PCAL9535A Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Rev. 2 — 23 January 2015 Product data sheet 1. General description The PCAL9535A is a low-voltage 16-bit General Purpose Input/Output (GPIO) expander with interrupt and reset for I2C-bus/SMBus applications. NXP I/O expanders provide a simple solution when additional I/Os are needed while keeping interconnections to a minimum, for example, in ACPI power switches, sensors, push buttons, LEDs, fan control, etc. In addition to providing a flexible set of GPIOs, the wide VDD range of 1.65 V to 5.5 V allows the PCAL9535A to interface with next-generation microprocessors and microcontrollers where supply levels are dropping down to conserve power. The PCAL9535A contains the PCA9535 register set of four pairs of 8-bit Configuration, Input, Output, and Polarity Inversion registers, and additionally, the PCAL9535A has Agile I/O, which are additional features specifically designed to enhance the I/O. These additional features are: programmable output drive strength, latchable inputs, programmable pull-up/pull-down resistors, maskable interrupt, interrupt status register, programmable open-drain or push-pull outputs. The PCAL9535A is a pin-to-pin replacement to the PCA9535 and PCA9535A, however, the PCAL9535A powers up with all I/O interrupts masked. This mask default allows for a board bring-up free of spurious interrupts at power-up. The PCAL9535A open-drain interrupt (INT) output is activated when any input state differs from its corresponding Input Port register state and is used to indicate to the system master that an input state has changed. INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. Thus, the PCAL9535A can remain a simple slave device. The device outputs have 25 mA sink capabilities for directly driving LEDs while consuming low device current. The power-on reset sets the registers to their default values and initializes the device state machine. Three hardware pins (A0, A1, A2) select the fixed I2C-bus address and allow up to eight devices to share the same I2C-bus/SMBus. PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 2. Features and benefits I2C-bus to parallel port expander Operating power supply voltage range of 1.65 V to 5.5 V Low standby current consumption: 1.5 A (typical at 5 V VDD) 1.0 A (typical at 3.3 V VDD) Schmitt-trigger action allows slow input transition and better switching noise immunity at the SCL and SDA inputs Vhys = 0.10 VDD (typical) 5 V tolerant I/Os Open-drain active LOW interrupt output (INT) 400 kHz Fast-mode I2C-bus Internal power-on reset Power-up with all channels configured as inputs No glitch on power-up Latched outputs with 25 mA drive maximum capability for directly driving LEDs Latch-up performance exceeds 100 mA per JESD78, Class II ESD protection exceeds JESD22 2000 V Human Body Model (A114-A) 1000 V Charged-Device Model (C101) Packages offered: TSSOP24, HVQFN24 2.1 Agile I/O features Pin to pin replacement for PCA9535 and PCA9535A with interrupts disabled at power-up Software backward compatible with PCA9535 and PCA9535A Output port configuration: bank selectable push-pull or open-drain output stages Interrupt status: read-only register identifies the source of an interrupt Bit-wise I/O programming features: Output drive strength: four programmable drive strengths to reduce rise and fall times in low capacitance applications Input latch: Input Port register values changes are kept until the Input Port register is read Pull-up/pull-down enable: floating input or pull-up/down resistor enable Pull-up/pull-down selection: 100 k pull-up/down resistor selection Interrupt mask: mask prevents the generation of the interrupt when input changes state PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 3. Ordering information Table 1. Ordering information Type number Topside marking Package Name Description Version PCAL9535AHF L35A HWQFN24 plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 4 0.75 mm SOT994-1 PCAL9535APW PCAL9535A TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 3.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature range PCAL9535AHF PCAL9535AHF,128 HWQFN24 Reel pack, SMD, 13-inch, Turned 6000 40 C to +85 C PCAL9535APW PCAL9535APW,118 TSSOP24 Reel pack, SMD, 13-inch 2500 40 C to +85 C 4. Block diagram PCAL9535A P1_0 P1_1 8-bit A0 A1 A2 write pulse P1_2 INPUT/ OUTPUT PORTS P1_3 P1_4 P1_5 P1_6 read pulse P1_7 I2C-BUS/SMBus CONTROL SCL SDA P0_0 INPUT FILTER P0_1 8-bit write pulse VDD P0_2 INPUT/ OUTPUT PORTS P0_3 P0_4 P0_5 P0_6 read pulse P0_7 POWER-ON RESET VSS VDD INT LP FILTER 002aah425 Remark: All I/Os are set to inputs at reset. Fig 1. PCAL9535A Product data sheet Block diagram of PCAL9535A All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 5. Pinning information 5.1 Pinning 19 SCL terminal 1 index area 21 VDD 20 SDA 2 22 INT A1 24 VDD 23 SDA 24 A2 1 23 A1 PCAL9535AHF INT 6 19 P1_6 P0_2 3 16 P1_6 P0_3 7 18 P1_5 P0_3 4 15 P1_5 P0_4 8 17 P1_4 P0_4 5 14 P1_4 P0_5 9 16 P1_3 P0_5 6 13 P1_3 P0_6 10 15 P1_2 P0_7 11 14 P1_1 VSS 12 13 P1_0 PCAL9535APW 002aah427 Transparent top view 002aah426 Fig 2. P1_2 12 17 P1_7 P0_2 P1_1 11 2 P1_0 10 18 A0 P0_1 9 1 20 P1_7 VSS P0_0 5 8 21 A0 P0_1 7 22 SCL 4 P0_7 3 P0_6 A2 P0_0 Pin configuration for TSSOP24 Fig 3. Pin configuration for HWQFN24 5.2 Pin description PCAL9535A Product data sheet Table 3. Pin description Symbol Pin Type Description TSSOP24 HWQFN24 INT 1 22 O Interrupt output. Connect to VDD through a pull-up resistor. A1 2 23 I Address input 1. Connect directly to VDD or VSS. A2 3 24 I Address input 2. Connect directly to VDD or VSS. P0_0[2] 4 1 I/O Port 0 input/output 0. P0_1[2] 5 2 I/O Port 0 input/output 1. P0_2[2] 6 3 I/O Port 0 input/output 2. P0_3[2] 7 4 I/O Port 0 input/output 3. P0_4[2] 8 5 I/O Port 0 input/output 4. P0_5[2] 9 6 I/O Port 0 input/output 5. P0_6[2] 10 7 I/O Port 0 input/output 6. P0_7[2] 11 8 I/O Port 0 input/output 7. VSS 12 9[1] power Ground. P1_0[3] 13 10 I/O Port 1 input/output 0. P1_1[3] 14 11 I/O Port 1 input/output 1. P1_2[3] 15 12 I/O Port 1 input/output 2. P1_3[3] 16 13 I/O Port 1 input/output 3. P1_4[3] 17 14 I/O Port 1 input/output 4. P1_5[3] 18 15 I/O Port 1 input/output 5. P1_6[3] 19 16 I/O Port 1 input/output 6. All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Table 3. Pin description …continued Symbol Pin Type Description 17 I/O Port 1 input/output 7. 21 18 I Address input 0. Connect directly to VDD or VSS. SCL 22 19 I Serial clock bus. Connect to VDD through a pull-up resistor. SDA 23 20 I/O Serial data bus. Connect to VDD through a pull-up resistor. VDD 24 21 power Supply voltage. TSSOP24 HWQFN24 P1_7[3] 20 A0 [1] HWQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. [2] Pins P0_0 to P0_7 correspond to bits P0.0 to P0.7. At power-up, all I/O are configured as high-impedance inputs. [3] Pins P1_0 to P1_7 correspond to bits P1.0 to P1.7. At power-up, all I/O are configured as high-impedance inputs. 6. Functional description Refer to Figure 1 “Block diagram of PCAL9535A”. 6.1 Device address slave address 0 1 0 0 fixed A2 A1 A0 R/W hardware selectable 002aah371 Fig 4. PCAL9535A device address A2, A1 and A0 are the hardware address package pins and are held to either HIGH (logic 1) or LOW (logic 0) to assign one of the eight possible slave addresses. The last bit of the slave address (R/W) defines the operation (read or write) to be performed. A HIGH (logic 1) selects a read operation, while a LOW (logic 0) selects a write operation. 