PCF8564A Real time clock and calendar Rev. 3 — 26 August 2013 Product data sheet 1. General description The PCF8564A is a CMOS1 real-time clock and calendar optimized for low power consumption. A programmable clock output, interrupt output and voltage low detector are also provided. All addresses and data are transferred serially via the two-line bidirectional I2C-bus. Maximum bus speed is 400 kbit/s. The built-in word address register is incremented automatically after each written or read data byte. 2. Features and benefits Provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal Wide clock operating voltage: 1.0 V to 5.5 V Low back-up current typical 250 nA at 3.0 V and 25 C 400 kHz two-wire I2C interface (1.8 V to 5.5 V) Low-voltage detector Alarm and timer functions Two integrated oscillator capacitors Programmable clock output for peripheral devices (32.768 kHz, 1.024 kHz, 32 Hz, and 1 Hz) Internal Power-On Reset (POR) I2C slave address: read A3h, write A2h 3. Applications Timing devices Time of the day tracking Process timing Alarm Portable instruments Electronic metering Battery powered products 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20. PCF8564A NXP Semiconductors Real time clock and calendar 4. Ordering information Table 1. Ordering information Type number Package Name Description Version PCF8564AU bare die wire bond die; 9 bonding pads PCF8564AU PCF8564AUG bare die 9 bumps PCF8564AUG 4.1 Ordering options Table 2. Ordering options Product type number Sales item (12NC) Orderable part number PCF8564AU/10AB/1 935289478005 PCF8564AU/10AB/1,0 1 wafer, sawn, on FFC PCF8564AU/5BB/1 935289319015 PCF8564AU/5BB/1,01 1 unsawn wafer PCF8564AU/5GB/1 935289477015 PCF8564AU/5GB/1,01 1 unsawn wafer PCF8564AU/5GC/1 935293569015 PCF8564AU/5GC/1,01 1 unsawn wafer PCF8564AUG/12HB/1 935301011005 PCF8564AUG/12HB/1V 1 wafer, sawn, on 8 inch metal FFC; chips with soft bumps[1] [1] IC revision Delivery form Bump hardness, see Table 36. 5. Marking Table 3. PCF8564A Product data sheet Marking codes Type number Marking code PCF8564AU PC8564A-1 PCF8564AUG PC8564A-1 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 2 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 6. Block diagram &/.2( 26&, 26&,//$725 N+] ',9,'(5 &/.287 &/2&.287 26&2 &21752/ 021,725 K &RQWUROB K &RQWUROB 'K &/.287BFWUO 32:(521 5(6(7 7,0( 9'' 966 :$7&+ '2* K 6HFRQGV K 0LQXWHV K +RXUV K 'D\V K :HHNGD\V K 0RQWKV K <HDUV $/$50)81&7,21 K 0LQXWHBDODUP $K +RXUBDODUP 6'$ ,& %K 'D\BDODUP 6&/ ,17(5)$&( &K :HHNGD\BDODUP ,17 ,17(55837 7,0(5)81&7,21 3&)$ (K 7LPHUBFWUO )K 7LPHU DDK Fig 1. Block diagram of PCF8564A PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 3 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 7. Pinning information 7.1 Pinning 26&, &/.2( 26&2 9'' &/.287 6&/ 6'$ \ ,17 966 [ 3&)$ DDD Viewed from active side. For mechanical details, see Figure 27 and Figure 28. Fig 2. Pinning diagram of PCF8564A 7.2 Pin description Table 4. Pin description Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified. Symbol Pin Description OSCI 1 oscillator input OSCO 2 oscillator output INT 3 interrupt output, open-drain, active LOW VSS 4 ground[1] SDA 5 serial data input and output SCL 6 serial clock input CLKOUT 7 clock output, push-pull VDD 8 supply voltage CLKOE 9 CLKOUT enable input [1] PCF8564A Product data sheet The substrate (rear side of the die) is at VSS potential and must not be connected. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 4 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8. Functional description The PCF8564A contains sixteen 8-bit registers with an auto-incrementing address register, an on-chip 32.768 kHz oscillator with integrated capacitors, a frequency divider which provides the source clock for the RTC, a programmable clock output, a timer, a voltage low detector, and a 400 kHz I2C-bus interface. All sixteen registers (see Table 5) are designed as addressable 8-bit parallel registers although not all bits are implemented. The first two registers (memory address 00h and 01h) are used as control and/or status registers. The addresses 02h through 08h are used as counters for the clock function (seconds up to years counters). Address locations 09h through 0Ch contain alarm registers which define the conditions for an alarm. Address 0Dh controls the CLKOUT output frequency. 0Eh and 0Fh are the timer control and timer registers, respectively. The seconds, minutes, hours, days, months, years, as well as the minute alarm, hour alarm, and day alarm registers are all coded in BCD format. 8.1 CLKOUT output A programmable square wave is available at the CLKOUT pin. Frequencies of 32.768 kHz, 1.024 kHz, 32 Hz and 1 Hz can be generated for use as a system clock, microcontroller clock, input to a charge pump, or for calibration of the oscillator. CLKOUT is a CMOS push-pull output, and if disabled it becomes logic 0. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 5 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.2 Register organization Table 5. Register overview Bit positions labelled as - are not implemented. Bit positions labelled as N should always be written with logic 0. After reset, all registers are set according to Table 28. Address Register name Bit 7 6 5 4 3 2 1 0 Control registers 00h Control_1 TEST1 N STOP N TESTC N N N 01h Control_2 N N N TI_TP AF TF AIE TIE - WEEKDAYS Time and date registers 02h Seconds VL SECONDS (0 to 59) 03h Minutes - MINUTES (0 to 59) 04h Hours - - HOURS (0 to 23) 05h Days - - DAYS (1 to 31) 06h Weekdays - - - - 07h Months C - - MONTH (1 to 12) 08h Years YEARS (0 to 99) Alarm registers 09h Minute_alarm AEN_M MINUTE_ALARM (0 to 59) 0Ah Hour_alarm AEN_H - HOUR_ALARM (0 to 23) 0Bh Day_alarm AEN_D - DAY_ALARM (1 to 31) 0Ch Weekday_alarm AEN_W - - - - WEEKDAY_ALARM FE - - - - - FD[1:0] - - - - - TD[1:0] CLKOUT control register 0Dh CLKOUT_ctrl Timer registers 0Eh Timer_ctrl TE 0Fh Timer TV[7:0] PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 6 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.3 Control registers 8.3.1 Register Control_1 Table 6. Bit 7 Control_1 - control and status register 1 (address 00h) bit description Symbol Value Description Reference TEST1 0[1] normal mode; Section 8.9 1 EXT_CLK test mode (see Section 8.9) N 0[2] default value STOP 0[1] RTC source clock runs • 6 5 1 4 N 0[2] 3 TESTC 0 • • N Section 8.10 RTC divider chain flip-flops are asynchronously set to logic 0 the RTC clock is stopped (CLKOUT at 32.768 kHz is still available) default value Power-On Reset (POR) override facility is disabled; • 2 to 0 must be set to logic 0 during normal operations Section 8.11.1 set to logic 0 for normal operation (see Section 8.11.1) 1[1] Power-On Reset (POR) override is enabled 000[2] default value [1] Default value. [2] Bits labeled as N should always be written with logic 0. 