High Performance 1A Linear Regulator with Programmable Current Limiting ISL80101A Features The ISL80101A is a low dropout voltage, single output LDO with programmable current limiting. This LDO operates from input voltages of 2.2V to 6V, and is capable of providing output voltages of 0.8V to 5V. Other custom voltage options are available upon request. • ±2% VADJ Accuracy Guaranteed Over Line, Load and TJ = -40°C to +125°C • Very Low 212mV Dropout Voltage at VIN = 4.5V • High Accuracy Current Limit Programmable up to 1.75A • Very Fast Transient Response A sub-micron BiCMOS process is utilized for this product family to deliver the best in class analog performance and overall value. The programmable current limiting improves system reliability of end applications. An external capacitor on the soft-start pin provides an adjustable soft-starting ramp. The ENABLE feature allows the part to be placed into a low quiescent current shutdown mode. • 100µVRMS Output Noise • Power-Good Output • Programmable Soft-Start • Over-Temperature Protection • Small 10 Ld DFN Package This CMOS LDO will consume significantly lower quiescent current as a function of load compared to bipolar LDOs, which translates into higher efficiency and packages with smaller footprints. Quiescent current is modestly compromised to achieve a very fast load transient response. Applications • Telecommunications and Networking • Medical Equipment • Instrumentation Systems Table 1 shows the differences between the ISL80101A and others in its family: • USB Devices • Gaming TABLE 1. KEY DIFFERENCES BETWEEN FAMILY OF PARTS ISL80101 1.75A No ISL80101A 1.62A Yes ISL80121-5 0.75A Yes 5.0V ± 5% 10 10µF CIN RSET VIN VOUT 9 V IN VOUT 8 10k R1 ADJ ISET 1 3.3V 2 10µF COUT 100pF CPB 6 0.01µF CSS ENABLE PG 2.61k R3 3 100k 0.464k R2 ISL80101A 7 • Routers and Switchers PROGRAMMABLE ISET 4 1.5 CURRENT LIMIT (A) ILIMIT (DEFAULT) PART NUMBER VIN = 4.5V 1.2 0.9 VIN = 5.5V 0.6 VIN = 5.0V 0.3 SS GND 5 0.0 10 100 1000 RSET (kΩ) 2.9x ( 2xV IN – 1 ) I LIMIT = 1.62 – -------------------------------------------------------R ( kΩ ) SET FIGURE 1. TYPICAL APPLICATION February 24, 2011 FN7712.2 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2010, 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL80101A Block Diagram SS THERMAL SHUTDOWN VIN CURRENT LIMITER VOUT ISET PG VOLTAGE REFERENCE POWER GOOD ADJ ADJUSTABLE VOLTAGE VERSION SENSE FIXED VOLTAGE VERSION ENABLE GND Ordering Information PART NUMBER (Notes 1, 2) ISL80101AIRAJZ PART MARKING DZAC VOUT VOLTAGE (Note 3) TEMP. RANGE (°C) ADJ -40 to +125 PACKAGE (Pb-Free) 10 Ld 3x3 DFN PKG DWG. # L10.3x3 NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. The 1.5V, 3.3V and 5V fixed output voltages will be released in the future. Please contact Intersil Marketing for more details. 2 FN7712.2 February 24, 2011 ISL80101A Pin Configurations ISL80101A (10 LD 3X3 DFN) TOP VIEW VOUT 1 10 VIN VOUT 2 ADJ 3 9 VIN PAD PG 4 GND 5 8 ISET 7 ENABLE 6 SS Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 1, 2 VOUT Output voltage. A minimum 10uF X5R/X7R output capacitor is required for stability. See “External Capacitor Requirements” on page 8 for more details. 3 ADJ LDO output feedback input. To adjust the output voltage, connect this pin to a resistive voltage divider from the VOUT to GND. 4 PG VOUT in regulation signal. Logic low indicates VOUT is not in regulation, and must be grounded if not used. 5 GND 6 SS 7 ENABLE 8 ISET Current limit setting. Current limit is 1.62A when this pin is left floating. This default value can be increased by tying RSET to GND, or decreased by tying RSET to VIN. See “Programmable Current Limit” on page 7 for more details. 9, 10 VIN Input supply. A minimum of 10µF X5R/X7R input capacitor is required for stability. See “External Capacitor Requirements” on page 8 for more details. - EPAD Ground. External capacitor adjusts in-rush current. VIN-independent chip enable. TTL and CMOS compatible. EPAD at ground potential. Soldering it directly to GND plane is required for thermal considerations. See “Power Dissipation and Thermals” on page 9 for more details. 