VISHAY I N T E RT E CH N OLO G Y , I N C . INTERACTIVE data book THIN FILM PRODUCTS vishay Electro-films vsD-db0005-0404 Notes: 1.To navigate: a) Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents page to go to the main Table of Contents page. b) Click on the products within the Table of Contents to go directly to the datasheet. c) Use the scroll or page up/page down functions. d) Use the Adobe ® Acrobat ® page function in the browser bar. 2.To search the text of the catalog use the Adobe ® Acrobat ® search function. One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components THIN FILM PRODUCTS V i s h a y E l e c t r o - F i l m s , I n c. High Density Interconnects Hybrid Resistors/Capacitors Microwave Components Inductors High TCR Sensors w w w. v i s h a y. c o m DATA BOOK V I S H A Y I N T E R T E C H N O L O G Y, I N C . VISHAY INTERTECHNOLOGY, INC. DISCRETE SEMICONDUCTORS RECTIFIERS SMALL-SIGNAL DIODES ZENER & SUPPRESSOR DIODES MOSFETs RF TRANSISTORS OPTOELECTRONICS ICs PASSIVE COMPONENTS CAPACITORS RESISTIVE PRODUCTS MAGNETICS INTEGRATED MODULES DC/DC CONVERTERS STRESS SENSORS AND TRANSDUCERS STRAIN GAGES AND INSTRUMENTS Schottky (single, dual) Standard, Fast and Ultra-Fast Recovery (single, dual) Clamper/Damper Bridge Superectifier ® Sinterglass Avalanche Diodes Schottky and Switching (single, dual) Tuner/Capacitance (single, dual) Bandswitching PIN Zener Diodes (single, dual) TVS (TransZorb,® Automotive, ESD, Arrays) Power MOSFETs JFETs Bipolar Transistors (AF and RF) Dual Gate MOSFETs MOSMICs® IR Emitters, Detectors and IR Receiver Modules Opto Couplers and Solid State Relays Optical Sensors LEDs and 7 Segment Displays Infrared Data Transceiver Modules Custom products Power ICs Analog Switches Tantalum Capacitors Solid Tantalum Capacitors Wet Tantalum Capacitors Ceramic Capacitors Multilayer Chip Capacitors Disc Capacitors Film Capacitors Power Capacitors Heavy Current Capacitors Aluminum Capacitors Silicon Capacitors Foil Resistors Film Resistors Thin Film Resistors Thick Film Resistors Metal Oxide Film Resistors Carbon Film Resistors Wirewound Resistors Variable Resistors Cermet Variable Resistors Wirewound Variable Resistors Conductive Plastic Variable Resistors Networks/Arrays Non-Linear Resistors NTC Thermistors PTC Thermistors Varistors Inductors Transformers PHOTOSTRESS® INSTRUMENTS TRANSDUCERS Load Cells Weighing Systems ONE OF THE WORLD'S LARGEST MANUFACTURERS OF DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTS Thin Film Products Vishay Electro-Films, Inc. Vishay Electro-Films, Inc. 111 Gilbane Street Warwick, Rhode Island 02886 USA Phone: +1 401 738-9150 Fax: +1401738-4389 www.vishay.com NOTICE The information in this catalog has been carefully checked for accuracy, and though it is believed to be correct, no warranty, either express or implied, is made as to either its applicability to, or its compatibility with, specific requirements; nor does Vishay Intertechnology, Inc. and its affiliates assume any responsibility for correctness of this information, nor for damages consequent to its use. All such printed materials are not legally binding unless confirmed in writing pursuant to §§463 and 480 11 of the German Code of Civil Law. Warning Regarding Life Support Applications Not all products listed in this catalog are generally recommended for use in life support systems where a failure or malfunction of the component may directly threaten life or cause injury. The user of products in such applications assumes all risks of such use and will agree to hold Vishay Intertechnology, Inc. and all the companies whose products are represented in this catalog, harmless against all damages. HIGH DENSITY INTERCONNECT Vishay Electro-Films CHIP RESISTORS • High Density Interconnects CHIP MICROWAVE RESISTORS CAPACITORS • Hybrid Resistors/Capacitors • Microwave Components RESISTOR CAPACITOR ARRAYS CHIP RESISTOR ARRAYS Vishay Electro-Films, Inc. Thin Film Technology CHIP VOLTAGE DIVIDERS • Inductors HIGH TCR SENSOR • High TCR Sensors CHIP INDUCTOR METALIZED WAFERS www.vishay.com PACKAGED PRODUCTS NETWORKS VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Table of Contents Vishay Electro-Films THIN FILM PRODUCTS THIN FILM HIGH DENSITY INTERCONNECT PRODUCTS High Density Interconnect Flow Chart ................................................................................................................................................. 5 HDI Single Layer ............... ...................................................................................................................................................................... 6 HDI Multi Layer.................. ...................................................................................................................................................................... 9 General Design Guidelines ................................................................................................................................................................... 11 Ceramic..............................Design Layout Guidelines: Ceramic............................................................................................................ 12 Microwave .........................Design Layout Guidelines: Microwave ........................................................................................................ 16 Silicon ................................Design Layout Guidelines: Silicon............................................................................................................... 18 THIN FILM CHIP RESISTORS, WIRE BONDABLE Chip Resistors, Single Value Flow Chart ............................................................................................................................................ 20 CC1.....................................20 x 40 NiCr on Alumina ............................................................................................................................. 22 CC2.....................................30 x 30 NiCr on Alumina ............................................................................................................................. 24 CC3.....................................50 x 50 NiCr on Alumina ............................................................................................................................. 26 CC4.....................................50 x 100 NiCr on Alumina ........................................................................................................................... 28 CC5.....................................100 x 100 NiCr on Alumina ......................................................................................................................... 30 CC6.....................................30 x 40 NiCr on Alumina ............................................................................................................................. 32 CC8.....................................20 x 20 NiCr on Alumina ............................................................................................................................. 34 SFC.....................................20 x 20 Ta2N on Alumina ............................................................................................................................ 36 SFM ....................................20 x 20 Ta2N on Silicon............................................................................................................................... 38 SFP .....................................22 x 22 Ta2N on Silicon with Part Mark....................................................................................................... 40 SFN.....................................20 x 20 NiCr on Silicon................................................................................................................................ 42 SFX .....................................40 x 40 Ta2N Megohm on silicon ................................................................................................................ 44 SC3 .....................................50 x 50 NiCr on Silicon................................................................................................................................ 46 QFM ....................................20 x 20 Ta2N on Quartz .............................................................................................................................. 48 QFN ....................................20 x 20 NiCr on Quartz ............................................................................................................................... 50 QFX ....................................50 x 50 Ta2N Megohm on Quartz ............................................................................................................... 52 BCR ....................................20 x 20 Ta2N Back-Contact on Silicon ........................................................................................................ 54 BCM....................................15 x 15 Ta2N Back-Contact on Silicon ........................................................................................................ 56 BCP ....................................22 x 22 Ta2N Back-Contact on Silicon with Part Mark ................................................................................ 58 PWA ...................................30 x 45 Ta2N 500mW on Silicon ................................................................................................................. 60 PWB ...................................70 x 70 Ta2N 1W on Silicon ........................................................................................................................ 62 Chip Resistors Dual Value Flow Chart ................................................................................................................................................ 64 CTT .....................................30 x 30 Ta2N Center-Tap on Alumina ......................................................................................................... 66 CTA ....................................30 x 30 NiCr Center-Tap on Alumina .......................................................................................................... 68 CCC ....................................100 x 100 NiCr Center-Tap on Alumina ...................................................................................................... 70 CTR (Low Ohmic)..............30 x 30 Ta2N Low Ohm Center Tap on Silicon ........................................................................................... 72 Custom Networks .............30 x 30 Ta2N Dual Resistor Divider on Silicon............................................................................................ 74 CTN ....................................30 x 30 NiCr Center-Tap on Silicon ............................................................................................................ 76 CTR ....................................30 x 30 Ta2N Center-Tap on Silicon ........................................................................................................... 78 CTM ....................................40 x 40 Ta2N Megohm Center-Tap on Silicon ............................................................................................ 80 CTQ ....................................30 x 30 Ta2N Center-Tap on Quartz ........................................................................................................... 82 CC7, CCB ...........................30 x 30, 50 x 50 NiCr User Trim on Alumina............................................................................................... 84 SC7, SCB ...........................30 x 30, 50 x 50 NiCr User Trim on Silicon ................................................................................................. 86 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 2 Revision: 28-May-04 Table of Contents Vishay Electro-Films MICROWAVE RESISTORS Microwave Resistors Flow Chart ..........................................................................................................................................................88 Thin Film Microwave Components .......................................................................................................................................................89 MIB ..................................... 10 x 20 Ta2N Microwave on Alumina...........................................................................................................90 MIC ..................................... 20 x 40 Ta2N Microwave on Alumina...........................................................................................................92 MIF ..................................... 16 x 20 Ta2N Microwave on Alumina...........................................................................................................94 MID ..................................... 50 x 50 Ta2N Microwave on Alumina...........................................................................................................96 TMR.................................... 20 x 60 Ta2N Multi-Tap on Alumina.............................................................................................................98 MOS/NMOS CAPACITORS . MOS/NMOS Capacitors Flow Chart ....................................................................................................................................................100 NC Series................................... Single Value Chip and Wire Capacitors.............................................................................................101 CBA............................................ Four Capacitor Binary Array ..............................................................................................................104 CBB, CBC .................................. Five Capacitor Binary Array...............................................................................................................106 FILTER NETWORKS Filter Networks Flowchart ...................................................................................................................................................................108 RCN............................................ Resistor/Capacitor Filter Networks ....................................................................................................109 CHIP RESISTOR ARRAYS Chip Resistor Arrays Flow Chart ........................................................................................................................................................111 CLA, CLB................................... 60 x 90 Ta2N Isolated or Pin 1 Common Array..................................................................................112 MTR............................................ 30 x 30 Ta2N Multi-Tap on Silicon .....................................................................................................114 MTT ............................................ 40 x 40 Ta2N Multi-Tap on Silicon .....................................................................................................116 CHIP VOLTAGE DIVIDERS . Chip Voltage Dividers Flow Chart.......................................................................................................................................................118 ATA ............................................ 58 x 58 Ta2N Voltage Dividers on Silicon ..........................................................................................119 HIGH TCR SENSORS High TCR Sensors Flow Chart ...........................................................................................................................................................121 RT............................................... High TC Resistors on Silicon .............................................................................................................122 INDUCTORS Inductors Flow Chart ...........................................................................................................................................................................124 PSC ............................................ Spiral Chip Inductor ...........................................................................................................................125 METALIZED COMPONENTS Metalized Plates Flow Chart.................................................................................................................................................................127 Metalized Plates ....................................................................................................................................................................................128 HP - MT Conductor Hybrid Circuit Substrates...................................................................................................................................129 THIN FILM SURFACE MOUNT NETWORKS Packaged Product Networks Flow Chart ...........................................................................................................................................130 SLR ............................................ Single Layer Resistor Carrier.............................................................................................................131 RESISTORS NETWORK TIME STABILITY CURVES ...............................................................................................................133 THICKNESS CONVERSION CHART.............................................................................................................................................134 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Revision: 28-May-04 www.vishay.com 3 Alphabetical Product Index Vishay Electro-Films PAGE NO. PAGE NO. ATA........................................................................................ 119 Inductors Flow Chart ........................................................... 124 BCM......................................................................................... 56 MIB .......................................................................................... 90 BCP ......................................................................................... 58 MIC .......................................................................................... 92 BCR ......................................................................................... 54 Microwave Guidelines ........................................................... 16 CBA ....................................................................................... 104 Microwave Resistors Flow Chart.......................................... 88 CBB, CBC ............................................................................. 106 MID .......................................................................................... 96 CCC ......................................................................................... 70 Metalized Plates ................................................................... 128 CC1.......................................................................................... 22 Metalized Plates Flow Chart................................................ 127 CC2.......................................................................................... 24 MIF........................................................................................... 94 CC3.......................................................................................... 26 MOS/NMOS Capacitors Flow Chart.................................... 100 CC4.......................................................................................... 28 MTR ....................................................................................... 114 CC5.......................................................................................... 30 MTT........................................................................................ 116 CC6.......................................................................................... 32 NC Series .............................................................................. 101 CC7, CCB ................................................................................ 84 Packaged Product Networks Flow Chart........................... 130 CC8.......................................................................................... 34 PSC........................................................................................ 125 Ceramic Guidelines ............................................................... 12 PWA......................................................................................... 60 Chip Resistor Arrays Flow Chart........................................ 111 PWB......................................................................................... 62 Chip Resistors Dual Value Flow Chart................................. 64 QFM ......................................................................................... 48 Chip Resistors Single Value Flow Chart.............................. 20 QFN ......................................................................................... 50 Chip Voltage Dividers Flow Chart ...................................... 118 QFX.......................................................................................... 52 CLA, CLB .............................................................................. 112 Resistor Network Time Stability Curves............................ 133 CTA.......................................................................................... 68 RCN ....................................................................................... 109 CTM ......................................................................................... 80 RT .......................................................................................... 122 CTN.......................................................................................... 76 SC3 .......................................................................................... 46 CTQ ......................................................................................... 82 SC7, SCB ................................................................................ 86 CTR.......................................................................................... 78 SFC.......................................................................................... 36 CTR (Low Ohmic)................................................................... 72 SFM ......................................................................................... 38 CTT .......................................................................................... 66 SFN.......................................................................................... 42 Custom Networks .................................................................. 74 SFP .......................................................................................... 40 Filter Networks Flow Chart ................................................. 108 SFX .......................................................................................... 44 HDI Multi Layer......................................................................... 9 Silicon Guidelines.................................................................. 18 HDI Single Layer ...................................................................... 6 SLR........................................................................................ 131 High Density Interconnect Flow Chart................................... 5 Thickness Conversion Chart .............................................. 134 High TCR Sensors Flow Chart............................................ 121 Thin Film Microwave Components....................................... 89 HP - MT Conductor Circuit Substrates .............................. 129 TMR ......................................................................................... 98 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 4 Revision: 29-Mar-04 Vishay Electro-Films SUBSTRATE CHARACTERISTICS ...........................07 Thin Film High Density Interconnect Products (HDI) PATTERN CAPABILITIES ...........................07 RESISTOR PARAMETERS ..........................07 SINGLE LAYER PROTECTIVE COATING ..........................08 HIGH CONDUCTANCE POWER LINES ..........................08 LASER MACHINED SHAPES ..........................08 LINE WIDTH CONTROL ..........................08 HIGH DENSITY INTERCONNECT PRODUCTS AIR OR POLYIMIDE SUPPORTED BRIDGES ........................09 BACKSIDE PATTERNING .........................09 MULTILAYER FRONT TO BACK VIA CONNECTION ........................09 MULTI-LAYER INTERCONNECT METALIZATION .......................10 HIGH TEMPERATURE APPLICATIONS .......................10 GENERAL INFORMATION GENERAL DESIGN GUIDELINES ......................06 .......................11 DESIGN LAYOUT DESIGN LAYOUT DESIGN LAYOUT GUIDELINES GUIDELINES GUIDELINES FOR CERAMIC FOR SILICON MICROWAVE AND QUARTZ APPLICATIONS .......................12 ......................18 .....................16 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61055 Revision: 20-Nov-03 www.vishay.com 5 HIGH DENSITY INTERCONNECT Substrate Product Flow Chart HIGH DENSITY INTERCONNECT Substrate Design Guidelines Single Layer Vishay Electro-Films GENERAL INFORMATION Vishay Electro-Films (EFI) has produced high quality, patterned thin-film substrates in volume since 1974 for both the hybrid circuit and the microwave industries. These products are used in both military and industrial hybird circuit applications. Our unique volume capability is achieved through the use of high capacity metalizing systems and patterning processes providing tight process parameter control, product uniformity, and production flexibility. This long term experience with engineering and manufacturing of these products has naturally evolved into the expertise necessary to engineer and manufacture high density multi-layer products, flip chip and ball grid array technologies and specific application oriented devices. Although a high percentage of hybrid or microwave substrates are produced with conductor patterns only, the majority have associated circuit resistors deposited as well. Customers can add active devices and any other passive components as required. High density and multi-layer products are developed with Vishay EFI and the customer working as a team. Because of the high complexity of these devices and their close relationship to end product performance, this team approach assures the optimum performance and price. Vishay EFI’s processes and equipment have been designed to support the production of small lots as well as high volume runs on the same production and class 1000 lines. All processing is performed in contiguous class 100 clean rooms. Substrates are available in a wide variety of materials, conductor and adhesion metals and with either nichrome or tantalum nitride resistors depending on the application, customer preference, and manufacturing requirements. Other options include: metalized-through holes, filled vias, backside metalization and patterning, wrap around patterned edges, thick copper power line conductors, and both aluminum and gold wire bond pads on the same substrate to provide monometalic interfaces in very high temperature applications. ∑ Vishay EFI manufactures patterned substrates for the hybrid circuit industry as large as 4 inches x 4 inches, many with high density fine lines and sometimes with hundreds of resistors. ∑ Patterning on both surfaces, interconnections by metalized through holes or patterned wrap-around edges. ∑ Vishay EFI proprietary, military approved, patterned, resistor overcoat protection (required for 0.1% or tighter tolerances). Polyimide available where possible at additional cost. ∑ Overcoat or polyimide insulation for wire bonding over conductors. ∑ Special bond pad metalization for very high temperature applications. ∑ In-house laser machining of specially shaped substrates. ∑ Beryllium Oxide or Aluminum Nitride substrate material for very high power applications. ∑ Multi-level metalization using polyimide insulation. Vishay EFI’s high quality is maintained by the extensive use of statistical process controls in league with product assurance teams composed of production, engineering and product assurance personnel. As an added control, 100% of all substrates are visually inspected to MIL-STD-883 Method 2032, level H or K or to the Vishay EFI standard industrial specification as required. 