TH8056 DataSheet old 181 DownloadLink 4810

TH8056
Enhanced Single Wire CAN Transceiver
Features
‰
Fully compatible with GMW3089 V2.3 and J2411 Single Wire CAN specification for Class
B in-vehicle communications
‰
30 µA typical power consumption in sleep mode independent from CAN voltage range
‰
Operating voltage range 5V to 27V
‰
Up to 40 kbps bus speed
‰
Up to 100 kbps high-speed transmission mode
‰
Logic inputs compatible with 3.3V and 5V supply systems
‰
Control pin for external voltage regulators
‰
Low RFI due to output wave shaping in normal and high voltage wake up mode
‰
Fully integrated receiver filter
‰
Bus terminals proof against short-circuits and transients in automotive environment
‰
Loss of ground protection, very low leakage current (typ. 20µA at 27V and 125°C)
‰
Protection against load dump, jump start
‰
Thermal overload and short circuit protection
‰
ESD protection of 4 kV on CAN pin (2kV on any other pin)
‰
Under voltage lockout
‰
Bus dominant time-out feature
‰
14-pin thermally enhanced and 8-pin SOIC package
Ordering Information
Part No.
Temperature Range
Package
Revision
TH8056 KDC A
TH8056 KDC A8
-40 to 125 °C
-40 to 125 °C
SOIC14
SOIC8
A
A
General Description
The TH8056 is a physical layer device for a single wire data link capable of operating with various CSMA/CR protocols
such as the Bosch Controller Area Network (CAN) version 2.0. This serial data link network is intended for use in
applications where a high data rate is not required and a lower data rate can achieve cost reductions in both the physical
media components and the microprocessor and/or dedicated logic devices that use the network.
The network shall be able to operate in either the normal data rate mode or the high-speed data download mode for
assembly line and service data transfer operations. The high-speed mode is only intended to be operational when the
bus is attached to an off-board service node. This node shall provide temporary bus electrical loads which facilitate
higher speed operation.
The bit rate for normal communications is typically 33.33kbit/s, for high-speed transmissions as described above a typical
bit rate of 83.33kbit/s is recommended. The TH8056 is designed in accordance with the Single Wire CAN Physical Layer
Specification GMW3089 V2.3 and supports many additional features like under-voltage lock-out, time-out for faulty
blocked input signals, output blanking time in case of bus ringing and a very low sleep mode current.
TH8056 – Datasheet
3901008056
Page 1 of 26
April 2005
Rev 009
TH8056
Enhanced Single Wire CAN Transceiver
Contents
1.
Functional Diagram ....................................................................................................3
2.
Electrical Specification ..............................................................................................4
2.1
2.2
2.3
2.4
2.5
2.6
3.
Operating Conditions.............................................................................................4
Absolute Maximum Ratings ...................................................................................4
Static Characteristics.............................................................................................5
Dynamic Characteristics........................................................................................7
Bus loading requirements......................................................................................8
Timing Diagrams ...................................................................................................9
Functional Description.............................................................................................11
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
TxD Input pin .......................................................................................................11
Mode 0 and Mode 1 pins .....................................................................................11
RxD Output pin ....................................................................................................12
Bus LOAD pin......................................................................................................12
Vbat INPUT pin....................................................................................................13
CAN BUS pin.......................................................................................................13
INH Pin (TH8056 KDC A8 only)...........................................................................13
State Diagram......................................................................................................14
Power Dissipation................................................................................................15
Application Circuitry.............................................................................................17
4.
Pin Description .........................................................................................................18
5.
Package Dimensions................................................................................................19
5.1
5.2
6.
SOIC14................................................................................................................19
SOIC8..................................................................................................................20
Tape and Reel Specification ....................................................................................21
6.1
6.2
7.
Tape Specification ...............................................................................................21
Reel Specification for SOIC14NB ........................................................................22
ESD/EMC Remarks ...................................................................................................23
7.1
7.2
7.3
7.4
General Remarks ................................................................................................23
ESD-Test .............................................................................................................23
EMC ....................................................................................................................23
Latch Up Test ......................................................................................................23
8.
Revision History .......................................................................................................24
9.
Assembly Information ..............................................................................................25
10.
Disclaimer..............................................................................................................25
TH8056 – Datasheet
3901008056
Page 2 of 26
April 2005
Rev 009
TH8056
Enhanced Single Wire CAN Transceiver
1. Functional Diagram
INH *
VBAT
TH8056
5V Supply &
References
Biasing&
VBAT Monitor
Reverse
Current
Protection
RCOsc
Wave Shaping
TxD
CANH
CAN Driver
Time Out
FeedbackLoop
Input
Filter
MODE0
MODE
CONTROL
MODE1
LOAD
Receive
Comparator
Loss of
Ground
Detection
Reverse
Current
Protection
Wake up filter
RxD
RxD Blanking
Time Filter
GND
Figure 1 - Block Diagram
* INH terminal is present on TH8056 KDC A only
TH8056 – Datasheet
3901008056
Page 3 of 26
April 2005
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TH8056
Enhanced Single Wire CAN Transceiver
2. Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
The absolute maximum ratings (in accordance with IEC 134) given in the table below are limiting values that
do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term
exposure to limiting values may affect the reliability of the device.
