RT9017

RT9017
500mA Peak, Thermal Folded Back CMOS LDO Regulator
General Description
Features
The RT9017 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9017 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. Regulator ground current increases
only slightly in dropout, further prolonging the battery life.
The RT9017 also works with low-ESR ceramic capacitors,
reducing the amount of board space necessary for power
applications, critical in hand-held wireless devices. The
RT9017 consumes less than 0.01μA in shutdown mode
and has fast turn-on time less than 50μs. RT9017 is short
circuit thermal folded back protected. RT9017 lowers its
OTP trip point from 165°C to 110°C when output short
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Short Circuit Thermal Folded Back Protection
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circuit occurs (VOUT < 0.4V) providing maximum safety to
end users. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio. Available in the SOT-23-3,
SOT-23-5 and WDFN-6L 2x2 packages, the RT9017 also
offers a range of 1.5V to 3.5V with 0.1V per step.
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Low-Noise for RF Application
Fast Response in Line/Load Transient
Quick Start-Up (Typically 50μ
μs)
0.01μ
μA Standby Current When Shutdown
Low Dropout : 380mV @ 500mA
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Current Limiting Protection
Thermal Shutdown Protection
Only 1μ
μF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
RoHS Compliant and 100% Lead (Pb)-Free
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Applications
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Ordering Information
RT9017-
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Package Type
V : SOT-23-3
B : SOT- 23-5
BR : SOT- 23-5 (R-Type)
QW : WDFN-6L 2x2 (W-Type)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Note :
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Output Voltage
15 : 1.5V
16 : 1.6V
:
34 : 3.4V
35 : 3.5V
1H : 1.85V
2H : 2.85V
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CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Pin Configurations
(TOP VIEW)
EN
GND
VIN
1
6
2
5
3
RoHS compliant and compatible with the current require-
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Suitable for use in SnPb or Pb-free soldering processes.
4
WDFN-6L 2x2
VIN
Richtek products are :
`
7
NC
NC
VOUT
3
ments of IPC/JEDEC J-STD-020.
2
GND
VOUT
SOT-23-3
DS9017-05 April 2011
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RT9017
VIN
VOUT
VOUT
NC
5
4
5
4
EN
2
3
NC
GND
VIN
SOT-23-5
2
3
GND
EN
SOT-23-5 (R-Type)
Typical Application Circuit
RT9017
VIN
VIN
CIN
1uF
VOUT
COUT
1uF
Chip Enable
EN
VOUT
GND
Functional Pin Description
Pin Name
EN
Pin Function
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ
resistor connected to GND when the control signal is floating.
NC
No Internal Connection.
GND
Ground.
VOUT
Output Voltage.
VIN
Input Voltage.
Function Block Diagram
EN
Shutdown
and
Logic Control
VIN
VREF
-
MOS Driver
+
Error
Amplifier
VOUT
Current-Limit
and
Thermal
Protection
GND
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DS9017-05 April 2011
RT9017
Absolute Maximum Ratings
(Note 1)
Supply Input Voltage -----------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SOT-23-3 -------------------------------------------------------------------------------------------------------------------SOT-23-5 -------------------------------------------------------------------------------------------------------------------WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------z Package Thermal Resistance (Note 2)
SOT-23-3, θJA --------------------------------------------------------------------------------------------------------------SOT-23-5, θJA --------------------------------------------------------------------------------------------------------------WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------z Junction Temperature ----------------------------------------------------------------------------------------------------z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------z Storage Temperature Range -------------------------------------------------------------------------------------------z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) -----------------------------------------------------------------------------------------------------z