100% of resistors are tested for value and tolerance. Customer-specific inspection and test requirements can also be included. DESIGN AND LAYOUT Most customers provide their own layout design, leaving appropriate space for Vishay EFI to design-in the resistors at the proper locations. Vishay EFI guidelines provide the parameters required for calculating the resistor areas as well as design parameters necessary for proper thin film processing and manufacture. After order placement Vishay EFI will design the resistor details and review the layout design sometimes suggesting small modifications to facilitate manufacture. If required, Vishay EFI can provide the layout design for hybrid substrates from a schematic. In either case the completed layout design is always sent to the customer for final approval prior to mask fabrication. CAD SYSTEMS Vishay EFI CAD systems are compatible with DXF AUTOCAD, thus designs are often received from customer by direct data link. Additionally, Vishay assembles all resistor probe cards for laser trimming testing in-house. and the EFI and This extensive internal production tooling capability enables Vishay EFI to focus on new designs and initial delivery requirements, free from the difficulties that sometimes arise from subcontractor delays. MASK FABRICATION Vishay EFI has masks fabricated by outside vendors. Vishay EFI has developed working arrangements and direct data links with select vendors for quick turn around of mask sets. PRICE QUOTATION If your layout is complete, send it with the appropriate data to the Vishay EFI Application Engineering Department (401) 738-9150 FAX: (401) 738-4389. If you do not already have a completed layout, contact our Application Engineers to discuss your requirements. Please include a table of resistor values, tolerances, temperature coefficients of resistance (TCR) and power dissipations. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 6 Document Number: 61056 Revision: 13-Jan-04 Vishay Electro-Films SUBSTRATE CHARACTERISTICS Material Al2O3, BeO, AIN, Quartz, Silicon, Sapphire, Ferrite Surface Finish Al2O3 As Fired, 2μin maximum; Polished, to 0.5μin Dimensions 0.02 inches x 0.02 inches to 4 inches x 4 inches Dimensional Tolerance ± 0.005 inches scribed; (± 0.001 inches saw cut) Thickness 0.005 inches to 0.050 inches Thickness Tolerance 0.002 inches standard to as tight as 0.0005 inches Sputtered Resistor NiCr, Ta2N Sputtered Metalization Ti, TiW, Pd, Ni, Au, Al Electro-Plated Metals Au, Cu, Ni, Solder Electroless Plated Sn, Ni, Au PATTERN CAPABILITIES Conductor Line Width 0.002 inches, most economical; 0.001 inches, available Conductor Line Thickness 50 to 300μinch; 0.002 inches thick Cu standard; up to 0.006 inches available Line Width Tolerance 0.0001 inch at 150μinches thickness over 2 inch span Through Hole Minimum Diameter 0.005 inches dependent on substrate thickness Through Hole Tolerance, Diameter and Position ± 0.002 inches Metalized Hole Diameter to Substrate Thickness Ratio 0.8 minimum or greater preferred RESISTOR PARAMETERS Value Range 1W to 10MW Absolute Tolerance to ± 0.05% Ratio Tolerance to ± 0.01%* Absolute TCR Ratio TCR Long Term Stability ± 50ppm/°C standard; ± 25 and ± 10ppm/°C available ± 5.0ppm/°C standard; ± 1.0ppm/°C available Absolute and Ratio, see graphs in Resistor Long Term Stability datasheet *Contact Applications Engineering for tighter tolerances. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61056 Revision: 13-Jan-04 www.vishay.com 7 HIGH DENSITY INTERCONNECT Substrate Design Guidelines Single Layer HIGH DENSITY INTERCONNECT Substrate Design Guidelines Single Layer Vishay Electro-Films PROTECTIVE COATING In 1975, Vishay Electro-Films (EFI) developed a low cost patternable overcoat to protect the resistors and other critical areas from mechanical damage during handling. It is essential to overcoat resistors of 0.1% or tighter tolerances to maintain tolerance during assembly and test of the hybrid, and it is beneficial to overcoat all resistors. This overcoating material was evaluated by the Rome Air Force Development Laboratory and approved for use under MIL-STD-883. In this photograph the dark areas are where the patterned overcoating has been applied over the resistors. HIGH CONDUCTANCE POWER LINES For high power applications, Vishay EFI can provide power lines with up to 0.006 inches thick copper. Copper conductors to 0.002 inches thickness can be integrated on substrates in relatively close proximity to the fine line patterns without any degradation of the patterning capability. Copper lines are isolated with nickel barrier layers to prevent copper oxidation and intermetalic diffusion during high temperature processing and operation. This photograph illustrates thick conductor bonding pads and interconnects. Thin small-signal lines can easily be incorporated on the same substrate. LASER MACHINED SHAPES In house laser machining of ceramic provides Vishay EFI with the ability to offer custom shaped ceramic substrates, cut outs and holes for special applications. LINE WIDTH CONTROL Vishay EFI’s tight process controls and extensive class 100 clean room facilities, provide the capability for maintaining superior line width and line edge definition for critical elements such as couplers and filters. Lines of 500 microinches with spaces of 400 microinches and tolerances of ± 50 microinches can be supplied in volume. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 8 Document Number: 61056 Revision: 13-Jan-04 Vishay Electro-Films Patterned Substrate Products AIR OR POLYIMIDE SUPPORTED BRIDGES Vishay Electro-Films (EFI) has extensive experience in providing rugged and well-defined air bridges down to 0.001 inch width and with consistent air gap dimensions. The substrate to the right has air bridges associated with the lange coupler section of this microwave circuit. The line drawing depicts a close up view of the air bridge configuration. The shaded portion of the drawing is the first conductor layer. A sacrificial layer is deposited and patterned before the second conductor layer is put in place. The intermediate layer is then removed leaving the completed air bridge. The same process can be done using polymide; in this case the intermediate polymide layer remains in place on the finished part. Bridges supported by polymide provide a more rugged structure for handling during final hybrid assembly. LANGE COUPLERS Combining its fine pattern and supported bridge capabilities, Vishay Electro-Films can offer large coupler features down to 0.5 mil with pattern resolution of 0.1 mil. This type of coupler offers compact design, wide band width and low loss parameters. BACKSIDE PATTERNING AND FRONT TO BACK VIA CONNECTION Conductor interconnect patterns or ground plane definition can be provided on the bottom surface of the substrate. Front to back alignment can be held to 0.003 inches. The side by side photographs below show the top and bottom conductor patterns of a two-sided patterned substrate. Interconnection from the top and bottom pattern is by metalized through holes. Front to ground plate or back side conduction pattern connections can be made by metalized through holes, patterned wrap around edges or by means of filled vias. Wherever possible metalized through holes or patterned wrap around edges (or a combination of both) are recommended. The minimum recommended metalized through hole diameter is 80% of the substrate thickness. The filled via process adds significant complexity and thus cost to the process. Filled vias, however, can be used to provide additional low thermal conductivity paths to a ground plate heat sink where necessary. Vias are planar to 100 microinches. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61058 Revision: 28-May-04 www.vishay.com 9 HIGH DENSITY INTERCONNECT HDI Multi Layer HIGH DENSITY INTERCONNECT HDI Multi Layer Vishay Electro-Films MULTI-LAYER INTERCONNECT METALIZATION Areas of first level metalization can be overcoated with polyimide and a second level of interconnects can be provided to accommodate high density interconnect requirements. Two levels of conductors can be seen in areas of the substrate shown to the right. In this case interconnects to the chips on the first layer and to conductors on the first layer are made with wire bonding to the second layer. Interconnects can also be made by metalized through vias. HIGH TEMPERATURE APPLICATIONS When designing hybrid assemblies to operate at temperatures above 125°C it becomes important to provide monometallic interconnects to prevent intermetalic diffusion and resultant long term reliability problems. For these situations, Vishay Electro-Films (EFI) has developed processes for depositing both aluminum and gold bonding pads on the same substrate. This structure provides for monometallic interconnects. Aluminum wire can be used to connect from the aluminum pads on the substrate. Similarly, gold wire can be used to connect gold pads on the substrate to gold hermetic package terminals. Appropriate barrier metals are included in substrate processing to provide long term reliability in high temperature applications. Aluminum Bond Pads Active Chip Bond Pad Products using this technology have successfully operated at 250°C. The graph on the Resistor Long Term Stability data sheet illustrates stable performance of Vishay EFI nichrome resistors at 200°C operating temperature. The photgraph to the right shows aluminum bonding pads (light gray) around the active chip bond pad. These aluminum pads are connected to the gold conductor traces with appropriate metallic barrier metalization. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 10 Document Number: 61058 Revision: 28-May-04 Vishay Electro-Films Standard Layout Guidelines DESIGN CAPABILITIES Thin Film High Density Interconnect design guide is directed at engineers looking to design the following: ∑ Simple resistor networks ∑ Integrated resistor-capacitor networks ∑ Multilayer substrate that involve up to 5 layers ∑ Custom thin film substrate on alumina (AI2O3) Aluminum nitride (AlN) or beryllium oxide (BeO) ∑ Substrates with special shapes, vias, and patterns ∑ Substrates for microwave applications The wide array of capabilities allows users to find solutions for applications servicing many markets such as: ∑ Military ∑ Automotive ∑ Instrumentation - microwave ∑ Telecommunications - CATV, fiber optic and wireless ∑ Aerospace ∑ Medical DIMENSIONS in inches (millimeters) MAXIMUM SUBSTRATE SIZE 4.1” [104] X 4.1” [104] CONDUCTORS & RESISTORS - VALUES & TOLERANCES VALUE TO ± 0.1% LAYER TO LAYER VALUE TO ± 5% REGISTRATION ± 0.0005” [0.01] WIDTH: 0.002” [0.05] MIN. WIDTH: 0.002” [0.05] MIN. METAL PULLBACK 0.003” [0.08] PREFERRED LENGTH: 0.002” [0.05] MIN. 0.005” [0.13] MIN. HALF VIA. EDGE WRAP 0.003” [0.08] MIN. LATERAL RESISTOR SPACING (FOR LASER ENTRY) AIR BRIDGE LINE SPACING 0.0005” [0.013] MIN. TOL. ± 0.0001” [0.003] MIN. DIA. 0.010” [0.254] OR SUBSTRATE THICKNESS SLOTTED EDGEWRAP 0.007” [0.18] ± 0.005” [0.13] INTRUSION 0.006” [0.15] TYP RADIUS 0.020” [0.51] TYP WIDTH LINE WIDTH 0.0005” [0.013] MIN. TOL. ± 0.0001” [0.003] 0.001” [0.025] SQ. MIN CONTACT AIR BRIDGES OR SUPPORTED MULTILAYER CONDUCTORS (UP TO 5 LAYERS) VIA PAD 0.005” [0.13] TYP. DIELECTRIC VIAS 0.002” [0.08] DIA. BACK PATTERN AIR BRIDGE HOLES AND MACHINED FEATURES REGISTRATION VIA TO CIRCUIT ± 0.002” [0.05] FRONT TO BACK PATTERN REGISTRATION ± 0.002” [0.05] ANNULUS 0.005” [0.13] FOR PLATED THRU HOLES 0.0025” [0.064] FOR FILLED VIAS 0.004” [0.01] FOR VENTED FILLED VIAS CIRCUIT FEATURE LOCATION TOLERANCE ± 0.002” [0.05] RELATIVE TO CIRCUIT DATUM THIN FILM CAPACITORS VALUE: L x W x 0.15pF/SQ. MIL (Si3N4) VALUE: L x W x 0.055pF/SQ. MIL (POLY) CONDUCTOR OVERLAP AREA DIELECTRIC AREA RADIUS ± 0.006 [0.15] MIN CUTOUT HOLE LOCATION ± 0.002” [0.51] NON-CUMMULATIVE TOLERANCE TO ± 0.003” [0.08] 0.020” [0.51] MIN. LENGTH: 0.005” [0.13] MIN. DIAMOND SAWN TO ± 0.001” [0.025] ± 0.003” [0.08] STD. CUTOUT SPACING ± 0.015” [0.38] MIN. HOLE DIAMETER GREATER OF 0.020” [0.51] OR HOLE DIAMETER] 0.8 x SUBSTRATE THICKNESS FOR PLATED THRU HOLES 0.007” FOR FILLED VIAS AS MEASURED FROM THE LASER EXIT SIDE SURFACE DIAMETER TO ± 0.001” [0.025] THRU DIAMETER 0.001” PER 0.010” [0.25] THICKNESS LASER CUT FEATURES ± 0.003” [0.08] VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61081 Revision: 28-May-04 www.vishay.com 11 HIGH DENSITY INTERCONNECT General Design Guidelines HIGH DENSITY INTERCONNECT Guidelines: Ceramic Vishay Electro-Films Design Layout Guidelines for Ceramic Substrates FOR CERAMIC SUBSTRATES The following information is the criteria for the layout designer. Deviation from the rules stated below must be done with extreme care. The criteria for the layout designer follows: 1. The maximum active area on a ceramic plate is the nominal size of the plate minus 0.250 inches. Example a 2.00 inches square plate would have an active area of 1.750 inches square. 2. The preferred distance for any conductor, or pad from the substrate border is 0.005 inches. The acceptable distance is 0.002 inches. 3. The preferred conductor line width is 0.004 inches or greater. The preferred space between any two conductors is 0.004 inches. The acceptable distance is 0.002 inches. 4. The preferred probe pad is size 0.010 inches by 0.010 inches. The acceptable probe pad size opening is 0.006 inches by 0.006 inches. The acceptable Kelvin probe pad size opening is 0.008 inches by 0.006 inches. Place probe pads as close to the outside pattern edge as possible, adhering to minimum guidelines, to eliminate probes from shadowing resistors during laser trim. 5. The preferred minimum resistor line width and space 0.001 inches. The acceptable minimum line width and space is 0.0005 inches. 6. The power density at 100W/square is 100Watts/inches square at a film temperature of +125°C. The current density (Id), expressed in mA/mil line width, is inversely proportional to the resistivity of the resistor material. Id= (k)/ (resistivity) where k=(100)(mA/mil)(ohms/square) Example (for 25W/square); Id = [(100)(mA/mil)(W/square)/ (25W/square)] = 4mA/mil line width Example (for 50W/square): Id = [(100)(mA/mil)(W/square)/ (50W/square)] = 2mA/mil line width 7.0 The optimum resistivity for absolute TCR is listed below: 7.1 For absolute TC of £ ± 15ppm/°C use 125W/square. 7.2 For absolute TC of > ± 15ppm/°C and £ ± 25ppm/°C use 125W square (or 100 to 150W/square at lower yield). 7.3 For absolute TC of > ± 26ppm/°C and £ ± 49ppm/°C use 125W/square (or 75 to 175W/square at lower yield). 7.4 For absolute TC of ≥ 50ppm/°C the nominal resistivity for design must be within the range of 50 to 200W/square. 0.003 RESISTOR LINE WIDTH 8.2 Design rule for ≥ 150 to 200W/square material. Design to 70% of nominal value with a 70% of nominal trim range. The 70% trim range may include a 40% trim block, a 20% link and a 10% link. 8.3 Design rule for £ 150W/square material. Design to 75% of nominal value with a 60% of nominal trim range. The 60% trim range may include a 35% trim block, a 15% link and a 10% link. 9.0 The preferred spacing between adjacent conductor and resistor is 0.004 inches. The acceptable spacing is 0.002 inches. The preferred spacing for laser entry and exit is ≥ 0.003 inches between adjacent circuit elements. The minimum spacing is 0.002 inches. 0.004 inches 0.004 inches 10. Resistor/conductor interface is nominally 0.002 inches. For conductor widths of 0.004 inches or less, the overlap of the resistor termination to the conductor attach area is one-half the conductor width. For conductor widths greater than 0.004 inches, the overlap of the resistor termination to the conductor attach area is one-half the conductor width up to a maximum of 0.005 inches. 0.002 inches 0.002 inches 0.002 inches 0.002 inches 0.002 inches 8.0 Resistors shall be designed using the following criteria: 8.1 Any resistor with an absolute tolerance tighter than 0.1% accuracy requires an additional high resolution fine trim area with a minimum trim range of 1% of the nominal value. 11. Resistor line widths of less than 0.002 inches require a “step-up” to 0.002 inches at the conductor/resistor interface. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 12 Document Number: 61059 Revision: 13-Nov-03 Vishay Electro-Films 0.002 inches HIGH DENSITY INTERCONNECT Guidelines: Ceramic 0.002 inches 0.001 inches 12. Typical designs for trim are as follows: 1.5 X FINISH FINISH B D START A X B X = minimum line width C 0.005 inches MINIMUM TOP HAT WIDTH D E A START START 1. The corner square is considered to be 0.5 squares. CORNER SQUARE RESISTOR LINEWIDTH VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61059 Revision: 13-Nov-03 ww ww.vishay.com 13 HIGH DENSITY INTERCONNECT Guidelines: Ceramic Vishay Electro-Films DESIGN LAYOUT GUIDELINES FOR CERAMIC SUBSTRATES in inches BONDING PADS QUARTZ ALUMINA Minimum Bonding pads with no overcoat 0.006 x 0.006 0.006 x 0.006 Minimum Bonding pads with overcoat 0.008 x 0.008 0.008 x 0.008 Preferred Bonding pads size 0.010 x 0.010 0.010 x 0.010 Minimum distance from conductor or pad to substrate border 0.002 0.003 Preferred distance from conductor or pad to substrate border 0.003 0.005 Resistor to conductor edge 0.001 0.001 Preferred resistor to conductor edge 0.002 0.002 0.002 0.002 RESISTOR TO CONDUCTOR INSERTION Resistor to conductor insertion Preferred resistor to conductor insertion Resistor line width of less than 2.0 require a step-up (0.003 inches or 50% of attached pad width) 0.002 0.002 Resistor to conductor or pad 0.001 0.0025 Preferred distance from resistor to conductor or pad 0.002 0.004 MINIMUM SPACING Resistor to resistor (same resistor) (same space as resistor linewidth) Resistor to resistor (adjacent resistor) 0.0005 0.001 Conductor to conductor 0.001 0.002 Preferred conductor to conductor 0.002 0.004 Distance from resistor to substrate border 0.003 0.005 Preferred distance from resistor to substrate border 0.004 0.007 Conductor width traces 0.001 0.002 Preferred conductor width 0.002 0.004 Resistor width 0.005 MINIMUM DIMENSIONS Preferred resistor width Laser entry 0.005 (0.001 or greater) 0.002 0.0025 Preferred laser entry 0.003 0.003 Laser kerf width 0.005 0.005 Laser kerf (customer specification) (Per customer specs.) Top hat width 0.003 0.005 Saw cut street width 0.006 0.006 Overcoat distance from the insertion point of the resistor 0.002 0.002 Overcoat covering overlap 0.002 0.002 Notes: • • • • • Pad one must be shaped with a notch or a rounded corner. All drawings must show where to measure linewidths. All designs must have an alignment marker. The corner square on a resistor is considered to be 0.5 squares. Any resistor with a tolerance tighter than 0.1% accuracy requires an additional high resolution fine trim area with a minimum trim range of 1% of the nominal value. • The active area on herman ceramic plate is 4.16 inches by 3.36 inches. • The active area on super herman ceramic plate is 4.16 inches by 4.16 inches. • The active area on quartz plate is 2.75 inches by 2.75 inches. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 14 Document Number: 61059 Revision: 13-Nov-03 Vishay Electro-Films HIGH DENSITY INTERCONNECT Guidelines: Ceramic DESIGN LAYOUT GUIDELINES FOR CERAMIC CHIP COMPONENTS in inches BONDING PADS ALUMINA NON-KELVIN 0.004 x 0.004 KELVIN-(R < 1kW) or (R < 100kW & TOL. < 1%) 0.004 x 0.007 MINIMUM SPACING Resistor to Bonding Pad 0.0007 Resistor to Metal 0.0006 Resistor to Resistor (same resistor) (smaller of resistor width or 0.0005) Resistor to Resistor (adjacent resistor) 0.0005 Metal to Metal 0.001 MINIMUM OVERLAP Metal to Oxide Window N/A Metal to Back Contact N/A Resistor to Back Contact Resistor to Metal N/A Resistor Continuous under Metal Edges of Resistor & Metal Coincide MINIMUM DIMENSIONS Aluminum width 0.0005 Gold width 0.002 Resistor width 0.0005 Resistor to Metal Connections 0.0005 Ladder Rung width 0.0005 Ladder Gap width 0.0015 Back Contact Window Street width Ladder Centers (nicking allowed) Ladder Centers (no nicking allowed) Solid Trim 5 x Power Density - Conservative 5 x Power Density - Maximum N/A 0.008 2 x RUNG WIDTH RUNG WIDTH + 1.5 Allowed 500W/square inches 5kW/square inch Notes: • • • • • If possible one Kelvin pad should be on all designs for edge sensing. One bonding pad should be shaped differently for orientation purposes. All drawings will show where to measure linewidth and its value for critical applications. Laser entries will be 0.0015 square inches minimum. Overcoat opening shall include street and alignment marker. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61059 Revision: 13-Nov-03 www.vishay.com 15 HIGH DENSITY INTERCONNECT Guidelines: Microwave Vishay Electro-Films Design Layout Guidelines for Microwave Applications The following guidelines for thin film substrate design are presented to provide the microwave designer with practical and production achievable thin film parameter capabilities as well as to provide a relative cost impact to achieve the tightest specifications. This cost relation is indicated by providing two achievable limits: one with little or no cost premium and the other at some level of cost impact. The tightest tolerances should be specified only where required for circuit performance. If the tightest tolerances are specified for all parameters, even if not required, unnecessary costs will result. 1. SUBSTRATE SIZE: Sizes are available in most substrate materials to 4 inches x 4 inches. Size tolerances: A. Scribe and break ± 0.003 inches most economical B. Saw to size ± 0.001 inches small premium Surface finish: A. 2 - 4 microinch as fired most economical B. 2 microinch or 1 microinch maximum polished small premium Thickness tolerance as fired: A. 0.015 ± 0.002 inches (standard), ± 0.001 inches small premium B. 0.010 ± 0.001 inches (standard), ± 0.0005 inches premium Thickness tolerance polished: A. ± 0.0005 inches standard 2. METALIZATION: A. Sputtered: NiCr, Ta2N, TiW, Ni, Au, Pd, Al, B. Electro- Plated : Au (to 500 microinches), Ni (to 200 microinches), Cu (to 0.005 inches). (Thick copper can be selectively plated on the power lines). Compatibility: While the majority of these materials can be used in multilayer combinations, some combinations are not compatible dependent on patterning requirements. For combinations not widely used or when in doubt, please contact Vishay Electro-Films (EFI) application engineering before finalizing specifications. 3. PATTERNS: A. Minimum Line Widths or Spaces: 0.0005 inches B. Line Width Tolerance: a. Metal thickness up to 150 microinches ± 0.0001 inches (standard) ± 0.00005 inches (premium) b. Metal thickness over 150 microinches ± 0.0001 inches per each 100 microinches thickness: Tighter per discussion with Vishay EFI application engineering (premium). C. Metalization to Substrate Edge: If metalization is brought to the substrate edge, slight disturbance of the metal will occur because of the sawing or scribing operation. If this slight disturbance is not acceptable, a 0.002 inch designed pullback from the edge is required. This also applies to the backside groundplane. 0.002 INCH METAL PULLBACK FROM SUBSTRATE EDGE IF REQUIRED METAL SUBSTRATE NOT TO SCALE 4. AIR BRIDGES: Width: 0.001 inch minimum (standard); 0.005 inch (premium); (either true air bridge or over polyimide dielectric). 5. THROUGH HOLES: A. Diameter: 0.006 inch minimum B. Taper The hole will be tapered down from the laser spot entry side, normally the top side, 0.001 inch for every 0.010 inches substrate thickness. The smallest diameter will be used for the hole dimension. 0.010 INCHES (NOT TO SCALE) 0.0005 INCHES C. Patterned Metalized Slits: Two slits, 0.002 inches wide and 0.006 inches long, will be placed typically 180° opposite across the rim of the via. They will not be placed in a signal path unless there is no option. 6. METALIZED THROUGH HOLES: A. Patterns: When designing through hole patterns, design aminimum of a 0.005 inches ring around each hole (see figure below) to allow for the tolerance build-up caused by hole placement, manufacturing alignment, diameter tolerance, slight laser entrance hole rounding and other factors. 0.005 INCHES MINIMUM If this presents a severe design problem, contact Vishay EFI application engineering. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 16 Document Number: 610 Revision: 12-Nov-03 Vishay Electro-Films METALIZED THROUGH HOLES (continued) B. Double Sided, Front to Back Alignment: ± 0.002 inch (standard), tighter, consult Vishay EFI Application Engineering (premium). C. Metalization: The same metalization layers should be used on each side of the substrate when metalized through holes are used. (Plating thickness may be different). For example, if resistor material is required on the top side, it should also be used on the bottom side for the adhesion layer. D. Size: Metalized through hole diameters should have a minimum ratio of 0.8 with substrate thickness. 