 0.285 (7.24) 0.245 (6.22) 0.13 (3.30) MIN SEATING AND BASE PLANE 0.009 (0.23) 0.004 (0.10) -D- 0.370 (9.40) 0.250 (6.35) -H- 0.03 (0.76) MIN LEAD FINISH SIDE VIEW NOTES: 0.006 (0.15) 0.004 (0.10) 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. LEAD FINISH 0.009 (0.23) BASE METAL 0.004 (0.10) 0.019 (0.48) 0.015 (0.38) 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 0.0015 (0.04) MAX 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 0.022 (0.56) 0.015 (0.38) 3 SECTION A-A 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Controlling dimension: INCH. Submit Document Feedback 6 FN9037.3 May 10, 2016