Data Sheet

IP4264CZ8-20; IP4264CZ8-40
Integrated USIM/SIM card passive filter arrays with
ESD protection
Rev. 3 — 22 July 2010
Product data sheet
1. Product profile
1.1 General description
The IP4264CZ8-20 and IP4264CZ8-40 are 3-channel RC low-pass filter arrays which are
designed to provide filtering of undesired RF signals in the 800 MHz-to-6000 MHz
frequency band. In addition, the IP4264CZ8-20 and IP4264CZ8-40 incorporate diodes to
provide protection to downstream components from ElectroStatic Discharge (ESD)
voltages up to ±25 kV contact and higher than ±25 kV air discharge far exceeding
IEC 61000-4-2, level 4.
Both IP4264CZ8-20 and IP4264CZ8-40 support ESD protection of the USB data pins of
an Universal Subscriber Identity Module (USIM) interface as well as the digital standard
SIM interface ESD protection and ElectroMagnetic Interface (EMI) filtering.
The IP4264CZ8-20 and IP4264CZ8-40 are fabricated using monolithic silicon technology.
They integrate three resistors and seven high-level ESD protection diodes in a 0.4 mm
pitch 8-pin Micropak (compatible with Quad Flat-pack No-leads (QFN)) lead-free plastic
package with a height of only 0.5 mm.
These features make the IP4264CZ8-20 and IP4264CZ8-40 ideal for use in applications
requiring component miniaturization such as mobile phone handsets, cordless telephones
and personal digital devices.
The devices are also available in Wafer Level Chip-Size Package (WLCSP):
WLCSP11 (for USIM) with 0.4 mm pitch (IP4365CX11), and WLCSP8 (for SIM) with both
0.4 mm pitch (IP4364CX8/LF) and 0.5 mm pitch (IP4064CX8/LF).
1.2 Features and benefits
„ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
„ 3-channel SIM card interface with integrated RC-filter array and SIM voltage
ESD protection
„ 2 USIM (USB1.1) compliant ESD protection diodes with 20 pF channel capacitance
„ Integrated 100 Ω/100 Ω/47 Ω series channel resistors
„ Total channel capacitance of 20 pF (IP4264CZ8-20) or 40 pF (IP4264CZ8-40)
„ Downstream ESD protection up to ±25 kV (contact) according to IEC 61000-4-2
„ Micropak (QFN compatible) plastic package with 0.4 mm pitch
„ Also available in WLCSP11: IP4365CX11 (USIM interface) and
in WLCSP8: IP4364CX8/LF (0.4 mm pitch) and IP4064CX8/LF or IP4044CX8/LF
(both using 0.5 mm pitch, SIM interface)
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
1.3 Applications
„ USIM and SIM interfaces in e.g. cellular and Personal Communication System (PCS)
mobile handsets
2. Pinning information
Table 1.
Pinning
Pin
Description
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
ESD protection
GND
Simplified outline
ground
8
Graphic symbol
5
R1
1
8
100 Ω
R2
1
4
Transparent
top view
2
7
47 Ω
R3
3
6
100 Ω
4
5
018aaa015
3. Ordering information
Table 2.
Ordering information
Type number
IP4264CZ8-20
Package
Name
Description
Version
HXSON8U
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm
SOT983-1
IP4264CZ8-40
4. Marking
Table 3.