2.1 Operating Conditions
Parameter
Symbol
Min
Max
Unit
VBAT
5.0
18
V
Operating ambient temperature for TH8056 KDC A
TA
-40
125
°C
Junction temperature
TJ
-40
150
°C
Battery voltage
2.2 Absolute Maximum Ratings
Parameter
Symbol
Supply Voltage
VBAT
Short-term supply voltage
VBAT.ld
Transient supply voltage
Transient supply voltage
Transient supply voltage
VBAT.tr1
VBAT..tr2
VBAT..tr3
CANH voltage
VCANH
Transient bus voltage
Transient bus voltage
Transient bus voltage
DC voltage on pin LOAD
DC voltage on pins TxD, MODE1, MODE0,RxD,
ESD capability of CANH
VCANH..tr1
VCANH.tr2
VCANH.tr3
VLOAD
Condition
ESD capability of any other pins
ESDHB
Maximum latch – up free current at any Pin
ILATCH
Thermal impedance [3]
ΘJA
Storage temperature
Junction temperature
Tstg
Tvj
Max
Unit
-0.3
18
40
27
V
Load dump; t<500ms
Jump start; t<1min
ISO 7637/1 pulse 1[1]
ISO 7637/1 pulses 2[1]
ISO 7637/1 pulses 3A, 3B
VBAT <= 27V
VBAT = 0
ISO 7637/1 pulse 1 [2]
ISO 7637/1 pulses 2 [2]
ISO 7637/1 pulses 3A, 3B [2]
-200
100
200
V
V
V
via RT > 2kΩ
-40
40
V
-0.3
7
V
-4
4
kV
-2
2
kV
-500
500
70
150
150
150
mA
VDC
ESDCANHB
Min
Human body model,
equivalent to discharge
100pF with 1.5kΩ,
Human body model,
equivalent to discharge
100pF with 1.5kΩ,
-50
-200
-20
-40
-50
in free air, SOIC14
in free air, SOIC8
-55
-40
100
200
40
40
V
V
V
V
V
K/W
°C
°C
[1]
ISO 7637 test pulses are applied to VBAT via a reverse polarity diode and >1uF blocking capacitor .
ISO 7637 test pulses are applied to CANH via a coupling capacitance of 1 nF.
[3]
The application board shall be realized with a ground copper foil area >150mm2 (low conductance board in accordance to
JEDEC51-7)
[2]
TH8056 – Datasheet
3901008056
Page 4 of 26
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TH8056
Enhanced Single Wire CAN Transceiver
2.3 Static Characteristics
Unless otherwise specified all values in the following tables are valid for VBAT = 5V to 27V and TAMB=-40°C to
125oC. All voltages are referenced to ground (GND), positive currents flow into the IC.
Parameter
Symbol
Condition
Min
Typ
Max
Unit
6
12
18
V
PIN VBAT
Operating supply voltage
VBAT
Low battery operating supply voltage
VBAT_L
except high-speed/sleep mode
5
6
V
Short duration Operating supply voltage
VBAT_JS
T<1min, Tamb < 85°C
(except high-speed mode)
18
27
V
Under-voltage lock-out
VBATuv
4.0
4.8
V
Supply current, recessive, all active modes
IBAT
VBAT = 18V , TxD open
5
8
mA
Normal mode supply current, dominant
IBATN [2]
VBAT = 27V MODE0=MODE1=H
TxD=L, Rload = 200Ω
30
35
mA
High-speed mode supply current, dominant
IBATH [2]
VBAT = 16V
MODE0=H,MODE1=L,TxD=L,
Rload = 75Ω
60
75
mA
Wake-up mode supply current, dominant
IBATW [2]
VBAT = 27V
MODE0=L,MODE1=H, TxD=L,
Rload = 200Ω
60
75
mA
IBATS
VBAT =18V, TxD, RxD, MODE0,
MODE1 open;
30
60
µA
Sleep mode supply current
PIN CANH
Bus output voltage, low battery
Voh_l
RL > 200Ω,
Normal, high-speed mode,
5V < VBAT < 6V
3.4
5.1
V
Bus output voltage
Voh
RL > 200Ω, Normal mode,
6V < VBAT < 27V
4.4
5.1
V
Bus output voltage, high-speed mode
Voh
RL > 75Ω, high-speed mode,
8V < VBAT < 16V
4.2
5.1
V
Fixed Wake-up Output High Voltage
VohWuFix
Wake-up mode, RL > 200Ω,
11.2V < VBAT < 27V
9.9
12.5
V
Offset Wake-up Output High Voltage
VohWuOffset
Wake-up mode, RL > 200Ω,
5V < VBAT < 11.2V
VBAT – 1.5
VBAT
V
Recessive state or sleep mode,
Rload = 6.5 kΩ,
-0.2
0.20
V
Recessive state output voltage
Vol
Bus short circuit current
-ICAN_SHORT
VCANH = 0V, VBAT = 27V,
TxD = 0V
50
350
mA
Bus leakage current during loss of ground
ILKN_CAN[1]
Loss of ground, VCANH = 0V
-50
10
µA
TxD high;
-10
10
µA
Bus leakage current, bus positive
ILKP_CAN
Bus input threshold
Vih
Normal, high-speed mode
2.0
2.1
2.2
V
Bus input threshold low battery
Vihlb
Normal mode 5V<VBAT<6V
1.6
1.7
2.2
V
VihWuFix[2]
Sleep mode, VBAT > 11.2V
6.6
7.9
V
VBAT-4.3
VBAT-3.25
V
Fixed Wake-up Input High Voltage
Threshold
Offset Wake-up Input High Voltage
Threshold
TH8056 – Datasheet
3901008056
VihWuOffset[2] Sleep mode
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Enhanced Single Wire CAN Transceiver
Parameter
Symbol
Condition
Min
