TH8056 Enhanced Single Wire CAN Transceiver Features Fully compliant to GMW3089 V2.4 and J2411 Single Wire CAN specification for Class B in-vehicle communications Only 60 µA worst case sleep mode current independent from CAN voltage range Operating voltage range 5V to 26.5V Up to 40 kbps bus speed Up to 100 kbps high-speed transmission mode Logic inputs compatible with 3.3V and 5V supply systems Control pin for external voltage regulators Low RFI due to output wave shaping in normal and high voltage wake up mode Fully integrated receiver filter Bus terminals proof against short-circuits and transients in automotive environment Loss of ground protection, very low leakage current (typ. 20µA at 26.5V and 125°C) Protection against load dump, jump start Thermal overload and short circuit protection Under voltage lockout Bus dominant time-out feature Pb-Free 14-pin thermally enhanced and 8-pin SOIC package Ordering Information Part No. Temperature Range Package Revision TH8056 KDC A TH8056 KDC A8 -40 to 125 °C -40 to 125 °C SOIC14 SOIC8 A A General Description The TH8056 is a physical layer device for a single wire data link capable of operating with various CSMA/CR protocols such as the Bosch Controller Area Network (CAN) version 2.0. This serial data link network is intended for use in applications where a high data rate is not required and a lower data rate can achieve cost reductions in both the physical media components and the microprocessor and/or dedicated logic devices that use the network. The network shall be able to operate in either the normal data rate mode or the high-speed data download mode for assembly line and service data transfer operations. The high-speed mode is only intended to be operational when the bus is attached to an off-board service node. This node shall provide temporary bus electrical loads which facilitate higher speed operation. The bit rate for normal communications is typically 33.33kbit/s, for high-speed transmissions as described above a typical bit rate of 83.33kbit/s is recommended. The TH8056 is designed in accordance with the Single Wire CAN Physical Layer Specification GMW3089 V2.4 and supports many additional features like under-voltage lock-out, time-out for faulty blocked input signals, output blanking time in case of bus ringing and a very low sleep mode current. TH8056 – Datasheet 3901008056 Page 1 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver Contents 1. Functional Diagram ....................................................................................................3 2. Electrical Specification ..............................................................................................4 2.1 2.2 2.3 2.4 2.5 2.6 3. Operating Conditions.............................................................................................4 Absolute Maximum Ratings ...................................................................................4 Static Characteristics.............................................................................................5 Dynamic Characteristics........................................................................................7 Bus loading requirements......................................................................................8 Timing Diagrams ...................................................................................................9 Functional Description.............................................................................................11 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 TxD Input pin .......................................................................................................11 Mode 0 and Mode 1 pins .....................................................................................11 RxD Output pin ....................................................................................................12 Bus LOAD pin......................................................................................................12 Vbat INPUT pin....................................................................................................13 CAN BUS pin.......................................................................................................13 INH Pin (TH8056 KDC A8 only)...........................................................................13 State Diagram......................................................................................................14 Power Dissipation................................................................................................15 Application Circuitry.............................................................................................17 4. Pin Description .........................................................................................................18 5. Package Dimensions................................................................................................19 5.1 5.2 6. SOIC14................................................................................................................19 SOIC8..................................................................................................................20 Tape and Reel Specification ....................................................................................21 6.1 6.2 7. Tape Specification ...............................................................................................21 Reel Specification for SOIC14NB ........................................................................22 ESD/EMC Remarks ...................................................................................................23 7.1 7.2 7.3 7.4 General Remarks ................................................................................................23 ESD-Test .............................................................................................................23 EMC ....................................................................................................................23 Latch Up Test ......................................................................................................23 8. Revision History .......................................................................................................24 9. Assembly Information ..............................................................................................25 10. Disclaimer..............................................................................................................26 TH8056 – Datasheet 3901008056 Page 2 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 1. Functional Diagram INH * VBAT TH8056 5V Supply & References Biasing& VBAT Monitor Reverse Current Protection RCOsc Wave Shaping TxD CANH CAN Driver Time Out FeedbackLoop Input Filter MODE0 MODE CONTROL MODE1 LOAD Receive Comparator Loss of Ground Detection Reverse Current Protection Wake up filter RxD RxD Blanking Time Filter GND Figure 1 - Block Diagram * INH terminal is present on TH8056 KDC A only TH8056 – Datasheet 3901008056 Page 3 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 2. Electrical Specification All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings (in accordance with IEC 134) given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device. 2.1 Operating Conditions Parameter Symbol Min Max Unit VBAT 5.0 18 V Operating ambient temperature for TH8056 KDC A TA -40 125 °C Junction temperature TJ -40 150 °C Battery voltage 2.2 Absolute Maximum Ratings Parameter Symbol Supply Voltage VBAT Short-term supply voltage VBAT.ld Transient supply voltage Transient supply voltage Transient supply voltage VBAT.tr1 VBAT..tr2 VBAT..tr3 CANH voltage VCANH Transient bus voltage Transient bus voltage Transient bus voltage DC voltage on pin LOAD VCANH..tr1 VCANH.tr2 VCANH.tr3 VLOAD DC voltage on pins TxD, MODE1, MODE0,RxD, VDC ESD capability of any pin (Human Body Model) ESDHBM Maximum latch – up free current at any Pin Condition ΘJA Storage temperature Junction temperature Tstg Tvj Max Unit -0.3 18 40 26.5 V Load dump; t<500ms Jump start; t<1min ISO 7637/1 pulse 1[1] ISO 7637/1 pulses 2[1] ISO 7637/1 pulses 3A, 3B VBAT <= 26.5V VBAT = 0 ISO 7637/1 pulse 1 [2] ISO 7637/1 pulses 2 [2] ISO 7637/1 pulses 3A, 3B [2] -200 100 200 V V V via RT > 2kΩ -40 40 V -0.3 7 V -2 2 kV -500 500 70 150 150 150 mA Human body model, equivalent to discharge 100pF with 1.5kΩ, ILATCH Thermal impedance [3] Min -50 -200 -20 -40 -50 in free air, SOIC14 in free air, SOIC8 -55 -40 100 200 40 40 V V V V V K/W °C °C [1] ISO 7637 test pulses are applied to VBAT via a reverse polarity diode and >1uF blocking capacitor . ISO 7637 test pulses are applied to CANH via a coupling capacitance of 1 nF. The application board shall be realized with a ground copper foil area >150mm2 (low conductance board in accordance to JEDEC51-7) [2] [3] TH8056 – Datasheet 3901008056 Page 4 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 2.3 Static Characteristics Unless otherwise specified all values in the following tables are valid for VBAT = 5V to 26.5V and TAMB=-40°C to 125oC. All voltages are referenced to ground (GND), positive currents flow into the IC. Parameter Symbol Condition Min Typ Max Unit 6 12 18 V PIN VBAT Operating supply voltage VBAT Low battery operating supply voltage VBAT_L except high-speed/sleep mode 5 6 V Short duration Operating supply voltage VBAT_JS T<1min, Tamb < 85°C (except high-speed mode) 18 26.5 V Under-voltage lock-out VBATuv 4.0 