PCF2127
Accurate RTC with integrated quartz crystal for industrial
applications
Rev. 8 — 19 December 2014
Product data sheet
1. General description
The PCF2127 is a CMOS1 Real Time Clock (RTC) and calendar with an integrated
Temperature Compensated Crystal (Xtal) Oscillator (TCXO) and a 32.768 kHz quartz
crystal optimized for very high accuracy and very low power consumption. The PCF2127
has 512 bytes of general-purpose static RAM, a selectable I2C-bus or SPI-bus, a backup
battery switch-over circuit, a programmable watchdog function, a timestamp function, and
many other features.
For a selection of NXP Real-Time Clocks, see Table 94 on page 89
2. Features and benefits
1.
UL Recognized Component
Operating temperature range from 40 C to +85 C
Temperature Compensated Crystal Oscillator (TCXO) with integrated capacitors
Typical accuracy:
PCF2127AT: 3 ppm from 15 C to +60 C
PCF2127T: 3 ppm from 30 C to +80 C
Integration of a 32.768 kHz quartz crystal and oscillator in the same package
Provides year, month, day, weekday, hours, minutes, seconds, and leap year
correction
512 bytes of general-purpose static RAM
Timestamp function
with interrupt capability
detection of two different events on one multilevel input pin (for example, for tamper
detection)
Two line bidirectional 400 kHz Fast-mode I2C-bus interface
3 line SPI-bus with separate data input and output (maximum speed 6.5 Mbit/s)
Battery backup input pin and switch-over circuitry
Battery backed output voltage
Battery low detection function
Extra power fail detection function with input and output pins
Power-On Reset Override (PORO)
Oscillator stop detection function
Interrupt output (open-drain)
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
Programmable 1 second or 1 minute interrupt
Programmable watchdog timer with interrupt
Programmable alarm function with interrupt capability
Programmable square wave output pin
Programmable countdown timer with interrupt
Clock operating voltage: 1.8 V to 4.2 V
Low supply current: typical 0.70 A at VDD = 3.3 V
3. Applications
Electronic metering for electricity, water, and gas
Precision timekeeping
Access to accurate time of the day
GPS equipment to reduce time to first fix
Applications that require an accurate process timing
Products with long automated unattended operation time
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCF2127AT
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
PCF2127T
SO16
plastic small outline package; 16 leads;
body width 7.5 mm
SOT162-1
4.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCF2127AT/2
PCF2127AT/2Y
935299867518
tape and reel, 13 inch, dry pack
2
PCF2127T/2
PCF2127T/2Y
935299866518
tape and reel, 13 inch, dry pack
2
5. Marking
Table 3.
PCF2127
Product data sheet
Marking codes
Product type number
Marking code
PCF2127AT/2
PCF2127AT
PCF2127T/2
PCF2127T
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
6. Block diagram
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Block diagram of PCF2127
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
7. Pinning information
7.1 Pinning
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Fig 2.
Pin configuration for PCF2127AT (SO20)
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Fig 3.
Pin configuration for PCF2127T (SO16)
DDD
Fig 4.
PCF2127
Product data sheet
Position of the stubs from the package assembly process
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
After lead forming and cutting, there remain stubs from the package assembly process.
These stubs are present at the edge of the package as illustrated in Figure 4. The stubs
are at an electrical potential. To avoid malfunction of the PCF2127, it has to be ensured
that they are not shorted with another electrical potential (e.g. by condensation).
7.2 Pin description
Table 4.
Pin description of PCF2127
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Symbol
Pin
Description
PCF2127AT
PCF2127T
SCL
1
1
combined serial clock input for both I2C-bus and SPI-bus
SDI
2
2
serial data input for SPI-bus
connect to pin VSS if I2C-bus is selected
SDO
3
3
serial data output for SPI-bus, push-pull
SDA/CE
4
4
combined serial data input and output for the I2C-bus and
chip enable input (active LOW) for the SPI-bus
IFS
5
5
interface selector input
connect to pin VSS to select the SPI-bus
connect to pin BBS to select the I2C-bus
TS
6
6
timestamp input (active LOW) with 200 k internal pull-up
resistor (RPU)
CLKOUT
7
7
clock output (open-drain)
VSS
8
8
ground supply voltage
n.c.
9 to 12
-
not connected; do not connect; do not use as feed through
TEST
13
9
do not connect; do not use as feed through
PFO
14
10
power fail output (open-drain; active LOW)
PFI
15
11
power fail input
RST
16
12
reset output (open-drain; active LOW)
INT
17
13
interrupt output (open-drain; active LOW)
BBS
18
14
output voltage (battery backed)
VBAT
19
15
battery supply voltage (backup)
VDD
20
16
supply voltage
connect to VSS if battery switch-over is not used
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8. Functional description
The PCF2127 is a Real Time Clock (RTC) and calendar with an on-chip Temperature
Compensated Crystal (Xtal) Oscillator (TCXO) and a 32.768 kHz quartz crystal integrated
into the same package (see Section 8.3.3).
Address and data are transferred by a selectable 400 kHz Fast-mode I2C-bus or a 3 line
SPI-bus with separate data input and output (see Section 9). The maximum speed of the
SPI-bus is 6.5 Mbit/s.
The PCF2127 has a backup battery input pin and backup battery switch-over circuit which
monitors the main power supply. The backup battery switch-over circuit automatically
switches to the backup battery when a power failure condition is detected (see
Section 8.6.1). Accurate timekeeping is maintained even when the main power supply is
interrupted.
A battery low detection circuit monitors the status of the battery (see Section 8.6.2). When
the battery voltage drops below a certain threshold value, a flag is set to indicate that the
battery must be replaced soon. This ensures the integrity of the data during periods of
battery backup.
8.1 Register overview
The PCF2127 contains an auto-incrementing address register: the built-in address
register will increment automatically after each read or write of a data byte up to the
register 1Bh. After register 1Bh, the auto-incrementing will wrap around to address 00h
(see Figure 5).
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Fig 5.
Handling address registers
• The first three registers (memory address 00h, 01h, and 02h) are used as control
registers (see Section 8.2).
• The memory addresses 03h through to 09h are used as counters for the clock
function (seconds up to years). The date is automatically adjusted for months with
fewer than 31 days, including corrections for leap years. The clock can operate in
12-hour mode with an AM/PM indication or in 24-hour mode (see Section 8.9).
• The registers at addresses 0Ah through 0Eh define the alarm function. It can be
selected that an interrupt is generated when an alarm event occurs (see
Section 8.10).
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
• The register at address 0Fh defines the temperature measurement period and the
clock out mode. The temperature measurement can be selected from every 4 minutes
(default) down to every 30 seconds (see Table 14). CLKOUT frequencies of
32.768 kHz (default) down to 1 Hz for use as system clock, microcontroller clock, and
so on, can be chosen (see Table 15).
• The registers at addresses 10h and 11h are used for the watchdog and countdown
timer functions. The watchdog timer has four selectable source clocks allowing for
timer periods from less than 1 ms to greater than 4 hours (see Table 58). Either the
watchdog timer or the countdown timer can be enabled (see Section 8.11). For the
watchdog timer, it is possible to select whether an interrupt or a pulse on the reset pin
is generated when the watchdog times out. For the countdown timer, it is only
possible that an interrupt is generated at the end of the countdown.
• The registers at addresses 12h to 18h are used for the timestamp function. When the
trigger event happens, the actual time is saved in the timestamp registers (see
Section 8.12).
• The register at address 19h is used for the correction of the crystal aging effect (see
Section 8.4.1).
• The registers at addresses 1Ah and 1Bh define the RAM address. The register at
address 1Ch (RAM_wrt_cmd) is the RAM write command; register 1Dh
(RAM_rd_cmd) is the RAM read command. Data is transferred to or from the RAM by
the serial interface (see Section 8.5).
• The registers Seconds, Minutes, Hours, Days, Months, and Years are all coded in
Binary Coded Decimal (BCD) format to simplify application use. Other registers are
either bit-wise or standard binary.
When one of the RTC registers is written or read, the content of all counters is temporarily
frozen. This prevents a faulty writing or reading of the clock and calendar during a carry
condition (see Section 8.9.8).
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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NXP Semiconductors
PCF2127
Product data sheet
Table 5.
Register overview
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as T must always be written with logic 0. Bits labeled as X are undefined at
power-on and unchanged by subsequent resets.