8.3.2 Register Control_2 Table 7. Bit Control_2 - control and status register 2 (address 01h) bit description Symbol Value Description 7 to 5 N 000[1] default value 4 TI_TP 0[2] INT is active when TF is active (subject to the status of TIE) 1 INT pulses active according to Table 8 (subject to the status of TIE); • 3 AF 2 TF 1 AIE 0 TIE Reference Remark: note that if AF and AIE are active then INT will be permanently active 0[2] alarm flag inactive 1 alarm flag active 0[2] timer flag inactive 1 timer flag active 0[2] alarm interrupt disabled 1 alarm interrupt enabled 0[2] timer interrupt disabled 1 timer interrupt enabled [1] Bits labeled as N should always be written with logic 0. [2] Default value. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 Section 8.3.2.1 and Section 8.8 Section 8.3.2.1 Section 8.3.2.1 Section 8.3.2.1 Section 8.3.2.1 © NXP B.V. 2013. All rights reserved. 7 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.3.2.1 Interrupt output Bits TF and AF: When an alarm occurs, AF is set to 1. Similarly, at the end of a timer countdown, TF is set to 1. These bits maintain their value until overwritten by command. If both timer and alarm interrupts are required in the application, the source of the interrupt can be determined by reading these bits. To prevent one flag being overwritten while clearing another, a logic AND is performed during a write access. 7,B73 7( WRLQWHUIDFH UHDG7) 7)7,0(5 &2817'2:1&2817(5 7,( HJ$,( 6(7 &/($5 38/6( *(1(5$725 75,**(5 &/($5 ,17 IURPLQWHUIDFH FOHDU7) VHWDODUP IODJ$) WRLQWHUIDFH UHDG$) $)$/$50 )/$* 6(7 $,( &/($5 IURPLQWHUIDFH FOHDU$) DDD When bits TIE and AIE are disabled, pin INT will remain high-impedance. Fig 3. Interrupt scheme Bits TIE and AIE: These bits activate or deactivate the generation of an interrupt when TF or AF is asserted respectively. The interrupt is the logical OR of these two conditions when both AIE and TIE are set. Countdown timer interrupts: The pulse generator for the countdown timer interrupt uses an internal clock and is dependent on the selected source clock for the countdown timer and on the countdown value TV. As a consequence, the width of the interrupt pulse varies (see Table 8). Table 8. INT operation (bit TI_TP = 1)[1] Source clock (Hz) PCF8564A Product data sheet INT period (s) TV = 1[2] TV > 1 4096 1⁄ 8192 1⁄ 4096 64 1⁄ 128 1⁄ 64 1 1⁄ 64 1⁄ 64 1⁄ 60 1⁄ 64 1⁄ 64 [1] TF and INT become active simultaneously. [2] TV = loaded countdown value. Timer is stopped when TV = 0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 8 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.4 Time and date registers The majority of the registers are coded in the BCD format to simplify application use. 8.4.1 Register Seconds Table 9. Seconds - seconds and clock integrity status register (address 02h) bit description Bit Symbol Value Place value Description 7 VL 0 - clock integrity is guaranteed 1[1] - integrity of the clock information is not guaranteed 6 to 4 SECONDS 0 to 5 ten’s place actual seconds coded in BCD format, see Table 10 3 to 0 unit place [1] 0 to 9 Start-up value. Table 10. Seconds coded in BCD format Seconds value in decimal Upper-digit (ten’s place) Digit (unit place) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 00 0 0 0 0 0 0 0 01 0 0 0 0 0 0 1 02 0 0 0 0 0 1 0 09 0 0 0 1 0 0 1 10 0 0 1 0 0 0 0 58 1 0 1 1 0 0 0 59 1 0 1 1 0 0 1 : : 8.4.1.1 Voltage low detector and clock monitor The PCF8564A has an on-chip voltage low detector. When VDD drops below Vlow the VL (Voltage Low) flag is set to indicate that the integrity of the clock information is no longer guaranteed. The VL flag can only be cleared by command. PJU 9'' QRUPDOSRZHU RSHUDWLRQ SHULRGRIEDWWHU\ RSHUDWLRQ 9ORZ 9/VHW Fig 4. PCF8564A Product data sheet W Voltage low detection All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 9 of 48 PCF8564A NXP Semiconductors Real time clock and calendar The VL flag is intended to detect the situation when VDD is decreasing slowly, for example under battery operation. Should the oscillator stop or VDD reach Vlow before power is re-asserted, then the VL flag will be set. This indicates that the time is possibly corrupted. 8.4.2 Register Minutes Table 11. Minutes - minutes register (address 03h) bit description Bit Symbol Value Place value Description 7 - - - unused actual minutes coded in BCD format 6 to 4 MINUTES 0 to 5 ten’s place 3 to 0 0 to 9 unit place 8.4.3 Register Hours Table 12. Bit Hours - hours register (address 04h) bit description Value Place value Description 7 to 6 - Symbol - - unused 5 to 4 HOURS 0 to 2 ten’s place actual hours coded in BCD format 3 to 0 0 to 9 unit place 8.4.4 Register Days Table 13. Bit Days - days register (address 05h) bit description Symbol 7 to 6 5 to 4 DAYS[1] 3 to 0 [1] Value Place value Description - - unused 0 to 3 ten’s place actual day coded in BCD format 0 to 9 unit place The PCF8564A compensates for leap years by adding a 29th day to February if the year counter contains a value which is exactly divisible by 4, including the year 00. 8.4.5 Register Weekdays Table 14. Bit PCF8564A Product data sheet Weekdays - weekdays register (address 06h) bit description Symbol Value Description 7 to 3 - - unused 2 to 0 WEEKDAYS 0 to 6 actual weekday values, see Table 15 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 10 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 15. Weekday assignments Day[1] Bit 2 1 0 Sunday 0 0 0 Monday 0 0 1 Tuesday 0 1 0 Wednesday 0 1 1 Thursday 1 0 0 Friday 1 0 1 Saturday 1 1 0 [1] Definition may be re-assigned by the user. 8.4.6 Register Months Table 16. Months - months and century flag register (address 07h) bit description Bit Symbol Value Place value Description 7 C[1] 0[2] - indicates the century is x 1 - indicates the century is x + 1 6 to 5 - - - unused 4 0 to 1 ten’s place actual month coded in BCD format, see Table 17 0 to 9 unit place MONTHS 3 to 0 [1] This bit may be re-assigned by the user. [2] This bit is toggled when the register Years overflows from 99 to 00. Table 17. Month PCF8564A Product data sheet Month assignments coded in BCD format Upper-digit (ten’s place) Digit (unit place) Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 January 0 0 0 0 1 February 0 0 0 1 0 March 0 0 0 1 1 April 0 0 1 0 0 May 0 0 1 0 1 June 0 0 1 1 0 July 0 0 1 1 1 August 0 1 0 0 0 September 0 1 0 0 1 October 1 0 0 0 0 November 1 0 0 0 1 December 1 0 0 1 0 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 11 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.4.7 Register Years Table 18. Bit Years - years register (08h) bit description Symbol Value Place value Description 7 to 4 YEARS 0 to 9 ten’s place 3 to 0 0 to 9 unit place [1] actual year coded in BCD format[1] When the register Years overflows from 99 to 00, the century bit C in the register Months is toggled. The PCF8564A compensates for leap years by adding a 29th day to February if the year counter contains a value which is divisible by 4, including the year 00. 8.5 Setting and reading the time Figure 5 shows the data flow and data dependencies starting from the 1 Hz clock tick. +]WLFN 6(&21'6 0,187(6 +2856 /($3<($5 &$/&8/$7,21 '$<6 :((.'