3A, Rad Hard, Positive, Ultra Low Dropout Regulator ISL75051SRH Features The ISL75051SRH is a radiation hardened low-voltage, high-current, single-output LDO specified for up to 3.0A of continuous output current. These devices operate over an input voltage range of 2.2V to 6.0V and are capable of providing output voltages of 0.8V to 5.0V adjustable based on resistor divider setting. Dropout voltages as low as 65mV can be realized using the device. • DLA SMD#5962-11212 The OCP pin allows the short circuit output current limit threshold to be programmed by means of a resistor from the OCP pin to GND. The OCP setting range is from 0.5A minimum to 8.5A maximum. The resistor sets the constant current threshold for the output under fault conditions. The thermal shutdown disables the output if the device temperature exceeds the specified value. It subsequently enters an ON/OFF cycle until the fault is removed. The ENABLE feature allows the part to be placed into a low current shutdown mode that typically draws about 1µA. When enabled, the device operates with a typical low ground current of 11mA, which provides for operation with low quiescent power consumption. The device is optimized for fast transient response and single event effects. This reduces the magnitude of SET seen on the output. Additional protection diodes and filters are not needed. The device is stable with tantalum capacitors as low as 47µF and provides excellent regulation all the way from no load to full load. Programmable soft-start allows the user to program the inrush current by means of the decoupling capacitor value used on the BYP pin. Applications • Output Current Up to 3.0A at TJ = 150°C • Output Accuracy ±1.5% over MIL Temp Range • Ultra Low Dropout: - 65mV Typ Dropout at 1.0A - 225mV Typ Dropout at 3.0A • Noise of 100µVRMS from 300Hz to 300kHz • SET Mitigation with No Added Filtering/Diodes • Input Supply Range: 2.2V to 6.0V • Fast Load Transient Response • Shutdown Current of 1µA Typ • Output Adjustable Using External Resistors • PSRR 66dB Typ @ 1kHz • Enable and PGood Feature • Programmable Soft-start/Inrush Current Limiting • Adjustable Overcurrent Limit from 0.5A to 8.5A • Over-temperature Shutdown • Stable with 47µF Min Tantalum Capacitor • 18 Ld Ceramic Flatpack Package • Radiation Environment - High Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 krad(Si) - SET/SEL/SEB . . . . . . . . . . . . . . . . . . . . . . . .86 MeV•cm2/mg • LDO Regulator for Space Application • DSP, FPGA and µP Core Power Supplies • Post-regulation of Switched Mode Power Supplies • Down-hole Drilling 0.30 EN EN BYP OCP 0.1uF ADJ ISL75051SRH VIN 220uF VOUT VIN VOUT PG GND R1 0.1uF 0.1uF 2.67k VIN 4.7n PG R2 100pF 220uF DROPOUT VOLTAGE (V) ROCP +150°C 0.25 +125°C 0.20 0.15 +25°C 0.10 0.05 0.00 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 IOUT (A) FIGURE 1. TYPICAL APPLICATION November 4, 2011 FN7610.1 1 FIGURE 2. DROPOUT vs IOUT CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL75051SRH Block Diagram VIN CURRENT LIMIT ADJ OCP 520MV POWER PMOS REFERENCE BIAS BYPASS VOUT CURRENT LIMIT THERMAL SHUTDOWN LEVEL SHIFT ENABLE ADJ VADJ PGOOD DELAY 450mV GND Typical Applications EN EN 10 9 BYP OCP 11 8 ADJ VIN 12 7 VOUT VIN 13 6 VOUT VIN 14 5 ISL75051SRH VOUT VIN 15 4 VOUT VIN 16 3 VOUT VIN 17 2 VOUT PG 18 1 GND 511 0.2uF VIN VOUT 220uF 0.1uF 0.1uF 4.32k 220uF 2.67k 4.7n VIN 2.26k 5.49k 100pF PG 2 FN7610.1 November 4, 2011 ISL75051SRH Pin Configuration ISL75051SRH (18LD CDFP) TOP VIEW GND 1 18 PG VOUT 2 17 VIN VOUT 3 16 VIN VOUT 4 15 VIN VOUT 5 14 VIN VOUT 6 13 VIN VOUT 7 12 VIN VADJ 8 11 OCP BYP 9 10 EN GND Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 12, 13, 14 15, 16, 17 VIN Input supply pins 18 PG VOUT in regulation signal. Logic low defines when VOUT is not in regulation. Must be grounded if not used. 1 GND GND pin 2, 3, 4 5, 6, 7 VOUT Output voltage pins 8 VADJ VADJ pin allows VOUT to be programmed with an external resistor divider. 