UGY1088 24 V Push-Pull line amplifier MMIC Rev. 2 — 12 July 2013 Product data sheet 1. Product profile 1.1 General description The UGY1088 MMIC is a device which covers all push-pull applications. Dependent on the application circuit, the gain can be set between 21 dB and 35 dB power gain with a flat power gain response and excellent input and output return loss over the 40 MHz to 1003 MHz frequency range. It is especially suited for CATV amplifiers. The UGY1088 is a highly linear, monolithic GaAs RF amplifier that has been developed to replace standard CATV hybrid amplifiers. Offered in a HVQFN32 surface mount package, the MMIC consists of 3 stages of balanced amplifiers that are optimized for exceptionally low distortion and noise figure. The flat power gain response and excellent input and output return loss over the 40 MHz to 1003 MHz CATV downstream band is formed when one UGY1088 is cascaded between transmission line baluns. The gain level is set by the external feedback circuit in the final MMIC application. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 1.2 Features and benefits 1 GHz specified performance Gain is typical 30 dB, by application, power gain can be set between 21 dB and 35 dB Very low distortion Excellent 75 input and output match Stable with high VSWR load conditions Monolithic design for consistent performance part-to-part Low DC power consumption Highly integrated for low additional part count Surface mount package compatible with automatic assembly Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications Up to 1003 MHz CATV push-pull amplifier for line extender, distribution and trunk amplifiers and optical nodes in hybrid TV infrastructure networks. UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 1.4 Quick reference data Table 1. Quick reference data Bandwidth 40 MHz to 1003 MHz; for a 29 dB application circuit; VB = 24 V (DC); ZS = ZL = 75 ; Tmb = 35 C; ICC = 265 mA; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gp power gain f = 1003 MHz [1] 28 29 30 dB NF noise figure f = 50 MHz [1] - 3.7 4.1 dB CTB composite triple beat Vo = 44 dBmV [1][2] - 65 62 dBc - 70 64 dBc - 58 - dBc 230 265 300 mA CSO composite second-order distortion Vo = 44 dBmV [1][2] Xmod cross modulation Vo = 44 dBmV [1][2] ICC supply current [1] Measured with baluns and transformers on the input and output of the device, see Figure 2. [2] 79 NTSC channels [f = 55.25 MHz to 547.35 MHz]; flat output level. 2. Pinning information 25 FET3A_GATE 26 FET2_BIAS 27 FET3A_SRC 28 FET2A_DRN 29 FET2A_IFR 30 FET2A_SRC terminal 1 index area 31 FET1A_DRN 32 FET2A_GATE 2.1 Pinning FET1A_IFR 1 24 n.c. n.c. 2 23 FET3_BIAS FET1A_GATE 3 22 FET4A_DRN FET1A_SRC 4 FET1B_SRC 5 FET1B_GATE 6 19 FET4B_DRN n.c. 7 18 FET4_BIAS FET1B_IFR 8 17 n.c. 21 n.c. FET3B_GATE 16 20 n.c. FET1_BIAS 15 FET3B_SRC 14 FET2B_DRN 13 FET2B_IFR 12 FET2B_SRC 11 9 FET2B_GATE FET1B_DRN 10 UGY1088 aaa-001977 Transparent top view Fig 1. UGY1088 Product data sheet Pin configuration for HVQFN32 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 2 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 2.2 Pin description Table 2. UGY1088 Product data sheet Pin description Symbol Pin Description FET1A_IFR 1 internal feedback resistor FET1a n.c. 2 not connected FET1A_GATE 3 gate FET1a FET1A_SRC 4 source FET1a FET1B_SRC 5 source FET1b FET1B_GATE 6 gate FET1b n.c. 7 not connected FET1B_IFR 8 internal feedback resistor FET1b FET2B_GATE 9 gate FET2b FET1B_DRN 10 drain FET1b FET2B_SRC 11 source FET2b FET2B_IFR 12 internal feedback resistor FET2b FET2B_DRN 13 drain FET2b FET3B_SRC 14 source FET3b FET1_BIAS 15 bias FET1 FET3B_GATE 16 gate FET3b n.c. 17 not