Address
Register name
Bit
7
6
5
4
3
2
1
0
Reset value
Reference
Control registers
00h
Control_1
EXT_
TEST
T
STOP
TSF1
POR_
OVRD
12_24
MI
SI
0000 1000
Table 7 on page 10
01h
Control_2
MSF
WDTF
TSF2
AF
CDTF
TSIE
AIE
CDTIE
0000 0000
Table 9 on page 11
02h
Control_3
BTSE
BF
BLF
BIE
BLIE
0000 0000
Table 11 on page 12
PWRMNG[2:0]
Time and date registers
Seconds
OSF
SECONDS (0 to 59)
1XXX XXXX
Table 28 on page 30
04h
Minutes
-
MINUTES (0 to 59)
- XXX XXXX
Table 31 on page 31
05h
Hours
-
-
- - XX XXXX
Table 33 on page 32
06h
Days
-
-
07h
Weekdays
-
-
-
08h
Months
-
-
-
09h
Years
AMPM
HOURS (1 to 12) in 12-hour mode
HOURS (0 to 23) in 24-hour mode
- - XX XXXX
DAYS (1 to 31)
- - XX XXXX
Table 35 on page 32
- - - - - XXX
Table 37 on page 33
- - - X XXXX
Table 40 on page 34
YEARS (0 to 99)
XXXX XXXX
Table 43 on page 35
-
-
WEEKDAYS (0 to 6)
MONTHS (1 to 12)
Alarm registers
0Ah
Second_alarm
AE_S
SECOND_ALARM (0 to 59)
1XXX XXXX
Table 45 on page 38
0Bh
Minute_alarm
AE_M
MINUTE_ALARM (0 to 59)
1XXX XXXX
Table 47 on page 38
0Ch
Hour_alarm
AE_H
1 - XX XXXX
Table 49 on page 39
-
Day_alarm
AE_D
-
0Eh
Weekday_alarm
AE_W
-
HOUR_ALARM (1 to 12) in 12-hour mode
HOUR_ALARM (0 to 23) in 24-hour mode
1 - XX XXXX
DAY_ALARM (1 to 31)
1 - XX XXXX
Table 51 on page 39
-
-
-
WEEKDAY_ALARM (0 to 6)
1 - - - - XXX
Table 53 on page 40
TCR[1:0]
OTPR
-
-
COF[2:0]
00X - - 000
Table 13 on page 12
WD_CD[1:0]
TI_TP
-
-
000 - - - 11
Table 55 on page 41
XXXX XXXX
Table 57 on page 42
00 - X XXXX
Table 68 on page 50
CLKOUT control register
0Fh
CLKOUT_ctl
watchdog registers
10h
Watchdg_tim_ctl
11h
Watchdg_tim_val
-
WATCHDG_TIM_VAL[7:0]
TF[1:0]
Timestamp registers
12h
Timestp_ctl
TSM
TSOFF
-
1_O_16_TIMESTP[4:0]
PCF2127
8 of 100
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0Dh
AMPM
Accurate RTC with integrated quartz crystal for industrial applications
Rev. 8 — 19 December 2014
All information provided in this document is subject to legal disclaimers.
03h
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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Register name
Bit
13h
Sec_timestp
-
14h
Min_timestp
-
15h
Hour_timestp
-
-
16h
Day_timestp
-
-
17h
Mon_timestp
-
-
18h
Year_timestp
7
6
5
Reset value
Reference
SECOND_TIMESTP (0 to 59)
- XXX XXXX
Table 70 on page 50
MINUTE_TIMESTP (0 to 59)
- XXX XXXX
Table 72 on page 51
- - XX XXXX
Table 74 on page 51
4
AMPM
3
2
1
0
HOUR_TIMESTP (1 to 12) in 12-hour mode
Rev. 8 — 19 December 2014
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HOUR_TIMESTP (0 to 23) in 24-hour mode
- - XX XXXX
DAY_TIMESTP (1 to 31)
- - XX XXXX
Table 76 on page 52
- - - X XXXX
Table 78 on page 52
XXXX XXXX
Table 80 on page 52
- - - - 1000
Table 17 on page 14
---- ---0
Table 20 on page 16
-
MONTH_TIMESTP (1 to 12)
YEAR_TIMESTP (0 to 99)
Aging offset register
19h
Aging_offset
-
-
-
-
-
-
-
-
AO[3:0]
RAM registers
1Ah
RAM_addr_MSB
-
-
-
RA8
1Bh
RAM_addr_LSB
0000 0000
Table 22 on page 16
1Ch
RAM_wrt_cmd
X
X
X
X
RA[7:0]
X
X
X
X
XXXX XXXX
Table 23 on page 16
1Dh
RAM_rd_cmd
X
X
X
X
X
X
X
X
XXXX XXXX
Table 24 on page 16
PCF2127
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Address
NXP Semiconductors
PCF2127
Product data sheet
Table 5.
Register overview …continued
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as T must always be written with logic 0. Bits labeled as X are undefined at
power-on and unchanged by subsequent resets.
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8.2 Control registers
The first 3 registers of the PCF2127, with the addresses 00h, 01h, and 02h, are used as
control registers.
8.2.1 Register Control_1
Table 6.
Control_1 - control and status register 1 (address 00h) bit allocation
Bits labeled as T must always be written with logic 0.
Bit
Symbol
7
6
5
4
3
2
1
0
EXT_
TEST
T
STOP
TSF1
POR_
OVRD
12_24
MI
SI
0
0
0
0
1
0
0
0
Reset
value
Table 7.
Control_1 - control and status register 1 (address 00h) bit description
Bits labeled as T must always be written with logic 0.
Bit
Symbol
Value
Description
Reference
7
EXT_TEST
0
normal mode
Section 8.14
1
external clock test mode
6
T
0
unused
-
5
STOP
0
RTC source clock runs
Section 8.15
1
RTC clock is stopped;
RTC divider chain flip-flops are asynchronously
set logic 0;
CLKOUT at 32.768 kHz, 16.384 kHz, or
8.192 kHz is still available
4
TSF1
0
no timestamp interrupt generated
Section 8.12.1
1
flag set when TS input is driven to an intermediate
level between power supply and ground;
flag must be cleared to clear interrupt
3
POR_OVRD
0
Power-On Reset Override (PORO) facility disabled; Section 8.8.2
1
Power-On Reset Override (PORO) sequence
reception enabled
0
24-hour mode selected
1
12-hour mode selected
Table 33,
Table 49,
Table 74
0
minute interrupt disabled
Section 8.13.1
1
minute interrupt enabled
0
second interrupt disabled
1
second interrupt enabled
set logic 0 for normal operation
2
1
0
12_24
MI
SI
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8.2.2 Register Control_2
Table 8.
Control_2 - control and status register 2 (address 01h) bit allocation
Bit
Symbol
7
6
5
4
3
2
1
0
MSF
WDTF
TSF2
AF
CDTF
TSIE
AIE
CDTIE
0
0
0
0
0
0
0
0
Reset
value
Table 9.
Control_2 - control and status register 2 (address 01h) bit description
Bit
Symbol
Value
Description
Reference
7
MSF
0
no minute or second interrupt generated
Section 8.13
1
flag set when minute or second interrupt generated;
flag must be cleared to clear interrupt
6
WDTF
0
no watchdog timer interrupt or reset generated
1
flag set when watchdog timer interrupt or reset
generated;
0
no timestamp interrupt generated
1
flag set when TS input is driven to ground;
0
no alarm interrupt generated
1
flag set when alarm triggered;
0
no countdown timer interrupt generated
1
flag set when countdown timer interrupt generated;
0
no interrupt generated from timestamp flag
1
interrupt generated when timestamp flag set
no interrupt generated from the alarm flag
Section 8.13.4
flag cannot be cleared by command (read-only)
5
TSF2
Section 8.12.1
flag must be cleared to clear interrupt
4
AF
Section 8.10.6
flag must be cleared to clear interrupt
3
CDTF
Section 8.11.4
flag must be cleared to clear interrupt
2
TSIE
1
AIE
0
1
interrupt generated when alarm flag set
0
CDTIE
0
no interrupt generated from countdown timer flag
1
interrupt generated when countdown timer flag set
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
Section 8.13.6
Section 8.13.5
Section 8.13.2
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8.2.3 Register Control_3
Table 10.
Control_3 - control and status register 3 (address 02h) bit allocation
Bit
7
6
Symbol
PWRMNG[2:0]
Reset
value
Table 11.
5
0
0
0
4
3
2
1
0
BTSE
BF
BLF
BIE
BLIE
0
0
0
0
0
Control_3 - control and status register 3 (address 02h) bit description
Bit
Symbol
Value
Description
Reference
7 to 5
PWRMNG[2:0]
see
Table 25
control of the battery switch-over, battery low
detection, and extra power fail detection functions
Section 8.6
4
BTSE
0
no timestamp when battery switch-over occurs
Section 8.12.4
1
time-stamped when battery switch-over occurs
0
no battery switch-over interrupt generated
1
flag set when battery switch-over occurs;
3
BF
Section 8.6.1
and
Section 8.12.4
flag must be cleared to clear interrupt
2
BLF
0
battery status ok;
Section 8.6.2
no battery low interrupt generated
1
battery status low;
flag cannot be cleared by command
1
0
BIE
BLIE
0
no interrupt generated from the battery flag (BF)
1
interrupt generated when BF is set
0
no interrupt generated from battery low flag (BLF)
1
interrupt generated when BLF is set
Section 8.13.7
Section 8.13.8
8.3 Register CLKOUT_ctl
Table 12. CLKOUT_ctl - CLKOUT control register (address 0Fh) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
Symbol
6
5
TCR[1:0]
Reset
value
0
0
4
3
OTPR
-
-
X
-
-
2
1
0
COF[2:0]
0
0
0
Table 13. CLKOUT_ctl - CLKOUT control register (address 0Fh) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Description
7 to 6
TCR[1:0]
see Table 14
temperature measurement period
5
OTPR
0
no OTP refresh
1
OTP refresh performed
4 to 3
-
-
unused
2 to 0
COF[2:0]
see Table 15
CLKOUT frequency selection
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8.3.1 Temperature compensated crystal oscillator
The frequency of tuning fork quartz crystal oscillators is temperature-dependent. In the
PCF2127, the frequency deviation caused by temperature variation is corrected by
adjusting the load capacitance of the crystal oscillator.
