PCA9555A Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Rev. 1 — 11 September 2012 Product data sheet 1. General description The PCA9555A is a low-voltage 16-bit General Purpose Input/Output (GPIO) expander with interrupt and weak pull-up resistors for I2C-bus/SMBus applications. NXP I/O expanders provide a simple solution when additional I/Os are needed while keeping interconnections to a minimum, for example, in ACPI power switches, sensors, push buttons, LEDs, fan control, etc. In addition to providing a flexible set of GPIOs, the wide VDD range of 1.65 V to 5.5 V allows the PCA9555A to interface with next-generation microprocessors and microcontrollers where supply levels are dropping down to conserve power. The PCA9555A contains the PCA9555 register set of four pairs of 8-bit Configuration, Input, Output, and Polarity Inversion registers. The PCA9555A is a pin-to-pin replacement to the PCA9555 and other industry-standard devices. A more fully featured device, the PCAL9555A, is available with Agile I/O features. See the respective data sheet for more details. The PCA9555A open-drain interrupt (INT) output is activated when any input state differs from its corresponding Input Port register state and is used to indicate to the system master that an input state has changed. INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. Thus, the PCA9555A can remain a simple slave device. The device outputs have 25 mA sink capabilities for directly driving LEDs while consuming low device current. The power-on reset sets the registers to their default values and initializes the device state machine. All input/output pins have weak pull-up resistors connected to them to eliminate external components. Three hardware pins (A0, A1, A2) select the fixed I2C-bus address and allow up to eight devices to share the same I2C-bus/SMBus. PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 2. Features and benefits I2C-bus to parallel port expander Operating power supply voltage range of 1.65 V to 5.5 V Low standby current consumption: 1.5 A (typical at 5 V VDD) 1.0 A (typical at 3.3 V VDD) Schmitt-trigger action allows slow input transition and better switching noise immunity at the SCL and SDA inputs Vhys = 0.10 VDD (typical) 5 V tolerant I/Os Open-drain active LOW interrupt output (INT) 400 kHz Fast-mode I2C-bus Internal power-on reset Power-up with all channels configured as inputs with weak pull-up resistors No glitch on power-up Latched outputs with 25 mA drive maximum capability for directly driving LEDs Latch-up performance exceeds 100 mA per JESD78, Class II ESD protection exceeds JESD22 2000 V Human Body Model (A114-A) 1000 V Charged-Device Model (C101) Packages offered: TSSOP24, HWQFN24 3. Ordering information Table 1. Ordering information Type number Package Name Description Version PCA9555APW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 PCA9555AHF HWQFN24 plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 4 0.75 mm SOT994-1 3.1 Ordering options Table 2. Ordering options Type number PCA9555A Product data sheet Topside mark Temperature range PCA9555APW PCA9555A 40 C to +85 C PCA9555AHF 555A 40 C to +85 C All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 2 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 4. Block diagram PCA9555A P1_0 P1_1 8-bit A0 P1_2 A1 A2 write pulse INPUT/ OUTPUT PORTS P1_3 P1_4 P1_5 P1_6 read pulse P1_7 I2C-BUS/SMBus CONTROL SCL P0_0 INPUT FILTER SDA P0_1 8-bit P0_2 write pulse INPUT/ OUTPUT PORTS P0_3 P0_4 P0_5 P0_6 read pulse VDD P0_7 POWER-ON RESET VDD VSS INT LP FILTER 002aaf807 Remark: All I/Os are set to inputs at reset. Fig 1. Block diagram of PCA9555A 5. Pinning information 5.1 Pinning terminal 1 index area 6 19 P1_6 P0_2 3 16 P1_6 P0_3 7 18 P1_5 P0_3 4 15 P1_5 P0_4 8 17 P1_4 P0_4 5 14 P1_4 P0_5 9 16 P1_3 P0_5 6 13 P1_3 P0_6 10 15 P1_2 P0_7 11 14 P1_1 VSS 12 13 P1_0 PCA9555APW Fig 2. Product data sheet Pin configuration for TSSOP24 002aaf806 Transparent top view Fig 3. All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 P1_2 12 17 P1_7 P0_2 P1_1 11 2 P1_0 10 18 A0 P0_1 9 1 20 P1_7 VSS P0_0 5 8 21 A0 P0_1 7 22 SCL 4 P0_7 3 P0_6 A2 P0_0 002aaf805 PCA9555A 19 SCL 23 SDA 20 SDA 2 21 VDD A1 22 INT 24 VDD 24 A2 1 23 A1 PCA9555AHF INT Pin configuration for HWQFN24 © NXP B.V. 2012. All rights reserved. 3 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 5.2 Pin description PCA9555A Product data sheet Table 3. Pin description Symbol Pin Type Description TSSOP24 HWQFN24 INT 1 22 O Interrupt output. Connect to VDD through a pull-up resistor. A1 2 23 I Address input 1. Connect directly to VDD or VSS. A2 3 24 I Address input 2. Connect directly to VDD or VSS. P0_0[2] 4 1 I/O Port 0 input/output 0. P0_1[2] 5 2 I/O Port 0 input/output 1. P0_2[2] 6 3 I/O Port 0 input/output 2. P0_3[2] 7 4 I/O Port 0 input/output 3. P0_4[2] 8 5 I/O Port 0 input/output 4. P0_5[2] 9 6 I/O Port 0 input/output 5. P0_6[2] 10 7 I/O Port 0 input/output 6. P0_7[2] 11 8 I/O Port 0 input/output 7. VSS 12 9[1] power Ground. P1_0[3] 13 10 I/O Port 1 input/output 0. P1_1[3] 14 11 I/O Port 1 input/output 1. P1_2[3] 15 12 I/O Port 1 input/output 2. P1_3[3] 16 13 I/O Port 1 input/output 3. P1_4[3] 17 14 I/O Port 1 input/output 4. P1_5[3] 18 15 I/O Port 1 input/output 5. P1_6[3] 19 16 I/O Port 1 input/output 6. P1_7[3] 20 17 I/O Port 1 input/output 7. A0 21 18 I Address input 0. Connect directly to VDD or VSS. SCL 22 19 I Serial clock bus. Connect to VDD through a pull-up resistor. SDA 23 20 I/O Serial data bus. Connect to VDD through a pull-up resistor. VDD 24 21 power Supply voltage. [1] HWQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. [2] Pins P0_0 to P0_7 correspond to bits P0.0 to P0.7. At power-up, all I/O are configured as high-impedance inputs. [3] Pins P1_0 to P1_7 correspond to bits P1.0 to P1.7. At power-up, all I/O are configured as high-impedance inputs. All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 4 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 6. Functional description Refer to Figure 1 “Block diagram of PCA9555A”. 