TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT The product is a silicon P/N structure tailored for ESD protection and is offered in the standard EIA 0402 size. The single channel Chip Scale device is used to help protect sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5VDC. The bipolar device is ideal for protection where AC signals are present. The state-of-the-art device is designed to suppress ESD and other transient over-voltage events to meet the International Electrotechnical Compatability (EMC transient immunity stantards IEC 61000-4-2 for Electrosatic Discharge Requirements). The monolithic silicon device is comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures has been tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection. Ordering Information Part Number Diode Channels Bumps Package Size mils (mm) Quantity Per Reel SP0501BACT 1 2 40x20 (1x 0.5) 3500 Schematic TVS DIODE ARRAYS 5 Applications SP0501BAC • Cell phone handsets • Personal Digital Assistants (PDA) • Portable handheld equipment (Laptop, Palmtop computers) • Computer port, keyboard (USB1.1) • Set-Top Box (Audio and Video ports) Features • PCMCIA cards • Single channel suppressor in an EIA 0402 device size • ESD Capability - IEC 61000-4-2, Direct Discharge .................................30kV (Level 4) - IEC 61000-4-2, Air Discharge ......................................30kV (Level 4) - MIL STD 883D (Method 3015.7).................................................30kV • Signal line protection for applications up to 5VDC • Fast response time .........................................................................< 1ns • Low input capacitance .........................................................30pF Typical • Low clamp voltage (8kV test) ................................................13V Typical • Low input leakage ....................................................1nA @ 3.3V Typical • Operating temperature range ............................................-40°C to 85°C w w w. l i t t e l f u s e . c o m 219 TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT Electrical Specifications TA = 25°C Unless Otherwise Specified TEST CONDITIONS MIN TYPICAL MAX Reverse Standoff Voltage I = 10µA ±5.9 - - V Reverse Standoff Leakage Current V = 5.5V 1 100 µA 7.5 9.2 V - 7.5 - 6.0 V PARAMETER UNITS Signal Clamp Voltage Positive I = 10mA 6.0 Negative I = 10mA -9.2 Clamp Voltage during ESD MIL-STD 833D (Method 3015.7) 8kV V 13 ESD Test Level V IEC-61000-4-2, Contact discharge 30 MIL-STD-883D Method 3015 (HBM) 30 Capacitance kV kV 5V @ 1Mhz Turn on/off Time 30 pF <1 ns Temperature Range Operating -40 85 °C Storage -65 150 °C Outline Drawing Typical Device Capacitance vs. Voltage 50 1.0 (.04") 40 0.076 (.003") 30 20 0.36 (.014") 0.076 (.003") 0.5 (.02") 10 0 1 0 2 3 Voltage Across Device (V) 220 4 0.15 (.006") 5 NOTE** Metal Bump: 63/37 (Sn/Pb) alloy w w w. l i t t e l f u s e . c o m 0.36 (.014") 0.076 (.003") TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT Printed Circuit Board Recommendations Pad Size in PCB 14 x 6 mils (0.356 x 0.152mm) Pad Shape Rectangle Pad Definition Non Solder Mask Defined Pads (NSMD) Solder Mask Opening 18 x 10 mils (0.457 x 0.254mm) Solder Stencil Thickness 6 mils (0.152mm) Solder Stencil Aperture Opening 14 x 6 mils (0356 x 0.152mm) Solder Flux Ratio 50/50 Solder Paste Type No Clean Board Trace Finish Organic Solderable Preservative (OSP) (Enteck: Cu Plus 106A) Solder stencil opening/PCB land Solder Mask Opening 2 mils 5 TVS DIODE ARRAYS 28 mils 14 mils 18 mils 2 mils 10 mils 6 mils Typical Solder Reflow Thermal Profile (No-Clean Flux) 250 EXH PH Z2 Z3 48 97 145 Z4 Z RF CD EXH 225 Temperature (oC) 200 175 150 125 100 75 50 25 0 194 242 290 339 387 435 Time (s) w w w. l i t t e l f u s e . c o m 221