The load capacitance is changed by switching between two load capacitance values using
a modulation signal with a programmable duty cycle. In order to compensate the spread of
the quartz parameters every chip is factory calibrated.
The frequency accuracy can be evaluated by measuring the frequency of the square
wave signal available at the output pin CLKOUT. However, the selection of
fCLKOUT = 32.768 kHz (default value) leads to inaccurate measurements. Accurate
frequency measurement occurs when fCLKOUT = 16.384 kHz or lower is selected (see
Table 15).
8.3.1.1
Temperature measurement
The PCF2127 has a temperature sensor circuit used to perform the temperature
compensation of the frequency. The temperature is measured immediately after power-on
and then periodically with a period set by the temperature conversion rate TCR[1:0] in the
register CLKOUT_ctl.
Table 14.
Temperature measurement period
TCR[1:0]
Temperature measurement period
[1]
00
4 min
01
2 min
10
1 min
11
30 seconds
[1]
Default value.
8.3.2 OTP refresh
Each IC is calibrated during production and testing of the device. The calibration
parameters are stored on EPROM cells called One Time Programmable (OTP) cells. It is
recommended to process an OTP refresh once after the power is up and the oscillator is
operating stable. The OTP refresh takes less than 100 ms to complete.
To perform an OTP refresh, bit OTPR has to be cleared (set to logic 0) and then set to
logic 1 again.
8.3.3 Clock output
A programmable square wave is available at pin CLKOUT. Operation is controlled by the
COF[2:0] control bits in register CLKOUT_ctl. Frequencies of 32.768 kHz (default) down
to 1 Hz can be generated for use as system clock, microcontroller clock, charge pump
input, or for calibrating the oscillator.
CLKOUT is an open-drain output and enabled at power-on. When disabled, the output is
high-impedance.
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Table 15.
CLKOUT frequency selection
CLKOUT frequency (Hz)
Typical duty cycle[1]
32768
60 : 40 to 40 : 60
001
16384
50 : 50
010
8192
50 : 50
011
4096
50 : 50
100
2048
50 : 50
101
1024
50 : 50
110
1
50 : 50
111
CLKOUT = high-Z
-
COF[2:0]
[2][3]
000
[1]
Duty cycle definition: % HIGH-level time : % LOW-level time.
[2]
Default value.
[3]
The specified accuracy of the RTC can be only achieved with CLKOUT frequencies not equal to
32.768 kHz or if CLKOUT is disabled.
The duty cycle of the selected clock is not controlled, however, due to the nature of the
clock generation all but the 32.768 kHz frequencies are 50 : 50.
8.4 Register Aging_offset
Table 16. Aging_offset - crystal aging offset register (address 19h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read.
Bit
7
6
5
4
Symbol
-
-
-
-
Reset
value
-
-
-
-
3
2
1
0
0
0
AO[3:0]
1
0
Table 17. Aging_offset - crystal aging offset register (address 19h) bit description
Bit positions labeled as - are not implemented and return 0 when read.
Bit
Symbol
Value
Description
7 to 4
-
-
unused
3 to 0
AO[3:0]
see Table 18
aging offset value
8.4.1 Crystal aging correction
The PCF2127 has an offset register Aging_offset to correct the crystal aging effects2.
The accuracy of the frequency of a quartz crystal depends on its aging. The aging offset
adds an adjustment, positive or negative, in the temperature compensation circuit which
allows correcting the aging effect.
At 25 C, the aging offset bits allow a frequency correction of typically 1 ppm per AO[3:0]
value, from 7 ppm to +8 ppm.
2.
For further information, refer to the application note Ref. 3 “AN11266”.
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Table 18.
Frequency correction at 25C, typical
AO[3:0]
ppm
Decimal
Binary
0
0000
+8
1
0001
+7
2
0010
+6
3
0011
+5
4
0100
+4
5
0101
+3
6
0110
+2
7
0111
+1
[1]
0
8
1000
9
1001
1
10
1010
2
11
1011
3
12
1100
4
13
1101
5
14
1110
6
15
1111
7
[1]
Default value.
8.5 General purpose 512 bytes static RAM
The PCF2127 contains a general purpose 512 bytes static RAM. This integrated SRAM is
battery backed and can therefore be used to store data which is essential for the
application to survive a power outage.
9 bits, RA[8:0], define the RAM address pointer in registers RAM_addr_MSB and
RAM_addr_LSB. The register address pointer increments after each read or write
automatically up to 1Bh and then wraps around to address 00h (see Figure 5 on page 6).
Data is transferred to or from the RAM by the interface. To write to the RAM, the register
RAM_wrt_cmd, to read from the RAM the register RAM_rd_cmd must be addressed
explicitly.
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8.5.1 Register RAM_addr_MSB
Table 19. RAM_addr_MSB - RAM address MSB register (address 1Ah) bit allocation
Bit positions labeled as - are not implemented and return 0 when read.
Bit
7
6
5
4
3
2
1
0
Symbol
-
-
-
-
-
-
-
RA8
Reset
value
-
-
-
-
-
-
-
0
Table 20. RAM_addr_MSB - RAM address MSB register (address 1Ah) bit description
Bit positions labeled as - are not implemented and return 0 when read.
Bit
Symbol
Description
7 to 1
-
unused
0
RA8
RAM address, MSB (9th bit)
8.5.2 Register RAM_addr_LSB
Table 21.
RAM_addr_LSB - RAM address LSB register (address 1Bh) bit allocation
Bit
7
6
5
4
Symbol
Reset
value
Table 22.
3
2
1
0
0
0
0
0
RA[7:0]
0
0
0
0
RAM_addr_LSB - RAM address LSB register (address 1Bh) bit description
Bit
Symbol
Description
7 to 0
RA[7:0]
RAM address, LSB (1st to 8th bit)
8.5.3 Register RAM_wrt_cmd
Table 23.
RAM_wrt_cmd - RAM write command register (address 1Ch) bit description
Bit
Symbol
Description
7 to 0
-
data to be written into RAM
8.5.4 Register RAM_rd_cmd
Table 24.
RAM_rd_cmd - RAM read command register (address 1Dh) bit description
Bit
Symbol
Description
7 to 0
-
data to be read from RAM
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8.5.5 Operation examples
8.5.5.1
Writing to the RAM
1. Set RAM address:
– Select register RAM_addr_MSB (send address 1Ah).
– Set value for bit RA8 (data byte of register 1Ah).
Note: register address will be incremented automatically to 1Bh.
– Set value for array RA[7:0] (data byte of register 1Bh).
2. Send RAM write command:
– Select register RAM_wrt_cmd (send address 1Ch).
3. Write data into the RAM:
– Write n data byte into RAM.
For details, see Figure 46 on page 69.
8.5.5.2
Reading from the RAM
1. Set RAM address:
– Select register RAM_addr_MSB (send address 1Ah).
– Set value for bit RA8 (data byte of register 1Ah).
Note: register address will be incremented automatically to 1Bh.
– Set value for array RA[7:0] (data byte of register 1Bh).
2. Send RAM read command:
– Select register RAM_rd_cmd (send address 1Dh).
3. Read from the RAM:
– Read n data byte from the RAM.
For details, see Figure 47 on page 70.
8.6 Power management functions
The PCF2127 has two power supplies:
VDD — the main power supply
VBAT — the battery backup supply
Internally, the PCF2127 is operating with the internal operating voltage Voper(int) which is
also available as VBBS on the battery backed output voltage pin, BBS. Depending on the
condition of the main power supply and the selected power management function,
Voper(int) is either on the potential of VDD or VBAT (see Section 8.6.4).
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Three power management functions are implemented:
Battery switch-over function. monitoring the main power supply VDD and switching to
VBAT in case a power fail condition is detected (see Section 8.6.1).
Battery low detection function. monitoring the status of the battery, VBAT (see
Section 8.6.2).
Extra power fail detection function. monitoring the voltage at the power fail input pin,
PFI (see Section 8.6.3).
The power management functions are controlled by the control bits PWRMNG[2:0] (see
Table 25) in register Control_3 (see Table 11):
Table 25.
Power management control bit description
PWRMNG[2:0]
Function
[1]
000
battery switch-over function is enabled in standard mode;
battery low detection function is enabled;
extra power fail detection function is enabled
001
battery switch-over function is enabled in standard mode;
battery low detection function is disabled;
extra power fail detection function is enabled
010
battery switch-over function is enabled in standard mode;
battery low detection function is disabled;
extra power fail detection function is disabled
011
battery switch-over function is enabled in direct switching mode;
battery low detection function is enabled;
extra power fail detection function is enabled
100
battery switch-over function is enabled in direct switching mode;
battery low detection function is disabled;
extra power fail detection function is enabled
101
battery switch-over function is enabled in direct switching mode;
battery low detection function is disabled;
extra power fail detection function is disabled
[2]
110
battery switch-over function is disabled - only one power supply
(VDD);
battery low detection function is disabled;
extra power fail detection function is enabled
[2]
111
battery switch-over function is disabled - only one power supply
(VDD);
battery low detection function is disabled;
extra power fail detection function is disabled
PCF2127
Product data sheet
[1]
Default value.
[2]
When the battery switch-over function is disabled, the PCF2127 works only with the power supply VDD.
