Rev: 002 ISSUE NO : Product Family Data Sheet LM362A - CRI 90 Introduction Features Beam Angle: 120˚ Precondition : JEDEC Level 2a Dimension : 3.6 x 2.3 x 0.6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do 446-711, KOREA Copyright © 2009-2011 SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to change without notice. SAMSUNG, http://www.samsungled.com is a registered trademark of SAMSUNG ELECTRONICS. 1 / 47 Contents 1. Product Code Information ----------------------- 3 2. Luminous Flux Characteristics ----------------------- 7 3. Characteristics ----------------------- 9 4. Typical Characteristics Graph ----------------------- 10 5. Outline Drawing & Dimension ----------------------- 15 6. Reliability Test Items & Conditions ----------------------- 16 7. Solder Conditions ----------------------- 17 8. Tape & Reel ----------------------- 18 9. Label Structure ----------------------- 19 10. Packing Structure ----------------------- 20 11. Precaution For Use ----------------------- 22 12. Hazard Substance Analysis Report ----------------------- 25 13. Revision History ----------------------- 47 http://www.samsungled.com 2 / 47 1. Product Code Information 1) Luminous Flux Bins (Ts = 25℃) Sorting Condition lm @100mA Nominal CCT Product Code Flux Rank Flux Bin Intensity Range (cd) Flux Range (Φv, lm) 2700K 3000K 3500K 4000K SPMWHT325AD7YBW0S0 SPMWHT325AD7YBV0S0 SPMWHT325AD7YBU0S0 SPMWHT325AD7YBT0S0 S0 S0 S0 S0 S1 48.00 ~ 53.00 S2 53.00 ~ 58.00 S3 58.00 ~ 63.00 S1 50.00 ~ 55.00 S2 55.00 ~ 60.00 S3 60.00 ~ 65.00 S1 52.00 ~ 57.00 S2 57.00 ~ 62.00 S3 62.00 ~ 67.00 S1 54.00 ~ 59.00 S2 59.00 ~ 64.00 S3 64.00 ~ 69.00 Notes: 1) Luminous Intensity(Iv, cd) values are for representative reference only 2) SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurement 2) Color Bins (Ts = 25℃) 1) Color Binning Nominal Product Code Color Rank 2700K SPMWHT325AD7YBW0S0 W0 (Whole Bin) 3000K SPMWHT325AD7YBV0S0 V0 (Whole Bin) 3500K SPMWHT325AD7YBU0S0 U0 (Whole Bin) 4000K SPMWHT325AD7YBT0S0 T0 (Whole Bin) CCT http://www.samsungled.com Chromaticity Bins W1,W2,W3,W4,W5,W6,W7,W8, W9,WA,WB,WC,WD,WE,WF,WG V1,V2,V3,V4,V5,V6,V7,V8, V9,VA,VB,VC,VD,VE,VF,VG U1,U2,U3,U4,U5,U6,U7,U8, U9,UA,UB,UC,UD,UE,UF,UG T1,T2,T3,T4,T5,T6,T7,T8, T9,TA,TB,TC,TD,TE,TF,TG 3 / 47 2) Chromaticity Region & Coordinates http://www.samsungled.com 4 / 47 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) V rank (3000K) 0.4373 0.3893 W1 W2 W3 W4 W5 W6 W7 W8 0.4418 0.3981 0.4475 0.3994 0.4465 0.4071 W9 0.4513 0.4164 0.4573 0.4178 0.4147 0.3814 V1 0.4183 0.3898 0.4242 0.3919 0.4221 0.3984 V9 0.4259 0.4073 0.4322 0.4096 0.4428 0.3906 0.4523 0.4085 0.4203 0.3833 0.4281 0.4006 0.4428 0.3906 0.4523 0.4085 0.4203 0.3833 0.4281 0.4006 0.4475 0.3994 0.4532 0.4008 WA 0.4573 0.4178 0.4634 0.4193 V2 0.4242 0.3919 0.4300 0.3939 VA 0.4322 0.4096 0.4385 0.4119 0.4483 0.3919 0.4582 0.4099 0.4259 0.3853 0.4342 0.4028 0.4483 0.3919 0.4582 0.4099 0.4259 0.3853 0.4342 0.4028 0.4532 0.4008 0.4589 0.4021 WB 0.4634 0.4193 0.4695 0.4207 V3 0.4300 0.3939 0.4359 0.3960 VB 0.4385 0.4119 0.4449 0.4141 0.4538 0.3931 0.4641 0.4112 0.4316 0.3873 0.4403 0.4049 0.4538 0.3931 0.4641 0.4112 0.4316 0.3873 0.4403 0.4049 0.4589 0.4021 0.4646 0.4034 WC 0.4695 0.4207 0.4756 0.4221 V4 0.4359 0.3960 