Typ
Max
Unit
0.5
V
1
V
RLOAD
+35%
Ω
PIN LOAD
Voltage on switched ground pin
VLOAD
ILOAD = 5mA
Voltage on switched ground pin
VLOAD_LOB
ILOAD = 7mA , VBAT = 0V
Load resistance during loss of battery
RLOAD_LOB
VBAT = 0
RLOAD
-10%
PIN TXD,MODE0,MODE1
High level input voltage
Vih
Low level input voltage
Vil
TxD pull-up current
MODE pull-down resistor
-IIL_TXD
2.0
TxD = L, MODE0 and 1 = H
RMODE_pd
V
0.8
V
20
50
µA
20
50
kΩ
0.4
V
10
µA
70
mA
PIN RXD
Low level output voltage
Vol_rxd
IRxD = 2mA
High level output leakage
Iih_rxd
VRxD = 5V
Irxd
VRxD = 5V
RxD output current
-10
PIN INH
High level output voltage
Voh_INH
IINH = -180µA
Leakage current
IINH_lk
Mode0/1 = L ,VINH = 0V
VS -0.8V
VS-0.5V
V
-5
5
µA
Over-temperature Protection
Thermal shutdown
Tsd [2]
155
180
°C
Thermal recovery
Trec [2]
126
150
°C
[1]
[2]
Leakage current in case of loss of ground is the sum of both currents ILKN_CAN and ILKN_LOAD .
Thresholds are not tested in production, but characterized and guaranteed by design
TH8056 – Datasheet
3901008056
Page 6 of 26
April 2005
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Enhanced Single Wire CAN Transceiver
2.4 Dynamic Characteristics
Unless otherwise specified all values in the following table are valid for VBAT = 5V to 27V and TAMB= -40°C to
125oC.
Parameter
Symbol
Condition
Min
Max
Unit
tTr [1]
min and max loads acc. to
2.5 Bus loading requirements
2
6.3
µs
tTWUr [2]
min and max loads acc. to
2.5 Bus loading requirements
3
18
µs
Transmit delay in normal mode,
falling edge
tTf [3]
min and max loads acc. to
2.5 Bus loading requirements
1.8
10
µs
Transmit delay in wake-up mode,
falling edge
tTWU1f [3]
min and max loads acc. to
2.5 Bus loading requirements
3
13.7
µs
Transmit delay in high-speed mode,
rising edge
tTHSr [4]
min and max loads acc. to
2.5 Bus loading requirements
0.1
1.5
µs
Transmit delay in high-speed mode,
falling edge
tTHSf[5]
min and max loads acc. to
2.5 Bus loading requirements
0.04
3
µs
Receive delay , all active modes
tDR [6]
CANH high to low transition
0.3
1
µs
Receive delay , all active modes
tRD [6]
CANH low to high transition
0.3
1
µs
Input minimum pulse length, all active
modes
tmpDR [6]
CANH high to low transition
0.15
1
µs
Input minimum pulse length, all active
modes
tmpRD [6]
CANH low to high transition
0.15
1
µs
Transmit delay in normal and wake-up
mode, rising edge
Transmit delay in wake-up mode to VihWU,
rising edge
Wake-up filter time delay
Typ
tWUF
See diagrams, Figure 3
10
70
µs
Receive blanking time after
TxD L-H transition
trb
See diagrams, Figure 4
0.5
6
µs
TxD time-out reaction time
ttout
All active modes
10
30
ms
Delay from Normal to High-speed/HVWU
Mode
tdnhs
30
ms
Delay from High-speed /HVWU to Normal
Mode
tdhsn
30
ms
Delay from Normal Mode to Standby
tdsby
VBAT = 6V to 27V
500
µs
Delay from Standby to Sleep Mode
tdsleep
VBAT = 6V to 27V
500
ms
Delay from Sleep to normal Mode
tdsnwu
VBAT = 6V to 27V
50
ms
TH8056 – Datasheet
3901008056
Page 7 of 26
100
April 2005
Rev 009
TH8056
Enhanced Single Wire CAN Transceiver
[1]
The maximum signal delay time for a bus rising edge is measured from Vcmos il on the TxD input pin to the VihMax + V g off max
level on CANH at maximum network time constant , minimum signal delay time for a bus rising edge is measured from Vcmos ih
on the TxD input pin to 1V on CANH at minimum network time constant .These definitions are valid in both normal and HVWU
mode
[2]
The maximum signal delay time for a bus rising edge in HVWU mode is measured from Vcmos il on the TxD input pin to the
VihWUMax + V g off max level on CANH at maximum network time constant, minimum signal delay time for a bus rising edge is
measured from Vcmos ih on the TxD input pin to 1V on CANH at minimum network time constant
[3]
Maximum signal delay time for a bus falling edge is measured from V cmos ih on the TxD input pin to 1V on CANH at maximum
network time constant, minimum signal delay time for a bus falling edge is measured from V cmos ih on the TxD input pin to the
VihMax + V g off max level on CANH. These definitions are valid in both normal and HVWU mode.