VBAT must be put to ground and the battery low detection function is disabled.
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8.6.1 Battery switch-over function
The PCF2127 has a backup battery switch-over circuit which monitors the main power
supply VDD. When a power failure condition is detected, it automatically switches to the
backup battery.
One of two operation modes can be selected:
Standard mode — the power failure condition happens when:
VDD < VBAT AND VDD < Vth(sw)bat
Vth(sw)bat is the battery switch threshold voltage. Typical value is 2.5 V. The battery
switch-over in standard mode works only for VDD > 2.5 V
Direct switching mode — the power failure condition happens when VDD < VBAT. Direct
switching from VDD to VBAT without requiring VDD to drop below Vth(sw)bat
When a power failure condition occurs and the power supply switches to the battery, the
following sequence occurs:
1. The battery switch flag BF (register Control_3) is set logic 1.
2. An interrupt is generated if the control bit BIE (register Control_3) is enabled
(see Section 8.13.7).
3. If the control bit BTSE (register Control_3) is logic 1, the timestamp registers store the
time and date when the battery switch occurred (see Section 8.12.4).
4. The battery switch flag BF is cleared by command; it must be cleared to clear the
interrupt.
The interface is disabled in battery backup operation:
• Interface inputs are not recognized, preventing extraneous data being written to the
device
• Interface outputs are high-impedance
For further information about I2C-bus communication and battery backup operation, see
Section 9.3 on page 70.
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8.6.1.1
Standard mode
If VDD > VBAT OR VDD > Vth(sw)bat: Voper(int) is at VDD potential.
If VDD < VBAT AND VDD < Vth(sw)bat: Voper(int) is at VBAT potential.
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Vth(sw)bat is the battery switch threshold voltage. Typical value is 2.5 V. In standard mode, the
battery switch-over works only for VDD > 2.5 V.
VDD may be lower than VBAT (for example VDD = 3 V, VBAT = 4.1 V).
Fig 6.
PCF2127
Product data sheet
Battery switch-over behavior in standard mode with bit BIE set logic 1 (enabled)
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8.6.1.2
Direct switching mode
If VDD > VBAT: Voper(int) is at VDD potential.
If VDD < VBAT: Voper(int) is at VBAT potential.
The direct switching mode is useful in systems where VDD is always higher than VBAT.
This mode is not recommended if the VDD and VBAT values are similar (for example,
VDD = 3.3 V, VBAT 3.0 V). In direct switching mode, the power consumption is reduced
compared to the standard mode because the monitoring of VDD and Vth(sw)bat is not
performed.
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Fig 7.
8.6.1.3
Battery switch-over behavior in direct switching mode with bit BIE set logic 1
(enabled)
Battery switch-over disabled: only one power supply (VDD)
When the battery switch-over function is disabled:
•
•
•
•
PCF2127
Product data sheet
The power supply is applied on the VDD pin
The VBAT pin must be connected to ground
Voper(int) is at VDD potential
The battery flag (BF) is always logic 0
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8.6.1.4
Battery switch-over architecture
The architecture of the battery switch-over circuit is shown in Figure 8.
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Fig 8.
Battery switch-over circuit, simplified block diagram
Voper(int) is at VDD or VBAT potential.
Remark: It has to be assured that there are decoupling capacitors on the pins VDD, VBAT,
and BBS.
8.6.2 Battery low detection function
The PCF2127 has a battery low detection circuit which monitors the status of the battery
VBAT.
When VBAT drops below the threshold value Vth(bat)low (typically 2.5 V), the BLF flag
(register Control_3) is set to indicate that the battery is low and that it must be replaced.
Monitoring of the battery voltage also occurs during battery operation.
An unreliable battery cannot prevent that the supply voltage drops below Vlow (typical
1.2 V) and with that the data integrity gets lost. (For further information about Vlow see
Section 8.7.)
When VBAT drops below the threshold value Vth(bat)low, the following sequence occurs (see
Figure 9):
1. The battery low flag BLF is set logic 1.
2. An interrupt is generated if the control bit BLIE (register Control_3) is enabled
(see Section 8.13.8).
3. The flag BLF remains logic 1 until the battery is replaced. BLF cannot be cleared by
command. It is automatically cleared by the battery low detection circuit when the
battery is replaced or when the voltage rises again above the threshold value. This
could happen if a super capacitor is used as a backup source and the main power is
applied again.
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Fig 9.
Battery low detection behavior with bit BLIE set logic 1 (enabled)
8.6.3 Extra power fail detection function
The PCF2127 has an extra power fail detection circuit which compares the voltage at the
power fail input pin PFI to an internal reference voltage equal to 1.25 V.
If VPFI < 1.25 V, the power fail output PFO is driven LOW. PFO is an open-drain, active
LOW output which requires an external pull-up resistor in any application.
The extra power fail detection function is typically used as a low voltage detection for the
main power supply VDD (see Figure 10).
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Usually R1 and R2 should be chosen such that the voltage at pin PFI
• is higher than 1.25 V at start-up
• falls below 1.25 V when VDD falls below a desired threshold voltage, Vth(uvp), defined
by Equation 1:
R
V th uvp = -----1- + 1 1.25V
R
2
(1)
Vth(uvp) value is usually set to a value that there are several milliseconds before VDD falls
below the minimum operating voltage of the system, in order to allow the microcontroller
to perform early backup operations, like terminating the communication with the
PCF2127.
The value of C is determined from Equation 2:
0.02 As
C = --------------------- ----- R 1 //R 2 V
(2)
If the extra power fail detection function is not used, pin PFI must be connected to VSS and
pin PFO must be left open circuit.
8.6.3.1
Extra power fail detection when the battery switch-over function is enabled
• When the power switches to the backup battery supply VBAT, the power fail
comparator is switched off and the power fail output at pin PFO goes (or remains)
LOW
• When the power switches back to the main VDD, the pin PFO is not driven LOW
anymore. It is pulled HIGH through the external pull-up resistance for a certain time
(trec = 15.63 ms to 31.25 ms). Then the power fail comparator is enabled again
For illustration, see Figure 11 and Figure 12.
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Accurate RTC with integrated quartz crystal for industrial applications
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Fig 11. PFO signal behavior when battery switch-over is enabled in standard mode and
Vth(uvp) > (VBAT, Vth(sw)bat)
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Fig 12. PFO signal behavior when battery switch-over is enabled in direct switching
mode and Vth(uvp) < VBAT
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8.6.3.2
Extra power fail detection when the battery switch-over function is disabled
If the battery switch-over function is disabled and the power fail comparator is enabled,
the power fail output at pin PFO depends only on the result of the comparison between
VPFI and 1.25 V:
• If VPFI > 1.25 V, PFO = HIGH (through the external pull-up resistor)
• If VPFI < 1.25 V, PFO = LOW
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Fig 13. PFO signal behavior when battery switch-over is disabled
8.6.4 Battery backup supply
The VBBS voltage on the output pin BBS is at the same potential as the internal operating
voltage Voper(int), depending on the selected battery switch-over function mode:
Table 26.
Output pin BBS
Battery switch-over function
mode
Conditions
Potential of
Voper(int) and
VBBS
standard
VDD > VBAT OR VDD > Vth(sw)bat
VDD
VDD < VBAT AND VDD < Vth(sw)bat
VBAT
direct switching
VDD > VBAT
VDD
VDD < VBAT
VBAT
disabled
only VDD available,
VBAT must be put to ground
VDD
The output pin BBS can be used as a supply for external devices with battery backup
needs, such as SRAM (see Ref. 3 “AN11266”). For this case, Figure 14 shows the typical
driving capability when VBBS is driven from VDD.
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Fig 14. Typical driving capability of VBBS: (VBBS VDD) with respect to the output load
current IBBS
8.7 Oscillator stop detection function
The PCF2127 has an on-chip oscillator detection circuit which monitors the status of the
oscillation: whenever the oscillation stops, a reset occurs and the oscillator stop flag OSF
(in register Seconds) is set logic 1.
• Power-on:
a. The oscillator is not running, the chip is in reset (OSF is logic 1).
b. When the oscillator starts running and is stable after power-on, the chip exits from
reset.
c. The flag OSF is still logic 1 and can be cleared (OSF set logic 0) by command.
• Power supply failure:
a. When the power supply of the chip drops below a certain value (Vlow), typically
1.2 V, the oscillator stops running and a reset occurs.
b. When the power supply returns to normal operation, the oscillator starts running
again, the chip exits from reset.
c. The flag OSF is still logic 1 and can be cleared (OSF set logic 0) by command.
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(1) Theoretical state of the signals since there is no power.
(2) The oscillator stop flag (OSF), set logic 1, indicates that the oscillation has stopped and a reset has
occurred since the flag was last cleared (OSF set logic 0). In this case, the integrity of the clock
information is not guaranteed. The OSF flag is cleared by command.
Fig 15. Power failure event due to battery discharge: reset occurs
8.8 Reset function
The PCF2127 has a Power-On Reset (POR) and a Power-On Reset Override (PORO)
function implemented.
8.8.1 Power-On Reset (POR)
The POR is active whenever the oscillator is stopped. The oscillator is considered to be
stopped during the time between power-on and stable crystal resonance (see Figure 16).
This time may be in the range of 200 ms to 2 s depending on temperature and supply
voltage. Whenever an internal reset occurs, the oscillator stop flag is set (OSF set
logic 1).