$< 0217+6 <($56 & Fig 5. DDD Data flow for the time function During read/write operations, the time counting circuits (memory locations 02h through 08h) are blocked. This prevents • Faulty writing or reading of the clock and calendar during a carry condition • Incrementing the time registers, during the read cycle After this read/write access is completed, the time circuit is released again and any pending request to increment the time counters, that occurred during the read access, is serviced. A maximum of 1 request can be stored; therefore, all accesses must be completed within 1 second (see Figure 6). PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 12 of 48 PCF8564A NXP Semiconductors Real time clock and calendar WV 6/$9($''5(66 67$57 '$7$ '$7$ 6723 DDD Fig 6. Access time for read/write operations As a consequence of this method, it is very important to make a read or write access in one go, that is, setting or reading seconds through to years should be made in one single access. Failing to comply with this method could result in the time becoming corrupted. As an example, if the time (seconds through to hours) is set in one access and then in a second access the date is set, it is possible that the time may increment between the two accesses. A similar problem exists when reading. A roll over may occur between reads thus giving the minutes from one moment and the hours from the next. Recommended method for reading the time: 1. Send a START condition and the slave address for write (A2h). 2. Set the address pointer to 2 (seconds) by sending 02h. 3. Send a RE-START condition or STOP followed by START. 4. Send the slave address for read (A3h). 5. Read the seconds. 6. Read the minutes. 7. Read the hours. 8. Read the days. 9. Read the weekdays. 10. Read the century and month. 11. Read the years. 12. Send a STOP condition. 8.6 Alarm registers 8.6.1 Register Minute_alarm Table 19. Bit Symbol Value Place value Description 7 AEN_M 0 - Product data sheet minute alarm is enabled 1[1] - minute alarm is disabled 6 to 4 MINUTE_ALARM 0 to 5 ten’s place 3 to 0 0 to 9 unit place minute alarm information coded in BCD format [1] PCF8564A Minute_alarm - minute alarm register (address 09h) bit description Default value. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 13 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.6.2 Register Hour_alarm Table 20. Hour_alarm - hour alarm register (address 0Ah) bit description Bit Symbol Value Place value Description 7 AEN_H 0 - hour alarm is enabled 1[1] - hour alarm is disabled - - unused 5 to 4 HOUR_ALARM 0 to 2 ten’s place 3 to 0 0 to 9 unit place hour alarm information coded in BCD format 6 [1] - Default value. 8.6.3 Register Day_alarm Table 21. Day_alarm - day alarm register (address 0Bh) bit description Bit Symbol Value Place value Description 7 AEN_D 0 - day alarm is enabled 1[1] - day alarm is disabled - - unused 5 to 4 DAY_ALARM 0 to 3 ten’s place 3 to 0 0 to 9 unit place day alarm information coded in BCD format 6 [1] - Default value. 8.6.4 Register Weekday_alarm Table 22. Weekday_alarm - weekday alarm register (address 0Ch) bit description Bit Symbol Value Description 7 AEN_W 0 weekday alarm is enabled 1[1] weekday alarm is disabled - unused 6 to 3 - 2 to 0 WEEKDAY_ALARM 0 to 6 [1] weekday alarm information coded in BCD format Default value. 8.6.5 Alarm flag By clearing the MSB of one or more of the alarm registers AEN_x (Alarm Enable), the corresponding alarm condition(s) are active. When an alarm occurs, AF is set to logic 1. The asserted AF can be used to generate an interrupt (INT). The AF is cleared by command. The registers at addresses 09h through 0Ch contain alarm information. When one or more of these registers is loaded with a valid minute, hour, day, or weekday and its corresponding Alarm Enable bit (AEN_x) is logic 0, then that information is compared with the current minute, hour, day, and weekday. When all enabled comparisons first match, the Alarm Flag (AF in register Control_2) is set to logic 1. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 14 of 48 PCF8564A NXP Semiconductors Real time clock and calendar The generation of interrupts from the alarm function is controlled via bit AIE. If bit AIE is enabled, the INT pin follows the condition of bit AF. AF will remain set until cleared by command. Once AF has been cleared, it will only be set again when the time increments to match the alarm condition once more. Alarm registers which have their AEN_x bit at logic 1 are ignored. FKHFNQRZVLJQDO H[DPSOH $(1B0 $(1B0 0,187($/$50 0,187(7,0( $(1B+ +285$/$50 +2857,0( VHWDODUPIODJ$) $(1B' '$<$/$50 '$<7,0( $(1B: :((.'$<$/$50 DDD :((.'$<7,0( (1) Only when all enabled alarm settings are matching. It’s only on increment to a matched case that the alarm flag is set, see Section 8.6.5. Fig 7. Alarm function block diagram 8.7 Register CLKOUT_ctrl and clock output A programmable square wave is available at pin CLKOUT. Operation is controlled by the FE bit in register CLKOUT_ctrl at address 0Dh and the CLKOUT output enable pin (CLKOE). To enable pin CLKOUT pin CLKOE must be set HIGH. Frequencies of 32.768 kHz (default), 1.024 kHz, 32 Hz, and 1 Hz can be generated for use as a system clock, microcontroller clock, input to a charge pump, or for calibration of the oscillator. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 15 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 23. CLKOUT_ctrl - CLKOUT control register (address 0Dh) bit description Bit Symbol Value Description 7 FE 0 the CLKOUT output is inhibited and CLKOUT output is set to logic 0 1[1] the CLKOUT output is activated - unused 6 to 2 1 to 0 FD[1:0] [1] frequency output at pin CLKOUT 00[1] 32.768 kHz 01 1.024 kHz 10 32 Hz 11 1 Hz Default value. 8.8 Timer function The 8-bit countdown timer at address 0Fh is controlled by the timer control register at address 0Eh. The timer control register determines one of 4 source clock frequencies for the timer (4.096 kHz, 64 Hz, 1 Hz, or 1⁄60 Hz) and enables or disables the timer. The timer counts down from a software-loaded 8-bit binary value. At the end of every countdown, the timer sets the TF (Timer Flag) to logic 1. The TF may only be cleared using the interface. The generation of interrupts from the timer function is controlled via bit TIE. If bit TIE is enabled the INT pin follows the condition of bit TF. The interrupt may be generated as a pulsed signal every countdown period or as a permanently active signal which follows the condition of the timer flag TF. TI_TP is used for this mode control. When reading the timer, the current countdown value is returned. 8.8.1 Register Timer_ctrl Table 24. Bit 7 Timer_ctrl - timer control register (address 0Eh) bit description Symbol Value Description TE 0[1] timer is disabled 1 timer is enabled - unused 6 to 2 - timer source clock frequency select[2] 1 to 0 TD[1:0] PCF8564A Product data sheet 00 4.096 kHz 01 64 Hz 10 1 Hz 11[2] 1⁄ 60 Hz [1] Default value. [2] These bits determine the source clock for the countdown timer; when not in use, TD[1:0] should be set to 1⁄ Hz for power saving. 