BCR Datasheet

BCR
www.vishay.com
Vishay Electro-Films
Thin Film, Back-Contact Resistor
FEATURES
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Product may not be to scale
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips
available.
The BCR requires only one wire bond thus saving hybrid
space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
Wire bondable
Only one wire bond required
Small size: 0.020 inches square
Resistance range: 10  to 1 M
Oxidized silicon substrate for good power
dissipation
Resistor material: Tantalum nitride, self-passivating
Moisture resistant
Case size: 0202
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid
packages where space is limited. The bottom connection is
made by attaching the back of the chip to the substrate
either eutectically or with conductive epoxy. The single wire
bond is made to the notched pad on the top of the chip. (The
other rectangular pad on the top of the chip is a via hole, a
low-ohmic contact connecting the resistor to the bottom of
the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
VALUE
Standard Tolerances
UNIT
10 to 1M

± 0.1, ± 0.2, ± 0.5, ± 1, ± 2, ± 5
%
± 25, ± 50, ± 100, ± 250
ppm/°C
Total Resistance Range
TCR
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
10 Ω
20 Ω 50 Ω
100 Ω 200 Ω 1 kΩ
360 kΩ
1 MΩ
200 kΩ
620 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
100  to 250 k
< 100  or > 251 k
- 35 typ.
- 20 typ.
dB
Moisture resistance, MIL-STD-202, Method 106
± 0.5 max. R/R
%
Stability, 1000 h, + 125 °C, 125 mW
± 1.0 max. R/R
%
Operating Temperature Range
- 55 to + 125
°C
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
± 0.25 max. R/R
%
High Temperature Exposure, + 150 °C, 100 h
± 0.5 max. R/R
%
Dielectric Voltage Breakdown
200
V
Insulation Resistance
1012 min.

Operating Voltage
75 max.
V
0.250
W
± 0.25 max. R/R
%
DC Power Rating at + 70 °C (Derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 25-Feb-13
Document Number: 61023
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BCR
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.020
0.020
TYPICAL RANGE
10 Ω to 29 Ω
TYPICAL RANGE
30 Ω to 81 Ω
TYPICAL RANGE
82 Ω to 819 Ω
0.016
TYPICAL RANGE
820 Ω to 1 MΩ
Note
• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection.
SCHEMATIC
Bond Pad
Back of Chip
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.020" x 0.020" ± 0.002" (0.50 mm x 0.50 mm ± 0.05 mm)
Chip Thickness
0.010" ± 0.003" (0.253 mm ± 0.05 mm)
Chip Substrate Material
Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad Size
0.004" x 0.004" (0.100 mm x 0.100 mm)
Number of Pads
1
Pad Material
10 kÅ minimum aluminum (15 kÅ minimum gold optional)
Backing
3 kÅ minimum gold
Recommended Attachment Method
Eutectic or conductive epoxy
GLOBAL PART NUMBER INFORMATION
Global Part Number: BCR50000FKAHWS
Global Part Number Description: BCR 5K 1 %, 100 ppm/°C, Al term., Class H, WS
B
C
R
MODEL
RESISTANCE
BCR
20 x 20 size
back contact
resitor
First 4 digits are
significant figures
of resistance
5
0
0
0
0
RESISTANCE
MULTILPLIER
CODE
TOLERANCE
CODE
TCR
(ppm/°C)
B = 0.01
A = 0.1
0=1
1 = 10
2 = 100
3 = 1000
B = 0.1 %
C = 0.25 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
J = 5.0 %
K = 10 %
E = ± 25
C = ± 50
K = ± 100
M = ± 250
R = 0/- 250
F
K
A
H
W
VISUAL CLASS
TERMINATION (per MIL-STD-883,
Method 2032
G = Gold
A = Aluminum
H = Class H
K = Class K
S
PACKAGING
WS = Waffle pack
100 min./mult.
Historical Part Number: WBCR02750000F (will continue to be accepted)
Revision: 25-Feb-13
Document Number: 61023
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay
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Revision: 02-Oct-12
1
Document Number: 91000