6V
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Recommended Operating Conditions
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400mW
400mW
606mW
250°C/W
250°C/W
165°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Voltage Accuracy
ΔVOUT
IOUT = 1mA
−2
--
+2
%
Current Limit
ILIM
RLOAD = 1Ω
530
--
--
mA
Quiescent Current
IQ
VEN >= 1.2V, IOUT = 0mA
--
90
130
μA
Dropout Voltage (Note 5)
V DROP
IOUT = 300mA, VOUT > 2.8V
--
220
--
IOUT = 500mA, VOUT > 2.8V
--
380
--
Line Regulation
ΔVLINE
VIN = (VOUT + 1V) to 5.5V,
IOUT = 1mA
--
--
0.3
%
Load Regulation
ΔVLOAD 1mA < IOUT < 500mA
--
--
0.6
%
Standby Current
ISTBY
VEN = GND, Shutdown
--
0.01
1
μA
EN Input Bias Current
IIBSD
VEN = GND or VIN
--
0
100
nA
V IL
VIN = 3V to 5.5V, Shutdown
--
--
0.4
1.2
--
--
--
−60
--
--
−30
--
EN Threshold
Power Supply
Rejection Rate
Logic-Low Voltage
Logic-High Voltage V IH
f = 100Hz
f = 10kHz
PSRR
VIN = 3V to 5.5V, Start-Up
COUT = 1μF, IOUT = 100mA
mV
V
dB
Thermal Shutdown Temperature
T SD
--
165
--
°C
Thermal Shutdown Temperature
Hysteresis
Thermal Folded Back
ΔT SD
--
30
--
°C
--
110
--
°C
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RT9017
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board
of JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
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DS9017-05 April 2011
RT9017
Typical Operating Characteristics
Quiesent Current vs. Temperature
Output Voltage vs. Temperature
100
VIN = 5V
CIN = COUT = 1uF
RT9017-15PB
VIN = 3.3V
CIN = COUT = 1uF
95
Quiescent Current (uA)
Output Voltage (V)
2
1.9
1.8
No Load
1.7
90
85
80
75
70
65
60
1.6
-50
-25
0
25
50
75
100
-50
125
-25
RT9017-15PB
VIN = 3.3V
CIN = COUT = 1uF
100
125
RT9017-33PB
CIN = COUT = 1uF
0.75
0.5
TJ = 125°C
400
TJ = 25°C
300
200
TJ = -40°C
100
0.25
0
-50
-25
0
25
50
75
100
125
0
100
200
300
400
Temperature (°C)
Load Current (mA)
PSRR
Line Transient Response
Input Voltage
Deviation (V)
VOUT = 2.5V
CIN = COUT = 1uF, X7R
0
-20
Output Voltage
Deviation (mV)
PSRR (dB)
75
500
Dropout Voltage (mV)
EN Pin Threshold Voltage (V)
600
1
20
50
Dropout Voltage vs. Load Current
EN Pin Shutdown Threshold vs. Temperature
1.25
25
Temperature (°C)
Temperature (°C)
1.5
0
-40
ILOAD = 100mA
-60
ILOAD = 10mA
CIN = COUT = 1uF
500
ILOAD = 50mA
5
4
3
20
0
-20
-80
10
0.01
100
0.1
1K
1
10K
10
100K
100
1M
1000
Time (100μs/Div)
Frequency (kHz)
(Hz)
DS9017-05 April 2011
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RT9017
4
50
0
-50
CIN = COUT = 1uF
ILOAD = 10mA to 300mA
RT9017-35PB
VIN = 5.0V
200
0
50
0
-50
Time (100μs/Div)
Time (500μs/Div)
Load Transient Response
Start Up
CIN = COUT = 1uF
ILOAD = 10mA to 400mA
400
200
10
VOUT = 1.8V
ILOAD = 1mA
VIN = 5V
CIN = COUT = 1uF
5
0
Output Voltage
(V)
0
50
0
-50
10
2
1
0
Time (500μs/Div)
Time (10μs/Div)
EN Pin Shutdown Response
Noise
VIN = 5V
CIN = COUT = 1uF
5
400
0
200
2
VOUT = 1.8V
ILOAD = 150mA
VIN = 4.5V
CIN = COUT = 1uF
VOUT = 1.8V
ILOAD = 1mA
Noise (μV)
Output Voltage Load Current
Deviation (mV)
(mA)
EN Pin Voltage
(V)
400
Output Voltage
Deviation (mV)
3
RT9017-35PB
VIN = 5.0V
Output Voltage
(V)
ILOAD = 250mA
Load Current
(mA)
CIN = COUT = 1uF
5
Load Transient Response
EN Pin Voltage
(V)
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
Line Transient Response
0
-200
-400
1
0
f = 10Hz to 100kHz
Time (1ms/Div)
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Time (5ms/Div)
DS9017-05 April 2011
RT9017
Noise
VOUT = 1.8V
No Load
VIN = 4.5V
CIN = COUT = 1uF
Noise (μV)
400
200
0
-200
-400
f = 10Hz to 100kHz
Time (5ms/Div)
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RT9017
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9017 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 1μF on the RT9017 input and the amount of
capacitance can be increased without limit. The input
capacitor must be located a distance of not more than
0.5 inch from the input pin of the IC and returned to a
clean analog ground. Any good quality ceramic or tantalum
can be used for this capacitor. The capacitor with larger
value and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response.