6.1 Device address slave address 0 1 0 0 fixed A2 A1 A0 R/W hardware selectable 002aaf819 Fig 4. PCA9555A device address A2, A1 and A0 are the hardware address package pins and are held to either HIGH (logic 1) or LOW (logic 0) to assign one of the eight possible slave addresses. The last bit of the slave address (R/W) defines the operation (read or write) to be performed. A HIGH (logic 1) selects a read operation, while a LOW (logic 0) selects a write operation. 6.2 Registers 6.2.1 Pointer register and command byte Following the successful acknowledgement of the address byte, the bus master sends a command byte, which is stored in the Pointer register in the PCA9555A. The lower three bits of this data byte state the operation (read or write) and the internal registers (Input, Output, Polarity Inversion, or Configuration) that will be affected. This register is write only. B7 B6 B5 B4 B3 B2 B1 B0 002aaf540 Fig 5. Table 4. Pointer register bits Command byte Pointer register bits Command byte Register (hexadecimal) Protocol Power-up default Input port 0 read byte xxxx xxxx[1] 01h Input port 1 read byte xxxx xxxx 0 02h Output port 0 read/write byte 1111 1111 1 03h Output port 1 read/write byte 1111 1111 0 0 04h Polarity Inversion port 0 read/write byte 0000 0000 1 0 1 05h Polarity Inversion port 1 read/write byte 0000 0000 0 1 1 0 06h Configuration port 0 read/write byte 1111 1111 0 1 1 1 07h Configuration port 1 read/write byte 1111 1111 B7 B6 B5 B4 B3 B2 B1 B0 0 0 0 0 0 0 0 0 00h 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 [1] Undefined. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 5 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 6.2.2 Input port register pair (00h, 01h) The Input port registers (registers 0 and 1) reflect the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by the Configuration register. The Input port registers are read only; writes to these registers have no effect. The default value ‘X’ is determined by the externally applied logic level. An Input port register read operation is performed as described in Section 7.2 “Reading the port registers”. Table 5. Bit Input port 0 register (address 00h) 7 6 5 4 3 2 1 0 Symbol I0.7 I0.6 I0.5 I0.4 I0.3 I0.2 I0.1 I0.0 Default X X X X X X X X Table 6. Bit Input port 1 register (address 01h) 7 6 5 4 3 2 1 0 Symbol I1.7 I1.6 I1.5 I1.4 I1.3 I1.2 I1.1 I1.0 Default X X X X X X X X 6.2.3 Output port register pair (02h, 03h) The Output port registers (registers 2 and 3) show the outgoing logic levels of the pins defined as outputs by the Configuration register. Bit values in these registers have no effect on pins defined as inputs. In turn, reads from these registers reflect the value that was written to these registers, not the actual pin value. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 7. Bit 7 6 5 4 3 2 1 0 Symbol O0.7 O0.6 O0.5 O0.4 O0.3 O0.2 O0.1 O0.0 Default 1 1 1 1 1 1 1 1 Table 8. Bit PCA9555A Product data sheet Output port 0 register (address 02h) Output port 1 register (address 03h) 7 6 5 4 3 2 1 0 Symbol O1.7 O1.6 O1.5 O1.4 O1.3 O1.2 O1.1 O1.0 Default 1 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 6 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 6.2.4 Polarity inversion register pair (04h, 05h) The Polarity inversion registers (registers 4 and 5) allow polarity inversion of pins defined as inputs by the Configuration register. If a bit in these registers is set (written with ‘1’), the corresponding port pin’s polarity is inverted in the Input register. If a bit in this register is cleared (written with a ‘0’), the corresponding port pin’s polarity is retained. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 9. Bit Polarity inversion port 0 register (address 04h) 7 6 5 4 3 2 1 0 Symbol N0.7 N0.6 N0.5 N0.4 N0.3 N0.2 N0.1 N0.0 Default 0 0 0 0 0 0 0 0 Table 10. Bit Polarity inversion port 1 register (address 05h) 7 6 5 4 3 2 1 0 Symbol N1.7 N1.6 N1.5 N1.4 N1.3 N1.2 N1.1 N1.0 Default 0 0 0 0 0 0 0 0 6.2.5 Configuration register pair (06h, 07h) The Configuration registers (registers 6 and 7) configure the direction of the I/O pins. If a bit in these registers is set to 1, the corresponding port pin is enabled as a high-impedance input. If a bit in these registers is cleared to 0, the corresponding port pin is enabled as an output. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 11. Bit 7 6 5 4 3 2 1 0 Symbol C0.7 C0.6 C0.5 C0.4 C0.3 C0.2 C0.1 C0.0 Default 1 1 1 1 1 1 1 1 Table 12. Bit PCA9555A Product data sheet Configuration port 0 register (address 06h) Configuration port 1 register (address 07h) 7 6 5 4 3 2 1 0 Symbol C1.7 C1.6 C1.5 C1.4 C1.3 C1.2 C1.1 C1.0 Default 1 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 7 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 6.3 I/O port When an I/O is configured as an input, FETs Q1 and Q2 are off, which creates a high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, Q1 or Q2 is enabled, depending on the state of the Output port register. In this case, there are low-impedance paths between the I/O pin and either VDD or VSS. The external voltage applied to this I/O pin should not exceed the recommended levels for proper operation. data from shift register output port register data configuration register data from shift register D VDD Q1 Q FF write configuration pulse CK 100 kΩ Q D Q FF write pulse P0_0 to P0_7 P1_0 to P1_7 CK Q2 output port register input port register D Q FF read pulse CK VSS input port register data to INT polarity inversion register data from shift register D Q polarity inversion register data FF write polarity pulse CK 002aah328 At power-on reset, all registers return to default values. Fig 6. Simplified schematic of the I/Os (P0_0 to P0_7, P1_0 to P1_7) PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 8 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 6.4 Power-on reset When power (from 0 V) is applied to VDD, an internal power-on reset holds the PCA9555A in a reset condition until VDD has reached VPOR. At that time, the reset condition is released and the PCA9555A registers and I2C-bus/SMBus state machine initializes to their default states. After that, VDD must be lowered to below VPORF and back up to the operating voltage for a power-reset cycle. See Section 8.2 “Power-on reset requirements”. 6.5 Interrupt output An interrupt is generated by any rising or falling edge of the port inputs in the Input mode. After time tv(INT), the signal INT is valid. The interrupt is reset when data on the port changes back to the original value or when data is read form the port that generated the interrupt (see Figure 10 and Figure 11). Resetting occurs in the Read mode at the acknowledge (ACK) or not acknowledge (NACK) bit after the rising edge of the SCL signal. Interrupts that occur during the ACK or NACK clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Any change of the I/Os after resetting is detected and is transmitted as INT. A pin configured as an output cannot cause an interrupt. Changing an I/O from an output to an input may cause a false interrupt to occur, if the state of the pin does not match the contents of the Input Port register. 7. Bus transactions The PCA9555A is an I2C-bus slave device. Data is exchanged between the master and PCA9555A through write and read commands using I2C-bus. The two communication lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Writing to the port registers Data is transmitted to the PCA9555A by sending the device address and setting the least significant bit to a logic 0 (see Figure 4 “PCA9555A device address”). The command byte is sent after the address and determines which register will receive the data following the command byte. Eight registers within the PCA9555A are configured to operate as four register pairs. The four pairs are input port, output port, polarity inversion, configuration registers. After sending data to one register, the next data byte is sent to the other register in the pair (see Figure 7 and Figure 8). For example, if the first byte is sent to Output Port 1 (register 3), the next byte is stored in Output Port 0 (register 2). There is no limitation on the number of data bytes sent in one write transmission. In this way, the host can continuously update a register pair independently of the other registers, or the host can simply update a single register. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 9 of 39 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 data to port 0 command byte 0 A2 A1 A0 0 START condition R/W NXP Semiconductors PCA9555A Product data sheet 1 SCL A 0 0 0 0 0 0 1 0 acknowledge from slave A 0.7 data to port 1 0.0 A 1.7 DATA 0 acknowledge from slave DATA 1 1.0 A P STOP condition acknowledge from slave write to port tv(Q) data out from port 1 DATA VALID 002aah344 Fig 7. Write to output port registers SCL 1 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 0 A2 A1 A0 0 R/W A 0 0/1 0 acknowledge from slave 0 0/1 0/1 0/1 0/1 A MSB acknowledge from slave STOP condition data to register DATA 0 A LSB MSB acknowledge from slave DATA 1 A P LSB acknowledge from slave 002aah345 Fig 8. Write to Control registers PCA9555A 10 of 39 © NXP B.V. 2012. All rights reserved. START condition data to register command byte Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Rev. 1 — 11 September 2012 All information provided in this document is subject to legal disclaimers. tv(Q) data out from port 0 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 7.2 Reading the port registers In order to read data from the PCA9555A, the bus master must first send the PCA9555A address with the least significant bit set to a logic 0 (see Figure 4 “PCA9555A device address”). The command byte is sent after the address and determines which register will be accessed. After a restart, the device address is sent again, but this time the least significant bit is set to a logic 1. Data from the register defined by the command byte is sent by the PCA9555A (see Figure 9, Figure 10 and Figure 11). Data is clocked into the register on the falling edge of the acknowledge clock pulse. After the first byte is read, additional bytes may be read but the data now reflects the information in the other register in the pair. For example, if Input Port 1 is read, the next byte read is Input Port 0. There is no limit on the number of data bytes received in one read transmission, but on the final byte