[4]
The signal delay time in high-speed mode for a bus rising edge is measured from Vcmos il on the TxD input pin to the VihMax + V g
max level on CANH at maximum high-speed network time constant.
off
[5]
The signal delay time in high-speed mode for a bus falling edge is measured from Vcmos ih on the TxD input pin to 1V on CANH
at maximum high-speed network time constant
[6]
Receive delay time is measured from the rising / falling edge crossing of the nominal Vih value on CANH to the falling
(Vcmos_il_max) / rising (Vcmos_ih_min) edge of RxD. This parameter is tested by applying a square wave signal to CANH.
The minimum slew rate for the bus rising and falling edges is 50V/us. The low level on bus is always 0V. For normal mode
and high-speed mode testing the high level on bus is 4V. For HVWU mode testing the high level on bus is Vbat – 2V.
2.5 Bus loading requirements
Parameter
Symbol
Min
Number of system nodes
Typ
2
Network distance between any two ECU nodes
Max
Unit
32
Bus length
60
M
Node Series Inductor Resistance (if required)
Rind
3.5
Ohm
Ground Offset Voltage
Vgoff
1.3
V
Ground Offset Voltage, low battery
Vgofflb
0.1 VBAT
0.6
V
150
300
pF
19000
pF
6665
Ohm
Device Capacitance (unit load)
Cul
135
Network Total Capacitance
Ctl
396
Device Resistance (unit load)
Rul
6435
Device Resistance (min load)
Rmin
2000
Network Total Resistance
Rtl
200
3332
Ohm
Rload
75
135
Ohm
Network Time Constant [1]
τ
1
4
µs
Network Time Constant, high-speed mode [1]
τ
1.5
µs
High-Speed Mode Network Resistance to GND
6490
Ohm
[1]
The network time constant incorporates the bus wiring capacitance. The minimum value is selected to limit radiated emissions. The
maximum value is selected to ensure proper communication under all communication modes. Not all combinations of R and C are
possible. The following load conditions are used for the measurement of the dynamic characteristics:
Normal and high volt. wake-up mode
min.load/min tau
3.3KΩ/ 540pF
min.load/max tau
3.3KΩ/ 1.2nF
max.load/min tau
200Ω/ 5nF
max.load/max tau 200Ω/ 20nF
TH8056 – Datasheet
3901008056
High-speed mode
Additional 140Ω tool resistance to
ground in parallel
Additional 120Ω tool resistance to
ground in parallel
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TH8056
Enhanced Single Wire CAN Transceiver
2.6 Timing Diagrams
VTxD
50%
t
tT
VCANH
Vih max + Vgoff max
1V
t
tR
tF
tD
tDR
VRxD
50%
t
Figure 2 - Input / Output Timing
TH8056 – Datasheet
3901008056
Page 9 of 26
April 2005
Rev 009
TH8056
Enhanced Single Wire CAN Transceiver
VCANH
Vih+Vgoff
t
tWu
tWU
tWuF
VRxD
tWU < tWuF
wake up
interrupt
t
Figure 3 – Wake-up Filter Time Delay
VTxD
50%
t
VCANH
Vih
t
VRxD
50%
t
trb
Figure 4 - Receive Blanking Time
TH8056 – Datasheet
3901008056
Page 10 of 26
April 2005
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Enhanced Single Wire CAN Transceiver
3. Functional Description
3.1 TxD Input pin
Logic command to transmit on the single wire CAN bus
TxD Polarity
TxD = logic 1 (or floating) on this pin produces an undriven or recessive bus state (low bus voltage)
TxD = logic 0 on this pin produces either a bus normal or a bus high-voltage dominant state
depending on the transceiver mode state (high bus voltage)
ƒ
ƒ
If the TxD pin is driven to a logic low state while Mode 0,1 pins are in the 0,0 or sleep state, the transceiver
cannot drive the CAN Bus pin to the dominant state.
The transceiver provides an internal pull up on the TxD pin, which will cause the transmitter to default to the
bus recessive state, when TxD is not driven.
TxD input signals are standard CMOS logic levels for 3.3V and 5V supply voltages.
Time-out feature
In case of a faulty blocked dominant TxD input signal the CANH output is switched off automatically after the
specified TxD time-out reaction time to prevent a dominant bus. The transmission is continued by next TxD L
to H transition without delay.
