Mar 2003 Positive Buck Regulator Makes Negative Boost DC/DC Converter

DESIGN IDEAS
Positive Buck Regulator Makes
Negative Boost DC/DC Converter
by Keith Szolusha
Power supply designers can choose
from a plethora of available positive
buck regulators that can also be used
as negative boost DC/DC converters.
Some buck regulators have a negative
feedback reference voltage expressly
for this purpose, but they are far outnumbered by the variety of ICs that
have positive reference feedback voltages. A designer can take advantage of
this greater variety of devices by using
a positive buck switch-mode regulator
to create an excellent negative boost
converter—all that is needed are a few
small modifications to the typical buck
converter configuration.
Figure 1a shows a –5V input to –9V
output at 1.2A negative boost converter
using the LT1765EFE positive buck
converter switch-mode regulator. The
LT1765EFE operates with a 3V to 25V
input, uses a 1.2V feedback voltage,
and has an internal 3A power switch.
The fast 1.25MHz switching frequency
of the LT1765EFE helps reduce the size
of the inductor and input and output
capacitors. Figure 1b shows a typical
positive buck converter application for
the LT1765EFE, a 12V in to 3.3V out
at 2.2A DC/DC converter.
In Figure 1a the VIN pin is connected
to system ground and the GND pin of
the IC is connected to the negative voltage output. This makes the negative
boost converter configuration provide
a positive voltage at the VFB pin with
respect to the GND pin of the IC. In this
topology the maximum input voltage
CMDSH-3
0.22µF
VSW
U1
SYNC LT1765EFE
FB
SHDN
VC
GND
COUT
22µF
16V X5R
CERAMIC
OUTPUT
–9V AT 1.2A
L1
2.5µH
BOOST
VIN
CC
4700pF
RC
6.8k
INPUT
–5V
CIN
2.2µF
6.3V X5R
CERAMIC
UPS120
64.9k
10.0k
CF
100pF
L1: SUMIDA CDRH5D28-2R5 (847) 956-0667
HIGH ∆I/∆t PATH IS IN BOLD FOR LAYOUT CONSIDERATIONS
rating of the IC has to be greater than
the magnitude of output voltage for the
negative boost converter. The IC must
also have a minimum input voltage
rating that is less than the magnitude
of the input voltage in order for the
circuit to turn-on upon power-up,
since the output voltage can have an
initial state of 0V.
Notice that the maximum output
current for the negative boost converter in Figure 1a is less than the
maximum output current of the positive buck converter Figure 1b, even
though they use the same 3A internal
power switch.
Inductor Selection
The inductor is chosen based on
maximum output current, peak switch
current, and desired ripple current.
First calculate the duty cycle (DC),
and then either calculate the ripple
current (IP–P) based on the chosen
inductor (L), or the inductor value
based on the desired ripple current.
It is generally good practice to choose
the inductor value so that the peakto-peak ripple current is about 40% of
the input current. These calculations
are approximate and ignore the effect
of switch, inductor, and Schottky diode
power losses.
continued on page 35
Figure 1a. –5V input to –9V output at 1.2A DC/DC converter
90
CMDSH-3
OUTPUT
3.3V AT 2.2A
0.22µF
VIN
BOOST
VSW
U1
SYNC LT1765EFE
FB
SHDN
VC
GND
CIN
2.2µF
25V X5R
CERAMIC
CC
1000pF
RC
4.7k
17.4k
B220A
62pF
CF
100pF
10.0k
COUT
10µF
6.3V X5R
CERAMIC
L1: SUMIDA CDRH5D28-2R5 (847) 956-0667
fSWITCH = 1.25MHz
HIGH ∆I/∆t PATH IS IN BOLD FOR LAYOUT CONSIDERATIONS
Figure 1b. 12V input to 3.3Voutput at 2.2A DC/DC converter
Linear Technology Magazine • March 2003
85
EFFICIENCY (%)
INPUT
12V
L1
2.5µH
80
75
70
65
60
0
200
400 600 800 1000 1200 1400
LOAD CURRENT (mA)
Figure 2. Efficiency of the negative boost
converter in Figure 1a is as high as 85% and
typically greater than 80%.
33
DESIGN IDEAS
because they can increase the ambient temperature (TA) and reduce the
maximum charge current.
800mA Charger Circuit
Another method of maximizing charge
current is to dissipate some of the
power in an external component, thus
reducing the power dissipation on the
die. Figure 1 shows how the LTC4054
can provide a complete standalone
lithium-ion charger solution using
few external components.
The external resistor Rcc is used
to dissipate 160mW of the charger’s
total power dissipation, enabling the
LTC4054 to thermally regulate at
higher charge currents. Because the
power is dissipated in an external component that also uses the PC board as
its heat sink, the temperature of the
die is reduced.
When this circuit is programmed
to charge at 800mA, the voltage on
the VCC pin drops to 4.8V. With a
nominal battery voltage of 3.7V and
an ambient temperature of 25°C, the
LTC4054 enters thermal regulation
when (see sidebar):
θJA ≤
95°C
= 108°C/W
1.1V • 800mA
The thermal resistance of the
LTC4054 can now be as high as
108°C/W before thermal regulation
limits the charge current.
Dissipating power in an external
component is a useful technique,
especially when a high input supply
voltage is used. However, the designer
should avoid dropping the VCC pin voltage low enough to put the LTC4054
into dropout, which could increase the
time spent charging in constant-voltage mode. This occurs when the voltage
across the internal MOSFET drops low
enough to cause the FET to enter the
linear region. The transistor does not
enter the linear region as long as the
following condition is met:
VCC – VBAT ≥ IBAT • R DS(ON)
The RDS(ON) of the LTC4054 FET is
nominally 600mΩ. Since Li-Ion battery
voltages do not typically exceed 4.2V,
an LTC4054 programmed with 800mA
will not enter dropout as long as the
VCC pin stays above 4.68V.
Conclusion
The LTC4054 standalone Li-Ion
battery charger provides a simple,
compact solution for charging single
cell Li-Ion batteries using very few
external components. Its thermal
regulation feature allows the designer
to eliminate the need for thermal overdesign, maximize charge current, and
shorten charge times.
LT1765, continued from page 33
DC =
IIN ~
(VOUT – VIN )
Maximum output current (I OUT(MAX))
is an approximation derived from the
maximum allowable input current
given the ripple current.
VOUT
VOUT • IOUT
VIN • η
where η is the overall efficiency
IOUT(MAX) =