6.2 Registers 6.2.1 Pointer register and command byte Following the successful acknowledgement of the address byte, the bus master sends a command byte, which is stored in the Pointer register in the PCAL9535A. The lower three bits of this data byte state the operation (read or write) and the internal registers (Input, Output, Polarity Inversion, or Configuration) that will be affected. Bit 6 in conjunction with the lower four bits of the Command byte are used to point to the extended features of the device (Agile I/O). This register is write only. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O B7 B6 B5 B4 B3 B2 B1 B0 002aaf540 Fig 5. Table 4. Pointer register bits Command byte Pointer register bits Command byte Register (hexadecimal) Protocol Power-up default read byte xxxx xxxx[1] B7 B6 B5 B4 B3 B2 B1 B0 0 0 0 0 0 0 0 0 00h 0 0 0 0 0 0 0 1 01h Input port 1 read byte xxxx xxxx 0 0 0 0 0 0 1 0 02h Output port 0 read/write byte 1111 1111 0 0 0 0 0 0 1 1 03h Output port 1 read/write byte 1111 1111 0 0 0 0 0 1 0 0 04h Polarity Inversion port 0 read/write byte 0000 0000 0 0 0 0 0 1 0 1 05h Polarity Inversion port 1 read/write byte 0000 0000 0 0 0 0 0 1 1 0 06h Configuration port 0 read/write byte 1111 1111 0 0 0 0 0 1 1 1 07h Configuration port 1 read/write byte 1111 1111 0 1 0 0 0 0 0 0 40h Output drive strength register 0 read/write byte 1111 1111 0 1 0 0 0 0 0 1 41h Output drive strength register 0 read/write byte 1111 1111 0 1 0 0 0 0 1 0 42h Output drive strength register 1 read/write byte 1111 1111 0 1 0 0 0 0 1 1 43h Output drive strength register 1 read/write byte 1111 1111 0 1 0 0 0 1 0 0 44h Input latch register 0 read/write byte 0000 0000 0 1 0 0 0 1 0 1 45h Input latch register 1 read/write byte 0000 0000 0 1 0 0 0 1 1 0 46h Pull-up/pull-down enable register 0 read/write byte 0000 0000 0 1 0 0 0 1 1 1 47h Pull-up/pull-down enable register 1 read/write byte 0000 0000 0 1 0 0 1 0 0 0 48h Pull-up/pull-down selection register 0 read/write byte 1111 1111 0 1 0 0 1 0 0 1 49h Pull-up/pull-down selection register 1 read/write byte 1111 1111 0 1 0 0 1 0 1 0 4Ah Interrupt mask register 0 read/write byte 1111 1111 0 1 0 0 1 0 1 1 4Bh Interrupt mask register 1 read/write byte 1111 1111 0 1 0 0 1 1 0 0 4Ch Interrupt status register 0 read byte 0000 0000 0 1 0 0 1 1 0 1 4Dh Interrupt status register 1 read byte 0000 0000 0 1 0 0 1 1 1 1 4Fh Output port configuration register read/write byte 0000 0000 [1] Input port 0 Undefined. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.2.2 Input port register pair (00h, 01h) The Input port registers (registers 0 and 1) reflect the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by the Configuration register. The Input port registers are read only; writes to these registers have no effect. The default value ‘X’ is determined by the externally applied logic level. An Input port register read operation is performed as described in Section 7.2 “Reading the port registers”. Table 5. Bit Input port 0 register (address 00h) 7 6 5 4 3 2 1 0 Symbol I0.7 I0.6 I0.5 I0.4 I0.3 I0.2 I0.1 I0.0 Default X X X X X X X X Table 6. Bit Input port 1 register (address 01h) 7 6 5 4 3 2 1 0 Symbol I1.7 I1.6 I1.5 I1.4 I1.3 I1.2 I1.1 I1.0 Default X X X X X X X X 6.2.3 Output port register pair (02h, 03h) The Output port registers (registers 2 and 3) show the outgoing logic levels of the pins defined as outputs by the Configuration register. Bit values in these registers have no effect on pins defined as inputs. In turn, reads from these registers reflect the value that was written to these registers, not the actual pin value. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 7. Bit 7 6 5 4 3 2 1 0 Symbol O0.7 O0.6 O0.5 O0.4 O0.3 O0.2 O0.1 O0.0 Default 1 1 1 1 1 1 1 1 Table 8. Bit PCAL9535A Product data sheet Output port 0 register (address 02h) Output port 1 register (address 03h) 7 6 5 4 3 2 1 0 Symbol O1.7 O1.6 O1.5 O1.4 O1.3 O1.2 O1.1 O1.0 Default 1 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.2.4 Polarity inversion register pair (04h, 05h) The Polarity inversion registers (registers 4 and 5) allow polarity inversion of pins defined as inputs by the Configuration register. If a bit in these registers is set (written with ‘1’), the corresponding port pin’s polarity is inverted in the Input register. If a bit in this register is cleared (written with a ‘0’), the corresponding port pin’s polarity is retained. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 9. Bit Polarity inversion port 0 register (address 04h) 7 6 5 4 3 2 1 0 Symbol N0.7 N0.6 N0.5 N0.4 N0.3 N0.2 N0.1 N0.0 Default 0 0 0 0 0 0 0 0 Table 10. Bit Polarity inversion port 1 register (address 05h) 7 6 5 4 3 2 1 0 Symbol N1.7 N1.6 N1.5 N1.4 N1.3 N1.2 N1.1 N1.0 Default 0 0 0 0 0 0 0 0 6.2.5 Configuration register pair (06h, 07h) The Configuration registers (registers 6 and 7) configure the direction of the I/O pins. If a bit in these registers is set to 1, the corresponding port pin is enabled as a high-impedance input. If a bit in these registers is cleared to 0, the corresponding port pin is enabled as an output. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 11. Bit 7 6 5 4 3 2 1 0 Symbol C0.7 C0.6 C0.5 C0.4 C0.3 C0.2 C0.1 C0.0 Default 1 1 1 1 1 1 1 1 Table 12. Bit PCAL9535A Product data sheet Configuration port 0 register (address 06h) Configuration port 1 register (address 07h) 7 6 5 4 3 2 1 0 Symbol C1.7 C1.6 C1.5 C1.4 C1.3 C1.2 C1.1 C1.0 Default 1 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.2.6 Output drive strength register pairs (40h, 41h, 42h, 43h) The Output drive strength registers control the output drive level of the GPIO. Each GPIO can be configured independently to a certain output current level by two register control bits. For example, Port 0.7 is controlled by register 41 bits CC0.7 (bits [7:6]), Port 0.6 is controlled by register 41 CC0.6(bits [5:4]). The output drive level of the GPIO is programmed 00b = 0.25, 01b = 0.50, 10b = 0.75, or 11b = 1 of the maximum drive capability of the I/O. See Section 8.2 “Output drive strength control”. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 13. Bit Current control port 0 register (address 40h) 7 Symbol Default Table 14. Bit Table 15. Bit 1 Table 16. Bit 3 CC0.2 1 7 1 6 2 1 CC0.1 1 5 CC0.7 1 0 CC0.0 1 1 1 1 4 3 2 1 0 CC0.6 1 1 CC0.5 1 CC0.4 1 1 1 1 3 2 1 0 Current control port 1 register (address 42h) 7 6 5 CC1.3 1 4 CC1.2 1 1 CC1.1 1 CC1.0 1 1 1 1 3 2 1 0 Current control port 1 register (address 43h) 7 Symbol Default 4 Current control port 0 register (address 41h) Symbol Default 5 CC0.3 Symbol Default 6 6 5 CC1.7 1 4 CC1.6 1 1 CC1.5 1 1 CC1.4 1 1 1 6.2.7 Input latch register pair (44h, 45h) The input latch registers (registers 44 and 45) enable and disable the input latch of the I/O pins. These registers are effective only when the pin is configured as an input port. When an input latch register bit is 0, the corresponding input pin state is not latched. A state change of the corresponding input pin generates an interrupt. A read of the input register clears the interrupt. If the input goes back to its initial logic state before the input port register is read, then the interrupt is cleared. When an input latch register bit is 1, the corresponding input pin state is latched. A