MSP Datasheet

MSP
www.vishay.com
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
• According to CECC 40402-801 (wirewound)
• Wide range of ohmic values (0.04  to 1 M)
• Low temperature coefficient 
(± 25 ppm/°C available)
• Good electrical insulation
• All welded construction and molded encapsulant
• High power ratings (up to 2.5 W)
• Stability class 0.5
• Pure matte tin termination
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package
ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface
mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS in millimeters
Recommended Soldering Areas
C
A
E
Z
B
W
F
D
F
X
X
SERIES
A
B
C
D
E
F
W
X
Z
MSP 1
6.9
3.8
3.8
2.5
6.5
1.4
2.7
2.9
6
WEIGHT in g
0.2
MSP 2
11.4
5
7
5
11
2.4
5.2
4.1
9.4
0.8
MSP 3
14.8
6.6
7
5
14.4
2.4
5.2
4.1
12.7
1.5
Note
• General tolerance: ± 0.2 mm
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
RESISTANCE
RANGE

RATED POWER
P25 °C
W
LIMITING ELEMENT
VOLTAGE
V
TOLERANCE
±%
TEMPERATURE
COEFFICIENT
± ppm/°C
MSP 1 B
0.04 to 2.2K
1
50
0.5, 1, 2, 5
25, 50, 100
MSP 2 B
0.04 to 4.7K
2
120
0.5, 1, 2, 5
25, 50, 100
MSP 3 B
0.04 to 13K
2.5
200
0.5, 1, 2, 5
25, 50, 100
MSP 1 C
10 to 332K
0.5
300
0.5, 1
25, 50
MSP 2 C
10 to 1M
1
350
0.5, 1
25, 50


Revision: 24-Feb-14
Document Number: 50003
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Vishay Sfernice Series
METAL FILM
MSP 1 B
MSP 2 B
MSP 3 B
MSP 1 C
MSP 2 C
0704M
1107M
1607M
0704M
1107M
1W
2W
2.5 W
0.5 W
1W
± 5 % E24 Series
0.04 to
2.2K
0.04 to
4.7K
0.04 to
13K
-
-
± 2 % E48 Series
0.04 to
2.2K
0.04 to
4.7K
0.05 to
13K
-
-
± 1 % E96 Series
0.04 to
2.2K
0.04 to
4.7K
0.05 to
13K
10 to
332K
10 to
1M
± 0.5 % E96 Series
0.4 to
2.2K
0.4 to
4.7K
0.3 to
13K
10 to
332K
10 to
1M
50 V
120 V
200 V
300 V
350 V
MSP 1 B
MSP 2 B
MSP 3 B
MSP 1 C
MSP 2 C
-
-
-
180K
122.5K
Metric Size
Rated Dissipation at + 25 °C, P25
Ohmic Range in 
Relation to Tolerance 
(with Prefered Ohmic 
Value Series)
WIREWOUND
Limiting Element Voltage, Umax. AC/DC
Series
Critical Resistance
Temperature Coefficient
Failure Rate
CECC 40402-801
- 55 °C/+ 200 °C
< 1  ± 100 ppm/°C
1  to < 10  ± 50 ppm/°C
10  ± 25 ppm/°C
E6
10-6/h
E6
10-6/h
- 55 °C/+ 155 °C
10  to 332 k
K3: ± 50 ppm/°C
K4: ± 25 ppm/°C
> 332 k
E0 or A
10-4/h
-
-
MECHANICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Wirewound
Encapsulant
Metal Film
Thermoset
Resistive Element
CuNi or NiCr
Ceramic Substrate
Alumina or Steatite
Termination
NiCr or NiP
Alumina
Electrolytic pure matte tin
ENVIRONMENTAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Temperature Range
Climatic Category (LCT/UCT/days)
Wirewound
Metal Film
- 55 °C to 275 °C
- 55 °C to 155 °C
55/200/56
55/125/10