4.8 V Supply current, recessive, all active modes IBAT VBAT = 18V , TxD open 5 8 mA Normal mode supply current, dominant IBATN [2] VBAT = 26.5V MODE0=MODE1=H TxD=L, Rload = 200Ω 30 35 mA High-speed mode supply current, dominant IBATH [2] VBAT = 16V MODE0=H,MODE1=L,TxD=L, Rload = 75Ω 60 75 mA Wake-up mode supply current, dominant IBATW [2] VBAT = 26.5V MODE0=L,MODE1=H, TxD=L, Rload = 200Ω 60 75 mA VBAT =13V, Tamb < 85°C 40 60 µA Sleep mode supply current IBATS PIN CANH Bus output voltage, low battery Voh_l RL > 200Ω, Normal, high-speed mode, 5V < VBAT < 6V 3.4 5.1 V Bus output voltage Voh RL > 200Ω, Normal mode, 6V < VBAT < 26.5V 4.4 5.1 V Bus output voltage, high-speed mode Voh RL > 75Ω, high-speed mode, 8V < VBAT < 16V 4.2 5.1 V Fixed Wake-up Output High Voltage VohWuFix Wake-up mode, RL > 200Ω, 11.2V < VBAT < 26.5V 9.9 12.5 V Offset Wake-up Output High Voltage VohWuOffset Wake-up mode, RL > 200Ω, 5V < VBAT < 11.2V VBAT – 1.5 VBAT V Recessive state or sleep mode, Rload = 6.5 kΩ, -0.2 0.20 V Recessive state output voltage Vol Bus short circuit current -ICAN_SHORT VCANH = 0V, VBAT = 26.5V, TxD = 0V 50 350 mA Bus leakage current during loss of ground ILKN_CAN[1] Loss of ground, VCANH = 0V -50 10 µA TxD high; -10 10 µA Bus leakage current, bus positive ILKP_CAN Bus input threshold Vih Normal, high-speed mode 2.0 2.1 2.2 V Bus input threshold low battery Vihlb Normal mode 5V<VBAT<6V 1.6 1.7 2.2 V VihWuFix[2] Sleep mode, VBAT > 11.2V 6.6 7.9 V VBAT-4.3 VBAT-3.25 V Fixed Wake-up Input High Voltage Threshold Offset Wake-up Input High Voltage Threshold TH8056 – Datasheet 3901008056 VihWuOffset[2] Sleep mode Page 5 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver Parameter Symbol Condition Min Typ Max Unit 0.1 V 1 V RLOAD +35% Ω PIN LOAD ILOAD = 1mA, all active modes and sleep mode Voltage on switched ground pin VLOAD Voltage on switched ground pin VLOAD_LOB ILOAD = 7mA , VBAT = 0V Load resistance during loss of battery RLOAD_LOB VBAT = 0 RLOAD -10% PIN TXD,MODE0,MODE1 High level input voltage Vih Low level input voltage Vil TxD pull-up current MODE pull-down resistor -IIL_TXD 2.0 TxD = L, MODE0 and 1 = H RMODE_pd V 0.65 V 20 50 µA 20 50 kΩ 0.4 V 10 µA 70 mA PIN RXD Low level output voltage Vol_rxd IRxD = 2mA High level output leakage Iih_rxd VRxD = 5V Irxd VRxD = 5V RxD output current -10 PIN INH High level output voltage Voh_INH IINH = -180µA Leakage current IINH_lk Mode0/1 = L ,VINH = 0V VS -0.8V VS-0.5V V -5 5 µA Over-temperature Protection Thermal shutdown Tsd [2] 155 180 °C Thermal recovery Trec [2] 126 150 °C [1] [2] Leakage current in case of loss of ground is the sum of both currents ILKN_CAN and ILKN_LOAD . Thresholds are not tested in production, but characterized and guaranteed by design TH8056 – Datasheet 3901008056 Page 6 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 2.4 Dynamic Characteristics Unless otherwise specified all values in the following table are valid for VBAT = 5V to 26.5V and TAMB= -40°C to 125oC. Parameter Symbol Condition Min Max Unit tTr [1] min and max loads acc. To 2.5 Bus loading requirements 2 6.3 µs tTWUr [2] min and max loads acc. To 2.5 Bus loading requirements 3 18 µs Transmit delay in normal mode, falling edge tTf [3] min and max loads acc. To 2.5 Bus loading requirements 1.8 10 µs Transmit delay in wake-up mode, falling edge tTWU1f [3] min and max loads acc. To 2.5 Bus loading requirements 3 13.7 µs Transmit delay in high-speed mode, rising edge tTHSr [4] min and max loads acc. To 2.5 Bus loading requirements 0.1 1.5 µs Transmit delay in high-speed mode, falling edge tTHSf[5] min and max loads acc. To 2.5 Bus loading requirements 0.04 3 µs Receive delay , all active modes tDR [6] CANH high to low transition 0.2 1 µs Receive delay , all active modes tRD [6] CANH low to high transition 0.2 1 µs Input minimum pulse length, all active modes tmpDR [6] CANH high to low transition 0.1 1 µs Input minimum pulse length, all active modes tmpRD [6] CANH low to high transition 0.1 1 µs tWUF See diagrams, Figure 3 10 70 µs Receive blanking time after TxD L-H transition trb See diagrams, Figure 4 0.5 6 µs TxD time-out reaction time ttout All active modes 10 30 ms Delay from Normal to High-speed/HVWU Mode tdnhs 30 ms Delay from High-speed /HVWU to Normal Mode tdhsn 30 ms Delay from Normal Mode to Standby tdsby VBAT = 6V to 26.5V 500 µs Delay from Standby to Sleep Mode tdsleep VBAT = 6V to 26.5V 500 ms Delay from Sleep to normal Mode tdsnwu VBAT = 6V to 26.5V 50 ms Transmit delay in normal and wake-up mode, rising edge Transmit delay in wake-up mode to VihWU, rising edge Wake-up filter time delay TH8056 – Datasheet 3901008056 Page 7 of 26 100 Typ March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver [1] The maximum signal delay time for a bus