9 BYP To filter the internal reference, connect a 0.1µF capacitor from BYP pin to GND. 10 EN VIN independent chip enable. TTL and CMOS compatible. 11 OCP Allows current limit to be programmed with an external resistor. Top Lid GND The top lid is connected to GND pin of the package. 3 FN7610.1 November 4, 2011 ISL75051SRH Ordering Information ORDERING NUMBER PART NUMBER (NOTES 1, 2) TEMP RANGE (°C) PACKAGE PKG DWG. # 5962R1121201VXC ISL75051SRHVF -55 to +125 18 Ld CDFP K18.D 5962R1121201QXC ISL75051SRHQF -55 to +125 18 Ld CDFP K18.D 5962R1121201V9A ISL75051SRHVX -55 to +125 Die ISL75051SRHX/SAMPLE ISL75051SRHX/SAMPLE -55 to +125 Die Sample ISL75051SRHF/PROTO ISL75051SRHF/PROTO -55 to +125 18 Ld CDFP ISL75051SRHEVAL1Z Evaluation Board K18.D NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. For Moisture Sensitivity Level (MSL), please see device information page for ISL75051SRH. For more information on MSL please see Tech Brief TB363. 4 FN7610.1 November 4, 2011 ISL75051SRH Absolute Maximum Ratings Thermal Information VIN Relative to GND (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.7V VOUT Relative to GND (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.7V PG, EN, OCP/ADJ Relative to GND (Note 3). . . . . . . . . . . . . -0.3 to +6.7VDC Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 18 Ld CDFP Package (Notes 5, 6) . . . . . . . 28 4 Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Recommended Operating Conditions (Note 4) Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . .-55°C to +125°C Junction Temperature (TJ) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C VIN Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2V to 6.0V VOUT Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.8V to 5.0V PG, EN, OCP/ADJ relative to GND . . . . . . . . . . . . . . . . . . . . . . . 0V to +6.0V Radiation Information Max Total Dose (Dose Rate = 50 - 300radSi/s . . . . . . . . . . . . . . . . . . . . . . . 100 krad (Si) SET (VOUT < ±5% During Events (Note 7). . . . . . . . . . . . . . 86MeV•cm2/mg SEL/B (No Latchup/Burnout . . . . . . . . . . . . . . . . . . . . . . . . 86MeV•cm2/mg The output capacitance used for SEE testing is 220µF for CIN and COUT, 200nF for BYPASS CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 3. Extended operation at these conditions may compromise reliability. Exceeding these limits will result in damage. Recommended operating conditions define limits where specifications are guaranteed. 4. Refer to “Thermal Guidelines” on page 12. 5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379 6. For θJC, the “case temp” location is the center of the package underside. 7. The device can work down to VOUT = 0.8V; however, the SET performance of < ±5% at LET = 86MeV.cm2/mg is guaranteed at VOUT = >1.5V only. SET tests performed with 220µF 10V 25mΩ and 0.1µF CDR04 capacitor on the input and output. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220µF 25mΩ and 0.1µF X7R, TJ = +25°C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature. Please refer to “Applications Information” on page 11 of the datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. PARAMETER SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS -1.5 0.2 1.5 % -1.5 0.2 1.5 % 514.8 520 525.2 mV DC CHARACTERISTICS DC Output Voltage Accuracy VOUT VOUT Resistor adjust to 0.52V, 1.5V and 1.8V 2.2V < VIN < 3.6V; 0A < ILOAD < 3.0A VOUT Resistor adjust to 5.0V VOUT + 0.4V < VIN < 6.0V; 0A < ILOAD < 3.0A Feedback Pin VADJ 2.2V < VIN < 6.0V; ILOAD = 0A BYP Pin VBYP 2.2V < VIN < 6.0V; ILOAD = 0A 520 DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V, +25°C & -55°C (Note 9) 1.13 3.5 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.5V, +125°C (Note 9) 1.13 8.0 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V, +25°C & -55°C (Note 9) 1.62 3.5 mV DC Input Line Regulation 2.2V < VIN < 3.6V, VOUT = 1.8V, +125°C (Note 9) 1.62 10.5 mV DC Input Line Regulation VOUT + 0.4V < VIN < 6.0V, VOUT = 5.0V (Note 9) 12.50 20.0 mV DC Output Load Regulation VOUT = 1.5V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 9) -4.0 -0.8 -0.1 mV DC Output Load Regulation VOUT = 1.8V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 9) -4.0 -1.2 -0.05 mV DC Output Load Regulation VOUT = 5.0V; 0A < ILOAD < 3.0A, VIN = VOUT + 0.4V (Note 9) -15.0 -6.0 -0.05 mV 5 mV FN7610.1 November 4, 2011 ISL75051SRH Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220µF 25mΩ and 0.1µF X7R, TJ = +25°C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature. Please refer to “Applications Information” on page 11 of the datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. (Continued) PARAMETER SYMBOL Feedback Input Current TEST CONDITIONS MIN (Note 8) TYP VADJ = 0.5V MAX (Note 8) UNITS 1 µA Ground Pin Current IQ VOUT = 1.5V; ILOAD = 0A, VIN = 2.2V 11 12 mA Ground Pin Current IQ VOUT = 5.0V; ILOAD = 0A, VIN = 6.0V 16 18 mA Ground Pin Current IQ VOUT = 1.5V; ILOAD = 3.0A, VIN = 2.2V 11 13 mA Ground Pin Current IQ VOUT = 5.0V; ILOAD = 3.0A, VIN = 6.0V 16 18 mA ENABLE Pin = 0V, VIN = 6.0V 1 10 µA Ground Pin Current in Shutdown ISHDN Dropout Voltage VDO ILOAD = 1.0A, VOUT = 2.5V (Note 10) 65 100 mV Dropout Voltage VDO ILOAD = 2.0A, VOUT = 2.5V (Note 10) 140 200 mV Dropout Voltage VDO ILOAD = 3.0A, VOUT = 2.5V (Note 10) 225 300 mV Output Short Circuit Current ISCL VOUT = 0V, VIN = 2.2V, RSET = 5.11k 1.1 A Output Short Circuit Current ISCL VOUT = 0V, VIN = 6.0V, RSET = 5.11k 1.2 A Output Short Circuit Current ISCH VOUT = 0V, VIN = 2.2V, RSET = 511Ω 5.7 A Output Short Circuit Current ISCH VOUT = 0V, VIN = 6.0V, RSET = 511Ω 6.2 A Thermal Shutdown Temperature TSD VOUT + 0.4V < VIN < 6.0V 175 °C Thermal Shutdown Hysteresis (Rising Threshold) TSDn VOUT + 0.4V < VIN < 6.0V 25 °C Input Supply Ripple Rejection PSRR VP-P = 300mV, f = 1kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 66 dB Input Supply Ripple Rejection PSRR VP-P = 300mV, f = 100kHz, ILOAD = 3A; VIN = 2.5V, VOUT = 1.8V 30 dB AC CHARACTERISTICS 42 Phase Margin PM VOUT = 1.8V, CL = 220µF Tantalum 70 dB Gain Margin GM VOUT = 1.8V, CL = 220µF Tantalum 16 dB ILOAD = 10mA, BW = 300Hz < f < 300kHz, BYPASS to GND capacitor = 0.2µF 100 µVRMS Output Noise Voltage DEVICE START-UP CHARACTERISTICS: ENABLE PIN Rising Threshold 2.2V < VIN < 6.0V 0.6 0.9 1.2 V Falling Threshold 2.2V < VIN < 6.0V 0.47 0.7 0.9 V Enable Pin Leakage Current VIN = 6.0V, EN = 6.0V 1 µA Enable Pin Propagation Delay VIN = 2.2V, EN rise