Revision: 24-Feb-14
Document Number: 50003
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
PERFORMANCE
CONDITIONS
TESTS
Wirewound
REQUIREMENTS
Metal Film
IEC 60115-1
5 Pr or U = 2 Umax./5 s
Short Time Overload
Load Life
IEC 60115-1
90’/30’ cycles
1000 h Pr + 25 °C
8000 h Pr
Dielectric w/s Voltage
IEC 60115-1
URMS = 500 V/60 s
± (0.5 % + 0.05 )
± (3 % + 0.05 )
±1%
-
± (0.5 % + 0.05 )
± 0.5 %
± (0.5 % + 0.05 )
±1%
IEC 60115-1
IEC 60068-2-21 Test Ue3
2 mm/10 times
± (0.25 % + 0.05 )
± 0.25 %
IEC 60115-1
IEC 60068-2-27 Test Ea
50 g’s/half sine/3 times by direction (i.e. 18 shocks)
± (0.25 % + 0.05 )
n/a
± (0.25 % + 0.05 )
± 0.25 %
± (0.5 % + 0.05 )
n/a
- 55 °C/+ 125 °C
IEC 60115-1
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
IEC 60115-1
IEC 60068-2-3 Test Ca
95 % HR/40 °C
Humidity
(Steady State)
56 days
Substrate Bending Test
10 days
IEC 60115-1
IEC 60068-2-6 Test Fc
Vibration
10 Hz/2000 Hz
10 Hz/500 Hz
IEC 60115-1
IEC 60068-2-58 Solder bath
260 °C/10 s
Resistance to 
Soldering Heat
POWER RATING
TEMPERATURE RISE
125
250
50
MSP C
25
0
- 55
25 50
100
155
200
250 275
AMBIENT TEMPERATURE IN °C
SP
3
B
M
1B
150
SP
100
2
B
M
MS
P
75
200
SP
2
C
M
C
MSP B
1
100
M
SP
HOT SPOT TEMPERATURE IN °C
RATED POWER IN %
± 0.25 %
± 0.25 %
Climatic Sequence
0
- 100
± (0.25 % + 0.05 )
± (0.25 % + 0.05 )
- 55 °C/+ 200 °C
Shock
Metal Film
No flashover or breakdown
Leakage current < 10 μA
IEC 60115-1
IEC 60068-2-14 Test Na
5 cycles (30’ at LCT/30’ at UCT)
Rapid Change of
Temperature
Wirewound
CECC 40402-801
50
0
0
0.5
1
1.5
2
2.5
3
RATED POWER IN W
SURFACE MOUNTING OF MSP B
NON INDUCTIVE WINDING FOR MSP B
Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an
iron 40 W: 3 s at 350 °C.
Non-inductive (Ayrton Perry) winding available.
Please consult Vishay Sfernice.
Soldering is possible by wave, reflow and vapor phase.
Revision: 24-Feb-14
Document Number: 50003
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
PACKAGING
In bulk (plastic bag of 100 units or multiples)
In tube:
MSP1 70 units per tube
MSP2 50 units per tube
MSP3 40 units per tube
In reel of 500 units for MSP1 and MSP2
DIMENSIONS in millimeters - Informative Data
P0
T1
T
W
T2
T4
T3
P
Tube
B0
A0
Cross section of tube
K0
Reel
TUBE PACKAGING
MSP 1
MSP 2
MSP 3
REEL PACKAGING
T1
T2
T3
T4
LENGTH
A0
B0
K0
P0
W
T
6.6
6.8
4.6
4.8
530
3.9
7.35
4.25
4
12
0.254
8
7.43
11.91
5.36
4
24
0.368
12
9.2
8.7
8
7.5
615
P
N/A
MARKING
Vishay Sfernice trademark, ohmic value (in ), tolerance (in %), series and style, technology, manufacturing date.
ORDERING INFORMATION
MSP
1
B
48U7
SERIES
STYLE
TECHNOLOGY
B: Wirewound
C: Metal Film
±1%
NON INDUCTIVE OHMIC VALUE TOLERANCE
WINDING
Optional
TC
BA100
e3
Applicable
only in “C”
technology
PACKAGING
LEAD (Pb)-FREE
SAP PART NUMBERING GUIDELINES
M
GLOBAL
MODEL
MSP
S
P
1
OPTION
SIZE
Blank
or
N
(Non
inductive
winding)
1B
2B
3B
1C
2C
Revision: 24-Feb-14
B
4
8
R
OHMIC VALUE
The first four digits are
significant figures and the
last digit specifies the
number of zeros to follow.
R designates decimal point.
48R70 = 48.7 
B=
48701 = 48 700 
Wirewound
10002 = 100 000 
C=
R0100 = 0.01 
Metal film
R4700 = 0.47 
...
7
TOL.
B = 0.1 %
F=1%
G=2%
J=5%
K = 10 %
0
F
TEMP.
COEF.
Blank
or
Applicable only
on metal film
technologies
1C and 2C:
H  K3
or
E  K4
T
2
0
E
3
PACKAGING
SPECIAL
RoHS
S14 = Bag
(100 pieces)
R10 = Reel
(500 pieces)
T25 = Tube
(70 pieces)
T17 = Tube
(40 pieces)
T20 = Tube
(50 pieces)
As
applicable
E3 =
Pure tin
Document Number: 50003
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000