0.4418 0.3981 VC 0.4449 0.4141 0.4513 0.4164 0.4593 0.3944 0.4700 0.4126 0.4373 0.3893 0.4465 0.4071 0.4418 0.3981 0.4513 0.4164 0.4183 0.3898 0.4259 0.4073 0.4465 0.4071 0.4523 0.4085 WD 0.4562 0.4260 0.4624 0.4274 V5 0.4221 0.3984 0.4281 0.4006 VD 0.4299 0.4165 0.4364 0.4188 0.4475 0.3994 0.4573 0.4178 0.4242 0.3919 0.4322 0.4096 0.4475 0.3994 0.4573 0.4178 0.4242 0.3919 0.4322 0.4096 0.4523 0.4085 0.4582 0.4099 WE 0.4624 0.4274 0.4687 0.4289 V6 0.4281 0.4006 0.4342 0.4028 VE 0.4364 0.4188 0.4430 0.4212 0.4532 0.4008 0.4634 0.4193 0.4300 0.3939 0.4385 0.4119 0.4532 0.4008 0.4634 0.4193 0.4300 0.3939 0.4385 0.4119 0.4582 0.4099 0.4641 0.4112 WF 0.4687 0.4289 0.4750 0.4304 V7 0.4342 0.4028 0.4403 0.4049 VF 0.4430 0.4212 0.4496 0.4236 0.4589 0.4021 0.4695 0.4207 0.4359 0.3960 0.4449 0.4141 0.4589 0.4021 0.4695 0.4207 0.4359 0.3960 0.4449 0.4141 0.4641 0.4112 0.4700 0.4126 0.4646 0.4034 http://www.samsungled.com WG 0.4750 0.4304 0.4813 0.4319 0.4756 0.4221 V8 0.4403 0.4049 0.4465 0.4071 0.4418 0.3981 VG 0.4496 0.4236 0.4562 0.4260 0.4513 0.4164 5 / 47 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) T rank (4000K) 0.3889 0.3690 U1 U2 0.3953 0.3720 0.3981 0.3800 U4 U5 U6 U7 U8 U9 0.4010 0.3882 0.4040 0.3966 0.3670 0.3578 T1 0.3726 0.3612 0.3744 0.3685 0.3702 0.3722 T9 0.3763 0.3760 0.3782 0.3837 0.3915 0.3768 0.3968 0.3930 0.3686 0.3649 0.3719 0.3797 0.3953 0.3720 0.4010 0.3882 0.3726 0.3612 0.3763 0.3760 0.4017 0.3751 0.4048 0.3832 0.3981 U3 0.3941 0.3848 UA 0.4080 0.3916 0.4113 0.4001 T2 0.3783 0.3646 0.3804 0.3721 TA 0.3825 0.3798 0.3847 0.3877 0.380 0.4040 0.3966 0.3744 0.3685 0.3782 0.3837 0.4017 0.3751 0.4080 0.3916 0.3783 0.3646 0.3825 0.3798 0.4082 0.3782 0.4116 0.3865 UB 0.4150 0.3950 0.4186 0.4037 T3 0.3840 0.3681 0.3863 0.3758 TB 0.3887 0.3836 0.3912 0.3917 0.4048 0.3832 0.4113 0.4001 0.3804 0.3721 0.3847 0.3877 0.4082 0.3782 0.4150 0.3950 0.3840 0.3681 0.3887 0.3837 0.4147 0.3814 0.4183 0.3898 UC 0.4221 0.3984 0.4259 0.4073 T4 0.3898 0.3716 0.3924 0.3794 TC 0.3950 0.3875 0.3978 0.3958 0.4116 0.3865 0.4186 0.4037 0.3863 0.3758 0.3912 0.3917 0.3915 0.3768 0.3968 0.3930 0.3686 0.3649 0.3719 0.3797 0.3981 0.3800 0.4010 0.3882 UD 0.4040 0.3966 0.4071 0.4052 T5 0.3744 0.3685 0.3763 0.3760 TD 0.3782 0.3837 0.3802 0.3916 0.3941 0.3848 0.3996 0.4015 0.3702 0.3722 0.3736 0.3874 0.3981 0.3800 0.4040 0.3966 0.3744 0.3685 0.3782 0.3837 0.4048 0.3832 0.4080 0.3916 UE 0.4113 0.4001 0.4146 0.4089 T6 0.3804 0.3721 0.3825 0.3798 TE 0.3847 0.3877 0.3869 0.3958 0.4011 0.3882 0.4071 0.4052 0.3763 0.3760 0.3802 0.3916 0.4048 0.3832 0.4113 0.4001 0.3804 0.3721 0.3847 0.3877 0.4116 0.3865 0.4150 0.3950 UF 0.4186 0.4037 0.4222 0.4127 T7 0.3863 0.3758 0.3887 0.3836 TF 0.3912 0.3917 0.3937 0.4001 0.4080 0.3916 0.4146 0.4089 0.3825 0.3798 0.3869 0.3958 0.4116 0.3865 0.4186 0.4037 0.3863 0.3758 0.3912 0.3917 0.4183 0.3898 0.4221 0.3984 0.4150 0.3950 http://www.samsungled.com UG 0.4259 0.4073 0.4299 0.4165 0.4222 0.4127 T8 0.3924 0.3794 0.3950 0.3875 0.3887 0.3836 TG 0.3978 0.3958 0.4006 0.4044 0.3937 0.4001 6 / 47 2. Luminous Flux Characteristics (Ts = 25℃) Nominal Minimum CCT CRI1) 2700K 3000K If(mA) Vf(V) Power(W) Flux(lm) lm/W 50 5.71 0.29 32 109 100 5.96 0.60 58 96 110 5.99 0.66 62 94 120 6.03 0.72 67 93 130 6.06 0.79 71 90 140 