LITTELFUSE SP0501BACT

TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
The product is a silicon P/N structure tailored for ESD protection and is
offered in the standard EIA 0402 size. The single channel Chip Scale
device is used to help protect sensitive digital or analog input circuits on
data, signal, or control lines with voltage levels up to 5VDC. The bipolar
device is ideal for protection where AC signals are present.
The state-of-the-art device is designed to suppress ESD and other
transient over-voltage events to meet the International Electrotechnical
Compatability (EMC transient immunity stantards IEC 61000-4-2 for
Electrosatic Discharge Requirements). The monolithic silicon device is
comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures has been tailored
for transient protection. The low capacitance and clamp voltage are ideal
for high speed signal line protection.
Ordering Information
Part Number
Diode
Channels
Bumps
Package Size
mils (mm)
Quantity Per
Reel
SP0501BACT
1
2
40x20 (1x 0.5)
3500
Schematic
TVS DIODE ARRAYS
5
Applications
SP0501BAC
• Cell phone handsets
• Personal Digital Assistants (PDA)
• Portable handheld equipment (Laptop, Palmtop computers)
• Computer port, keyboard (USB1.1)
• Set-Top Box (Audio and Video ports)
Features
• PCMCIA cards
• Single channel suppressor in an EIA 0402 device size
• ESD Capability
- IEC 61000-4-2, Direct Discharge .................................30kV (Level 4)
- IEC 61000-4-2, Air Discharge ......................................30kV (Level 4)
- MIL STD 883D (Method 3015.7).................................................30kV
• Signal line protection for applications up to 5VDC
• Fast response time .........................................................................< 1ns
• Low input capacitance .........................................................30pF Typical
• Low clamp voltage (8kV test) ................................................13V Typical
• Low input leakage ....................................................1nA @ 3.3V Typical
• Operating temperature range ............................................-40°C to 85°C
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TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
Electrical Specifications TA = 25°C Unless Otherwise Specified
TEST CONDITIONS
MIN
TYPICAL
MAX
Reverse Standoff Voltage
I = 10µA
±5.9
-
-
V
Reverse Standoff Leakage Current
V = 5.5V
1
100
µA
7.5
9.2
V
- 7.5
- 6.0
V
PARAMETER
UNITS
Signal Clamp Voltage
Positive
I = 10mA
6.0
Negative
I = 10mA
-9.2
Clamp Voltage during ESD
MIL-STD 833D (Method 3015.7)
8kV
V
13
ESD Test Level
V
IEC-61000-4-2, Contact discharge
30
MIL-STD-883D Method 3015 (HBM)
30
Capacitance
kV
kV
5V @ 1Mhz
Turn on/off Time
30
pF
<1
ns
Temperature Range
Operating
-40
85
°C
Storage
-65
150
°C
Outline Drawing
Typical Device Capacitance vs. Voltage
50
1.0 (.04")
40
0.076 (.003")
30
20
0.36
(.014")
0.076
(.003")
0.5 (.02")
10
0
1
0
2
3
Voltage Across Device (V)
220
4
0.15 (.006")
5
NOTE** Metal Bump: 63/37 (Sn/Pb) alloy
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0.36 (.014")
0.076 (.003")
TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
Printed Circuit Board Recommendations
Pad Size in PCB
14 x 6 mils (0.356 x 0.152mm)
Pad Shape
Rectangle
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
18 x 10 mils (0.457 x 0.254mm)
Solder Stencil Thickness
6 mils (0.152mm)
Solder Stencil Aperture Opening
14 x 6 mils (0356 x 0.152mm)
Solder Flux Ratio
50/50
Solder Paste Type
No Clean
Board Trace Finish
Organic Solderable Preservative (OSP)
(Enteck: Cu Plus 106A)
Solder stencil
opening/PCB land
Solder Mask
Opening
2 mils
5
TVS DIODE ARRAYS
28 mils
14 mils 18 mils
2 mils
10 mils
6 mils
Typical Solder Reflow Thermal Profile (No-Clean Flux)
250
EXH
PH
Z2
Z3
48
97
145
Z4
Z
RF
CD
EXH
225
Temperature (oC)
200
175
150
125
100
75
50
25
0
194
242
290
339
387
435
Time (s)
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221