IP –P 
ISW(MAX) –
 • VIN • η
2 

VOUT
IP –P = IIN • 40%
IP –P =
Input and Output Capacitors
DC • VIN
f •L
where f is the switching frequency
or L =
DC • VIN
f • IP –P
Maximum inductor current (IL(MAX))
is equal to peak switch current in this
configuration. The IC has a maximum
switch current (ISW(MAX)) of 3A, so the
maximum inductor current must remain below 3A. To keep switch current
below the maximum, more inductance
might be needed to keep the ripple
current low enough.
IL(MAX) = ISW(MAX) = IIN +
IP –P
2
Linear Technology Magazine • March 2003
Like a typical boost converter, the
input capacitor in the negative boost
topology has low ripple current and
the output capacitor has high discontinuous ripple current. The size
of the output capacitor is typically
bigger than the input capacitor in order to handle the greater RMS ripple
current.
ICIN(RMS) =
IP –P
ICOUT(RMS) =
12
2

2 I
1 – DC • IIN + P –P 

12 

(
)
The output capacitor ESR has a direct effect on the output voltage ripple
of the DC/DC converter. Choosing
higher frequency switch-mode regulators reduces the need for excessive
RMS ripple current rating. Regardless,
a low-ESR output capacitor, such as
a ceramic, can minimize the output
voltage ripple of the negative boost
converter.
∆VOUT(P –P) = ISW(MAX) • ESR COUT
Layout
Figures 1a and 1b show the high ΔI/Δt
switching paths of the negative boost
and positive buck DC/DC converters.
This loop must be kept as small as
possible, by minimizing trace lengths,
in order to minimize trace inductance.
The discontinuous currents in this
path create very high ΔI/Δt values.
Any trace inductance in this loop results in voltage spikes that can render
a circuit noisy or uncontrollable. For
this reason, circuit layout can be just
as important as component selection.
Note that the layout of the negative
boost is similar to the positive buck
regulator, with the locations of the
input and output swapped.
35