6.09 0.85 75 86 150 6.11 0.92 79 85 160 6.14 0.98 83 83 170 6.17 1.05 87 81 180 6.20 1.12 91 80 190 6.23 1.18 94 80 200 6.27 1.25 98 78 50 5.71 0.29 33 112 100 5.96 0.60 59 99 110 5.99 0.66 64 97 120 6.03 0.72 69 95 130 6.06 0.79 73 93 140 6.09 0.85 77 91 150 6.11 0.92 81 88 160 6.14 0.98 86 87 170 6.17 1.05 90 85 180 6.20 1.12 94 84 190 6.23 1.18 97 82 200 6.27 1.25 101 80 90 90 http://www.samsungled.com 7 / 47 2. Luminous Flux Characteristics (Ts = 25℃) Nominal Minimum CCT CRI1) 3500K 4000K If(mA) Vf(V) Power(W) Flux(lm) lm/W 50 5.71 0.29 34 116 100 5.96 0.60 61 102 110 5.99 0.66 66 100 120 6.03 0.72 71 98 130 6.06 0.79 75 95 140 6.09 0.85 80 94 150 6.11 0.92 84 91 160 6.14 0.98 88 90 170 6.17 1.05 92 88 180 6.20 1.12 96 86 190 6.23 1.18 100 85 200 6.27 1.25 104 83 50 5.71 0.29 35 119 100 5.96 0.60 63 105 110 5.99 0.66 68 103 120 6.03 0.72 73 101 130 6.06 0.79 78 98 140 6.09 0.85 72 97 150 6.11 0.92 76 94 160 6.14 0.98 91 93 170 6.17 1.05 95 91 180 6.20 1.12 99 89 190 6.23 1.18 103 87 200 6.27 1.25 107 85 90 90 http://www.samsungled.com 8 / 47 3. Characteristics 1) Absolute Maximum Rating Item Operating temperature range Storage temperature range LED junction temperature Forward Current Peak Pulsed Forward Current Thermal resistance Assembly Process Temperature ESD Symbol Rating Top Tstg TJ IF IFP Rth, j-s - -40℃ ~ +85℃ -40℃ ~ +100℃ 125℃ 200 mA 400 mA 15℃/W 260℃, < 10sec 5kV Condition Duty 1/10 pulse width 10ms Junction to solder point HBM 2) Electro-optical Characteristics - Voltage and CRI Item Unit Forward Voltage (@100 mA, Tj = 25℃) V Reverse Voltage (@5 mA, Tj = 25℃) Color Rendering Index Special CRI4) (R9) V Ra - Rank A1 A2 YB A3 A4 A5 7 - Min Typ Max 5.6 5.8 6.0 6.2 6.4 0.7 90 50 - 5.8 6.0 6.2 6.4 6.6 1.2 - Notes: 1)~2) SAMSUNG ELECTRONICS maintains a tolerance of VF:±0.1 V, Ra :±3.0 on measurements 3) Electro-optical Characteristics - Luminous Intensity and Flux Item Luminous Flux (@100 mA, Ts = 25℃) Unit CCT Rank 2700K S0 3000K S0 3500K S0 4000K S0 lm S1 S2 S3 S1 S2 S3 S1 S2 S3 S1 S2 S3 Min Typ Max 48.0 53.0 58.0 50.0 55.0 60.0 52.0 57.0 62.0 54.0 59.0 64.0 - 53.0 58.0 63.0 55.0 60.0 65.0 57.0 62.0 67.0 59.0 64.0 69.0 Notes: Luminous Intensity(Iv, cd) values are for representative reference only http://www.samsungled.com 9 / 47 4. Typical Characteristics Graph 1) Spectrum Distribution (Ts = 25℃) 2700K & 3000K 3500K & 4000K http://www.samsungled.com 10 / 47 2) Forward Current Characteristics (Ts = 25℃) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage http://www.samsungled.com 11 / 47 3) Temperature Characteristics Relative Flux vs. Ts(solder temp.) @ 100mA Forward Voltage vs. Ts(solder temp.) @ 100mA http://www.samsungled.com 12 / 47 4) Color shift Characteristics Color x,y vs. Forward Current http://www.samsungled.com 13 / 47 5) Derating Curve (Ta = 25℃) Rj-a = 30℃/W Rj-a = 21℃/W Rj-a = 12℃/W 6) Viewing Angle Characteristics Viewing Angle http://www.samsungled.com 14 / 47 5. Outline Drawing and Dimension 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone ⓐ 3. Do not place pressure on the encapsulation resin ⓑ Recommended Land Pattern Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method ① Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of PCB to reach Ts point. ② Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions ① The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. ② Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. ③ Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs. http://www.samsungled.com 15 / 47 6. Reliability Test Items and Conditions 1) Test Items and Results Test Item Test Conditions Test Hours/Cycles Sample No MSL Test 125 ℃ 24hrs drying → 60 ℃, 60 %RH 120hrs → 260 ℃ 10sec 3 cycles 1 cycle 11 Room Temperature life test 25 ℃±3 ℃, DC200㎃ 1,000 hrs 22 High Temperature life test 85 ℃±3 ℃, DC200 ㎃ 1,000 hrs 22 High Temperature humidity life test 85℃±3 ℃, 85 %±2 %RH, DC200 ㎃ 1,000 hrs 22 Low Temperature life test -40 ℃±3 ℃, DC200 ㎃ 1,000 hrs 22 Power Temperature Cycle -40 ℃/20 min ↔ 85 ℃/20 min, Temp. change within 100min, on/off 5 min 100 cycles 50 Thermal Shock -45 ℃/15 min ↔ 125 ℃/15 min, Temp. change within 5min → Hot plate 180 ℃ 200 cycles 100 High Temperature Storage Ta=120 ℃±3 ℃ 1000 hrs 11 Low Temperature Storage Ta=-40 ℃±3 ℃ 1000 hrs 11 ESD(HBM) R1:10 ㏁, R2:1.5 ㏀, C:100 ㎊, V = ±5 kV 5 times 10 ESD(MM) R1:10 ㏁, R2:0, C:200 ㎊, V = ±0.5 kV 5 times 10 Vibration Test 100~2000~100 Hz, 200 m/s2, Sweep 4 min, X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Limit Test Condition Min Max Forward Voltage VF IF = 100 ㎃ Init. Value*0.9 Init. Value*1.1 Luminous Flux Im IF = 100 ㎃ Init. Value*0.8 Init. Value*1.2 http://www.samsungled.com 16 / 47 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 seconds @Max. 300℃, under soldering iron. http://www.samsungled.com 17 / 47 8. Tape And Reel Start End More than 40 ㎜ Mounted with More than (100~200)㎜ Leading part more than Unloaded tape Flash LED Unloaded tape (200~400)㎜ (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 ㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10° angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package. http://www.samsungled.com 18 / 47 9. Label Structure 1) Label Structure ⓐⓑⓒⓓⓔⓕ A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code Rank Code ⓐⓑ : Forward Voltage Rank ⓒⓓ : Chromaticity Coordinate Rank ⓔⓕ : Luminous Intensity Rank 2) LOT Number The Lot number is composed of the following characters A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 PCS ① : Production Site (S:SAMSUNG LED, G:GOSIN CHINA) ② : L (LED) ③ : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) ④ : Year (V:2011, W:2012, X:2013...) ⑤ : Month (1 ~ 9, A, B) ⑥ : Day (1 ~ 9, A, B ~ V) ⑦⑧⑨ : SAMSUNG Electronics LED Product number (1 ~ 999) ⓐⓑⓒ : Reel Number (1 ~ 999) http://www.samsungled.com 19 / 47 10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs LEVEL 2a IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Bag A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE 7inch SIZE(mm) Reels/ box ⓐ ⓑ ⓒ 245 220 182 Up to 10 Reels 245 220 86 Up to 5 Reels ① SIDE A1W1S1 ① SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII H CHIP LED [Box Label] W L http://www.samsungled.com 20 / 47 2) Aluminum Packing Bag A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag http://www.samsungled.com 21 / 47 11. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기 위해 저항 등의 설치를 권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며, 세정이 필요할 시에는 IPA 사용을 권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의 발광 시, 동작 전류는 주변 최고온도를 고려하여 결정되어야 함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(Shelf life of sealed bags: 12 months, temp. ~40℃, ~90%RH) LED의 보관은 청정한 환경에서 보존되어져야 하며, 만약 삼성전자로부터 공급받는 후 3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함. (보존 bag의 수명 : 12 개월, 보존 온도 ~40℃, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이 개봉된 후에, 납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의 사항에 부합되어야 함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30℃/60%RH, a. 제품은 30℃/60%RH보다 같거나 낮은 조립조건에서 672시간(28일)이내에 조립해야 함. b. Stored at <10%RH. b. 10% 이하의 상대습도에서 보관되어야 함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후, 건조한 장소에서 보관할 것을 권장함. http://www.samsungled.com 22 / 47 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5℃. 만약 습도표시카드의 수치가 23±5℃에서 60% 이상이라면, 제품 실장 전 baking해야 함. 8) Devices must be baked for 1 hour at 60±5℃, if baking is required. 만약 baking이 필요하다면, 제품은 60±5℃에서 1시간 정도 baking 되어야 함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기 방지장갑이나 손목밴드를 사용하기를 권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약 절대 허용치를 초과하는 전압이 LED에 가해지면, LED 소자는 파괴되거나 손상될 수 있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된 제품은 누설전류의 증가, Turn on 전압의 저하, 저 전류에서의 점등불량 등의 이상 거동을 보일 수 있음. 10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsualnt when they expose to heat or light. VOCs(휘발성 유기 화합물)는 등기구에 사용되는 접착제, Flux, 경화제, 유기물 첨가제에서 발생하여 LED 실리콘 봉지제를 투과하고, 빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixtures). 이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음. In order to prevent these problems, we recommend you to know the physical properties of the materials used in luminaires, They must be selected carefully. 이러한 문제 발생 방지를 위해서, 등기구에 사용되는 자재에 대한 물성을 알고 주의하여 선택 되어야함. http://www.samsungled.com 23 / 47 11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur(S), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이 황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로 바뀔 수 있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. 리드 프레임의 황화(Sulfurization)는 광량 저하, 색좌표 변화 및 심한 경우 LED 무등(Open) 불량을 일으킬 수도 있으니 주의가 필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, plain paper, lead solder cream and so on. 리드 프레임 황화(Sulfurization)의 근원이 될 수 있으니 LED는 아래의 목록으로 만들어진 산화성 물질들과 함께 저장, 사용이 불가함 : 고무, 일반 종이, 납땜 크림 등 http://www.samsungled.com 24 / 47 12. Hazard Substance Analysis Report http://www.samsungled.com 25 / 47 http://www.samsungled.com 26 / 47 http://www.samsungled.com 27 / 47 http://www.samsungled.com 28 / 47 http://www.samsungled.com 29 / 47 http://www.samsungled.com 30 / 47 http://www.samsungled.com 31 / 47 http://www.samsungled.com 32 / 47 http://www.samsungled.com 33 / 47 http://www.samsungled.com 34 / 47 http://www.samsungled.com 35 / 47 http://www.samsungled.com 36 / 47 http://www.samsungled.com 37 / 47 http://www.samsungled.com 38 / 47 http://www.samsungled.com 39 / 47 http://www.samsungled.com 40 / 47 http://www.samsungled.com 41 / 47 http://www.samsungled.com 42 / 47 http://www.samsungled.com 43 / 47 http://www.samsungled.com 44 / 47 http://www.samsungled.com 45 / 47 http://www.samsungled.com 46 / 47 Revision History Date No. Revision History 2014.02.05 001 2014.03.03 002 http://www.samsungled.com Writer Drawn Approved New version N.R.KIM S.B.YUN Out box 추가 N.R.KIM S.B.YUN 47 / 47