MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 14 June 2016, 10:22 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 24 February 2011 [Approved on 14 June 2016, 10:21 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Material
group
Chip (die)
Other inorganic
materials
Die attach
Encapsulation
Sn-Pb solder
EP (Epoxy resin)
Leadfinish
Tin plating
Leadframe
Copper (e.g.
copper amounts
in cable
harnesses)
% w/w des
Materials
im Artikel
3.89000%
4.37000%
44.78000%
0.55000%
46.41000%
Substances in
the material
CAS Number
% w/w des
Stoffs im
Artikel
Nickel
8049-31-8
1.50000%
Silicon dioxide
14808-60-7
5.05000%
Silicon
7440-21-3
93.45000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.50000%
ALUMINUM(III)
21645-51-2
HYDROXIDE
2.80000%
resin
9060-05-3
8.60000%
Epoxy resin 89
26335-32-0
18.00000%
Silica, Crystalline
14808-60-7
70.10000%
Tin
7440-31-5
100.00000%
iron
14127-53-8
0.10000%
Copper
7440-50-8
99.90000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
SOD-123FL
Diode SMD
0.018
g
Page 1
Report generated: 14 June 2016, 10:22 GMT