received the bus master must not acknowledge the data. After a subsequent restart, the command byte contains the value of the next register to be read in the pair. For example, if Input Port 1 was read last before the restart, the register that is read after the restart is the Input Port 0. command byte slave address SDA S 0 1 0 0 A2 A1 A0 0 START condition A 0 0/1 0 R/W data from lower or upper byte of register slave address 0 1 0 MSB 0 A2 A1 A0 1 (repeated) START condition (cont.) acknowledge from slave acknowledge from slave (cont.) S 0 0/1 0/1 0/1 0/1 A A data from upper or lower byte of register LSB DATA (first byte) R/W acknowledge from slave MSB A acknowledge from master LSB DATA (last byte) NA P no acknowledge from master at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter STOP condition 002aah346 Remark: Transfer can be stopped at any time by a STOP condition. Fig 9. Read from register PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 11 of 39 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors PCA9555A Product data sheet data into port 0 data into port 1 tv(INT) SCL 1 2 3 4 trst(INT) 5 6 slave address SDA S 0 1 0 7 8 0 A2 A1 A0 1 START condition 9 R/W I0.x A 7 6 5 acknowledge from slave 4 3 I1.x 2 1 0 A acknowledge from master 7 6 5 4 3 I0.x 2 1 0 A acknowledge from master 7 6 5 4 3 STOP condition I1.x 2 1 0 A acknowledge from master 7 6 5 4 3 2 1 0 1 P non acknowledge from master read from port 0 read from port 1 002aah347 This figure eliminates the command byte transfer and a restart between the initial slave address call and the actual data transfer from P port (see Figure 9). Fig 10. Read input port register, scenario 1 PCA9555A 12 of 39 © NXP B.V. 2012. All rights reserved. Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register). Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Rev. 1 — 11 September 2012 All information provided in this document is subject to legal disclaimers. INT xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx DATA 00 DATA 01 DATA 02 DATA 03 tsu(D) th(D) data into port 1 NXP Semiconductors PCA9555A Product data sheet data into port 0 DATA 10 DATA 11 DATA 12 tsu(D) th(D) INT SCL 1 2 3 4 trst(INT) 5 6 slave address SDA S 0 1 0 7 8 R/W 0 A2 A1 A0 1 START condition 9 I0.x A acknowledge from slave DATA 00 I1.x A acknowledge from master DATA 10 I0.x A acknowledge from master DATA 03 I1.x A acknowledge from master STOP condition DATA 12 1 P non acknowledge from master read from port 0 read from port 1 002aah348 This figure eliminates the command byte transfer and a restart between the initial slave address call and the actual data transfer from P port (see Figure 9). Fig 11. Read input port register, scenario 2 PCA9555A 13 of 39 © NXP B.V. 2012. All rights reserved. Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register). Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Rev. 1 — 11 September 2012 All information provided in this document is subject to legal disclaimers. tv(INT) PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 8. Application design-in information VDD (3.3 V) 10 kΩ 10 kΩ 10 kΩ 2 kΩ VDD VDD MASTER CONTROLLER PCA9555A SUB-SYSTEM 1(1) (e.g., temp sensor) 100 kΩ (×3) INT SCL SCL P0_0 SDA SDA P0_1 INT INT SUB-SYSTEM 2 (e.g., counter) P0_2 RESET P0_3 VSS A P0_4 controlled switch (e.g., CBT device) enable P0_5 B P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 A2 A1 A0 SUB-SYSTEM 3(1) (e.g., alarm system) 10 DIGIT NUMERIC KEYPAD ALARM VDD VSS 002aaf847 Device address configured as 0100 000X for this example. P0_0, P0_2, P0_3 configured as outputs. P0_1, P0_4, P0_5 configured as inputs. P0_6, P0_7 and (P1_0 to P1_7) configured as inputs. (1) External resistors are required for inputs (on P port) that may float. Also, internal pull-up may be used to eliminate external components. If a driver to an input will never let the input float, a resistor is not needed. If an output in the P port is configured as a push-pull output there is no need for external pull-up resistors. If an output in the P port is configured as an open-drain output, external pull-up resistors are required. Fig 12. Typical application 8.1 Minimizing IDD when the I/Os are used to control LEDs When the I/Os are used to control LEDs, they are normally connected to VDD through a resistor as shown in Figure 12. Since the LED acts as a diode, when the LED is off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower than VDD. Designs needing to minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD when the LED is off. Figure 13 shows a high value resistor in parallel with the LED. Figure 14 shows VDD less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at or above VDD and prevents additional supply current consumption when the LED is off. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 14 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 3.3 V VDD VDD LED 5V VDD 100 kΩ LED Pn Pn 002aag164 002aag165 Fig 13. High value resistor in parallel with the LED Fig 14. Device supplied by a lower voltage 8.2 Power-on reset requirements In the event of a glitch or data corruption, PCA9555A can be reset to its default conditions by using the power-on reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This reset also happens when the device is powered on for the first time in an application. The two types of power-on reset are shown in Figure 15 and Figure 16. VDD ramp-up ramp-down re-ramp-up td(rst) time (dV/dt)r (dV/dt)f time to re-ramp when VDD drops below 0.2 V or to VSS (dV/dt)r 002aah329 Fig 15. VDD is lowered below 0.2 V or to 0 V and then ramped up to VDD VDD ramp-down ramp-up td(rst) VI drops below POR levels (dV/dt)f time to re-ramp when VDD drops to VPOR(min) − 50 mV time (dV/dt)r 002aah330 Fig 16. VDD is lowered below the POR threshold, then ramped back up to VDD Table 13 specifies the performance of the power-on reset feature for PCA9555A for both types of power-on reset. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 15 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Table 13. Recommended supply sequencing and ramp rates Tamb = 25 C (unless otherwise noted). Not tested; specified by design. Symbol Parameter Condition Min Typ Max Unit (dV/dt)f fall rate of change of voltage Figure 15 0.1 - 2000 ms (dV/dt)r rise rate of change of voltage Figure 15 0.1 - 2000 ms td(rst) reset delay time Figure 15; re-ramp time when VDD drops below 0.2 V or to VSS 1 - - s Figure 16; re-ramp time when VDD drops to VPOR(min) 50 mV 1 - - s VDD(gl) glitch supply voltage difference Figure 17 [1] - - 1 V [2] - - 10 s tw(gl)VDD supply voltage glitch pulse width Figure 17 VPOR(trip) power-on reset trip voltage falling VDD 0.7 - - V rising VDD - - 1.4 V [1] Level that VDD can glitch down to with a ramp rate of 0.4 s/V, but not cause a functional disruption when tw(gl)VDD < 1 s. [2] Glitch width that will not cause a functional disruption when VDD(gl) = 0.5 VDD. Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width (tw(gl)VDD) and glitch height (VDD(gl)) are dependent on each other. The bypass capacitance, source impedance, and device impedance are factors that affect power-on reset performance. Figure 17 and Table 13 provide more information on how to measure these specifications. VDD ∆VDD(gl) tw(gl)VDD time 002aah331 Fig 17. Glitch width and glitch height VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the registers and the I2C-bus/SMBus state machine are initialized to their default states. The value of VPOR differs based on the VDD being lowered to or from 0 V. Figure 18 and Table 13 provide more details on this specification. VDD VPOR (rising VDD) VPOR (falling VDD) time POR time 002aah332 Fig 18. Power-on reset voltage (VPOR) PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 16 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 8.3 Device current consumption with internal pull-up and pull-down resistors The PCA9555A integrates pull-up resistors to eliminate external components when pins are configured as inputs and pull-up resistors are required (for example, nothing is driving the inputs to the power supply rails. Since these pull-up resistors are internal to the device itself, they contribute to the current consumption of the device and must be considered in the overall system design. If the resistor is configured as a pull-up, that is, connected to VDD, a current will flow from the VDD pin through the resistor to ground when the pin is held LOW. This current will appear as additional IDD upsetting any current consumption measurements. The pull-up resistors are simple resistors and the current is linear with voltage. The resistance specification for these devices spans from 50 k with a nominal 100 k value. Any current flow through these resistors is additive by the number of pins held LOW and the current can be calculated by Ohm’s law. See Figure 22 for a graph of supply current versus the number of pull-up resistors. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 17 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 9. Limiting values Table 14. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions Min Max Unit 0.5 +6.5 V 0.5 +6.5 V 0.5 +6.5 V VI input voltage [1] VO output voltage [1] IIK input clamping current A0, A1, A2, SCL; VI < 0 V - 20 mA IOK output clamping current INT; VO < 0 V - 20 mA IIOK input/output clamping current P port; VO < 0 V or VO > VDD - 20 mA SDA; VO < 0 V or VO > VDD - 20 mA continuous; I/O port - 50 mA continuous; SDA, INT - 25 mA continuous; P port LOW-level output current IOL IOH HIGH-level output current - 25 mA IDD supply current - 160 mA ISS ground supply current - 200 mA Ptot total power dissipation - 200 mW Tstg storage temperature 65 +150 C Tj(max) maximum junction temperature - 125 C [1] The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 10. Recommended operating conditions Table 15. Operating conditions Symbol Parameter VDD supply voltage VIH HIGH-level input voltage VIL LOW-level input voltage Conditions Min Max Unit 1.65 5.5 V SCL, SDA 0.7 VDD 5.5 V A0, A1, A2, P1_7 to P0_0 0.7 VDD 5.5 V SCL, SDA 0.5 0.3 VDD V A0, A1, A2, P1_7 to P0_0 0.5 0.3 VDD V P1_7 to P0_0 - 10 mA IOH HIGH-level output current IOL LOW-level output current P1_7 to P0_0 - 25 mA Tamb ambient temperature operating in free air 40 +85 C 11. Thermal characteristics Table 16. Symbol Zth(j-a) [1] Thermal characteristics Parameter Conditions transient thermal impedance from junction to ambient Max Unit TSSOP24 package [1] 88 K/W HWQFN24 package [1] 66 K/W The package thermal impedance is calculated in accordance with JESD 51-7. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 18 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 12. Static characteristics Table 17. Static characteristics Tamb = 40 C to +85 C; VDD = 1.65 V to 5.5 V; unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VIK input clamping voltage II = 18 mA 1.2 - - V VPOR power-on reset voltage VI = VDD or VSS; IO = 0 mA - 1.1 1.4 V IOL LOW-level output current VOL = 0.4 V; VDD = 1.65 V to 5.5 V 3 - - mA 3 15[2] - mA SDA INT P port VOH VOL II HIGH-level output voltage LOW-level output voltage input current VOL = 0.5 V; VDD = 1.65 V [3] 8 10 - mA VOL = 0.7 V; VDD = 1.65 V [3] 10 13 - mA VOL = 0.5 V; VDD = 2.3 V [3] 8 10 - mA VOL = 0.7 V; VDD = 2.3 V [3] 10 13 - mA VOL = 0.5 V; VDD = 3.0 V [3] 8 14 - mA VOL = 0.7 V; VDD = 3.0 V [3] 10 19 - mA VOL = 0.5 V; VDD = 4.5 V [3] 8 17 - mA VOL = 0.7 V; VDD = 4.5 V [3] 10 24 - mA IOH = 8 mA; VDD = 1.65 V [4] 1.2 - - V IOH = 10 mA; VDD = 1.65 V [4] 1.1 - - V IOH = 8 mA; VDD = 2.3 V [4] 1.8 - - V IOH = 10 mA; VDD = 2.3 V [4] 1.7 - - V IOH = 8 mA; VDD = 3.0 V [4] 2.6 - - V IOH = 10 mA; VDD = 3.0 V [4] 2.5 - - V IOH = 8 mA; VDD = 4.5 V [4] 4.1 - - V IOH = 10 mA; VDD = 4.5 V [4] 4.0 - - V VDD = 1.65 V - - 0.45 V VDD = 2.3 V - - 0.25 V VDD = 3.0 V - - 0.25 V VDD = 4.5 V - - 0.2 V SCL, SDA, RESET; VI = VDD or VSS - - 1 A A0, A1, A2; VI = VDD or VSS - - 1 A P port P port; IOL = 8 mA VDD = 1.65 V to 5.5 V IIH HIGH-level input current P port; VI = VDD; VDD = 1.65 V to 5.5 V - - 1 A IIL LOW-level input current P port; VI = VSS; VDD = 1.65 V to 5.5 V - - 100 A PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 19 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Table 17. Static characteristics …continued Tamb = 40 C to +85 C; VDD = 1.65 V to 5.5 V; unless otherwise specified. Min Typ[1] Max Unit VDD = 3.6 V to 5.5 V - 10 25 A VDD = 2.3 V to 3.6 V - 6.5 15 A VDD = 1.65 V to 2.3 V - 4 9 A VDD = 3.6 V to 5.5 V - 1.5 7 A VDD = 2.3 V to 3.6 V - 1 3.2 A VDD = 1.65 V to 2.3 V - 0.5 1.7 A Symbol Parameter Conditions IDD supply current SDA, P port, A0, A1, A2; VI on SDA = VDD or VSS; VI on P port and A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 400 kHz SCL, SDA, P port, A0, A1, A2; VI on SCL, SDA = VDD or VSS; VI on P port and A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 0 kHz Active mode; P port, A0, A1, A2; VI on P port, A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 400 kHz, continuous register read VDD = 3.6 V to 5.5 V - 60 125 A VDD = 2.3 V to 3.6 V - 40 75 A VDD = 1.65 V to 2.3 V - 20 45 A - 1.1 1.5 mA SCL, SDA; one input at VDD 0.6 V, other inputs at VDD or VSS; VDD = 1.65 V to 5.5 V - - 25 A P port, A0, A1, A2; one input at VDD 0.6 V, other inputs at VDD or VSS; VDD = 1.65 V to 5.5 V - - 80 A pF with pull-ups enabled; P port, A0, A1, A2; VI on SCL and SDA = VDD or VSS; VI on P port = VSS; VI on A0, A1, A2 = VDD or VSS; IO = 0 mA; I/O = inputs with pull-up enabled; fSCL = 0 kHz VDD = 1.65 V to 5.5 V IDD additional quiescent supply current Ci input capacitance VI = VDD or VSS; VDD = 1.65 V to 5.5 V - 6 7 Cio input/output capacitance VI/O = VDD or VSS; VD = 1.65 V to 5.5 V - 7 8 pF VI/O = VDD or VSS; VDD = 1.65 V to 5.5 V - 7.5 8.5 pF [1] For IDD, all typical values are at nominal supply voltage (1.8 V, 2.5 V, 3.3 V, 3.6 V or 5 V VDD) and Tamb = 25 C. Except for IDD, the typical values are at VDD = 3.3 V and Tamb = 25 C. [2] Typical value for Tamb = 25 C. VOL = 0.4 V and VDD = 3.3 V. Typical value for VDD < 2.5 V, VOL = 0.6 V. [3] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 200 mA. [4] The total current sourced by all I/Os must be limited to 160 mA. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 20 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 12.1 Typical characteristics 002aah333 20 IDD (μA) 16 12 002aah334 1400 IDD(stb) (nA) VDD = 5.5 V 5.0 V 3.6 V 3.3 V 2.5 V 2.3 V VDD = 5.5 V 5.0 V 3.6 V 3.3 V 1000 800 600 8 400 2.5 V 2.3 V 1.8 V 1.65 V 4 0 −40 200 VDD = 1.8 V 1.65 V −15 10 35 0 −40 60 85 Tamb (°C) Fig 19. Supply current versus ambient temperature 002aah335 20 IDD (μA) 16 −15 10 35 60 85 Tamb (°C) Fig 20. Standby supply current versus ambient temperature 002aah336 1.2 Tamb = −40 °C 25 °C 85 °C IDD (mA) 0.8 12 8 0.4 4 0 1.5 0 2.5 3.5 4.5 5.5 0 VDD (V) 4 8 12 16 number of I/O held LOW Tamb = 25 C Fig 21. Supply current versus supply voltage PCA9555A Product data sheet Fig 22. Supply current versus number of I/O held LOW All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 21 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Isink (mA) 002aaf578 35 Isink (mA) 30 Tamb = −40 °C 25 °C 85 °C 25 002aaf579 35 30 Tamb = −40 °C 25 °C 85 °C 25 20 20 15 15 10 10 5 5 0 0 0 0.1 0.2 0.3 0 0.1 0.2 VOL (V) a. VDD = 1.65 V Isink (mA) b. VDD = 1.8 V 002aaf580 50 002aaf581 60 Isink (mA) 40 Tamb = −40 °C 25 °C 85 °C 30 0.3 VOL (V) Tamb = −40 °C 25 °C 85 °C 40 20 20 10 0 0 0 0.1 0.2 0.3 0 0.1 0.2 VOL (V) c. VDD = 2.5 V Isink (mA) 0.3 VOL (V) d. VDD = 3.3 V 002aaf582 70 Isink (mA) Tamb = −40 °C 25 °C 85 °C 60 50 002aaf583 70 Tamb = −40 °C 25 °C 85 °C 60 50 40 40 30 30 20 20 10 10 0 0 0 0.1 0.2 0.3 0 VOL (V) 0.1 0.2 0.3 VOL (V) e. VDD = 5.0 V f. VDD = 5.5 V Fig 23. I/O sink current versus LOW-level output voltage PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 22 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 002aah337 30 Isource (mA) Isource (mA) Tamb = −40 °C 25 °C 85 °C 20 002aah338 35 Tamb = −40 °C 25 °C 85 °C 30 25 20 15 10 10 5 0 0 0 0.2 0.4 0.6 VDD − VOH (V) 0 a. VDD = 1.65 V 002aah339 Isource (mA) Tamb = −40 °C 25 °C 85 °C 40 0.4 0.6 VDD − VOH (V) b. VDD = 1.8 V 60 Isource (mA) 0.2 002aah340 70 Tamb = −40 °C 25 °C 85 °C 60 50 40 30 20 20 10 0 0 0 0.2 0.4 0.6 VDD − VOH (V) c. VDD = 2.5 V 002aah341 0.4 0.6 VDD − VOH (V) 002aah342 90 Isource (mA) Tamb = −40 °C 25 °C 85 °C 60 0.2 d. VDD = 3.3 V 90 Isource (mA) 0 Tamb = −40 °C 25 °C 85 °C 60 30 30 0 0 0 0.2 0.4 0.6 