rising edge is measured from Vcmos il on the TxD input pin to the VihMax + V g off max level on CANH at maximum network time constant , minimum signal delay time for a bus rising edge is measured from Vcmos ih on the TxD input pin to 1V on CANH at minimum network time constant .These definitions are valid in both normal and HVWU mode [2] The maximum signal delay time for a bus rising edge in HVWU mode is measured from Vcmos il on the TxD input pin to the VihWUMax + V g off max level on CANH at maximum network time constant, minimum signal delay time for a bus rising edge is measured from Vcmos ih on the TxD input pin to 1V on CANH at minimum network time constant [3] Maximum signal delay time for a bus falling edge is measured from V cmos ih on the TxD input pin to 1V on CANH at maximum network time constant, minimum signal delay time for a bus falling edge is measured from V cmos ih on the TxD input pin to the VihMax + V g off max level on CANH. These definitions are valid in both normal and HVWU mode. [4] The signal delay time in high-speed mode for a bus rising edge is measured from Vcmos il on the TxD input pin to the VihMax + V g max level on CANH at maximum high-speed network time constant. off [5] The signal delay time in high-speed mode for a bus falling edge is measured from Vcmos ih on the TxD input pin to 1V on CANH at maximum high-speed network time constant [6] Receive delay time is measured from the rising / falling edge crossing of the nominal Vih value on CANH to the falling (Vcmos_il_max) / rising (Vcmos_ih_min) edge of RxD. This parameter is tested by applying a square wave signal to CANH. The minimum slew rate for the bus rising and falling edges is 50V/us. The low level on bus is always 0V. For normal mode and high-speed mode testing the high level on bus is 4V. For HVWU mode testing the high level on bus is Vbat – 2V. 2.5 Bus loading requirements Parameter Symbol Min Number of system nodes Typ 2 Network distance between any two ECU nodes Max Unit 32 Bus length 60 M Node Series Inductor Resistance (if required) Rind 3.5 Ohm Ground Offset Voltage Vgoff 1.3 V Ground Offset Voltage, low battery Vgofflb 0.1 VBAT 0.6 V 150 300 pF 19000 pF 6665 Ohm Device Capacitance (unit load) Cul 135 Network Total Capacitance Ctl 396 Device Resistance (unit load) Rul 6435 Device Resistance (min load) Rmin 2000 Network Total Resistance Rtl 200 3332 Ohm Rload 75 135 Ohm Network Time Constant [1] τ 1 4 µs Network Time Constant, high-speed mode [1] τ 1.5 µs High-Speed Mode Network Resistance to GND 6490 Ohm [1] The network time constant incorporates the bus wiring capacitance. The minimum value is selected to limit radiated emissions. The maximum value is selected to ensure proper communication under all communication modes. Not all combinations of R and C are possible. The following load conditions are used for the measurement of the dynamic characteristics: Normal and high volt. Wake-up mode min.load/min tau 3.3KΩ/ 540pF min.load/max tau 3.3KΩ/ 1.2nF max.load/min tau 200Ω/ 5nF max.load/max tau 200Ω/ 20nF TH8056 – Datasheet 3901008056 High-speed mode Additional 140Ω tool resistance to ground in parallel Additional 120Ω tool resistance to ground in parallel Page 8 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 2.6 Timing Diagrams VTxD 50% t tT VCANH Vih max + Vgoff max 1V t tR tF tD tDR VRxD 50% t Figure 2 – Input / Output Timing TH8056 – Datasheet 3901008056 Page 9 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver VCANH Vih+Vgoff t tWu tWU tWuF VRxD tWU < tWuF wake up interrupt t Figure 3 – Wake-up Filter Time Delay VTxD 50% t VCANH Vih t VRxD 50% t trb Figure 4 – Receive Blanking Time TH8056 – Datasheet 3901008056 Page 10 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 3. Functional Description 3.1 TxD Input pin Logic command to transmit on the single wire CAN bus TxD Polarity TxD = logic 1 (or floating) on this pin produces an undriven or recessive bus state (low bus voltage) TxD = logic 0 on this pin produces either a bus normal or a bus high-voltage dominant state depending on the transceiver mode state (high bus voltage) If the TxD pin is driven to a logic low state while Mode 0,1 pins are in the 0,0 or sleep state, the transceiver cannot drive the CAN Bus pin to the dominant state. The transceiver provides an internal pull up on the TxD pin, which will cause the transmitter to default to the bus recessive state, when TxD is not driven. TxD input signals are standard CMOS logic levels for 3.3V and 5V supply voltages. Time-out feature In case of a faulty blocked dominant TxD input signal the CANH output is switched off automatically after the specified TxD time-out reaction time to prevent a dominant bus. The transmission is continued by next TxD L to H transition without delay. 