The OTP refresh (see Section 8.3.2 on page 13) should ideally be executed as the first
instruction after start-up and also after a reset due to an oscillator stop.
PCF2127
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Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 16. Dependency between POR and oscillator
After POR, the following mode is entered:
•
•
•
•
•
•
32.768 kHz CLKOUT active
Power-On Reset Override (PORO) available to be set
24-hour mode is selected
Battery switch-over is enabled
Battery low detection is enabled
Extra power fail detection is enabled
The register values after power-on are shown in Table 5 on page 8.
8.8.2 Power-On Reset Override (PORO)
The POR duration is directly related to the crystal oscillator start-up time. Due to the long
start-up times experienced by these types of circuits, a mechanism has been built in to
disable the POR and therefore speed up the on-board test of the device.
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Fig 17. Power-On Reset (POR) system
The setting of the PORO mode requires that POR_OVRD in register Control_1 is set
logic 1 and that the signals at the interface pins SDA/CE and SCL are toggled as
illustrated in Figure 18. All timings shown are required minimum.
PCF2127
Product data sheet
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NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 18. Power-On Reset Override (PORO) sequence, valid for both I2C-bus and SPI-bus
Once the override mode is entered, the device is immediately released from the reset
state and the set-up operation can commence.
The PORO mode is cleared by writing logic 0 to POR_OVRD. POR_OVRD must be
logic 1 before a re-entry into the override mode is possible. Setting POR_OVRD logic 0
during normal operation has no effect except to prevent accidental entry into the PORO
mode.
8.9 Time and date function
Most of these registers are coded in the Binary Coded Decimal (BCD) format.
8.9.1 Register Seconds
Table 27. Seconds - seconds and clock integrity register (address 03h) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
7
Symbol
6
5
4
OSF
Reset
value
1
3
2
1
0
X
X
X
SECONDS (0 to 59)
X
X
X
X
Table 28. Seconds - seconds and clock integrity register (address 03h) bit description
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
7
OSF
Value
Place value Description
0
-
clock integrity is guaranteed
1
-
clock integrity is not guaranteed:
oscillator has stopped and chip reset has occurred
since flag was last cleared
6 to 4
SECONDS
3 to 0
PCF2127
Product data sheet
0 to 5
ten’s place
0 to 9
unit place
actual seconds coded in BCD format
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Accurate RTC with integrated quartz crystal for industrial applications
Table 29.
Seconds coded in BCD format
Seconds
value in
decimal
Upper-digit (ten’s place)
Digit (unit place)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
00
0
0
0
0
0
0
0
01
0
0
0
0
0
0
1
02
0
0
0
0
0
1
0
:
:
:
:
:
:
:
:
09
0
0
0
1
0
0
1
10
0
0
1
0
0
0
0
:
:
:
:
:
:
:
:
58
1
0
1
1
0
0
0
59
1
0
1
1
0
0
1
8.9.2 Register Minutes
Table 30. Minutes - minutes register (address 04h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
Symbol
-
Reset
value
-
6
5
4
3
2
1
0
X
X
X
MINUTES (0 to 59)
X
X
X
X
Table 31. Minutes - minutes register (address 04h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
-
-
-
unused
6 to 4
MINUTES
0 to 5
ten’s place
actual minutes coded in BCD format
0 to 9
unit place
3 to 0
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Accurate RTC with integrated quartz crystal for industrial applications
8.9.3 Register Hours
Table 32. Hours - hours register (address 05h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
5
Symbol
-
-
AMPM
4
3
2
1
0
HOURS (1 to 12) in 12-hour mode
HOURS (0 to 23) in 24-hour mode
Reset
value
-
-
X
X
X
X
X
X
Table 33. Hours - hours register (address 05h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 6
-
-
-
unused
-
indicates AM
12-hour
mode[1]
5
AMPM
0
1
-
indicates PM
4
HOURS
0 to 1
ten’s place
0 to 9
unit place
actual hours coded in BCD format when in 12-hour
mode
0 to 2
ten’s place
0 to 9
unit place
3 to 0
24-hour
mode[1]
5 to 4
HOURS
3 to 0
[1]
actual hours coded in BCD format when in 24-hour
mode
Hour mode is set by the bit 12_24 in register Control_1 (see Table 7).
8.9.4 Register Days
Table 34. Days - days register (address 06h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
Symbol
-
-
Reset
value
-
-
Table 35.
5
4
3
2
X
X
X
X
0
X
X
Days - days register (address 06h) bit description
Bit
Symbol
Value
Place value Description
7 to 6
-
-
-
unused
5 to 4
DAYS[1]
0 to 3
ten’s place
actual day coded in BCD format
0 to 9
unit place
3 to 0
[1]
1
DAYS (1 to 31)
If the year counter contains a value which is exactly divisible by 4, including the year 00, the RTC compensates for leap years by adding
a 29th day to February.
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Accurate RTC with integrated quartz crystal for industrial applications
8.9.5 Register Weekdays
Table 36. Weekdays - weekdays register (address 07h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
5
4
3
Symbol
-
-
-
-
-
Reset
value
-
-
-
-
-
2
1
0
WEEKDAYS (0 to 6)
X
X
X
Table 37. Weekdays - weekdays register (address 07h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Description
7 to 3
-
-
unused
2 to 0
WEEKDAYS
0 to 6
actual weekday value, see Table 38
Although the association of the weekdays counter to the actual weekday is arbitrary, the
PCF2127 assumes that Sunday is 000 and Monday is 001 for the purpose of determining
the increment for calendar weeks.
Table 38.
Weekday assignments
Day[1]
2
1
0
Sunday
0
0
0
Monday
0
0
1
Tuesday
0
1
0
Wednesday
0
1
1
Thursday
1
0
0
Friday
1
0
1
Saturday
1
1
0
[1]
PCF2127
Product data sheet
Bit
Definition may be reassigned by the user.
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Accurate RTC with integrated quartz crystal for industrial applications
8.9.6 Register Months
Table 39. Months - months register (address 08h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
5
Symbol
-
-
-
Reset
value
-
-
-
4
3
2
1
0
X
X
MONTHS (1 to 12)
X
X
X
Table 40. Months - months register (address 08h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 5
-
-
-
unused
4
MONTHS
0 to 1
ten’s place
actual month coded in BCD format, see Table 41
0 to 9
unit place
3 to 0
Table 41.
Month
PCF2127
Product data sheet
Month assignments in BCD format
Upper-digit
(ten’s place)
Digit (unit place)
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
January
0
0
0
0
1
February
0
0
0
1
0
March
0
0
0
1
1
April
0
0
1
0
0
May
0
0
1
0
1
June
0
0
1
1
0
July
0
0
1
1
1
August
0
1
0
0
0
September
0
1
0
0
1
October
1
0
0
0
0
November
1
0
0
0
1
December
1
0
0
1
0
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Accurate RTC with integrated quartz crystal for industrial applications
8.9.7 Register Years
Table 42. Years - years register (address 09h) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
7
6
5
X
X
X
Symbol
4
3
2
1
0
X
X
X
YEARS (0 to 99)
Reset
value
X
X
Table 43. Years - years register (address 09h) bit description
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 4
YEARS
0 to 9
ten’s place
0 to 9
unit place
3 to 0
actual year coded in BCD format
8.9.8 Setting and reading the time
Figure 19 shows the data flow and data dependencies starting from the 1 Hz clock tick.
During read/write operations, the time counting circuits (memory locations 03h through
09h) are blocked.
This prevents
• Faulty reading of the clock and calendar during a carry condition
• Incrementing the time registers during the read cycle
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Fig 19. Data flow of the time function
After this read/write access is completed, the time circuit is released again. Any pending
request to increment the time counters that occurred during the read/write access is
serviced. A maximum of 1 request can be stored; therefore, all accesses must be
completed within 1 second (see Figure 20).
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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35 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 20. Access time for read/write operations
As a consequence of this method, it is very important to make a read or write access in
one go. That is, setting or reading seconds through to years should be made in one single
access. Failing to comply with this method could result in the time becoming corrupted.
As an example, if the time (seconds through to hours) is set in one access and then in a
second access the date is set, it is possible that the time may increment between the two
accesses. A similar problem exists when reading. A roll-over may occur between reads
thus giving the minutes from one moment and the hours from the next. Therefore it is
advised to read all time and date registers in one access.
PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
8.10 Alarm function
When one or more of the alarm bit fields are loaded with a valid second, minute, hour, day,
or weekday and its corresponding alarm enable bit (AE_x) is logic 0, then that information
is compared with the actual second, minute, hour, day, and weekday (see Figure 21).
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(1) Only when all enabled alarm settings are matching.
Fig 21. Alarm function block diagram
The generation of interrupts from the alarm function is described in Section 8.13.5.
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Accurate RTC with integrated quartz crystal for industrial applications
8.10.1 Register Second_alarm
Table 44. Second_alarm - second alarm register (address 0Ah) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
7
5
4
X
X
X
AE_S
Reset
value
Table 45.