3.2 Mode 0 and Mode 1 pins
Select transceiver operating modes
The transceiver provides a weak internal pull-down current on each of these pins, which causes the
transceiver to default to sleep mode when they are not driven. The Mode input signals are standard CMOS
logic level for 3.3V and 5V supply voltages.
M0
M1
Mode
L
L
Sleep Mode
H
L
High-Speed
L
H
High-Voltage Wake-Up
H
H
Normal Mode
Figure 5 - Truth Table
Mode 0 = 0, Mode 1 = 0 - Sleep mode
Transceiver is in low-power state, waiting for wake-up via high-voltage signal or by mode pins change to any
state other than 0,0. In this state, the CAN Bus pin is not in the dominant state regardless of the state of the
TxD pin.
Mode 0 = 1, Mode 1 = 0 – High-Speed mode
This mode allows high-speed download with bitrates up to 100Kbit/s. The output waveshaping circuit is
disabled in this mode. Bus transmitters which require communicating in high-speed mode are able to drive
reduced bus resistance during this mode.
Note: High-speed mode is only allowed with connected tool resistance in parallel to the network load. Otherwise the stability of the
output signal is not guaranteed because of the slew rate enhancement for the required rise times .
TH8056 – Datasheet
3901008056
Page 11 of 26
April 2005
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TH8056
Enhanced Single Wire CAN Transceiver
Mode 0 = 0, Mode 1 = 1 - Transmit with high voltage signals to wake up remote nodes (HVWU)
This bus includes a selective node awake capability, which allows normal communication to take place
among some nodes while leaving the other nodes in an undisturbed sleep state. This is accomplished by
controlling the signal voltages such that all nodes must wake up when they receive a higher voltage
message signal waveform. The communication system communicates to the nodes information as to which
nodes are to stay operational (awake) and which nodes are to put themselves into a non-communicating
low-power “sleep” state. Communication at the lower, normal voltage levels does not disturb the sleeping
nodes.
Mode 0 = 1, Mode 1 = 1 - Normal speed and signal voltage mode
Transmission bit rate in normal communication is 33.333 Kbits/sec. In normal transmission mode the
TH8056 supports controlled waveform rise and overshoot times. Waveform trailing edge control is required
to assure that high frequency components are minimized at the beginning of the downward voltage slope.
The remaining fall time occurs after the bus is inactive with drivers off and is determined by the RC time
constant of the total bus load.
3.3 RxD Output pin
Logic data as sensed on the single wire CAN bus
RxD polarity
RxD = logic 1 on this pin indicates a bus recessive state (low bus voltage)
RxD = logic 0 on this pin indicates a bus normal or high-voltage bus dominant state
RxD in Sleep Mode
RxD does not pass signals to the micro processor while in sleep mode until a valid wake-up bus voltage level
is received or the Mode 0, 1 pins are not 0,0 respectively. When the valid wake-up bus signal awakens the
transceiver, the RxD pin signalizes an interrupt (logic 0 for dominant high-voltage signal). If there is no mode
change within the time stated, the transceiver reenters the sleep mode as described in 3.7
When not in sleep mode all valid bus signals will be sent out on the RxD pin.
RxD Typical Load
Resistance: 2.7 kohms
Capacitance: < 25 pF
3.4 Bus LOAD pin
Resistor ground with internal open-on-loss-of-ground protection
When the ECU experiences a loss of ground condition, this pin is switched to a high impedance state.
The ground connection through this pin is not interrupted in any transceiver operating mode including the
sleep mode. The ground connection is interrupted only when there is a valid loss of ground condition.
This pin provides the bus load resistor with a path to ground which contributes less than 0.1 volts to the bus
offset voltage when sinking the maximum current through one unit load resistor.
The transceiver’s maximum bus leakage current contribution to Vol from the LOAD pin when in a loss of
ground state is 50 uA over all operating temperatures and 3.5 V < Vbatt < 27 V.
TH8056 – Datasheet
3901008056
Page 12 of 26
April 2005
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TH8056
Enhanced Single Wire CAN Transceiver
3.5 Vbat INPUT pin
Vehicle Battery Voltage
The transceiver is fully operational as described in chapter 2 over the range 6V<Vbat IC<18V as measured
between the GND pin and this pin.
For 5V < Vbat IC < 6V the bus operates in normal mode with reduced dominant output voltage and reduced
receiver input voltage. High voltage wake-up call is not possible (dominant output voltage is the same as in
normal or high-speed mode).
The transceiver operates in normal mode and high-voltage wake-up mode if 18V < Vbat IC < 27V at 85°C for
one minute.
For 0V< Vbat IC < 4.8V, the bus is passive (not driven dominantly) and RxD is undriven (high), regardless of
the state of the TxD pin (under-voltage lock-out).
3.6 CAN BUS pin
Bus Input/Output
Wave Shaping in normal and HVWU mode
Wave shaping is incorporated into the transmitter to minimize EMI radiated emissions. An important
contributor to emissions is the rise and fall times during output transitions at the “corners” of the voltage
waveform. The resultant waveform is one half of a sine wave of frequency 50 - 65 kHz at the rising waveform
edge and one quarter of this sine wave at falling or trailing edge.
