VSON010X3030

PRODUCTS
TYPE
Semiconductor
PAGE
Jisso Information for
VSON xxx X series (E2)
1/4
― Jisso Infomation ―
Package : VSON ×××X series (E2)
< A table of contents >
1.Structure
2.Tape and Reel informations
3.Storage conditions
4.Marking lot number
5.Footprint dimensions
6.Recommended soldering
1 / 4 page
1 / 4 ~ 3 / 4 page
3 / 4 page
3 / 4 page
3 / 4 page
3 / 4 ~ 4 / 4 page
1. Structure
6
5
3
Compositional element
No.
1
4
2
Fig. 1 Structure
1
Lead (External lead : Pb free solder plating)
2
Die Pad
3
Die
4
Die Attach
5
Bonding Wire
6
Molding Resin
2. Tape and Reel information
2. 1. Packing specification
1Pin
Direction of feed
Reel
Fig. 2 Typical Tape and Reel configuration
2. 2. Tape and Reel specification
2. 2. 1. Tape and reel dimensions ( See the table on page 4/4 )
P0
 D0
P2
T
1234
E2 (See Fig. 2)
1234
Direction of feed
1234
See the table on page 4/4
1234
Quantity
1234
Embossed carrier tape
1234
Tape
D
W
B1
E
D1
K'
P1
W1
A
W2
A1
Fig. 3 Tape dimensions
REV. J
TSZ22111・05・002
2015. 1.16
Fig. 4 Reel dimensions
SPECIFICATION No.:TSZ02201-VSON×××X-1-2-E2
B
F
C
E
PRODUCTS
TYPE
Semiconductor
PAGE
Jisso Information for
VSON xxx X series (E2)
2/4
2. 3. Leader and Trailer
2. 3. 1. Leader
No component pockets are 25 pockets or more.
2. 3. 2. Trailer
No component pockets are 10 pockets or more.
Tape is free from reel.
Out going inspection stamp
2. 4. Laｂel for Reel and Box
Product No.
BA1234NUX-E2
Quantity
4,000pcs．0124 A5110F
Lot number
K.YAMADA
BA1234NUX-E2
MNo. 124 023 pcs.
MNo. 124 024 pcs.
Internal product code
Marking lot number
Pb Free Mark
Fig. 5 Label example
2. 5. Packing style
Unit box
Label
tape
Label
Reel
Fig. 6 Packing style
2. 6. Shipping style
4 unit boxes or less per shipping box
2. 7. Packing materials
Item
Material
Embossed carrier tape
PS
Cover tape
190
PET + PE
Reel
255
193
PS
Unit box
Cardboard
Shipping box
Cardboard
( all dimensions in mm)
Fig. 7 Shipping box dimensions and Shipping style
2. 8. Others
2. 8. 1. Peelback strength
Cover tape peelback strength is 0.2 to 0.7N.
Peelback
Peelback speed
300±10mm/min
165 to 180°
Fig. 8 Test method
REV. J
TSZ22111・05・002
SPECIFICATION No.:TSZ02201-VSON×××X-1-2-E2
PRODUCTS
TYPE
Semiconductor
PAGE
Jisso Information for
VSON xxx X series (E2)
3/4
2. 8. 2. Missing Ics
(1) No consecutive dropouts.
(2) A maximun 0.1% of specified number of products in each packing may be missing.