6
1
3
2
1
0
X
X
SECOND_ALARM (0 to 59)
X
X
Second_alarm - second alarm register (address 0Ah) bit description
Bit
Symbol
Value
Place value Description
7
AE_S
0
-
second alarm is enabled
1
-
second alarm is disabled
0 to 5
ten’s place
second alarm information coded in BCD format
0 to 9
unit place
6 to 4
SECOND_ALARM
3 to 0
8.10.2 Register Minute_alarm
Table 46. Minute_alarm - minute alarm register (address 0Bh) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
7
6
5
4
AE_M
Reset
value
1
3
2
1
0
X
X
MINUTE_ALARM (0 to 59)
X
X
X
X
X
Table 47. Minute_alarm - minute alarm register (address 0Bh) bit description
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
AE_M
0
-
minute alarm is enabled
1
-
minute alarm is disabled
0 to 5
ten’s place
minute alarm information coded in BCD format
0 to 9
unit place
6 to 4
MINUTE_ALARM
3 to 0
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NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8.10.3 Register Hour_alarm
Table 48. Hour_alarm - hour alarm register (address 0Ch) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
7
6
5
AE_H
-
AMPM
4
3
2
1
0
HOUR_ALARM (1 to 12) in 12-hour mode
HOUR_ALARM (0 to 23) in 24-hour mode
Reset
value
1
-
X
X
X
X
X
X
Table 49. Hour_alarm - hour alarm register (address 0Ch) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
AE_H
0
-
hour alarm is enabled
1
-
hour alarm is disabled
-
-
unused
0
-
indicates AM
1
-
indicates PM
0 to 1
ten’s place
0 to 9
unit place
hour alarm information coded in BCD format when in
12-hour mode
0 to 2
ten’s place
0 to 9
unit place
6
-
12-hour
5
mode[1]
AMPM
4
HOUR_ALARM
3 to 0
24-hour mode[1]
5 to 4
HOUR_ALARM
3 to 0
[1]
hour alarm information coded in BCD format when in
24-hour mode
Hour mode is set by the bit 12_24 in register Control_1.
8.10.4 Register Day_alarm
Table 50. Day_alarm - day alarm register (address 0Dh) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
7
6
AE_D
-
1
-
Reset
value
5
4
3
2
1
0
X
X
DAY_ALARM (1 to 31)
X
X
X
X
Table 51. Day_alarm - day alarm register (address 0Dh) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
AE_D
0
-
day alarm is enabled
1
-
day alarm is disabled
6
-
-
-
unused
5 to 4
DAY_ALARM
0 to 3
ten’s place
day alarm information coded in BCD format
0 to 9
unit place
3 to 0
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Accurate RTC with integrated quartz crystal for industrial applications
8.10.5 Register Weekday_alarm
Table 52. Weekday_alarm - weekday alarm register (address 0Eh) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
7
6
5
4
3
2
AE_W
-
-
-
-
WEEKDAY_ALARM (0 to 6)
1
-
-
-
-
X
Reset
value
1
X
0
X
Table 53. Weekday_alarm - weekday alarm register (address 0Eh) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Description
7
AE_W
0
weekday alarm is enabled
1
weekday alarm is disabled
6 to 3
-
-
unused
2 to 0
WEEKDAY_ALARM
0 to 6
weekday alarm information
8.10.6 Alarm flag
When all enabled comparisons first match, the alarm flag AF (register Control_2) is set.
AF remains set until cleared by command. Once AF has been cleared, it will only be set
again when the time increments to match the alarm condition once more. For clearing the
flags, see Section 8.11.6
Alarm registers which have their alarm enable bit AE_x at logic 1 are ignored.
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Example where only the minute alarm is used and no other interrupts are enabled.
Fig 22. Alarm flag timing diagram
8.11 Timer functions
The PCF2127 has two different timer functions, a watchdog timer and a countdown timer.
The timers can be selected by using the control bits WD_CD[1:0] in the register
Watchdg_tim_ctl.
• The watchdog timer has four selectable source clocks. It can, for example, be used to
detect a microcontroller with interrupt and reset capability which is out of control (see
Section 8.11.3)
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Accurate RTC with integrated quartz crystal for industrial applications
• The countdown timer has four selectable source clocks allowing for countdown
periods from less than 1 ms to more than 4 hours (see Section 8.11.4)
To control the timer functions and timer output, the registers Control_2, Watchdg_tim_ctl,
and Watchdg_tim_val are used.
8.11.1 Register Watchdg_tim_ctl
Table 54. Watchdg_tim_ctl - watchdog timer control register (address 10h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read.
Bit
7
Symbol
6
WD_CD[1:0]
Reset
value
0
0
5
4
3
2
TI_TP
-
-
-
0
-
-
-
1
0
TF[1:0]
1
1
Table 55. Watchdg_tim_ctl - watchdog timer control register (address 10h) bit description
Bit positions labeled as - are not implemented and return 0 when read.
Bit
Symbol
Value
Description
7 to 6
WD_CD[1:0]
00
Watchdog timer disabled;
countdown timer disabled
01
watchdog timer disabled;
countdown timer enabled
if CDTIE is set logic 1, the interrupt pin INT is
activated when the countdown timed out
10
watchdog timer enabled;
the interrupt pin INT is activated when timed out;
countdown timer not available
11
watchdog timer enabled;
the reset pin RST is activated when timed out;
countdown timer not available
5
TI_TP
4 to 2
-
1 to 0
TF[1:0]
PCF2127
Product data sheet
0
the interrupt pin INT is configured to generate a
permanent active signal when MSF and/or CDTF is
set
1
the interrupt pin INT is configured to generate a
pulsed signal when MSF flag and/or CDTF flag is set
(see Figure 27)
-
unused
timer source clock for watchdog and countdown timer
00
4.096 kHz
01
64 Hz
10
1 Hz
11
1⁄
60
Hz
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8.11.2 Register Watchdg_tim_val
Table 56. Watchdg_tim_val - watchdog timer value register (address 11h) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
7
6
5
X
X
X
4
Symbol
3
2
1
0
X
X
X
WATCHDG_TIM_VAL[7:0]
Reset
value
X
X
Table 57. Watchdg_tim_val - watchdog timer value register (address 11h) bit description
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
Value
Description
7 to 0
WATCHDG_TIM_
VAL[7:0]
00 to FF
timer period in seconds:
n
TimerPeriod = -------------------------------------------------------------SourceClockFrequency
where n is the timer value
Table 58.
Programmable watchdog timer
TF[1:0] Timer source
clock frequency
Units
Minimum timer
period (n = 1)
Units
Maximum timer
period (n = 255)
Units
00
4.096
kHz
244
s
62.256
ms
01
64
Hz
15.625
ms
3.984
s
10
1
Hz
1
s
255
s
11
1⁄
60
Hz
60
s
15300
s
8.11.3 Watchdog timer function
The watchdog timer function is enabled or disabled by the WD_CD[1:0] bits of the register
Watchdg_tim_ctl (see Table 55).
The two bits TF[1:0] in register Watchdg_tim_ctl determine one of the four source clock
frequencies for the watchdog timer: 4.096 kHz, 64 Hz, 1 Hz, or 1⁄60 Hz (see Table 58).
When the watchdog timer function is enabled, the 8-bit timer in register Watchdg_tim_val
determines the watchdog timer period (see Table 58).
The watchdog timer counts down from the software programmed 8-bit binary value n in
register Watchdg_tim_val. When the counter reaches 1, the watchdog timer flag WDTF
(register Control_2) is set logic 1.
If WDTF is logic 1 and:
• if WD_CD[1:0] = 10 an interrupt will be generated
• if WD_CD[1:0] = 11 a reset will be generated
The counter does not automatically reload.
When WD_CD[1:0] = 10 or WD_CD[1:0] = 11 and the Microcontroller Unit (MCU) loads a
watchdog timer value n:
• the flag WDTF is reset
• INT or RST is cleared
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• the watchdog timer starts again
Loading the counter with 0 will:
• reset the flag WDTF
• clear INT or RST
• stop the watchdog timer
Remark: WDTF is read only and cannot be cleared by command. WDTF can be cleared
by:
• loading a value in register Watchdg_tim_val
• reading of the register Control_2
Writing a logic 0 or logic 1 to WDTF has no effect.
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Counter reached 1, WDTF is logic 1, and an interrupt is generated.
Fig 23. WD_CD[1:0] = 10: watchdog activates an interrupt when timed out
• When the watchdog timer counter reaches 1, the watchdog timer flag WDTF is set
logic 1
• When a minute or second interrupt occurs, the minute/second flag MSF is set logic 1
(see Section 8.13.1)
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Counter reached 1, WDTF is set logic 1, reset pulse on the RST pin is generated for a time equal
to tw(rst).
Fig 24. WD_CD[1:0] = 11: watchdog activates a reset pulse when timed out
Table 59.
Specification of tw(rst)
WD_CD[1:0]
TF[1:0]
tw(rst)
11
00
244 s
01
15.625 ms
10
15.625 ms
11
15.625 ms
8.11.4 Countdown timer function
The countdown timer function is controlled by the WD_CD[1:0] bits in register
Watchdg_tim_ctl (see Table 55).
The timer counts down from the software programmed 8-bit binary value n in register
Watchdg_tim_val. When the counter reaches 1
• the countdown timer flag CDTF is set
• the counter automatically reloads
• and the next time period starts
Loading the counter with 0 effectively stops the timer.
Reading the timer returns the actual value of the countdown counter.
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Accurate RTC with integrated quartz crystal for industrial applications
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In this example, it is assumed that the countdown timer flag (CDTF) is cleared before the next
countdown period expires and that INT is set to pulsed mode.
