TSOP75S.. Datasheet

TSOP75S..
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detector and preamplifier in one package
• Optimized for Sony and Cisco SA codes
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
4
3
• Capable of side or top view
2
1
• Two lenses for high sensitivity and wide
receiving angle
• Insensitive to supply voltage ripple and noise
20953
• Very narrow optical filter to minimize the interference from
3D synchronizing signals and other optical noise sources
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
Pinning:
DESCRIPTION
1, 4 = GND, 2 = VS, 3 = OUT
The TSOP75S.. series are two lens miniaturized receiver
modules for infrared remote control systems. One PIN diode
per lens and a preamplifier are assembled on a leadframe,
the epoxy lens cap is designed as an IR filter.
ORDERING CODE
Taping:
TSOP75...TT - top view taped
The demodulated output signal can be directly decoded by
a microprocessor. The TSOP75S.. is compatible with all
common IR remote control data formats for TVs, including
the Sony code. It is optimized to suppress almost all
spurious pulses from energy saving fluorescent lamps but
will also suppress some data signals.
TSOP75...TR - side view taped
This component has not been qualified according to
automotive specifications.
PARTS TABLE
AGC
SONY (AGC-S)
Carrier frequency
40 kHz
TSOP75S40 (1)
56 kHz
TSOP75S56 (2)
Package
Heimdall
Pinning
1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm)
6.8 W x 3.0 H x 3.2 D
Mounting
SMD
Application
TV
(1)
Best remote control code
Sony 12 bit, 15 bit, and 20 bit IR-codes
BLOCK DIAGRAM
(2)
Cisco SA code
APPLICATION CIRCUIT
17170_5
2
VS
3
Input
AGC
Band
pass
Demodulator
OUT
Control circuit
GND
+ VS
C1
µC
OUT
VO
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-1
Rev. 1.4, 13-Oct-15
VS
GND
1, 4
PIN
R1
IR receiver
Circuit
30 k Ω
Transmitter
with
TSALxxxx
1
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VS
-0.3 to +6.0
V
mA
Supply voltage
Supply current
IS
3
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Storage temperature range
Operating temperature range
Tamb ≤ 85 °C
Power consumption
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS
2.5
-
5.5
V
Ev = 0, VS = 3.3 V
ISD
0.27
0.35
0.45
mA
Supply voltage
Supply current
UNIT
Ev = 40 klx, sunlight
ISH
-
0.45
-
mA
Ev = 0, test signal see fig. 1,
IR diode TSAL6200,
IF = 200 mA
d
-
45
-
m
Output voltage low
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see fig. 1
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee min.
-
0.12
0.25
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee max.
30
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 50
-
deg
Transmission distance
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Ee
Optical Test Signal
1.0
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
Output Pulse Width
tpo - Output Pulse Width (ms)
0.9
t
tpi *
* tpi
VO
T
10/f0 is recommended for optimal function
Output Signal
1)
VOH
2)
16110
7/f0 < td < 15/f0
tpi - 5/f0 < tpo < tpi + 6/f0
0.8
Input Burst Length
0.7
0.6
0.5
0.4
0.3
λ = 950 nm,
Optical Test Signal, Fig.1
0.2
0.1
0
0.1
VOL
td
1)
tpo
2)
20752
t
Fig. 1 - Output Active Low
Rev. 1.4, 13-Oct-15
1
10
102
103
104
105
Ee - Irradiance (mW/m2)
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
2
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Ee min. - Threshold Irradiance (mW/m2)
Ee
Vishay Semiconductors
Optical Test Signal
600 µs
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VO
VOH
VOL
t off
t on
4
Correlation with Ambient Light Sources:
2
3.5 10 W/m = 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2 = 8.2 kLx (Daylight, T = 5900 K)
3
Wavelength of Ambient
Illumination: λ = 950 nm
2.5
2
1.5
1
0.5
0
0.01
t
20757
Ton, Toff - Output Pulse Width (ms)
0.8
Ton
0.7
0.6
0.5
Toff
0.4
0.3
0.2
λ = 950 nm,
Optical Test Signal, Fig. 3
0.1
0
0.1
1
10
100
1000
10 000
Ee - Irradiance (mW/m2)
20759
10
100
3.0
2.5
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
2.0
1.5
1.0
0.5
0
1
10
100
1000
ΔVS RMS - AC Voltage on DC Supply Voltage (mV)
Fig. 4 - Output Pulse Diagram
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
1.2
1.0
0.9
1.0
Max. Envelope Duty Cycle
Ee min./Ee - Relative Responsivity
1
Fig. 6 - Sensitivity in Bright Ambient
Ee min. - Threshold Irradiance (mW/m2)
Fig. 3 - Output Function
0.1
Ee - Ambient DC Irradiance (W/m2)
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.8
0.7
0.6
TSOP75S..