Short circuits
If the CAN BUS pin is shorted to ground for any duration of time, the current is limited to the specified value,
until an over-temperature shut-down circuit disables the output high side drive source transistor (before the
local die temperature exceeds the damage limit threshold).
Loss of ground
In case of an ECU loss of ground condition, the LOAD pin is switched into high impedance state. The CANH
transmission is continued until the under-voltage lock-out voltage threshold is detected.
Loss of battery
In case of loss of battery (VBAT = 0 or open) the transceiver does not disturb bus communication. The
maximum reverse current into power supply system doesn’t exceed 500µA.
3.7 INH Pin (TH8056 KDC A only)
This Pin is a high-voltage highside switch used to control the ECU’s regulated microcontroller voltage supply.
After power-on the transceiver automatically enters an intermediate standby mode, the INH output will
become HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply for the ECU .
If there is no mode change within the time stated, the transceiver reenters the sleep mode and the INH
output goes to logic 0 (floating). When the transceiver has detected a valid wake-up condition (bus HVWU
traffic which exceeds the wake-up filter time delay) the INH output will become HIGH (VBAT) again and the
same procedure starts as described after power-on. In case of a mode change into any active mode the
sleep timer is stopped and INH keeps high (VBAT) level. If the transceiver enters the sleep mode (M0,1=0),
INH goes to logic 0 (floating) no sooner than 100ms when no wake-up signal is present.
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Enhanced Single Wire CAN Transceiver
3.8 State Diagram
HVWU Mode
M0
M1
INH
low
high
VBAT
M0/1 =>High
High Speed Mode
M0&1=>Low
M0
M1
INH
high
low
VBAT
VBATon
Normal Mode
M0
M1
INH
high
high
VBAT
M0/1 =>High
(if VCC_ECU on)
VBAT standby
M0/1 INH RxD CAN
after min. 100ms
-> no mode change
-> no valid wake up
low
VS
high /
float.
low[1]
wake up
request
from Bus
Sleep Mode
[1]
M0/1
INH/CAN
low
floating
low after HVWU, high after VBAT on & VCCECU present
Figure 6 - State Diagram
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Enhanced Single Wire CAN Transceiver
3.9 Power Dissipation
The TH8056 has an integrated protection against thermal overload. If the junction temperature reaches the
thermal shutdown threshold the TH8056 disables the transmitter driver to reduce the power dissipation to
protect the IC itself from thermal overload. The function of the transceiver will become again available if the
junction temperate drops below the thermal recovery temperature.
To secure a stable functioning within the application and to avoid a transmitter switch off due to thermal
overload under normal operating conditions, the application must take care of the maximum power
dissipation of the IC. The junction temperature can be calculated with:
TJ = Ta + Pd * θja
TJ
Junction temperature
Ta
Ambient temperature
Pd
Dissipated power
θja
Thermal resistance
The Junction temperature shouldn’t exceed under normal operating conditions the limit specified in chapter
2.3 Static Characteristics.
The power dissipation of an IC is the major factor determining the junction temperature. The TH8056
consumes current in different functions. A part of the supply current goes to the load and the other part
dissipates internally. The internal part has a constant passive part and an active part which depends on the
actual bus transmission. The complete internal part causes and increasing of the junction temperature.
Ptot = PINT_a + PINT_P
PINT_a Internal power dissipation active
PINT_p Internal power dissipation passive
Ptot
Overall power dissipation
D
Duty cycle for data transmission
The internal passive part can be calculated with the operating voltage and the normal mode supply current
recessive. The active part can be calculated with the voltage drop of the driving transistor and the current of
the CAN bus. The active part generates only during data transmission power dissipation. Therefore the duty
cycle has to be taken into account.
PINT_p = VBAT * IBAT
PINT_a = (VBAT - VCANH) * Iload * D
VBAT
Battery supply voltage
IBAT
Normal mode supply current recessive
Can network current
Iload
D
Duty cycle for data transmission
VCANH Voltage at CANH pin
The power dissipation of the load can be calculated with the CANH voltage and the CAN bus current.
where
Pload = VCANH * Iload * D
Iload = VCANH / Rload_net
Pload
Power dissipation of the load resistor
Current of CAN network
Iload
VCANH Voltage at CANH pin
Rload_net Network total resistance
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Page 15 of 26
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Enhanced Single Wire CAN Transceiver
Assumptions:
VBAT = 26.5V
Rload = 6.49 kΩ
Network with 32 nodes
VCANH = 5.1V
IBAT = 6mA
D = 50%
Ta = 125°C
ΘJA = 70k/W (Thermally enhanced SOIC14 package)
Computations:
Rload_net = 6.49kΩ / 32nodes = 203Ω
Iload = 5.1V / 203Ω = 25mA
Pload = 5.1V * 25mA * 0.5 = 64mW
PINT_a = (26.5V – 5.1V) * 25mA * 0.5 = 267mW
PINT_P = 26.5V * 6mA = 159mW
Ptot = 267mW + 159mW = 426mW
Tj = 125°C + 426mW * 70k/W = 155°C
The above calculation shows that under worst case conditions (max. operating voltage, max bus load, max
ambient temperature) the TH8056 with the thermally enhanced SOIC14 package operates below the thermal
limit. A stable functioning is possible up to these limits.