to IOUT rise 450 µs Enable Pin Turn-on Delay VIN = 2.2V, VOUT = 1.8V, ILOAD = 1A, COUT = 220µF, CBYP = 0.2µF 6 ms Enable Pin Turn-on Delay VIN = 2.2V, VOUT=1.8V, ILOAD = 1A, COUT = 47µF, CBYP = 0.2µF 50 µs Hysteresis Must be independent of VIN; 2.2V < VIN < 6.0V 90 200 318 mV VOUT Error Flag Rising Threshold 2.2V < VIN < 6.0V 85 90 96 % VOUT Error Flag Falling Threshold 2.2V < VIN < 6.0V 82 88 93 % VOUT Error Flag Hysteresis 2.2V < VIN < 6.0V 2.5 3.2 4.0 %VOUT 225 300 DEVICE START-UP CHARACTERISTICS: PG PIN 6 FN7610.1 November 4, 2011 ISL75051SRH Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 220µF 25mΩ and 0.1µF X7R, TJ = +25°C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst-case junction temperature. Please refer to “Applications Information” on page 11 of the datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits. (Continued) PARAMETER SYMBOL MIN (Note 8) TEST CONDITIONS TYP MAX (Note 8) UNITS Error Flag Low Voltage ISINK = 1mA 35 100 mV Error Flag Low Voltage ISINK = 6mA 185 400 mV Error Flag Leakage Current VIN = 6.0V, PG = 6.0V 0.01 1 µA NOTES: 8. Parameters with MIN and/or MAX limits are 100% tested at -55°C, +25°C and +125°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 9. Line and Load Regulation done under pulsed condition for T<10ms. 10. Dropout is defined as the difference between the supply VIN and VOUT, when the supply produces a 2% drop in VOUT from its nominal value. Data measured within a 3ms period. Typical Operating Performance 0.522 1.528 1.524 VOUT (V) 1.522 +25°C, VOUT (mV) -58°C, VOUT (mV) 0.520 1.520 1.518 +128°C, VOUT (mV) 1.516 -58°C, VADJ (mV) 0.519 0.518 +128°C, VADJ (mV) 0.517 1.514 1.512 VIN = 2.5V V = 1.5V 1.510 OUT 0.0 0.5 1.0 +25°C, VADJ (mV) 0.521 VADJ (V) 1.526 1.5 2.0 2.5 3.0 0.516 V = 2.5V IN V = 1.5V 0.515 OUT 0.0 0.5 1.0 3.5 FIGURE 3. LOAD REGULATION, VOUT vs IOUT 2.510 0.5210 3.5 +25°C, VADJ (mV) -58°C, VADJ (mV) 0.5200 +25°C, VOUT (mV) +128°C, VOUT (mV) 0.5195 0.5190 0.5185 0.5180 0.5170 0.5165 1.5 2.0 2.5 3.0 IOUT (A) FIGURE 5. LOAD REGULATION, VOUT vs IOUT 7 +128°C, VADJ (mV) 0.5175 2.495 2.490 VIN = 3.3V V = 2.5V 2.485 OUT 0.0 0.5 1.0 3.0 0.5205 -58°C, VOUT (mV) 2.505 2.500 2.5 0.5215 VADJ (V) VOUT (V) 2.515 2.0 FIGURE 4. LOAD REGULATION, VADJ vs IOUT 2.525 2.520 1.5 IOUT (A) IOUT (A) 3.5 VIN = 3.3V VOUT = 2.5V 0.5160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IOUT (A) FIGURE 6. LOAD REGULATION, VADJ vs IOUT FN7610.1 November 4, 2011 ISL75051SRH Typical Operating Performance (Continued) 0.5215 4.090 +25°C, VADJ (mV) 0.5210 4.085 0.5205 +128°C, VOUT (mV) 4.070 1.0 1.5 2.0 0.5190 +128°C, VADJ (mV) 0.5185 0.5180 0.5170 VIN = 5V VOUT = 4V 0.5 0.5195 0.5175 -58°C, VOUT (mV) 4.060 0.0 VADJ (V) VOUT (V) +25°C, VOUT (mV) 4.075 4.065 -58°C, VADJ (mV) 0.5200 4.080 2.5 3.0 3.5 0.5165 VIN = 5V V = 4V 0.5160 OUT 0.0 0.5 1.0 1.5 IOUT (A) FIGURE 7. LOAD REGULATION, VOUT vs IOUT 2.5 3.0 3.5 FIGURE 8. LOAD REGULATION, VADJ vs IOUT 8 0.525 ROCP = 0.511k 7 0.523 6 +25°C, VADJ (mV) 0.521 0.519 -58°C, VADJ (mV) +128°C, VADJ (mV) ROCP = 0.681k 5 OCP (A) VADJ (V) 2.0 IOUT (A) ROCP = 0.75k ROCP = 1.00k 4 3 ROCP = 1.47k ROCP = 2.00k ROCP = 2.61k ROCP = 3.83 2 0.517 1 0.515 2.0 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 2.0 2.5 3.0 3.5 4.0 VIN (V) 5.5 6.0 6.5 7.0 FIGURE 10. ROCP vs OCP AT +25°C, VOUT = 1.5V 8 8 ROCP = 0.511k 7 6 7 6 ROCP = 0.681k 5 4 3 ROCP = 0.75k ROCP = 1.00k ROCP = 1.47k ROCP = 2.00k OCP (A) OCP (A) 5.0 VIN (V) FIGURE 9. VIN vs VADJ OVER