TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors IR Receiver Modules for Remote Control Systems FEATURES • Continuous data transmission possible • Very low supply current • Photo detector and preamplifier in one package • Internal filter for PCM frequency • Supply voltage: 2.5 V to 5.5 V • Improved immunity against ambient light • Capable of side or top view • Insensitive to supply voltage ripple and noise • Low profile 2.35 mm • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION MECHANICAL DATA The TSOP77...W series are miniaturized SMD IR receiver modules for infrared remote control systems. Two PIN diodes and a preamplifier are assembled on a leadframe, the epoxy package contains an IR filter. Pinning: 1, 4 = GND, 2 = VS, 3 = OUT ORDERING CODE The demodulated output signal can be directly connected to a microprocessor for decoding. The TSOP774..W series devices are optimized to suppress almost all spurious pulses from Wi-Fi and CFL sources. They may suppress some data signals if continuously transmitted. Taping: TSOP77...WTT - top view taped TSOP77...WTR - side view taped The TSOP772..W series devices are provided primarily for compatibility with old AGC2 designs. New designs should prefer the TSOP534.. series containing the newer AGC4. These components have not been qualified according to automotive specifications. PARTS TABLE LEGACY, FOR LONG BURST REMOTE CONTROLS (AGC2) RECOMMENDED FOR LONG BURST CODES (AGC4) (1) 30 kHz TSOP77230W TSOP77430W 33 kHz TSOP77233W TSOP77433W 36 kHz TSOP77236W TSOP77436W (2)(3)(4) 38 kHz TSOP77238W TSOP77438W (5)(6)(9) 40 kHz TSOP77240W TSOP77440W 56 kHz TSOP77256W TSOP77456W (7)(8) AGC Carrier frequency Package Heimdall no lens Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 2.35 D Mounting SMD Application Best remote control code Remote control (2) RC-5 (3) RC-6 (4) Panasonic (5) NEC (6) Sharp (7) r-step (8) Thomson RCA (9) r-map Note (1) We advise try AGC4 first if the burst length is unknown Rev. 1.4, 26-Nov-15 1 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors BLOCK DIAGRAM APPLICATION CIRCUIT 17170-10 2 IR receiver VS 3 Input Band pass AGC OUT Demodulator VO GND GND Control circuit µC OUT 1, 4 PIN + VS C1 Circuit 30 k Ω R1 Transmitter with TSALxxxx VS GND The external components R1 and C1 are optional to improve the robustness against electrical overstress (typical values are R1 = 100 Ω, C1 = 0.1 µF). 20445-1 ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage Supply current Output voltage Voltage at output to supply Output current Junction temperature Storage temperature range Operating temperature range Power consumption Soldering temperature TEST CONDITION SYMBOL VS IS VO VS - VO IO Tj Tstg Tamb Ptot Tsd Tamb ≤ 85 °C t ≤ 10 s, 1 mm from case VALUE -0.3 to +6 5 -0.3 to 5.5 -0.3 to (VS + 0.3) 5 100 -25 to +85 -25 to +85 10 260 UNIT V mA V V mA °C °C °C mW °C Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Supply voltage TEST CONDITION VS = 5 V, Ev = 0 Ev = 40 klx, sunlight Ev = 0, IR diode TSAL6200, IF = 400 mA, test signal see fig. 1 IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1 Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Angle of half transmission distance Supply current Transmission distance Output voltage low Minimum irradiance Maximum irradiance Directivity SYMBOL VS ISD ISH MIN. 2.5 0.55 - TYP. 0.7 0.8 MAX. 5.5 0.9 - UNIT V mA mA d - 35 - m VOSL - - 100 mV Ee min. - 0.4 0.8 mW/m2 Ee max. ϕ1/2 50 - ± 75 - W/m2 deg TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Optical Test Signal 1.0 (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) tpo - Output Pulse Width (ms) Ee t tpi * * tpi VO Output Signal 16110 1) 7/f0 < td < 15/f0 