PCA9703 18 V tolerant SPI 16-bit GPI with maskable INT Rev. 4 — 5 September 2014 Product data sheet 1. General description The PCA9703 is a low power 18 V tolerant SPI General Purpose Input (GPI) shift register designed to monitor the status of switch inputs. It generates an interrupt when one or more of the switch inputs change state but allows selected inputs to not generate interrupts using the interrupt masking feature. The input level is recognized as a HIGH when it is greater than 0.8 VDD and as a LOW when it is less than 0.55 VDD (minimum LOW threshold of 2.5 V at 5 V node). The PCA9703 can monitor up to 16 switch inputs. The falling edge of the CS pin samples the input port status and clears the interrupt. When CS is LOW, the rising edge of the SCLK loads the shift register and shifts the value out of the shift register. The serial input is sampled on the falling edge of SCLK. The contents of the shift register are loaded into the interrupt mask register of the device on the rising edge of CS. Each of the input ports has a 18 V breakdown ESD protection circuit, which dumps the ESD/overvoltage current to ground. When used with a series resistor (minimum 100 k), the input can connect to a 12 V battery and support double battery, reverse battery, 27 V jump start and 40 V load dump conditions in automotive applications. Higher voltages can be tolerated on the inputs depending on the series resistor used to limit the input current. The INT_EN pin is used to both enable the GPI pins and to enable the INT output pin to minimize battery drain in cyclically supplied pull-up or pull-down applications. The SDIN pull-down prevents floating nodes when the device is used in daisy-chain applications. With both the high breakdown voltage and high ESD, this device is useful for both automotive (AEC-Q100 compliance available) and mobile applications. 2. Features and benefits 16 general purpose input ports 18 V tolerant input ports with 100 k external series resistor Input LOW threshold 0.55 VDD with minimum of 2.5 V at VDD = 4.5 V Open-drain interrupt output Interrupt enable pin (INT_EN) disables GPI pins and interrupt output Interrupt-masking feature allows no interrupt generation from selected inputs VDD range: 4.5 V to 5.5 V IDD is very low 2.5 A maximum SPI serial interface with speeds up to 5 MHz SPI supports daisy-chain connection for large switch numbers AEC-Q100 compliance available PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT ESD protection exceeds 5 kV HBM per JESD22-A114 and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA Operating temperature range: 40 C to +125 C Offered in TSSOP24 and HWQFN24 packages 3. Applications Automotive Body control modules Electronic control units (for example, for body controller) Switch monitoring SBC wake pin extension Industrial equipment Cellular telephones Emergency lighting 4. Ordering information Table 1. Ordering information Type number Topside marking Package PCA9703HF 9703 HWQFN24 plastic thermal enhanced very very thin quad flat package; SOT994-1 no leads; 24 terminals; body 4 4 0.75 mm PCA9703PW PCA9703PW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 PCA9703PW/Q900[1] PCA9703PW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 [1] Name Description Version PCA9703PW/Q900 is AEC-Q100 compliant. Contact [email protected] for PPAP. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 2 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 5. Block diagram VDD INT PCA9703 DFF0 IN1 INPUT DFF1 IN15 MASK REGISTER INPUT SHIFT REGISTER INT_EN IN0 SDOUT SDIN SCLK CS DFF15 INPUT INPUT STATUS REGISTER 20 μA 002aae021 VSS Fig 1. Block diagram of PCA9703 6. Pinning information 19 SCLK 20 SDIN 21 VDD 22 SDOUT terminal 1 index area 23 INT 24 INT_EN 6.1 Pinning SDOUT 1 24 VDD INT 2 23 SDIN INT_EN 3 22 SCLK IN0 1 18 CS IN0 4 21 CS IN1 2 17 IN15 IN1 5 20 IN15 IN2 3 16 IN14 IN2 6 IN3 4 15 IN13 IN3 7 IN4 5 14 IN12 IN4 8 17 IN12 IN5 6 13 IN11 IN5 9 16 IN11 IN6 10 15 IN10 IN7 11 14 IN9 VSS 12 13 IN8 IN10 12 IN9 11 IN8 10 9 VSS 8 IN7 IN6 7 PCA9703HF 002aae024 Transparent top view Fig 2. PCA9703 Product data sheet Pin configuration for HWQFN24 19 IN14 18 IN13 002aae023 Fig 3. All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 PCA9703PW PCA9703PW/Q900 Pin configuration for TSSOP24 © NXP B.V. 2014. All rights reserved. 