MSP www.vishay.com Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies FEATURES • According to CECC 40402-801 (wirewound) • Wide range of ohmic values (0.04 to 1 M) • Low temperature coefficient (± 25 ppm/°C available) • Good electrical insulation • All welded construction and molded encapsulant • High power ratings (up to 2.5 W) • Stability class 0.5 • Pure matte tin termination • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface mounting equipment and can withstand wave and reflow soldering techniques. DIMENSIONS in millimeters Recommended Soldering Areas C A E Z B W F D F X X SERIES A B C D E F W X Z MSP 1 6.9 3.8 3.8 2.5 6.5 1.4 2.7 2.9 6 WEIGHT in g 0.2 MSP 2 11.4 5 7 5 11 2.4 5.2 4.1 9.4 0.8 MSP 3 14.8 6.6 7 5 14.4 2.4 5.2 4.1 12.7 1.5 Note • General tolerance: ± 0.2 mm STANDARD ELECTRICAL SPECIFICATIONS MODEL RESISTANCE RANGE RATED POWER P25 °C W LIMITING ELEMENT VOLTAGE V TOLERANCE ±% TEMPERATURE COEFFICIENT ± ppm/°C MSP 1 B 0.04 to 2.2K 1 50 0.5, 1, 2, 5 25, 50, 100 MSP 2 B 0.04 to 4.7K 2 120 0.5, 1, 2, 5 25, 50, 100 MSP 3 B 0.04 to 13K 2.5 200 0.5, 1, 2, 5 25, 50, 100 MSP 1 C 10 to 332K 0.5 300 0.5, 1 25, 50 MSP 2 C 10 to 1M 1 350 0.5, 1 25, 50 Revision: 24-Feb-14 Document Number: 50003 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MSP www.vishay.com Vishay Sfernice TECHNICAL SPECIFICATIONS RESISTIVE TECHNOLOGY Vishay Sfernice Series METAL FILM MSP 1 B MSP 2 B MSP 3 B MSP 1 C MSP 2 C 0704M 1107M 1607M 0704M 1107M 1W 2W 2.5 W 0.5 W 1W ± 5 % E24 Series 0.04 to 2.2K 0.04 to 4.7K 0.04 to 13K - - ± 2 % E48 Series 0.04 to 2.2K 0.04 to 4.7K 0.05 to 13K - - ± 1 % E96 Series 0.04 to 2.2K 0.04 to 4.7K 0.05 to 13K 10 to 332K 10 to 1M ± 0.5 % E96 Series 0.4 to 2.2K 0.4 to 4.7K 0.3 to 13K 10 to 332K 10 to 1M 50 V 120 V 200 V 300 V 350 V MSP 1 B MSP 2 B MSP 3 B MSP 1 C MSP 2 C - - - 180K 122.5K Metric Size Rated Dissipation at + 25 °C, P25 Ohmic Range in Relation to Tolerance (with Prefered Ohmic Value Series) WIREWOUND Limiting Element Voltage, Umax. AC/DC Series Critical Resistance Temperature Coefficient Failure Rate CECC 40402-801 - 55 °C/+ 200 °C < 1 ± 100 ppm/°C 1 to < 10 ± 50 ppm/°C 10 ± 25 ppm/°C E6 10-6/h E6 10-6/h - 55 °C/+ 155 °C 10 to 332 k K3: ± 50 ppm/°C K4: ± 25 ppm/°C > 332 k E0 or A 10-4/h - - MECHANICAL SPECIFICATIONS RESISTIVE TECHNOLOGY Wirewound Encapsulant Metal Film Thermoset Resistive Element CuNi or NiCr Ceramic Substrate Alumina or Steatite Termination NiCr or NiP Alumina Electrolytic pure matte tin ENVIRONMENTAL SPECIFICATIONS RESISTIVE TECHNOLOGY Temperature Range Climatic Category (LCT/UCT/days) Wirewound Metal Film - 55 °C to 275 °C - 55 °C to 155 °C 55/200/56 55/125/10 Revision: 24-Feb-14 Document Number: 50003 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MSP www.vishay.com Vishay Sfernice PERFORMANCE CONDITIONS TESTS Wirewound REQUIREMENTS Metal Film IEC 60115-1 5 Pr or U = 2 Umax./5 s Short Time Overload Load Life IEC 60115-1 90’/30’ cycles 1000 h Pr + 25 °C 8000 h Pr Dielectric w/s Voltage IEC 60115-1 URMS = 500 V/60 s ± (0.5 % + 0.05 ) ± (3 % + 0.05 ) ±1% - ± (0.5 % + 0.05 ) ± 0.5 % ± (0.5 % + 0.05 ) ±1% IEC 60115-1 IEC 60068-2-21 Test Ue3 2 mm/10 times ± (0.25 % + 0.05 ) ± 0.25 % IEC 60115-1 IEC 60068-2-27 Test Ea 50 g’s/half sine/3 times by direction (i.e. 18 shocks) ± (0.25 % + 0.05 ) n/a ± (0.25 % + 0.05 ) ± 0.25 % ± (0.5 % + 0.05 ) n/a - 55 °C/+ 125 °C IEC 60115-1 - 55 °C/+ 200 °C - 55 °C/+ 125 °C IEC 60115-1 IEC 60068-2-3 Test Ca 95 % HR/40 °C Humidity (Steady State) 56 days Substrate Bending Test 10 days IEC 60115-1 IEC 60068-2-6 Test Fc Vibration 10 Hz/2000 Hz 10 Hz/500 Hz IEC 60115-1 IEC 60068-2-58 Solder bath 260 °C/10 s Resistance to Soldering Heat POWER RATING TEMPERATURE RISE 125 250 50 MSP C 25 0 - 55 25 50 100 155 200 250 275 AMBIENT TEMPERATURE IN °C SP 3 B M 1B 150 SP 100 2 B M MS P 75 200 SP 2 C M C MSP B 1 100 M SP HOT SPOT TEMPERATURE IN °C RATED POWER IN % ± 0.25 % ± 0.25 % Climatic Sequence 0 - 100 ± (0.25 % + 0.05 ) ± (0.25 % + 0.05 ) - 55 °C/+ 200 °C Shock Metal Film No flashover or breakdown Leakage current < 10 μA IEC 60115-1 IEC 60068-2-14 Test Na 5 cycles (30’ at LCT/30’ at UCT) Rapid Change of Temperature Wirewound CECC 40402-801 50 0 0 0.5 1 1.5 2 2.5 3 RATED POWER IN W SURFACE MOUNTING OF MSP B NON INDUCTIVE WINDING FOR MSP B Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an iron 40 W: 3 s at 350 °C. Non-inductive (Ayrton Perry) winding available. Please consult Vishay Sfernice. Soldering is possible by wave, reflow and vapor phase. Revision: 24-Feb-14 Document Number: 50003 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MSP www.vishay.com Vishay Sfernice PACKAGING In bulk (plastic bag of 100 units or multiples) In tube: MSP1 70 units per tube MSP2 50 units per tube MSP3 40 units per tube In reel of 500 units for MSP1 and MSP2 DIMENSIONS in millimeters - Informative Data P0 T1 T W T2 T4 T3 P Tube B0 A0 Cross section of tube K0 Reel TUBE PACKAGING MSP 1 MSP 2 MSP 3 REEL PACKAGING T1 T2 T3 T4 LENGTH A0 B0 K0 P0 W T 6.6 6.8 4.6 4.8 530 3.9 7.35 4.25 4 12 0.254 8 7.43 11.91 5.36 4 24 0.368 12 9.2 8.7 8 7.5 615 P N/A MARKING Vishay Sfernice trademark, ohmic value (in ), tolerance (in %), series and style, technology, manufacturing date. ORDERING INFORMATION MSP 1 B 48U7 SERIES STYLE TECHNOLOGY B: Wirewound C: Metal Film ±1% NON INDUCTIVE OHMIC VALUE TOLERANCE WINDING Optional TC BA100 e3 Applicable only in “C” technology PACKAGING LEAD (Pb)-FREE SAP PART NUMBERING GUIDELINES M GLOBAL MODEL MSP S P 1 OPTION SIZE Blank or N (Non inductive winding) 1B 2B 3B 1C 2C Revision: 24-Feb-14 B 4 8 R OHMIC VALUE The first four digits are significant figures and the last digit specifies the number of zeros to follow. R designates decimal point. 48R70 = 48.7 B= 48701 = 48 700 Wirewound 10002 = 100 000 C= R0100 = 0.01 Metal film R4700 = 0.47 ... 7 TOL. B = 0.1 % F=1% G=2% J=5% K = 10 % 0 F TEMP. COEF. Blank or Applicable only on metal film technologies 1C and 2C: H K3 or E K4 T 2 0 E 3 PACKAGING SPECIAL RoHS S14 = Bag (100 pieces) R10 = Reel (500 pieces) T25 = Tube (70 pieces) T17 = Tube (40 pieces) T20 = Tube (50 pieces) As applicable E3 = Pure tin Document Number: 50003 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000