2) t - 5/f < t < t + 6/f pi 0 po pi 0 VOH VOL T 10/f0 is recommended for optimal function td 1) tpo 2) Input Burst Length 0.7 0.6 0.5 0.4 0.3 0.2 λ = 950 nm, Optical Test Signal, Fig.1 0.1 1 10 102 103 104 Ee - Irradiance (mW/m2) Fig. 1 - Output Active Low Rev. 1.4, 26-Nov-15 0.8 0 0.1 t Output Pulse Width 0.9 Fig. 2 - Pulse Length and Sensitivity in Dark Ambient 2 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Optical Test Signal 600 µs Ee min. - Threshold Irradiance (mW/m2) Ee Vishay Semiconductors t 600 µs t = 60 ms 94 8134 Output Signal, (see fig. 4) VO VOH VOL Ee min. - Threshold Irradiance (mW/m2) ton, toff - Output Pulse Width (ms) ton 0.6 toff 0.4 0.3 0.2 λ = 950 nm, optical test signal, Fig. 1 0.1 0 0.1 1 10 100 Ee - Irradiance Wavelength of ambient illumination: λ = 950 nm 2 1.5 1 0.5 0 0.01 0.1 1 10 100 1000 1.0 f = f0 0.9 0.8 0.7 f = 30 kHz 0.6 0.5 f = 20 kHz 0.4 0.3 0.2 f = 10 kHz 0.1 f = 100 Hz 0 1 10 000 21394 (mW/m2) Fig. 4 - Output Pulse Diagram 10 100 1000 ΔVsRMS - AC Voltage on DC Supply Voltage (mV) Fig. 7 - Sensitivity vs. Supply Voltage Disturbances 1.2 0.8 0.7 1.0 Max. Envelope Duty Cycle Ee min./Ee - Relative Responsivity 3 2.5 Fig. 6 - Sensitivity in Bright Ambient 0.8 0.5 4 3.5 Ee - Ambient DC Irradiance (W/m2) Fig. 3 - Output Function 0.7 Correlation with ambient light sources: 10 W/m2 = 1.4 klx (Std. ilum. A, T = 2855 K) 10 W/m2 = 8.2 klx (Daylight, T = 5900 K) t t off t on 5 4.5 0.8 0.6 0.4 f = f0 ± 5 % Δf(3 dB) = f0/10 0.2 0.6 0.5 0.3 0.2 TSOP774..W 0.1 0.0 0 0.7 16925 0.9 1.1 f = 38 kHz, Ee = 2 mW/m² 0 1.3 f/f0 - Relative Frequency 20 40 60 80 100 120 Burst Length (Number of Cycles/Burst) Fig. 5 - Frequency Dependence of Responsivity Rev. 1.4, 26-Nov-15 TSOP772..W 0.4 Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length 3 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W Ee min. - Threshold Irradiance (mW/m2) www.vishay.com Vishay Semiconductors 0.8 0° 20° 30° 0.7 40° 0.6 0.5 50° 1.0 0.4 60° 0.9 70° 0.3 0.8 80° 0.2 -30 -10 10 30 50 70 90 0.6 Tamb - Ambient Temperature (°C) 1.0 0.9 Ee min. - Sensitivity (mW/m2) 1.0 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 800 850 900 10° 0.7 0.6 0.5 0.4 0.3 0.2 0.1 2.5 3.5 4.5 5.5 VS - Supply Voltage (V) Fig. 10 - Relative Spectral Sensitivity vs. Wavelength 0° 0 0.8 0.0 1.5 950 1000 1050 1100 1150 λ- Wavelength (nm) 21425 0.2 Fig. 12 - Vertical Directivity 0.9 0 750 0.4 drel - Relative Transmission Distance 22194 Fig. 9 - Sensitivity vs. Ambient Temperature S (λ) rel - Relative Spectral Sensitivity 10° 20° Fig. 13 - Sensitivity vs. Supply Voltage 30° 40° 1.0 0.9 50° 0.8 60° 70° 80° 0.6 0.4 0.2 0 drel - Relative Transmission Distance 22193 Fig. 11 - Horizontal Directivity Rev. 1.4, 26-Nov-15 4 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors SUITABLE DATA FORMAT IR Signal This series is designed to suppress spurious output pulses due to noise or disturbance signals. The devices can distinguish data signals from noise due to differences in frequency, burst length, and envelope duty cycle. The data signal should be close to the device’s band-pass center frequency (e.g. 38 kHz) and fulfill the conditions in the table below. When a data signal is applied to the product in the presence of a disturbance, the sensitivity of the receiver is automatically reduced by the AGC to insure that no spurious pulses are present at the receiver’s output. 