3 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 6.2 Pin description Table 2. Pin description Symbol Pin Type Description TSSOP24 HWQFN24 SDOUT 1 22 output 3-state serial data output; normally high-impedance INT 2 23 output open-drain interrupt output (active LOW) INT_EN 3 24 input GPI pin enable and interrupt output enable 1 = GPI pin and interrupt output are enabled 0 = GPI pin and interrupt output are disabled and interrupt output is high-impedance IN0 4 1 input input port 0 IN1 5 2 input input port 1 IN2 6 3 input input port 2 IN3 7 4 input input port 3 IN4 8 5 input input port 4 IN5 9 6 input input port 5 IN6 10 7 input input port 6 IN7 11 8 input input port 7 VSS 12 9[1] ground ground supply IN8 13 10 input input port 8 IN9 14 11 input input port 9 IN10 15 12 input input port 10 IN11 16 13 input input port 11 IN12 17 14 input input port 12 IN13 18 15 input input port 13 IN14 19 16 input input port 14 IN15 20 17 input input port 15 CS 21 18 input chip select (active LOW) SCLK 22 19 input serial input clock SDIN 23 20 input serial data input (20 A pull-down) VDD 24 21 supply supply voltage [1] PCA9703 Product data sheet HWQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 4 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 7. Functional description PCA9703 is a 16-bit General Purpose Input (GPI) with an open-drain interrupt output designed to monitor switch status. By putting an external 100 k series resistor at the input port, the device allows the input to tolerate momentary double 12 V battery, reverse battery, 27 V jump start or 40 V load dump conditions. The interrupt output is asserted when an input port status changes, the input is not masked and the interrupt output is enabled. The open-drain interrupt output is enabled when INT_EN is HIGH and disabled when INT_EN is LOW. The INT_EN also enables the GPI pins when it is HIGH. In cyclically supplied pull-up or pull-down applications, the GPI pull-ups or pull-downs should be active before the INT_EN is taken HIGH and the INT output should only be sampled after transient conditions have settled. Additionally, interrupts can be disabled in software by using the interrupt mask feature. The input port status is accessed via the 4-wire SPI interface. Upon power-up, the power-up reset cell clears all the registers, resulting in all zeros in both the input status register and the interrupt mask register. Since a zero in the interrupt mask register masks the interrupt from that pin, there will not be any interrupts generated. After power-up it is necessary to access the PCA9703 through the SPI pins in order to activate the interrupt for any GPI pins. When the PCA9703 is read over the SPI wires, the input conditions are clocked into the input status register on the CS falling edge. Since the inputs and the input status register now match, no interrupt is generated and any pre-existing interrupt is cleared. The input status register data is parallel loaded into the shift register on the first rising edge of the SCLK. The serial input data is captured on the opposite clock edge so that there is a 1⁄2 clock cycle hold time. The set-up time is diminished by the propagation time so the SCLK falling edge to rising edge must be long enough to provide sufficient set-up time. Successive clock cycles on the SCLK pin clock the data out of the PCA9703 and new data from the SDIN into the shift register. There is no limit to the number of clock cycles that can be applied with the CS LOW, however sufficient clock cycles should be used to both shift out all of the GPI data and shift in the new interrupt mask data to the correct position with the MSB first before the CS rising edge. For cyclic switch bias applications the switch bias should be applied first, then