3.2 Mode 0 and Mode 1 pins Select transceiver operating modes The transceiver provides a weak internal pull-down current on each of these pins, which causes the transceiver to default to sleep mode when they are not driven. The Mode input signals are standard CMOS logic level for 3.3V and 5V supply voltages. M0 M1 Mode L L Sleep Mode H L High-Speed L H High-Voltage Wake-Up H H Normal Mode Figure 5 – Truth Table Mode 0 = 0, Mode 1 = 0 – Sleep mode Transceiver is in low-power state, waiting for wake-up via high-voltage signal or by mode pins change to any state other than 0,0. In this state, the CAN Bus pin is not in the dominant state regardless of the state of the TxD pin. Mode 0 = 1, Mode 1 = 0 – High-Speed mode This mode allows high-speed download with bitrates up to 100Kbit/s. The output waveshaping circuit is disabled in this mode. Bus transmitters which require communicating in high-speed mode are able to drive reduced bus resistance during this mode. Note: High-speed mode is only allowed with connected tool resistance in parallel to the network load. Otherwise the stability of the output signal is not guaranteed because of the slew rate enhancement for the required rise times . TH8056 – Datasheet 3901008056 Page 11 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver Mode 0 = 0, Mode 1 = 1 – Transmit with high voltage signals to wake up remote nodes (HVWU) This bus includes a selective node awake capability, which allows normal communication to take place among some nodes while leaving the other nodes in an undisturbed sleep state. This is accomplished by controlling the signal voltages such that all nodes must wake up when they receive a higher voltage message signal waveform. The communication system communicates to the nodes information as to which nodes are to stay operational (awake) and which nodes are to put themselves into a non-communicating low-power “sleep” state. Communication at the lower, normal voltage levels does not disturb the sleeping nodes. Mode 0 = 1, Mode 1 = 1 – Normal speed and signal voltage mode Transmission bit rate in normal communication is 33.333 Kbits/sec. In normal transmission mode the TH8056 supports controlled waveform rise and overshoot times. Waveform trailing edge control is required to assure that high frequency components are minimized at the beginning of the downward voltage slope. The remaining fall time occurs after the bus is inactive with drivers off and is determined by the RC time constant of the total bus load. 3.3 RxD Output pin Logic data as sensed on the single wire CAN bus RxD polarity RxD = logic 1 on this pin indicates a bus recessive state (low bus voltage) RxD = logic 0 on this pin indicates a bus normal or high-voltage bus dominant state RxD in Sleep Mode RxD does not pass signals to the micro processor while in sleep mode until a valid wake-up bus voltage level is received or the Mode 0, 1 pins are not 0,0 respectively. When the valid wake-up bus signal awakens the transceiver, the RxD pin signalizes an interrupt (logic 0 for dominant high-voltage signal). If there is no mode change within the time stated, the transceiver reenters the sleep mode as described in 3.7 When not in sleep mode all valid bus signals will be sent out on the RxD pin. RxD Typical Load Resistance: 2.7 kohms Capacitance: < 25 pF 3.4 Bus LOAD pin Resistor ground with internal open-on-loss-of-ground protection When the ECU experiences a loss of ground condition, this pin is switched to a high impedance state. The ground connection through this pin is not interrupted in any transceiver operating mode including the sleep mode. The ground connection is interrupted only when there is a valid loss of ground condition. This pin provides the bus load resistor with a path to ground which contributes less than 0.1 volts to the bus offset voltage when sinking the maximum current through one unit load resistor. The transceiver’s maximum bus leakage current contribution to Vol from the LOAD pin when in a loss of ground state is 50 uA over all operating temperatures and 3.5 V < Vbatt < 26.5V. TH8056 – Datasheet 3901008056 Page 12 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 3.5 Vbat INPUT pin Vehicle Battery Voltage The transceiver is fully operational as described in chapter 2 over the range 6V<Vbat IC<18V as measured between the GND pin and this pin. For 5V < Vbat IC < 6V the bus operates in normal mode with reduced dominant output voltage and reduced receiver input voltage. High voltage wake-up call is not possible (dominant output voltage is the same as in normal or high-speed mode). The transceiver operates in normal mode and high-voltage wake-up mode if 18V < Vbat IC < 26.5V at 85°C for one minute. For 0V< Vbat IC < 4.8V, the bus is passive (not driven dominantly) and RxD is undriven (high), regardless of the state of the TxD pin (under-voltage lock-out). 