Reliability Data Report Product Family R303 LT1300/01/02/03/04/05/06/07/08/09/10 LT1610/14/15/16/17/18/83 LT1738 LT1930/31/32/34/35/36/37/76/77 LT3462/63/66/68/70/73/74/76/77 LT3501/10 LT3782 Reliability Data Report Report Number: R303 Report generated on: Wed Sep 19 10:10:07 PDT 2012 OPERATING LIFE TEST PACKAGE TYPE SIDEBRAZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP Totals SAMPLE SIZE 77 819 1606 233 2256 4,991 OLDEST DATE NEWEST DATE CODE CODE 9613 0421 0040 9312 9519 - 9613 1019 1209 9513 1201 - K DEVICE No. of FAILURES HRS (125°C) 1 38 1714 2125 232 2325 6,434 2,3 0 0 0 0 0 0 HIGHLY ACCELERATED STRESS TEST AT +131 DEG C / 85% RH PACKAGE TYPE SOIC/SOT/MSOP Totals SAMPLE SIZE 205 205 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES 4 CODE CODE HOURS (+85°C) 9426 - 0340 - 319 319 0 0 No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP Totals 4994 17287 1342 52845 76,468 OLDEST DATE NEWEST DATE K DEVICE CODE CODE HOURS 0112 9933 9516 9501 - 1125 1124 9845 1123 - 578 1113 346 4607 6,644 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0112 9445 9417 9428 - 1129 1124 1123 0049 - 1850 3875 14287 25 20,037 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0112 9933 9417 9417 - 1119 1124 9845 1123 - 1436 3539 96 11721 16,792 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/SOT/MSOP PLASTIC DIP Totals 5411 17842 67609 250 91,112 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP Totals 5270 17994 190 43765 67,219 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.28 FITS (3) Mean Time Between Failure in Years = 400652.25 (4) Assumes 20X Acceleration from 85 °C to +131 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning 0 0 0 0 0 Reliability Data Report Report Number: R303 Report generated on: Wed Sep 19 10:10:07 PDT 2012 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN Totals 50 50 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE HOURS 0826 - 0826 - 50 50 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE HOURS 1127 1004 0836 - 1129 1004 1018 - 233 150 1315 1,698 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/SOT/MSOP Totals 233 150 1415 1,798 0 0 0 0