RT9193T 300mA, Thermal Folded Back CMOS LDO Regulator General Description Features The RT9193T is designed for portable RF and wireless applications with demanding performance and space requirements. The RT9193T performance is optimized for battery-powered systems to deliver ultra low noise and low quiescent current. A noise bypass pin is available for further reduction of output noise. Regulator ground current increases only slightly in dropout, further prolonging the battery life. The RT9193T also works with low-ESR ceramic capacitors, reducing the amount of board space necessary for power applications, critical in hand-held wireless devices. The RT9193T consumes less than 0.01μA in shutdown mode and has fast turn-on time less than 50μs. RT9193T is short circuit thermal folded back z Short Circuit Thermal Folded Back Protection z protected. RT9193T lowers its OTP trip point from 165°C to 110°C when output short circuit occurs (VOUT < 0.4V) providing maximum safety to end users. The other features include ultra low dropout voltage, high output accuracy, current limiting protection, and high ripple rejection ratio. Available in the 5-lead of SC-70, SOT-23 and WDFN-6L 2x2 packages. z Ultra-Low-Noise for RF Application Ultra-Fast Response in Line/Load Transient Quick Start-Up (Typically 50us) < 0.01uA Standby Current When Shutdown Low Dropout : 220mV @ 300mA Wide Operating Voltage Ranges : 2.5V to 5.5V TTL-Logic-Controlled Shutdown Input Low Temperature Coefficient Current Limiting Protection Thermal Shutdown Protection Only 1uF Output Capacitor Required for Stability High Power Supply Rejection Ratio Custom Voltage Available RoHS Compliant and 100% Lead (Pb)-Free z z z z z z z z z z z z Applications z z z z Ordering Information z RT9193T- z Package Type U5 : SC-70-5 B : SOT-23-5 QW : WDFN-6L 2x2 (W-Type) CDMA/GSM Cellular Handsets Battery-Powered Equipment Laptop, Palmtops, Notebook Computers Hand-Held Instruments PCMCIA Cards Portable Information Appliances Marking Information For marking information, contact our sales representative Lead Plating System directly or through a Richtek distributor located in your P : Pb Free area. G : Green (Halogen Free and Pb Free) Output Voltage 15 : 1.5V 16 : 1.6V : 34 : 3.4V 35 : 3.5V 1H : 1.85V 2H : 2.85V Note : Richtek products are : ` (TOP VIEW) EN GND VIN 1 6 2 5 3 7 4 BP NC VOUT WDFN-6L 2x2 VOUT BP 5 4 RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. ` Pin Configurations Suitable for use in SnPb or Pb-free soldering processes. 2 3 VIN GND EN SC-70-5/SOT-23-5 DS9193T-06 April 2011 www.richtek.com 1 RT9193T Typical Application Circuit RT9193T VOUT GND Chip Enable EN + CIN 1uF VIN + VIN COUT VOUT 1uF BP CBP 22nF Functional Pin Description Pin Name Pin Function VIN Power Input Voltage GND Ground EN Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ resistor connected to GND when the control signal is floating. BP Reference Noise Bypass VOUT Output Voltage Function Block Diagram EN Shutdown and Logic Control Quick Start BP VIN VREF + - Error Amplifier MOSFET Driver VOUT Current-Limit and Thermal Protection GND www.richtek.com 2 DS9193T-06 April 2011 RT9193T Absolute Maximum Ratings z z z z z z (Note 1) Supply Input Voltage ---------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C SC-70-5 -------------------------------------------------------------------------------------------------------------------SOT-23-5 ------------------------------------------------------------------------------------------------------------------WDFN-6L 2x2 ------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2) SOT-70-5, θJA ------------------------------------------------------------------------------------------------------------SOT-23-5, θJA ------------------------------------------------------------------------------------------------------------WDFN-6L 2x2, θJA ------------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------------------ESD Susceptibility (Note 3) HBM (Human Body Mode) --------------------------------------------------------------------------------------------MM (Machine Mode) ---------------------------------------------------------------------------------------------------- Recommended Operating Conditions z z z 6V 300mW 400mW 606mW 333°C/W 250°C/W 165°C/W 260°C −65°C to 150°C 2kV 200V (Note 4) Supply Input Voltage ---------------------------------------------------------------------------------------------------- 2.5V to 5.5V Ambient Temperature Range ------------------------------------------------------------------------------------------ −40°C to 85°C Junction Temperature Range ------------------------------------------------------------------------------------------ −40°C to 125°C Electrical Characteristics (VIN = VOUT + 1V, CIN = COUT = 1uF, CBP = 22nF, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Output Voltage Accuracy ΔVOUT IOUT = 1mA −2 -- +2 % Current Limit ILIM RLOAD = 1Ω 360 400 -- mA Quiescent Current IQ VEN ≥ 1.2V, IOUT = 0mA -- 90 130 μA 170 200 Dropout Voltage (Note 5) V DROP IOUT = 200mA mV IOUT = 300mA -- 220 300 VIN = (VOUT + 0.3V) to 5.5V, IOUT = 1mA -- -- 0.3 % Line Regulation ΔVLINE Load Regulation ΔVLOAD 1mA < IOUT < 300mA -- -- 0.6 % Standby Current ISTBY VEN = GND, Shutdown -- 0.01 1 uA EN Input Bias Current IIBSD VEN = GND or VIN -- 0 100 nA V IL VIN = 3V to 5.5V, Shutdown -- -- 0.4 VIN = 3V to 5.5V, Start-Up 1.2 -- -- -- 100 -- -- −70 -- -- −50 -- -- 165 -- EN Threshold Logic-Low Voltage Logic-High Voltage V IH Output Noise Voltage eNO Power Supply Rejection Rate PSRR f = 100Hz f = 10kHz Thermal Shutdown Temperature DS9193T-06 April 2011 T SD 10Hz to 100kHz, IOUT = 200mA COUT = 1uF COUT = 1uF, IOUT = 10mA V uVRMS dB °C www.richtek.com 3 RT9193T Parameter Thermal Shutdown Temperature Hysteresis Symbol Test Conditions ΔTSD Thermal Folded Back Min Typ Max Unit -- 30 -- °C -- 110 -- °C Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θ JA is measured in the natural convection at T A = 25°C on a low effective thermal conductivity test board (Single Layer, 1S) of JEDEC 51-3 thermal measurement standard. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV. www.richtek.com 4 DS9193T-06 April 2011 RT9193T Typical Operating Characteristics Output Voltage vs. Temperature 1.8 RT9193T-15PU5 VIN = 3.3V CIN = COUT = 1uF X7R RT9193T-15PU5 VIN = 3.3V CIN = COUT = 1uF X7R 90 Quiescent Current (uA) 1.7 Output Voltage (V) Quiescent Current vs. Temperature 95 1.6 1.5 1.4 1.3 85 80 75 70 65 1.2 60 -50 -25 0 25 50 75 100 125 -50 -25 0 Dropout Voltage vs. Load Current TJ = 125°C 250 200 100 125 VIN = 4V to 5V CIN = COUT = 1uF, X7R 0 TJ = 25°C 150 TJ = -40°C -20 -40 100 ILOAD = 100mA -60 50 -80 0 0 0.05 0.1 0.15 0.2 0.25 0.3 ILOAD = 10mA 10 0.01 100 0.1 1K 1 10K 10 100K 100 Load Current (A) Frequency (Hz) (kHz) EN Pin Shoutdown Threshold vs. Temperature EN Pin Shutdown Response 1.5 RT9193T-15PU5 VIN = 3.3V CIN = COUT = 1uF X7R EN Pin Voltage (V) 1.75 1.25 Output Voltage (V) EN Pin Shoutdown Threshold (V) 75 PSRR 20 PSRR (dB) Dropout Voltage (mV) RT9193T-33PB CIN = COUT = 1uF 50 Temperature (°C) Temperature (°C) 300 25 1 0.75 10 VIN = 5V CIN = COUT = 1uF 1M 1000 RT9193T-28PU5 No Load 5 0 2 1 0 0.5 -50 -25 0 25 50 75 100 125 Time (500μs/Div) Temperature (°C) DS9193T-06 April 2011 www.richtek.com 5 RT9193T Load Transient Response VIN = 5V, VOUT = 2.8V CIN = COUT = 1uF 50 Output Voltage Deviation (mV) 0 20 0 -20 6 200 0 50 0 -50 Line Transient Response Line Transient Response VIN = 4V to 5V COUT = 1uF RT9193T-25PB ILOAD = 1mA Output Voltage Deviation (mV) 4 10 0 -10 6 VIN = 4V to 5V COUT = 1uF RT9193T-25PB ILOAD = 100mA 5 4 10 0 -10 Time (50μs/Div) Time (100μs/Div) Noise Noise RT9193T-30PB ILOAD = 50mA VIN = 4.5V CIN = COUT = 1uF, X7R 200 100 100 Noise (μV) 200 0 -100 -200 RT9193T-15PU5 ILOAD = 50mA 0 -100 -200 f = 10Hz to 100kHz Time (10ms/Div) www.richtek.com 6 ILOAD = 1mA to 250mA Time (500μs/Div) 5 Output Voltage Deviation (mV) VIN = 5V, VOUT = 2.8V 400 CIN = COUT = 1uF Time (500μs/Div) VIN = 4.5V CIN = COUT = 1uF, X7R Noise (μV) ILOAD = 1mA to 60mA Load Current (mA) 100 Input Voltage Deviation (V) Input Voltage Deviation (V) Output Voltage Deviation (mV) Load Current (mA) Load Transient Response f = 10Hz to 100kHz Time (10ms/Div) DS9193T-06 April 2011 RT9193T Output Voltage (V) EN Pin Voltage (V) Start Up 10 VIN = 5V CIN = COUT = 1uF RT9193T-28PU5 No Load 5 0 2 1 0 Time (10μs/Div) DS9193T-06 April 2011 www.richtek.com 7 RT9193T Applications Information Like any low-dropout regulator, the external capacitors used with the RT9193T must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 1μF on the RT9193T input and the amount of capacitance can be increased without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR and line-transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all LDOs application. The RT9193T is designed specifically to work with low ESR ceramic output capacitor in space-saving and performance consideration. Using a ceramic capacitor whose value is at least 1μF with ESR is > 25mΩ on the RT9193T output ensures stability. The RT9193T still works well with output capacitor of other types due to the wide stable ESR range. Figure 1 shows the curves of allowable ESR range as a function of load