3.6 CAN BUS pin Bus Input/Output Wave Shaping in normal and HVWU mode Wave shaping is incorporated into the transmitter to minimize EMI radiated emissions. An important contributor to emissions is the rise and fall times during output transitions at the “corners” of the voltage waveform. The resultant waveform is one half of a sine wave of frequency 50 – 65 kHz at the rising waveform edge and one quarter of this sine wave at falling or trailing edge. Short circuits If the CAN BUS pin is shorted to ground for any duration of time, the current is limited to the specified value, until an over-temperature shut-down circuit disables the output high side drive source transistor (before the local die temperature exceeds the damage limit threshold). Loss of ground In case of an ECU loss of ground condition, the LOAD pin is switched into high impedance state. The CANH transmission is continued until the under-voltage lock-out voltage threshold is detected. Loss of battery In case of battery loss (VBAT = 0 or open) the transceiver does not disturb bus communication. The maximum reverse current into power supply system doesn’t exceed 500µA. 3.7 INH Pin (TH8056 KDC A only) This Pin is a high-voltage highside switch used to control the ECU’s regulated microcontroller voltage supply. After power-on the transceiver automatically enters an intermediate standby mode, the INH output will become HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply for the ECU . If there is no mode change within the time stated, the transceiver reenters the sleep mode and the INH output goes to logic 0 (floating). When the transceiver has detected a valid wake-up condition (bus HVWU traffic which exceeds the wake-up filter time delay) the INH output will become HIGH (VBAT) again and the same procedure starts as described after power-on. In case of a mode change into any active mode the sleep timer is stopped and INH keeps high (VBAT) level. If the transceiver enters the sleep mode (M0,1=0), INH goes to logic 0 (floating) no sooner than 100ms when no wake-up signal is present. TH8056 – Datasheet 3901008056 Page 13 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 3.8 State Diagram HVWU Mode M0 M1 INH low high VBAT M0/1 =>High High Speed Mode M0&1=>Low M0 M1 INH high low VBAT VBATon Normal Mode M0 M1 INH high high VBAT M0/1 =>High (if VCC_ECU on) VBAT standby M0/1 INH RxD CAN after min. 100ms -> no mode change -> no valid wake up low VS high / float. low[1] wake up request from Bus Sleep Mode [1] M0/1 INH/CAN low floating low after HVWU, high after VBAT on & VCCECU present Figure 6 – State Diagram TH8056 – Datasheet 3901008056 Page 14 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 3.9 Power Dissipation The TH8056 has an integrated protection against thermal overload. If the junction temperature reaches the thermal shutdown threshold the TH8056 disables the transmitter driver to reduce the power dissipation to protect the IC itself from thermal overload. The function of the transceiver will become again available if the junction temperate drops below the thermal recovery temperature. To secure a stable functioning within the application and to avoid a transmitter switch off due to thermal overload under normal operating conditions, the application must take care of the maximum power dissipation of the IC. The junction temperature can be calculated with: TJ = Ta + Pd * θja TJ Junction temperature Ta Ambient temperature Pd Dissipated power θja Thermal resistance The Junction temperature shouldn’t exceed under normal operating conditions the limit specified in chapter 2.3 Static Characteristics. The power dissipation of an IC is the major factor determining the junction temperature. The TH8056 consumes current in different functions. A part of the supply current goes to the load and the other part dissipates internally. The internal part has a constant passive part and an active part which depends on the actual bus transmission. The complete internal part causes and increasing of the junction temperature. Ptot = PINT_a + PINT_P PINT_a Internal power dissipation active PINT_p Internal power dissipation passive Ptot Overall power dissipation D Duty cycle for data transmission The internal passive part can be calculated with the operating voltage and the normal mode supply current recessive. The active part can be calculated with the voltage drop of the driving transistor and the current of the CAN bus. The active part generates only during data transmission power dissipation. Therefore the duty cycle has to be taken into account. PINT_p = VBAT * IBAT PINT_a = (VBAT – VCANH) * Iload * D VBAT Battery supply voltage IBAT Normal mode supply current recessive Can network current Iload D Duty cycle for data transmission VCANH Voltage at CANH pin The power dissipation of the load can be calculated with the CANH voltage and the CAN bus current. where Pload = VCANH * Iload * D Iload = VCANH / Rload_net Pload Power dissipation of the load resistor Current of CAN network Iload VCANH Voltage at CANH pin Rload_net Network total resistance TH8056 – Datasheet 3901008056 Page 15 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver Assumptions: VBAT = 26.5V Rload = 6.49 kΩ Network with 32 nodes VCANH = 5.1V IBAT = 6mA D = 50% Ta = 125°C ΘJA = 70k/W (Thermally enhanced SOIC14 package) Computations: Rload_net = 6.49kΩ / 32nodes = 203Ω Iload = 5.1V / 203Ω = 25mA Pload = 5.1V * 25mA * 0.5 = 64mW PINT_a = (26.5V – 5.1V) * 25mA * 0.5 = 267mW PINT_P = 26.5V * 6mA = 159mW Ptot = 267mW + 159mW = 426mW Tj = 125°C + 426mW * 70k/W = 155°C The above calculation shows that under worst case conditions (max. operating voltage, max bus load, max ambient temperature) the TH8056 with the thermally enhanced SOIC14 package operates below the thermal limit. A stable functioning is possible up to these limits. 3.9.1. Thermal behaviour of TH8056 with SOIC8 – TH8056 KDC A8 The thermal impedance of an SOIC8 package is about twice in comparison to the thermally enhanced SOIC14 package. Therefore the maximum power dissipation within this package is only about the half. The using of the SOIC8 version of TH8056 depends on the network architecture (number of nodes), the max. ambient temperature and the needed functionality (using of INH pin). The following diagram shows the relationship between junction temperature, ambient temperature and number of nodes, which have to be taken into account for using the SOIC8 version. UBAT = 26.5V; Ta = 125°C 160 UBAT = 18V; Ta = 125°C 150 UBAT = 26.5V; Ta = 105°C Junction Temperature 140 UBAT = 18V; Ta = 105°C 130 Save Operating Area SOIC8 Package 120 UBAT = 26.5V; Ta = 85°C 110 100 90 80 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 Number of Network Nodes Figure 7 – Save operating area of SOIC8 package TH8056 – Datasheet 3901008056 Page 16 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 3.10 Application Circuitry other loads [1] VBAT VBAT_ECU Voltage regulator VBAT +5V ECU connector to Single Wire CAN Bus 100nF 2.7k VBAT INH 9 RxD CAN controller 100pF 10 47µH 5 12 3 MODE0 CANH 1k TH8056 100pF 6.49k 4 MODE1 2 TxD 11 LOAD ESD Protection TPSMA16A or MMBZ27VCLT1 or equivalent 1,7,8,14 GND [1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses) Figure 8 – Application Circuitry TH8056 KDC A other loads [1] VBAT VBAT_ECU Voltage regulator VBAT +5V ECU connector to Single Wire CAN Bus 100nF 2.7k VBAT 100pF CAN controller 5 4 RxD MODE0 MODE1 TxD 47µH 7 2 CANH 1k TH8056 100pF 6.49k 3 1 6 LOAD ESD Protection TPSMA16A or MMBZ27VCLT1 or equivalent 8 GND [1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses) Figure 9 – Application circuitry TH8056 KDC A8 TH8056 – Datasheet 3901008056 Page 17 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 4. Pin Description TH8056 KDC A TH8056 KDC A8 GND 1 14 GND TxD 1 TxD 2 13 N.C. MODE0 2 12 CANH MODE1 3 11 LOAD RXD 4 5 10 VBAT N.C. 6 9 INH GND 7 8 GND MODE0 3 MODE1 4 RXD TH8056 TH8056 8 GND 7 CANH 6 LOAD 5 VBAT Pin TH8056 KDC A Pin TH8056 KDC A8 Name IO-Typ 1 - GND P Ground 2 1 TXD I Transmit data from MCU to CAN 3 2 MODE0 I Operating mode select input 0 4 3 MODE1 I Operating mode select input 1 5 4 RXD O Receive data from CAN to MCU 6 - N.C. 7 - GND P Ground 8 - GND P Ground 9 - INH O Control Pin for external voltage regulator (high voltage high side switch) 10 5 VBAT P Battery voltage 11 6 LOAD O Resistor load (loss of ground low side switch ) 12 7 CANH I/O Single wire CAN bus pin 13 - N.C. 14 8 GND P Ground TH8056 – Datasheet 3901008056 Description Page 18 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 5. Package Dimensions 5.1 SOIC14 Small Outline Integrated Circiut (SOIC), SOIC 14, 150 mil A1 B D E e H h L A α ZD A2 8.56 8.74 3.81 3.99 1.27 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0° 8° 0.51 1.37 1.57 0.337 0.344 0.160 0.167 0.050 0.228 0.244 0.010 0.020 0.016 0.050 0.060 0.068 0° 8° 0.020 0.054 0.062 C All Dimension in mm, coplanarity < 0.1 mm min max 0.10 0.25 0.36 0.45 0.19 0.25 All Dimension in inch, coplanarity < 0.004” min max 0.004 0.01 0.014 0.0075 0.018 0.0098 TH8056 – Datasheet 3901008056 Page 19 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 5.2 SOIC8 Small Outline Integrated Circiut (SOIC), SOIC 8, 150 mil A1 B D E e H h L A α ZD A2 4.80 4.98 3.81 3.99 1.27 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0° 8° 0.53 1.37 1.57 0.189 0.196 0.150 0.157 0.050 0.016 0.050 