connected FET4_BIAS 18 bias FET4 FET4B_DRN 19 drain FET4b n.c. 20 not connected n.c. 21 not connected FET4A_DRN 22 drain FET4a FET3_BIAS 23 bias FET3 n.c. 24 not connected FET3A_GATE 25 gate FET3a FET2_BIAS 26 bias FET2 FET3A_SRC 27 source FET3a FET2A_DRN 28 drain FET2a FET2A_IFR 29 internal feedback resistor FET2a FET2A_SRC 30 source FET2a FET1A_DRN 31 drain FET1a FET2A_GATE 32 gate FET2a - die pad ground All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 3 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 3. Ordering information Table 3. Ordering information Type number Package Name UGY1088 Description Version HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 5 0.85 mm. SOT617-3 4. Marking Table 4. Marking codes Type number Marking code UGY1088 Y888C 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit - 30 V - 75 dBmV VB supply voltage Vi(RF) RF input voltage Tstg storage temperature 40 +150 C Tcase case temperature 20 +125 C ICC supply current - 300 mA VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E - 300 V Charged Device Model (CDM); According to JEDEC standard 22-C101B - 400 V single tone 6. Thermal characteristics Table 6. UGY1088 Product data sheet Thermal characteristics Symbol Parameter Rth(j-c) thermal resistance from junction to case Conditions All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 Typ Unit 3.5 K/W © NXP B.V. 2013. All rights reserved. 4 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 7. Characteristics Table 7. Characteristics Bandwidth 40 MHz to 1003 MHz; for a 29 dB application circuit; VB = 24 V (DC); ZS = ZL = 75 ; Tmb = 35 C; ICC = 265 mA; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gp power gain f = 1003 MHz [1] 28 29 30 dB SLsl slope straight line f = 45 MHz to 1003 MHz [1] 1.3 1.6 2.0 dB FL flatness of frequency response f = 1003 MHz [1] - 0.8 1.0 dB f = 50 MHz [1] - 3.7 4.1 dB f = 1003 MHz [1] - 4.5 5.0 dB f = 45 MHz to 200 MHz [1] 18 - - dB f = 200 MHz to 550 MHz [1] 19 - - dB f = 550 MHz to 870 MHz [1] 19 - - dB f = 870 MHz to 914 MHz [1] 19 - - dB f = 914 MHz to 1003 MHz [1] 15 - - dB f = 45 MHz to 200 MHz [1] 19 - - dB f = 200 MHz to 550 MHz [1] 19 - - dB f = 550 MHz to 870 MHz [1] 19 - - dB f = 870 MHz to 914 MHz [1] 19 - - dB f = 914 MHz to 1003 MHz [1] 18 - - dB [4] 230 265 300 mA NF noise figure RLin RLout input return loss output return loss supply current ICC 79 NTSC channels CTB CSO Xmod composite triple beat composite second-order distortion cross modulation Vo = 44 dBmV [1][2] - 65 62 dBc Vo = 44 dBmV [1][2] - 70 64 dBc Vo = 44 dBmV [1][2] - 58 - dB Vo = 44 dBmV [1][3] - 62 - dBc Vo = 44 dBmV [1][3] - 64 - dBc Vo = 44 dBmV [1][3] - 58 - dB Vo = 44 dBmV [1][3] - 63 - dBc 79 NTSC channels + 75 digital channels CTB CSO Xmod CCN composite triple beat composite second-order distortion cross modulation carrier-to-composite noise [1] Measured with baluns and transformers on the input and output of the device, see Figure 2. [2] 79 NTSC channels [f = 55.25 MHz to 547.35 MHz]; flat output level. [3] 79 NTSC channels [f = 55.25 MHz to 547.35 MHz] + 75 digital channels [f = 547.25 MHz to 1003 MHz] (6 dB offset); flat output level. [4] The supply current may be reduced by decreasing the value of R14 (see Figure 2). All specifications are measured on evaluation board rev 1.0 (see Figure 2). UGY1088 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 5 of 12 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 15 Ω R5 56 Ω R9 L4 33 Ω C4 1 nF 32 C10 10 nF 31 R7 L8 180 Ω 5.6 nH 30 C6 10 nF L6 29 dB push-pull amplifier 28 27 25 1 R3 680 Ω L2 18 nH T2 3 Rev. 2 — 12 July 2013 All information provided in this document is subject to