Enable Function
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9017 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 20mΩ on the
RT9017 output ensures stability. The RT9017 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1. shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9017
and returned to a clean analog ground.
Thermal Considerations
The RT9017 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9017 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO regulator
in a continuously on state.
Thermal protection limits power dissipation in RT9017.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
RT9017 lowers its OTP trip level from 165°C to 110°C
when output short circuit occurs (VOUT < 0.4V) as shown
in Figure 2. This limits IC case temperature under 100°C
and provides maximum safety to end users when output
short circuit occurs.
VOUT Short to GND
0.4V
Region of Stable COUT ESR vs. Load Current
(Ω)ESR (Ω)
OUT ESR
Region ofCStable
COUT
100.00
100
RT9017-15PB
CIN = 1μF, X7R
Unstable Region
10
10.00
COUT = 1uF
1.001
IOUT
TSD
165 °C
110 °C
OTP Trip Point
110 °C
Stable Region
0.10
VOUT
0.01
IC Temperature
Unstable Region (Simulation Verity)
80 °C
0.00
0
100
200
300
Load Current (mA)
400
500
Figure 2. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs
Figure 1
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DS9017-05 April 2011
RT9017
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) - TA ) / θJA
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
700
WDFN-6L 2x2
Power Dissipation (mW)
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
600
500
SOT-23-3/
SOT-23-5
400
300
200
100
0
0
25
50
75
100
125
150
Ambient Temperature (°C)
Figure 3. Derating Curve for Packages
For recommended operating conditions specification of
RT9017, where T J(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for SOT-23-3/SOT23-5 package is 250°C/W and WDFN-6L 2x2 package is
165°C/W on standard JEDEC 51-3 thermal test board.
The maximum power dissipation at TA = 25°C can be
calculated by following formula :
PD(MAX) = (125°C−25°C)/250 = 400 mW (SOT-23-3/
SOT-23-5)
PD(MAX) = (125°C−25°C)/333 = 300 mW (SC-70-5)
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9017 packages, the Figure 3. of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
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RT9017
Outline Dimension
H
D
L
C
B
e
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.508
0.014
0.020
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
1.803
2.007
0.071
0.079
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-3 Surface Mount Package
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DS9017-05 April 2011
RT9017
H
D
L
B
C
b
A
A1
e
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.559
0.014
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-5 Surface Mount Package
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RT9017
D2
D
L
E
E2
1
e
b
A
A1
SEE DETAIL A
2
1
2
1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.350
0.008
0.014
D
1.950
2.050
0.077
0.081
D2
1.000
1.450
0.039
0.057
E
1.950
2.050
0.077
0.081
E2
0.500
0.850
0.020
0.033
e
L
0.650
0.300
0.026
0.400
0.012
0.016
W-Type 6L DFN 2x2 Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
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DS9017-05 April 2011