0.060 0.068 0° 8° 0.021 0.054 0.062 C All Dimension in mm, coplanarity < 0.1 mm min max 0.10 0.25 0.36 0.46 0.19 0.25 All Dimension in inch, coplanarity < 0.004” min max 0.004 0.0098 0.014 0.0075 0.018 0.0098 TH8056 – Datasheet 3901008056 0.2284 0.0099 0.244 0.0198 Page 20 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 6. Tape and Reel Specification 6.1 Tape Specification max. 10° max. 10° IC pocket R Top View n. mi Sectional View T2 P0 D0 P2 T E G1 < A0 > F K0 W B0 B1 S1 G2 P1 D1 T1 Cover Tape Ab i k l i ht Standard Reel with diameter of 13“ D0 Package Parts per Reel Width Pitch SOIC14 2500 16 mm 8 mm SOIC8 2500 12 mm 8 mm E P0 P2 Tmax T1 max G1 min G2 min B1 max D1 min F P1 Rmin T2 max W 1.75 ±0.1 4.0 ±0.1 2.0 ±0.1 0.6 0.1 0.75 0.75 12.1 1.5 7.5 ±0.1 4 – 12 ±0.1 30 8.0 16.0 ±0.3 1.75 ±0.1 4.0 ±0.1 2.0 ±0.1 0.6 0.1 0.75 0.75 8.2 1.5 5.5 ±0.05 4 ±0.1 30 6.5 12.0 ±0.3 SOIC14 1.5 +0.1 SOIC8 1.5 +0.1 A0, B0, K0 can be calculated with package specification. Cover Tape width 13.3 mm. TH8056 – Datasheet 3901008056 Page 21 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 6.2 Reel Specification for SOIC14NB W2 W1 B* D* C A N Amax B* C D*min 330 2.0 ±0.5 13.0 +0,5/-0,2 20.2 Width of half reel Nmin W1 W2 max 4 mm 100.0 4.4 7.1 8 mm 100.0 8.4 11.1 TH8056 – Datasheet 3901008056 Page 22 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 7. ESD/EMC Remarks 7.1 General Remarks Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 7.2 ESD-Test The TH8056 is tested according to MIL883D (human body model). 7.3 EMC The test on EMC impacts is done according to ISO 7637-1 for power supply pins and ISO 7637-3 for dataand signal pins. Power Supply pin VBAT, CANH, LOAD: Testpulse Condition Duration 1 t1 = 5 s / US = -100 V / tD = 2 ms 5000 pulses 2 t1 = 0.5 s / US = 100 V / tD = 0.05 ms 5000 pulses 3a/b US = -200 V/ US = 200 V burst 100ns / 10 ms / 90 ms break 1h 5 Ri = 0.5 Ω, tD = 400 ms 10 pulses every 1min tr = 0.1 ms / UP+US = 40 V 7.4 Latch Up Test The TH8056 is tested according to JESD78 (Class 2). TH8056 – Datasheet 3901008056 Page 23 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 8. Revision History Version Changes 001 001a 002 003 004 005 006 007 - 008 009 010 011 012 - - Remark Initial Release Added chapter revision history Error corrected within Figure 1 - Block Diagram Pinout corrected within Figure 8 – Application Circuitry compatibility to GMW3089 Version 2.2 Static Characteristics modified according to GMW3089 V2.2 Dynamic Characteristics modified according to GMW3089 V2.2 Bus loading requirements modified according to GMW3089 V2.2 High-speed Mode added remark VBAT input pin description changed Add Tape and Reel Specification Change of ESD/EMC Remarks Changed application circuitry according to GMW3089 Rev.2.2 Change of chapter 9. Assembly Information Change of Order Code Update of chapter “Features” with compatibility to GMW3089 V2.3 and very low leakage current during loss of ground Update of chapter “Features” high voltage wake up mode instead of high speed .. Change of “Static characteristics” o Supply current dominant o Transmit delay Change of “Dynamic characteristics” o Input min pulse length o Condition for mode change from normal to standby, standby to sleep and sleep to normal Change of application circuitry acc. To GMW3089 V2.3 Spec. Change of “Static characteristics” o Offset Wake-up Output High Voltage o Mode pull down resistor Additional Package Version SOIC8 Additional chapter “Power Dissipation” Adaption of sleep mode condition acc. To GMW3089 Rev. 2.4 Change of ESD capability of CANH pin Update of Assembly information Change of Parameter “Input minumum pulse length at CANH” Change of “Short duration operating supply voltage” Change of “Receive Delay” Change of “Low level input voltage” at TxD, Mode 0,1 Change of load pin definition to be compliant to GMW3089 2.4 TH8056 – Datasheet 3901008056 Page 24 of 26 Date Sep. 2002 March 2003 06/13/03 09/18/03 12/01/03 05/13/04 06/14/04 24/06/04 31/08/04 15/04/05 21/03/06 08/12/06 07/03/07 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 9. Assembly Information Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of the Use of Certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality_leadfree.asp TH8056 – Datasheet 3901008056 Page 25 of 26 March 2007 Rev 012 TH8056 Enhanced Single Wire CAN Transceiver 10. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2002 Melexis NV. All rights reserved. For the latest version of this document. Go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe and Japan: Phone: +32 1367 0495 E-mail: [email protected] All other locations: Phone: +1 603 223 2362 E-mail: [email protected] ISO/TS16949 and ISO14001 Certified TH8056 – Datasheet 3901008056 Page 26 of 26 March 2007 Rev 012