60 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 16 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 8.8.2 Register Timer Table 25. Bit Timer - timer register (address 0Fh) bit description Symbol 7 to 0 TV[7:0] [1] Value Description 0h to FFh countdown timer value[1] TV SourceClockFrequency Countdown period in seconds: CountdownPeriod = --------------------------------------------------------------- where TV is the countdown timer value. Table 26. Timer register bits value range Bit 7 6 5 4 3 2 1 0 128 64 32 16 8 4 2 1 The timer register is an 8-bit binary countdown timer. It is enabled or disabled via the timer control register. The source clock for the timer is also selected by the timer control register. Other timer properties such as single or periodic interrupt generation are controlled via the register Control_2 (address 01h). For accurate read back of the count down value, the I2C-bus clock (SDA) must be operating at a frequency of at least twice the selected timer clock. Since it is not possible to freeze the countdown timer counter during read back, it is recommended to read the register twice and check for consistent results. 8.9 EXT_CLK test mode The test mode is entered by setting the TEST1 bit of register Control_1 to logic 1. The CLKOUT pin then becomes an input. The test mode replaces the internal 64 Hz signal with that applied to the CLKOUT pin. Every 64 positive edges applied to CLKOUT then generates an increment of one second. The signal applied to the CLKOUT pin should have a minimum pulse width of 300 ns and a maximum period of 1000 ns. The 64 Hz clock, now sourced from CLKOUT, is divided down to 1 Hz by a 26 divide chain called a prescaler. The prescaler can be set to a known state by using the STOP bit. When the STOP bit is set, the prescaler is reset to logic 0. (STOP must be cleared before the prescaler can operate.) From a STOP condition, the first 1 second increment will take place after 32 positive edges on CLKOUT. Thereafter, every 64 positive edges will cause a 1 second increment. Remark: Entry into EXT_CLK test mode is not synchronized to the internal 64 Hz clock. When entering the test mode, no assumption as to the state of the prescaler can be made. 8.9.1 Operation example 1. Set EXT_CLK test mode (Bit 7 Control_1 = 1). 2. Set STOP (Bit 5 Control_1 = 1). 3. Clear STOP (Bit 5 Control_1 = 0). 4. Set time registers to desired value. 5. Apply 32 clock pulses to CLKOUT. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 17 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 6. Read time registers to see the first change. 7. Apply 64 clock pulses to CLKOUT. 8. Read time registers to see the second change. Repeat 7 and 8 for additional increments. 8.10 STOP bit function The function of the STOP bit is to allow for accurate starting of the time circuits. The STOP bit function will cause the upper part of the prescaler (F2 to F14) to be held in reset and thus no 1 Hz ticks will be generated (see Figure 8). The time circuits can then be set and will not increment until the STOP bit is released (see Figure 9 and Table 27). ) ) 5(6(7 5(6(7 +] ) UHVHW +] ) +] 26&,//$725 +] +] 26&,//$7256723 '(7(&725 ) +]WLFN 5(6(7 6723 +] +] &/.287VRXUFH +] +] Fig 8. DDD STOP bit functional diagram The STOP bit function will not affect the output of 32.768 kHz on CLKOUT, but will stop the generation of 1.024 kHz, 32 Hz and 1 Hz. The lower two stages of the prescaler (F0 and F1) are not reset and because the I2C-bus is asynchronous to the crystal oscillator, the accuracy of re-starting the time circuits will be between zero and one 8.192 kHz cycle (see Figure 9). +] VWRSUHOHDVHG VWRV Fig 9. PCF8564A Product data sheet DDI STOP bit release timing All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 18 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 27. First increment of time circuits after STOP bit release Bit Prescaler bits STOP F0F1-F2 to F14 [1] 1 Hz tick Time Comment hh:mm:ss Clock is running normally 0 12:45:12 01-0 0001 1101 0100 prescaler counting normally STOP bit is activated by user. F0F1 are not reset and values cannot be predicted externally 1 XX-0 0000 0000 0000 12:45:12 prescaler is reset; time circuits are frozen 08:00:00 prescaler is reset; time circuits are frozen 08:00:00 prescaler is now running 08:00:00 - 08:00:00 - 08:00:00 - : : New time is set by user 1 XX-0 0000 0000 0000 STOP bit is released by user 0 XX-1 0000 0000 0000 XX-0 1000 0000 0000 XX-1 1000 0000 0000 : WRV XX-0 0000 0000 0000 - 08:00:01 0 to 1 transition of F14 increments the time circuits 10-0 0000 0000 0001 08:00:01 - : : : 08:00:01 - 08:00:01 - 10-0 0000 0000 0000 08:00:01 - : : - 11-1 1111 1111 1110 08:00:01 - 00-0 0000 0000 0001 08:00:02 0 to 1 transition of F14 increments the time circuits 11-1 1111 1111 1111 00-0 0000 0000 0000 V 08:00:00 00-0 0000 0000 0001 11-1 1111 1111 1110 DDD [1] F0 is clocked at 32.768 kHz. The first increment of the time circuits is between 0.507813 s and 0.507935 s after STOP bit is released. The uncertainty is caused by the prescaler bits F0 and F1 not being reset (see Table 27) and the unknown state of the 32 kHz clock. 8.11 Reset The PCF8564A includes an internal reset circuit which is active whenever the oscillator is stopped. In the reset state the I2C-bus logic is initialized including the address pointer and all registers are set according to Table 28. I2C-bus communication is not possible during reset. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 19 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 28. Register reset values[1] Address Register name Bit 7 6 5 4 3 2 1 0 00h Control_1 0 0 0 0 1 0 0 0 01h Control_2 0 0 0 0 0 0 0 0 02h Seconds 1 x x x x x x x 03h Minutes x x x x x x x x 04h Hours x x x x x x x x 05h Days x x x x x x x x 06h Weekdays x x x x x x x x 07h Months x x x x x x x x 08h Years x x x x x x x x 09h Minute_alarm 1 x x x x x x x 0Ah Hour_alarm 1 x x x x x x x 0Bh Day_alarm 1 x x x x x x x 0Ch Weekday_alarm 1 x x x x x x x 0Dh CLKOUT_ctrl 1 x x x x x 0 0 0Eh Timer_ctrl 0 x x x x x 1 1 0Fh Timer x x x x x x x x [1] Registers marked ‘x’ are undefined at power-on and unchanged by subsequent resets. 8.11.1 Power-On Reset (POR) override The POR duration is directly related to the crystal oscillator start-up time. Due to the long start-up times experienced by these types of circuits, a circuit has been implemented to disable the POR and speed up functional test of the module. The setting of this mode requires that the I2C signals on the pins SDA and SCL are toggled as illustrated in Figure 10. All timings shown are required minimums. Once the override mode has been entered, the chip immediately stops, being reset, and normal operation may begin, i.e., entry into the EXT_CLK test mode via I2C access. The override mode may be cleared by writing logic 0 to TESTC. TESTC must be set to logic 1 before re-entry into the override mode is possible. Setting TESTC to logic 0 during normal operation has no effect, except to prevent entry into the POR override mode. QV QV 6'$ 6&/ PV SRZHURQ RYHUULGHDFWLYH PJP Allow 500 ns between the edges of either signal. Fig 10. POR override sequence PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 20 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 9. Characteristics of the I2C-bus The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. 