7. FILLED VIAS: A. Diameter 0.007 inch standard. Center to center hole placement is 0.000015 inch minimum. Surface finish: The substrate will normally be supplied with a polished or lapped surface necessitated by the fill process. B. Planarity: The filled via will not extend above the substrate or be recessed below the substrate by more than 500μin C. Patterned Metalization Slits: Two slits, 0.002 inch wide and 0.006 inch long, will be placed typically 180° opposite across the rim of the via. They will not be placed in a signal path unless there is no option. SLITS IN METAL Hermeticity: Non-Hermetic. 8. RESISTORS A. Material: Resistors can be either nichrome or tantalum nitride. For most microwave applications tantalum nitride is recommended unless unusual tolerances or long term stability requirements exist. B. Resistivity: Recommended resistivity for Ta2N is 25 -100 ohms/ square; for NiCr is 25 - 200 ohms/square. C. Temperature Coefficient: a. For Ta2N, 25 - 50 ohms/square, less than ±100ppm/°C; 51-100 ohms/square less than ±150ppm/°C. b. For NiCr, 25 - 200 ohm/square, less than ± 50ppm/°C. D. Design: a. Value: For Ta2N, Vishay EFI recommends that all resistors be designed to 80% of value with 20% trim range (e.g. block resistors, add 20% to the width.) All high frequency resistors will be laser edge trimmed to value to preserve frequency response (see figure below). However, Vishay EFI can supply resistors of 20% standard (10% on demand) or looser tolerance which are designed to 100% of value with no laser trimming. Matching of identically designed resistors in relatively close proximity, can be held to 3% without trimming. For nichrome resistors, design all resistors to 80% of value with a 20% trim range. Resistor laser trimmed around center line to maintain frequency response b. Power: To insure adequate long term stability, the following guidelines should be used relative to power handling (current density). RESISTIVITY (OHMS/SQUARE) CURRENT/0.001 INCH OF LINE WIDTH 25 4mA 50 2mA 100 1mA 200 0.5mA E. Stabilization Temperature: For the best long term stability, all Ta2N resistors should be stabilized at approximately 425°C. However, please note that if nickel has been specified under gold for solderability, temperatures above 350°C will cause the nickel to diffuse into the the gold creating two problems. One, nickel oxide will form on the gold surface making soldering difficult and secondly, the resistivity of the gold will increase perhaps adversely effecting electrical performance. Specifying palladium in place of nickel will reduce but not eliminate the problem. For most microwave applications where the resistor tolerances are (Ta2N) 10% or greater, a stabilization temperature of 350°C, nominal, should provide adequate long term stability, Remember that if the resistors are designed to 100% value with no trim allowed, some range in stabilization temperature is required to provide low cost yields. In no case is it recommended that the stabilization temperature be less than 300°C. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 610 Revision: 12-Nov-03 www.vishay.com 17 HIGH DENSITY INTERCONNECT Guidelines: Microwave HIGH DENSITY INTERCONNECT Guidelines: Silicon Vishay Electro-Films Design Layout Guidelines for Silicon Substrates FOR SILICON SUBSTRATES The following information is the criteria for the layout designer. Deviation from the rules stated below must be done with extreme care. The criteria for the layout designer follows: 1. The standard wafer dimensions are 3 inches or 5 inches. 2. The minimum spacing of any metal pad to the finished substrate edge is 0.001 inches. 3. The minimum line width and space for any resistive material is 0.00015 inches. 4. The line width for any aluminum conductor is > 0.0005 inches, line width for gold conductor is > 0.001. 5. The minimum bond pad size is 0.008 inches x 0.005 inches. With the 0.008 inches along the edge of the substrate, unless otherwise specified. 6. The power density for silicon is 2500 watts/inches square at 100 ohms per square. The current density (T) expressed in mA/mil is inversely proportional to the resistivity of the resistor material. Examples for various sheet resistivities: 9. Laser entries require 0.0015 inches square minimum. 10. Design rule percentages for all parts are as follows: Design to 70% of nominal value with a trim range of 70% of nominal trim range (preferred) Design to 70 % of nominal value with a trim range of 60% of nominal trim range (acceptable) 11. Minimum spacing between metal and resistor is ≥ 0.001 inches. 12. Spacing between resistor to resistor (adjacent resistor) is 0.0005 inches. Spacing between resistor to resistor (same resistor) is the smaller of the resistor width or 0.0005 inches. 13. If overcoat is required it must overlap all bond pads by 0.00025 inches. The street must be free of overcoat material. 14. Most silicon parts require saw kerf marks, made of resistor material, which are placed in the street. These saw kerfs are usually placed on all four corners of substrate. They are placed approximately 0.0005 inches away from the bond pad. All silicon parts require an alignment marker on the upper right corner of the substrate street (see illustration) Maximum Substrate Edge (Step & Repeat) 25 ohms/square 10000 Watts/inches square 14.14 A/inches 14.14 mA/milinches 50 ohms/square 5000 Watts/inches square 7.07 A/inches 7.07 mA/milinches 100 ohms/square 2500 Watts/inches square 3.53 A/inches 3.53 mA/milinches 200 ohms/square 1250 Watts/inches square 1.75 A/inches 1.75 mA/milinches 7. All resistors with a ratio tolerance of £ 0.01% that cannot be designed using a link design will require a solid trim tab capable of providing a trim resolution of 25% of the required tolerance. 8. All resistor line widths that are smaller than 0.0005 inches will require a “step-up” to 0.0005 inches at the resistor/ conductor interface. Detail B ABCD ABCD Saw Kerfs Detail C PATTERN AREA Detail A 1/2 Street Width 0.0005 Inches 0.0035 Inches minimum 0.0005 Inches 0.0005 Inches Typ. 0.003 Inches 10 x 0.0001 inches L/S 5 x 0.0002 inches L/S 0.001 Inches 0.0002 0.0005 x 0.0005 inches Detail A Detail B RESISTOR Rev. CONDUCTOR Rev. 0.0015 Inches ABCD ABCD 0.0005 Detail C VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 18 For technical questions contact: efi@vishay.com Document Number: 61061 Revision: 12-Nov-03 Vishay Electro-Films DESIGN LAYOUT GUIDELINES FOR SILICON SUBSTRATES/CHIP COMPONENTS in inches BONDING PADS SILICON QUARTZ ALUMINA NON-KELVIN 0.004 x 0.004 0.004 x 0.004 0.004 x 0.004 KELVIN-(R < 1k ohm) or (R < 100k ohm & TOL. < 1%) 0.004 x 0.007 0.004 x 0.007 0.004 x 0.007 Resistor to Bonding Pad 0.0007 0.0007 0.0007 Resistor to Metal 0.0006 0.0006 0.0006 MINIMUM SPACING Resistor to Resistor (same resistor) (smaller of resistor width or 0.0005) Resistor to Resistor (adjacent resistor) 0.0005 0.0005 0.0005 Metal to Metal 0.001 0.001 0.001 Metal to Oxide Window 0.0005 N/A N/A Metal to Back Contact 0.0005 N/A N/A Resistor to Back Contact 0.0005 N/A N/A MINIMUM OVERLAP Resistor Continuous under Metal Edges of Resistor & Metal Coincide Resistor to Metal MINIMUM DIMENSIONS Aluminum width 0.0005 0.0005 0.0005 Gold width 0.001 0.001 0.002 Resistor width 0.0001 0.0001 0.0005 Resistor to Metal Connections 0.00025 0.00025 0.0005 Ladder Rung width 0.0002 0.0002 0.0005 Ladder Gap width 0.0015 0.0015 0.0015 0.003 x 0.003 N/A N/A 0.006 0.008 0.008 Back Contact Window Street width Ladder Centers (nicking allowed) 2 x RUNG WIDTH Ladder Centers (no nicking allowed) RUNG WIDTH + 0.0015 Solid Trim Not Preferred Not Preferred Allowed 5 x Power Density - Conservative at 50W/square 25kW/square inches 200W/square inches 500W/square inches 5 x Power Density - Maximum* 50kW/square inches 2.5kW/square inches 5kW/square inches Notes •. If possible one Kelvin pad should be on all designs for edge sensing. •. One bonding pad should be shaped differently for orientation purposes. •. All drawings will show where to measure line width and its value for critical applications. •. Laser entries will be 0.0015 square inches minimum. •. Overcoat opening shall include street and alignment marker. •. Maximum ratings degrade long term drift characteristics. VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61061 Revision: 12-Nov-03 For technical questions contact: efi@vishay.com www.vishay.com 19 HIGH DENSITY INTERCONNECT Guidelines: Silicon CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Single Value SIZE (inches) POWER VALUE RANGE PERFORMANCE FILM MODEL ALUMINA SINGLE-VALUE TOP-CONTACT SILICON 0.020 x 0.020 25mW 11 - 1 MEG1 QUARTZ SINGLE-VALUE CHIP RESISTOR SINGLE-VALUE BACK-CONTACT POWER SILICON 0.020 x 0.020 25mW 201 - 510K1 ◆ ■ Ta2N QFM...............48 NiCr QFN...............50 Ta2N QFX............... 52 0.050 x 0.050 20mW 500K1 - 10 MEG1 ◆ 0.020 x 0.020 250mW 101 - 1 MEG1 ◆ Ta2N BCR...............54 0.015 x 0.015 100mW 1001 - 100K1 ◆ Ta2N BCM...............56 0.022 x 0.022 250mW 101 - 1 MEG1 ◆ Ta2N BCP................58 0.030 x 0.045 1/2 watt 0.31 - 1 MEG1 ● Ta2N PWA..............60 0.070 x 0.070 1 watt 101 - 20K1 ● Ta2N PWB..............62 SILICON VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 20 For technical questions contact: efi@vishay.com Document Number: 61054 Revision: 20-Nov-03 Vishay Electro-Films PERFORMANCE 0.020 x 0.040 40mW 101 - 24K1 ■ FILM MODEL NiCr CC1................22 0.030 x 0.030 40 mW 251 - 40K1 ▲ NiCr CC2................24 0.050 x 0.050 100mW 301 - 125K1 ▲ NiCr CC3................26 0.050 x 0.0100 175mW 501 - 400K1 ▲ NiCr CC4................28 0.100 x 0.100 400mW 451 - 1 MEG1 ▲ NiCr CC5 ...............30 0.030 x 0.045 65mW 201 -59K1 ▲ NiCr CC6................32 NiCr CC8................34 Ta2N SFC................36 FILM MODEL ■ Ta2N SFM...............38 ■ Ta2N SFP................40 NiCr SFN................42 Ta2N SFX................44 NiCr SC3................46 0.020 x 0.020 40mW 201 - 10K1 ● 0.020 x 0.020 50mW 101 - 10K1 ◆ SIZE (inches) POWER VALUE RANGE PERFORMANCE 0.020 x 0.020 250mW 11 - 1 MEG 1 0.020 x 0.020 125mW 201 - 510K1 ▲ 0.040 x 0.040 20mW 510K1 - 20 MEG1 ◆ 0.050 x 0.050 400mW 1001 - 50K1 ■ Performance Key ▲ ● ■ ◆ TCR ± 10ppm/°C TCR ± 25ppm/°C TCR ± 50ppm/°C TCR ± 100ppm/°C TOL ± 0.05% TOL ± 0.1% TOL ± 0.5% TOL ± 1% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61054 Revision: 20-Nov-03 For technical questions contact: efi@vishay.com www.vishay.com 21 CHIP RESISTORS SIZE (inch) POWER VALUE RANGE CC1 Vishay Electro-Films CHIP RESISTORS Thin Film 0402 Size Resistor on Alumina FEATURES x Small single chip size: 0.020 x 0.040 inches Product may not be to scale x Resistance range: 10: to 24k: x Alumina substrate x Low stray capacitance: < 0.2pF The CC1 series single-value resistor chips offer a small size, low shunt capacitance and solder pad option. The CC1s nichrome resistor material offers excellent stability. The CC1s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC1s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor material: nichrome x Resistor passivation coat optional x Solder Pads optional APPLICATIONS Vishay EFI CC1 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES* AND TOLERANCES Temperature Coefficient of resistance , values* andTightest tolerances diagram Standard Tolerance Available 0.5% 0.1% ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 10Ω 20Ω 200Ω 12KΩ 24KΩ Note* Only 25: to 1k: are standard strip line designs for microwave applications STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 - Hermetic applications Stability, 1000 hours, + 125°C, 40mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.2% maximum 'R/R ± 0.1% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.1% maximum 'R/R 400V 1012 minimum 100V maximum 40mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 22 For technical questions contact: [email protected] Document Number: 61001 Revision: 13-Nov-03 CC1 Thin Film 0402 Size Resistor on Alumina Vishay Electro-Films DIMENSIONS in inches 0.020 0.020 0.040 0.010 CHIP RESISTORS 0.020 0.040 0.010 0.040 0.010 0.012 0.012 0.012 TYPICAL RANGE 10Ω - 15Ω TYPICAL RANGE 16Ω - 29Ω TYPICAL RANGE 30Ω - 24Ω SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pad size Number of pads Pad material Backing 0.020 x 0.040 ± 0.003 (0.5 x 1.0 ± 0.08mm) 0.010 ± 0.002 (0.254 ± 0.03mm) 99.6% alumina, 2-4 μinch finish Nichrome 0.010 x 0.012 (0.175 x 0.30mm) 2 25kÅ minimum gold standard None OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 100ppm/°C TCR, Gold Terminations W CC1 INSPECTION PRODUCT /PACKAGING FAMILY W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 5000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% * Coating standard E TCR B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G TERMINATIONS G = Gold S = Solder NOTE: Factory will convert order number into final part number VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61001 Revision: 13-Nov-03 For technical questions contact: [email protected] www.vishay.com 23 CC2 Vishay Electro-Films CHIP RESISTORS Thin Film 0303 Size Resistor on Alumina FEATURES x Chip size: 0.030 inches square x Resistance range: 25: to 38k: Product may not be to scale x Alumina substrate x Low stray capacitance: < 0.2pF The CC2 series single-value resistor chips offer a relatively small size, low shunt capacitance and solder pad option. The CC2s nichrome resistor material offers excellent stability. The CC2s are manufactured using Vishay Electro Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC2s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor material: nichrome x Resistor passivation coat optional x Tolerances to 0.05% APPLICATIONS Vishay EFI CC2 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Temperature Coefficient of resistance , values* and Tightest tolerances diagram Standard Tolerance Available 0.1% 0.05% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 25Ω 75Ω 100Ω 20KΩ 38KΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 - Hermetic applications Stability, 1000 hours, + 125°C, 100mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.2% maximum 'R/R ± 0.1% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.1% maximum 'R/R 400V 1012 minimum 100V 100mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 24 For technical questions contact: [email protected] Document Number: 61077 Revision: 13-Nov-03 CC2 Vishay Electro-Films Thin Film 0303 Size Resistor on Alumina DIMENSIONS in inches CHIP RESISTORS 0.030 0.030 0.030 0.030 0.004 0.024 0.006 0.010 R < 100Ω R < 100Ω SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.030 ± 0.003 (1.27 x 1.27 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 μinch finish Resistor material Nichrome Bonding pad size 0.004 x 0.006 (0.100 x 0.15mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 50ppm/°C TCR, Gold Terminations W CC2 INSPECTION PRODUCT /PACKAGING FAMILY W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 5000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE A = 0.05%* B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% *Coating standard D TCR G TERMINATIONS A = ± 10ppm/°C B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G = Gold S = Solder NOTE: Factory will convert order number into final part number VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61077 Revision: 13-Nov-03 For technical questions contact: [email protected] www.vishay.com 25 CC3 Vishay Electro-Films CHIP RESISTORS Thin Film 0505 Size Resistor on Alumina FEATURES x Chip size: 0.050 inches square x Resistance range: 30: to 125k: Product may not be to scale x Alumina substrate x Low stray capacitance: < 0.2pF The CC3 series single-value resistor chips offer a relatively small size, low shunt capacitance and solder pad option. The CC3s nichrome resistor material offers excellent stability. The CC3s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC3s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor material: nichrome x Resistor passivation coat optional x Tolerances to 0.05% x Solder pad optional APPLICATIONS Vishay EFI CC3 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Temperature Coefficient of resistance , values* and Tightest tolerances diagram Standard Tolerance Available 0.1% 0.05% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 30Ω 75Ω 100Ω 40KΩ 125KΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 - Hermetic applications Stability, 1000 hours, + 125°C, 100mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.2% maximum 'R/R ± 0.1% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.1% maximum 'R/R 400V 1012 minimum 100V 100mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 26 For technical questions contact: [email protected] Document Number: 61002 Revision: 12-Nov-03 CC3 Vishay Electro-Films Thin Film 0505 Size Resistor on Alumina DIMENSIONS in inches CHIP RESISTORS 0.050 0.050 0.044 0.010 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 μinch finish Resistor material Nichrome Bonding pad size 0.010 x 0.044 (0.254 x 0.117mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 50ppm/°C TCR, Gold Terminations CC3 W INSPECTION PRODUCT FAMILY /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 5000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE A = 0.05%* B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% *Coating standard D TCR G TERMINATIONS A = ± 10ppm/°C B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G = Gold S = Solder VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61002 Revision: 12-Nov-03 For technical questions contact: [email protected] www.vishay.com 27 CC4 Vishay Electro-Films CHIP RESISTORS Thin Film 0510 Size Resistor on Alumina FEATURES x Chip size: 0.050 x 0.100 inches x Resistance range: 50: to 400k: Product may not be to scale x Alumina substrate x Low stray capacitance: < 0.2pF The CC4 series single-value resistor chips offer increased power in larger size, low shunt capacitance and solder pad option. The CC4s nichrome resistor material offers excellent stability. The CC4s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC4s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor material: nichrome x Resistor passivation coat optional x Tolerances to 0.05% x Solder pad optional APPLICATIONS Vishay EFI CC4 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Temperature Coefficient of resistance , values* and tolerances diagram Tolerance Available Tightest Standard 0.1% 0.05% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 50Ω 150Ω 200KΩ 400KΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 - Hermetic applications Stability, 1000 hours, + 125°C, 175mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.2% maximum 'R/R ± 0.1% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.1% maximum 'R/R 400V 1012 minimum 100V maximum 175mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 28 For technical questions contact: [email protected] Document Number: 61004 Revision: 12-Nov-03 CC4 Vishay Electro-Films Thin Film 0510 Size Resistor on Alumina DIMENSIONS in inches SCHEMATIC CHIP RESISTORS 0.050 0.100 0.065 0.045 0.015 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.100 ± 0.003 (1.27 x 2.54 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 μinch finish Resistor material Nichrome Bonding pad size 0.015 x 0.045 (0.381 x 1.143mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 80:, ± 10%, ± 50ppm/°C TCR, Gold Terminations CC4 W PRODUCT INSPECTION /PACKAGING FAMILY W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 8000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE A = 0.05%* B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% *Coating standard D TCR G TERMINATIONS A = ± 10ppm/°C B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G = Gold S = Solder VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61004 Revision: 12-Nov-03 For technical questions contact: [email protected] www.vishay.com 29 CC5 Vishay Electro-Films CHIP RESISTORS Thin Film 1010 Size Resistor on Alumina FEATURES x Chip size: 0.100 inches square Product may not be to scale x Resistance range: 50: to 1M: x Alumina substrate x Low stray capacitance: < 0.2pF The CC5 series single-value resistor chips offer increased power in larger size, low shunt capacitance and solder pad option. The CC5s nichrome resistor material offers excellent stability. The CC5s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC5s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor material: nichrome x DC power rating: 400mW x Resistor passivation coat optional x Tolerances to 0.05% x Solder pad optional APPLICATIONS Vishay EFI CC5 chip resistors have excellent power dissipation capability and are ideally suited for prototyping. Not suitable for high moisture applications unless protected. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Temperature Coefficient of resistance , values* and tolerances diagram Tightest Standard Tolerance Available 0.05% 0.1% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 50Ω 100Ω 500KΩ 1MΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical ± 0.1% maximum 'R/R Stability, 1000 hours, + 125°C Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.25% maximum 'R/R 200V 1012 minimum Insulation resistance Operating voltage 200V maximum DC power rating at + 125°C (derated to zero at + 150°C) 400mW maximum 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 30 For technical questions contact: [email protected] Document Number: 61005 Revision: 13-Jan-04 CC5 Vishay Electro-Films Thin Film 1010 Size Resistor on Alumina DIMENSIONS in inches CHIP RESISTORS 0.094 0.0075 0.100 0.0075 0.100 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.100 x 0.100 ± 0.003 (2.54 x 2.54 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material 99.6% alumina Resistor material Nichrome Bonding pad size 0.0075 x 0.094 (0.190 x 2.375mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 80:, ± 10%, ± 50ppm/°C TCR, Gold Terminations W CC5 INSPECTION PRODUCT /PACKAGING FAMILY W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 8000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE A = 0.05%* B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% *Coating standard D TCR G TERMINATIONS A = ± 10ppm/°C B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G = Gold S = Solder VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61005 Revision: 13-Jan-04 For technical questions contact: [email protected] www.vishay.com 31 CC6 Vishay Electro-Films CHIP RESISTORS Thin Film 0304 Size Resistor on Alumina FEATURES x Chip size: 0.030 x 0.045 inches x Resistance range: 20: to 59k: Product may not be to scale x Alumina substrate x Low stray capacitance: < 0.2pF x Resistor material: nichrome The CC6 series single-value resistor chips offer a small size, low shunt capacitance and solder pad option. The CC6s nichrome resistor material offers excellent stability. The CC6s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC6s are 100% electrically tested and visually inspected to MIL-STD-883. x Resistor passivation coat optional x Tolerances to 0.05% x Solder pad optional APPLICATIONS Vishay EFI CC6 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic applications where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Temperature Coefficient of resistance , values* and tolerances diagram Tightest Standard Tolerance Available 0.1% 0.05% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 20Ω 75Ω 100Ω 30KΩ 59KΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 - Hermetic applications Stability, 1000 hours, + 125°C, 65mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.2% maximum 'R/R ± 0.1% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.1% maximum 'R/R 400V 1012 minimum 100V maximum 65mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 32 For technical questions contact: [email protected] Document Number: 61006 Revision: 12-Nov-03 CC6 Vishay Electro-Films Thin Film 0304 Size Resistor on Alumina DIMENSIONS in inches CHIP RESISTORS 0.030 0.045 0.020 0.010 0.024 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.045 ± 0.003 (0.762 x 1.143 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 microinch finish Resistor material Nichrome Bonding pad size 0.010 x 0.024 (0.254 x 0.61mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 50ppm/°C TCR, Gold Terminations W CC6 INSPECTION PRODUCT /PACKAGING FAMILY W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) 5000 B RESISTANCE MULTIPLIER VALUE CODE Use first 4 or 5 B = 0.01 significant digits A = 0.1 of resistance 0=1 1 = 10 2 = 100 K TOLERANCE CODE A = 0.05%* B = 0.1%* C = 0.25%* D = 0.5% F = 1.0% G = 2.0% J = 5.0% K = 10% *Coating standard D TCR G TERMINATIONS A = ± 10ppm/°C B = ± 25ppm/°C D = ± 50ppm/°C E = ± 100ppm/°C G = Gold S = Solder VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61006 Revision: 12-Nov-03 For technical questions contact: [email protected] www.vishay.com 33 CC8 Vishay Electro-Films CHIP RESISTORS Thin Film 0202 Size Resistor on Alumina FEATURES x Chip size: 0.020 inches square Product may not be to scale x Resistance range: 20: to 20k: x Alumina substrate The CC8 series resistor chips offer a combination of low shunt capacitance, small size and excellent stability. The CC8s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CC8s are 100% electrically tested and visually inspected to MIL-STD-883. x Low stray capacitance: < 0.2pF x Resistor material: nichrome with passivation coat x Tolerances to 0.5% APPLICATIONS Vishay EFI CC8 chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators Recommended for hermetic environment where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.5% PROCESS CODE ± 25ppm/°C CLASS H* CLASS K* ± 50ppm/°C 303 308 302 307 301 306 ± 100ppm/°C 20Ω 50Ω 5.1KΩ 20KΩ *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 (Passivated film) Stability, 1000 hours, + 125°C, 25mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 1000 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.5% maximum 'R/R ± 0.2% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.5% maximum 'R/R 400V 1012 minimum 100V maximum 35mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 34 For technical questions contact: [email protected] Document Number: 61007 Revision: 20-Nov-03 CC8 Vishay Electro-Films Thin Film 0202 Size Resistor on Alumina DIMENSIONS in inches CHIP RESISTORS 0.020 0.020 0.020 0.020 0.004 0.004 0.012 0.006 TYPICAL RANGE 20Ω - 49Ω TYPICAL RANGE 50Ω - 20KΩ SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.08mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 microinch finish Resistor material Nichrome Bonding pad size 0.004 x 0.006 (0.10 x 0.15mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Passivation Thermalset Plastic Backing None OPTIONS: Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 50ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) CC8 PRODUCT FAMILY 302 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use first 4 significant digits of resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61007 Revision: 20-Nov-03 For technical questions contact: [email protected] www.vishay.com 35 SFC Vishay Electro-Films CHIP RESISTORS Thin Film 0202 Size Resistor on Alumina FEATURES x Small size: 0.020 inches square Product may not be to scale The SFC series resistor chips offer a combination of low shunt capacitance and small size. The SFCs tantalum nitride resistor material offers excellent resistance to high moisture environments. The SFCs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SFCs are 100% electrically tested and visually inspected to MIL-STD-883. x Resistance range: 10: to 10K: x Alumina substrate x Low shunt capacitance: < 0.2pF x Resistor material: tantalum nitride x Moisture resistant APPLICATIONS Vishay EFI SFC chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: x Amplifiers x Couplers x Oscillators x Filters x Attenuators TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1.0% PROCESS CODE ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C 10Ω 50Ω 5.6KΩ 10KΩ CLASS H* CLASS K* 002 122 001 121 000 120 *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202 Method 106 Stability, 1000 hours, + 125°C, 25mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical ± 0.5% maximum 'R/R ± 0.5% maximum 'R/R - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.5% maximum 'R/R 400V 1012 minimum 100V maximum 62mW maximum ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 36 For technical questions contact: [email protected] Document Number: 61008 Revision: 02-Dec-03 SFC Thin Film 0202 Size Resistor on Alumina Vishay Electro-Films DIMENSIONS in inches CHIP RESISTORS 0.020 0.020 0.020 0.020 0.004 0.004 0.012 0.006 TYPICAL RANGE 10Ω - 49Ω TYPICAL RANGE 50Ω - 10KΩ SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.768mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2-4 microinch finish Resistor material Tantalum nitride, self-passivating Bonding pad size 0.004 x 0.006 (0.10 x 0.15mm) minimum Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 50:, ± 10%, ± 250ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample visually inspected parts loaded in matrix trays (4% AQL) SFC PRODUCT FAMILY 000 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use first 4 significant digits of resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61008 Revision: 02-Dec-03 For technical questions contact: [email protected] www.vishay.com 37 SFM Vishay Electro-Films CHIP RESISTORS Thin Film Top-Contact Resistor FEATURES x Small size: 0.020 inches square Product may not be to scale The SFM series single-value resistor chips offer a small size, wide ohmic value range and excellent power capacity. The SFMs tantalum nitride resistor material offers excellent resistance to high moisture environments. The SFMs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SFMs are 100% electrically tested and visually inspected to MIL-STD-883. x Resistance range: 1.0: to 1M: x DC power rating: 250mW x Oxidized silicon substrate for good power dissipation x Resistor material tantalum nitride, self passivating x Moisture resistant APPLICATIONS Vishay EFI SFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages. They are ideally suited for this purpose because of their small size. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1% 0.5% 0.1% CLASS H* 050 051 045 040 *MIL-PRF-38534 inspection criteria ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C 1Ω 10Ω 30Ω 100Ω PROCESS CODE CLASS K* 123 122 121 120 200KΩ 360KΩ 620KΩ 1MΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 100: - 250k: < 100: or > 251k: Moisture resistance, MIL-STD-202 Method 106 Stability, 1000 hours, + 125°C, 125mW - 35dB typical - 20dB typical ± 0.5% maximum 'R/R ± 0.25% maximum 'R/R Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours - 55°C to + 125°C ± 0.25% maximum 'R/R ± 0.5% maximum 'R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 250mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 'R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 38 For technical questions contact: [email protected] Document Number: 61017 Revision: 19-Mar-04 SFM Vishay Electro-Films Thin Film Top-Contact Resistor CONFIGURATIONS in inches CHIP RESISTORS 0.004 0.020 0.020 0.007 0.020 0.016 0.006 0.016 0.004 0.004 TYPICAL RANGE 1Ω - 29Ω 0.004 TYPICAL RANGE 30Ω - 819Ω TYPICAL RANGE 820Ω - 1MΩ SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.004 x 0.004 (0.10 x 0.10mm) Number of pads 2 Pad material 25kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold backing for eutectic die attach Gold bonding pads, 15kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10K:, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample , commercial visually inspected parts loaded in matrix trays (4% AQL) SFM PRODUCT FAMILY 045 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits of resistance 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61017 Revision: 19-Mar-04 For technical questions contact: [email protected] www.vishay.com 39 SFP Vishay Electro-Films CHIP RESISTORS Thin Film Top-Contact Resistor with Part Mark FEATURES • Part marked - 5 digits Product may not be to scale The SFP series single-value resistor chips offer a small size, wide ohmic value range and excellent power capacity. The SFPs are part marked with resistance value allowing user the ability to visually determine the resistance value of the chip. The SFPs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SFPs are 100% electrically tested and visually inspected to MIL-STD-883. • Small size: 0.022 inches square • Resistance range: 11 to 1M1 • DC power rating: 250mW • Oxidized silicon substrate for good power dissipation • Resistor material: tantalum nitride, self passivating • Moisture resistant APPLICATIONS Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of the chip. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1% 0.5% PROCESS CODE 0.1% ± 25ppm/°C CLASS H* CLASS K* ± 50ppm/°C 103 108 ± 100ppm/°C 102 107 101 106 100 105 ± 250ppm/°C 11 101 301 1001 200K1 430K1 620K1 1M1 *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202 Method 106 Stability, 1000 hours, + 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 35dB typical - 20dB typical ± 0.5% maximum 6R/R ± 0.25% maximum 6R/R - 55°C to + 125°C ± 0.25% maximum 6R/R ± 0.5% maximum 6R/R 200V 1012 minimum 100V maximum 250mW ± 0.25% maximum 6R/R Values above 1M available VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 40 For technical questions contact: efi@vishay.com Document Number: 61000 Revision: 04-Dec-03 SFP Thin Film Top-Contact Resistor with Part Mark Vishay Electro-Films DIMENSIONS in inches CHIP RESISTORS 0.005 TYPICAL RANGE < 301 PART MARK 0.018 TYPICAL RANGE 301 - 1991 SCHEMATIC 0.022 PART MARK PART MARK PART MARK PART MARK PART MARK PART MARK PART MARK TYPICAL RANGE 2001 - 1K1 TYPICAL RANGE 1K1 - 1M1 0.004 STANDARD MARKING - 5 DIGITS XXXX X Four significant digits of value Multiplier C = 0.001 B = 0.01 A = 0.1 0=0 1 = 10 2 = 100 3 = 1000 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pad size Number of pads Pad material Backing 0.022 x 0.022 ± 0.003 (0.558 x 0.558 ± 0.05mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Tantalum nitride, self-passivating 0.004 x 0.004 (0.10 x 0.10mm) 2 25kÅ minimum aluminum None, lapped semiconductor silicon OPTIONS: Gold backing for eutectic die attach Gold bonding pads, 15kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10K1, ± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) SFP PRODUCT FAMILY 100 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits of the resistance 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61000 Revision: 04-Dec-03 For technical questions contact: efi@vishay.com www.vishay.com 41 SFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 20 inches square • Resistance range: 101 to 510k1 Product may not be to scale • Resistor material: nichrome The SFN series resistor chips offer a combination of nichrome stability, good power rating and small size. The SFNs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SFNs are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate • 125mW power APPLICATIONS Vishay EFI SFN resistor chips are widely used in hybrid packages where space is limited. Designed with capacity to handle substantial power loads, they also have the benefit of nichrome stability. Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available PROCESS CODE 0.1% CLASS H* ± 10ppm/°C 208 200 202 204 *MIL-PRF-38534 inspection criteria ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 201 501 1001 CLASS K* 209 201 203 205 510K1 1K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 - 35dB typical - 20dB typical ± 0.25% maximum 6R/R Stability, 1000 hours, + 125°C, 50mW Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 125mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 42 For technical questions contact: efi@vishay.com Document Number: 61025 Revision: 19-Mar-04 SFN Vishay Electro-Films NiCr Thin Film, Top-Contact Resistor DIMENSIONS in inches 0.004 CHIP RESISTORS 0.008 0.014 0.020 0.004 0.004 0.020 TYPICAL RANGE 101 - 551 0.004 TYPICAL RANGE 561 - 7.4K1 TYPICAL RANGE 7.5K1 - 510K1 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.51 x 0.51 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Nichrome (Passivation Optional) Bonding pad size 0.004 x 0.004 (0.10 x 0.10mm) Number of pads 2 Pad material 15kÅ minimum Gold Backing None, lapped semiconductor silicon OPTIONS: Aluminum Pads Passivation (thermal set plastic) Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10K1, ± 1%, ± 50ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) SFN PRODUCT FAMILY 202 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use the first 4 significant digits of the resistance 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61025 Revision: 19-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 43 SFX Vishay Electro-Films CHIP RESISTORS Thin Film, Top-Contact Megohm Resistor FEATURES • Megohm resistance range: 0.51M to 20M1 • Chip size: 0.040 inches square Product may not be to scale • Reduced hybrid size • Resistor material: tantalum nitride, self-passivating The SFX series resistor chips extends the range of available resistance to 20 Meg. These offer one of the best combinations of small size and high value available. The SFXs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SFXs are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate APPLICATIONS The SFX series megohm resistor chips are designed for use in hybrid packages which require small-size high-value resistors. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% PROCESS CODE 0.5% ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C ± 350ppm/°C 510K1 2M1 3.3M1 10M1 20M1 CLASS H* CLASS K* 059 155 054 156 017 158 018 157 *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 12dB typical Moisture resistance, MIL-STD-202 Method 106, (Passivated only) ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 10mW ± 1.0% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 400V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 20mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 44 For technical questions contact: efi@vishay.com Document Number: 61018 Revision: 04-Dec-03 SFX Vishay Electro-Films Thin Film, Top-Contact Megohm Resistor DIMENSIONS in inches CHIP RESISTORS 0.040 0.005 0.037 0.005 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.040 x 0.040 ± 0.003 (1.0 x 1.0 ± 0.075mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.050mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 2 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold backing for eutectic die attach Resistance values above 20M are available in 0.055 inches square size 0.030 inch square size also available with different values and TCR restrictions. Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 5M1, ± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts, per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) SFX PRODUCT FAMILY 017 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use the first 4 significant digits of the resistance 3 MULTIPLIER CODE 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% L = 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61018 Revision: 04-Dec-03 For technical questions contact: efi@vishay.com www.vishay.com 45 SC3 Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Small single chip size: 0.050 inches square Product may not be to scale • Resistance range: 1001 to 50k1 • Resistor material: nichrome The SC3 series resistor chips on silicon offer a combination of nichrome stability, wide resistance range and higher power rating than is available on the same sized ceramic substrate. The SC3’s are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The SC3s are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate for good power dissipation • 400mW capability • User trimmable APPLICATIONS Vishay EFI SC3 chip resistors have excellent power dissipation capability and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% PROCESS CODE ± 25ppm/°C CLASS H* CLASS K* ± 50ppm/°C 202 206 ± 100ppm/°C 200 204 201 205 *MIL-PRF-38534 inspection criteria 1001 50K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Stability, 1000 hours, + 125°C ± 0.1% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.25% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 150°C) 400mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 46 For technical questions contact: efi@vishay.com Document Number: 61014 Revision: 09-Dec-03 SC3 Vishay Electro-Films NiCr Thin Film, Top-Contact Resistor DIMENSIONS in inches CHIP RESISTORS 0.050 0.050 0.045 0.0075 0.0075 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Nichrome Bonding pad size 0.0075 x 0.045 (0.190 x 1.143mm) minimum Number of pads 2 Pad material 15kÅ minimum gold standard Backing None, lapped semiconductor silicon OPTIONS: Gold backing for eutectic die attach Aluminum bonding pads, 10kÅ minimum thickness User trimmable Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 5001, ± 10%, ± 50ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) SC3 PRODUCT FAMILY 200 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use the first 4 significant digits of the resistance A MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE B = 0.1% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61014 Revision: 09-Dec-03 For technical questions contact: efi@vishay.com www.vishay.com 47 QFM Vishay Electro-Films CHIP RESISTORS Thin Film, Top-Contact Resistor FEATURES • Small size, 0.020 inches square Product may not be to scale The QFM series tantulum nitride on quartz single-value resistor chips offer a small size, wide ohmic value range and excellent frequency response. The QFMs tantalum nitride resistor material offers excellent resistance to high moisture environments. The QFMs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The QFMs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range: 1.01 to 1M1 • DC power rating: 25mW • Quartz substrate: < 0.1pF shunt capacitance • Resistor material: tantalum nitride, self passivating • Moisture resistant APPLICATIONS The QFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages. They are ideally suited for this purpose because of their small size. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1% 0.5% PROCESS CODE CLASS H* CLASS K* 103 107 101 105 102 106 100 104 Aluminum Terminations 0.1% ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C *MIL-PRF-38534 inspection criteria 11 101 301 1001 200K1 430K1 620K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds - 35dB typical - 20dB typical ± 0.5% maximum 6R/R ± (0.25% + 0.011) maximum 6R/R - 55°C to + 125°C ± 0.25% maximum 6R/R ± 0.5% maximum 6R/R 200V 1012 minimum 100V maximum 25mW ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 48 For technical questions contact: efi@vishay.com Document Number: 61078 Revision: 23-Mar-04 QFM Vishay Electro-Films Thin Film, Top-Contact Resistor CONFIGURATIONS in inches 0.020 CHIP RESISTORS 0.004 0.020 0.007 0.020 0.016 0.006 0.016 0.004 0.004 TYPICAL RANGE 11 - 291 0.004 TYPICAL RANGE 301 - 8191 TYPICAL RANGE 8201 - 1M1 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Quartz Resistor material Tantalum nitride, self-passivating Bonding pad size 0.004 x 0.004 (0.10 x 0.10mm) minimum Number of pads 2 Pad material 10kÅ minimum aluminum Backing None, lapped Quartz OPTIONS: Gold backing for eutectic die attach Gold bonding pads, 15kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10K1, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) QFM PRODUCT FAMILY 102 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use the first 4 digits of the resistance 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61078 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 49 QFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 0.020 inches square Product may not be to scale The QFN series nichrome on quartz resistor chips offer a combination of nichrome stability, excellent frequency response and small size. The QFNs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The QFNs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range: 101 to 510k1 • Resistor material: nichrome • Quartz substrate: < 0.1pF shunt capacitance • Power: 25mW APPLICATIONS Vishay EFI QFN top-contact resistor chips are widely used in hybrid packages where space is limited. Designed with capacity to handle substantial power loads, they also have the benefit of nichrome stability. Recommended for hermetic environments where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1% 0.5% PROCESS CODE 0.1% CLASS H* 203 201 202 200 ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C CLASS K* 207 205 206 204 Gold Terminations *MIL-PRF-38534 inspection criteria 11 101 301 1001 200K1 360K1 510K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Stability, 1000 hours, + 125°C, 50mW - 35dB typical - 20dB typical ± 0.1% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 25mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 50 For technical questions contact: efi@vishay.com Document Number: 61079 Revision: 19-Mar-04 QFN Vishay Electro-Films NiCr Thin Film, Top-Contact Resistor DIMENSIONS in inches 0.008 0.020 0.004 0.004 CHIP RESISTORS 0.014 0.004 0.020 0.004 TYPICAL RANGE 561 - 7.4K1 TYPICAL RANGE 101 - 551 TYPICAL RANGE 7.5K1 - 510K1 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.003 (0.51 x 0.51 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Quartz Resistor material Nichrome (Passivation Optional) Bonding pad size 0.004 x 0.004 (0.10 x 0.10mm) Number of pads 2 Pad material 15kÅ minimum gold Backing None, lapped Quartz OPTIONS: Aluminum bonding pads, 10kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10K1, ± 1%, ± 50ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) QFN PRODUCT FAMILY 202 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use the first 4 digits significant digits of the resistance Available alternatives: Aluminum pads or gold back Passivation (thermal set plastic) 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61079 Revision: 19-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 51 QFX Vishay Electro-Films CHIP RESISTORS Thin Film, Top-Contact Megohm Resistor FEATURES • Chip size: 0.050 inches square Product may not be to scale • Resistance range: 500k1 to 10M1 • Quartz substrate: < 0.1pF shunt capacitance The QFX series, tantulum nitride on quartz resistor chips combine high resistance with low shunt capacitance. These offer one of the best combinations of small size, frequency response and high value available. The QFXs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The QFXs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material: tantalum nitride, self-passivating APPLICATIONS The QFX series resistor chips are designed for circuits requiring high values with lower shunt capacitance for higher frequency of operation. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% PROCESS CODE 0.5% ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C ± 350ppm/°C CLASS H* 012 CLASS K* 174 009 175 013 176 014 177 *MIL-PRF-38534 inspection criteria 500K1 1M1 2.0M1 4.2M1 10M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 12dB typical Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 10mW ± 0.5% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 400V 1012 minimum Insulation resistance Operating voltage 400V maximum DC power rating at + 70°C (derated to zero at + 175°C) 20mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 52 For technical questions contact: efi@vishay.com Document Number: 61031 Revision: 23-Mar-04 QFX Thin Film, Top-Contact Megohm Resistor Vishay Electro-Films DIMENSIONS in inches CHIP RESISTORS 0.050 0.045 0.050 0.005 0.005 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.050 ± 0.003 (1.25 x 1.25 ± 0.75mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Quartz Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 2 Pad material 10kÅ minimum aluminum Backing None, lapped Quartz OPTIONS: Gold bonding pads, 15kÅ minimum Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 5M1, ± 1%, ± 350ppm/°C TCR, 50 mil, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) QFX PRODUCT FAMILY 014 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use the first 4 digits significant digits of the resistance 3 MULTIPLIER CODE 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% L = 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61031 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 53 BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 101 to 1M1 The Back Contact Resistor (BCR) series single-value back-contact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space. The BCRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCRs are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate for good power dissipation • Resistor material: tantalum nitride, self-passivating • Moisture resistant APPLICATIONS Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.) TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 2% 1% 0.5% 0.2% PROCESS CODE 0.1% ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C CLASS H* 010 002 027 008 CLASS K* 056 061 059 052 *MIL-PRF-38534 inspection criteria 101 201 501 1001 2001 1K1 200K1 360K1 620K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 125mW ± 1.0% maximum 6R/R - 35dB typical - 20dB typical Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V Insulation resistance 1012 minimum Operating voltage 75V maximum DC power rating at + 70°C (derated to zero at + 175°C) 250mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 54 For technical questions contact: efi@vishay.com Document Number: 61023 Revision: 29-Mar-04 BCR Vishay Electro-Films Thin Film, Back-Contact Resistor DIMENSIONS in inches CHIP RESISTORS 0.020 0.016 0.020 0.004 TYPICAL RANGE 101 - 231 TYPICAL RANGE 241 - 2201 TYPICAL RANGE 1.6K1 - 1M1 TYPICAL RANGE 1801 - 2.2K1 NOTE: Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection. SCHEMATIC Bond Pad Back of Chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05mm) Chip thickness 0.010 ± 0.003 (0.253 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.004 x 0.004 (0.100 x 0.100mm) Number of pads 1 Pad material 10kÅ minimum aluminum Backing 3kÅ minimum gold Recommended attachment method Eutectic or conductive epoxy OPTIONS: Gold bonding pads, 15kÅ minimum thickness. Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 16k1, ± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) BCR PRODUCT FAMILY 008 PROCESS CODE See Process Code Table 1600 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61023 Revision: 29-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 55 BCM Vishay Electro-Films CHIP RESISTORS Miniature Back-Contact Resistor Chip FEATURES • Only one wire bound required Product may not be to scale • Small size: 0.015 inches square • Single top contact The BCM series are the smallest single value chips available from Vishay EFI. One wire bond only, they are intended for loose tolerance commercial applications. The BCMs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCMs are 100% electrically tested and visually inspected to Vishay EFI’s commercial criteria. PERCENT OF RATED POWER - 65°C • Resistance range: 1001 to 100k1 (See Standard RETMA Chart) • Tolerance: ± 10%, ± 20%, ± 25%, ± 50% • Packaging: Matrix tray STANDARD VALUE RETMA CHART 70°C 100 TOLERANCE ± 10% 75 50 ± 20% 10 33 10 12 39 15 15 47 22 18 56 33 22 68 47 27 82 68 25 0 - 75 - 50 - 25 0 25 50 75 100 125 150 175 DERATING CURVE STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR ± 250ppm/°C Noise, MIL-STD-202, Method 106 -20dB typical Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 50mW ± 1.0% maximum 6R/R Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.5% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.25% maximum 6R/R 1012 minimum Insulation resistance (open resistor) Operating voltage 100V maximum Power rating at + 70°C (See Derating Curve) 100mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.5% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 56 For technical questions contact: efi@vishay.com Document Number: 61026 Revision: 15-Jan-04 BCM Vishay Electro-Films Miniature Back-Contact Resistor Chip CONFIGURATIONS in inches CHIP RESISTORS 0.015 0.004 0.004 0.015 TYPICAL RANGE 8211 - 100K1 TYPICAL RANGE 1001 - 8201 SCHEMATIC Bond Pad Back of Chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.015 x 0.015 ± 0.002 (0.381 x 0.381 ± 0.05mm) Chip thickness 0.008 ± 0.003 (0.203 ± 0.08mm) Chip substrate material Silicon Resistor material Tantalum nitride, self-passivating Bonding pad size 0.0038 square minimum - 0.004 square typical Number of pads 1 top Pad material Aluminum 10kÅ thick Backing 3kÅ minimum gold ORDERING INFORMATION Example: 100% visual, 100k1, ± 10%, ± 250ppm/°C TCR, Aluminum Pads, Commercial Inspection. W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) BCM PRODUCT FAMILY 000 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 2 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61026 Revision: 15-Jan-04 For technical questions contact: efi@vishay.com www.vishay.com 57 BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip requires only one wire bond, thus saving hybrid space. The BCPs are part marked with resistance value allowing user the ability to visually determine the resistance value of the chip. The BCPs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCPs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range: 101 to 1M1 • Oxidized silicon substrate for good power dissipation • Resistor material: tantalum nitride, self-passivating • Moisture resistant APPLICATIONS Vishay EFI BCP resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.) The die is part marked with the resistance value. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 2.5% 1% 0.5% PROCESS CODE 0.1% 0.2% ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C CLASS H* CLASS K* 103 133 102 132 101 131 100 130 *MIL-PRF-38534 inspection criteria 101 201 501 1001 2001 1K1 200K1 360K1 620K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 125mW ± 1.0% maximum 6R/R - 35dB typical - 20dB typical Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 100V Insulation resistance 1012 minimum Operating voltage 75V maximum DC power rating at + 70°C (derated to zero at + 175°C) 250mW 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 58 For technical questions contact: efi@vishay.com Document Number: 61027 Revision: 23-Mar-04 BCP Vishay Electro-Films Thin Film Back-Contact Resistor DIMENSIONS in inches CHIP RESISTORS 0.005 PART MARK TYPICAL RANGE < 301 PART MARK 0.018 TYPICAL RANGE 301 - 1991 0.022 0.004 TYPICAL RANGE 2001 - 1K1 TYPICAL RANGE 1K1 - 1M1 SCHEMATIC STANDARD MARKING - 5 DIGITS X Multiplier C = 0.001 B = 0.01 A = 0.1 0=0 1 = 10 1 = 100 3 = 1000 XXXX Four significant digits of value PART MARK PART MARK PART MARK PART MARK PART MARK PART MARK BACK OF DIE MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.022 x 0.022 ± 0.002 (0.55 x 0.55 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 1 Pad material 10kÅ minimum aluminum Backing 3kÅ minimum gold Recommended attachment method Eutectic or conductive epoxy ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) BCP PRODUCT FAMILY 100 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61027 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 59 PWA Vishay Electro-Films CHIP RESISTORS Thin Film Power Resistors FEATURES • 500mW power Product may not be to scale • Chip size: 0.030 x 0.045 inches • Resistance range 0.31 to 1M1 The PWA series resistor chips offer a 500mW power rating in a small size. These offer one of the best combinations of size and power available. The PWAs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The PWAs are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate for good power dissipation • Resistor material: Tantalum nitride, self-passivating APPLICATIONS The PWA resistor chips are used mainly in higher power circuits of amplifiers where increased power loads require a more specialized resistor. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 1% PROCESS CODE 0.1% 0.5% CLASS H* 002 001 000 009 ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C ± 150ppm/°C CLASS K* 006 005 008 010 *MIL-PRF-38534 inspection criteria 0.31 21 51 251 200K1 300K1 500K1 1M1 1001 *600, - 100ppm R < 21, ± 250ppm for 21 to 51 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 250mW ± 0.5% maximum 6R/R - 35dB typical - 20dB typical Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.2% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage steady state 5 x rated power DC power rating at + 70°C (derated to zero at + 175°C) (Conductive epoxy die attach to alumina substrate) 5 x rated power short-time overload, + 25°C, 5 seconds 100V maximum 200V maximum 500mW ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 60 For technical questions contact: efi@vishay.com Document Number: 61019 Revision: 23-Feb-04 PWA Vishay Electro-Films Thin Film Power Resistors DIMENSIONS in inches 0.030 0.024 0.007 0.030 0.024 0.030 0.024 0.007 0.007 0.007 0.0045 CHIP RESISTORS 0.030 0.024 0.045 0.045 0.045 0.007 TYPICAL RANGE 0.31 - 1.31 TYPICAL RANGE 1.41 - 7.41 TYPICAL RANGE 7.51 - 421 TYPICAL RANGE 431 - 1MEG1 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.045 ± 0.002 (0.762 x 1.143 ± 0.5mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.007 x 0.024 (0.1778 x 0.6096mm) Number of pads 2 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Gold bonding pads, 15kÅ minimum thickness Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) PWA PRODUCT FAMILY 000 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61019 Revision: 23-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 61 PWB Vishay Electro-Films CHIP RESISTORS Thin Film Power Resistors FEATURES • Power: 1 watt Product may not be to scale • Chip size: 0.070 inches square • Resistance range: 0.3Ω to 20kΩ • Oxidized silicon substrate for good power dissipation The PWB series resistor chips offer a 1 watt power rating in a relatively small size. They offer one of the best combinations of size and power available. The PWBs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The PWBs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material: tantalum nitride, self-passivating APPLICATIONS The PWB resistor chips are used mainly in higher power circuits of amplifiers where increased power loads require a more specialized resistor. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 1% 0.5% PROCESS CODE ± 50ppm/°C ± 100ppm/°C ± 250ppm/°C * CLASS H* 001 CLASS K* 005 000 004 008 009 *MIL-PRF-38534 inspection criteria 0.3Ω 2Ω 10Ω 50Ω 10KΩ 20KΩ *± 600ppm/°C R < 2Ω STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 100Ω - 250kΩ < 100Ω or > 251kΩ Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum ΔR/R Stability, 1000 hours, + 125°C, 500mW ± 0.5% maximum ΔR/R - 35dB typical - 20dB typical Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum ΔR/R High temperature exposure, + 150°C, 100 hours ± 0.2% maximum ΔR/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage steady state 5 x rated power DC power rating at + 70°C (derated to zero at + 175°C) (Conductive epoxy die attach to alumina substrate) 5 x rated power short-time overload, + 25°C, 5 seconds 100V maximum 200V maximum 1 Watt ± 0.25% maximum ΔR/R% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 62 For technical questions contact: efi@vishay.com Document Number: 61021 Revision: 23-Feb-04 PWB Vishay Electro-Films Thin Film Power Resistors DIMENSIONS in inches CHIP RESISTORS 0.070 0.063 0.070 0.063 0.005 0.005 0.072 0.072 0.010 TYPICAL RANGE R < 240Ω TYPICAL RANGE 240Ω - 20KΩ SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.070 x 0.070 ± 0.005 (1.781 x 1.781mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.010 (0.127 x 0.254mm) minimum Number of pads 2 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Gold bonding pads, 15kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10kΩ, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) PWB PRODUCT FAMILY 000 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 F TOLERANCE CODE D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61021 Revision: 23-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 63 CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Dual Value SIZE (inches) POWER VALUE RANGE PERFORMANCE 0.030 x 0.030 125mW 251 - 35K1 ALUMINA DUAL VALUE TOP-CONTACT DUAL VALUE CHIP RESISTORS ◆ FILM MODEL Ta2N CTT 0.030 x 0.030 125mW 501 - 35K1 ▲ NiCr CTA 0.100 x 0.100 250mW 1001 - 1 MEG1 ▲ NiCr CCC Ta2N CTQ SILICON QUARTZ 0.030 x 0.030 60mW 101 - 1 MEG1 ● 0.030 x 0.030 50mW 2001 - 20K1 ▲ NiCr CC7 0.050 x 0.050 100mW 2001 - 50K1 ▲ NiCr CCB ALUMINA USER TRIM 0.050 x 0.050 250mW 1001 - 50K1 ■ NiCr SCB 0.030 x 0.030 250mW 1001 - 20K1 ■ NiCr SC7 SILICON VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 64 For technical questions contact: efi@vishay.com Document Number: 61075 Revision: 18-Feb-04 Vishay Electro-Films CHIP RESISTORS SIZE (inches) POWER VALUE RANGE PERFORMANCE MODEL FILM 0.030 x 0.030 250mW 11 - 9.91 ◆ Ta2N CTR (LOW VALUE) 0.030 x 0.030 250mW 1001 - 500K1 ◆ Ta2N Dual Resistor Networks NiCr CTN 0.030 x 0.030 250mW 101 - 1 MEG1 ▲ 0.030 x 0.030 250mW 101 - 1 MEG1 ◆ Ta2N CTR 0.040 x 0.040 40mW 200K1 - 10 MEG1 ◆ Ta2N CTM Performance Key ▲ ● ■ ◆ TCR ± 10ppm/°C TCR ± 25ppm/°C TCR ± 50ppm/°C TCR ± 100ppm/°C TOL ± 0.05% TOL ± 0.1% TOL ± 0.5% TOL ± 1% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61075 Revision: 18-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 65 CTT Vishay Electro-Films CHIP RESISTORS Thin Film, Center-Tapped Resistors FEATURES • Center tap feature Product may not be to scale • Chip size: 0.030 inches square • Resistance range RT: 101 to 36k1 The CTT series resistor chips offer a combination of low shunt capacitance and excellent stability. The CTT offers the designer flexibility in use as either a single value resistor or as two resistor with a center tap feature. The CTTs six bonding pads allows the user increased layout flexibility. The CTTs tantalum nitride resistor material offers excellent resistance to high moisture environments. The CTTs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTTs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate, low shunt capacitance: < 0.2pF • Resistor material: tantalum nitride • Moisture resistant APPLICATIONS I The CTT center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, tracking, low shunt capacitance and better frequency response are necessary. Vishay EFI measures low-value resistors by the four-wire Kelvin technique. I RA V I RB V V TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available PROCESS CODE 0.5% ± 25ppm/°C CLASS H* 202 CLASS K* 207 ± 50ppm/°C 200 205 ± 100ppm/°C 201 206 ± 200ppm/°C 204 209 *MIL-PRF-38534 inspection criteria 101 251 501 4.3K1 10K1 35K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) Center tap ratio, RA/RB: Tolerance Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C, 62mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds *10ppm/°C for R < 100 ± 2ppm/°C* 1 ± 1% - 35dB typical ± 0.5% maximum 6R/R ± 0.25% maximum 6R/R - 55°C to + 125°C ± 0.1% maximum 6R/R ± 0.2% maximum 6R/R 1012 minimum 100V maximum 125mW ± 0.25% maximum 6R/R% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 66 For technical questions contact: efi@vishay.com Document Number: 61016 Revision: 23-Feb-04 CTT Vishay Electro-Films Thin Film, Center-Tapped Resistors DIMENSIONS in inches CHIP RESISTORS 0.030 0.030 STANDARD CONFIGURATION *Six locations. All pads 0.005 x 0.005 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.050mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material 99.6% Alumina Resistor material Tantalum nitride Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 6 Pad material 25kÅ minimum gold Backing None OPTIONS: Alphanumeric part marking, up to six characters Aluminum bonding pads, 10kÅ minimum Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CTT PRODUCT FAMILY 201 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% L = 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61016 Revision: 23-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 67 CTA Vishay Electro-Films CHIP RESISTORS Thin Film, Center-Tapped Resistors FEATURES • Center tap feature Product may not be to scale • Tight ratio tolerances to: ± 0.1% • Chip size: 0.030 inches square The CTA series resistor chips combine the best tolerances, stability and low shunt capacitance. The CTA offers the designer flexibility in use as either a single value resistor or as two resistors with a center tap feature. The CTAs six bonding pads allows the user increased layout flexibility. The CTAs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTAs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range total: 251 to 35k1 • Alumina substrate, low shunt capacitance: < 0.2pF • Resistor material nichrome • Excellent stability: ± 0.025% maximum 6R/R APPLICATIONS The CTA center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, low shunt capacitance and tracking between two resistors is critical. Recommended for hermetic environments where chip is not exposed to moisture. For lower values, the resistance of the six bonding-pad configurations can vary, depending on the method of measurement used. Vishay EFI measures low-value resistors by the four-wire Kelvin technique. The measuring method is illustrated in the diagram to the right. I I RA V I RB V V TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available PROCESS CODE 0.1% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C CLASS H* 203 CLASS K* 233 202 232 200 230 201 231 *MIL-PRF-38534 inspection criteria 251 1001 2001 1K1 20K1 35K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) Center tap ratio, RA/RB: Tolerance Noise, MIL-STD-202, Method 308 Moisture resistance, MIL-STD-202, Method 106, (Passivated only) Stability, 1000 hours, + 125°C, 62mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds *10ppm/°C for R < 100 ± 2ppm/°C* 1 ± 1% standard - 35dB typical ± 0.5% maximum 6R/R ± 0.025% maximum 6R/R - 55°C to + 125°C ± 0.1% maximum 6R/R ± 0.1% maximum 6R/R 1012 minimum 100V maximum 125mW ± 0.25% maximum 6R/R% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 68 For technical questions contact: efi@vishay.com Document Number: 61015 Revision: 23-Feb-04 CTA Vishay Electro-Films Thin Film, Center-Tapped Resistors DIMENSIONS in inches CHIP RESISTORS 0.030 0.030 STANDARD CONFIGURATION *Six locations. All pads 0.005 x 0.005 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.050mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material 99.6% Alumina Resistor material Nichrome Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 6 Pad material 25kÅ minimum gold Backing None OPTIONS: Aluminum bonding pads, 10kÅ minimum Center-tap ratio tolerances to 0.02% R > 1k1 Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CTA PRODUCT FAMILY 201 PROCESS CODE See Process Code Table 1000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 F TOLERANCE CODE A = 0.05% B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61015 Revision: 23-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 69 CCC Vishay Electro-Films CHIP RESISTORS Thin Film, 1010 Center-Tapped Resistors on Alumina FEATURES • Larger single size for extended value range Product may not be to scale • Resistance range total: 1001 to 1 M1 Custom values: RA or RB - 501 to 500k1 • Power: 400mW The CCC series resistor chips offer good 400mw power, low shunt capacitance and a center tap feature. The CCCs nichrome resistor material offers excellent stability. The CCCs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CCCs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate • Low stray capacitance: < 0.2pF • Resistor material: nichrome APPLICATIONS Vishay EFI CCC chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators Recommended for hermetic environment where die is not exposed to moisture. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES PROCESS CODE Tightest Standard Tolerance Available CLASS H* 203 200 201 202 *MIL-PRF-38534 inspection criteria 0.1% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 1001 2001 500K CLASS K* 207 204 205 206 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Center tap ratio, RA/RB: Tolerance Stability, 1000 hours, + 125°C, 400mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 125°C 5 x rated power short-time overload, + 25°C, 5 seconds - 20dB typical 1 ± 1% ± 0.1% maximum 6R/R - 55°C to + 125°C ± 0.25% maximum 6R/R ± 0.25% maximum 6R/R 400V 1012 minimum 200V maximum 400mW maximum ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 70 For technical questions contact: efi@vishay.com Document Number: 61010 Revision: 23-Feb-04 CCC Thin Film 1010 Size Center-Tapped Resistors on Alumina Vishay Electro-Films DIMENSIONS in inches CHIP RESISTORS 0.100 0.010 0.010 0.010 0.100 0.082 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.100 x 0.100 ± 0.003 (2.5 x 2.5 ± 0.08mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.03mm) Chip substrate material 99.6% alumina, 2-4 microinch finish Resistor material Nichrome Bonding pad size 0.005 x 0.010 (0.12 x 0.24mm) minimum Number of pads 6 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, RT = 5001, 501, ± 10%, ± 50ppm/°C TCR, RA = RB = RT/2, Gold Pads, Class H Visual inspection For tighter ratio tolerance, RA,RB or user trim consult factory for P/N. W INSPECTION /PACKAGING W = 100% visually inspected parts X = Sample, visually inspected loaded in matrix trays (4% AQL) CCC PRODUCT FAMILY 201 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use first 4 significant digits of resistance (RT) A MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE B = 0.1% C = 0.25% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61010 Revision: 23-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 71 CTR (Low ohms) Vishay Electro-Films CHIP RESISTORS Low Ohmic Value Resistors Supplemental Data Sheet FEATURES • Resistance range total: 11 to 9.91 Product may not be to scale • Center Tap • Chip size: 0.030 inches square The CTR low ohm series provides a center tap option down to 1 ohm for non-critical tolerance applications. The CTRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTRs are 100% electrically tested and visually inspected to MIL-STD-883. • Oxidized silicon substrate for good power dissipation • Resistor material: Tantalum nitride, self passivating APPLICATIONS For low values, the resistance of the six bonding pad configurations can vary, depending on the method of measurement used. Vishay EFI measures low value resistors by the four-wire kelvin technique using the method illustrated in the measurement schematic for resistors of less than 10. Consult Vishay EFI Applications Engineering for alternate measurement method if tighter requirements are needed. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1.0% 5% ± 100ppm/°C + 600 to - 100ppm/°C 11 PROCESS CODE CLASS H* 101 *MIL-PRF-38534 inspection criteria 5.11 CLASS K* 131 9.91 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) ± 200ppm/°C typical Voltage ratio, RA/RB: Tolerance 1 ± 5% Noise, MIL-STD-202, Method 308 - 20dB typical ± 0.25% ± 0.01% maximum 6R/R Stability, 1000 hours, + 125°C, 125mW Operating temperature range - 55°C to + 125°C ± 0.1% maximum 6R/R Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours ± 0.2% + 0.01% maximum 6R/R DC power rating at + 70°C (derated to zero at 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds 250mW ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 72 For technical questions contact: efi@vishay.com Document Number: 61028 Revision: 25-Feb-04 CTR (Low ohms) Vishay Electro-Films Low Ohmic Value Resistors DIMENSIONS in inches CHIP RESISTORS 0.005 0.030 TYPICAL RANGE 11 - 6.71 TYPICAL RANGE 6.81 - 9.91 SCHEMATIC RT = RA + RB V I RA RB I V V MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum Nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) minimum Number of pads 6 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Alphanumeric part parking, up to six character Gold bonding pads, 15kÅ minimum; Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, 21, ± 5%, + 600 to - 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts X = Sample, visually inspected loaded in matrix trays (4% AQL) CTR PRODUCT FAMILY 101 PROCESS CODE See Process Code Table 2000 RESISTANCE VALUE Use first 4 significant digits of resistance (RT) C MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 J TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61028 Revision: 25-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 73 Custom Networks Vishay Electro-Films CHIP RESISTORS Dual Resistor Divider Thin Film Custom Network FEATURES • Individual value and tolerance selection Product may not be to scale • Ratio tolerance to 0.05% • Chip size: 0.030 inches square The STR, DTR series of dual resistor dividers provides the user with the option to specify the value, tolerance of each individual resistor and ratio tolerance. The dual resistor dividers are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The dual resistor dividers are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range: 1001 to 500k1 • Oxidized silicon substrate for good power dissipation • Resistor material: tantalum nitride, self-passivating APPLICATIONS Vishay EFI custom-made two resistor chips are designed for hybrid packages requiring close ratio-matching and tracking of two different resistors for gain accuracy and stability. The customized resistance values give the hybrid designer greater flexibility. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% Resistance range refers only to RA or RB Extended value/TCR range available using Nichrome version ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 1001 180K1 310K1 500K1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) Resistance ratio tolerance RA/RB Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C derated power Operating temperature range ± 10ppm/°C, (RA < 1K) ± 5ppm/°C, (RA * 1K) Customer specified to 0.05% - 35dB typical - 20db typical ± 0.5% maximum 6R/R ± 0.2% maximum absolute ± 0.02 maximum ratio - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.2% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V DC power rating at + 70°C (derated to zero at 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds 125mW each resistor ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 74 For technical questions contact: efi@vishay.com Document Number: 61032 Revision: 27-Feb-04 Custom Networks Dual Resistor Divider Thin Film Custom Network Vishay Electro-Films DIMENSIONS in inches RA RB DTR SERIES CONFIGURATION RB RA 0.030 0.026 CHIP RESISTORS STR SERIES CONFIGURATION 0.030 0.005 0.005 0.005 0.005 RA < RB 1001 to 500K1 Orientation Pad (rounded) RA < RB 1K1 to 500K1 Orientation Pad (rounded) SCHEMATIC RA RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.030 x 0.030 ± 0.003 (0.762 x 0.762 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum Nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) minimum Number of pads 6 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Gold bonding pads, 15kÅ minimum; Contact Applications Engineer ORDERING INFORMATION Example: 100% visual, STR format, 1k1/20k1, 1% Tolerance, 0.1% Ratio, 50ppm/°C, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts per MIL-STD-883 X = Sample, visually inspected loaded in matrix trays (4% AQL) 2000 1 0 / STR 1000 RESISTANCE VALUE PRODUCT RESISTANCE MULTIPLIER + MULTIPLIER (R2) CODE FAMILY VALUE (R1) B = 0.01 Use first 4 A = 0.1 digits 0=1 1 = 10 2 = 100 3 = 1000 D B F TCR RATIO TOLERANCE TOLERANCE CODE B = ± 25 D = 0.05% B = 0.01% D = ± 50 F = 0.1% C = 0.2% E = ± 100 G = 0.2% D = 0.5% G = ± 200 J = 0.5% F = 1.0% K = 1% G = 2.0% M = 2% H = 2.5% J = 5.0% K = 10% H CLASS Class H Class K A BOND PADS Aluminum Gold VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61032 Revision: 27-Feb-04 For technical questions contact: efi@vishay.com www.vishay.com 75 CTN Vishay Electro-Films CHIP RESISTORS Nichrome Thin Film, Center Tapped Resistors FEATURES • Center tap feature Product may not be to scale • Chip size: 0.030 inches square • Resistance range total: 101 to 1M1 • Ratio tolerances to: 0.1% The CTN series is a center tapped nichrome resistor chip providing excellent stability at 250mW power levels. The CTN offers the designer flexibility in use as either a single value resistor or as two resistors with a center tap feature. The CTNs six bonding pads allows the user increased layout flexibility. The CTNs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTNs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material: nichrome • Oxidized silicon substrate for good power dissipation APPLICATIONS The CTN center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, high power and tracking between two resistors is critical. Recommended for Hermetic environment where die is not exposed to moisture. For low values, the resistance of the six bonding-pad configurations can vary, depending on the method of measurement used. Vishay EFI measures low-value resistors by the four wire Kelvin technique. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available PROCESS CODE 0.1% 0.5% ± 10ppm/°C ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C CLASS H* 203 CLASS K* 263 202 262 200 260 201 261 *MIL-PRF-38534 inspection criteria 101 1001 2001 1K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) ± 2ppm/°C* Center tap ratio, RA/RB tolerance 1 ± 1% standard Noise, MIL-STD-202, Method 308, 1001 - 250k1 - 35dB typical ± 0.1% 6R/R Stability, 1000 hours, + 125°C, 125mW Operating temperature range - 55°C to + 125°C Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 250mW *20ppm/°C for R < 20 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 76 For technical questions contact: efi@vishay.com Document Number: 61024 Revision: 23-Mar-04 CTN Nichrome Thin Film, Center-Tapped Resistors Vishay Electro-Films CONFIGURATIONS in inches RA STANDARD CONFIGURATION Six locations. All pads 0.005 x 0.005 inch RB 0.026 0.030 TYPICAL RANGE 101 - 491 TYPICAL RANGE 501 - 1991 TYPICAL RANGE 1001 - 1M1 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pad size Number of pads Pad material Backing 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Nichrome 0.005 x 0.005 (0.127 x 0.127mm) minimum 6 15kÅ minimum gold standard None, lapped semiconductor silicon OPTIONS: Alphanumeric part marking, up to six characters Gold backing for eutectic die attach Center tap ratio tolerances to 0.01% Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Gold Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrixtrays (4% AQL) CTN PRODUCT FAMILY 201 PROCESS CODE See Process Code Table 1000 1 RESISTANCE MULTIPLIER VALUE CODE Use first 4 significant C = 0.001 digits of resistance (RT) B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61024 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 77 CHIP RESISTORS 0.030 CTR Vishay Electro-Films CHIP RESISTORS Thin Film, Center-Tapped Resistors FEATURES • Center tap feature Product may not be to scale • Tight ratio tolerances to: 0.05% • Chip size: 0.030 inches square • Resistance range total: 101 to 1M1 • Oxidized silicon substrate for good power dissipation • Resistor material: tantalum nitride, self-passivating The CTR series is a center-tapped resistor chip combining excellent stability with 250mW power levels. The CTR offers the designer flexibility in use as either a single value resistor as two resistors with a center tap feature. The CTR’s six bonding pads allows the user increased layout flexibility. The CTRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTRs are 100% electrically tested and visually inspected to MIL-STD-883. • Moisture resistant I V RA RB V I V APPLICATIONS Vishay EFI CTR center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, high power and tracking between two resistors is critical. For low values, the resistance of the six bonding-pad configurations can vary, depending on the method of measurement used. Vishay EFI measures low-value resistors by the four wire Kelvin technique. The method illustrated above is critical for resistors of less than 1001. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% 0.5% PROCESS CODE ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C CLASS H* 102 CLASS K* 132 100 130 101 131 *MIL-PRF-38534 inspection criteria 101 251 1001 360K1 620K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA/RB) Center tap ratio, RA/RB tolerance Noise, MIL-STD-202, Method 308, < 1001 or > 251k1 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds ± 2ppm/°C* 1 ± 1% standard - 20dB typical ± 0.5% maximum 6R/R ± 0.2% maximum absolute - 55°C to + 125°C ± 0.1% maximum 6R/R ± 0.2% maximum 6R/R 200V 1012 minimum 100V maximum 250mW ± 0.1% maximum 6R/R *5ppm/°C for R < 100 20ppm/°C for R < 20 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 78 For technical questions contact: efi@vishay.com Document Number: 61020 Revision: 23-Mar-04 CTR Thin Film, Center-Tapped Resistors Vishay Electro-Films CONFIGURATIONS in inches 0.030 TYPICAL RANGE 101 - 26.91 0.030 TYPICAL RANGE 271 - 991 TYPICAL RANGE 1001 - 1M1 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pad size Number of pads Pad material Backing 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Tantalum nitride, self passivating 0.005 x 0.005 (0.127 x 0.127mm) 6 10kÅ minimum aluminum None, lapped semiconductor silicon OPTIONS: Alphanumeric part marking, up to six characters Gold bonding pads 15kÅ minimum; Ratio Tolerance to 0.05% 1 to 10 ohm values available, See CTR Low Ohm Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrixtrays (4% AQL) CTR PRODUCT FAMILY 101 PROCESS CODE See Process Code Table 1000 1 RESISTANCE MULTIPLIER VALUE CODE Use first 4 significant C = 0.001 digits of resistance (RT) B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE A = 0.05% B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61020 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 79 CHIP RESISTORS 0.026 STANDARD CONFIGURATION Six locations. All pads 0.005 x 0.005 inch RB RA CTM Vishay Electro-Films CHIP RESISTORS Megohm Center-Tap Chip Resistor FEATURES • Resistance range total: 200k1 to 10M1 Product may not be to scale • Center Tap • Chip size: 0.040 inches square The CTM resistor chips extends the resistance range to 10Meg in a center tap configuration while keeping the die size relatively small. The CTMs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTMs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material: tantalum nitride, self-passivating • Moisture resistant APPLICATIONS Vishay EFI CTM tapped megohm resistor chips are designed for hybrid packages requiring high value, two resistor combinations. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.2% 0.1% PROCESS CODE 0.5% ± 50ppm/°C ± 100ppm/°C 0 to - 250ppm/°C 0 to - 350ppm/°C CLASS H* 100 CLASS K* 130 101 131 099 129 098 128 *MIL-PRF-38534 inspection criteria 200K1 1.0M1 2M1 5M1 10M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between resistors ± 5ppm/°C Ratio/ratio, RA/RB: Tolerance 1 ± 1% standard Noise - 12dB typical ± 0.5% maximum 6R/R Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum absolute ± 0.005% ratio Stability, 1000 hours, + 125°C, 10mW Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at + 175°C) 20mW each resistor 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 80 For technical questions contact: efi@vishay.com Document Number: 61034 Revision: 23-Mar-04 CTM Vishay Electro-Films Megohm Center-Tap Chip Resistor DIMENSIONS in inches CHIP RESISTORS 0.040 0.0154 0.036 0.005 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.040 x 0.040 ± 0.002 (1.02 x 1.02 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) Number of pads 3 Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Custom Ratios available up to 4:1 RA/RB - Consult Vishay EFI Sales Consult Applications Engineer ORDERING INFORMATION Example: 100% visual, 2M1, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CTM PRODUCT FAMILY 101 PROCESS CODE See Process Code Table 2000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) 3 MULTIPLIER CODE 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61034 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 81 CTQ Vishay Electro-Films CHIP RESISTORS Thin Film Center-Tapped Resistors FEATURES • Center tap feature Product may not be to scale • Chip size: 0.030 inches square • Resistance range total: 101 to 1M1 The CTQ series resistor chips offer a wide resistance range with lower shunt capacitance than can be offered with the silicon based resistors but only at a lower power level. The CTQ offers the designer flexibility in use as either a single value resistor or as two resistor with a center tap feature. The CTQs six bonding pads allows the user increased layout flexibility. The CTQs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CTQs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material: Tantalum nitride, self-passivating • Moisture resistant • Quartz substrate • Low shunt capacitance < 0.1pF APPLICATIONS The CTQ center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, low shunt capacitance and tracking between two resistors is critical. For low values, the resistance of the six bonding pad configuration can vary, depending on the method of measurement used. Vishay EFI measures low-value resistors by the four-wire Kelvin technique. I V RA RB V I V TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.5% 0.1% PROCESS CODE CLASS H* 102 CLASS K* 132 ± 50ppm/°C 100 130 ± 100ppm/°C 101 131 ± 25ppm/°C *MIL-PRF-38534 inspection criteria 101 251 1001 360K1 620K1 1M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between halves (RA,RB) Center tap ratio, RA/RB: Tolerance Noise, MIL-STD-202, Method 308, 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C, 30mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at + 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds *5ppm/°C for R < 100. 20ppm/°C for R < 20 ± 2ppm/°C* 1 ± 1% standard - 35dB typical - 20db typical ± 0.5% maximum 6R/R ± 0.25% maximum 6R/R - 55°C to + 125°C ± 0.1% maximum 6R/R ± 0.2% maximum 6R/R 400V 1012 minimum 200V 60mW ± 0.25% maximum 6R/R% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 82 For technical questions contact: efi@vishay.com Document Number: 61030 Revision: 01-Mar-04 CTQ Thin Film Center-Tapped Resistors Vishay Electro-Films DIMENSIONS in inches STANDARD CONFIGURATION Six locations. All pads 0.005 x 0.005 inches 0.026 0.030 TYPICAL RANGE 271 - 991 TYPICAL RANGE 101 - 26.91 TYPICAL RANGE 1001 - 1M1 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pad size Number of pads Pad material Backing OPTIONS: Alphanumeric part marking, up to six characters Gold bonding pads, 15kÅ minimum Center-tap ratio tolerances to 0.05% 1 to 10 ohm values available Contact Applications Engineer 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05mm) 0.010 ± 0.003 (0.254 ± 0.05mm) Quartz Tantalum nitride, self-passivating 0.005 x 0.005 (0.127 x 0.127mm) 6 10kÅ minimum aluminum None, lapped quartz ORDERING INFORMATION Example: 100% visual, 10k1, ± 1%, ± 100ppm/°C TCR, Aluminum Pads, Class H Visual inspection W CTQ 101 1000 INSPECTION PRODUCT PROCESS RESISTANCE /PACKAGING FAMILY CODE VALUE W = 100% visually inspected See Process Code Use first 4 digits parts in matrix trays per Table significant digits of the MIL-STD-883 resistance (RT) X = Sample, visually inspected parts loaded in matrix trays (4% AQL) 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61030 Revision: 01-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 83 CHIP RESISTORS 0.030 CC7, CCB Vishay Electro-Films CHIP RESISTORS Thin Film Resistors on Alumina, User Trimmable FEATURES • Small single chip size CC7 - 0.030 inches square CCB - 0.050 inches square Product may not be to scale • Alumina substrate The CC7 and CCB series resistor chips offer the combination of user trimmability, low shunt capacitance and excellent stability. The CC7 and CCB can be specified as either a single RT value resistor, as two resistors with a center tap feature (1:1 ratio or custom) ratio or user trimmable. The CC7 and CCBs a six bonding pads allows the user increased layout flexibility. The CC7 and CCBs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. They are 100% electrically tested and visually inspected to MIL-STD-883. • Low stray capacitance: < 0.2pF • Resistance range RT: 1001 to 20k1 for CC7 Resistance range RT: 1001 to 50k1 for CCB • Resistor material: nichrome • User trimmable APPLICATIONS Vishay EFI CC7 and CCB chip resistors provide excellent high frequency response and are ideally suited for prototyping. Typical application areas are: • Couplers • Amplifiers • Filters • Oscillators • Attenuators Recommended for hermetic environments where die is not exposed to moisture TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES PROCESS CODE Tightest Standard Tolerance Available CC7 0.1% 1001 2001 CCB ± 10ppm/°C CLASS H* 219 CLASS K* 223 CLASS H* 219 CLASS K* 223 ± 25ppm/°C 220 224 220 224 ± 50ppm/°C 221 225 221 225 ± 100ppm/°C 222 226 222 226 1K1 50K1 *MIL-PRF-38534 inspection criteria RA user trimmable 50% above RT value specified in P/N STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Stability, 1000 hours, + 125°C at rated power Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage - 20dB typical + 0.1% maximum 6R/R - 55°C to + 125°C + 0.25% maximum 6R/R + 0.25% maximum 6R/R 400V 1012 minimum 100V maximum 50mW maximum (30 mil) 100mW maximum (50 mil) DC power rating at 125°C 5 x rated power short-time overload, + 25°C, 5 seconds NOTE: Performance characteristics are not guaranteed once user trimmed + 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 84 For technical questions contact: efi@vishay.com Document Number: 61012 Revision: 23-Mar-04 CC7, CCB Thin Film Resistors on Alumina, User Trimmable Vishay Electro-Films DIMENSIONS in inches 0.005 CHIP RESISTORS CC7 CCB 0.030 0.0075 0.005 0.050 0.005 0.030 0.016 0.050 0.035 0.005 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER 0.030 x 0.030 ± 0.003 (0.76 x 0.76 ± 0.08mm) 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.08mm) 0.010 ± 0.002 (0.25 ± 0.03mm) Chip size Chip thickness Chip substrate material 99.6% alumina, 2 - 4 microinch finish Resistor material Nichrome Bonding pad size 0.005 x 0.005 (0.12 x 0.12mm) minimum Number of pads 6 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Gold back for solder die attach Consult Application Engineer ORDERING INFORMATION Example: 100% visualled, RT = 500, ± 10%, ± 50ppm/°C TCR, Gold pads, Class H vixual inspection, 30 mil size, RA user trim. Standard user trim versions will be supplied with RA untrimmed For custom RA, RB combinations consult Application Engineer W INSPECTION /PACKAGING W = 100% visually inspected parts X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CC7 PRODUCT FAMILY CC7 CCB 221 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) A MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE B = 0.1% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61012 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 85 SC7, SCB Vishay Electro-Films CHIP RESISTORS Thin Film Resistors on Silicon, User Trimmable FEATURES • Chip sizes Product may not be to scale SC7 - 0.030 inches square SCB - 0.050 inches square • Resistance range RT: 1001 to 20k1 for SC7 Resistance range RT: 1001 to 50k1 for SCB The SC7 and SCB series resistor chips offer a combination of nichrome user trimmability as a single resistor or as a ratio trim while maintaining the excellent TCR tracking characteristics of two resistors on the same chip. The SC7 and SCBs are manufactured using Vishay ElectroFilms (EFI) sophisticated thin film equipment and manufacturing technology. The SC7 and SCBs are 100% electrically tested and visually inspected to MIL-STD-883. • Silicon substrate • Power: 250 or 400mW capability • Resistor material: nichrome • User trimmable APPLICATIONS Vishay EFI SC7 and SCB chip resistors have excellent power dissipation capability and are ideally suited for prototyping. Typical application areas are: • Couplers • Amplifiers • Filters • Oscillators • Attenuators Recommended for hermetic environments where die is not exposed to moisture TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES PROCESS CODE Tightest Standard Tolerance Available SC7 0.1% CLASS H* 220 221 222 ± 25ppm/°C ± 50ppm/°C ± 100ppm/°C 1001 2001 50K1 SCB CLASS K* 224 225 226 CLASS H* 220 221 222 CLASS K* 224 225 226 *MIL-PRF-38534 inspection criteria RA user trimmable 50% above RT value specified in P/N STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Stability, 1000 hours, + 125°C at rated power Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition F High temperature exposure, + 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at 70°C Derated to zero at 150°C 5 x rated power short-time overload, + 25°C, 5 seconds NOTE: Performance characteristics are not guaranteed once user trimmed - 20dB typical ± 0.2% maximum 6R/R - 55°C to + 125°C ± 0.25% maximum 6R/R ± 0.25% maximum 6R/R 200V 1012 minimum 100V maximum 250mW maximum (0.030 inches) 400mW maximum (0.050 inches) + 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 86 For technical questions contact: efi@vishay.com Document Number: 61011 Revision: 23-Mar-04 SC7, SCB Vishay Electro-Films Thin Film Resistors on Silicon, User Trimmable DIMENSIONS in inches 0.005 CHIP RESISTORS SCB SC7 0.030 0.050 0.0075 0.005 0.005 0.030 0.016 0.050 0.035 0.005 0.005 SCHEMATIC RT = RA + RB RA RB MECHANICAL SPECIFICATIONS in inches PARAMETER 0.030 x 0.030 ± 0.003 (0.76 x 0.76 ± 0.076mm) 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076mm) 0.010 ± 0.002 (0.25 ± 0.05mm) Chip size Chip thickness Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Nichrome Bonding pad size 0.005 x 0.005 (0.127 x 0.127mm) minimum Number of pads 6 Pad material 15kÅ minimum gold standard Backing None, lapped semiconductor silicon OPTIONS: Gold back for solder die attach Consult Application Engineer ORDERING INFORMATION Example: 100% visualled, RT = 500, ± 10%, ± 50ppm/°C TCR, RA user trim Gold pads, Class H visual inspection Standard user trim versions will be supplied with RA untrimmed For custom RA, RB combinations consult Application Engineer W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) SC7 PRODUCT FAMILY SC7 SCB 221 PROCESS CODE See Process Code Table 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) A MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE B = 0.1% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61011 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 87 Vishay Electro-Films SIZE (inches) POWER VALUE RANGE MICROWAVE RESISTORS Thin Film Microwave Resistors PERFORMANCE KEY FILM 0.010 x 0.020 25mW 20Ω - 100Ω ● Ta2N MIB.....................90 0.020 x 0.040 125mW 25Ω - 500Ω ● Ta2N MIC.....................92 0.016 x 0.020 50mW 20Ω - 100Ω ● Ta2N MIF......................94 0.050 x 0.050 200mW 18Ω - 500Ω ● Ta2N MID.....................96 Ta2N TMR....................98 Ta2N MICRO COMPONENTS..89 SINGLE VALUE MICROWAVE RESIST ORS 0.020 x 0.060 125mW 10Ω, 10Ω, 20Ω, 50Ω, 50Ω, 100Ω 6 RESISTORS MULTI-VALUE TAPPED ■ ▲ CUSTOM Performance Key ▲ ● ■ TCR ± 50ppm/°C TCR TOL ± 0.1% TOL + 100ppm/°C ± 1% TCR TOL ± 200ppm/°C ± 1% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 88 For technical questions contact: [email protected] Document Number: 61035 Revision: 01-Mar-04 Microwave Components Vishay Electro-Films Thin Film Microwave Components METALIZED PLATES SUBSTRATE MATERIAL • Quartz - Beryllium Oxide various thicknesses • Sizes - up to 4.1 inches x 3.3 inches METALIZATION Vishay Electro-Films (EFI) offers a wide variety of metalized substrates suitable for microwave hybrid and microwave integrated circuit applications. Vishay EFI’s unique economical fabrication process provides an exceptional range of dimensions, metalizations and circuitry. Typical applications include: amplifiers, oscillators, limiters, couplers filters, attenuators with frequency response through 18gHz and into the millimeter wavelength range. • Sputtered in various combinations of NiCr, Ta2N, Ni, Au, Al, TiW, Ti, Pd • Electroplated - Cu, Ni, Au up to 300 microinches • Excellent adhesion (typically 7 - 10,000 lbs./inches square) • One, two or six surfaces • Through Holes - metalized or non-metalized PATTERNED & ETCHED SUBSTRATES Product may not be to scale Vishay EFI can handle the transition from a circuit requirement to a finished thin film microcomponent with in-house artwork and photo mask generation. Vishay EFI’s processing techniques and quality control guarantee optimum quality in prototype or production quantities. Vishay EFI is a thin film specialist with unequalled productivity. • Conductor only or resistor/conductor patterns • Resistive films - high stability Nichrome or self-passivating Ta2N • In-house laser machining for round or odd shaped substrates • Metalized through holes • Patterned edges • Planar inductors • Large couplers with fine line patterns, line and space tolerances as tight as ± 50 microinches PRECISION CHIP RESISTORS • Attenuator chips • Resistance range 201 to 1M1 Product may not be to scale • Automatic laser trimming to ± 0.05% absolute • Edge trim for high frequency applications • Gold or solder coated terminations Vishay EFI precision chip resistors are edge trimmed to tolerance providing excellent high frequency response. Edge trimming leaves a solid symmetrical block resistor void of any laser cuts eliminating the capacitive effects from a plunge “L” cut trim. • TCR ± 50ppm/°C, ± 25ppm/°C or ± 10ppm/°C • Single side or wraparound terminations • Size - 0.020 inches x 0.040 inches to 0.100 inches x 0.100 inches VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61003 Revision: 01-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 89 MICROWAVE RESISTORS Product may not be to scale • Alumina (as fired or polished) standard thicknesses of 0.010 inches, 0.015 inches and 0.025 inches, dielectric constant 9.8 typical @ 25°C - 10gHz Loss factor 0.004 typical @ 25°C - 10gHz MIB Vishay Electro-Films Thin Film Microwave Resistor FEATURES • Small single chip size: 0.010 x 0.020 inches MICROWAVE RESISTORS Product may not be to scale • Microwave resistance range: 201 to 1001 • Overall resistance range: 201 to 2k1 The MIB resistor chips on alumina are designed with low shunt capacitance. Resistor geometrics are compatible with strip lines, making them ideally suited for microwave circuits. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The MIBs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate • Low stray capacitance: < 0.2pF • Resistor material: tantalum nitride, self passivating • Moisture resistant APPLICATIONS Vishay EFI MIB chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES 201 to 1001 Resistance Range Tolerance ± 5%, ± 10%, ± 20% standard TCR ± 100ppm/°C STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 12mW ± 0.5% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 400V 1012 Insulation resistance minimum Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at 150°C) 25mW maximum 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 90 For technical questions contact: efi@vishay.com Document Number: 61036 Revision: 01-Mar-04 MIB Vishay Electro-Films Thin Film Microwave Resistor DIMENSIONS in inches SCHEMATIC 0.010 MICROWAVE RESISTORS 0.020 0.005 0.006 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.010 x 0.020 ± 0.002 (0.25 x 0.5 ± 0.08mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2 - 4 microinch finish Resistor material Tantalum nitride, self passivating Bonding pad size 0.005 x 0.006 (0.12 x 0.24mm) Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visualled, 501, ± 10%, ± 100ppm/°C TCR, Gold Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) MIB PRODUCT FAMILY 002 PROCESS CODE 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 K TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61036 Revision: 01-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 91 MIC Vishay Electro-Films Thin Film Microwave Resistor FEATURES • Small chip size: 0.020 x 0.040 inches MICROWAVE RESISTORS Product may not be to scale • Microwave resistance range: 201 - 1k1 • Overall resistance range: 21 to 20k1 The MIC resistor chips on alumina are designed with low shunt capacitance. Most lower value resistor geometrics are compatible with strip lines, making them ideally suited for microwave circuits. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The MICs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate • Low stray capacitance: < 0.2pF • Resistor material: tantalum nitride, self passivating • Moisture resistant APPLICATIONS Vishay EFI MIC chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1.0% PROCESS CODE MICROWAVE CLASS H* CLASS K* CLASS H* ± 25ppm/°C 004 034 - CLASS K* - ± 50ppm/°C 002 032 - - ± 100ppm/°C 001 031 014 - ± 200ppm/°C 003 033 016 017 Gold Termination 21 101 201 10K1 15K1 20K1 *MIL-PRF-38534 inspection criteria NOTE: Only 201 to 1k1 are standard strip line designs for Microwave applications STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.1% maximum 6R/R Stability, 1000 hours, + 125°C, 62mW ± 0.2% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.2% maximum 6R/R Dielectric voltage breakdown 400V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds 125mW maximum ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 92 For technical questions contact: efi@vishay.com Document Number: 61037 Revision: 02-Mar-04 MIC Vishay Electro-Films Thin Film Microwave Resistor DIMENSIONS in inches 0.020 0.020 0.020 0.040 0.010 0.010 0.010 0.012 0.012 0.012 TYPICAL RANGE 21 - 61 TYPICAL RANGE 6.21 - 191 TYPICAL RANGE 201 - 20K1 SCHEMATIC IMPEDANCE VS FREQUENCY 501, 20 x 40 MIL SIZE MECHANICAL SPECIFICATIONS in inches PARAMETER Chip thickness Chip substrate material Resistor material 0.020 x 0.040 ± 0.003 (0.5 x 1.0 ± 0.076mm) 0.010 ± 0.002 (0.254 ± 0.05mm) 99.6% alumina, 2 - 4 microinch finish Tantalum nitride, self passivating Bonding pad size 0.010 x 0.012 (0.254 x 0.30mm) minimum Number of pads 2 Pad material 50.20 50.10 50.00 49.90 49.80 49.70 25kÅ minimum gold standard Backing 50.40 50.30 IMPEDANCE (OHMS) Chip size None 49.60 0.00E + 00 5.00E + 08 1.00E + 09 1.50E + 09 2.00E + 09 2.50E + 09 3.00E + 09 3.50E + 09 FREQUENCY (HZ) OPTIONS: Terminations: Aluminum, Nickel solder (62/32/2) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visualled, 501, ± 10%, ± 100ppm/°C TCR, Gold Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) MIC PRODUCT FAMILY 001 PROCESS CODE 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61037 Revision: 02-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 93 MICROWAVE RESISTORS 0.040 0.040 MIF Vishay Electro-Films Thin Film Microwave Resistor FEATURES • Small single chip size: 0.016 x 0.020 inches MICROWAVE RESISTORS Product may not be to scale The MIF resistor chips on alumina are designed with low shunt capacitance. Resistor geometrics are compatible with strip lines, making them ideally suited for microwave circuits. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The MIFs are 100% electrically tested and visually inspected to MIL-STD-883. • Microwave resistance range: 201 to 1001 • Overall resistance range: 201 to 2k1 • Alumina substrate • Low stray capacitance: < 0.2pF • Resistor material: tantalum nitride, self passivating • Moisture resistant • Power: 50mW APPLICATIONS Vishay EFI MIF chip resistors provide excellent high frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES 201 to 1001 Resistance Range Tolerance ± 1%, ± 5%, ± 10%, ± 20% standard TCR ± 100ppm/°C STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 25mW ± 0.5% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 400V 1012 Insulation resistance minimum Operating voltage 100V maximum DC power rating at + 70°C (derated to zero at 150°C) 50mW maximum 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 94 For technical questions contact: efi@vishay.com Document Number: 61038 Revision: 02-Mar-04 MIF Vishay Electro-Films Thin Film Microwave Resistor DIMENSIONS in inches SCHEMATIC 0.016 MICROWAVE RESISTORS 0.020 0.005 0.012 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.016 x 0.020 ± 0.003 (0.40 x 0.5 ± 0.076mm) Chip thickness 0.010 ± 0.001 (0.25 ± 0.025mm) Chip substrate material 99.6% alumina, 2 - 4 microinch finish Resistor material Tantalum nitride, self passivating Bonding pad size 0.005 x 0.012 (0.125 x 0.30mm) Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum/Solder Gold back for solder die attach 5 mil chip thickness Contact Applications Engineer ORDERING INFORMATION Example: 100% visualled, 501, ± 10%, ± 100ppm/°C TCR, Gold Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) MIF PRODUCT FAMILY 002 PROCESS CODE 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 K TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61038 Revision: 02-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 95 MID Vishay Electro-Films Thin Film Microwave Resistor FEATURES • Chip size: 0.050 inches square MICROWAVE RESISTORS Product may not be to scale • Microwave resistance range: 181 to 5001 • Overall resistance range: 21 to 100k1 The MID resistor chips on alumina are designed for low shunt capacitance applications with 200mW power requirements. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The MIDs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate • Low stray capacitance: < 0.2pF • Power: 200mW • Resistor material: tantalum nitride, self passivating • Moisture resistant APPLICATIONS Vishay EFI MIC chip resistors provide excellent high-frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 1.0% PROCESS CODE MICROWAVE CLASS H* CLASS K* CLASS H* ± 25ppm/°C 003 007 - CLASS K* - ± 50ppm/°C 002 006 - - ± 100ppm/°C 001 005 022 - ± 200ppm/°C 000 004 008 009 *MIL-PRF-38534 inspection criteria 21 5.11 101 251 33K1 51K1 75K1 100K1 NOTE: Only 181 to 5001 are standard strip line designs for Microwave applications STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.1% maximum 6R/R Stability, 1000 hours, + 125°C, 100mW ± 0.2% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.2% maximum 6R/R Dielectric voltage breakdown 400V 1012 Insulation resistance Operating voltage minimum 100V maximum DC power rating at + 70°C (derated to zero at 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds 200mW maximum ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 96 For technical questions contact: efi@vishay.com Document Number: 61076 Revision: 23-Mar-04 MID Vishay Electro-Films Thin Film Microwave Resistor DIMENSIONS in inches 0.050 0.050 0.050 0.016 0.044 0.044 TYPICAL RANGE 21 - 7.91 TYPICAL RANGE 81 - 171 0.044 0.010 TYPICAL RANGE 181 - 100K1 SCHEMATIC MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material 99.6% alumina, 2 - 4 microinch finish Resistor material Tantalum nitride, self passivating Bonding pad size 0.010 x 0.044 (0.254 x 1.11mm) Number of pads 2 Pad material 25kÅ minimum gold standard Backing None OPTIONS: Terminations: Aluminum, Nickel solder (62/32/2) Gold back for solder die attach Contact Applications Engineer ORDERING INFORMATION Example: 100% visualled, 501, ± 10%, ± 100ppm/°C TCR, Gold Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) MID PRODUCT FAMILY 001 PROCESS CODE See Process Code table 5000 RESISTANCE VALUE Use first 4 digits significant digits of the resistance B MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% M = 20% L = 25% N = 505 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61076 Revision: 23-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 97 MICROWAVE RESISTORS 0.044 0.050 0.050 0.050 TMR Vishay Electro-Films Thin Film Tapped Microwave Resistor FEATURES MICROWAVE RESISTORS Product may not be to scale • Six resistors on a single chip: size 0.020 x 0.060 inches • Resistance range: 101 to 2401 The TMR resistor chips on alumina are designed with multiple low ohm taps for circuit trimming. The resistor geometries are compatible with strip lines, making them ideally suited for microwave circuits. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The TMRs are 100% electrically tested and visually inspected to MIL-STD-883. • Alumina substrate • Low stray capacitance: < 0.2pF • Resistor material: tantalum nitride self passivating APPLICATIONS Vishay EFI TMR chip resistors provide excellent high frequency response and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators • Limiters TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Individual resistances 101, 101, 201, 501, 501, 1001 Total resistance 2401 Tolerance ± 10% of total value TCR ± 100ppm/°C STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 - 20dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 62mW ± 1.0% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V 1012 Insulation resistance Operating voltage minimum 100V maximum DC power rating at + 70°C (derated to zero at 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds 125mW ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 98 For technical questions contact: efi@vishay.com Document Number: 61039 Revision: 02-Mar-04 TMR Vishay Electro-Films Thin Film Tapped Microwave Resistor DIMENSIONS in inches SCHEMATIC 0.020 101 MICROWAVE RESISTORS 101 201 0.060 0.004 501 501 1001 0.013 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.020 x 0.060 ± 0.003 (1.5 x 0.5 ± 0.08mm) Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material 99.6% alumina, 2 - 4 microinch finish Resistor material Tantalum nitride, self passivating Bonding pad size 0.004 x 0.013 (0.10 x 0.33mm) Number of pads 7 Pad material 15kÅ minimum gold Backing OPTIONS: Gold back for solder die attach Contact Applications Engineer None ORDERING INFORMATION Example: 100% visualled, 2401, ± 10%, ± 100ppm/°C TCR, Gold Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) TMR PRODUCT FAMILY 005 PROCESS CODE See Process Code table 2400 RESISTANCE VALUE Use first 4 digits significant digits of the resistance (RT) A MULTIPLIER CODE A = 0.1 K TOLERANCE CODE K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61039 Revision: 02-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 99 Vishay Electro-Films SIZE (inches) VALUE RANGE CHIP CAPACITORS Thin Film Capacitors MOS/MNOS (Wire Bondable Back Contact) 0.020 x 0.020 0.5pF - 51pF SINGLE VALUE CAPACIT ORS MOS/MNOS PERFORMANCE ▲ 40V - 100V NCA.............101 0.030 x 0.030 33pF - 160pF ■ 50V - 100V NCB.............101 0.040 x 0.040 56pF - 330pF ■ 25V - 100V NCC.............101 0.050 x 0.055 150pF - 470pF ■ 50V - 100V NCD.............101 0.060 x 0.060 360pF - 1000pF ■ 25V - 40V NCE.............101 30V - 100V CBA.............104 0.020 x 0.030 3.75pF or 15pF TOTAL 4 - VALUES BINARY MULTI-VALUE ARRAY WORKING VOLTAGE ◆ 0.020 x 0.048 31pF TOTAL 5 - VALUES ● 75V CBB............106 0.046 x 0.046 93pF TOTAL 5 - VALUES ● 75V CBC............106 Performance Key ■ ▲ TCC + 15 ± 25ppm/°C TCC + 45 ± 25ppm/°C TOL 5% TOL 5% ◆ ● TCC + 45 ± 25ppm/°C TCC + 45 ± 25ppm/°C TOL TOL 10% 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 100 For technical questions contact: [email protected] Document Number: 61040 Revision: 02-Mar-04 NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of increased performance and smaller size when compared with its thick film counterparts. These chips are available in sizes down to 20 mil square and in capacitances up to 1000pF. Parts require epoxy or eutectic die attach to substrate and one wire bond. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The NC’s are 100% electrically tested and visually inspected to MIL-STD-883. • Small size: 0.020 to 0.060 inches square • Capacitance range: 0.5pF to 1000pF APPLICATIONS The NC series of capacitor chips are designed for assembly in hybrid circuits using conventional wire-bonding techniques. They provide excellent stability and performance, and their small size gives the hybrid designer greater layout flexibility. They are available as MNOS or MOS capacitors. The MOS version is to be preferred when low dielectric absorption is required. ELECTRICAL SCHEMATIC NCA/NCB/NCC ELECTRICAL SCHEMATIC NCD/NCE TOP BONDING PADS TOP BONDING PADS BACK OF CHIP BACK OF CHIP STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Peak voltage at + 25°C 1.5 x working voltage 0.05% MNOS 0.1% MOS Dissipation factor, 1kHz, 1Vrms, + 25°C Q at 1mHz, 50mVrms, + 25°C 1000 minimum + 45 ± 25ppm/°C MNOS + 15 ± 25ppm/°C MOS TCC, - 55°C to + 150°C 109 minimum Insulation resistance at working voltage, + 25°C Operating temperature range - 55°C to + 125°C Thermal shock ± 0.25% + 0.25pF maximum 6C/C Moisture resistance, MIL-STD-202, Method 106 ± 1.0% + 0.25pF maximum 6C/C Short time overload, + 25°C, 5 seconds, 1.5 x working voltage ± 0.25% + 0.25pF maximum High temperature exposure, 100 hours at 150°C ambient ± 0.25% + 0.25pF maximum 6C/C Life, MIL-STD-202, Method 108 Condition D, + 125°C ambient, 100 hours at working voltage ± 0.25% + 0.25pF maximum 6C/C VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61033 Revision: 05-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 101 NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors DC WORKING VOLTAGES VALUES AND TOLERANCES NCA 0.020 Inches Square DC WORKING VOLTAGE MOS CAPACITANCE VALUE pF 51 47 43 - 55 - 36 60 - 33 65 - 30 75 35 27 80 39 24 90 44 22 95 48 20 105 54 18 120 60 16 135 68 15 140 73 13 150 85 12 160 93 11 180 102 10 200 114 8.2 200 160 6.8 200 193 5.6 200 200 4.7 200 200 NA 50 NA 100 39 NA CHIP CAPACITORS 4.3 3.9 3.6 3.3 3.0 2.7 2.4 2.2 2.00 1.80 1.60 1.50 1.30 1.20 1.10 1.0 0.91 0.82 0.75 0.68 0.62 0.56 0.50 DC WORKING VOLTAGE MNOS MOS 40 45 - CAPACITANCE VALUE pF ±5% ±10% ±20% ±25% ±2.5% ±5% ±10% ±20% **± 0.5pF NA = NOT AVAILABLE 91 82 - 65 - 200 NA 65 55 180 160 75 68 60 NA 100 DC WORKING CAPACITANCE VALUE pF VOLTAGE MNOS MOS 50 1000 60 - 65 - 70 - 150 70 - 38 130 80 40 62 90 42 120 90 45 56 95 47 110 100 49 51 105 47 120 43 130 52 56 135 68 36 140 74 33 150 ±2.5% ±5% ±10% ±20% 81 910 25 - 820 30 - 750 30 - 680 35 - 40 - 560 40 - 510 50 - 470 50 20 430 60 25 390 65 28 620 100 110 54 360 75 30 91 120 60 330 80 34 82 135 66 300 90 38 270 100 40 62 39 DC WORKING VOLTAGE MNOS MOS 20 - 75 140 72 240 100 47 68 165 81 220 110 52 62 180 88 200 120 57 180 135 63 160 140 70 150 140 76 190 56 97 ±2.5% ±5% ±10% ±20% NCE DC WORKING CAPACITANCE VOLTAGE VALUE pF MNOS MOS 55 220 NCD CAPACITANCE VALUE pF NCD 0.055 inches square NCE 0.060 inches square NCC 0.040 inches square NA NCB 0.030 inches square ±2.5% ±5% ±10% ±20% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 102 For technical questions contact: efi@vishay.com Document Number: 61033 Revision: 05-Mar-04 NC Series Thin Film Single Value Chip and Wire Capacitors Vishay Electro-Films DIMENSIONS 0.5pF - 1.3pF 1.4pF - 3.9pF 4pF - 9.1pF 10pF - 51pF NCA 0.020 ± 0.003 inches square 56pF - 220pF 150pF - 510pF 360pF - 1000pF NCB 0.030 ± 0.003 inches square NCC 0.040 ± 0.003 inches square NCD 0.055 ± 0.003 inches square NCE 0.060 ± 0.003 inches square CHIP CAPACITORS 33pF - 100pF MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Per Diagrams Chip thickness 0.010 ± 0.002 (0.25 ± 0.05mm) Chip substrate material Semiconductor silicon Dielectric Silicon dioxide/Silicon nitride Bond pad 0.005 x 0.005 minimum, 10kÅ aluminum Backing 3kÅ minimum gold OPTIONS: Gold bond pads 15kÅ Lower profile version is available, Consult Applications Engineer ORDERING INFORMATION Example: 100% visualled, 2pF, ± 5%, 20 mil MOS capacitor, Aluminum Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, commercial visually inspected loaded in matrix trays (4% AQL) NCA PRODUCT FAMILY NCA NCB NCC NCD NCE 017 PROCESS CODE 017 = MOS Aluminum 000 = MNOS Aluminum 2000 CAPACITANCE VALUE (pF) Use first 4 digits significant digits of capacitance C MULTIPLIER CODE C = 0.001 B = 0.01 A = 0.1 0=1 J TOLERANCE CODE D = ± 0.5pF H = ± 2.5%* J = ± 5.0% K = ± 10% M = ± 20% L = ± 25% N = ± 50% * MOS only VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61033 Revision: 05-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 103 CBA Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • User value selection CHIP CAPACITORS Product may not be to scale • Four capacitors with common connection • Capacitance range: 0.25pF to 15pF in binary increments The CBA MOS capacitor chips each contain four different capacitors in binary increments allowing the user many choices in value selection. Two versions of CBA capacitors are available: one with a total capacitance of 3.75pF and one with a total capacitance of 15pF. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The CBAs are 100% electrically tested and visually inspected to MIL-STD-883. • Dielectric: silicon dioxide • Chip size: 0.019 x 0.030 inches • Substrate: silicon with gold backing APPLICATIONS Vishay EFI CBA binary MOS multi-value capacitor chips are designed for hybrid packages in which microwave circuits are to be trimmed. This is done on the CBA chips by selecting the bonding pad for the required capacitance and wire-bonding by conventional techniques. WV (DC) VALUES AND TOLERANCES CAPACITOR MODEL CBA 3.75pF CBA 15pF 3.75pF 15pF 0.25pF, 0.50pF, 1.0pF, 2.0pF 1.0pF, 2.0pF, 4.0pF, 8.0pF Tolerance ± 25% ± 10% DC Working voltage 100V 30V Total capacitance Individual capacitance STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Peak voltage at + 25°C 1.5 x working voltage Dissipation factor, 1kHz, 1Vrms, + 25°C 0.1% maximum MOS Q at 1mHz, 50mVrms, + 25°C 1000 minimum TCC, - 55°C to + 150°C + 15 ± 25ppm/°C 109 minimum Insulation resistance at working voltage, + 25°C Operating temperature range - 55°C to + 150°C Thermal shock ± 0.25% + 0.25pF maximum 6C/C Moisture resistance, MIL-STD-202, Method 106 ± 1.0% + 0.25pF maximum 6C/C Short time overload, + 25°C, 5 seconds; 1.5 x working voltage ± 0.25% + 0.25pF maximum 6C/C High temperature exposure: 100 hours at + 150°C ambient Life, MIL-STD-202, Method 108, Condition D, + 125°C ambient, 1000 hours at working voltage ± 0.25% + 0.25pF maximum ± 2.0% + 0.25pF maximum 6C/C VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 104 For technical questions contact: efi@vishay.com Document Number: 61041 Revision: 03-Mar-04 CBA Vishay Electro-Films Thin Film Binary MOS Capacitors CONFIGURATIONS in inches 0.004 0.004 0.004 0.00375 0.008 0.015 0.019 0.0075 0.030 CHIP CAPACITORS SCHEMATIC TOP BONDING PADS 0.25pF 0.5pF TOP BONDING PADS 1.0pF 2.0pF 1.0pF Back of chip 2.0pF 4.0pF 8.0pF Back of chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.019 x 0.030 ± 0.002 (0.48 x 0.75 ± 0.05mm) Chip thickness 0.010 ± 0.003 (0.25 ± 0.08mm) Chip substrate material Semiconductor Silicon Dielectric Silicon dioxide (MOS) Bonding pads 10kÅ minimum aluminum Backing 3kÅ minimum gold OPTIONS: Gold bonding pads 15 kÅ minimum Other value combinations available Consult Applications Engineer ORDERING INFORMATION Example: 100% visualled, 3.75pF ± 25%, Aluminum Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CBA PRODUCT FAMILY 004 PROCESS CODE 004 = CBA 3750 CAPACITANCE VALUE (pF) Use first 4 significant digits of the capacitance (CT) C MULTIPLIER CODE C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 L TOLERANCE CODE K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61041 Revision: 03-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 105 CBB, CBC Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • User value selection CHIP CAPACITORS Product may not be to scale • Five capacitors on a 0.019 x 0.048 inches (CBB) or 0.044 inches square (CBC) chip • Capacitance range: 1.0pF to 93pF in binary increments The CBB and CBC MOS capacitor chips each contain five different capacitors in binary increments allowing the user many choices in value selection. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The CBB and CBCs are 100% electrically tested and visually inspected to MIL-STD-883. • Dielectric: silicon dioxide • Low dielectric loss • Substrate: silicon with gold backing APPLICATIONS Vishay EFI CBB and CBC binary MOS multi-value capacitor chips are designed to be a useful device for trimming hybrid circuits by adding or subtracting capacitance, using normal wire-bonding techniques. WV (DC) VALUES AND TOLERANCES CAPACITOR MODEL CBB CBC Total capacitance 31pF 93pF 1pF, 2pF, 4pF, 8pF, 16pF 3pF, 6pF, 12pF, 24pF, 48pF ± 10% ± 10% 75V 75V Individual capacitance Tolerance DC Working voltage STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Peak voltage at + 25°C 1.5 x working voltage Dissipation factor, 1kHz, 1Vrms, + 25°C 0.1% Q at 1mHz, 50mVrms, + 25°C 1000 minimum TCC, - 55°C to + 150°C + 15 ± 25ppm/°C 109 minimum Insulation resistance at working voltage, + 25°C Operating temperature range - 55°C to + 150°C Thermal shock ± 0.25% + 0.25pF maximum 6C/C Moisture resistance, MIL-STD-202, Method 106 ± 1.0% + 0.25pF maximum 6C/C Short time overload, + 25°C, 5 seconds; 1.5 x working voltage ± 0.25% + 0.25pF maximum 6C/C High temperature exposure: 100 hours at + 150°C ambient Life, MIL-STD-202, Method 108, Condition D, + 125°C ambient, 1000 hours at working voltage ± 0.25% + 0.25pF maximum ± 2.0% + 0.25pF maximum 6C/C VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 106 For technical questions contact: efi@vishay.com Document Number: 61042 Revision: 03-Mar-04 CBB, CBC Vishay Electro-Films Thin Film Binary MOS Capacitors CONFIGURATIONS in inches CBB CBC 0.029 0.004 0.004 0.004 0.008 0.009 0.016 0.009 0.018 0.003 3pF 6pF 0.020 0.00375 12pF 24pF 0.0124 0.0075 1 4pF 2pF 8pF 16pF 0.015 0.019 0.044 0.018 CHIP CAPACITORS 49pF 0.048 0.040 SCHEMATIC TOP BONDING PADS 1pF 2pF 4pF TOP BONDING PADS 8pF 16pF 3pF Back of chip 6pF 12pF 24pF 48pF Back of chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size, 0.019 x 0.048 ± 0.002 (0.48 x 1.2 ± 0.05mm) 0.044 x 0.044 ± 0.002 (1.1 x 1.1 ± 0.05mm) CBB CBC Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Semiconductor Silicon Dielectric Silicon dioxide (MOS) Bonding pads 10kÅ minimum aluminum Backing 3kÅ minimum gold OPTIONS: Gold bonding pads 15 kÅ minimum Consult Applications Engineer ORDERING INFORMATION Example: 100% visualled, 93pF, 10%, CBC Capacitor, Aluminum Pads, Class H visual inspection W INSPECTION /PACKAGING W = 100% visually inspected parts per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4% AQL) CBC PRODUCT FAMILY CBB CBC 012 PROCESS CODE 008 = CBB 012 = CBC 9300 CAPACITANCE VALUE (pF) Use first 4 significant digits of the capacitance (CT) B MULTIPLIER CODE C = 0.001 B = 0.01 A = 0.1 0=1 K TOLERANCE CODE J = 5.0% K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61042 Revision: 03-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 107 Vishay Electro-Films RESISTOR CAPACITOR ARRAYS Thin Film Filter Network Resistor-Capacitor Array (Wire Bondable) SIZE (inches) R - RANGE C - RANGE THIN FILM FILTER FILTER NETWORK RESISTOR/CAP ACITOR OR RESISTOR/CAPACIT ARRAY ARRAY 0.125 x 0.135 25, 50 ohms 50, 100, 200, 400pF MULTIVALUE PERFORMANCE ▲ MODEL RCN............109 Performance Key ▲ TCR ± 100ppm/°C TOL ± 10% TCC ± 200ppm/°C TOL ± 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 108 For technical questions contact: e @vishay.com Document Number: 61043 Revision: 03-Mar-04 RCN Vishay Electro-Films Thin Film Filter Networks FEATURES • Standard Resistance range: 251 and 501 Product may not be to scale • Standard Capacitance range: 50pF, 100pF, 200pF, 400pF • Resistance Tolerance to 1% Capacitance Tolerance to 5% The RCN series combines resistor and capacitor technology on a single chip to provide filtering capability together with excellent stability. Specifications below are standard but may be changed and customized for the application and are available in widebody SOIC or DIP packages. • Resistor material: Tantalum nitride, self-passivating • Oxidized silicon substrate APPLICATIONS The RCN filter chips are used for low pass filters, RFI & EMI, CMOS digital filters, ECL terminators and power supply filters. Contact our Sales Department for any special configurations or requirements that are needed. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND COMBOS (Standard) Absolute TCR = ± 100ppm/°C Absolute TCC = + 45 ± 75ppm/°C R C R C 251 50pF 501 50pF 251 100pF 501 100pF 251 200pF 501 200pF 251 400pF 501 400pF STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 - 35dB typical - 20dB typical Moisture resistance, MIL-STD-202 Method 106 ± 0.5% maximum 6R/R Stability, 100 hours, + 125°C 50mW/Res @ WVDC ± 0.5% maximum 6R/R ± 2.0% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202, Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure, + 150°C, 1000 hours ± 0.2% maximum 6R/R Insulation resistance 109 minimum Operating voltage 25V maximum DC power rating at - 55°C to + 125°C (100V maximum) 50mW 5 x rated power short-time overload, + 25°C, 5 seconds (100V maximum) ± 0.5% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61013 Revision: 05-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 109 RESISTOR CAPACITOR ARRAYS These chips are manufactured using Vishay (EFI) sophisticated Thin Film equipment and manufacturing technology. The RCNs are 100% electrically tested and visually inspected to MIL-STD-883. • Capacitor MOS/MNOS RCN Vishay Electro-Films Thin Film Filter Networks DIMENSIONS in inches 0.135 0.125 RESISTOR CAPACITOR ARRAYS SCHEMATIC Chip back plane MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.135 x 0.125 ± 0.005 (3.429 x 3.175 ± 0.127mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Chip substrate material Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pad size 0.005 x 0.007 (0.127 x 0.178mm) Number of pads 16 (8 x RC) Pad material 10kÅ minimum aluminum Backing 3kÅ minimum Gold OPTIONS: Gold bonding pads 15kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100% visualled, 251, ± 20%, 200pF ± 20%, ± 100ppm/°C, Aluminum Pads, Class H visual inspection P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) RCN 200 PRODUCT SERIES FAMILY 250 RESISTANCE VALUE Use the first 3 significant digits of the resistance & multiplier A RESISTOR TOLERANCE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 201 CAPACITOR VALUE Use the first 3 significant digits of the capacitance & multiplier M CAPACITANCE TOLERANCE J = 5.0% K = 10% M = 20% N = 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 110 For technical questions contact: efi@vishay.com Document Number: 61013 Revision: 05-Mar-04 Vishay Electro-Films Thin Film Chip Resistor Arrays Wire Bondable SIZE (inches) VALUE RANGE DESCRIPTION FILM MODEL 0.060 x 0.090 501 - 1M1 8 RESISTORS ISOLATED ▲ Ta2N CLA.......112 0.060 x 0.090 501 - 1M1 8 RESISTORS COMMON ▲ Ta2N CLB.......112 Ta2N MTR......114 Ta2N MTT.......116 SILICON 0.030 x 0.030 4001 - 240K1 13 RESISTORS MULTI-TAP 0.040 x 0.040 1.1K1 - 275K1 20 RESISTORS MULTI-TAP ● ■ Performance Key ■ ▲ TCR ± 10ppm/°C TCR TOL ± 0.1% TOL ± 250ppm/°C 1% ● TCR TOL ± 100ppm/°C 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61044 Revision: 08-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 111 CHIP RESISTOR ARRAYS CHIP RESISTOR RESISTOR ARRAYS ARRAYS PERFORMANCE CLA, CLB Vishay Electro-Films Thin Film Eight Resistor Array FEATURES • Eight equal value resistors on a 0.060 x 0.090 inch chip Product may not be to scale The CLA and CLB resistor arrays are the hybrid equivalent to the eight resistor common connection and isolated networks available in sips or dips. The resistors are spaced on 0.010 inches centers resulting in minimal space requirements. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The CLA and CLBs are 100% electrically tested and visually inspected to MIL-STD-883. • Resistance range: 201 to 1M1 • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values available • Moisture resistant APPLICATIONS The CLA and CLB thin film resistor arrays are designed for hybrid packages requiring up to eight resistors of the same resistance value and tolerance, as well as excellent TCR tracking. For such hybrids, they afford great savings in cost and space. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 0.1% CHIP RESISTOR ARRAYS 0.5% PROCESS CODE CLASS H* CLASS K* 026 054 ± 50ppm/°C 017 049 ± 100ppm/°C 008 045 ± 25ppm/°C *MIL-PRF-38534 inspection criteria 201 3001 300K1 500K1 1 M1 STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking spread Noise, MIL-STD-202, Method 308 1001 - 250k1 < 1001 or > 251k1 Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, + 125°C, 25mW Absolute Ratio Operating temperature range Thermal shock, MIL-STD-202 Method 107, Test condition F High temperature exposure ± 150°C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating at + 70°C, (derated to zero at 175°C) 5 x rated power short-time overload, + 25°C, 5 seconds ± 5ppm/°C - 35dB typical - 20dB typical ± 0.5% maximum 6R/R ± 0.25% maximum 6R/R ± 0.05% maximum 6R/R - 55°C to + 125°C ± 0.1% maximum 6R/R ± 0.2% maximum 6R/R 200V 1012 minimum 100V 50mW per resistor ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 112 For technical questions contact: efi@vishay.com Document Number: 61009 Revision: 05-Mar-04 CLA, CLB Vishay Electro-Films Thin Film Eight Resistor Array DIMENSIONS in inches CLA CLB 0.090 0.007 0.090 0.004 0.060 0.004 0.054 0.054 0.060 0.004 0.004 0.0775 0.007 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.060 x 0.090 ± 0.002 (1.50 x 2.26 ± 0.05mm) Chip thickness 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Resistor material Tantalum nitride, self-passivating Bonding pads 0.004 x 0.007 (0.10 x 0.178mm) CHIP RESISTOR ARRAYS Chip substrate material CLA - 16 CLB - 9 Number of top pads Pad material 10kÅ minimum aluminum Backing None, lapped semiconductor silicon OPTIONS: Gold backing for eutectic die attach For custom configurations, Consult Applications Engineer ORDERING INFORMATION Example: 100% visualled, 10k1, ± 1%, ± 100ppm/°C TCR, CLA Format, Aluminum Pads, Class H visual inspection P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts per MIL-STD-883 in matrix trays X = Sample, visually inspected loaded in matrix trays (4% AQL) CLA PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1000 RESISTANCE VALUE Use first 4 significant digits of the resistance 1 MULTIPLIER CODE D = 0.0001 C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 4 = 10000 F TOLERANCE CODE B = 0.1% C = 0.2% D = 0.5% F = 1.0% G = 2.0% H = 2.5% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61009 Revision: 05-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 113 MTR Vishay Electro-Films Thin Film Multi-Tap Resistors FEATURES ∑ Selectable values by wire bonding Product may not be to scale ∑ Chip size: 0.030 inches square ∑ Standard resistance range: 100W to 24kW or 800W to 240kW The MTR multi-tap resistors, available in two formats, offer eleven taps allowing the user to select specified increments a wide range of values. The desired resistance value is obtained by bonding the wires to the appropriate pads. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The MTRs are 100% electrically tested and visually inspected to MIL-STD-883. ∑ Resistor material: Tantalum nitride, self-passivating ∑ Oxidized silicon substrate for good power dissipation ∑ Ideally suited for hybrid prototyping APPLICATIONS The MTR series of multi-tap resistor chips are designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. CHIP RESISTOR ARRAYS TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Total resistance range 7 resistors between Pads 1 and 8 5 resistors between Pads 8 and 13 Standard tolerances Format A Format B 100W, 200W, 400W, 800W, 2.4kW, 8kW, 24kW 800W, 2.4kW, 8kW, 24kW, 80kW, 160kW, 240kW PROCESS CODE CLASS H* CLASS K* 050 060 051 061 Each 12.5% of total resistance Each 2.5% of total resistance ± 10%, ± 20% of total resistance of all 12 resistors TCR ± 100ppm/°C EXAMPLE: When the total resistance value is 8kW, the resistors between pads 8 and 13 are 200 each, and the resistors between Pads 1 and 8 are 1k each. *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between elements ± 5ppm/°C Noise, MIL-STD-202, Method 308 - 30dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum DR/R Stability, 1000 hours, + 125°C, 125mW ± 0.5% maximum DR/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202 Method 107, Test condition F ± 0.25% maximum DR/R High temperature exposure + 150°C, 100 hours ± 0.5% maximum DR/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C, (derated to zero at + 175°C) 250mW, total R 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum DR/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 114 For technical questions contact: efi@vishay.com Document Number: 61045 Revision: 28-May-04 MTR Vishay Electro-Films Thin Film Multi-Tap Resistors DIMENSIONS in inches 0.030 0.030 0.030 0.030 0.004 0.004 0.004 0.004 Format B Format A SCHEMATIC 13 R R R R 5R 5R 5R R 5R 5R 5R 5R CHIP RESISTOR ARRAYS 1 R = 40 R T MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pads Number of top pads Pad material Backing 0.030 x 0.030 ± 0.003 (0.762 x 0.762 ± 0.076mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Tantalum nitride, self-passivating 0.004 x 0.004 (0.10 x 0.10mm) 13 10kÅ minimum aluminum None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Gold bonding pads 15kÅ minimum thickness Other values available on request, Consult Application Engineer ORDERING INFORMATION Example: 100% visualled, 8kW, ± 10%, ± 100ppm/°C TCR, Alumimun Pads, Format B, Class H visual inspection P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, commercial visually inspected parts in matrix trays (4% AQL) MTR PRODUCT FAMILY 051 PROCESS CODE 050 = Format A 051 = Format B See Process Code table 8000 RESISTANCE VALUE Use first 4 significant digits of the resistance (RT) 0 MULTIPLIER CODE A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61045 Revision: 28-May-04 For technical questions contact: efi@vishay.com www.vishay.com 115 MTT Vishay Electro-Films Thin Film Multi-Tap Resistors FEATURES • Selectable values by wire bonding Product may not be to scale • Resistance range: 1.1k1 to 275k1 • Chip size: 0.038 inches square The MTT multi-tap resistors offer nineteen taps allowing the user to select specified increments and a wide range of values. The desired resistance value is obtained by bonding the wires to the appropriate pads. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The MTT’s are 100% electrically tested and visually inspected to MIL-STD-883. • Resistor material tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Ideally suited for hybrid prototyping APPLICATIONS CHIP RESISTOR ARRAYS The MTT series of multi-tap resistor chips are designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Total resistance range 1.1k1, 2.75k1, 5.5k1, 11k1, 27.5k1, 55k1, 110k1, 275k1 10 resistors between Pads 1 and 11 10 resistors between Pads 11 and 21 Standard tolerances Each 9.1% of total resistance Each 0.91% of total resistance ± 1%, ± 5%, ± 10%, ± 20% of total resistance of all 20 resistors TCR ± 250ppm/°C EXAMPLE: When the total resistance value is 55k1, the resistors between pads 11 and 21 are 5001 each, and the resistors between Pads 1 and 11 are 5k1 each. STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between elements ± 5ppm/°C Noise, MIL-STD-202, Method 308 - 30dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 125mW ± 0.5% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202 Method 107, Test condition F ± 0.25% maximum 6R/R High temperature exposure ± 150°C, 100 hours ± 0.5% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage 100V maximum DC power rating at + 70°C, (derated to zero at + 175°C) 250mW, total R 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.25% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 116 For technical questions contact: efi@vishay.com Document Number: 61046 Revision: 08-Mar-04 MTT Vishay Electro-Films Thin Film Multi-Tap Resistors DIMENSIONS in inches 0.038 0.038 0.009 21 0.004 0.004 0.009 0.004 0.004 TYPICAL RANGE 1.0k1 - 5.5k1 TYPICAL RANGE 11k1 - 275k1 SCHEMATIC R R R R R R R R R 10R 10R 10R 10R 10R 10R 10R 10R 10R 10R R = 110R T CHIP RESISTOR ARRAYS R 21 1 MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pads Number of pads Pad material Backing 0.038 x 0.038 ± 0.002 (0.762 x 0.762mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Tantalum nitride, self-passivating 0.004 x 0.004 (0.10 x 0.10mm) 21 10kÅ minimum aluminum None, lapped semiconductor silicon OPTIONS: Gold back for eutectic die attach Gold bonding pads 15kÅ minimum thickness Other values available on request, Consult Application Engineer ORDERING INFORMATION Example: 100% visualled, 55k1, ± 10%, ± 250ppm/°C TCR, Aluminum Pads, Class H visual inspection P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix trays per MIL-STD-883 X = Sample, commercial visually inspected parts in matrix trays (4% AQL) MTT PRODUCT FAMILY 002 PROCESS CODE 002 = Class H 008 = Class K See Process Code table 5500 RESISTANCE VALUE Use first 4 significant digits of the resistance (RT) 1 MULTIPLIER CODE A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE K = 10% M = 20% L = 25% N = 50% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61046 Revision: 08-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 117 Vishay Electro-Films Thin Film Chip Voltage Dividers SIZE (inches) VALUE PERFORMANCE VOLTAGE RATIO RANGE MULTIVALUE 0.058 x 0.058 25K1 TOTAL 1 - 20 ▲ MODEL Ta2N ATA..............119 CHIP VOLTAGE DIVIDERS CHIP VOLT VOLTAGE DIVIDERS FILM Performance Key ▲ TCR TOL ± 50ppm/°C ± 5% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 118 For technical questions contact: efi@vishay.com Document Number: 61047 Revision: 08-Mar-04 ATA Vishay Electro-Films Thin Film Voltage Divider Resistors FEATURES • Variable ratios Product may not be to scale • Chip size: 0.058 inch square • Resistor material: tantalum nitride, self-passivating The ATA voltage divider is a versatile two-resistor tapped chip whose RA/RB ratio can be specified within the values of 1:1 to 20:1. • Oxidized silicon substrate for good power dissipation • Moisture resistant These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The ATAs are 100% electrically tested and visually inspected to MIL-STD-883. APPLICATIONS Vishay EFI ATA voltage divider resistor-ratio chips are designed for the tight ratio tolerances generally required in amplifier feedback circuits. The great range of ratio choices makes them specially suitable for this application. TEMPERATURE COEFFICIENT OF RESISTANCE VALUES AND TOLERANCES Resistance (RA + RB) 25k1 Tolerances (RA + RB) ± 5% Greatest ratio (RA/RB) 20:1 ± 50ppm/°C CHIP VOLTAGE DIVIDERS TCR STANDARD ELECTRICAL SPECIFICATIONS PARAMETER TCR tracking between RA and RB ± 5ppm/°C Noise, MIL-STD-202, Method 308 - 35dB typical Moisture resistance, MIL-STD-202, Method 106 ± 0.5% maximum 6R/R Stability, 1000 hours, + 125°C, 25mW ± 0.25% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202 Method 107, Test condition F ± 0.1% maximum 6R/R High temperature exposure + 150°C, 100 hours ± 0.2% maximum 6R/R Dielectric voltage breakdown 200V 1012 Insulation resistance Operating voltage minimum 100V maximum DC power rating at + 70°C, (derated to zero at + 175°C) 50mW per resistor 5 x rated power short-time overload, + 25°C, 5 seconds ± 0.1% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61022 Revision: 08-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 119 ATA Vishay Electro-Films Thin Film Voltage Divider Resistors CONFIGURATIONS ATTENUATOR = RA FACTOR RA + RB 3 1 RB RB RC RA 3 RA 2 1 Any ratio RA/RB from 1 to 20 is available to ± 0.05% Rc is a parasitic resistor approximately 51 in value, which does not effect the performance of the device when it is used into a high impedence load. 2 Shaded areas represent bonding pads. MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pads Number of top pads Pad material Backing 0.058 x 0.058 ± 0.003 (1.47 x 1.47 ± 0.076mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 Tantalum nitride, self-passivating 0.005 x 0.005 (0.127 x 0.127mm) 3 10kÅ minimum aluminum None, lapped semiconductor silicon CHIP VOLTAGE DIVIDERS OPTIONS: Gold back for eutectic die attach Contact Applications Engineer ATTENUATION TABLE PART # ATA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 RATIO ACCURACY TEMPERATURE TRACKING RATIO RA/RB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ± 0.05% ± 5ppm/°C maximum ± 2ppm/°C typical ATTENUATOR FACTOR RB/RA + RB 11111111111111111111 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 ± 0.025% to ± 0.048% ± 2.5ppm/°C to ± 4.8ppm/°C maximum ± 1ppm/°C to ± 2ppm/°C typical ATTENUATOR FACTOR RA/RA + RB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 ± 0.025% to ± 0.0025% ± 2.5ppm/°C to ± 0.25ppm/°C maximum ± 1ppm/°C to ± 0.15ppm/°C typical ORDERING INFORMATION Example: 100% visualled, 25k1, ± 5%, ± 100ppm/°C TCR, Ratio = 19.0, Aluminum Pads, Class H visual inspection P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts per MIL-STD-883 X = Sample, visually inspected loaded in matrix trays (4% AQL) ATA PRODUCT FAMILY 003 PROCESS CODE 003 = Class H 005 = Class K 1900 RATIO VALUE Use first 4 significant digits of the ratio RA/RB - Any ratio between 1 to 20 B MULTIPLIER CODE C = 0.001 B = 0.01 J TOLERANCE CODE J = 5.0% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 120 For technical questions contact: efi@vishay.com Document Number: 61022 Revision: 08-Mar-04 Vishay Electro-Films Thin Film High TCR Sensor (Wire Bondable Top Contact) SIZE (inches) VALUE RANGE PERFORMANCE ▲ SINGLE VALUE 0.020 x 0.020 511 - 24K1 FILM MODEL Ni ● Pd RTA.............122 HIGH TCR SENSOR ▲ 0.030 x 0.030 511 - 51K1 DUAL VALUE Ni ● Pd RTB............122 HIGH TCR SENSOR Performance Key ▲ ● TCR + 1800ppm/°C TCR + 4800ppm/°C TOL 1% TOL 1% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61048 Revision: 08-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 121 RT Vishay Electro-Films High TC Thin Film Resistors FEATURES Product may not be to scale • Small chip size 0.020 x 0.020 inch - Format A 0.030 x 0.030 inch - Format B • Silicon substrate • Large change in resistance over temperature The RT resistor chip series offers high TC for special temperature sensing applications. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The RTs are 100% electrically tested and visually inspected to MIL-STD-883. • Standard resistance ranges: 511 to 24k1 - Format A 511 to 51k1 - Format B APPLICATIONS Vishay EFI RT chip resistors provide high TCR for circuit temperature compensation and are ideally suited for prototyping. Typical application areas are: • Amplifiers • Couplers • Oscillators • Filters • Attenuators WV (DC) VALUES AND TOLERANCES Tolerances ± 1%, ± 2%, ± 5%, ± 10% 511 - 24k1 - Format A 511 - 51k1 - Format B RETMA Values STANDARD ELECTRICAL SPECIFICATIONS HIGH TCR SENSOR PARAMETER Noise, MIL-STD-202, Method 308 TCR Absolute - 20dB typical + 1800ppm/°C - Type 1 - Nickel + 4800ppm/°C - Type 2 - Palladium TCR Linearity Stability, 1000 hours, + 125°C, 25mW < 3ppm/°C ± 1.0% maximum 6R/R Operating temperature range - 55°C to + 125°C Thermal shock, MIL-STD-202 Method 107, Test condition F ± 0.5% maximum 6R/R High temperature exposure ± 150°C, 100 hours ± 0.50% maximum 6R/R Dielectric voltage breakdown 200V 1012 minimum Insulation resistance Operating voltage DC power rating at + 70°C (derated to zero at 150°C) 5 x rated power short-time overload, + 25°C, 5 seconds 100V maximum 65mW maximum - Format A 125mW, maximum - Format B ± 0.5% maximum 6R/R VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 122 For technical questions contact: efi@vishay.com Document Number: 61029 Revision: 09-Mar-04 RT Vishay Electro-Films High TC Thin Film Resistors CONFIGURATIONS in inches FORMAT A FORMAT B 0.030 0.020 0.020 0.030 0.004 0.005 0.004 STANDARD RTB AND RTD CONFIGURATIONS Six locations. All pads 0.005 x 0.005 inches minimum SCHEMATICS RT = RA + RB MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size - Format A Chip size - Format B Chip thickness Chip substrate material Bonding pad size Pad material Backing HIGH TCR SENSOR 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.08mm) 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05mm) 0.010 ± 0.002 (0.254 ± 0.05mm) Oxidized silicon, 10kÅ minimum SiO2 0.004 x 0.004 (0.10 x 0.10mm) minimum 15kÅ minimum Gold standard None OPTIONS: Gold back for solder die attach ORDERING INFORMATION Example: 100% visualled, 1001, ± 10% P/N: W INSPECTION /PACKAGING W = 100% visually inspected parts in matrix tray per MIL-STD-883 X = Sample, commercial visually inspected parts loaded in matrix trays (4% AQL) RTB PRODUCT FAMILY RTD - 30 RTB - 30 RTA - 20 XXX PROCESS CODE Dependent on TC Consult factory 100 = + 1800ppm°C 300 = + 4800ppm°C 1000 RESISTANCE VALUE Use first 4 significant digits of the resistance A MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 K TOLERANCE CODE F = 1.0% G = 2.0% J = 5.0% K = 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61029 Revision: 09-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 123 Vishay Electro-Films Thin Film Inductor (Wire Bondable) SIZE (inches) RANGE SINGLE VALUE 0.050 x 0.050 140nH MULTIVALUE TUNABLE 0.050 x 0.050 35nH PERFORMANCE ▲ MODEL PSC TYPE S.......125 INDUCTOR INDUCTOR CHIP ● PSC TYPE T.......125 Performance Key CHIP INDUCTOR ▲ ● Q @ 1MHz 0.05 Q @ 1MHz TOLERANCE ± 5% TOLERANCE 0.08 ± 10% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 124 For technical questions contact: efi@vishay.com Document Number: 61049 Revision: 09-Mar-04 PSC Vishay Electro-Films Spiral Chip Inductor FEATURES • Small chip size: 0.050 inches square Product may not be to scale • Alumina substrate The PSC Chip Inductors offer the best combination of size and value available. Generally custom built to specific value requirements, two versions are offered here. • Inductance up to 150nH These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The PSCs are 100% electrically tested for inductance and Q. • Inductor material: thin film gold APPLICATIONS Primary application is in microwave circuits as resistant element or as choke in power supplies. High self-resonance is important for choke applications and achieved by reducing capacitance between turns by physically increasing space between spiral lines. Multi tap coils are available for wire bond tuning but since inductors are very sensitive to pattern width/spacing and metallization thickness almost all are custom built to specification desired. VALUES AND TOLERANCES TYPE S Single Bond TYPE T Tunable Q @ 1MHz 0.05 0.08 Tolerances ± 5% to ± 25% ± 10% to ± 25% Steps 3 x 9% Custom values/sizes available. Quartz substrate available for higher Q. Consult Application Engineer CHIP INDUCTOR STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Operating temperature range - 55°C + 125°C Dielectric constant 9.8 for alumina Coil resistance < 51 10121 minimum Insulation resistance VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61050 Revision: 09-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 125 PSC Vishay Electro-Films Spiral Chip Inductor CONFIGURATIONS in inches TYPE S TYPE T 0.004 DIA DIA 0.008 3 2 0.050 0.050 1 4 5 DIA 0.008 0.050 0.050 SCHEMATIC 2 3 4 5 1 TYPE S TYPE T MECHANICAL SPECIFICATIONS in inches PARAMETER Chip size 0.050 x 0.050 ± 0.003 (1.32 x 1.32 ± 0.076mm) Chip thickness 0.015 ± 0.002 (0.38 ± 0.05mm) Chip substrate material 99.6 Alumina, Quartz available Bonding pad size TYPE S 4 mil diameter typical TYPE T 8 mil diameter typical CHIP INDUCTOR Pad material Gold ORDERING INFORMATION Example: PSC TYPE S, 140nH, ± 10% P/N: PSC S/T TYPE 140 INDUCTANCE VALUE 3 significant digits 0 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 K TOLERANCE CODE J = 5.0% K = 10% M = 20% L = 25% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 126 For technical questions contact: efi@vishay.com Document Number: 61050 Revision: 09-Mar-04 Substrate Thin Film Metalized Wafers Vishay Electro-Films Thin Film Metalized Plates SIZE METALIZED METALIZED PLATES PLATES SUBSTRATE MATERIAL METALIZATION FILMS NiCr, Cu, Ta2N 2 to 4 INCHES ALUMINA 2 to 3 INCHES QUARTZ 2 to 4 INCHES ALUMINUM NITRIDE 2 to 3 INCHES BERYLLIUM OXIDE 3 to 5 INCHES SILICON Ni, TiW Pd, Al, Au NiCr, Ta2N Ni, TiW Pd, Al, Au NiCr, Cu, Ta2N Ni, TiW Pd, Au CAPABILITY SHEET..........128 NiCr, Cu, Ta2N Ni, TiW Pd, Au NiCr, Ta2N Ni, TiW Pd, Al, Au METALIZED WAFERS VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61051 Revision: 09-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 127 Metalized Plates Vishay Electro-Films Metalized Plates FEATURES • Metalization on 1, 2, or 6 surfaces • Excellent adhesion to all materials • Sizes to 4 inches x 4 inches Product may not be to scale • Metalized through holes with excellent adhesion • Polished or “As Fired” surfaces Vishay Electro-Films (EFI) offers the widest variety of metalization options, substrate materials, surface finishes and through hole metalization with rapid high volume delivery. • High volume • Rapid delivery Unique, proprietary sputtering systems provide high volume and uniform deposition for up to three different metalization layers on one or both sides without breaking vacuum. This insures excellent adhesion to the surfaces and on the metalized thru-hole walls. Volume plating with the conditions precisely controlled for each substrate insures uniform plating thickness from substrate to substrate as well as across individual substrates. SUBSTRATE MATERIALS Alumina, 99.6% • Thickness - 0.010 inches, 0.015 inches, 0.025 inches • Surface finish - as fired, 2 -4 microinches Polished, < 2 microinches Beryllium Oxide, Aluminum Nitride • For high thermal conductivity requirements • For low dielectric constant applications • Very low noise amplifiers • Loss factor: 0.0004 typical @ 25°C - 1MHz • Dielectric constant: 9.8 typical @ 25°C - 10GHz Quartz • Metalized, patterned, with resistors • Consistently high adhesion levels METALIZATION The Vishay EFI sputtering systems employ long life (15 year), large area targets that provide consistent resistance, TCR and long term stability characteristics from plate-to-plate and run-to-run. You can be sure that all parts shipped for decades will have the same characteristics as the qualification run. • Sputtered resistance material, 101/square to 2001/square • High stability nichrome. METALIZED WAFERS • Moisture resistant tantalum nitride. • Sputtered adhesion or barrier metal layers: NiCr, Ti, TiW, Ta2N, Mo, Cu, Ni, Pd. • Plated layers to 1000 microinches: Ni, Cu, Au. Ordering Information; Consult Application Engineer VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 128 For technical questions contact: efi@vishay.com Document Number: 61052 Revision: 09-Mar-04 Hybrid Circuit Substrates Vishay Electro-Films High-Power Multi-Tiered Conductor Hybrid Circuit Substrate FEATURES • Copper power lines up to 5000 microinches thick • Gold small signal lines ± 100 microinches width tolerance • Temperatures to 350°C • Substrate material: Alumina, Beryllium Oxide or Aluminum Nitride Product may not be to scale • Excellent adhesion • Metallized through holes • Filled vias • Resistors available • Sizes up to 4 inches x 4 inches Vishay Electro-Films (EFI) has developed a thin film process that has the unique capability of incorporating up to 5000 microinches thick plated copper conductors on the same substrate with standard 100 to 300 micro-inch thick conductors. Some hybrid circuit applications require thick copper conductors for the power lines but standard thickness small signal lines to maintain tight line width control of critical elements. For example, a microwave application may require high power bias current to GaAs or other semiconductor devices while also requiring tight line width control to obtain good high frequency performance for lange couplers, filters or other critical signal patterns. For standard, high power, low frequency hybrid circuit substrates, thick copper plating alone is ideal. The 5000μ inch thick plated copper has a resistivity of less than 0.15 milliohms/square. In most cases, the dc or low frequency copper power lines are overplated with nickel and gold to prevent oxidation, permitting high temperature processing and operation. The conductor material for the small signal lines is normally gold. Several substrate materials and various adhesion metals are available. Consult Applications Engineer to discuss your requirements in detail to jointly develop the optimum metalization structure for your application. TYPICAL CROSS SECTION POWER LINES PG PG PN PN SIGNAL LINES PC PC PG PG SG SG SA SA PG SG PG SG SA SA SUBSTRATE SG Sputtered Adhesion Layer Sputtered Gold PG Plated Gold PC Plated Copper PN METALIZED WAFERS SA Plated Nickel DRAWING NOT TO SCALE VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61053 Revision: 10-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 129 Vishay Electro-Films Thin Film Packaged Product Networks STYLE SURFACE MOUNT LEADLESS PACKAGED PRODUCTS LEADLESS CHIP CARRIER PERFORMANCE SINGLE LAYER ▲ MODEL SLR......... 131 Performance Key PACKAGED PRODUCTS NETWORKS ▲ ● ■ ◆ TCR ± 10ppm/°C TCR ± 25ppm/°C TCR ± 50ppm/°C TCR ± 100ppm/°C TOL ± 0.05% TOL ± 0.1% TOL ± 0.2% TOL ± 1% VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 130 For technical questions contact: efi@vishay.com Document Number: 61064 Revision: 29-Mar-04 SLR Vishay Electro-Films Single Layer Resistor Carrier Networks FEATURES ∑ Standard sizes 0.100, 0.150, 0.210 wide ∑ Custom sizes up to 0.500 inches x 0.500 inches ∑ Pad count to 36 ∑ Mixed values to 500KW Product may not be to scale ∑ Multiple reference resistor groups ∑ Ratio tolerance to ± 0.01% ∑ Ratio TCR’s to ± 1ppm/°C ∑ Nichrome resistor material standard. Tantalum nitride available, consult factory ∑ Custom pad spacing 0.025 inches or greater SLR (Single Layer Resistor Carrier) networks are offered to provide the user with a leadless device that maximizes board density while maintaining tight ratio tolerances and TCR tracking. Pads are provided top and bottom connected by edge castellations for ease of visual solder joint inspection. Resistors can be covered with Vishay Electro-Films (EFI) proprietary thermal set plastic for physical protection or left uncoated to facilitate user trimming. SLR’s are provided with 0.050 inches standard contact spacing; however, 0.025 inches contact spacing is also available. The standard contact metallization is gold flash over nickel plate. Solder coated contacts can be provided if preferred. Custom configurations, values, and tolerance combinations are available with fast turnaround. PRODUCT CAPABILITIES 10W to 500KW Resistance Range Absolute Resistance Tolerance ± 1% to ± 0.05% Resistance Ratio Tolerance ± 0.1% to ± 0.01% Absolute TCR ± 50ppm/°C; available to ±10ppm/°C Ratio TCR ± 5ppm/°C; available to ±1ppm/°C Absolute Resistor Stability (Mean)* 300ppm/1000hours @125°C (typical) Ratio Resistor Stability (Mean)* 18ppm/1000hours @ 125°C (typical) Package Power Dissipation 100mW/Res @70°C, 50 mW/ 125°C Temperature Range 0°C to + 70°C, - 40°C to + 85°C, - 55°C to + 125°C The SLR construction allows for a wide selection of special sizes and shapes with rapid turnaround and low NRE costs. The holes for the edge castellations are laser drilled into a multiple-up, large area substrates in-house prior to metallization. This permits new configurations with only laser software and a mask set. Custom parts can be provided with combinations of features listed: 1. 2. 3. 4. 5. Any combination of resistor values between 100W and 100KW in the standard sizes. Custom resistor network patterns (no crossovers). A wide variety of rectangular sizes and shapes with contact pads on two to four sides. Pad center-to-center spacings from 0.025 inches (0.635 mm) and larger. Uncoated to permit customer trimming. Document Number: 61068 Revision: 28-May-04 For technical questions contact: efi@vishay.com www.vishay.com 131 PACKAGED PRODUCTS NETWORKS VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 SLR Vishay Electro-Films Single Layer Resistor Carrier Networks OUTLINE DRAWING DIMENSIONS in inches [millimeters] C B D E A F R1 PIN 1 Centers A B C D E F 0.025 * 0.100 0.015 0.025 0.015 0.020 [0.64] * [2.54] [0.38] [0.64] [0.38] [0.51] 0.050 ** 0.100 0.030 0.050 0.015 0.020 [1.28] ** [2.54] [0.76] [1.28] [0.38] [0.51] 0.050 ** 0.150 0.030 0.050 0.025 0.020 [1.28] ** [3.84] [0.76] [1.28] [0.64] [0.51] 0.050 ** 0.210 0.030 0.050 0.025 0.020 [1.28] ** [5.37] [0.76] [1.28] [0.64] [0.51] * 0.025 inches [0.64mm] per resistor, 2 to 18 pads. ** 0.050 inches [1.28mm] per resistor, 2 to 18 pads. Resistor Area Single Layer 16 Pin Chip Carrier Chip measures 0.300 inches x 0.300 inches. Castellations are on 0.050 inches (1.27mm) centers. (Special Order) Standard Pitch: Castellations are on 0.050 inches (1.27mm) centers (0.025 inch pitch special order) ORDERING INFORMATION Example: SLRC-4-10000-1-B-F-D-C-G, 8 Lead 0.100 wide, with 4 Identical 100KW Isolated Resistors, Absolute Tolerance: 0.1%, Ratio Tolerance: 0.1%, Absolute TCR: 50ppm/°C, Ratio TCR: 2ppm/°C, Gold Termination SLR MODEL C WIDTH PACKAGED PRODUCTS NETWORKS C = 100 N = 150 M = 210 4 10000 1 B NUMBER RESISTANCE VALUE ABSOLUTE OF VALUE MULTIPLIER TOLERANCE % % RESISTORS ALL SAME VALUE (5 Significant Digits) C = 0.001 B = 0.01 A = 0.1 0 = 1.0 1 = 10.0 2 = 100.0 A = 0.05 B = 0.1 C = 0.2 D = 0.5 F = 1.0 G = 2.0 J = 5.0 K = 10.0 M = 20.0 F RATIO TOLERANCE (To R1) A = 0.005 B = 0.010 C = 0.025 D = 0.050 F = 0.100 H = 0.250 J = 0.500 K = 1.000 X = N/A D C G ABSOLUTE TCR. RATIO TCR TERMINATION PPM/°C PPM/°C A = 10 B = 25 D = 50 E = 100 B=1 C=2 D=3 F=5 G = 10 X = N/A G = Ni/Gold S = Solder Coated NOTE: Factory will covert order number into final part number. For special value combinations and pin outs consult Application Engineer VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 132 For technical questions contact: efi@vishay.com Document Number: 61068 Revision: 28-May-04 Resistor Network Time Stability Curves Vishay Electro-Films Resistor Network Time Stability Curves 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0.030 ABSOLUTE STABILITY OPERATING LIFE 1000 Hours = 0.0370% (Mean) 1 Year = 0.0520% (Mean) RATIO STABILITY OPERATING LIFE 0.025 6 1R IN % R2 6 R IN % NiCr on Alumina, 125°C 1000 Hours = 0.0018% (Mean) 1 Year = 0.0089% (Mean) 0.020 0.015 0.010 1 Year 0.005 1000 Hours 1000 Hours 0 2000 0.000 0 1 Year 4000 6000 8000 10000 12000 14000 2000 4000 6000 8000 10000 12000 14000 TIME IN HOURS TIME IN HOURS Figure 2 Figure 1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.030 ABSOLUTE STABILITY STORAGE LIFE SET 1000 Hours = 0.2500% (Mean) 4000 Hours = 0.5258% (Mean) RATIO STABILITY STORAGE LIFE SET 0.025 6 1R IN % R2 6 R IN % NiCr on Alumina, 200°C 1000 Hours = 0.0035% (Mean) 4000 Hours = 0.0084% (Mean) 0.020 0.015 0.010 0.005 0 500 1000 1500 2000 2500 3000 3500 0.000 0 4000 1000 2000 TIME IN HOURS 3000 4000 TIME IN HOURS Figure 3 Figure 4 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0.000 ABSOLUTE STABILITY OPERATING LIFE 1000 Hours = 0.040% (Mean) 0 100 200 300 400 500 600 700 800 6 1R IN % R2 6 R IN % Ta2N on Silicon, 125°C 0.010 0.009 0.008 0.007 0.006 0.005 0.004 0.003 0.002 0.001 0.000 900 1000 RATIO STABILITY OPERATING LIFE 1000 Hours = 0.0054% (Mean) 0 100 200 300 400 500 600 TIME IN HOURS 700 800 900 1000 TIME IN HOURS Figure 5 Figure 6 NiCr on Alumina 0.07 ABSOLUTE STABILITY VS. TEMPERATURE 0.06 6 1R IN % R2 6 R IN % 0.07 1000 Hours 0.05 0.04 0.03 RATIO STABILITY VS. TEMPERATURE 0.06 1000 Hours 0.05 0.04 0.03 0.02 0.02 0.01 0.01 0.00 0.00 25 35 45 55 65 75 85 95 105 115 125 135 145 25 35 45 STORAGE TEMPERATURE (°C) 55 65 75 85 95 105 115 125 135 145 STORAGE TEMPERATURE (°C) VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 Document Number: 61074 Revision: 10-Mar-04 For technical questions contact: efi@vishay.com www.vishay.com 133 PACKAGED PRODUCTS NETWORKS Figure 8 Figure 7 Thickness Conversion Chart Vishay Electro-Films Thickness Conversion Chart METRIC cm mm CENTIMETER MILLIMETER ENGLISH μ MICRON 10 100 105 2.54 25.4 25,400 10 10,000 2.54 2540 1 1000 0.254 254 0.1 100 1 0.254 0.1 Å ANGSTROM 0.001 μin MICRO-INCH 0.001 MILS 0.1 TENTH in 109 6 1000 10 1 395 39.5 0.395 105 100 1 0.1 39,500 39.5 0.395 10,000 10 0.1 3950 3.95 1000 1 108 107 106 in INCH 3.95 10 25.4 0.01 LOG SCALES 10 105 395 0.395 2.54 25,400 100 0.1 1 10,000 39.5 0.254 2540 10 1000 3.95 254 1 0.01 PACKAGED PRODUCTS NETWORKS 100 VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 • ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988 • SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389 www.vishay.com 134 For technical questions contact: efi@vishay.com Document Number: 61080 Revision: 10-Mar-04 WORLDWIDE SALES CONTACTS DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTS THE AMERICAS VISHAY AMERICAS ONE GREENWICH PLACE SHELTON, CT 06484 UNITED STATES PH: +1-402-563-6866 FAX: +1-402-563-6296 ASIA VISHAY INTERTECHNOLOGY ASIA PTE LTD. 25 TAMPINES STREET 92 KEPPEL BUILDING #02-00 SINGAPORE 528877 PH: +65-6788-6668 FAX: +65-6788-0988 JAPAN VISHAY JAPAN CO., LTD. SHIBUYA 3F, GE EDISON BUILDING 3-5-16 SHIBUYA SHIBUYA-KU TOKYO 150-0002 JAPAN PH: +81-3-5464-6411 FAX: +81-3-5464-6433 EUROPE VISHAY ELECTRONIC GMBH GEHEIMRAT-ROSENTHAL-STR. 100 95100 SELB GERMANY PH: +49-9287-71-0 FAX: +49-9287-70435 VISHAY S.A. 4, RUE DE SALONIQUE 95101 ARGENTEUIL FRANCE PH: +33-1-39-98-22-00 FAX: +33-1-39-98-22-05 VISHAY LTD. PALLION INDUSTRIAL ESTATE SUNDERLAND, SR4 6SU GREAT BRITAIN PH: +44-191-514-4155 FAX: +44-191-567-8262 ONLINE INFORMATION For product information and a current list of sales offices, representatives and distributors, visit our website: www.vishay.com ONE OF THE WORLD'S LARGEST MANUFACTURERS OF DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTS is now Vishay V I S H A Y I N T E R T E C H N O L O G Y, I N C . World Headquarters 63 Lincoln Highway Malvern, PA 19355-2143 United States w w w. v i s h a y. c o m © C o p y r i g h t V i s h a y I n t e r t e c h n o l o g y, I n c. R e g i s t e r e d Tr a d e m a r k s o f V i s h a y I n t e r t e c h n o l o g y, I n c. All rights reserved. Printed in the United States. Specifications subject to change without notice. Databook VSD-DB0005-0404