3 FN7712.2 February 24, 2011 ISL80101A Absolute Maximum Ratings (Note 6) Thermal Information VIN Relative to GND.................................................................... -0.3V to +6.5V VOUT Relative to GND ................................................................ -0.3V to +6.5V PG, ENABLE, SENSE, SS, ISET Relative to GND ...................................................................... -0.3V to +6.5V ESD Rating Human Body Model (Tested per JEDEC)............................................. 2.5kV Machine Model (Tested per JEDEC) ..................................................... 250V Latch Up (Tested per JEDEC)..........................................±100mA @ +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld 3x3 DFN Package (Notes 4, 5). . . . . 48 7 Maximum Junction Temperature (Plastic Package).........................+150°C Storage Temperature Range ............................................... -65°C to +150°C Pb-Free Reflow Profile................................................................see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions (Note 7) Junction Temperature Range (TJ) ...................................... -40°C to +125°C VIN Relative to GND ...........................................................................2.2V to 6V VOUT Range....................................................................................800mV to 5V PG, ENABLE, SENSE, SS, ISET Relative to GND................................. 0V to 6V PG Sink Current......................................................................................... 10mA CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 6. Absolute maximum voltage rating is defined as the voltage applied for a lifetime average duty cycle above 6V of 1% 7. Electromigration specification defined as lifetime average junction temperature of +110°C where max rated DC current = lifetime average current. Electrical Specifications Unless otherwise noted, all parameters are established over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 3.3V, CIN = COUT = 10µF, TJ = +25°C, ILOAD = 0A Applications must follow thermal guidelines of the package to determine worst case junction temperature. Please refer to “Functional Description” on page 7 and Tech Brief TB379. Boldface limits apply over the operating temperature range, -40°C to +125°C. Pulse load techniques used by ATE to ensure TJ = TA defines established limits. PARAMETER SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS 490 500 510 mV 0.2 1 DC CHARACTERISTICS DC ADJ Pin Voltage Accuracy VADJ ΔVOUT/ΔVIN DC Input Line Regulation ΔVOUT DC Output Load Regulation VOUT + 0.4V < VIN < 6V; 0A < ILOAD < 1A VOUT + 0.4V < VIN < 6.0V, VOUT = 5.0V 0A < ILOAD < 1A -1 VADJ = 0.5V Feedback Input Current Ground Pin Current IQ ILOAD = 0A, 2.2V < VIN <6V ILOAD = 1A, 2.2V < VIN <6V Ground Pin Current in Shutdown ISHDN Dropout Voltage (Note 9) VDO Output Current Limit ILIMIT % % 0.01 1 µA 3 5 mA 5 7 mA ENABLE = 0.2V, VIN = 6V 0.2 12 µA ILOAD = 1A, VIN = 4.5V, VSENSE = 0V 90 212 mV VOUT = 2V, 4.5V < VIN < 5.5V, ISET is floating VOUT = 2V, VIN = 5.0V, RSET = 25.5kΩ 1.62 0.540 0.640 A 0.740 A Thermal Shutdown Temperature TSD VOUT + 0.4V < VIN < 6V 160 °C Thermal Shutdown Hysteresis (Rising Threshold) TSDn VOUT + 0.4V < VIN < 6V 30 °C PSRR f = 1kHz, ILOAD = 1A; VIN = 5.0V 48 dB f = 120Hz, ILOAD = 1A; VIN = 5.0V 48 dB ILOAD = 10mA, BW = 300Hz < f < 300kHz 100 µVRMS AC CHARACTERISTICS Input Supply Ripple Rejection Output Noise Voltage ENABLE PIN CHARACTERISTICS Turn-on Threshold VEN(HIGH) 4 2.2V < VIN < 6V 0.3 0.8 1.0 V FN7712.2 February 24, 2011 ISL80101A Electrical Specifications Unless otherwise noted, all parameters are established over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 3.3V, CIN = COUT = 10µF, TJ = +25°C, ILOAD = 0A Applications must follow thermal guidelines of the package to determine worst case junction