3.9.1. Thermal behaviour of TH8056 with SOIC8 – TH8056 KDC A8
The thermal impedance of an SOIC8 package is about twice in comparison to the thermally enhanced
SOIC14 package. Therefore the maximum power dissipation within this package is only about the half.
The using of the SOIC8 version of TH8056 depends on the network architecture (number of nodes), the
max. ambient temperature and the needed functionality (using of INH pin).
The following diagram shows the relationship between junction temperature, ambient temperature and
number of nodes, which have to be taken into account for using the SOIC8 version.
UBAT = 26.5V; Ta = 125°C
UBAT = 18V; Ta = 125°C
160
150
UBAT = 26.5V; Ta = 105°C
Junction Temperature
140
UBAT = 18V; Ta = 105°C
130
Save Operating Area
SOIC8 Package
120
UBAT = 26.5V; Ta = 85°C
110
100
90
80
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
Number of Network Nodes
Figure 7 - Save operating area of SOIC8 package
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Enhanced Single Wire CAN Transceiver
3.10 Application Circuitry
VBAT
other loads
[1]
VBAT_ECU
Voltage regulator
VBAT
+5V
ECU connector to
Single Wire CAN Bus
100nF
2.7k
VBAT
INH
9
RxD
CAN controller
100pF
10
47µH
5
12
3
MODE0
CANH
TH8056
1k
100pF
6.49k
4
MODE1
2
TxD
11
LOAD
ESD Protection TPSMA16A or
MMBZ27VCLT1 or
equivalent
1,7,8,14
GND
[1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses)
Figure 8 - Application Circuitry TH8056 KDC A
VBAT
other loads
[1]
VBAT_ECU
Voltage regulator
VBAT
+5V
ECU connector to
Single Wire CAN Bus
100nF
2.7k
VBAT
100pF
CAN controller
5
4
RxD
MODE0
MODE1
TxD
47µH
7
2
CANH
TH8056
1k
100pF
6.49k
3
1
6
LOAD
ESD Protection TPSMA16A or
MMBZ27VCLT1 or
equivalent
8
GND
[1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses)
Figure 9 - Application circuitry TH8056 KDC A8
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Enhanced Single Wire CAN Transceiver
4. Pin Description
TH8056 KDC A
TH8056 KDC A8
GND
1
14
GND
TxD
1
TxD
2
13
N.C.
MODE0
2
MODE0
3
12
CANH
MODE1
3
MODE1
4
11
LOAD
RXD
4
RXD
5
10
VBAT
N.C.
6
9
INH
GND
7
8
GND
TH8056
TH8056
8
GND
7
CANH
6
LOAD
5
VBAT
Pin
TH8056 KDC A
Pin
TH8056 KDC A8
Name
IO-Typ
1
-
GND
P
Ground
2
1
TXD
I
Transmit data from MCU to CAN
3
2
MODE0
I
Operating mode select input 0
4
3
MODE1
I
Operating mode select input 1
5
4
RXD
O
Receive data from CAN to MCU
6
-
N.C.
7
-
GND
P
Ground
8
-
GND
P
Ground
9
-
INH
O
Control Pin for external voltage regulator (high voltage
high side switch)
10
5
VBAT
P
Battery voltage
11
6
LOAD
O
Resistor load (loss of ground low side switch )
12
7
CANH
I/O
Single wire CAN bus pin
13
-
N.C.
14
8
GND
P
Ground
TH8056 – Datasheet
3901008056
Description
Page 18 of 26
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Enhanced Single Wire CAN Transceiver
5. Package Dimensions
5.1 SOIC14
Small Outline Integrated Circiut (SOIC), SOIC 14, 150 mil
A1
B
D
E
e
H
h
L
A
α
ZD
A2
8.56
8.74
3.81
3.99
1.27
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0°
8°
0.51
1.37
1.57
0.337
0.344
0.160
0.167
0.050
0.228
0.244
0.010
0.020
0.016
0.050
0.060
0.068
0°
8°
0.020
0.054
0.062
C
All Dimension in mm, coplanarity < 0.1 mm
min
max
0.10
0.25
0.36
0.45
0.19
0.25
All Dimension in inch, coplanarity < 0.004”
min
max
0.004
0.01
0.014 0.0075
0.018 0.0098
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Page 19 of 26
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Enhanced Single Wire CAN Transceiver
5.2 SOIC8
Small Outline Integrated Circiut (SOIC), SOIC 8, 150 mil
A1
B
D
E
e
H
h
L
A
α
ZD
A2
4.80
4.98
3.81
3.99
1.27
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0°
8°
0.53
1.37
1.57
0.189
0.196
0.150
0.157
0.050
0.016
0.050
0.060
0.068
0°
8°
0.021
0.054
0.062
C
All Dimension in mm, coplanarity < 0.1 mm
min
max
0.10
0.25
0.36
0.46
0.19
0.25
All Dimension in inch, coplanarity < 0.004”
min
max
0.004
0.0098
0.014 0.0075
0.018 0.0098
TH8056 – Datasheet
3901008056
0.2284 0.0099
0.244 0.0198
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6. Tape and Reel Specification
6.1 Tape Specification
max. 10°
max. 10°
IC pocket
R
Top View
n.