current for various output capacitor values. Output capacitor of larger capacitance can reduce noise and improve load transient response, stability, and PSRR. The output capacitor should be located not more than 0.5 inch from the VOUT pin of the RT9193T and returned to a clean analog ground. Region of Stable COUT ESR vs. Load Current 100.00 100 Instable C OUT ESR (Ω) 10 10.00 Connecting a 22nF between the BP pin and GND pin significantly reduces noise on the regulator output, it is critical that the capacitor connection between the BP pin and GND pin be direct and PCB traces should be as short as possible. There is a relationship between the bypass capacitor value and the LDO regulator turn on time. DC leakage on this pin can affect the LDO regulator output noise and voltage regulation performance. Enable Function The RT9193T features an LDO regulator enable/disable function. To assure the LDO regulator will switch on, the EN turn on control level must be greater than 1.2 volts. The LDO regulator will go into the shutdown mode when the voltage on the EN pin falls below 0.4 volts. For to protecting the system, the RT9193T have a quickdischarge function. If the enable function is not needed in a specific application, it may be tied to VIN to keep the LDO regulator in a continuously on state. Thermal Considerations Thermal protection limits power dissipation in RT9193T. When the operation junction temperature exceeds 165°C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turn on again after the junction temperature cools by 30°C. RT9193T lowers its OTP trip level from 165°C to 110°C when output short circuit occurs (VOUT < 0.4V) as shown in Figure 2. This limits IC case temperature under 100°C and provides maximum safety to end users when output short circuit occurs. For continue operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is : 1 1.00 Stable 0.10 Bypass Capacitor and Low Noise PD = (VIN−VOUT) x IOUT + VIN x IQ 0.01 Simulation Verify RT9193T-15PU5 CIN = COUT = 1uF, X7R 0.00 0 50 100 150 200 Load Current (mA) Figure 1 www.richtek.com 8 250 300 The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : DS9193T-06 April 2011 RT9193T PD(MAX) = ( TJ(MAX) − TA ) /θJA 700 For recommended operating conditions specification of RT9193T, where T J(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for SOT-23-5 package is 250°C/W, SC-70-5 package is 333°C/W and WDFN-6L 2x2 package is 165°C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : PD(MAX) = (125°C−25°C) / 333 = 300mW (SC-70-5) WDFN-6L 2x2 Power Dissipation (mW) Where T J(MAX) is the maximum operation junction temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. 600 500 SOT-23-5 400 SC 70-5 300 200 100 0 0 25 50 75 100 125 150 Ambient Temperature (°C) Figure 3. Derating Curve for Packages PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT-23-5) PD(MAX) = (125°C−25°C) / 165 = 606mW (WDFN-6L 2x2) The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. For RT9193T packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. VOUT Short to GND 0.4V VOUT IOUT TSD 165 °C 110 C ° OTP Trip Point 110 °C IC Temperature 80 °C Figure 2. Short Circuit Thermal Folded Back Protection when Output Short Circuit Occurs DS9193T-06 April 2011 www.richtek.com 9 RT9193T Outline Dimension H D L B C b A A1 e Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.800 1.100 0.031 0.044 A1 0.000 0.100 0.000 0.004 B 1.150 1.350 0.045 0.054 b 0.150 0.400 0.006 0.016 C 1.800 2.450 0.071 0.096 D 1.800 2.250 0.071 0.089 e 0.650 0.026 H 0.080 0.260 0.003 0.010 L 0.210 0.460 0.008 0.018 SC-70-5 Surface Mount Package www.richtek.com 10 DS9193T-06 April 2011 RT9193T H D L B C b A A1 e Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.889 1.295 0.035 0.051 A1 0.000 0.152 0.000 0.006 B 1.397 1.803 0.055 0.071 b 0.356 0.559 0.014 0.022 C 2.591 2.997 0.102 0.118 D 2.692 3.099 0.106 0.122 e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024 SOT-23-5 Surface Mount Package DS9193T-06 April 2011 www.richtek.com 11 RT9193T D2 D L E E2 1 e b A A1 SEE DETAIL A 2 1 2 1 A3 DETAIL A Pin #1 ID and Tie Bar Mark Options Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.350 0.008 0.014 D 1.950 2.050 0.077 0.081 D2 1.000 1.450 0.039 0.057 E 1.950 2.050 0.077 0.081 E2 0.500 0.850 0.020 0.033 e L 0.650 0.300 0.026 0.400 0.012 0.016 W-Type 6L DFN 2x2 Package Richtek Technology Corporation Richtek Technology Corporation Headquarter Taipei Office (Marketing) 5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377 Email: [email protected] Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. www.richtek.com 12 DS9193T-06 April 2011