after the input voltage is settled the general purpose inputs are switched on by taking the INT_EN HIGH. This also enables the interrupt output, which will only indicate an interrupt if the GPI data does not match the input status register on a bit that is enabled by the interrupt mask register value. If an interrupt is generated, the pull-up or pull-down source should remain active and the INT_EN should remain active and the SPI pins are used to update the input status register and read the data out. They are also used to store the new interrupt mask on the rising edge of CS. After the SPI transaction is complete the INT_EN is taken LOW to turn the inputs off and disable the INT output. Then the GPI pull-ups or pull-downs can be turned off. The GPI pins are specifically designed so that any ESD/overstress current flows to ground, not VDD. They are also specifically designed so that if the input voltage returns to the same value after pull-up or pull-down bias cycling as before the input pull-up or pull-down bias cycling, before the input is enabled it will be detected as the same state. If the Input Status register is read when INT_EN is LOW, the input state at the INT_EN transition will be output regardless of the actual input levels since the GPI pins are turned off. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 5 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT If the VDD falls below the 4.5 V minimum specified supply voltage, the input threshold will move down since they are a function of the VDD voltage. The input status register and the interrupt mask register retain their values to below VDD = 2.0 V and power-down can only be used to generate a power-up reset if the VDD falls below 0.2 V before returning to the operating range. Multiple PCA9703 devices can be serially connected for monitoring a large number of switches by connecting the SDOUT of one device to the SDIN of the next device. SCLK and CS must be common among all devices and interrupt outputs may be tied together. No external logic is necessary because all the devices’ interrupt outputs are open-drain that function as ‘wired-AND’ and can simply be connected together to a single pull-up resistor. 7.1 SPI bus operation The PCA9703 interfaces with the controller via the 4-wire SPI bus that is comprised of the following signals: chip select (CS), serial clock (SCLK), serial data in (SDIN), and serial data out (SDOUT). To access the device, the controller asserts CS LOW, then sends SCLK and SDIN. When reading is complete and the interrupt mask data is in place, the controller de-asserts CS. See Figure 4 for register access timing. 7.1.1 CS - chip select The CS pin is the device chip select and is an active LOW input. The falling edge of CS captures the input port status in the input status register. If the interrupt output is asserted, the falling edge of CS will clear the interrupt. When CS is LOW, the SPI interface is active. When CS transitions HIGH the interrupt mask is stored and when CS is HIGH, the SPI interface is disabled. 7.1.2 SCLK - serial clock input SCLK is the serial clock input to the device. It should be LOW and remain LOW during the falling and rising edge of CS. When CS is LOW, the first rising edge of SCLK parallel loads the shift register from the input status register. The subsequent rising edges on SCLK serially shifts data out from the shift register. The falling edge of SCLK samples the data on SDIN. 7.1.3 SDIN - serial data input SDIN is the serial data input port. The data is sampled into the shift register on the falling edge of SCLK. SDIN is only active when CS is LOW. This input has a 20 A pull-down current source to prevent the SDIN node from floating when CS is HIGH. 7.1.4 SDOUT - serial data output SDOUT is the serial data output signal. SDOUT is high-impedance when CS is HIGH and switches to low-impedance after CS goes LOW. When CS is LOW, after the first rising edge of SCLK the most significant bit in the shift register is presented on SDOUT. Subsequent rising edges of SCLK shift the remaining data from the shift register onto SDOUT. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 6 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 7.1.5 Register access timing Figure 4 shows the waveforms of the device operation. Initially CS is HIGH and SCLK is LOW. On the falling edge of CS, input port status, DATA[n:0] is captured into the input status register, and subsequently the first rising edge of SCLK parallel loads the shift register. The falling edge of SCLK samples the data on the SDIN. The MSB from the shift register is valid and available on the SDOUT after the first rising edge of SCLK. sample SDIN CS SCLK MSB in MSB − 1 in LSB in SDOUT MSB out MSB − 1 out LSB out shift register DATA[15:0] SDIN high-impedance input status register DATA[15:0] interrupt mask register 002aae286 DATA[15:0] is data on the input pins, IN[15:0]. Shaded areas indicate active but invalid data. Fig 4. Register access timing 7.1.6 Software reset operation Software reset will be activated by writing all zeroes into the shift register. This is identical to having an interrupt mask value of 0X00. Such an operation will reset the device, clear the input status register to zero and set the interrupt output to HIGH (no interrupt). 7.2 Interrupt output INT is the open-drain interrupt output and is active LOW. A pull-up resistor of approximately 10 k is recommended. A user-defined interrupt mask bit pattern is shifted into the shift register via SDIN. The value of bits in the mask pattern will determine which input pins will cause an interrupt. Any bit that is = 0 will disable the input pin corresponding to that bit position from generating an interrupt. Interrupts will be enabled for bits having value = 1. The mask bit pattern is not automatically aligned with the desired input pins. It is the responsibility of the programmer to shift the correct number of (mask) bits to the correct positions into the shift PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 7 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT register. The interrupt mask bit pattern must be positioned into the shift register prior to the CS rising edge. Misaligned mask pattern will result in unexpected activation of the interrupt signal. The interrupt output is asserted when the input status is changed, and the interrupt mask bit corresponding to the input pin that caused the change is unmasked (bit value = 1), and is cleared on the falling edge of CS or when the input port status matches the input status register. When there are multiple devices, the INT outputs may be tied together to a single pull-up. Table 3 illustrates the state of the interrupt output versus the state of the input port and input status register. The interrupt output is asserted when the input port and input status register differ. Table 3. Interrupt output function truth table H = HIGH; L = LOW; X = don’t care INT_EN Input port status Input status register[1] INT output[2] Mask bit = 1 (unmasked) Mask bit = 0 (masked) L H H H L H L H L H H H L L H H H H H H L X X H H [1] Input status register is the value or content of the D flip-flops. [2] Logic states shown for INT pin assumes 10 k pull-up resistor. 7.3 Interrupt enable INT_EN is the interrupt output enable input and the general purpose input enable input. It is an active HIGH input. When the INT_EN pin is LOW the GPI pins are turned off and the input state is saved to minimize power loss when the input pull-ups or pull-downs are cycled and the INT output is disabled. The cycled pull-ups or pull-downs should be active sufficiently long before the INT_EN is taken active that the GPI pin voltage is completely settled to prevent false or transient interrupt signals. 