mi
Sectional View
T2
P0
D0
T
P2
E
G1
< A0 >
F
K0
W
B0
B1
S1
G2
T1
P1
D1
Cover Tape
Ab i k l i ht
Standard Reel with diameter of 13“
D0
Package
Parts per Reel
Width
Pitch
SOIC14
2500
16 mm
8 mm
SOIC8
2500
12 mm
8 mm
E
P0
P2
Tmax
T1 max
G1 min
G2 min
B1 max
D1 min
F
P1
Rmin
T2 max
W
1.75
±0.1
4.0
±0.1
2.0
±0.1
0.6
0.1
0.75
0.75
12.1
1.5
7.5
±0.1
4 - 12
±0.1
30
8.0
16.0
±0.3
1.75
±0.1
4.0
±0.1
2.0
±0.1
0.6
0.1
0.75
0.75
8.2
1.5
5.5
±0.05
4
±0.1
30
6.5
12.0
±0.3
SOIC14
1.5
+0.1
SOIC8
1.5
+0.1
A0, B0, K0 can be calculated with package specification.
Cover Tape width 13.3 mm.
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Enhanced Single Wire CAN Transceiver
6.2 Reel Specification for SOIC14NB
W2
W1
B*
D*
C
A
N
Amax
B*
C
D*min
330
2.0 ±0.5
13.0 +0,5/-0,2
20.2
Width of half reel
Nmin
W1
W2 max
4 mm
100.0
4.4
7.1
8 mm
100.0
8.4
11.1
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Enhanced Single Wire CAN Transceiver
7. ESD/EMC Remarks
7.1 General Remarks
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
7.2 ESD-Test
The TH8056 is tested according to MIL883D (human body model).
7.3 EMC
The test on EMC impacts is done according to ISO 7637-1 for power supply pins and ISO 7637-3 for dataand signal pins.
Power Supply pin VBAT, CANH, LOAD:
Testpulse
Condition
Duration
1
t1 = 5 s / US = -100 V / tD = 2 ms
5000 pulses
2
t1 = 0.5 s / US = 100 V / tD = 0.05 ms
5000 pulses
3a/b
US = -200 V/ US = 200 V
burst 100ns / 10 ms / 90 ms break
1h
5
Ri = 0.5 Ω, tD = 400 ms
10 pulses every 1min
tr = 0.1 ms / UP+US = 40 V
7.4 Latch Up Test
The TH8056 is tested according to JESD78 (Class 2).
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Enhanced Single Wire CAN Transceiver
8. Revision History
Version
Changes
Remark
001
Initial Release
Date
Sep. 2002
001a -
Added chapter revision history
Error corrected within Figure 1 - Block Diagram
002
-
Pinout corrected within Figure 8 - Application Circuitry
06/13/03
003
-
compatibility to GMW3089 Version 2.2
Static Characteristics modified according to GMW3089 V2.2
Dynamic Characteristics modified according to GMW3089 V2.2
Bus loading requirements modified according to GMW3089 V2.2
High-speed Mode added remark
VBAT input pin description changed
Add Tape and Reel Specification
Change of ESD/EMC Remarks
09/18/03
004
-
Changed application circuitry according to GMW3089 Rev.2.2
12/01/03
005
-
Change of chapter 9. Assembly Information
05/13/04
006
-
Change of Order Code
06/14/04
007
-
Update of chapter “Features” with compatibility to GMW3089
V2.3 and very low leakage current during loss of ground
Update of chapter “Features” high voltage wake up mode
instead of high speed ..
Change of “Static characteristics”
o Supply current dominant
o Transmit delay
Change of “Dynamic characteristics”
o Input min pulse length
o Condition for mode change from normal to standby,
standby to sleep and sleep to normal
Change of application circuitry acc. to GMW3089 V2.3 Spec.
24/06/04
-
-
March
2003
008
-
Change of “Static characteristics”
o Offset Wake-up Output High Voltage
o Mode pull down resistor
31/08/04
009
-
Additional Package Version SOIC8
Additional chapter “Power Dissipation”
15/04/05
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Enhanced Single Wire CAN Transceiver
9. Assembly Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture
sensitivity level, as defined in this specification, according to following test methods:
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
CECC00802
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation (Directive on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has
installed a roadmap to qualify their package families for lead free processes also.
Various lead free generic qualifications are running, current results on request.
For more information on Melexis lead free statement
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
see
quality
page
at
our
website:
10. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2002 Melexis NV. All rights reserved.
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Your notes
For the latest version of this document. Go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan:
Phone: +32 1367 0495
E-mail: [email protected]
All other locations:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS16949 and ISO14001 Certified
TH8056 – Datasheet
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