TSOP772..W, TSOP774..W Datasheet

TSOP772..W, TSOP774..W
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Continuous data transmission possible
• Very low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
• Capable of side or top view
• Insensitive to supply voltage ripple and noise
• Low profile 2.35 mm
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
MECHANICAL DATA
The TSOP77...W series are miniaturized SMD IR receiver
modules for infrared remote control systems. Two PIN
diodes and a preamplifier are assembled on a leadframe, the
epoxy package contains an IR filter.
Pinning:
1, 4 = GND, 2 = VS, 3 = OUT
ORDERING CODE
The demodulated output signal can be directly connected
to a microprocessor for decoding. The TSOP774..W series
devices are optimized to suppress almost all spurious
pulses from Wi-Fi and CFL sources. They may suppress
some data signals if continuously transmitted.
Taping:
TSOP77...WTT - top view taped
TSOP77...WTR - side view taped
The TSOP772..W series devices are provided primarily for
compatibility with old AGC2 designs. New designs should
prefer the TSOP534.. series containing the newer AGC4.
These components have not been qualified according to
automotive specifications.
PARTS TABLE
LEGACY, FOR
LONG BURST REMOTE CONTROLS (AGC2)
RECOMMENDED FOR
LONG BURST CODES (AGC4) (1)
30 kHz
TSOP77230W
TSOP77430W
33 kHz
TSOP77233W
TSOP77433W
36 kHz
TSOP77236W
TSOP77436W (2)(3)(4)
38 kHz
TSOP77238W
TSOP77438W (5)(6)(9)
40 kHz
TSOP77240W
TSOP77440W
56 kHz
TSOP77256W
TSOP77456W (7)(8)
AGC
Carrier
frequency
Package
Heimdall no lens
Pinning
1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm)
6.8 W x 3.0 H x 2.35 D
Mounting
SMD
Application
Best remote control code
Remote control
(2)
RC-5
(3)
RC-6
(4)
Panasonic
(5)
NEC
(6)
Sharp
(7)
r-step
(8)
Thomson RCA
(9)
r-map
Note
(1) We advise try AGC4 first if the burst length is unknown
Rev. 1.4, 26-Nov-15
1
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170-10
2
IR receiver
VS
3
Input
Band
pass
AGC
OUT
Demodulator
VO
GND
GND
Control circuit
µC
OUT
1, 4
PIN
+ VS
C1
Circuit
30 k Ω
R1
Transmitter
with
TSALxxxx
VS
GND
The external components R1 and C1 are optional
to improve the robustness against electrical overstress
(typical values are R1 = 100 Ω, C1 = 0.1 µF).
20445-1
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
Supply current
Output voltage
Voltage at output to supply
Output current
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
Soldering temperature
TEST CONDITION
SYMBOL
VS
IS
VO
VS - VO
IO
Tj
Tstg
Tamb
Ptot
Tsd
Tamb ≤ 85 °C
t ≤ 10 s, 1 mm from case
VALUE
-0.3 to +6
5
-0.3 to 5.5
-0.3 to (VS + 0.3)
5
100
-25 to +85
-25 to +85
10
260
UNIT
V
mA
V
V
mA
°C
°C
°C
mW
°C
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
TEST CONDITION
VS = 5 V, Ev = 0
Ev = 40 klx, sunlight
Ev = 0, IR diode TSAL6200, IF = 400 mA,
test signal see fig. 1
IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
Angle of half transmission distance
Supply current
Transmission distance
Output voltage low
Minimum irradiance
Maximum irradiance
Directivity
SYMBOL
VS
ISD
ISH
MIN.
2.5
0.55
-
TYP.
0.7
0.8
MAX.
5.5
0.9
-
UNIT
V
mA
mA
d
-
35
-
m
VOSL
-
-
100
mV
Ee min.
-
0.4
0.8
mW/m2
Ee max.
ϕ1/2
50
-
± 75
-
W/m2
deg
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
1.0
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
tpo - Output Pulse Width (ms)
Ee
t
tpi *
* tpi
VO
Output Signal
16110
1)
7/f0 < td < 15/f0
2) t - 5/f < t < t + 6/f
pi
0
po
pi
0
VOH
VOL
T
10/f0 is recommended for optimal function
td 1)
tpo 2)
Input Burst Length
0.7
0.6
0.5
0.4
0.3
0.2
λ = 950 nm,
Optical Test Signal, Fig.1
0.1
1
10
102
103
104
Ee - Irradiance (mW/m2)
Fig. 1 - Output Active Low
Rev. 1.4, 26-Nov-15
0.8
0
0.1
t
Output Pulse Width
0.9
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
2
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Optical Test Signal
600 µs
Ee min. - Threshold Irradiance (mW/m2)
Ee
Vishay Semiconductors
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VO
VOH
VOL
Ee min. - Threshold Irradiance (mW/m2)
ton, toff - Output Pulse Width (ms)
ton
0.6
toff
0.4
0.3
0.2
λ = 950 nm,
optical test signal, Fig. 1
0.1
0
0.1
1
10
100
Ee - Irradiance
Wavelength of ambient
illumination: λ = 950 nm
2
1.5
1
0.5
0
0.01
0.1
1
10
100
1000
1.0
f = f0
0.9
0.8
0.7
f = 30 kHz
0.6
0.5
f = 20 kHz
0.4
0.3
0.2
f = 10 kHz
0.1
f = 100 Hz
0
1
10 000
21394
(mW/m2)
Fig. 4 - Output Pulse Diagram
10
100
1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
1.2
0.8
0.7
1.0
Max. Envelope Duty Cycle
Ee min./Ee - Relative Responsivity
3
2.5
Fig. 6 - Sensitivity in Bright Ambient
0.8
0.5
4
3.5
Ee - Ambient DC Irradiance (W/m2)
Fig. 3 - Output Function
0.7
Correlation with
ambient light sources:
10 W/m2 = 1.4 klx
(Std. ilum. A, T = 2855 K)
10 W/m2 = 8.2 klx
(Daylight, T = 5900 K)
t
t off
t on
5
4.5
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.6
0.5
0.3
0.2
TSOP774..W
0.1
0.0
0
0.7
16925
0.9
1.1
f = 38 kHz, Ee = 2 mW/m²