TEMPERATURE 2 ROCP = 0.511k ROCP = 0.681k 5 4 3 ROCP = 0.75k ROCP = 1.00k ROCP = 1.47k ROCP = 2.00k 2 1 0 2.0 4.5 ROCP = 5.11k 1 ROCP = 2.61k 2.5 3.0 3.5 ROCP = 3.83 4.0 4.5 5.0 VIN (V) 5.5 ROCP = 5.11k 6.0 6.5 FIGURE 11. ROCP vs OCP AT +128°C, VOUT = 1.5V 8 7.0 0 2.0 ROCP = 3.83 ROCP = 2.61k 2.5 3.0 3.5 4.0 4.5 5.0 VIN (V) ROCP = 5.11k 5.5 6.0 6.5 7.0 FIGURE 12. ROCP vs OCP AT -58°C, VOUT = 1.5V FN7610.1 November 4, 2011 ISL75051SRH Typical Operating Performance FIGURE 13. TRANSIENT LOAD RESPONSE, VIN = 3.3V, VOUT = 2.5V, COUT = 47µF, 35mΩ (Continued) FIGURE 14. TRANSIENT LOAD RESPONSE, VIN = 3.3V, VOUT = 2.5V, COUT = 220µF, 25mΩ FIGURE 15. POWER-ON AND POWER-OFF, EN = 0 TO 1, +25°C, VIN = 6V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-ON FIGURE 16. POWER-ON AND POWER-OFF, EN = 0 TO 1, +25°C, VIN = 2.2V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-ON FIGURE 17. POWER-ON AND POWER-OFF, EN = 1 TO 0, +25°C, VIN = 6V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-OFF FIGURE 18. POWER-ON AND POWER-OFF, EN = 1 TO 0, +25°C, VIN = 2.2V, VOUT = 0.8V, IOUT = 0.5A, PGOOD TURN-OFF 9 FN7610.1 November 4, 2011 ISL75051SRH Typical Operating Performance (Continued) 140 NOISE (µV/√Hz 0.5) 120 100 80 60 40 > 20 0 0 50k 100k 150k 200k 250k 300k FREQUENCY (Hz) > FIGURE 19. NOISE (µV/√Hz O.5) > FIGURE 20. PSRR 10 FN7610.1 November 4, 2011 ISL75051SRH Applications Information Input Voltage Requirements This RH LDO will work from a VIN in the range of 2.2V to 6.0V. The input supply can have a tolerance of as much as ±10% for conditions noted in the “Electrical Specifications” table starting on page 5. Minimum guaranteed input voltage is 2.2V. However, due to the nature of an LDO, VIN must be some margin higher than the output voltage, plus dropout at the maximum rated current of the application, if active filtering (PSRR) is expected from VIN to VOUT. The dropout spec of this family of LDOs has been generously specified to allow applications to design for efficient operation. TABLE 2. TYPICAL GM/PM WITH VARIOUS CAPACITORS CAPACITANCE (µF) ESR (mΩ) GAIN MARGIN (dB) PHASE MARGIN (°) 47 35 14 55 100 25 16 57 220 6 19 51 220 25 16 69 100 100 10 62 Type numbers of KEMET capacitors used in the device are shown in Table 3. Adjustable Output Voltage TABLE 3. KEMET CAPACITORS USED IN DEVICE The output voltage of the RH LDO can be set to any user programmable level between 0.8V to 5.0V. This is achieved with a resistor divider connected between the OUT, ADJ and GND pins. With the internal reference at 0.52V, the divider ratio should be fixed such that when the desired VOUT level is reached, the voltage presented to the ADJ pin is 0.52V. Resistor values for typical voltages are shown in Table 1. TABLE 1. RESISTOR VALUES FOR TYPICAL VOLTAGES RBOTTOM 0.8V 7.87k 4.32k 1.5V 2.26k 4.32k 1.8V 1.74k 4.32k 2.5V 1.13k 4.32k 4.0V 634 4.32k 5.0V 499 4.32k Input and Output Capacitor Selection RH operation requires the use of a combination of tantalum and ceramic capacitors to achieve a good volume-to-capacitance ratio. The recommended combination is a 220µF, 25mΩ 10V DSSC 04051-032 rated tantalum capacitor in parallel with a 0.1µF MIL-PRF-49470 CDR04 ceramic capacitor, to be connected between VIN to GND pins and VOUT to GND pins of the LDO, with PCB traces no longer than 0.5cm. The stability of the device depends on the capacitance and ESR of the output capacitor. The usable ESR range for the device is 6mΩ to 100mΩ. At the lower limit of ESR = 6mΩ, the phase margin is about 51°C. On the high side, an ESR of 100mΩ is found to limit the gain margin at around 10dB. The typical GM/PM seen with capacitors are shown in Table 2. T525D476M016ATE035 47µF, 10V, 35mΩ T525D107M010ATE025 100µF, 10V, 25mΩ T530D227M010ATE006 220µF, 10V, 6mΩ T525D227M010ATE025 220µF, 10V, 25mΩ T495X107K016ATE100 100µF, 16V, 100mΩ A typical gain phase plot measured on the ISL75051SRHEVAL1Z evaluation board for VIN = 3.3V, VOUT = 1.8V and IOUT = 3A with a 220µF, 10V, 25mΩ capacitor is shown in Figure 21 and is measured at GM = 16.3dB and PM = 69.16°. GAIN (dB) RTOP CAPACITOR DETAILS 60 50 40 30 20 10 0 -10 3.3V -20 1.8V -30 3.0A -40 1x220µF -50 T525D -60 500 180 150 120 90 60 30 0 -30 -60 -90 -120 -150 -180 PHASE GAIN 5k 50k 500k PHASE (°) VOUT KEMET TYPE NUMBER 5M FREQUENCY (Hz) FIGURE 21. TYPICAL GAIN PHASE PLOT Enable The device can be enabled by applying a logic high on the EN pin. The enable threshold is typically 0.9V. A soft-start cycle is initiated when the device is enabled using this pin. Taking this pin to logic low disables the device. EN can be driven from either an open drain or a totem pole logic drive between EN pin and GND. Assuming an open drain configuration, M1 will actively pull down the EN line, as shown in Figure 22, and thereby discharge the input capacitance, shutting off the device immediately. 11 FN7610.1 November 4, 2011 ISL75051SRH Current Limit Protection VIN R1 10k INT EN GATE EN PIN INT EN BUS M1 EN The RH LDO incorporates protection against overcurrent due to any short or overload condition applied to the output pin. The current limit circuit becomes a constant current source when the output current exceeds the current limit threshold, which can be adjusted by means of a resistor connected between the OCP pin and GND. If the short or overload condition is removed from VOUT, then the output returns to normal voltage mode regulation. OCP can be calculated with Equation 2: (EQ. 2) OCP = 9.5 • EXP ( – 0.6 • ( ROCP ⁄ ( 1 + 0.1ROCP ) ) ) 0 where OCP = Overcurrent Threshold in amps, and ROCP = OCP resistor in kΩ. FIGURE 22. ENABLE Power Good The Power-Good pin is asserted high when the voltage on the ADJ pin crosses the rising threshold of 0.9 x VADJ typ. On the falling threshold, Power-Good is asserted low when the voltage on the ADJ pin crosses the falling threshold of 0.88 x VADJ. The power-good output is an open-drain output rated for a continuous sink current of 1mA. In the event of an overload condition based on the set OCP limit, the die temperature may exceed the internal over-temperature limit, and the LDO begins to cycle on and off due to the fault condition (Figure 24). However, thermal cycling may never occur if the heatsink used for the package can keep the die temperature below the limits specified for thermal shutdown. 8 7 Soft-start is achieved by means of the charging time constant of the BYP pin. The capacitor value on the pin determines the time constant and can be calculated using Equation 1: 6 T S = 0.00577xC S (EQ. 1) OCP (A) Soft-start 5 4 OCP = +25°C 3 2 where TS = soft-start time in ms, and CS = BYPASS capacitor in nF. The BYPASS capacitor, C1, charges with a 90µA source current and provides an EA reference, -IN, with an SS ramp. VOUT, in turn, follows this ramp. The ramp rate can be calculated based on the C1 value. For conditions in which C1 is opened, or for small values of C1, the ramp is provided by C2 = 50pF, with a source of 