legal disclaimers. T1 D1 C2 10 nF 22 C3 10 nF C11 0.82 pF C8 10 nF NXP Y888C X1 NXP Semiconductors 8. Application information UGY1088 Product data sheet 24 VDC supply R11 BFM520 D2 6 R4 680 Ω R2 10 Ω R1 22 Ω 19 L3 18 nH 18 8 9 10 11 13 R8 C5 1 nF C1 10 nF R6 56 Ω 180 Ω 14 15 16 L9 5.6 nH C7 10 nF L7 L10 1.5 nH R10 L5 C13 10 nF 33 Ω R12 CV2 0.1 pF to 1.0 pF 15 Ω R14 500 Ω See Table 8 for the list of components. Fig 2. Application circuit C9 10 nF output 75 aaa-001976 UGY1088 6 of 12 © NXP B.V. 2013. All rights reserved. input 75 C12 10 nF 24 V Push-Pull line amplifier MMIC L1 10 nH CV1 0.1 pF to 1.0 pF T3 R13 10 kΩ UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC Table 8. List of components See Figure 2 for component layout. Component UGY1088 Product data sheet Description Value C1, C2, C3, C6, capacitor C7, C8, C9, C10, C12, C13 10 nF C4, C5 1 nF capacitor C11 capacitor 0.82 pF CV1, CV2 preset capacitor 0.1 pF to 1.0 pF D1, D2 high-speed switching diode - L1 inductor 10 nH L2, L3 inductor 18 nH L4, L5, L6, L7 ferrite bead - L8, L9 inductor 5.6 nH L10 inductor 1.5 nH R1 NTC thermistor 22 R2 resistor 10 R3, R4 resistor 680 R5, R6 resistor 56 R7, R8 resistor 180 R9, R10 resistor 33 R11, R12 resistor 15 R13 resistor 10 k Remarks BAS516 (NXP) BLM15HD182SN1D (Murata) R14 preset resistor 500 T1, T3 balun transformer - 617DB-1655 (TOKO) or balun of the same quality T2 center transformer - 617PS-A0369=P3 (TOKO) or Gemphil A0369 X1 dual NPN wideband transistor - All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 BFM520 (NXP) © NXP B.V. 2013. All rights reserved. 7 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 9. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm D B SOT617-3 A terminal 1 index area A A1 E detail X C e1 e 9 16 y1 C C A B C v w 1/2 e b y L 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area 32 25 X Dh 0 2.5 Dimensions Unit(1) mm 5 mm scale A(1) A1 b max 0.05 0.30 nom 0.85 min 0.00 0.18 c D(1) Dh E(1) Eh 5.1 3.75 5.1 3.75 0.2 4.9 3.45 4.9 e e1 e2 0.5 3.5 3.5 L v w y y1 0.5 0.1 0.05 0.05 0.1 0.3 3.45 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version References IEC SOT617-3 Fig 3. JEDEC JEITA sot617-3_po European projection Issue date 11-06-14 11-06-21 MO-220 Package outline SOT617-3 UGY1088 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 8 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 10. Abbreviations Table 9. Abbreviations Acronym Description CATV Community Antenna TeleVision GaAs Gallium-Arsenide MMIC Monolithic Microwave Integrated Circuit NPN Negative-Positive-Negative NTSC National Television Standard Committee NTC Negative Temperature Coefficient VSWR Voltage Standing Wave Ratio 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes UGY1088 v.2 20130712 Product data sheet - UGY1088 v.1 Modifications UGY1088 v.1 UGY1088 Product data sheet • • • • • Table 1 on page 2: Tcase has been changed to Tmb Table 5 on page 4: The maximum value of Tcase has been changed Table 7 on page 5: Tcase has been changed to Tmb Figure 3 on page 8: Drawing has been updated Section 12.3 on page 10: Disclaimer “Translations” has been added 20120126 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 - © NXP B.V. 2013. All rights reserved. 9 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. UGY1088 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 10 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UGY1088 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 11 of 12 UGY1088 NXP Semiconductors 24 V Push-Pull line amplifier MMIC 14. Contents 1 1.1 1.2 1.3 1.4 2 2.1 2.2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 July 2013 Document identifier: UGY1088