0
1.3
f/f0 - Relative Frequency
20
40
60
80
100
120
Burst Length (Number of Cycles/Burst)
Fig. 5 - Frequency Dependence of Responsivity
Rev. 1.4, 26-Nov-15
TSOP772..W
0.4
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
3
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Ee min. - Threshold Irradiance (mW/m2)
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Vishay Semiconductors
0.8
0°
20°
30°
0.7
40°
0.6
0.5
50°
1.0
0.4
60°
0.9
70°
0.3
0.8
80°
0.2
-30
-10
10
30
50
70
90
0.6
Tamb - Ambient Temperature (°C)
1.0
0.9
Ee min. - Sensitivity (mW/m2)
1.0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
800
850
900
10°
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2.5
3.5
4.5
5.5
VS - Supply Voltage (V)
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
0°
0
0.8
0.0
1.5
950 1000 1050 1100 1150
λ- Wavelength (nm)
21425
0.2
Fig. 12 - Vertical Directivity
0.9
0
750
0.4
drel - Relative Transmission Distance
22194
Fig. 9 - Sensitivity vs. Ambient Temperature
S (λ) rel - Relative Spectral Sensitivity
10°
20°
Fig. 13 - Sensitivity vs. Supply Voltage
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.6
0.4
0.2
0
drel - Relative Transmission Distance
22193
Fig. 11 - Horizontal Directivity
Rev. 1.4, 26-Nov-15
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SUITABLE DATA FORMAT
IR Signal
This series is designed to suppress spurious output pulses
due to noise or disturbance signals. The devices can
distinguish data signals from noise due to differences in
frequency, burst length, and envelope duty cycle. The data
signal should be close to the device’s band-pass center
frequency (e.g. 38 kHz) and fulfill the conditions in the table
below.
When a data signal is applied to the product in the presence
of a disturbance, the sensitivity of the receiver is
automatically reduced by the AGC to insure that no spurious
pulses are present at the receiver’s output.
0
Some examples which are suppressed are:
5
• DC light (e.g. from tungsten bulbs sunlight)
10
15
20
Time (ms)
16920
Fig. 14 - IR Disturbance from Fluorescent Lamp
with Low Modulation
• Continuous signals at any frequency
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see fig. 14 or fig. 15)
IR Signal
• 2.4 GHz and 5 GHz Wi-Fi
0
16921
5
10
15
20
Time (ms)
Fig. 15 - IR Disturbance from Fluorescent Lamp
with High Modulation
TSOP772..W
TSOP774..W
Minimum burst length
10 cycles/burst
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 12 cycles
10 to 35 cycles
≥ 12 cycles
70 cycles
> 4 x burst length
35 cycles
> 10 x burst length
For bursts greater than
a minimum gap time in the data stream is needed of
Maximum number of continuous short bursts/second
800
1300
NEC code
Yes
Preferred
RC5/RC6 code
Yes
Preferred
Thomson 56 kHz code
Yes
Preferred
Sharp code
Yes
Preferred
Mild disturbance patterns
are suppressed (example:
signal pattern of fig. 14)
Complex and critical disturbance
patterns are suppressed (example:
signal pattern of fig. 15 or
highly dimmed LCDs)
Suppression of interference from fluorescent lamps
Notes
• For data formats with short bursts please see the datasheet of TSOP773..W and TSOP775..W
Rev. 1.4, 26-Nov-15
5
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
Center of
sensitive area
(3.25)
Mold residue
2.35
(1.8)
1.2 ± 0.2
3
0.8
Mold residue
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.05
Not indicated tolerances ± 0.15
(1.5)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
Pick and place area
1.8
1.27
Drawing-No.: 6.550-5300.01-4
Issue: 4; 13.09.11
0.8
22609
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.4, 26-Nov-15
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
3.6
0.3
TAPING VERSION TSOP..TR DIMENSIONS in millimeters
16
1.75
7.5
Ø 1.5
4
Direction of feed
8
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5342.01-4
Issue: 2; 12.06.13
Rev. 1.4, 26-Nov-15
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3
0.3
TAPING VERSION TSOP..TT DIMENSIONS in millimeters
16
1.75
7.5
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5341.01-4
Issue: 3; 06.10.15
Rev. 1.4, 26-Nov-15
8
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 ± 10 mm/min.
165° to 180° peel angle
Rev. 1.4, 26-Nov-15
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
Aluminum bag
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
LEVEL
CAUTION
15973
This bag contains
MOISTURE-SENSITIVE DEVICES
FINAL PACKINGFINAL PACKING
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
RECOMMENDED METHOD OF STORAGE
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
• Storage temperature 10 °C to 30 °C
22522
• Storage humidity ≤ 60 % RH max.
Rev. 1.4, 26-Nov-15
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
10
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ESD PRECAUTION
VISHAY SEMICONDUTORS STANDARD
BAR CODE LABELS
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (example)
22178
Rev. 1.4, 26-Nov-15
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000