temperature. Please refer to “Functional Description” on page 7 and Tech Brief TB379. Boldface limits apply over the operating temperature range, -40°C to +125°C. Pulse load techniques used by ATE to ensure TJ = TA defines established limits. (Continued) PARAMETER SYMBOL Hysteresis (Rising Threshold) VEN(HYS) ENABLE Pin Turn-on Delay tEN TEST CONDITIONS 2.2V < VIN < 6V MIN (Note 8) TYP MAX (Note 8) UNITS 10 80 200 mV COUT = 10µF, ILOAD = 1A 80 VIN = 6V, ENABLE = 3V ENABLE Pin Leakage Current µs 1 µA SOFT START CHARACTERISTICS Reset Pull-Down Current IPD Soft Start Charge Current ICHG VIN = 5.4V, ENABLE = 0V, SS = 1V 0.5 1 1.3 mA -3.3 -2 -0.8 µA 75 84 92 %VOUT 47 100 mV 0.05 1 µA PG PIN CHARACTERISTICS VOUT PG Flag Threshold VOUT PG Flag Hysteresis 4 PG Flag Low Voltage ISINK = 500µA PG Flag Leakage Current VIN = 6V, PG = 6V % NOTES: 8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 9. Dropout is defined by the difference in supply VIN and VOUT when the output is below its nominal regulation. 5 FN7712.2 February 24, 2011 ISL80101A Typical Operating Performance Unless otherwise noted: VIN = 5V, VOUT = 3.3V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. 150 0.505 +125°C 120 0.504 0.503 +25°C 90 0.501 VADJ (V) DROPOUT (mV) 0.502 60 0.500 0.499 0.498 30 0.497 -40°C 0 0 0.2 0.4 0.6 0.496 0.8 0.495 -40 1.0 -20 0 20 LOAD CURRENT (A) 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2. DROPOUT vs LOAD FIGURE 3. VADJ vs TEMPERATURE 1.8 2.0 1.8 1.2 1.4 0.6 1.2 ΔVOUT (%) OUTPUT VOLTAGE (V) 1.6 +125°C 1.0 0.8 -40°C +25°C +25°C 0 -0.6 0.6 0.4 -40°C +125°C -1.2 0.2 0 0 1 3 2 5 4 6 -1.8 0 0.25 SUPPLY VOLTAGE (V) FIGURE 4. OUTPUT VOLTAGE vs SUPPLY VOLTAGE 0.50 OUTPUT CURRENT (A) 0.75 1.00 FIGURE 5. OUTPUT VOLTAGE vs OUTPUT CURRENT 3.5 5 GROUND CURRENT (mA) GROUND CURRENT (mA) 3.0 2.5 2.0 1.5 +25°C +125°C -40°C 1.0 3 2 1 0.5 0 4 0 0.2 0.4 0.6 0.8 LOAD CURRENT (A) FIGURE 6. GROUND CURRENT vs LOAD CURRENT 6 1.0 0 2 3 4 5 6 INPUT VOLTAGE (V) FIGURE 7. GROUND CURRENT vs SUPPLY VOLTAGE FN7712.2 February 24, 2011 ISL80101A Typical Operating Performance Unless otherwise noted: VIN = 5V, VOUT = 3.3V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. (Continued) 1.8 1.6 ENABLE (5V/DIV) CURRENT LIMIT (A) 1.4 SS (1V/DIV) VOUT (2V/DIV) 1.2 1.0 RSET = OPEN 0.8 0.6 0.4 0.2 PG (2V/DIV) RSET = 25.5kΩ 0 -40 TIME (5ms/DIV) FIGURE 8. ENABLE START-UP 10 60 TEMPERATURE (°C) 110 FIGURE 9. CURRENT LIMIT vs TEMPERATURE 90 80 100mA 70 0mA VOUT AT 50mV/DIV PSRR (dB) 60 50 40 30 20 IOUT = 1A 10 0 100 IOUT = 10mA 1000mA 1k TIME (20µs/div) FIGURE 10. LOAD TRANSIENT RESPONSE Functional Description Input Voltage Requirements ISL80101A is capable of delivering output voltages from 0.8V to 5.0V. Due to the nature of an LDO, VIN must be some margin higher than VOUT plus dropout at the maximum rated current of the application if active filtering (PSRR) is expected from VIN to VOUT. The generous dropout specification of this family of LDOs allows applications to design for a level of efficiency that can accommodate profiles smaller than the TO220/263. Programmable Current Limit The ISL80101A protects against overcurrent due to short-circuit and overload conditions applied to the output. When this happens, the LDO performs as a constant current source. If the short-circuit or overload condition is removed, the output returns to normal voltage regulation operation. 500mA 10k FREQUENCY (Hz) 100k 1M FIGURE 11. PSRR vs FREQUENCY This limit can be increased by tying a resistor RSET from the ISET pin to ground. The current limit is determined by RSET as shown in Equation 1. Do not short this pin to ground. Increasing the current limit past 1.75A may cause damage to the part and is highly discouraged. 2.9 I LIMIT = 1.62 + -------------------------R SET ( kΩ ) (EQ. 1) The current limit can be decreased from the 1.62A default by tying RSET from the ISET pin to VIN. The current limit is then determined by both RSET and VIN following Equation 2. 