9.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal (see Figure 11). 6'$ 6&/ GDWDOLQH VWDEOH GDWDYDOLG FKDQJH RIGDWD DOORZHG PEF Fig 11. Bit transfer 9.2 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH, is defined as the START condition (S). A LOW-to-HIGH transition of the data line, while the clock is HIGH, is defined as the STOP condition (P), see Figure 12. 6'$ 6'$ 6&/ 6&/ 6 3 67$57FRQGLWLRQ 6723FRQGLWLRQ PEF Fig 12. Definition of START and STOP conditions 9.3 System configuration A device generating a message is a transmitter, a device receiving a message is the receiver. The device that controls the message is the master; and the devices which are controlled by the master are the slaves (see Figure 13). PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 21 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 6'$ 6&/ 0$67(5 75$160,77(5 5(&(,9(5 6/$9( 75$160,77(5 5(&(,9(5 6/$9( 5(&(,9(5 0$67(5 75$160,77(5 5(&(,9(5 0$67(5 75$160,77(5 PED Fig 13. System configuration 9.4 Acknowledge The number of data bytes transferred between the START and STOP conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge cycle. • A slave receiver, which is addressed, must generate an acknowledge after the reception of each byte. • Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. • The device that acknowledges must pull-down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). • A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Acknowledgement on the I2C-bus is shown in Figure 14. GDWDRXWSXW E\WUDQVPLWWHU QRWDFNQRZOHGJH GDWDRXWSXW E\UHFHLYHU DFNQRZOHGJH 6&/IURP PDVWHU 6 67$57 FRQGLWLRQ FORFNSXOVHIRU DFNQRZOHGJHPHQW PEF Fig 14. Acknowledgment on the I2C-bus PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 22 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 10. I2C-bus protocol 10.1 Addressing Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The PCF8564A acts as a slave receiver or slave transmitter. Therefore, the clock signal SCL is only an input signal, but the data signal SDA is a bidirectional line. Two slave addresses are reserved for the PCF8564A: Read: A3h (1010 0011) Write: A2h (1010 0010) The PCF8564A slave address is shown in Figure 14. JURXS 5: JURXS PFH Fig 15. Slave address 10.2 Clock and calendar READ or WRITE cycles Figure 16, Figure 17, and Figure 18 show the I2C-bus configuration for the different PCF8564A READ and WRITE cycles. The word address is a 4-bit value that defines which register is to be accessed next. The upper four bits of the word address are not used. DFNQRZOHGJHPHQW IURPVODYH 6 6/$9($''5(66 $ DFNQRZOHGJHPHQW IURPVODYH :25'$''5(66 $ 5: DFNQRZOHGJHPHQW IURPVODYH '$7$ $ 3 QE\WHV DXWRLQFUHPHQW PHPRU\ZRUGDGGUHVV PEG Fig 16. Master transmits to slave receiver (WRITE mode) PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 23 of 48 PCF8564A NXP Semiconductors Real time clock and calendar DFNQRZOHGJHPHQW IURPVODYH 6 6/$9($''5(66 $ DFNQRZOHGJHPHQW IURPVODYH :25'$''5(66 5: $ 6 DFNQRZOHGJHPHQW IURPPDVWHU DFNQRZOHGJHPHQW IURPVODYH 6/$9($''5(66 DWWKLVPRPHQWPDVWHUWUDQVPLWWHU EHFRPHVPDVWHUUHFHLYHUDQG 3&)$VODYHUHFHLYHU EHFRPHVVODYHWUDQVPLWWHU '$7$ $ $ QE\WHV 5: DXWRLQFUHPHQW PHPRU\ZRUGDGGUHVV QRDFNQRZOHGJHPHQW IURPPDVWHU '$7$ 3 ODVWE\WH DXWRLQFUHPHQW PHPRU\ZRUGDGGUHVV DDD Fig 17. Master reads word after setting word address (write word address; READ data) DFNQRZOHGJHPHQW IURPVODYH 6 6/$9($''5(66 $ 5: DFNQRZOHGJHPHQW IURPPDVWHU $ '$7$ QE\WHV QRDFNQRZOHGJHPHQW IURPPDVWHU '$7$ 3 ODVWE\WH DXWRLQFUHPHQW ZRUGDGGUHVV DXWRLQFUHPHQW ZRUGDGGUHVV PJO Fig 18. Master reads slave immediately after first byte (READ mode) PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 24 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 10.3 Interface watchdog timer WV GDWD 67$57 6/$9($''5(66 '$7$ '$7$ :'WLPHU 6723 :'WLPHUWUDFNLQJ WLPH FRXQWHUV UXQQLQJ WLPHFRXQWHUVIUR]HQ UXQQLQJ DDD a. Correct data transfer: read or write VWV GDWD 67$57 6/$9($''5(66 '$7$ '$7$ :'WLPHU WLPH FRXQWHUV GDWDWUDQVIHUIDLO :'WLPHUWUDFNLQJ UXQQLQJ WLPHFRXQWHUVIUR]HQ :'WULSV UXQQLQJ DDD b. Incorrect data transfer; read or write Fig 19. Interface watchdog timer During read/write operations, the time counting circuits are frozen. To prevent a situation where the accessing device becomes locked and does not clear the interface, the PCF8564A has a built in watchdog timer. Should the interface be active for more than 1 s from the time a valid slave address is transmitted, then the PCF8564A will automatically clear the interface and allow the time counting circuits to continue counting. The watchdog will trigger between 1 s and 2 s after receiving a valid slave address. Each time the watchdog period is exceeded, 1 s will be lost from the time counters. The watchdog is implemented to prevent the excessive loss of time due to interface access failure e.g. if main power is removed from a battery backed-up system during an interface access. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 25 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 11. Internal circuitry &/.2( 26&, 9'' 26&2 &/.287 6&/ ,17 966 6'$ 3&)$ DDD Fig 20. Device diode protection diagram 12. Safety notes CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. CAUTION Semiconductors are light sensitive. Exposure to light sources can cause the IC to malfunction. The IC must be protected against light. The protection must be applied to all sides of the IC. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 26 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 13. Limiting values Table 29. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD Conditions Min Max Unit supply voltage 0.5 +6.5 V VI input voltage 0.5 +6.5 V VO output voltage 0.5 +6.5 V IDD supply current 50.0 +50.0 mA II input current 10.0 +10.0 mA IO output current 10.0 +10.0 mA ISS ground supply current 50.0 +50.0 mA Ptot total power dissipation - 300 mW V electrostatic discharge voltage HBM [1] - 3500 MM [2] - 250 V Ilu latch-up current all pins but OSCI [3] - 100 mA Tstg storage temperature [4] 65 +150 C Tamb ambient temperature 40 +85 C VESD operating device [1] Pass level; Human Body Model (HBM) according to Ref. 5 “JESD22-A114”. [2] Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”. [3] Pass level; latch-up testing, according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)). [4] According to the NXP store and transport conditions (see Ref. 11 “UM10569”) the devices have to be stored at a temperature of +5 C to +45 C and a humidity of 25 % to 75 %. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 27 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 14. Static characteristics Table 30. Static characteristics VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; fosc = 32.768 kHz; quartz Rs = 40 k; CL = 8 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit supply voltage interface inactive; Tamb = 25 C [1] 1.0 - 5.5 V [1] interface active; fSCL = 400 kHz 1.8 - 5.5 V Vlow - 5.5 V - - 800 A - - 200 A VDD = 5.0 V - 275 550 nA VDD = 3.0 V - 250 500 nA - 225 450 nA VDD = 5.0 V - 500 750 nA VDD = 3.0 V - 400 650 nA - 400 600 nA VDD = 5.0 V - 1500 3000 nA VDD = 3.0 V - 1000 2000 nA - 700 1400 nA Supplies VDD for clock data integrity; Tamb = 25 C IDD supply current interface active fSCL = 400 kHz fSCL = 100 kHz interface inactive (fSCL = 0 Hz); CLKOUT disabled; Tamb = 25 C [2] [3] [4] VDD = 2.0 V interface inactive (fSCL = 0 Hz); CLKOUT disabled; Tamb = 40 C to +85 C [2] [3] [4] VDD = 2.0 V interface inactive (fSCL = 0 Hz); CLKOUT enabled at 32 kHz; Tamb = 25 C [4] [5] [6] VDD = 2.0 V interface inactive (fSCL = 0 Hz); CLKOUT enabled at 32 kHz; Tamb = 40 C to +85 C [4] [5] [6] VDD = 5.0 V - 1700 3400 nA VDD = 3.0 V - 1100 2200 nA VDD = 2.0 V - 800 1600 nA on pins SDA and SCL 0.5 - +5.5 V on pins CLKOE and CLKOUT (test mode) 0.5 - VDD + 0.5 V Inputs VI input voltage VIL LOW-level input voltage - - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - - V PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 28 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 30. Static characteristics …continued VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; fosc = 32.768 kHz; quartz Rs = 40 k; CL = 8 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ILI input leakage current VI = VSS or VDD - 0 - A 1 - +1 A Ci input capacitance - - 7 pF 0.5 - VDD + 0.5 V post ESD event [7] Outputs VO output voltage on pin CLKOUT on pin INT 0.5 - +5.5 V IOL LOW-level output current on pin SDA; VOL = 0.4 V; VDD = 5 V 3 - - mA on pin INT; VOL = 0.4 V; VDD = 5 V 1 - - mA on pin CLKOUT: VOL = 0.4 V; VDD = 5 V 1 - - mA on pin CLKOUT; VOH = 4.6 V; VDD = 5 V 1 - - mA - 0 - A 1 - +1 A - 0.9 1.0 V IOH HIGH-level output current ILO output leakage current VO = VSS or VDD post ESD event Voltage detector Vlow low voltage Tamb = 25 C [1] For reliable oscillator start-up at power-on: VDD(po)min = VDD(min) + 0.3 V. [2] Timer source clock = 1⁄60 Hz. [3] CLKOUT disabled (FE = 0 or CLKOE = 0). [4] VIL and VIH with an input voltage swing of VSS to VDD. [5] CLKOUT is open circuit. [6] Current consumption when the CLKOUT pin is enabled is a function of the load on the pin, the output frequency, and the supply voltage. The additional current consumption for a given load is calculated from: I DD = C V DD F CLKOUT . [7] Tested on sample basis. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 29 of 48 PCF8564A NXP Semiconductors Real time clock and calendar PJU ,'' $ PJU ,'' $ 9''9 Tamb = 25 C; timer = 1 minute; CLKOUT disabled. Fig 21. IDD as a function of VDD 9''9 Tamb = 25 C; timer = 1 minute; CLKOUT = 32 kHz. Fig 22. IDD as a function of VDD PJU PJU ,'' $ IUHTXHQF\ GHYLDWLRQ SSP 7& VDD = 3 V; timer = 1 minute; CLKOUT = 32 kHz. Fig 23. IDD as a function of temperature PCF8564A Product data sheet 9''9 Tamb = 25 C; normalized to VDD = 3 V. Fig 24. Frequency deviation as a function of VDD All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 30 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 15. Dynamic characteristics Table 31. Dynamic characteristics VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; fosc = 32.768 kHz; quartz Rs = 40 k; CL = 8 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 6 8 10 pF - 0.2 - ppm Oscillator CL(itg) integrated load capacitance fosc/fosc relative oscillator frequency variation [1] VDD = 200 mV; Tamb = 25 C Quartz crystal parameters Rs series resistance - - 100 k CL load capacitance - 8 - pF - 50 - % CLKOUT output CLKOUT [2] duty cycle on pin CLKOUT I2C-bus timing characteristics (see Figure 25)[3][4] fSCL SCL clock frequency - - 400 kHz tHD;STA hold time (repeated) START condition 0.6 - - s tSU;STA set-up time for a repeated START condition 0.6 - - s tLOW LOW period of the SCL clock 1.3 - - s tHIGH HIGH period of the SCL clock 0.6 - - s tr rise time of both SDA and SCL signals - - 0.3 s tf fall time of both SDA and SCL signals - - 0.3 s Cb capacitive load for each bus line - - 400 pF tSU;DAT data set-up time 100 - - ns tHD;DAT data hold time 0 - - ns tSU;STO set-up time for STOP condition 0.6 - - s tw(spike) spike pulse width - - 50 ns C OSCI C OSCO [1] Integrated load capacitance, CL(itg), is a calculation of COSCI and COSCO in series: C L itg = -------------------------------------------- . C OSCI + C OSCO [2] Unspecified for fCLKOUT = 32.768 kHz. [3] All timing values are valid within the operating supply voltage at ambient temperature and referenced to VIL and VIH with an input voltage swing of VSS to VDD. [4] A detailed description of the I2C-bus specification is given in Ref. 9 “UM10204”. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 31 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 6'$ W%8) W/2: WI 6&/ W+'67$ WU W+''$7 W68'$7 W+,*+ 6'$ W6867$ W68672 PJD Fig 25. I2C-bus timing waveforms 16. Application information 9'' 6'$ ) 6&/ 9'' 0$67(5 75$160,77(5 5(&(,9(5 6&/ &/2&.&$/(1'$5 26&, 3&)$ 26&2 966 9'' 6'$ 5 6'$ 6&/ ,&EXV 5 DDD Connect CLKOE to an appropriate level. A 1 farad super capacitor combined with a low VF diode can be used as a standby or back-up supply. With the RTC in its minimum power configuration, the RTC may operate for weeks. Fig 26. Application diagram PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 32 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 17. Bare die outline :LUHERQGGLHERQGLQJSDGV 3&)$8 ' H $ H \ H ( [ ; 3 3 3 3 GHWDLO; 1RWH 0DUNLQJFRGH3&$ )LJXUHQRWGUDZQWRVFDOH SFIDXBGR 2XWOLQH YHUVLRQ 5HIHUHQFHV ,(& -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH 3&)$8 Fig 27. Bare die outline of PCF8564AU/x PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 33 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 32. Dimensions of PCF8564AU/x Chip dimensions including saw line. Original dimensions are in mm. Unit (mm) Product data sheet D E e e1 e2 P1 P2 P3 P4 max - - - - - - - - - - nom [1] 1.26 1.89 1.05 0.22 0.9 0.1 0.09 0.1 0.09 min - - - - - - - - - - [1] PCF8564A A Depending on wafer thickness, see Table 37. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 34 of 48 PCF8564A NXP Semiconductors Real time clock and calendar %DUHGLHEXPSV 3&)$8* ' H H \ H ( [ ; < 3 3 $ GHWDLO; $ $ GHWDLO< 1RWH 0DUNLQJFRGH3&$ )LJXUHQRWGUDZQWRVFDOH SFIDXJBGR 2XWOLQH YHUVLRQ 5HIHUHQFHV ,(& -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH 3&)$8* Fig 28. Bare die outline of PCF8564AUG/x PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 35 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 33. Dimensions of PCF8564AUG/x Chip dimensions including saw line. Original dimensions are in mm. Unit (mm) Product data sheet A1 A2 D E e e1 e2 P1 P2 max - - - - - - - - - - nom [1] 0.015 [1] 1.26 1.89 1.05 0.22 0.9 0.09 0.09 min - - - - - - - - - - [1] PCF8564A A Depending on wafer thickness, see Table 37. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 36 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 34. Pin location of all PCF8564A types All x/y coordinates represent the position of the center of each pin with respect to the center (x/y = 0) of the chip; see Figure 27 and Figure 28. Symbol Pad X (m) Y (m) Description OSCI 1 523.0 689.4 oscillator input OSCO 2 523.0 469.4 oscillator output INT 3 523.0 429.8 open-drain interrupt output (active LOW) VSS 4 523.0 684.4 ground (substrate) SDA 5 524.9 523.8 serial data I/O SCL 6 524.9 138.6 serial clock input CLKOUT 7 524.9 162.5 CMOS push-pull clock output VDD 8 524.9 443.3 supply CLKOE 9 524.9 716.3 CLKOUT output enable 5() 5() & & 5() DDD ) Fig 29. Alignment marks of all PCF8564A types Table 35. Alignment marks of all PCF8564A types All x/y coordinates represent the position of the REF point (see Figure 29) with respect to the center (x/y = 0) of the chip; see Figure 27 and Figure 28. Alignment markers Size (m) X (m) Y (m) C1 100 100 465.2 826.3 C2 100 100 523.0 890.0 F 90 117 569.9 885.5 Type number Min Max Unit[1] PCF8564AUG/12HB/1 35 80 HV Table 36. [1] PCF8564A Product data sheet Gold bump hardness Pressure of diamond head: 10 g to 50 g. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 37 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 18. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent standards. PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 38 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 19. Packing information 19.1 Wafer and Film Frame Carrier (FFC) information P P P 6DZODQH 6HDOULQJSOXVJDSWR DFWLYHFLUFXLWaP P GHWDLO; 0DUNLQJFRGH 3LQ 6WUDLJKWHGJH RIWKHZDIHU ; DDD Wafer thickness, see Table 37. Fig 30. Wafer layout of PCF8564A PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 39 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Table 37. PCF8564A wafer information Type number Wafer thickness Wafer diameter FFC for wafer size Marking of bad die PCF8564AU/5BB/1 0.28 mm 6 inch - inking PCF8564AU/5GB/1 0.69 mm 6 inch - inking PCF8564AU/5GC/1 0.69 mm 6 inch - wafer mapping PCF8564AU/10AB/1 0.20 mm 6 inch 6 inch inking PCF8564AUG/12HB/1 0.15 mm 6 inch 8 inch inking PP PP PP PP PHWDOIUDPH VWUDLJKWHGJH RIWKHZDIHU PP PP P P SODVWLFILOP DDD Fig 31. Film Frame Carrier (FFC) for 6 inch wafer (PCF8564AU/10AB/1) PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 40 of 48 PCF8564A NXP Semiconductors Real time clock and calendar PP PP PP PPSODVWLN PPPHWDOO IUDPH VWUDLJKWHGJH RIWKHZDIHU PP PP P P SODVWLFILOP DDD Fig 32. Film Frame Carrier (FFC) for 8 inch wafer (PCF8564AUG/12HB/1) PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 41 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 20. Abbreviations Table 38. Abbreviations Acronym Description BCD Binary Coded Decimal CMOS Complementary Metal Oxide Semiconductor FFC Film Frame Carrier HBM Human Body Model I2C Inter-Integrated Circuit IC Integrated Circuit LSB Least Significant Bit MM Machine Model MOS Metal Oxide Semiconductor MSB Most Significant Bit MSL Moisture Sensitivity Level PCB Printed-Circuit Board POR Power-On Reset ROM Read Only Memory RTC Real Time Clock SCL Serial CLock line SDA Serial DAta line 21. References [1] AN10439 — Wafer Level Chip Size Package [2] AN10706 — Handling bare die [3] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [4] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena [5] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) [6] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM) [7] JESD78 — IC Latch-Up Test [8] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices [9] UM10204 — I2C-bus specification and user manual [10] UM10301 — User Manual for NXP Real Time Clocks PCF85x3, PCA8565 and PCF2123, PCA2125 [11] UM10569 — Store and transport requirements PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 42 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 22. Revision history Table 39. Revision history Document ID Release date Data sheet status Change notice Supersedes PCF8564A v.3 20130826 Product data sheet - PCF8564A v.2 Modifications: • • adjusted product and ordering information added Figure 19 PCF8564A v.2 20100930 Product data sheet - PCF8564A v.1 PCF8564A v.1 20091008 Product data sheet - - PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 43 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 23. Legal information 23.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 23.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 23.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCF8564A Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 44 of 48 PCF8564A NXP Semiconductors Real time clock and calendar Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Bare die — All die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the NXP Semiconductors storage and transportation conditions. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. All die sales are conditioned upon and subject to the customer entering into a written die sale agreement with NXP Semiconductors through its legal department. 23.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 24. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 45 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 25. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2 Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4 Register overview . . . . . . . . . . . . . . . . . . . . . . . .6 Control_1 - control and status register 1 (address 00h) bit description . . . . . . . . . . . . . . .7 Control_2 - control and status register 2 (address 01h) bit description . . . . . . . . . . . . . . .7 INT operation (bit TI_TP = 1)[1] . . . . . . . . . . . . . .8 Seconds - seconds and clock integrity status register (address 02h) bit description . . . . . . . . .9 Seconds coded in BCD format . . . . . . . . . . . . .9 Minutes - minutes register (address 03h) bit description . . . . . . . . . . . . . . . . . . . . . . . . . .10 Hours - hours register (address 04h) bit description . . . . . . . . . . . . . . . . . . . . . . . . . .10 Days - days register (address 05h) bit description . . . . . . . . . . . . . . . . . . . . . . . . . .10 Weekdays - weekdays register (address 06h) bit description . . . . . . . . . . . . . .10 Weekday assignments . . . . . . . . . . . . . . . . . . 11 Months - months and century flag register (address 07h) bit description . . . . . . . . . . . . . . 11 Month assignments coded in BCD format . . . 11 Years - years register (08h) bit description . . . .12 Minute_alarm - minute alarm register (address 09h) bit description . . . . . . . . . . . . . .13 Hour_alarm - hour alarm register (address 0Ah) bit description . . . . . . . . . . . . . .14 Day_alarm - day alarm register (address 0Bh) bit description . . . . . . . . . . . . . .14 Weekday_alarm - weekday alarm register (address 0Ch) bit description . . . . . . . . . . . . . .14 CLKOUT_ctrl - CLKOUT control register (address 0Dh) bit description . . . . . . . . . . . . . .16 Timer_ctrl - timer control register (address 0Eh) bit description . . . . . . . . . . . . . .16 Timer - timer register (address 0Fh) bit description . . . . . . . . . . . . . . . . . . . . . . . . .17 Timer register bits value range . . . . . . . . . . . . .17 First increment of time circuits after STOP bit release . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Register reset values[1] . . . . . . . . . . . . . . . . . .20 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .27 Static characteristics . . . . . . . . . . . . . . . . . . . .28 Dynamic characteristics . . . . . . . . . . . . . . . . . .31 Dimensions of PCF8564AU/x . . . . . . . . . . . . .34 Dimensions of PCF8564AUG/x . . . . . . . . . . .36 Pin location of all PCF8564A types . . . . . . . .37 Alignment marks of all PCF8564A types . . . . .37 Gold bump hardness . . . . . . . . . . . . . . . . . . . .37 PCF8564A wafer information . . . . . . . . . . . . . .40 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .42 Revision history . . . . . . . . . . . . . . . . . . . . . . . .43 PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 46 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 26. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Fig 19. Fig 20. Fig 21. Fig 22. Fig 23. Fig 24. Fig 25. Fig 26. Fig 27. Fig 28. Fig 29. Fig 30. Fig 31. Fig 32. Block diagram of PCF8564A . . . . . . . . . . . . . . . . .3 Pinning diagram of PCF8564A . . . . . . . . . . . . . . .4 Interrupt scheme . . . . . . . . . . . . . . . . . . . . . . . . . .8 Voltage low detection . . . . . . . . . . . . . . . . . . . . . . .9 Data flow for the time function . . . . . . . . . . . . . . .12 Access time for read/write operations . . . . . . . . .13 Alarm function block diagram. . . . . . . . . . . . . . . .15 STOP bit functional diagram . . . . . . . . . . . . . . . .18 STOP bit release timing . . . . . . . . . . . . . . . . . . . .18 POR override sequence . . . . . . . . . . . . . . . . . . .20 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Definition of START and STOP conditions. . . . . .21 System configuration . . . . . . . . . . . . . . . . . . . . . .22 Acknowledgment on the I2C-bus . . . . . . . . . . . . .22 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Master transmits to slave receiver (WRITE mode) . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Master reads word after setting word address (write word address; READ data) . . . . . . . . . . . .24 Master reads slave immediately after first byte (READ mode) . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Interface watchdog timer . . . . . . . . . . . . . . . . . . .25 Device diode protection diagram . . . . . . . . . . . . .26 IDD as a function of VDD . . . . . . . . . . . . . . . . . . . .30 IDD as a function of VDD . . . . . . . . . . . . . . . . . . . .30 IDD as a function of temperature . . . . . . . . . . . . .30 Frequency deviation as a function of VDD . . . . . .30 I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .32 Application diagram . . . . . . . . . . . . . . . . . . . . . . .32 Bare die outline of PCF8564AU/x . . . . . . . . . . . .33 Bare die outline of PCF8564AUG/x . . . . . . . . . . .35 Alignment marks of all PCF8564A types . . . . . . .37 Wafer layout of PCF8564A . . . . . . . . . . . . . . . . .39 Film Frame Carrier (FFC) for 6 inch wafer (PCF8564AU/10AB/1) . . . . . . . . . . . . . . . . . . . . .40 Film Frame Carrier (FFC) for 8 inch wafer (PCF8564AUG/12HB/1) . . . . . . . . . . . . . . . . . . .41 PCF8564A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 August 2013 © NXP B.V. 2013. All rights reserved. 47 of 48 PCF8564A NXP Semiconductors Real time clock and calendar 27. Contents 1 2 3 4 4.1 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.2.1 8.4 8.4.1 8.4.1.1 8.4.2 8.4.3 8.4.4 8.4.5 8.4.6 8.4.7 8.5 8.6 8.6.1 8.6.2 8.6.3 8.6.4 8.6.5 8.7 8.8 8.8.1 8.8.2 8.9 8.9.1 8.10 8.11 8.11.1 9 9.1 9.2 9.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 CLKOUT output . . . . . . . . . . . . . . . . . . . . . . . . 5 Register organization . . . . . . . . . . . . . . . . . . . . 6 Control registers . . . . . . . . . . . . . . . . . . . . . . . . 7 Register Control_1 . . . . . . . . . . . . . . . . . . . . . . 7 Register Control_2 . . . . . . . . . . . . . . . . . . . . . . 7 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 8 Time and date registers . . . . . . . . . . . . . . . . . . 9 Register Seconds . . . . . . . . . . . . . . . . . . . . . . . 9 Voltage low detector and clock monitor . . . . . . 9 Register Minutes. . . . . . . . . . . . . . . . . . . . . . . 10 Register Hours . . . . . . . . . . . . . . . . . . . . . . . . 10 Register Days . . . . . . . . . . . . . . . . . . . . . . . . . 10 Register Weekdays. . . . . . . . . . . . . . . . . . . . . 10 Register Months . . . . . . . . . . . . . . . . . . . . . . . 11 Register Years . . . . . . . . . . . . . . . . . . . . . . . . 12 Setting and reading the time. . . . . . . . . . . . . . 12 Alarm registers . . . . . . . . . . . . . . . . . . . . . . . . 13 Register Minute_alarm . . . . . . . . . . . . . . . . . . 13 Register Hour_alarm . . . . . . . . . . . . . . . . . . . 14 Register Day_alarm . . . . . . . . . . . . . . . . . . . . 14 Register Weekday_alarm . . . . . . . . . . . . . . . . 14 Alarm flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Register CLKOUT_ctrl and clock output. . . . . 15 Timer function . . . . . . . . . . . . . . . . . . . . . . . . . 16 Register Timer_ctrl . . . . . . . . . . . . . . . . . . . . . 16 Register Timer . . . . . . . . . . . . . . . . . . . . . . . . 17 EXT_CLK test mode . . . . . . . . . . . . . . . . . . . . 17 Operation example . . . . . . . . . . . . . . . . . . . . . 17 STOP bit function . . . . . . . . . . . . . . . . . . . . . . 18 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Power-On Reset (POR) override . . . . . . . . . . 20 Characteristics of the I2C-bus . . . . . . . . . . . . 21 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 START and STOP conditions . . . . . . . . . . . . . 21 System configuration . . . . . . . . . . . . . . . . . . . 21 9.4 10 10.1 10.2 10.3 11 12 13 14 15 16 17 18 19 19.1 20 21 22 23 23.1 23.2 23.3 23.4 24 25 26 27 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock and calendar READ or WRITE cycles . Interface watchdog timer . . . . . . . . . . . . . . . . Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics. . . . . . . . . . . . . . . . . Application information . . . . . . . . . . . . . . . . . Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . Handling information . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . Wafer and Film Frame Carrier (FFC) information. . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . References. . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 23 23 23 25 26 26 27 28 31 32 33 38 39 39 42 42 43 44 44 44 44 45 45 46 47 48 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 August 2013 Document identifier: PCF8564A