7.4 General Purpose Inputs The General Purpose Inputs (GPI) are designed to behave like a typical input in the 0 V to 5.5 V range, but are also designed to have low leakage currents at elevated voltages. The input structure allows for elevated voltages to be applied through a series resistor. The series resistor is required when the input voltage is above 5.5 V. The series resistor is required for two reasons: first, to prevent damage to the input avalanche diode, and second, to prevent the ESD protection circuitry from creating an excessive current flow. The ESD protection circuitry includes a latch-back style device, which provides excellent ESD protection during assembly or typical 5.5 V applications. The series resistor limits the current flowing into the part and provides additional ESD protection. The limited current prevents the ESD latch-back device from latching back to a low voltage, which would cause excessive current flow and damage the part when the input voltage is above 5.5 V. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 8 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT The minimum required series resistance for applications with input voltages above 5.5 V is 100 k. For applications requiring an applied voltage above 27 V, Equation 1 is recommended to determine the series resistor. Failure to include the appropriate input series resistor may result in product failure and will void the warranty. voltage applied – 17 V R s = -----------------------------------------------------------II (1) The series resistor should be place physically as close as possible to the connected input to reduce the effective node capacitance. The input response time is effected by the RC time constant of the series resistor and the input node capacitance. 7.4.1 VIL, VIH and switching points A minimum LOW threshold of 2.5 V is guaranteed for the logical switching points for the inputs. See Figure 5 for details. VI HIGH VDD 0.8VDD VIH VIL 0.55VDD hysteresis minimum = 0.04VDD possible ground shift LOW 0V 002aae101 Fig 5. Logic level thresholds The VIL is specified as a maximum of 0.55 VDD and is 2.5 V at 4.5 V VDD. This means that if the user applies 2.5 V or less to the input (with VDD = 4.5 V), or as the voltage passes this threshold, they will always see a LOW. The VIH is specified as a minimum of 0.8 VDD. This means that if the user applies 3.6 V or more to the input (with VDD = 4.5 V), or as the voltage passes this threshold, they will always see a HIGH. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 9 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 8. Application design-in information 8.1 General application 4.5 V to 5.5 V 18 V 1.5 kΩ 100 kΩ IN0 VDD 10 kΩ relay INT CS SCLK SDIN SDOUT 18 V CONTROLLER OR PROCESSOR 100 kΩ INT_EN IN1 180 V open PCA9703 500 kΩ IN2 50 kΩ 5V 10 kΩ IN15 VSS 002aae026 Fig 6. Typical application 8.2 Automotive application Supports: • • • • • PCA9703 Product data sheet 12 V battery (8 V to 16 V) Double battery (16 V to 32 V) Reverse battery (8 V to 16 V) Jump start (27 V for 60 seconds) Load dump (40 V) All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 10 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 8.2.1 SBC wake port extension with cyclic biasing System Basis Chips (SBC) offer many functions needed for in-vehicle networking solutions. Some of the features built into SBC are: • • • • Transceivers (HS-CAN, LIN 2.0) Scalable voltage regulators Watchdog timers; wake-up function Fail-safe function For more information on SBC, refer to www.nxp.com/products/interface_and_connectivity/system_basis_chips/. 8.2.1.1 UJA106x with PCA9703, standby V3 alternate PVR100AD-B5V0 UJA106x IN0 INT IN1 INT_EN PCA9703 V2 V1 GND VDD CS SDIN SDOUT SCLK IN15 WAKE VSS VCC CSN μC MOSI MISO SCLK GND 002aae027 Fig 7. • • • • UJA106x with PCA9703 with supplied microcontroller (standby) PCA9703 fits to SBC UJA106x and UJA107xA family PCA9703 can be powered by V1 of SBC Extends the SBC with 16 additional wake inputs C can be set to stop-mode during standby to save ECU standby current. SBC with GPI periodically monitors the wake inputs – Cyclic bias via V3 – Very low system current consumption even with clamped switches – Interrupt enable control via V2 PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 11 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 8.2.1.2 UJA107xA with