2.9 × ( 2 × V IN – 1 ) I LIMIT = 1.62 – ----------------------------------------------R SET ( kΩ ) (EQ. 2) Figure 12 shows the relationship between RSET and the current limit when RSET is tied from the ISET pin to VIN for various VIN values. The current limit is set at 1.62A by default when the ISET pin is left floating. 7 FN7712.2 February 24, 2011 ISL80101A Output Voltage Selection . CURRENT LIMIT (A) 1.5 An external resistor divider is used to scale the output voltage relative to the internal reference voltage. This voltage is then fed back to the error amplifier. The output voltage can be programmed to any level between 0.8V and 5V. An external resistor divider, R2 and R3, is used to set the output voltage as shown in Equations 5 and 6. Please see Table 2 on page 9 for recommended values of R2 and R3. VIN = 4.5V 1.2 0.9 VIN = 5.5V 0.6 (EQ. 5) 0.3 ⎛ R3 ⎞ V OUT = 0.5V × ⎜ ------- + 1⎟ R ⎝ 2 ⎠ 0.0 10 V OUT R 3 = R 2 × ⎛ ------------- – 1⎞ ⎝ 0.5V ⎠ (EQ. 6) VIN = 5.0V 100 RSET (kΩ) 1000 FIGURE 12. CURRENT LIMIT vs RSET AT DIFFERENT VIN Enable Operation The ENABLE turn-on threshold is typically 800mV with 80mV of hysteresis. An internal pull-up or pull-down resistor to change these values is available upon request. As a result, this pin must not be left floating, and should be tied to VIN if not used. A 1kΩ to 10kΩ pull-up resistor is required for applications that use open collector or open drain outputs to control the ENABLE pin. The ENABLE pin may be connected directly to VIN for applications with outputs that are always on. Power-Good Operation PG is a logic output that indicates the status of VOUT, current limit tripping, and VIN. The PG flag is an open-drain NMOS that can sink up to 10mA during a fault condition. The PG pin requires an external pull-up resistor typically connected to the VOUT pin. The PG pin should not be pulled up to a voltage source greater than VIN. PG goes low when the output voltage drops below 84% of the nominal output voltage, the current limit faults, or the input voltage is too low. PG functions during shutdown, but not during thermal shutdown. For applications not using this feature, connect this pin to ground. Soft-Start Operation The soft-start circuit controls the rate at which the output voltage rises up to regulation at power-up or LDO enable. This start-up ramp time can be set by adding an external capacitor from the SS pin to ground. An internal 2µA current source charges up this CSS and the feedback reference voltage is clamped to the voltage across it. The start-up time is set by Equation 3. ( C SS x0.5 ) T start = --------------------------2μA (EQ. 3) Equation 4 determines the CSS required for a specific start-up in-rush current, where VOUT is the output voltage, COUT is the total capacitance on the output and IINRUSH is the desired in-rush current. ( V OUT xC OUT x2μA ) ) C SS = ----------------------------------------------------I INRUSH x0.5V (EQ. 4) The external capacitor is always discharged to ground at the beginning of start-up or enabling. 8 External Capacitor Requirements External capacitors are required for proper operation. Careful attention must be paid to the layout guidelines and selection of capacitor type and value to ensure optimal performance. OUTPUT CAPACITOR The ISL80101A applies state-of-the-art internal compensation to keep the selection of the output capacitor simple for the customer. Stable operation over full temperature, VIN range, VOUT range and load extremes are guaranteed for all capacitor types and values assuming a minimum of 10µF X5R/X7R is used for local bypass on VOUT. This output capacitor must be connected to the VOUT and GND pins of the LDO with PCB traces no longer than 0.5cm. There is a growing trend to use very-low ESR multilayer ceramic capacitors (MLCC) because they can support fast load transients and also bypass very high frequency noise from other sources. However, the effective capacitance of MLCCs drops with applied voltage, age, and temperature. X7R and X5R dielectric ceramic capacitors are strongly recommended as they typically maintain a