0.5µA. Connecting C1 min = 0.1µF to the BYPASS pin is recommended for normal operation. ADJ PIN VIN VIN I1 I2 90µAdc BYPASS EXT PIN C1 0.1µF 0 0.5µAdc U1 +IN INT SS NODE -IN OUT -IN ISL75051SRH EA C2 50pF 0 FIGURE 23. SOFT-START 12 VIN 75051_PMOS M1 VOUT 1 0 0 1 2 3 4 5 6 ROCP (kΩ) FIGURE 24. OCP vs ROCP OVER TEMP Thermal Guidelines If the die temperature exceeds typically +175°C, then the LDO output shuts down to zero until the die temperature cools to typically +155°C. The level of power combined with the thermal impedance of the package (θJC of 4°C/W for the 18 Ld CDFP package) determines whether the junction temperature exceeds the thermal shutdown temperature specified in the “Electrical Specifications” table. The device should be mounted on a high effective thermal conductivity PCB with thermal vias, per JESD51-7 and JESD51-5. Place a silpad between package base and PCB copper plane. The VIN and VOUT ratios should be selected to ensure that dissipation for the selected VIN range keeps TJ within the recommended operating level of 150°C for normal operation. FN7610.1 November 4, 2011 ISL75051SRH Weight Characteristics Weight of Packaged Device K18.D: 1.07 Grams typical with leads clipped Die Characteristics Die Dimensions BACKSIDE FINISH Silicon PROCESS 0.6µM BiCMOS Junction Isolated ASSEMBLY RELATED INFORMATION Substrate Potential 4555µm x 4555µm (179.3 mils x 179.3 mils) Thickness: 304.8µm ± 25.4µm (12.0 mils ± 1 mil) Unbiased ADDITIONAL INFORMATION Interface Materials Worst Case Current Density GLASSIVATION < 2 x 105 A/cm2 Type: Silicon Oxide and Silicon Nitride Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm TOP METALLIZATION Type: AlCu (99.5%/0.5%) Thickness: 2.7µm ±0.4µm BACKSIDE METALLIZATION None Transistor Count 2932 Layout Characteristics Step and Repeat 4555µm x 4555µm Metallization Mask Layout SUBSTRATE Type: Silicon PAD X Y COORDIN ATES PAD NAME X µm Y µm 1 G ND 0 0 2 G ND -393 0 3 VO UT -711 -710 4 VO UT -711 -1858 5 VO UT -711 -2964 6 ADJ -1680 -3070 7 BYP -1621 -3879 8 EN 2164 -3879 9 O CP 2222 -3131 10 VIN 1078 -2965 11 VIN 1078 -1853 12 VIN 1078 -711 13 PG 420 -25 13 FN7610.1 November 4, 2011 ISL75051SRH Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION CHANGE November 4, 2011 FN7610.1 Removed “Coming Soon” from ISL75051SRHVF, ISL75051SRHQF, ISL75051SRHVX and ISL75051SRHX/SAMPLE in “Ordering Information” table on page 4. September 30, 2011 FN7610.0 Initial Release Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL75051SRH To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN7610.1 November 4, 2011 ISL75051SRH Package Outline Drawing K18.D 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 2, 3/11 0.015 (0.381) 0.005 (0.127) PIN NO. 1 ID OPTIONAL 1 2 0.040 (1.016 BSC) 0.476 (12.09) 0.456 (11.58) PIN NO. 1 ID AREA 0.005 (0.127) MIN 4 0.020 (0.508) 0.013 (0.330) 0.122 (3.10) 0.100 (2.54) 0.038 (0.97) 0.026 (0.66) -C- TOP VIEW 6 0.397 (10.084) 0.377 (9.576) 0.283 (7.19) MIN 0.010 (0.25) 0.004 (0.10) -D- 0.350 (8.89) 0.250 (6.35) -H- 0.03 (0.76) MIN SEATING AND BASE PLANE SIDE VIEW NOTES: 0.007 (0.178) 0.004 (0.102) LEAD FINISH BASE METAL 0.010 (0.254) 0.004 (0.102) 0.017 (0.432) 0.013 (0.330) 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 0.0015 (0.04) MAX 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 0.020 (0.508) 0.013 (0.330) 3 SECTION A-A 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Dimensions = INCH (mm). Controlling dimension: INCH. 15 FN7610.1 November 4, 2011