f = 38 kHz,
Ee = 2 mW/m²
0.5
0.4
0.3
0.2
0.1
0.0
0
0.7
16925
0.9
1.1
0
1.3
f/f0 - Relative Frequency
Fig. 5 - Frequency Dependence of Responsivity
Rev. 1.4, 13-Oct-15
25
50
75
100
125
150
Burst Length (number of cycles/burst)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
3
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Ee min. - Threshold Irradiance (mW/m2)
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Vishay Semiconductors
0°
0.30
20°
30°
0.25
40°
0.20
1.0
0.15
0.10
0.9
50°
0.8
60°
70°
0.05
80°
0
-30
-10
10
30
50
70
0.6
90
Tamb - Ambient Temperature (°C)
0.4
0.2
0
drel - Relative Transmission Distance
21428
Fig. 9 - Sensitivity vs. Ambient Temperature
Fig. 12 - Vertical Directivity
0.30
1.0
0.9
Ee min. - Sensitivity (mW/m2)
S (λ) rel - Relative Spectral Sensitivity
10°
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750
0.25
0.20
0.15
0.10
0.05
0.00
800
850
900
950 1000 1050 1100 1150
1
λ- Wavelength (nm)
21425
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
0°
10°
2
3
4
5
VS - Supply Voltage (V)
20°
Fig. 13 - Sensitivity vs. Supply Voltage
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.6
0.4
0.2
0
drel - Relative Transmission Distance
21427
Fig. 11 - Horizontal Directivity
Rev. 1.4, 13-Oct-15
4
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SUITABLE DATA FORMAT
IR Signal
The TSOP752S.. series is designed to suppress spurious
output pulses due to noise or disturbance signals. Data and
disturbance signals can be distinguished by the devices
according to carrier frequency, burst length and envelope
duty cycle. The data signal should be close to the
band-pass center frequency (e.g. 40 kHz) and fulfill the
conditions in the table below.
When a data signal is applied to the TSOP75S.. in the
presence of a disturbance signal, the sensitivity of the
receiver is reduced to insure that no spurious pulses are
present at the output. Some examples of disturbance
signals which are suppressed are:
0
• DC light (e.g. from tungsten bulb or sunlight)
5
10
15
20
Time (ms)
16920
• Continuous signals at any frequency
Fig. 14 - IR Disturbance from Fluorescent Lamp
with Low Modulation
IR Signal
• Strongly or weakly modulated noise from fluorescent
lamps with electronic ballasts (see fig. 14 or fig. 15)
0
16921
5
10
15
20
Time (ms)
Fig. 15 - IR Disturbance from Fluorescent Lamp
with High Modulation
TSOP75S..
Minimum burst length
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 10 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
70 cycles
> 10 x burst length
Maximum number of continuous short bursts/second
1800
Suppression of interference from fluorescent lamps
Most common disturbance patterns are suppressed
Note
• Best choice of AGC for some popular IR-codes:
- TSOP75S40: Sony 12 bit, 15 bit, and 20 bit IR-codes
- TSOP75S56: Cisco SA code
Rev. 1.4, 13-Oct-15
5
Document Number: 84211
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue
2.5
(1.8)
1.2 ± 0.2
3
0.8
2.2
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.2
Not indicated tolerances ± 0.15
(1.65)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
1.27
Pick and place area
1.8
(R1.3)
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
0.8
22608
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.4, 13-Oct-15
6
Document Number: 84211
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
0.3
3.6
TAPING VERSION TSOP..TR DIMENSIONS in millimeters
16
7.5
1.75
1.34 ref.
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
Rev. 1.4, 13-Oct-15
7
Document Number: 84211
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3.65
0.3
TAPING VERSION TSOP..TT DIMENSIONS in millimeters
16
1.75
7.5
Ø 1.5
4
8
Direction of feed
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
Rev. 1.4, 13-Oct-15
8
Document Number: 84211
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 ± 10 mm/min.
165° to 180° peel angle
Rev. 1.4, 13-Oct-15
9
Document Number: 84211
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Aluminum bag
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
15973
FINAL PACKING
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
RECOMMENDED METHOD OF STORAGE
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
• Storage temperature 10 °C to 30 °C
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
• Storage humidity ≤ 60 % RH max.
Rev. 1.4, 13-Oct-15
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
10
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VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22178
Rev. 1.4, 13-Oct-15
11
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
1
Document Number: 91000