capacitance range within ±20% of nominal voltage over full operating ratings of temperature and voltage. Additional capacitors of any value in ceramic, POSCAP, alum/tantalum electrolytic types may be placed in parallel to improve PSRR at higher frequencies and/or load transient AC output voltage tolerances. Phase Boost Capacitor A small phase boost capacitor, CPB, can be placed across the top resistor, R3, in the feedback resistor divider network in order to place a zero at: 1 F z = -------------------------------2πxR 3 xC PB (EQ. 7) This zero increases the crossover frequency of the LDO and provides additional phase resulting in faster load transient response. It is also important to note that the LDO stability and load transient are affected by the type of output capacitor used. For optimal result, empirical tuning is suggested for each specific application. FN7712.2 February 24, 2011 ISL80101A Table 2 shows the recommended CPB, R3 and R2 for different output voltage and ceramic COUT. 46 44 VOUT (V) R3 (kΩ) R2 (kΩ) COUT (µF) CPB (pF) 5.0 2.61 0.287 10 100 3.3 2.61 0.464 10 100 2.5 2.61 0.649 10 82 1.8 2.61 1.0 10 82 1.5 2.61 1.3 10 68 1.5 2.61 1.3 22 150 1.2 2.61 1.87 22 120 1.2 2.61 1.87 47 270 1.0 2.61 2.61 47 220 0.8 2.61 4.32 47 220 INPUT CAPACITOR For proper operation, a minimum capacitance of 10µF X5R/X7R is required at the input. This ceramic input capacitor must be connected to the VIN and GND pins of the LDO with PCB traces no longer than 0.5cm. Power Dissipation and Thermals The junction temperature must not exceed the range specified in the “Recommended Operating Conditions (Note 7)” on page 4. The power dissipation can be calculated by using Equation 8: P D = ( V IN – V OUT ) × I OUT + V IN × I GND (EQ. 8) θJA, C/W TABLE 2. RECOMMENDED CPB FOR DIFFERENT VOUT AND COUT 42 40 38 36 34 2 4 6 8 10 12 14 16 18 20 2 22 24 EPAD-MOUNT COPPER LAND AREA ON PCB, mm FIGURE 13. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB WITH THERMAL VIAS θJA vs EPAD-MOUNT COPPER LAND AREA ON PCB Thermal Fault Protection The power level and the thermal impedance of the package (+48°C/W for DFN) determine when the junction temperature exceeds the thermal shutdown temperature. In the event that the die temperature exceeds around +160°C, the output of the LDO will shut down until the die temperature cools down to about +130°C. General PowerPAD Design Considerations Figure 14 shows the recommended use of vias on the thermal pad to remove heat from the IC. This typical array populates the thermal pad footprint with vias spaced three times the radius distance from the center of each via. Small via size is advisable, but not to the extent that solder reflow becomes difficult. All vias should be connected to the pad potential, with low thermal resistance for efficient heat transfer. Complete connection of the plated-through hole to each plane is important. It is not recommended to use “thermal relief” patterns to connect the vias. The maximum allowable junction temperature, TJ(MAX) and the maximum expected ambient temperature, TA(MAX) determine the maximum allowable power dissipation, as shown in Equation 9: (EQ. 9) P D ( MAX ) = ( T J ( MAX ) – T A ) ⁄ θ JA θJA is the junction-to-ambient thermal resistance. For safe operation, ensure that the power dissipation PD, calculated from Equation 8, is less than the maximum allowable power dissipation PD(MAX). The DFN package uses the copper area on the PCB as a heat-sink. The EPAD of this package must be soldered to the copper plane (GND plane). Figure 13 shows a curve for the θJA of the DFN package for different copper area sizes. 9 FIGURE 14. PCB VIA PATTERN FN7712.2 February 24, 2011 ISL80101A Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION CHANGE 2/2/11 FN7712.2 1. On page 1, “Features” a."