change of state in the input generates an interrupt and the input logic value is loaded into the corresponding bit of the input port register (registers 0 and 1). A read of the input port register clears the interrupt. If the input pin returns to its initial logic state before the input port register is read, then the interrupt is not cleared and the corresponding bit of the input port register keeps the logic value that initiated the interrupt. See Figure 12 “Read input port register (latch enabled), scenario 3”. For example, if the P0_4 input was as logic 0 and the input goes to logic 1 then back to logic 0, the input port 0 register will capture this change and an interrupt is generated (if unmasked). When the read is performed on the input port 0 register, the interrupt is PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O cleared, assuming there were no additional input(s) that have changed, and bit 4 of the input port 0 register will read ‘1’. The next read of the input port 0 register bit 4 register should now read ‘0’. An interrupt remains active when a non-latched input simultaneously switches state with a latched input and then returns to its original state. A read of the input register reflects only the change of state of the latched input and also clears the interrupt. The interrupt is not cleared if the input latch register changes from latched to non-latched configuration. If the input pin is changed from latched to non-latched input, a read from the input port register reflects the current port logic level. If the input pin is changed from non-latched to latched input, the read from the input register reflects the latched logic level. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 17. Bit Input latch port 0 register (address 44h) 7 6 5 4 3 2 1 0 Symbol L0.7 L0.6 L0.5 L0.4 L0.3 L0.2 L0.1 L0.0 Default 0 0 0 0 0 0 0 0 Table 18. Bit Input latch port 1 register (address 45h) 7 6 5 4 3 2 1 0 Symbol L1.7 L1.6 L1.5 L1.4 L1.3 L1.2 L1.1 L1.0 Default 0 0 0 0 0 0 0 0 6.2.8 Pull-up/pull-down enable register pair (46h, 47h) These registers allow the user to enable or disable pull-up/pull-down resistors on the I/O pins. Setting the bit to logic 1 enables the selection of pull-up/pull-down resistors. Setting the bit to logic 0 disconnects the pull-up/pull-down resistors from the I/O pins. Also, the resistors will be disconnected when the outputs are configured as open-drain outputs (see Section 6.2.12). Use the pull-up/pull-down registers to select either a pull-up or pull-down resistor. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 19. Bit 7 6 5 4 3 2 1 0 Symbol PE0.7 PE0.6 PE0.5 PE0.4 PE0.3 PE0.2 PE0.1 PE0.0 Default 0 0 0 0 0 0 0 0 Table 20. Bit PCAL9535A Product data sheet Pull-up/pull-down enable port 0 register (address 46h) Pull-up/pull-down enable port 1 register (address 47h) 7 6 5 4 3 2 1 0 Symbol PE1.7 PE1.6 PE1.5 PE1.4 PE1.3 PE1.2 PE1.1 PE1.0 Default 0 0 0 0 0 0 0 0 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.2.9 Pull-up/pull-down selection register pair (48h, 49h) The I/O port can be configured to have a pull-up or pull-down resistor by programming the pull-up/pull-down selection register. Setting a bit to logic 1 selects a 100 k pull-up resistor for that I/O pin. Setting a bit to logic 0 selects a 100 k pull-down resistor for that I/O pin. If the pull-up/pull-down feature is disconnected, writing to this register will have no effect on I/O pin. Typical value is 100 k with minimum of 50 k and maximum of 150 k. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 21. Bit Pull-up/pull-down selection port 0 register (address 48h) 7 6 5 4 3 2 1 0 Symbol PUD0.7 PUD0.6 PUD0.5 PUD0.4 PUD0.3 PUD0.2 PUD0.1 PUD0.0 Default 1 1 1 1 1 1 1 1 Table 22. Bit Pull-up/pull-down selection port 1 register (address 49h) 7 6 5 4 3 2 1 0 Symbol PUD1.7 PUD1.6 PUD1.5 PUD1.4 PUD1.3 PUD1.2 PUD1.1 PUD1.0 Default 1 1 1 1 1 1 1 1 6.2.10 Interrupt mask register pair (4Ah, 4Bh) Interrupt mask registers are set to logic 1 upon power-on, disabling interrupts during system start-up. Interrupts may be enabled by setting corresponding mask bits to logic 0. If an input changes state and the corresponding bit in the Interrupt mask register is set to 1, the interrupt is masked and the interrupt pin will not be asserted. If the corresponding bit in the Interrupt mask register is set to 0, the interrupt pin will be asserted. When an input changes state and the resulting interrupt is masked (interrupt mask bit is 1), setting the input mask register bit to 0 will cause the interrupt pin to be asserted. If the interrupt mask bit of an input that is currently the source of an interrupt is set to 1, the interrupt pin will be de-asserted. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 23. Bit 7 6 5 4 3 2 1 0 Symbol M0.7 M0.6 M0.5 M0.4 M0.3 M0.2 M0.1 M0.0 Default 1 1 1 1 1 1 1 1 Table 24. Bit PCAL9535A Product data sheet Interrupt mask port 0 register (address 4Ah) bit description Interrupt mask port 1 register (address 4Bh) bit description 7 6 5 4 3 2 1 0 Symbol M1.7 M1.6 M1.5 M1.4 M1.3 M1.2 M1.1 M1.0 Default 1 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.2.11 Interrupt status register pair (4Ch, 4Dh) These read-only registers are used to identify the source of an interrupt. When read, a logic 1 indicates that the corresponding input pin was the source of the interrupt. A logic 0 indicates that the input pin is not the source of an interrupt. When a corresponding bit in the interrupt mask register is set to 1 (masked), the interrupt status bit will return logic 0. A register pair write is described in Section 7.1 and a register pair read is described in Section 7.2. Table 25. Bit Interrupt status port 0 register (address 4Ch) bit description 7 6 5 4 3 2 1 0 Symbol S0.7 S0.6 S0.5 S0.4 S0.3 S0.2 S0.1 S0.0 Default 0 0 0 0 0 0 0 0 Table 26. Bit Interrupt status port 1 register (address 4Dh) bit description 7 6 5 4 3 2 1 0 Symbol S1.7 S1.6 S1.5 S1.4 S1.3 S1.2 S1.1 S1.0 Default 0 0 0 0 0 0 0 0 6.2.12 Output port configuration register (4Fh) The output port configuration register selects port-wise push-pull or open-drain I/O stage. A logic 0 configures the I/O as push-pull (Q1 and Q2 are active, see Figure 6). A logic 1 configures the I/O as open-drain (Q1 is disabled, Q2 is active) and the recommended command sequence to program this register (4Fh) before the configuration registers (06h, 07h) sets the port pins as outputs. ODEN0 configures Port 0_x and ODEN1 configures Port 1_x. Table 27. Bit Output port configuration register (address 4Fh) 7 6 5 Symbol Default PCAL9535A Product data sheet 4 3 2 reserved 0 0 0 0 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 0 0 1 0 ODEN1 ODEN0 0 0 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.3 I/O port When an I/O is configured as an input, FETs Q1 and Q2 are off, which creates a high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, Q1 or Q2 is enabled, depending on the state of the Output port register. In this case, there are low-impedance paths between the I/O pin and either VDD or VSS. The external voltage applied to this I/O pin should not exceed the recommended levels for proper operation. data from shift register data from shift register write configuration pulse output port register data configuration register D VDD Q Q1 ESD protection diode Q2 ESD protection diode FF CK D Q Q FF write pulse CK P0_0 to P0_7 P1_0 to P1_7 output port register VSS D Q input port register data FF read pulse CK VDD PULL-UP/PULL-DOWN CONTROL INTERRUPT MASK input port register 100 kΩ D input latch register data from shift register D CK data from shift register Q LATCH Q read pulse FF write input latch pulse to INT input port latch polarity inversion register D EN Q FF write polarity pulse CK 002aah428 At power-on reset, all registers return to default values. Fig 6. Simplified schematic of the I/Os (P0_0 to P0_7, P1_0 to P1_7) 6.4 Power-on reset When power (from 0 V) is applied to VDD, an internal power-on reset holds the PCAL9535A in a reset condition until VDD has reached VPOR. At that time, the reset condition is released and the PCAL9535A registers and I2C-bus/SMBus state machine initializes to their default states. After that, VDD must be lowered to below VPORF and back up to the operating voltage for a power-reset cycle. See Section 8.3 “Power-on reset requirements”. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 6.5 Interrupt output An interrupt is generated by any rising or falling edge of the port inputs in the Input mode. After time tv(INT), the signal INT is valid. The interrupt is reset when data on the port changes back to the original value or when data is read form the port that generated the interrupt (see Figure 10). Resetting occurs in the Read mode at the acknowledge (ACK) or not acknowledge (NACK) bit after the rising edge of the SCL signal. Interrupts that occur during the ACK or NACK clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Any change of the I/Os after resetting is detected and is transmitted as INT. A pin configured as an output cannot cause an interrupt. Changing an I/O from an output to an input may cause a false interrupt to occur, if the state of the pin does not match the contents of the Input Port register. The INT output has an open-drain structure and requires pull-up resistor to VDD. When using the input latch feature, the input pin state is latched. The interrupt is reset only when data is read from the port that generated the interrupt. The reset occurs in the Read mode at the acknowledge (ACK) or not acknowledge (NACK) bit after the rising edge of the SCL signal. 7. Bus transactions The PCAL9535A is an I2C-bus slave device. Data is exchanged between the master and PCAL9535A through write and read commands using I2C-bus. The two communication lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Writing to the port registers Data is transmitted to the PCAL9535A by sending the device address and setting the least significant bit to a logic 0 (see Figure 4 “PCAL9535A device address”). The command byte is sent after the address and determines which register will receive the data following the command byte. Twenty-two registers within the PCAL9535A are configured to operate as eleven register pairs. The eleven pairs are input port, output port, polarity inversion, configuration, output drive strength (two 16-bit registers), input latch, pull-up/pull-down enable, pull-up/pull-down selection, interrupt mask, and interrupt status registers. After sending data to one register, the next data byte is sent to the other register in the pair (see Figure 7 and Figure 8). For example, if the first byte is sent to Output Port 1 (register 3), the next byte is stored in Output Port 0 (register 2). There is no limitation on the number of data bytes sent in one write transmission. In this way, the host can continuously update a register pair independently of the other registers, or the host can simply update a single register. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 46 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 data to port 0 command byte 0 A2 A1 A0 0 START condition R/W NXP Semiconductors PCAL9535A Product data sheet 1 SCL A 0 0 0 0 0 0 1 0 acknowledge from slave A 0.7 data to port 1 0.0 A 1.7 DATA 0 acknowledge from slave DATA 1 1.0 A P STOP condition acknowledge from slave write to port tv(Q) data out from port 1 DATA VALID 002aah372 Fig 7. Write to output port registers SCL 1 2 3 4 5 6 7 8 9 slave address 0 1 0 0 A2 A1 A0 0 START condition R/W A 0 0/1 0 acknowledge from slave 0 0/1 0/1 0/1 0/1 A MSB acknowledge from slave STOP condition data to register DATA 0 A LSB MSB acknowledge from slave DATA 1 A P LSB acknowledge from slave 002aah373 Fig 8. Write to Control registers PCAL9535A 15 of 46 © NXP Semiconductors N.V. 2015. All rights reserved. SDA S data to register command byte Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Rev. 2 — 23 January 2015 All information provided in this document is subject to legal disclaimers. tv(Q) data out from port 0 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 7.2 Reading the port registers In order to read data from the PCAL9535A, the bus master must first send the PCAL9535A address with the least significant bit set to a logic 0 (see Figure 4 “PCAL9535A device address”). The command byte is sent after the address and determines which register will be accessed. After a restart, the device address is sent again, but this time the least significant bit is set to a logic 1. Data from the register defined by the command byte is sent by the PCAL9535A (see Figure 9, Figure 10 and Figure 11). Data is clocked into the register on the falling edge of the acknowledge clock pulse. After the first byte is read, additional bytes may be read but the data now reflects the information in the other register in the pair. For example, if Input Port 1 is read, the next byte read is Input Port 0. There is no limit on the number of data bytes received in one read transmission, but on the final byte received the bus master must not acknowledge the data. After a subsequent restart, the command byte contains the value of the next register to be read in the pair. For example, if Input Port 1 was read last before the restart, the register that is read after the restart is the Input Port 0. command byte slave address SDA S 0 1 0 0 A2 A1 A0 0 START condition A 0 0/1 0 R/W data from lower or upper byte of register slave address 0 1 0 MSB 0 A2 A1 A0 1 (repeated) START condition (cont.) acknowledge from slave acknowledge from slave (cont.) S 0 0/1 0/1 0/1 0/1 A A data from upper or lower byte of register LSB DATA (first byte) R/W acknowledge from slave MSB A acknowledge from master LSB DATA (last byte) NA P no acknowledge from master at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter STOP condition 002aah374 Remark: Transfer can be stopped at any time by a STOP condition. Fig 9. Read from register PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 46 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors PCAL9535A Product data sheet data into port 0 data into port 1 tv(INT) SCL 1 2 3 4 trst(INT) 5 6 slave address SDA S 0 1 0 7 8 R/W 0 A2 A1 A0 1 START condition 9 I0.x A acknowledge from slave 7 6 5 4 3 I1.x 2 1 0 A 7 acknowledge from master 6 5 4 3 I0.x 2 1 0 A acknowledge from master 7 6 5 4 3 STOP condition I1.x 2 1 0 A acknowledge from master 7 6 5 4 3 2 1 0 1 P non acknowledge from master read from port 0 read from port 1 002aah375 Fig 10. Read input port register (input latch disabled), scenario 1 PCAL9535A 17 of 46 © NXP Semiconductors N.V. 2015. All rights reserved. Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register). Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Rev. 2 — 23 January 2015 All information provided in this document is subject to legal disclaimers. INT xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx DATA 00 DATA 01 DATA 02 DATA 03 tsu(D) th(D) data into port 1 NXP Semiconductors PCAL9535A Product data sheet data into port 0 DATA 10 DATA 11 DATA 12 tsu(D) th(D) tv(INT) SCL 1 2 3 4 trst(INT) 5 6 slave address SDA S 0 1 0 7 8 R/W 0 A2 A1 A0 1 START condition 9 I0.x A acknowledge from slave I1.x DATA 00 A acknowledge from master DATA 10 I0.x A acknowledge from master DATA 03 I1.x A acknowledge from master DATA 12 STOP condition 1 P non acknowledge from master read from port 0 read from port 1 002aah376 Fig 11. Read input port register (non-latched), scenario 2 PCAL9535A 18 of 46 © NXP Semiconductors N.V. 2015. All rights reserved. Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register). Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Rev. 2 — 23 January 2015 All information provided in this document is subject to legal disclaimers. INT xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx DATA 01 DATA 02 NXP Semiconductors PCAL9535A Product data sheet data into port 0 DATA 01 tsu(D) data into port 1 DATA 10 DATA 11 DATA 10 I1.x I0.x th(D) tv(INT) SCL 1 2 3 4 trst(INT) 5 6 slave address SDA S 0 1 0 7 8 R/W 0 A2 A1 A0 1 START condition 9 I0.x A acknowledge from slave DATA 01 A acknowledge from master DATA 10 A acknowledge from master DATA 02 I1.x A acknowledge from master DATA 11 STOP condition 1 P non acknowledge from master read from port 0 read from port 1 002aah429 Fig 12. Read input port register (latch enabled), scenario 3 PCAL9535A 19 of 46 © NXP Semiconductors N.V. 2015. All rights reserved. Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register). Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Rev. 2 — 23 January 2015 All information provided in this document is subject to legal disclaimers. INT PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 8. Application design-in information VDD (3.3 V) 10 kΩ 10 kΩ 10 kΩ 2 kΩ VDD VDD MASTER CONTROLLER PCAL9535A SUB-SYSTEM 1(1) (e.g., temp sensor) 100 kΩ (×3) INT SCL SCL P0_0 SDA SDA P0_1 INT INT SUB-SYSTEM 2 (e.g., counter) P0_2 RESET P0_3 VSS A P0_4 controlled switch (e.g., CBT device) enable P0_5 B P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 A2 A1 A0 SUB-SYSTEM 3(1) (e.g., alarm system) 10 DIGIT NUMERIC KEYPAD ALARM VDD VSS 002aah430 Device address configured as 0100 000X for this example. P0_0, P0_2, P0_3 configured as outputs. P0_1, P0_4, P0_5 configured as inputs. P0_6, P0_7 and (P1_0 to P1_7) configured as inputs. (1) External resistors are required for inputs (on P port) that may float. Also, internal pull-up or pull-down may be used to eliminate the need for external components. If a driver to an input will never let the input float, a resistor is not needed. If an output in the P port is configured as a push-pull output there is no need for external pull-up resistors. If an output in the P port is configured as an open-drain output, external pull-up resistors are required. Fig 13. Typical application 8.1 Minimizing IDD when the I/Os are used to control LEDs When the I/Os are used to control LEDs, they are normally connected to VDD through a resistor as shown in Figure 13. Since the LED acts as a diode, when the LED is off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower than VDD. Designs needing to minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD when the LED is off. Figure 14 shows a high value resistor in parallel with the LED. Figure 15 shows VDD less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at or above VDD and prevents additional supply current consumption when the LED is off. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 20 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 3.3 V VDD VDD LED 5V VDD 100 kΩ LED Pn Pn 002aag164 Fig 14. High value resistor in parallel with the LED 002aag165 Fig 15. Device supplied by a lower voltage 8.2 Output drive strength control The Output drive strength registers allow the user to control the output drive level of the GPIO. Each GPIO can be configured independently to one of the four possible output current levels. By programming these bits the user is changing the number of transistor pairs or ‘fingers’ that drive the I/O pad. Figure 16 shows a simplified output stage. The behavior of the pad is affected by the Configuration register, the output port data, and the current control register. When the Current Control register bits are programmed to 10b, then only two of the fingers are active, reducing the current drive capability by 50 %. PMOS_EN0 VDD PMOS_EN1 Current Control register PMOS_EN[3:0] DECODER NMOS_EN[3:0] PMOS_EN2 Configuration register PMOS_EN3 P0_0 to P0_7 P1_0 to P1_7 Output port register NMOS_EN3 NMOS_EN2 NMOS_EN1 NMOS_EN0 002aah431 Fig 16. Simplified output stage PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 21 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Reducing the current drive capability may be desirable to reduce system noise. When the output switches (transitions from H/L), there is a peak current that is a function of the output drive selection. This peak current runs through VDD and VSS package inductance and will create noise (some radiated, but more critically Simultaneous Switching Noise (SSN)). In other words, switching many outputs at the same time will create ground and supply noise. The output drive strength control through the Current Control registers allows the user to mitigate SSN issues without the need of additional external components. 8.3 Power-on reset requirements In the event of a glitch or data corruption, PCAL9535A can be reset to its default conditions by using the power-on reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This reset also happens when the device is powered on for the first time in an application. The two types of power-on reset are shown in Figure 17 and Figure 18. VDD ramp-up ramp-down re-ramp-up td(rst) time (dV/dt)r (dV/dt)f time to re-ramp when VDD drops below 0.2 V or to VSS (dV/dt)r 002aah329 Fig 17. VDD is lowered below 0.2 V or to 0 V and then ramped up to VDD VDD ramp-down ramp-up td(rst) VI drops below POR levels (dV/dt)f time to re-ramp when VDD drops to VPOR(min) − 50 mV time (dV/dt)r 002aah330 Fig 18. VDD is lowered below the POR threshold, then ramped back up to VDD Table 28 specifies the performance of the power-on reset feature for PCAL9535A for both types of power-on reset. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 22 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Table 28. Recommended supply sequencing and ramp rates Tamb = 25 C (unless otherwise noted). Not tested; specified by design. Symbol Parameter Condition Min Typ Max Unit (dV/dt)f fall rate of change of voltage Figure 17 0.1 - 2000 ms (dV/dt)r rise rate of change of voltage Figure 17 0.1 - 2000 ms td(rst) reset delay time Figure 17; re-ramp time when VDD drops below 0.2 V or to VSS 1 - - s Figure 18; re-ramp time when VDD drops to VPOR(min) 50 mV 1 - - s VDD(gl) glitch supply voltage difference Figure 19 [1] - - 1 V [2] - - 10 s tw(gl)VDD supply voltage glitch pulse width Figure 19 VPOR(trip) power-on reset trip voltage falling VDD 0.7 - - V rising VDD - - 1.4 V [1] Level that VDD can glitch down to with a ramp rate of 0.4 s/V, but not cause a functional disruption when tw(gl)VDD < 1 s. [2] Glitch width that will not cause a functional disruption when VDD(gl) = 0.5 VDD. Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width (tw(gl)VDD) and glitch height (VDD(gl)) are dependent on each other. The bypass capacitance, source impedance, and device impedance are factors that affect power-on reset performance. Figure 19 and Table 28 provide more information on how to measure these specifications. VDD ∆VDD(gl) tw(gl)VDD time 002aah331 Fig 19. Glitch width and glitch height VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the registers and the I2C-bus/SMBus state machine are initialized to their default states. The value of VPOR differs based on the VDD being lowered to or from 0 V. Figure 20 and Table 28 provide more details on this specification. VDD VPOR (rising VDD) VPOR (falling VDD) time POR time 002aah332 Fig 20. Power-on reset voltage (VPOR) PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 23 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 8.4 Device current consumption with internal pull-up and pull-down resistors The PCAL9535A integrates programmable pull-up and pull-down resistors to eliminate external components when pins are configured as inputs and pull-up or pull-down resistors are required (for example, nothing is driving the inputs to the power supply rails. Since these pull-up and pull-down resistors are internal to the device itself, they contribute to the current consumption of the device and must be considered in the overall system design. The pull-up or pull-down function is selected in registers 48h and 49h, while the resistor is connected by the enable registers 46h and 47h. The configuration of the resistors is shown in Figure 6. If the resistor is configured as a pull-up, that is, connected to VDD, a current will flow from the VDD pin through the resistor to ground when the pin is held LOW. This current will appear as additional IDD upsetting any current consumption measurements. In the same manner, if the resistor is configured as a pull-down and the pin is held HIGH, current will flow from the power supply through the pin to the VSS pin. While this current will not be measured as part of IDD, one must be mindful of the 200 mA limiting value through VSS. The pull-up and pull-down resistors are simple resistors and the current is linear with voltage. The resistance specification for these devices spans from 50 k with a nominal 100 k value. Any current flow through these resistors is additive by the number of pins held HIGH or LOW and the current can be calculated by Ohm’s law. See Figure 24 for a graph of supply current versus the number of pull-up resistors. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 24 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 9. Limiting values Table 29. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions Min Max Unit 0.5 +6.5 V 0.5 +6.5 V 0.5 +6.5 V VI input voltage [1] VO output voltage [1] IIK input clamping current A0, A1, A2, SCL; VI < 0 V - 20 mA IOK output clamping current INT; VO < 0 V - 20 mA IIOK input/output clamping current P port; VO < 0 V or VO > VDD - 20 mA SDA; VO < 0 V or VO > VDD - 20 mA continuous; I/O port - 50 mA continuous; SDA, INT - 25 mA continuous; P port LOW-level output current IOL IOH HIGH-level output current - 25 mA IDD supply current - 160 mA ISS ground supply current - 200 mA Ptot total power dissipation - 200 mW Tstg storage temperature 65 +150 C Tj(max) maximum junction temperature - 125 C [1] The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 10. Recommended operating conditions Table 30. Operating conditions Symbol Parameter VDD supply voltage VIH HIGH-level input voltage VIL LOW-level input voltage Conditions Min Max Unit 1.65 5.5 V SCL, SDA 0.7 VDD 5.5 V A0, A1, A2, P1_7 to P0_0 0.7 VDD 5.5 V SCL, SDA 0.5 0.3 VDD V A0, A1, A2, P1_7 to P0_0 0.5 0.3 VDD V P1_7 to P0_0 - 10 mA IOH HIGH-level output current IOL LOW-level output current P1_7 to P0_0 - 25 mA Tamb ambient temperature operating in free air 40 +85 C 11. Thermal characteristics Table 31. Symbol Zth(j-a) [1] Thermal characteristics Parameter Conditions transient thermal impedance from junction to ambient Max Unit TSSOP24 package [1] 88 K/W HWQFN24 package [1] 66 K/W The package thermal impedance is calculated in accordance with JESD 51-7. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 25 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 12. Static characteristics Table 32. Static characteristics Tamb = 40 C to +85 C; VDD = 1.65 V to 5.5 V; unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VIK input clamping voltage II = 18 mA 1.2 - - V VPOR power-on reset voltage VI = VDD or VSS; IO = 0 mA - 1.1 1.4 V VOH HIGH-level output voltage[2] P port; IOH = 8 mA; CCX.X = 11b VDD = 1.65 V 1.2 - - V VDD = 2.3 V 1.8 - - V VDD = 3 V 2.6 - - V VDD = 4.5 V 4.1 - - V VDD = 1.65 V 1.1 - - V VDD = 2.3 V 1.7 - - V VDD = 3 V 2.5 - - V VDD = 4.5 V 4.0 - - V VDD = 1.65 V - - 0.45 V VDD = 2.3 V - - 0.25 V VDD = 3 V - - 0.25 V VDD = 4.5 V - - 0.2 V VDD = 1.65 V - - 0.5 V VDD = 2.3 V - - 0.3 V VDD = 3 V - - 0.25 V VDD = 4.5 V - - 0.2 V SDA 3 - - mA INT 3 15[3] - mA SCL, SDA; VI = VDD or VSS - - 1 A A0, A1, A2; VI = VDD or VSS P port; IOH = 2.5 mA and CCX.X = 00b; IOH = 5 mA and CCX.X = 01b; IOH = 7.5 mA and CCX.X = 10b; IOH = 10 mA and CCX.X = 11b; VOL LOW-level output voltage[2] P port; IOL = 8 mA; CCX.X = 11b P port; IOL = 2.5 mA and CCX.X = 00b; IOL = 5 mA and CCX.X = 01b; IOL = 7.5 mA and CCX.X = 10b; IOL = 10 mA and CCX.X = 11b; IOL II LOW-level output current input current VOL = 0.4 V; VDD = 1.65 V to 5.5 V VDD = 1.65 V to 5.5 V - - 1 A IIH HIGH-level input current P port; VI = VDD; VDD = 1.65 V to 5.5 V - - 1 A IIL LOW-level input current P port; VI = VSS; VDD = 1.65 V to 5.5 V - - 1 A PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 26 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Table 32. Static characteristics …continued Tamb = 40 C to +85 C; VDD = 1.65 V to 5.5 V; unless otherwise specified. Min Typ[1] Max Unit VDD = 3.6 V to 5.5 V - 10 25 A VDD = 2.3 V to 3.6 V - 6.5 15 A VDD = 1.65 V to 2.3 V - 4 9 A VDD = 3.6 V to 5.5 V - 1.5 7 A VDD = 2.3 V to 3.6 V - 1 3.2 A VDD = 1.65 V to 2.3 V - 0.5 1.7 A VDD = 3.6 V to 5.5 V - 60 125 A VDD = 2.3 V to 3.6 V - 40 75 A VDD = 1.65 V to 2.3 V - 20 45 A - 1.1 1.5 mA SCL, SDA; one input at VDD 0.6 V, other inputs at VDD or VSS; VDD = 1.65 V to 5.5 V - - 25 A P port, A0, A1, A2; one input at VDD 0.6 V, other inputs at VDD or VSS; VDD = 1.65 V to 5.5 V - - 80 A Symbol Parameter Conditions IDD supply current SDA, P port, A0, A1, A2; VI on SDA = VDD or VSS; VI on P port and A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 400 kHz SCL, SDA, P port, A0, A1, A2; VI on SCL, SDA = VDD or VSS; VI on P port and A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 0 kHz Active mode; P port, A0, A1, A2; VI on RESET = VDD; VI on P port and A0, A1, A2 = VDD; IO = 0 mA; I/O = inputs; fSCL = 400 kHz, continuous register read with pull-ups enabled; P port, A0, A1, A2; VI on SCL, SDA and RESET = VDD or VSS; VI on P port = VSS; VI on A0, A1, A2 = VDD or VSS; IO = 0 mA; I/O = inputs with pull-up enabled; fSCL = 0 kHz VDD = 1.65 V to 5.5 V IDD additional quiescent supply current[4] Ci input capacitance VI = VDD or VSS; VDD = 1.65 V to 5.5 V - 6 7 pF Cio input/output capacitance VI/O = VDD or VSS; VDD = 1.65 V to 5.5 V - 7 8 pF VI/O = VDD or VSS; VDD = 1.65 V to 5.5 V - 7.5 8.5 pF Rpu(int) internal pull-up resistance input/output 50 100 150 k Rpd(int) internal pull-down resistance input/output 50 100 150 k [1] For IDD, all typical values are at nominal supply voltage (1.8 V, 2.5 V, 3.3 V, 3.6 V or 5 V VDD) and Tamb = 25 C. Except for IDD, the typical values are at VDD = 3.3 V and Tamb = 25 C. [2] The total current sourced by all I/Os must be limited to 160 mA. [3] Typical value for Tamb = 25 C. VOL = 0.4 V and VDD = 3.3 V. Typical value for VDD < 2.5 V, VOL = 0.6 V. [4] Internal pull-up/pull-down resistors disabled. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 27 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 12.1 Typical characteristics 002aah333 20 IDD (μA) 16 12 002aah334 1400 IDD(stb) (nA) VDD = 5.5 V 5.0 V 3.6 V 3.3 V 2.5 V 2.3 V VDD = 5.5 V 5.0 V 3.6 V 3.3 V 1000 800 600 8 400 2.5 V 2.3 V 1.8 V 1.65 V 4 0 −40 200 VDD = 1.8 V 1.65 V −15 10 35 0 −40 60 85 Tamb (°C) Fig 21. Supply current versus ambient temperature 002aah335 20 IDD (μA) 16 −15 10 35 60 85 Tamb (°C) Fig 22. Standby supply current versus ambient temperature 002aah336 1.2 Tamb = −40 °C 25 °C 85 °C IDD (mA) 0.8 12 8 0.4 4 0 1.5 0 2.5 3.5 4.5 5.5 0 VDD (V) Tamb = 25 C Product data sheet 8 12 16 number of I/O held LOW VDD = 5 V Fig 23. Supply current versus supply voltage PCAL9535A 4 Fig 24. Supply current versus number of I/O held LOW All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 28 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Isink (mA) 002aaf578 35 Isink (mA) 30 Tamb = −40 °C 25 °C 85 °C 25 002aaf579 35 30 Tamb = −40 °C 25 °C 85 °C 25 20 20 15 15 10 10 5 5 0 0 0 0.1 0.2 0.3 0 0.1 0.2 VOL (V) a. VDD = 1.65 V Isink (mA) b. VDD = 1.8 V 002aaf580 50 002aaf581 60 Isink (mA) 40 Tamb = −40 °C 25 °C 85 °C 30 0.3 VOL (V) Tamb = −40 °C 25 °C 85 °C 40 20 20 10 0 0 0 0.1 0.2 0.3 0 0.1 0.2 VOL (V) c. VDD = 2.5 V Isink (mA) 0.3 VOL (V) d. VDD = 3.3 V 002aaf582 70 Isink (mA) Tamb = −40 °C 25 °C 85 °C 60 50 002aaf583 70 Tamb = −40 °C 25 °C 85 °C 60 50 40 40 30 30 20 20 10 10 0 0 0 0.1 0.2 0.3 0 VOL (V) e. VDD = 5.0 V 0.1 0.2 0.3 VOL (V) f. VDD = 5.5 V Fig 25. I/O sink current versus LOW-level output voltage with CCX.X = 11b PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 29 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 002aah110 30 Isource (mA) Isource (mA) Tamb = −40 °C 25 °C 85 °C 20 002aah111 35 Tamb = −40 °C 25 °C 85 °C 30 25 20 15 10 10 5 0 0 0 0.2 0.4 0.6 VDD − VOH (V) a. VDD = 1.65 V 0 002aah112 Isource (mA) Tamb = −40 °C 25 °C 85 °C 40 0.4 0.6 VDD − VOH (V) b. VDD = 1.8 V 60 Isource (mA) 0.2 002aah113 70 Tamb = −40 °C 25 °C 85 °C 60 50 40 30 20 20 10 0 0 0 0.2 0.4 0.6 VDD − VOH (V) c. VDD = 2.5 V 002aah114 0.4 0.6 VDD − VOH (V) 002aah115 90 Isource (mA) Tamb = −40 °C 25 °C 85 °C 60 0.2 d. VDD = 3.3 V 90 Isource (mA) 0 Tamb = −40 °C 25 °C 85 °C 60 30 30 0 0 0 e. VDD = 5.0 V 0.2 0.4 0.6 VDD − VOH (V) 0 0.2 0.4 0.6 VDD − VOH (V) f. VDD = 5.5 V Fig 26. I/O source current versus HIGH-level output voltage with CCX.X = 11b PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 30 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O VOL (mV) 002aah056 120 100 002aah343 200 VDD − VOH (mV) 160 (1) 80 120 VDD = 1.8 V 5V 60 (2) 80 40 (4) 20 0 −40 40 (3) −15 10 35 60 85 Tamb (°C) 0 −40 −15 10 35 60 85 Tamb (°C) Isource = 10 mA (1) VDD = 1.8 V; Isink = 10 mA (2) VDD = 5 V; Isink = 10 mA (3) VDD = 1.8 V; Isink = 1 mA (4) VDD = 5 V; Isink = 1 mA Fig 27. LOW-level output voltage versus temperature PCAL9535A Product data sheet Fig 28. I/O high voltage versus temperature All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 31 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 13. Dynamic characteristics Table 33. I2C-bus interface timing requirements Over recommended operating free air temperature range, unless otherwise specified. See Figure 29. Conditions Standard-mode Fast-mode I2C-bus Unit I2C-bus Symbol Parameter Min Max Min Max fSCL SCL clock frequency 0 100 0 400 tHIGH HIGH period of the SCL clock 4 - 0.6 - s tLOW LOW period of the SCL clock 4.7 - 1.3 - s tSP pulse width of spikes that must be suppressed by the input filter 0 50 0 50 ns tSU;DAT data set-up time 250 - 100 - ns tHD;DAT data hold time 0 - 0 - ns kHz tr rise time of both SDA and SCL signals - 1000 20 300 ns tf fall time of both SDA and SCL signals - 300 20 (VDD / 5.5 V) 300 ns tBUF bus free time between a STOP and START condition 4.7 - 1.3 - s tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - s tHD;STA hold time (repeated) START condition 4 - 0.6 - s tSU;STO set-up time for STOP condition 4 - 0.6 - s tVD;DAT data valid time SCL LOW to SDA output valid - 3.45 - 0.9 s tVD;ACK data valid acknowledge time ACK signal from SCL LOW to SDA (out) LOW - 3.45 - 0.9 s Table 34. Switching characteristics Over recommended operating free air temperature range; CL 100 pF; unless otherwise specified. See Figure 30. Symbol Parameter Conditions Fast-mode I2C-bus Min Max Min Max - 1 - 1 Unit s tv(INT) valid time on pin INT trst(INT) reset time on pin INT from SCL to INT - 1 - 1 s tv(Q) data output valid time from SCL to P port - 400 - 400 ns tsu(D) data input set-up time from P port to SCL 0 - 0 - ns th(D) data input hold time from P port to SCL 300 - 300 - ns PCAL9535A Product data sheet from P port to INT Standard-mode I2C-bus All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 32 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 14. Parameter measurement information VDD RL = 1 kΩ DUT SDA CL = 50 pF 002aag803 a. SDA load configuration two bytes for read Input port register(1) STOP START condition condition (P) (S) Address Bit 7 (MSB) Address Bit 1 R/W Bit 0 (LSB) Data Bit 7 (MSB) ACK (A) Data Bit 0 (LSB) STOP condition (P) 002aag952 b. Transaction format tHIGH tLOW tSP 0.7 × VDD 0.3 × VDD SCL tBUF tVD;DAT tr tf tf(o) tVD;ACK tSU;STA 0.7 × VDD SDA tf tHD;STA tr 0.3 × VDD tVD;ACK tSU;DAT tSU;STO tHD;DAT repeat START condition STOP condition 002aag804 c. Voltage waveforms CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. All parameters and waveforms are not applicable to all devices. Byte 1 = I2C-bus address; Byte 2, byte 3 = P port data. (1) See Figure 9. Fig 29. I2C-bus interface load circuit and voltage waveforms PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 33 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O VDD RL = 4.7 kΩ INT DUT CL = 100 pF 002aah069 a. Interrupt load configuration acknowledge from slave START condition R/W 8 bits (one data byte) from port slave address SDA S SCL 0 1 0 1 2 3 0 A2 A1 A0 1 4 5 6 7 8 acknowledge from slave DATA 1 A no acknowledge from master STOP condition data from port A DATA 2 1 P 9 B trst(INT) B trst(INT) INT tv(INT) data into port A A tsu(D) ADDRESS INT DATA 1 SCL 0.5 × VDD DATA 2 R/W 0.3 × VDD tv(INT) trst(INT) 0.5 × VDD Pn 0.7 × VDD A 0.5 × VDD INT View A - A View B - B 002aah256 b. Voltage waveforms CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. All parameters and waveforms are not applicable to all devices. Fig 30. Interrupt load circuit and voltage waveforms PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 34 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 500 Ω Pn DUT 2 × VDD CL = 50 pF 500 Ω 002aag805 a. P port load configuration SCL P0 A P7 0.7 × VDD 0.3 × VDD SDA tv(Q) Pn unstable data last stable bit A P7 002aag806 b. Write mode (R/W = 0) SCL P0 0.7 × VDD 0.3 × VDD tsu(D) th(D) Pn 002aag807 c. Read mode (R/W = 1) CL includes probe and jig capacitance. tv(Q) is measured from 0.7 VDD on SCL to 50 % I/O (Pn) output. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. The outputs are measured one at a time, with one transition per measurement. All parameters and waveforms are not applicable to all devices. Fig 31. P port load circuit and voltage waveforms PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 35 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 15. Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 32. Package outline SOT355-1 (TSSOP24) PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 36 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm B D SOT994-1 A terminal 1 index area E A A1 c detail X e1 1/2 e ∅v ∅w b e 7 12 M M C C A B C y1 C y L 13 6 e e2 Eh 1/2 e 1 18 terminal 1 index area 24 19 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D(1) Dh E (1) Eh e e1 e2 L v w y y1 mm 0.8 0.05 0.00 0.30 0.18 0.2 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 0.5 2.5 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT994-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 07-02-07 07-03-03 Fig 33. Package outline SOT994-1 (HWQFN24) PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 37 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 16. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 17. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 17.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 17.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 17.3 Wave soldering Key characteristics in wave soldering are: PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 38 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 17.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 34) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 35 and 36 Table 35. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 36. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 34. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 39 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 34. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 40 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 18. Soldering: PCB footprints Footprint information for reflow soldering of TSSOP24 package SOT355-1 Hx Gx P2 (0.125) Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 P2 Ay By C D1 D2 Gx Gy Hx Hy 0.650 0.750 7.200 4.500 1.350 0.400 0.600 8.200 5.300 8.600 7.450 sot355-1_fr Fig 35. PCB footprint for SOT355-1 (TSSOP24); reflow soldering PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 41 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Footprint information for reflow soldering of HVQFN24 package SOT994-1 Hx Gx D P 0.025 0.025 C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area nSPx nSPy 2 2 Dimensions in mm P Ax Ay Bx By C D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy 0.500 5.000 5.000 3.200 3.200 0.900 0.240 2.100 2.100 1.200 1.200 0.450 0.450 4.300 4.300 5.250 5.250 Issue date 07-09-24 09-06-15 sot994-1_fr Fig 36. PCB footprint for SOT994-1 (HWQFN24); reflow soldering PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 42 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 19. Abbreviations Table 37. Abbreviations Acronym Description ACPI Advanced Configuration and Power Interface CBT Cross-Bar Technology CDM Charged-Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge FET Field-Effect Transistor FF Flip-Flop GPIO General Purpose Input/Output HBM Human Body Model I2C-bus Inter-Integrated Circuit bus I/O Input/Output LED Light Emitting Diode SMBus System Management Bus 20. Revision history Table 38. Revision history Document ID Release date Data sheet status Change notice Supersedes PCAL9535A v.2 20150123 Product data sheet - PCAL9535A v.1 Modifications: PCAL9535A v.1 PCAL9535A Product data sheet • Section 1 “General description”: Paragraph 3, changed “PCAL9539” to “PCAL9535A”. 20120928 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 - © NXP Semiconductors N.V. 2015. All rights reserved. 43 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 21. Legal information 21.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 21.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 21.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCAL9535A Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 44 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 21.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 22. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCAL9535A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 January 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 45 of 46 PCAL9535A NXP Semiconductors Low-voltage 16-bit I2C-bus I/O port with interrupt and Agile I/O 23. Contents 1 2 2.1 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Agile I/O features . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pointer register and command byte . . . . . . . . . 5 Input port register pair (00h, 01h) . . . . . . . . . . . 7 Output port register pair (02h, 03h) . . . . . . . . . 7 Polarity inversion register pair (04h, 05h) . . . . . 8 Configuration register pair (06h, 07h) . . . . . . . . 8 Output drive strength register pairs (40h, 41h, 42h, 43h) . . . . . . . . . . . . . . . . . . . . . 9 6.2.7 Input latch register pair (44h, 45h) . . . . . . . . . . 9 6.2.8 Pull-up/pull-down enable register pair (46h, 47h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.2.9 Pull-up/pull-down selection register pair (48h, 49h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.2.10 Interrupt mask register pair (4Ah, 4Bh). . . . . . 11 6.2.11 Interrupt status register pair (4Ch, 4Dh) . . . . . 12 6.2.12 Output port configuration register (4Fh) . . . . . 12 6.3 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 13 6.5 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14 7 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 14 7.1 Writing to the port registers. . . . . . . . . . . . . . . 14 7.2 Reading the port registers . . . . . . . . . . . . . . . 16 8 Application design-in information . . . . . . . . . 20 8.1 Minimizing IDD when the I/Os are used to control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.2 Output drive strength control . . . . . . . . . . . . . 21 8.3 Power-on reset requirements . . . . . . . . . . . . . 22 8.4 Device current consumption with internal pull-up and pull-down resistors . . . . . . . . . . . . 24 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25 10 Recommended operating conditions. . . . . . . 25 11 Thermal characteristics . . . . . . . . . . . . . . . . . 25 12 Static characteristics. . . . . . . . . . . . . . . . . . . . 26 12.1 Typical characteristics . . . . . . . . . . . . . . . . . . 28 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 20 21 21.1 21.2 21.3 21.4 22 23 Dynamic characteristics. . . . . . . . . . . . . . . . . Parameter measurement information . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Handling information . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Soldering: PCB footprints . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 33 36 38 38 38 38 38 39 41 43 43 44 44 44 44 45 45 46 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 23 January 2015 Document identifier: PCAL9535A