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
Marking codes
Type number
Marking code
IP4264CZ8-20
N2
IP4264CZ8-40
N4
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
2 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VI
input voltage
at I/O pins
−0.5
+5.5
V
VESD
electrostatic
discharge voltage
all pins to ground
IP4264CZ8-20
IP4264CZ8-40
contact discharge
[1]
-
±15
kV
air discharge
[1]
-
±15
kV
contact discharge
[2]
-
±25
kV
air discharge
[2]
-
±25
kV
contact discharge
-
±8
kV
air discharge
-
±15
kV
60
mW
IEC 61000-4-2, level 4;
all pins to ground
Pch
channel power
dissipation
Tamb = 70 °C
-
Ptot
total power dissipation Tamb = 70 °C
-
180
mW
Tstg
storage temperature
−55
+150
°C
-
260
°C
−35
+85
°C
tp ≤ 10 s
Treflow(peak) peak reflow
temperature
Tamb
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
ambient temperature
[1]
IP4264CZ8-20 is qualified to 1000 contact discharges of ±15 kV using the IEC 61000-4-2 model far
exceeding the specified IEC 61000-4-2, level 4 (8 kV contact discharge).
[2]
IP4264CZ8-40 is qualified to 1000 contact discharges of ±25 kV using the IEC 61000-4-2 model far
exceeding the specified IEC 61000-4-2, level 4 (8 kV contact discharge).
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
3 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
6. Characteristics
Table 5.
Channel resistance
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rs(ch)
channel series
resistance
R1, R3
75
100
125
Ω
R2
35.2
47
58.8
Ω
Table 6.
Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vbias(DC) = 0 V
-
17
20
pF
Vbias(DC) = 2.5 V
-
11
15
pF
Vbias(DC) = 0 V
-
35
40
pF
Vbias(DC) = 2.5 V
-
23
28
pF
Vbias(DC) = 0 V
12
16
20
pF
Vbias(DC) = 2.5 V
8
11
14
pF
IP4264CZ8-20
Cch
channel capacitance
f = 1 MHz
[1][2]
IP4264CZ8-40
Cch
channel capacitance
f = 1 MHz
[1][2]
IP4264CZ8-20; IP4264CZ8-40
Cd
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
diode capacitance
f = 1 MHz
[3]
IRM
reverse leakage
current
VI = 3 V
-
-
50
nA
VBR
breakdown voltage
Itest = 1 mA
6
-
10
V
[1]
Guaranteed by design.
[2]
Total line capacitance including diode capacitance, per channel.
[3]
Measured between pins 4 and 5.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
4 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
7. Application information
7.1 Insertion loss
The IP4264CZ8-20 and IP4264CZ8-40 are mainly designed as EMI/Radio Frequency
Interference (RFI) filters for SIM card interfaces. The setup for measuring the return loss
is shown in Figure 1.
The insertion loss in a 50 Ω system for all three channels of the IP4264CZ8-20 with a line
capacitance of ≤ 20 pF total channel capacitance is shown in Figure 2.
And the insertion loss for IP4264CZ8-40 with a line capacitance of ≤ 40 pF channel
capacitance is shown in Figure 3.
DUT
IN
50 Ω
OUT
50 Ω
TEST BOARD
Vgen
018aaa016
Fig 1.
Frequency response setup
018aaa017
0
018aaa018
0
S21
(dB)
S21
(dB)
(1)
(1)
−10
−10
−20
−20
(2)
−30
(2)
−30
(3)
(3)
−40
10−1
1
10
102
103
104
f (MHz)
−40
10−1
Cch = 20 pF
1
(1) Pin 2 to 7
(2) Pin 1 to 8
(2) Pin 1 to 8
(3) Pin 3 to 6
(3) Pin 3 to 6
Frequency response curves for IP4264CZ8-20
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
102
103
104
f (MHz)
Cch = 40 pF
(1) Pin 2 to 7
Fig 2.
10
Fig 3.
Frequency response curves for IP4264CZ8-40
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
5 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
7.2 Crosstalk
The setup for measuring crosstalk between channels in a 50 Ω system is shown in
Figure 4. The crosstalk for the IP4264CZ8-20 is shown in Figure 5 and Figure 6 for the
IP4264CZ8-40. Unused channels are terminated with a 50 Ω resistor to ground.
IN1
50 Ω
OUT2
DUT
IN2
50 Ω
OUT1
TEST BOARD
Vgen
50 Ω
50 Ω
018aaa019
Fig 4.