±1.8% Vout Accuracy Guaranteed…" changed to "±2% Vadj Accuracy Guaranteed…" 2. Figure 1 on page 1 a."Typical Applications" changed to "Typical Application" b."82pF" for Cpb changed to "100pF" 3. On page 3, Pin Number 8 a. On "Description" of ISET, change 2nd sentence from "Current limit is 0.75mA when…" to "Current limit is 1.62A when…" 4. On page 4, “Electrical Specifications” a."DC Input Line Regulation" given own line, added symbol, and changed test conditions b. “Feedback Input Current”, added typical "0.01" and max "1" with units "µA" 5. On page 5, “Electrical Specifications” a. “PG PIN CHARACTERISTICS” “VOUT PG Flag Threshold”, Typical "85" changed to "84" %Vout 7. On page 7, “Programmable Current Limit” a. Equation 1 changed to "Ilimit=1.62+…" b. Equation 2 changed to "Ilimit=1.62-…" 8. Added "The current limit can be decreased from the 0.75A default…" changed to "The current limit can be decreased from the 1.62A default…" on page 7, between Equation 1 and Equation 2 9. On page 7, beginning of last paragraph a. "Figure 11 shows the relationship…" changed to "Figure 12 shows the relationship…" 10. “External Capacitor Requirements” on page 8: a. "The ISL80121-5 applies…" changed to "The ISL80101A applies… 11. On page 4, “Electrical Specifications”, “DC CHARACTERISTICS”, “Output Current Limit” a. "VOUT = 2V, VIN = 5.5V, RSET = 25.5k " changed to ""VOUT = 2V, VIN = 5.0V, RSET = 25.5k " 12. On page 4, “Electrical Specifications”, “AC CHARACTERISTICS”, “Input Supply Ripple Rejection” a. "58db" typical changed to "48" b. "62dB" typical changed to "48" 13. On page 8, revised Figure 12. Updated same graphic on page 1 14. Throughout: All "VIN" changed to "VIN" 15. Throughout: All "VOUT" changed to "VOUT" 16. Throughout: All "RSET" changed to "RSET" 17. Throughout: All "ISET" changed to "ISET" 18. Throughout: All "EN" and "enable" changed to "ENABLE" 19. Throughout: All "PGOOD" changed to "PG" 20. “Block Diagram” on page 2, subscripted pin names for VIN, VOUT, ISET. Changed PGOOD to PG 21. On page 3, EPAD Description a. "directly to GND plane is optional." Changed to "directly to GND plane is required for thermal considerations. See “Power Dissipation and Thermals” on page 9 for more details." 22. On page 1, in paragraph 2, "The programmable current limiting improves system reliability of applications" changed to "The programmable current limiting improves system reliability of end applications." 23. On page 1, “Features”, "Programmable Soft-starting" changed to "Programmable Soft-Start" 24. On page 4, “Electrical Specifications”, “DC CHARACTERISTICS”, "DC Output Voltage Accuracy" changed to “DC ADJ Pin Voltage Accuracy” 25. On page 5, Notes 10 and 11 deleted (they were not referenced in the spec table). 26. “Output Voltage Selection” on page 8, "An external resistor divider, R2 and R3, is used to set the output voltage as shown in Equation 5. The recommended value for R3 is 500Ω to 1kΩ. R2 is then chosen according to Equation 6." changed to "An external resistor divider, R2 and R3, is used to set the output voltage as shown in Equations 5 and 6. Please see Table 2 on page 9 for recommended values of R2 and R3." 29. Added “General PowerPAD Design Considerations” on page 9 30. Revised Figure 8 12/6/10 FN7712.1 Modified “Block Diagram” on page 2. In “Ground Pin Current” on page 4 Test Conditions: -Changed 1st line from "VOUT + 0.4V < VIN < 5V, VSENSE = 0V" to "ILOAD = 0A, 2.2V < VIN <6V" -Changed 2nd line from "VOUT + 0.4V < VIN < 6V, VSENSE = 0V" to "ILOAD = 1A, 2.2V < VIN <6V" Figure 2 “DROPOUT vs LOAD” on page 6: -Switched colors on 25°C and 125°C. 11/29/10 FN7712.0 Initial Release 10 FN7712.2 February 24, 2011 ISL80101A Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN7712.2 February 24, 2011 ISL80101A Package Outline Drawing L10.3x3 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 6, 09/09 3.00 6 PIN #1 INDEX AREA A B 1 6 PIN 1 INDEX AREA (4X) 3.00 2.00 8x 0.50 2 10 x 0.23 4 0.10 1.60 TOP VIEW 10x 0.35 BOTTOM VIEW 4 (4X) 0.10 M C A B 0.415 PACKAGE OUTLINE 0.200 0.23 0.35 (10 x 0.55) SEE DETAIL "X" (10x 0.23) 1.00 MAX 0.10 C BASE PLANE 2.00 0.20 C SEATING PLANE 0.08 C SIDE VIEW (8x 0.50) C 0.20 REF 5 1.60 0.05 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 12 FN7712.2 February 24, 2011