3. Storage conditions
3. 1. Storage environment
Recommended storage conditions are as follows :
-Temperature
: 5 to 30°C
-Humidity
: 40 to 70% RH
3. 2. Storage period
-Specified storage period : 1 year
4. Marking lot number
VSON010X3020
VSON010X3030
① ② ② ③
① Production year code
② week number
③ Production lot number
VSON008X2020
① ②
① ② ③
① Production year's month code
② Production lot number
① Production year code
② One last digit of week number
③ Production lot number
5. Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
(all dimensions in mm)
Package
Land pitch Land space Land length Land width
e
≧l2
MD1
b2
0.50
1.00
0.60
0.27
VSON010X3030
0.50
2.00
0.80
0.27
VSON008X2020
0.50
1.20
0.60
0.27
D3
MD1
l2
VSON010X3020
Package
E3
Themal Via
e
b2
Radiaton land Radiaton land
length
width
Thermal via
Pitch
Diameter
2.49
-
0.3
1.00
2.10
-
0.3
0.70
1.60
-
0.3
D3
E3
VSON010X3020
0.54
VSON010X3030
VSON008X2020
*The lead toe and lead side fillet may not be achieved
because of non-lead packeges.
6. Soldering conditions
6. 1. Recommended temperature profile for reflow
Package surface temperature
260°C MAX
255°C
Soldering temperature
1 to 4°C/sec
Preheating
temperature
Preheating
zone
REV. J
TSZ22111・05・002
Preheating temperature ; 130°C to 190°C
Preheating zone
; 120sec MAX
Soldering temperature ; 220°C to 230°C
Soldering zone
; 60sec MAX
(Notice)
Maximum 2-timessoldering
Time
10sec MAX
Soldering zone
SPECIFICATION No.:TSZ02201-VSON×××X-1-2-E2
PRODUCTS
TYPE
Semiconductor
PAGE
Jisso Information for
VSON xxx X series (E2)
4/4
6. 2. The wave soldering method is not supported.
6. 3. Notice information of board mounting
Mounting on flexible film
Mounting on flexible film, film bend may occur lack of lead from package,
usage of support board and under fill is recommended.
recommended
Not recommended
under fill
flexible film
support board
Mounting on long and narrow board
Mounting on long and narrow board, bending stress may occur a luck of lead from package,
bending board direction and outer lead direction is recommended as drawing (vertically layout)
and under fill usage is recommended.
Not recommended
recommended
mounting board
outer lead direction
board bending direction
6. 4. Rework by solering iron is not allowed or it may cause mold crack and terminal open.
< Tape dimensions >
Package
(pcs)
VSON010X3020
4000
VSON010X3030
4000
Tolerance
Package
Tape dimensions (all dimensions in mm)
Quantity
A1
B1
D0
2.25 3.25 φ1.5
3.30 3.30 φ1.5
±0.1 ±0.1
+0.1
-0
VSON008X2020
4000
A1
2.20
B1
2.20
±0.05 ±0.05
Tolerance
E
1.75
F
5.5
K'
0.85
P1
4.0
P2
2.0
φ1.1
1.75
5.5
0.75
4.0
2.0
D0
φ1.5
+0.1
-0
D1
φ0.8
±0.1
E
1.75
F
3.5
B
C
D
φ60 φ13.0 φ21.0
E
2.0
W1
13.0
W2
15.4
VSON010X3030 φ180
φ60 φ13.0 φ21.0
2.0
13.0
15.4
VSON008X2020 φ180
φ60 φ13.0 φ21.0
2.0
+1.0
±0.2 ±0.8 ±0.5
-0
9.0
11.4
±1.0
REV. J
TSZ22111・05・002
0.25 12.0
4.0
K'
0.85
P1
4.0
P2
2.0
T
0.3
W
8.0
P0
4.0
< Dehydrated weight >
A
VSON010X3020 φ180
Tolerance
P0
4.0
±0.1 ±0.05 ±0.05 ±0.1 ±0.05 ±0.05 ±0.2 ±0.1
Reel dimensions (all dimensions in mm)
+0
-1.5
W
12.0
±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.05 ±0.05 ±0.2 ±0.1
< Reel dimensions >
Package
T
0.3
Tape dimensions (all dimensions in mm)
Quantity
(pcs)
D1
φ1.0
+1.0
-0
Dehydrated weight
0.009
0.014
0.006
SPECIFICATION No.:TSZ02201-VSON×××X-1-2-E2
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001