QFM Datasheet

QFM
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Resistor
FEATURES
• Wire bondable
• Small size: 0.020 inches square
• Case: 0202
• Resistance range: 1.0  to 1 M
• DC power rating: 25 mW
Product may not be to scale
• Quartz substrate: < 0.1 pF shunt capacitance
The QFM series tantulum nitride on quartz single-value
resistor chips offer a small size, wide ohmic value range and
excellent frequency response.
• Resistor material: Tantalum nitride, self passivating
• Moisture resistant
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
The QFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
APPLICATIONS
The QFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFMs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
The QFM top-contact resistor chips are designed to handle
substantial power loads in many types of hybrid packages.
They are ideally suited for this purpose because of their
small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
VALUE
Total Resistance Range
1 to 1M

± 0.1, ± 1, ± 5
%
± 25, ± 50, ± 100, ± 250
ppm/°C
Standard Tolerances
TCR
UNIT
Tightest Standard Tolerance Available
1 % 0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
1Ω
10 Ω
30 Ω 100 Ω
200 kΩ 430 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
100  to 250 k
< 100  or > 251 k
- 35 typ.
- 20 typ.
dB
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
± 0.5 R/R
%
± (0.25 + 0.01 ) R/R
%
- 55 to + 125
°C
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
± 0.25 max. R/R
%
High Temperature Exposure, + 150 °C, 100 h
± 0.5 max. R/R
%
Dielectric Voltage Breakdown
200
V
Insulation Resistance
1012 min.

Operating Voltage
100 max.
V
DC Power Rating at + 70 °C (Derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 05-Apr-13
0.025
W
± 0.25 max. R/R
%
Document Number: 61078
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
QFM
www.vishay.com
Vishay Electro-Films
CONFIGURATIONS in inches
0.004
0.020
0.020
0.007
0.020
0.016
0.006
0.004
0.016
0.004
0.004
TYPICAL RANGE
30 Ω to 819 Ω
TYPICAL RANGE
1 Ω to 29 Ω
TYPICAL RANGE
820 Ω to 1 MΩ
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.020" x 0.020" ± 0.003" (0.5 mm x 0.5 mm ± 0.076 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
Quartz
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad size
0.004" x 0.004" (0.10 mm x 0.10 mm) minimum
Number of Pads
2
Pad Material
10 kÅ minimum aluminum (Au optional)
Backing
None, lapped quartz (Au optional)
GLOBAL PART NUMBER INFORMATION
Global Part Number: QFM50000FKANHWS
Global Part Number Description: QFM 5K 1 % 100 ppm/°C Al None H WS
Q
F
M
MODEL
RESISTANCE
QFM
First 4 digits
are significant
figures of
resistance
Revision: 05-Apr-13
5
0
0
RESISTANCE
MULTIPLIER
CODE
TOLERANCE
CODE
(%)
C = 0.001
B = 0.01
A = 0.1
0=1
1 = 10
2 = 100
3 = 1000
B = 0.1
C = 0.25
D = 0.5
F = 1.0
G = 2.0
J = 5.0
K = 10.0
0
0
TCR
(ppm/°C)
E = ± 25
C = ± 50
K = ± 100
M = ± 250
F
K
A
N
H
W
S
TERMINATION
BACK
METAL
VISUAL
CLASS
PACKAGING
CODE
G = Gold
A = Aluminum
G = Gold
N = None
H = Class H
K = Class K
WS =
Waffle pack
100 min., 1 mult
Document Number: 61078
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000