0 Some examples which are suppressed are: 5 • DC light (e.g. from tungsten bulbs sunlight) 10 15 20 Time (ms) 16920 Fig. 14 - IR Disturbance from Fluorescent Lamp with Low Modulation • Continuous signals at any frequency • Strongly or weakly modulated patterns from fluorescent lamps with electronic ballasts (see fig. 14 or fig. 15) IR Signal • 2.4 GHz and 5 GHz Wi-Fi 0 16921 5 10 15 20 Time (ms) Fig. 15 - IR Disturbance from Fluorescent Lamp with High Modulation TSOP772..W TSOP774..W Minimum burst length 10 cycles/burst 10 cycles/burst After each burst of length a minimum gap time is required of 10 to 70 cycles ≥ 12 cycles 10 to 35 cycles ≥ 12 cycles 70 cycles > 4 x burst length 35 cycles > 10 x burst length For bursts greater than a minimum gap time in the data stream is needed of Maximum number of continuous short bursts/second 800 1300 NEC code Yes Preferred RC5/RC6 code Yes Preferred Thomson 56 kHz code Yes Preferred Sharp code Yes Preferred Mild disturbance patterns are suppressed (example: signal pattern of fig. 14) Complex and critical disturbance patterns are suppressed (example: signal pattern of fig. 15 or highly dimmed LCDs) Suppression of interference from fluorescent lamps Notes • For data formats with short bursts please see the datasheet of TSOP773..W and TSOP775..W Rev. 1.4, 26-Nov-15 5 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 ± 0.1 Center of sensitive area (3.25) Mold residue 2.35 (1.8) 1.2 ± 0.2 3 0.8 Mold residue (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area 2.05 Not indicated tolerances ± 0.15 (1.5) Tool separation line (2.2) Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 Pick and place area 1.8 1.27 Drawing-No.: 6.550-5300.01-4 Issue: 4; 13.09.11 0.8 22609 ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handle products only after the temperature has cooled off • Finish soldering within 3 s • Handling after reflow should be done only after the work surface has been cooled off Rev. 1.4, 26-Nov-15 6 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE 300 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 T (°C) 200 max. 20 s 150 max. 100 s max. 120 s 100 max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s 50 0 0 50 100 150 t (s) 19800 200 250 300 max. 2 cycles allowed 3.6 0.3 TAPING VERSION TSOP..TR DIMENSIONS in millimeters 16 1.75 7.5 Ø 1.5 4 Direction of feed 8 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5342.01-4 Issue: 2; 12.06.13 Rev. 1.4, 26-Nov-15 7 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors 3 0.3 TAPING VERSION TSOP..TT DIMENSIONS in millimeters 16 1.75 7.5 Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5341.01-4 Issue: 3; 06.10.15 Rev. 1.4, 26-Nov-15 8 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE PEEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 ± 10 mm/min. 165° to 180° peel angle Rev. 1.4, 26-Nov-15 9 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - LOT-/serial-number Mixed code indicator Origin Long bar code top MIXED CODE - xxxxxxx+ Company logo Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: Aluminum bag 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. Label An EIA JEDEC® standard J-STD-020 level 4 label is included on all dry bags. Reel LEVEL CAUTION 15973 This bag contains MOISTURE-SENSITIVE DEVICES FINAL PACKINGFINAL PACKING 4 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH RECOMMENDED METHOD OF STORAGE 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 • Storage temperature 10 °C to 30 °C 22522 • Storage humidity ≤ 60 % RH max. Rev. 1.4, 26-Nov-15 EIA JEDEC standard J-STD-020 level 4 label is included on all dry bags 10 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP772..W, TSOP774..W www.vishay.com Vishay Semiconductors ESD PRECAUTION VISHAY SEMICONDUTORS STANDARD BAR CODE LABELS Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. BAR CODE PRODUCT LABEL (example) 22178 Rev. 1.4, 26-Nov-15 11 Document Number: 82466 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000