VDD − VOH (V) e. VDD = 5.0 V 0 0.2 0.4 0.6 VDD − VOH (V) f. VDD = 5.5 V Fig 24. I/O source current versus HIGH-level output voltage PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 23 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up VOL (mV) 002aah056 120 100 002aah343 200 VDD − VOH (mV) 160 (1) 80 120 VDD = 1.8 V 5V 60 (2) 80 40 (4) 20 0 −40 40 (3) −15 10 35 60 85 Tamb (°C) 0 −40 −15 10 35 60 85 Tamb (°C) Isource = 10 mA (1) VDD = 1.8 V; Isink = 10 mA (2) VDD = 5 V; Isink = 10 mA (3) VDD = 1.8 V; Isink = 1 mA (4) VDD = 5 V; Isink = 1 mA Fig 25. LOW-level output voltage versus temperature PCA9555A Product data sheet Fig 26. I/O high voltage versus temperature All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 24 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 13. Dynamic characteristics Table 18. I2C-bus interface timing requirements Over recommended operating free air temperature range, unless otherwise specified. See Figure 27. Symbol Parameter Conditions Standard-mode I2C-bus Fast-mode I2C-bus Unit Min Max Min Max fSCL SCL clock frequency 0 100 0 400 tHIGH HIGH period of the SCL clock 4 - 0.6 - s tLOW LOW period of the SCL clock 4.7 - 1.3 - s tSP pulse width of spikes that must be suppressed by the input filter 0 50 0 50 ns tSU;DAT data set-up time 250 - 100 - ns tHD;DAT data hold time 0 - 0 - ns kHz tr rise time of both SDA and SCL signals - 1000 20 300 ns tf fall time of both SDA and SCL signals - 300 20 (VDD / 5.5 V) 300 ns tBUF bus free time between a STOP and START condition 4.7 - 1.3 - s tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - s tHD;STA hold time (repeated) START condition 4 - 0.6 - s tSU;STO set-up time for STOP condition 4 - 0.6 - s tVD;DAT data valid time SCL LOW to SDA output valid - 3.45 - 0.9 s tVD;ACK data valid acknowledge time ACK signal from SCL LOW to SDA (out) LOW - 3.45 - 0.9 s Table 19. Switching characteristics Over recommended operating free air temperature range; CL 100 pF; unless otherwise specified. See Figure 28. Symbol Parameter Conditions Fast-mode I2C-bus Min Max Min Max - 1 - 1 Unit s tv(INT) valid time on pin INT trst(INT) reset time on pin INT from SCL to INT - 1 - 1 s tv(Q) data output valid time from SCL to P port - 400 - 400 ns tsu(D) data input set-up time from P port to SCL 0 - 0 - ns th(D) data input hold time from P port to SCL 300 - 300 - ns PCA9555A Product data sheet from P port to INT Standard-mode I2C-bus All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 25 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 14. Parameter measurement information VDD RL = 1 kΩ DUT SDA CL = 50 pF 002aaf848 a. SDA load configuration two bytes for read Input port register(1) STOP START condition condition (P) (S) Address Bit 7 (MSB) Address Bit 1 R/W Bit 0 (LSB) Data Bit 7 (MSB) ACK (A) Data Bit 0 (LSB) STOP condition (P) 002aag952 b. Transaction format tHIGH tLOW tSP 0.7 × VDD 0.3 × VDD SCL tBUF tVD;DAT tr tf tf(o) tVD;ACK tSU;STA 0.7 × VDD SDA tf tHD;STA tr 0.3 × VDD tVD;ACK tSU;DAT tSU;STO tHD;DAT repeat START condition STOP condition 002aag804 c. Voltage waveforms CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. All parameters and waveforms are not applicable to all devices. Byte 1 = I2C-bus address; Byte 2, byte 3 = P port data. (1) See Figure 9. Fig 27. I2C-bus interface load circuit and voltage waveforms PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 26 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up VDD RL = 4.7 kΩ INT DUT CL = 100 pF 002aah069 a. Interrupt load configuration acknowledge from slave START condition R/W 8 bits (one data byte) from port slave address SDA S SCL 0 1 0 1 2 3 0 A2 A1 A0 1 4 5 6 7 8 acknowledge from slave DATA 1 A no acknowledge from master STOP condition data from port A DATA 2 1 P 9 B trst(INT) B trst(INT) INT tv(INT) data into port A A tsu(D) ADDRESS INT DATA 1 SCL 0.5 × VDD DATA 2 R/W 0.3 × VDD tv(INT) trst(INT) 0.5 × VDD Pn 0.7 × VDD A 0.5 × VDD INT View A - A View B - B 002aah256 b. Voltage waveforms CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. All parameters and waveforms are not applicable to all devices. Fig 28. Interrupt load circuit and voltage waveforms PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 27 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 500 Ω Pn DUT 2 × VDD CL = 50 pF 500 Ω 002aag805 a. P port load configuration SCL P0 A P7 0.7 × VDD 0.3 × VDD SDA tv(Q) Pn unstable data last stable bit A P7 002aag806 b. Write mode (R/W = 0) SCL P0 0.7 × VDD 0.3 × VDD tsu(D) th(D) Pn 002aag807 c. Read mode (R/W = 1) CL includes probe and jig capacitance. tv(Q) is measured from 0.7 VDD on SCL to 50 % I/O (Pn) output. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. The outputs are measured one at a time, with one transition per measurement. All parameters and waveforms are not applicable to all devices. Fig 29. P port load circuit and voltage waveforms PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 28 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 15. Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 30. Package outline SOT355-1 (TSSOP24) PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 29 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm B D SOT994-1 A terminal 1 index area E A A1 c detail X e1 1/2 e ∅v ∅w b e 7 12 M M C C A B C y1 C y L 13 6 e e2 Eh 1/2 e 1 18 terminal 1 index area 24 19 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D(1) Dh E (1) Eh e e1 e2 L v w y y1 mm 0.8 0.05 0.00 0.30 0.18 0.2 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 0.5 2.5 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT994-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 07-02-07 07-03-03 Fig 31. Package outline SOT994-1 (HWQFN24) PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 30 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 16. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 17. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 17.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 17.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 17.3 Wave soldering Key characteristics in wave soldering are: PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 31 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 17.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 32) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 20 and 21 Table 20. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 21. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 32. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 32 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 33 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 18. Soldering: PCB footprints Footprint information for reflow soldering of TSSOP24 package SOT355-1 Hx Gx P2 (0.125) Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 P2 Ay By C D1 D2 Gx Gy Hx Hy 0.650 0.750 7.200 4.500 1.350 0.400 0.600 8.200 5.300 8.600 7.450 sot355-1_fr Fig 33. PCB footprint for SOT355-1 (TSSOP24); reflow soldering PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 34 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Footprint information for reflow soldering of HVQFN24 package SOT994-1 Hx Gx D P 0.025 0.025 C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area nSPx nSPy 2 2 Dimensions in mm P Ax Ay Bx By C D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy 0.500 5.000 5.000 3.200 3.200 0.900 0.240 2.100 2.100 1.200 1.200 0.450 0.450 4.300 4.300 5.250 5.250 Issue date 07-09-24 09-06-15 sot994-1_fr Fig 34. PCB footprint for SOT994-1 (HWQFN24); reflow soldering PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 35 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 19. Abbreviations Table 22. Abbreviations Acronym Description ACPI Advanced Configuration and Power Interface CBT Cross-Bar Technology CDM Charged-Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge FET Field-Effect Transistor FF Flip-Flop GPIO General Purpose Input/Output HBM Human Body Model I2C-bus Inter-Integrated Circuit bus I/O Input/Output LED Light Emitting Diode SMBus System Management Bus 20. Revision history Table 23. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9555A v.1 20120911 Product data sheet - - PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 36 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 21. Legal information 21.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 21.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 21.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA9555A Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 37 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 21.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 22. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCA9555A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2012 © NXP B.V. 2012. All rights reserved. 38 of 39 PCA9555A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up 23. Contents 1 2 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.3 6.4 6.5 7 7.1 7.2 8 8.1 8.2 8.3 9 10 11 12 12.1 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pointer register and command byte . . . . . . . . . 5 Input port register pair (00h, 01h) . . . . . . . . . . . 6 Output port register pair (02h, 03h) . . . . . . . . . 6 Polarity inversion register pair (04h, 05h) . . . . . 7 Configuration register pair (06h, 07h) . . . . . . . . 7 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9 Writing to the port registers. . . . . . . . . . . . . . . . 9 Reading the port registers . . . . . . . . . . . . . . . 11 Application design-in information . . . . . . . . . 14 Minimizing IDD when the I/Os are used to control LEDs . . . . . . . . . . . . . . . . . . . . . . . . 14 Power-on reset requirements . . . . . . . . . . . . . 15 Device current consumption with internal pull-up and pull-down resistors . . . . . . . . . . . . 17 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18 Recommended operating conditions. . . . . . . 18 Thermal characteristics . . . . . . . . . . . . . . . . . 18 Static characteristics. . . . . . . . . . . . . . . . . . . . 19 Typical characteristics . . . . . . . . . . . . . . . . . . 21 Dynamic characteristics . . . . . . . . . . . . . . . . . 25 Parameter measurement information . . . . . . 26 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 29 Handling information. . . . . . . . . . . . . . . . . . . . 31 Soldering of SMD packages . . . . . . . . . . . . . . 31 Introduction to soldering . . . . . . . . . . . . . . . . . 31 Wave and reflow soldering . . . . . . . . . . . . . . . 31 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 31 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 32 Soldering: PCB footprints. . . . . . . . . . . . . . . . 34 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 36 20 21 21.1 21.2 21.3 21.4 22 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 37 37 37 37 38 38 39 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 September 2012 Document identifier: PCA9555A