Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC NEW This family of avalanche diode arrays are designed for ESD protection and offered in an ultra small chip scale package. The multi-channel devices are used to help protect sensitive digital or analog input circuits on data, signal, or control lines with unipolar voltage levels up to 5VDC. The state-of-the-art structure is designed to suppress ESD and other transient over-voltage events to meet the International Electrotechnical Compatability (EMC transient immunity stantards IEC 61000-4-2 for Electrostatic Discharge Requirements). The monolithic silicon devices are comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures has been tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection. Ordering Information CS PACKAGE SIZE (MM) QUANTITY PER REEL 5 SP0504BACT 4 6 1.804 x 1.154 3500 SP0508BACT 8 10 3.104 x 1.154 3500 Features 3500 • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch) 20 16 SP0516BACT 3.104 x 2.454 NOTE: Bump pitch is 0.65mm • ESD Capability per HBM Standards Schematic - IEC 61000-4-2, Direct Discharge...............................25kV (Level 4) SP0516BAC SP0504BAC B1 B2 D1 B3 D2 D3 - IEC 61000-4-2, Air Discharge....................................30kV (Level 4) D4 D5 - MIL STD 833D (Method 3015.7) ..............................................30kV • Signal line protection for applications up to 5VDC • Fast response time...........................................................................< 1ns • Low input capacitance ..........................................................39pF Typical • Low clamp voltage ..................................................................12V Typical A1 A2 • Low input leakage.....................................................................10uA Max A3 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 • Operating temperature range ............................................- 40°C to 85°C Applications SP0508BAC • Cell phone handsets R1 R2 R3 R4 R5 • Personal Digital Assistants (PDA) • Portable handheld equipment (Laptop, Palmtop computers) • Computer port, keyboard (USB1.1) A1 A2 A3 A4 A5 • Set-Top Box (Audio and Video Ports) • PCMCIA cards A1 A2 A3 A4 A5 w w w. l i t t e l f u s e . c o m 199 SILICON PROTECTION CIRCUITS DIODE CHANNELS BUMPS PART NUMBER Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC ELECTRICAL SPECIFICATIONS TA = 25°C Unless Otherwise Specified TEST CONDITIONS MIN TYPICAL MAX UNITS Reverse Standoff Voltage I = 10µA ± 5.5 - - V Reverse Standoff Leakage Current V = 5.5V 10 µA PARAMETER Signal Clamp Voltage Positive I = 10mA 5.6 6.6 8.0 V Negative I = 10mA - 1.2 - 0.8 - 0.4 V Clamp Voltage during ESD MIL-STD-883D Method 3015 8kV Positive 12 V 8kV Negative -8 V ESD Test Level IEC-61000-4-2, Contact discharge kV 25 30 MIL-STD-883D Method 3015 (HBM) Capacitance 2.5VDC @ 1Mhz Turn on/off Time kV 39 pF <1 ns Temperature Range Operating - 40 85 °C Storage - 65 150 °C Typical Solder Reflow Thermal Profile (No Clean Flux) PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad Size on PCB 0.300mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads (NSMD) 125 Solder Mask Opening 0.350mm 100 Solder Stencil Thickness 0.152mm Solder Stencil Aperature Opening Solder Flux Ratio 0.360mm (sq) 50/50 Solder Paste No Clean Board Trace Finish OSP (Entek Cu Plus 106A) 250 EXH PH Z2 Z3 Z4 Z RF CD EXH 225 Temperature (oC) 200 175 150 75 50 25 0 48 97 145 194 242 Time (s) 200 290 339 387 435 w w w. l i t t e l f u s e . c o m Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC Outline Drawings SP0504BAC 3.104mm (.071") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026") B 1.154mm (.045") A 1 0.35mm Diameter (.014") 2 3 0.252mm (.010") 0.381mm (.015") 0.643mm (.025") 5 SILICON PROTECTION CIRCUITS SP0508BAC 3.104mm (.122") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026") B 1.154mm (.045") A 1 2 3 4 5 0.35mm Diameter Bumps (.014") 0.252mm (.010") 0.381mm (.015") 0.643mm (.025") SP0516BAC 3.104mm (.122") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026") 2.454mm (.096") B A 1 0.35mm Diameter Bumps (.014") 2 3 4 5 0.252mm (.010") w w w. l i t t e l f u s e . c o m 0.381mm (.015") 0.643mm (.025") 201