Crosstalk measurement setup
018aaa020
0
S21
(dB)
018aaa021
0
S21
(dB)
−20
−20
(1)
(1)
(2)
(3)
−40
−40
−60
−60
−80
−80
−100
10−1
1
10
102
103
104
f (MHz)
(2)
(3)
−100
10−1
Cch = 20 pF
1
(1) Pin 1 to 7
(2) Pin 2 to 6
(2) Pin 2 to 6
(3) Pin 3 to 8
(3) Pin 3 to 8
Crosstalk behavior for IP4264CZ8-20
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
102
103
104
f (MHz)
Cch = 40 pF
(1) Pin 1 to 7
Fig 5.
10
Fig 6.
Crosstalk behavior for IP4264CZ8-40
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
6 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
7.3 USIM interface application schematic
The application schematic diagram depicted in Figure 7 demonstrates how the
NXP SIM card EMI filter and ESD protection devices IP4264CZ8 are used in a typical
USIM interface application.
For example, in case a standard SIM interface without USB1.1 is used, the two single
diodes (pins 4 and 5) can protect the VSIM line.
Please note that this is only one example dependent on layout constraints e.g. channels
1 to 8 can be swapped with channels 3 to 6.
Also, the USB interface ESD protection pins 4 and 5 can be exchanged. Due to both sides
of the devices containing identical protection diodes, baseband and SIM card side can be
swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.).
VSIM
VSIM
protection
diode
RST
1
R3
8
VCC
GND
RST
SPU
CLK
I/O
100Ω
CLK
I/O
2
R2
7
47Ω
3
R1
6
AUX 1 AUX 2
100Ω
USB
D+
D−
SIM CARD
4
5
BASEBAND
CENTER GROUND PAD
018aaa022
Fig 7.
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
USIM application schematic for IP4264CZ8
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
7 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
8. Package outline
HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
SOT983-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
1/2 e
terminal 1
index area
v
w
b
e
1
L1
M
M
C
C A B
C
y
y1 C
4
L
Eh
8
5
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
1.75
1.65
1.5
1.3
1.4
1.3
0.5
0.3
0.4
1.2
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
Fig 8.
REFERENCES
OUTLINE
VERSION
IEC
SOT983-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-12
07-11-14
Package outline SOT983-1 (HXSON8U)
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
8 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4264CZ8-20_
IP4264CZ8-40 v.3
20100722
Product data sheet
-
IP4264CZ8-20_
IP4264CZ8-40_2
Modifications:
•
•
•
•
•
•
Section 1 “Product profile”: added USIM application
Table 1 “Pinning”: corrected graphic symbol
Table 6 “Channel characteristics”: added Cd maximum and minimum values
Figure 1, 2, 3, 4, 5 and 6: updated
Section 7.3 “USIM interface application schematic”. added
Section 10 “Legal information”: updated
IP4264CZ8-20_
IP4264CZ8-40_2
20090427
Product data sheet
-
IP4264CZ8-20_
IP4264CZ8-40_1
IP4264CZ8-20_
IP4264CZ8-40_1
20081106
Objective data sheet
-
-
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
9 of 12
IP4264CZ8-20; IP4264CZ8-40
NXP Semiconductors
Integrated USIM/SIM card passive filter arrays with ESD protection
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
10 of 12
NXP Semiconductors
IP4264CZ8-20; IP4264CZ8-40
Integrated USIM/SIM card passive filter arrays with ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4264CZ8-20_IP4264CZ8-40
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 July 2010
© NXP B.V. 2010. All rights reserved.
11 of 12
NXP Semiconductors
IP4264CZ8-20; IP4264CZ8-40
Integrated USIM/SIM card passive filter arrays with ESD protection
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
USIM interface application schematic. . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 22 July 2010
Document identifier: IP4264CZ8-20_IP4264CZ8-40