Fig 25. General countdown timer behavior
If a new value of n is written before the end of the actual timer period, this value takes
immediate effect. It is not recommended to change n without first disabling the counter by
setting WD_CD[1:0] = 00. The update of n is asynchronous to the timer clock. Therefore
changing it on the fly could result in a corrupted value loaded into the countdown counter.
This can result in an undetermined countdown period for the first period. The countdown
value n will, however, be correctly stored and correctly loaded on subsequent timer
periods.
If this mode is enabled and the countdown timer flag CDTF is set, an interrupt signal on
INT will be generated. See Section 8.13.2 for details on how the interrupt can be
controlled.
When starting the countdown timer for the first time, only the first period will not have a
fixed duration. The amount of inaccuracy for the first timer period depends on the chosen
source clock, see Table 60.
Table 60.
First period delay for timer counter
Timer source clock
Minimum timer period
Maximum timer period
4.096 kHz
n
n+1
64 Hz
n
n+1
1 Hz
(n 1) + 1⁄64 Hz
n + 1⁄64 Hz
1⁄
60
(n 1) +
n + 1⁄64 Hz
Hz
1⁄
64 Hz
At the end of every countdown, the timer sets the countdown timer flag (CDTF). CDTF
may only be cleared by command. The asserted CDTF can be used to generate an
interrupt (INT). The interrupt may be generated as a pulsed signal every countdown
period or as a permanently active signal which follows the condition of CDTF. TI_TP is
used to control this mode selection. The interrupt output may be disabled with the CDTIE
bit, see Table 9.
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When reading the timer, the actual countdown value is returned and not the initial value n.
Since it is not possible to freeze the countdown timer counter during read back, it is
recommended to read the register twice and check for consistent results.
8.11.5 Pre-defined timers: second and minute interrupt
PCF2127 has two pre-defined timers which are used to generate an interrupt either once
per second or once per minute (see Section 8.13.1). The pulse generator for the minute or
second interrupt operates from an internal 64 Hz clock. It is independent of the watchdog
or countdown timers. Each of these timers can be enabled by the bits SI (second interrupt)
and MI (minute interrupt) in register Control_1.
8.11.6 Clearing flags
The flags MSF, CDTF, AF and TSFx can be cleared by command. To prevent one flag
being overwritten while clearing another, a logic AND is performed during the write
access. A flag is cleared by writing logic 0 while a flag is not cleared by writing logic 1.
Writing logic 1 results in the flag value remaining unchanged.
Four examples are given for clearing the flags. Clearing the flags is made by a write
command:
• Bits labeled with - must be written with their previous values
• WDTF is read only and has to be written with logic 0
Repeatedly rewriting these bits has no influence on the functional behavior.
Table 61.
Register
Control_2
Table 62.
Register
Control_2
Flag location in register Control_2
Bit
7
6
5
4
3
2
1
0
MSF
WDTF
TSF2
AF
CDTF
-
-
-
Example values in register Control_2
Bit
7
6
5
4
3
2
1
0
1
0
1
1
1
0
0
0
The following tables show what instruction must be sent to clear the appropriate flag.
Table 63.
Register
Example to clear only CDTF (bit 3)
Bit
7
Control_2
[1]
1
Register
Control_2
Product data sheet
1
4
1
3
2
1
0
0
-[1]
-[1]
-[1]
3
2
1
0
1
0[1]
0[1]
0[1]
Example to clear only AF (bit 4)
Bit
7
PCF2127
0
5
The bits labeled as - have to be rewritten with the previous values.
Table 64.
[1]
6
1
6
0
5
1
4
0
The bits labeled as - have to be rewritten with the previous values.
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Table 65.
Register
Example to clear only MSF (bit 7)
Bit
7
Control_2
[1]
0
Register
Control_2
Product data sheet
1
4
1
3
2
1
0
1
0[1]
0[1]
0[1]
3
2
1
0
0
0[1]
0[1]
0[1]
Example to clear both CDTF and MSF
Bit
7
PCF2127
0
5
The bits labeled as - have to be rewritten with the previous values.
Table 66.
[1]
6
0
6
0
5
1
4
1
The bits labeled as - have to be rewritten with the previous values.
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8.12 Timestamp function
The PCF2127 has an active LOW timestamp input pin TS, internally pulled with an
on-chip pull-up resistor to Voper(int). It also has a timestamp detection circuit which can
detect two different events:
1. Input on pin TS is driven to an intermediate level between power supply and ground.
2. Input on pin TS is driven to ground.
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(1) When using switches or push-buttons, it is recommended to connect a 1 nF capacitance to the TS
pin to ensure proper switching.
Fig 26. Timestamp detection with two push-buttons on the TS pin (for example, for
tamper detection)
The timestamp function is enabled by default after power-on and it can be switched off by
setting the control bit TSOFF (register Timestp_ctl).
A most common application of the timestamp function is described in Ref. 3 “AN11266”.
See Section 8.13.6 for a description of interrupt generation from the timestamp function.
8.12.1 Timestamp flag
1. When the TS input pin is driven to an intermediate level between the power supply
and ground, either on the falling edge from VDD or on the rising edge from ground,
then the following sequence occurs:
a. The actual date and time are stored in the timestamp registers.
b. The timestamp flag TSF1 (register Control_1) is set.
c. If the TSIE bit (register Control_2) is active, an interrupt on the INT pin is
generated.
The TSF1 flag can be cleared by command. Clearing the flag clears the interrupt.
Once TSF1 is cleared, it will only be set again when a new negative or positive edge
on pin TS is detected.
2. When the TS input pin is driven to ground, the following sequence occurs:
a. The actual date and time are stored in the timestamp registers.
b. In addition to the TSF1 flag, the TSF2 flag (register Control_2) is set.
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c. If the TSIE bit is active, an interrupt on the INT pin is generated.
The TSF1 and TSF2 flags can be cleared by command; clearing both flags clears the
interrupt. Once TSF2 is cleared, it will only be set again when TS pin is driven to
ground once again.
8.12.2 Timestamp mode
The timestamp function has two different modes selected by the control bit TSM
(timestamp mode) in register Timestp_ctl:
• If TSM is logic 0 (default): in subsequent trigger events without clearing the timestamp
flags, the last timestamp event is stored
• If TSM is logic 1: in subsequent trigger events without clearing the timestamp flags,
the first timestamp event is stored
The timestamp function also depends on the control bit BTSE in register Control_3, see
Section 8.12.4.
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8.12.3 Timestamp registers
8.12.3.1
Register Timestp_ctl
Table 67. Timestp_ctl - timestamp control register (address 12h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
7
6
5
TSM
TSOFF
-
0
0
-
Reset
value
4
3
2
1
0
X
X
1_O_16_TIMESTP[4:0]
X
X
X
Table 68. Timestp_ctl - timestamp control register (address 12h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Description
7
TSM
0
in subsequent events without clearing the timestamp
flags, the last event is stored
1
in subsequent events without clearing the timestamp
flags, the first event is stored
0
timestamp function active
1
timestamp function disabled
-
unused
6
TSOFF
5
-
4 to 0
1_O_16_TIMESTP[4:0]
8.12.3.2
1⁄
16
second timestamp information coded in BCD
format
Register Sec_timestp
Table 69. Sec_timestp - second timestamp register (address 13h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
Symbol
-
Reset
value
-
6
5
X
X
4
3
2
1
0
X
X
SECOND_TIMESTP (0 to 59)
X
X
X
Table 70. Sec_timestp - second timestamp register (address 13h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
-
-
-
unused
6 to 4
SECOND_TIMESTP
0 to 5
ten’s place
second timestamp information coded in BCD format
0 to 9
unit place
3 to 0
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8.12.3.3
Register Min_timestp
Table 71. Min_timestp - minute timestamp register (address 14h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
Symbol
-
Reset
value
-
6
5
4
3
2
1
0
X
X
MINUTE_TIMESTP (0 to 59)
X
X
X
X
X
Table 72. Min_timestp - minute timestamp register (address 14h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7
-
-
-
unused
6 to 4
MINUTE_TIMESTP
0 to 5
ten’s place
minute timestamp information coded in BCD format
0 to 9
unit place
3 to 0
8.12.3.4
Register Hour_timestp
Table 73. Hour_timestp - hour timestamp register (address 15h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
5
Symbol
-
-
AMPM
4
3
2
1
0
HOUR_TIMESTP (1 to 12) in 12-hour mode
HOUR_TIMESTP (0 to 23) in 24-hour mode
Reset
value
-
-
X
X
X
X
X
X
Table 74. Hour_timestp - hour timestamp register (address 15h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 6
-
-
-
unused
0
-
indicates AM
1
-
indicates PM
0 to 1
ten’s place
0 to 9
unit place
hour timestamp information coded in BCD format
when in 12-hour mode
0 to 2
ten’s place
0 to 9
unit place
12-hour
mode[1]
5
AMPM
4
HOUR_TIMESTP
3 to 0
24-hour
5 to 4
mode[1]
HOUR_TIMESTP
3 to 0
[1]
hour timestamp information coded in BCD format
when in 24-hour mode
Hour mode is set by the bit 12_24 in register Control_1.