PCA9703, standby and sleep alternate PDTA114E BAT 10 kΩ V1 1 kΩ 1 kΩ alternate PDTA144E 1 kΩ 100 kΩ WAKE1 WAKE2 RSTN V1 GND 47 kΩ 10 kΩ PCA9703 100 kΩ UJA107xA 47 kΩ VDD 100 kΩ WBIAS 10 kΩ INT INT_EN IN0 IN1 IN15 VSS 10 kΩ CS SDIN SDOUT SCLK VCC CSN μC MOSI MISO SCLK GND 002aae029 Fig 8. UJA107xA with PCA9703 with supplied microcontroller (standby) alternate PDTA114E BAT 10 kΩ 6.8 kΩ alternate PVR100AD-B5V0 WBIAS 10 kΩ UJA107xA 1 kΩ 470 nF 1 kΩ alternate PDTA144E 1 kΩ 47 kΩ 47 kΩ VDD 10 kΩ PCA9703 100 kΩ 100 kΩ 100 kΩ INT INT_EN IN0 IN1 IN15 VSS CS SDIN SDOUT SCLK 10 kΩ 10 kΩ alternate PDTC144T WAKE1 WAKE2 RSTN V1 GND 47 kΩ VCC CSN μC MOSI MISO SCLK GND 002aae972 Fig 9. UJA107xA with PCA9703 with supplied microcontroller (sleep) • UJA107xA SBC provides WBIAS pin for cyclic biasing of the inputs • Compatible with UJA107xA based ASSPs PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 12 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 8.2.2 Application examples including switches to battery BAT BAT switch bias switch bias IN0 IN0 IN1 IN1 PCA9703 PCA9703 IN15 clamp 15 IN15 002aae030 Fig 10. Clamp 15 (ignition) detection 002aae031 Fig 11. Switches to battery and ground with cyclic biasing 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Tamb = 40 C to +125 C, unless otherwise specified. Symbol Parameter Conditions Min Max Unit VDD supply voltage 0.5 +6.0 V II input current IN[15:0] pins with series resistor and VI > 5.5 V [1] - 350 A VI input voltage GPI pins IN[15:0]; no series resistor [1] 0.5 +6 V Tstg storage temperature Tj(max) maximum junction temperature SPI pins [1] operating 0.5 +6 V 65 +150 C - 125 C With GPI external series resistors, the inputs support double battery, reverse battery and load dump conditions. During double battery or load dump the input pin will drain slightly higher leakage current until the input drops to 18 V. For more detail of leakage current specification, please refer to Table 5 “Static characteristics”. See Section 7.4 for series resistor requirements. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 13 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 10. Static characteristics Table 5. Static characteristics VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +125 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 4.5 5.0 5.5 V VDD = 5.5 V; input = 5 V or 18 V; INT_EN = VDD - 1.0 2.5 A [1] - 1.8 2.2 V [2] - - 0.55VDD V 0.8VDD - - V - 70 - mV - - 100 A Supply VDD supply voltage IDD supply current VPOR power-on reset voltage General Purpose Inputs (IN0 to IN15) VIL LOW-level input voltage VIH HIGH-level input voltage Vhys hysteresis voltage VDD = 4.5 V [3] II input current GPI recommended maximum current; VI > 5.5 V; with series resistor Rs IIH HIGH-level input current each input; VI = VDD 1 - +1 A ILI input leakage current VI = 17 V; 100 k series resistor 1 - +1 A Ci input capacitance VI = VSS or VDD - 2.0 5.0 pF Interrupt output (INT) IOL LOW-level output current VDD = 4.5 V; VOL = 0.4 V 6 - - mA IOH HIGH-level output current VOH = VDD 1 - +1 A Co output capacitance - 2 5 pF SPI and control (SDOUT, SDIN, SCLK, CS, INT_EN) VIL LOW-level input voltage - - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IIH HIGH-level input current SDIN; VI = VDD = 5.5 V - 20 40 A IOL LOW-level output current SDOUT; VOL = 0.4 V; VDD = 4.5 V 5 - - mA IOH HIGH-level output current SDOUT; VOH = VDD 0.5 V; VDD = 4.5 V 5 11 - mA Ci input capacitance VI = VSS or VDD - 2 5 pF Co output capacitance SDOUT; CS = VDD - 4 6 pF [1] VDD must be lowered to 0.2 V for at least 5 s in order to reset device. [2] Minimum VIL is 2.5 V at VDD = 4.5 V. [3] For GPI pin voltages > 5.5 V, see Section 7.4. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 14 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 11. Dynamic characteristics Table 6. Dynamic characteristics VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +125 C; unless otherwise specified. Symbol Parameter Conditions fmax maximum input clock frequency Min Typ Max Unit - - 5 MHz tr rise time SDOUT; 10 % to 90 % at 5 V - 35 60 ns tf fall time SDOUT; 90 % to 10 % at 5 V - 25 50 ns tWH pulse width HIGH SCLK 50 - - ns tWL pulse width LOW SCLK 50 - - ns tSPILEAD SPI enable lead time CS falling edge to SCLK rising edge 50 - - ns tSPILAG SPI enable lag time SCLK falling edge to CS rising edge 50 - - ns tsu(SDIN) SDIN set-up time SDIN to SCLK falling edge 20 - - ns th(SDIN) SDIN hold time from SCLK falling edge 30 - - ns ten(SDOUT) SDOUT enable time from CS LOW to SDOUT low-impedance; Figure 15 - - 55 ns tdis(SDOUT) SDOUT disable time from rising edge of CS to SDOUT high-impedance; Figure 15 - - 85 ns tv(SDOUT) SDOUT valid time from rising edge of SCLK; Figure 16 - - 55 ns tsu(SCLK) SCLK set-up time SCLK falling to CS falling 50 - - ns th(SCLK) SCLK hold time SCLK rising after CS rising 50 - - ns tPOR power-on reset pulse time time before CS is active after VDD > VPOR - - 250 ns trel(int) interrupt release time after CS going LOW; Figure 17 - - 500 ns tv(INT) valid time on pin INT after INn changes or INT_EN goes HIGH - 200 800 ns CS tsu(SCLK) tSPILEAD tWH 50 % tsu(SDIN) SCLK tSPILAG tWL th(SCLK) 50 % th(SDIN) MSB in SDIN ten(SDOUT) tv(SDOUT) tdis(SDOUT) high-impedance MSB out SDOUT trel(int) INT 002aac428 Fig 12. Timing diagram PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 15 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 2.5 V VDD VPOR 0V CS SCLK SDOUT MSB − 1 MSB out tPOR 002aad158 Fig 13. AC waveform for tPOR timing CS INn STATE 0 STATE 1 STATE 0 INT_EN tv(INT) tv(INT) INT trel(int) trel(int) 002aaf294 Fig 14. AC waveform for INT timing PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 16 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 12. Test information VDD open VDD PULSE GENERATOR VI RL 10 kΩ VO DUT CL 50 pF RT 10 kΩ 002aac580 Fig 15. Test circuitry for enable/disable times, SDOUT (ten(SDOUT) and tdis(SDOUT)) VDD PULSE GENERATOR VI VO DUT CL 50 pF RT 002aac581 Fig 16. Test circuitry for switching times, SDOUT (tv(SDOUT)) VDD VDD PULSE GENERATOR VI RL 10 kΩ VO DUT CL 50 pF RT 002aac582 Fig 17. Test circuitry for switching times, INT RL = load resistance. CL = load capacitance includes jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generators. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 17 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 13. Package outline 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F +( \ Y 0 $ = 4 $ SLQLQGH[ $ $ $ ș /S / ES H GHWDLO; Z 0 PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = ș PP R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 5()(5(1&(6 ,(& -('(& -(,7$ (8523($1 352-(&7,21 ,668('$7( 02 Fig 18. Package outline SOT355-1 (TSSOP24) PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 18 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT +:4)1SODVWLFWKHUPDOHQKDQFHGYHU\YHU\WKLQTXDGIODWSDFNDJHQROHDGV WHUPLQDOVERG\[[PP % ' 627 $ WHUPLQDO LQGH[DUHD ( $ $ F GHWDLO; H H Y Z E H 0 0 & & $ % & \ & \ / H H (K H WHUPLQDO LQGH[DUHD ; 'K PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ E F ' 'K ( (K H H H / Y Z \ \ PP 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& -(,7$ 627 02 (8523($1 352-(&7,21 ,668('$7( Fig 19. Package outline SOT994-1 (HWQFN24) PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 19 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 20 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 20) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8 Table 7. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 8. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 20. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 21 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 20. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 22 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 15. Soldering: PCB footprints )RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI76623SDFNDJH 627 +[ *[ 3 +\ *\ %\ $\ & '[ ' 3 *HQHULFIRRWSULQWSDWWHUQ 5HIHUWRWKHSDFNDJHRXWOLQHGUDZLQJIRUDFWXDOOD\RXW VROGHUODQG RFFXSLHGDUHD ',0(16,216LQPP 3 3 $\ %\ & ' ' *[ *\ +[ +\ VRWBIU Fig 21. PCB footprint for SOT355-1 (TSSOP24); reflow soldering PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 23 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT )RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI+94)1SDFNDJH 627 +[ *[ ' 3 & 63[ Q63[ +\ 63\WRW 63\ *\ 6/\ Q63\ %\ $\ 63[WRW 6/[ %[ $[ *HQHULFIRRWSULQWSDWWHUQ 5HIHUWRWKHSDFNDJHRXWOLQHGUDZLQJIRUDFWXDOOD\RXW VROGHUODQG VROGHUSDVWHGHSRVLW VROGHUODQGSOXVVROGHUSDVWH RFFXSLHGDUHD Q63[ Q63\ 'LPHQVLRQVLQPP 3 $[ $\ %[ %\ & ' 6/[ 6/\ 63[WRW 63\WRW 63[ 63\ *[ *\ +[ +\ ,VVXHGDWH VRWBIU Fig 22. PCB footprint for SOT994-1 (HWQFN24); reflow soldering PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 24 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 16. Abbreviations Table 9. Abbreviations Acronym Description ASSP Application Specific Standard Product CAN Controller Area Network CDM Charged-Device Model DUT Device Under Test ECU Electronic Control Unit ESD ElectroStatic Discharge GPI General Purpose Input HBM Human Body Model HS-CAN High-Speed Controller Area Network LIN Local Interconnect Network MSB Most Significant Bit PCB Printed-Circuit Board PPAP Production Part Approval Process RC Resistor-Capacitor network SBC System Basis Chip SPI Serial Peripheral Interface C microcontroller 17. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9703 v.4 20140905 Product data sheet - PCA9703 v.3 Modifications: • Table 5, Vhys: Updated conditions, min, typ and unit. Removed table note [3]. Aligned to characterization data, no change to device. • Removed references to hysteresis in Section 2, Figure 5, Section 7.4.1. PCA9703 v.3 20140317 Product data sheet - PCA9703 v.2 PCA9703 v.2 20120614 Product data sheet - PCA9703 v.1 PCA9703 v.1 20100223 Product data sheet - - PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 25 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA9703 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 26 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCA9703 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 5 September 2014 © NXP B.V. 2014. All rights reserved. 27 of 28 PCA9703 NXP Semiconductors 18 V tolerant SPI 16-bit GPI with maskable INT 20. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.2 7.3 7.4 7.4.1 8 8.1 8.2 8.2.1 8.2.1.1 8.2.1.2 8.2.2 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 17 18 18.1 18.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 SPI bus operation . . . . . . . . . . . . . . . . . . . . . . . 6 CS - chip select . . . . . . . . . . . . . . . . . . . . . . . . 6 SCLK - serial clock input . . . . . . . . . . . . . . . . . 6 SDIN - serial data input. . . . . . . . . . . . . . . . . . . 6 SDOUT - serial data output . . . . . . . . . . . . . . . 6 Register access timing . . . . . . . . . . . . . . . . . . . 7 Software reset operation. . . . . . . . . . . . . . . . . . 7 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 7 Interrupt enable . . . . . . . . . . . . . . . . . . . . . . . . 8 General Purpose Inputs . . . . . . . . . . . . . . . . . . 8 VIL, VIH and switching points. . . . . . . . . . . . . . . 9 Application design-in information . . . . . . . . . 10 General application. . . . . . . . . . . . . . . . . . . . . 10 Automotive application . . . . . . . . . . . . . . . . . . 10 SBC wake port extension with cyclic biasing . 11 UJA106x with PCA9703, standby. . . . . . . . . . 11 UJA107xA with PCA9703, standby and sleep 12 Application examples including switches to battery. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering of SMD packages . . . . . . . . . . . . . . 20 Introduction to soldering . . . . . . . . . . . . . . . . . 20 Wave and reflow soldering . . . . . . . . . . . . . . . 20 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21 Soldering: PCB footprints. . . . . . . . . . . . . . . . 23 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 18.3 18.4 19 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 27 27 28 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 September 2014 Document identifier: PCA9703