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8.12.3.5
Register Day_timestp
Table 75. Day_timestp - day timestamp register (address 16h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
Symbol
-
-
Reset
value
-
-
5
4
3
2
1
0
X
X
DAY_TIMESTP (1 to 31)
X
X
X
X
Table 76. Day_timestp - day timestamp register (address 16h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 6
-
-
-
unused
5 to 4
DAY_TIMESTP
0 to 3
ten’s place
day timestamp information coded in BCD format
0 to 9
unit place
3 to 0
8.12.3.6
Register Mon_timestp
Table 77. Mon_timestp - month timestamp register (address 17h) bit allocation
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
7
6
5
Symbol
-
-
-
Reset
value
-
-
-
4
3
2
1
0
MONTH_TIMESTP (1 to 12)
X
X
X
X
X
Table 78. Mon_timestp - month timestamp register (address 17h) bit description
Bit positions labeled as - are not implemented and return 0 when read. Bits labeled as X are undefined at power-on and
unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 5
-
-
-
unused
4
MONTH_TIMESTP
0 to 1
ten’s place
month timestamp information coded in BCD format
0 to 9
unit place
3 to 0
8.12.3.7
Register Year_timestp
Table 79. Year_timestp - year timestamp register (address 18h) bit allocation
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
7
6
5
Symbol
4
3
2
1
0
X
X
X
YEAR_TIMESTP (0 to 99)
Reset
value
X
X
X
X
X
Table 80. Year_timestp - year timestamp register (address 18h) bit description
Bits labeled as X are undefined at power-on and unchanged by subsequent resets.
Bit
Symbol
Value
Place value Description
7 to 4
YEAR_TIMESTP
0 to 9
ten’s place
0 to 9
unit place
3 to 0
PCF2127
Product data sheet
year timestamp information coded in BCD format
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8.12.4 Dependency between Battery switch-over and timestamp
The timestamp function depends on the control bit BTSE in register Control_3:
Table 81.
Battery switch-over and timestamp
BTSE
BF
Description
0
-
[1]
0
[1]
1
the battery switch-over does not affect the
timestamp registers
If a battery switch-over event occurs:
the timestamp registers store the time and
date when the switch-over occurs;
after this event occurred BF is set logic 1
1
the timestamp registers are not modified;
in this condition subsequent battery
switch-over events or falling edges on pin TS
are not registered
[1]
PCF2127
Product data sheet
Default value.
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8.13 Interrupt output, INT
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When SI, MI, CDTIE, WD_CD[1:0], AIE, TSIE, BIE, BLIE are all disabled, INT remains high-impedance.
Fig 27. Interrupt block diagram
PCF2127 has an interrupt output pin INT which is open-drain, active LOW (requiring a
pull-up resistor if used). Interrupts may be sourced from different places:
• second or minute timer
• countdown timer
PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
•
•
•
•
•
watchdog timer
alarm
timestamp
battery switch-over
battery low detection
The control bit TI_TP (register Watchdg_tim_ctl) is used to configure whether the
interrupts generated from the second/minute timer (flag MSF in register Control_2) and
the countdown timer (flag CDTF in register Control_2) are pulsed signals or a
permanently active signal. All the other interrupt sources generate a permanently active
interrupt signal which follows the status of the corresponding flags. When the interrupt
sources are all disabled, INT remains high-impedance.
• The flags MSF, CDTF, AF, TSFx, and BF can be cleared by command.
• The flag WDTF is read only. How it can be cleared is explained in Section 8.11.6.
• The flag BLF is read only. It is cleared automatically from the battery low detection
circuit when the battery is replaced.
8.13.1 Minute and second interrupts
Minute and second interrupts are generated by predefined timers. The timers can be
enabled independently from one another by the bits MI and SI in register Control_1.
However, a minute interrupt enabled on top of a second interrupt cannot be
distinguishable since it occurs at the same time.
The minute/second flag MSF (register Control_2) is set logic 1 when either the seconds or
the minutes counter increments according to the enabled interrupt (see Table 82). The
MSF flag can be cleared by command.
Table 82.
Effect of bits MI and SI on pin INT and bit MSF
MI
SI
Result on INT
Result on MSF
0
0
no interrupt generated
MSF never set
1
0
an interrupt once per minute
MSF set when minutes
counter increments
0
1
an interrupt once per second
MSF set when seconds
counter increments
1
1
an interrupt once per second
MSF set when seconds
counter increments
When MSF is set logic 1:
• If TI_TP is logic 1, the interrupt is generated as a pulsed signal.
• If TI_TP is logic 0, the interrupt is permanently active signal that remains until MSF is
cleared.
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Accurate RTC with integrated quartz crystal for industrial applications
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In this example, bit TI_TP is logic 1 and the MSF flag is not cleared after an interrupt.
Fig 28. INT example for SI and MI when TI_TP is logic 1
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In this example, bit TI_TP is logic 0 and the MSF flag is cleared after an interrupt.
Fig 29. INT example for SI and MI when TI_TP is logic 0
The pulse generator for the minute/second interrupt operates from an internal 64 Hz clock
and generates a pulse of 1⁄64 seconds in duration.
8.13.2 Countdown timer interrupts
The generation of interrupts from the countdown timer is controlled by the CDTIE bit
(register Control_2).
The interrupt may be generated as a pulsed signal at every countdown period or as a
permanently active signal which follows the status of the countdown timer flag CDTF. Bit
TI_TP is used to control this bit.
8.13.3 INT pulse shortening
The pulse generator for the countdown timer interrupt also uses an internal clock, but this
time it is dependent on the selected source clock for the countdown timer and on the
countdown value n. As a consequence, the width of the interrupt pulse varies (see
PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
Table 83).
Table 83.
INT operation (bit TI_TP = 1)
Source clock (Hz)
INT period (s)
n = 1[1]
n>1
4096
1⁄
8192
1⁄
4096
64
1⁄
128
1⁄
64
1
1⁄
64
1⁄
64
1⁄
60
1⁄
64
1⁄
64
[1]
n = loaded countdown value. Timer stopped when n = 0.
If the MSF or CDTF flag (register Control_2) is cleared before the end of the INT pulse,
then the INT pulse is shortened. This allows the source of a system interrupt to be cleared
immediately when it is serviced, that is, the system does not have to wait for the
completion of the pulse before continuing, see Figure 30 and Figure 31. Instructions for
clearing bit MSF and bit CDTF can be found in Section 8.11.6.
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(1) Indicates normal duration of INT pulse.
The timing shown for clearing bit MSF is also valid for the non-pulsed interrupt mode. That is, when
TI_TP is logic 0, where the INT pulse may be shortened by setting both bits MI and SI logic 0.
Fig 30. Example of shortening the INT pulse by clearing the MSF flag
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(1) Indicates normal duration of INT pulse.
The timing shown for clearing CDTF is also valid for the non-pulsed interrupt mode. That is, when
TI_TP is logic 0, where the INT pulse may be shortened by setting CDTIE logic 0.
Fig 31. Example of shortening the INT pulse by clearing the CDTF flag
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Accurate RTC with integrated quartz crystal for industrial applications
8.13.4 Watchdog timer interrupts
The generation of interrupts from the watchdog timer is controlled using the WD_CD[1:0]
bits (register Watchdg_tim_ctl). The interrupt is generated as an active signal which
follows the status of the watchdog timer flag WDTF (register Control_2). No pulse
generation is possible for watchdog timer interrupts.
The interrupt is cleared when the flag WDTF is reset. WDTF is a read-only bit and cannot
be cleared by command. Instructions for clearing it can be found in Section 8.11.6.
8.13.5 Alarm interrupts
Generation of interrupts from the alarm function is controlled by the bit AIE (register
Control_2). If AIE is enabled, the INT pin follows the status of bit AF (register Control_2).
Clearing AF immediately clears INT. No pulse generation is possible for alarm interrupts.
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Example where only the minute alarm is used and no other interrupts are enabled.
Fig 32. AF timing diagram
8.13.6 Timestamp interrupts
Interrupt generation from the timestamp function is controlled using the TSIE bit (register
Control_2). If TSIE is enabled, the INT pin follows the status of the flags TSFx. Clearing
the flags TSFx immediately clears INT. No pulse generation is possible for timestamp
interrupts.
8.13.7 Battery switch-over interrupts
Generation of interrupts from the battery switch-over is controlled by the BIE bit (register
Control_3). If BIE is enabled, the INT pin follows the status of bit BF in register Control_3
(see Table 81). Clearing BF immediately clears INT. No pulse generation is possible for
battery switch-over interrupts.
8.13.8 Battery low detection interrupts
Generation of interrupts from the battery low detection is controlled by the BLIE bit
(register Control_3). If BLIE is enabled, the INT pin follows the status of bit BLF (register
Control_3). The interrupt is cleared when the battery is replaced (BLF is logic 0) or when
bit BLIE is disabled (BLIE is logic 0). BLF is read only and therefore cannot be cleared by
command.
PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
8.14 External clock test mode
A test mode is available which allows on-board testing. In this mode, it is possible to set
up test conditions and control the operation of the RTC.
The test mode is entered by setting bit EXT_TEST logic 1 (register Control_1). Then
pin CLKOUT becomes an input. The test mode replaces the internal clock signal (64 Hz)
with the signal applied to pin CLKOUT. Every 64 positive edges applied to pin CLKOUT
generate an increment of one second.
The signal applied to pin CLKOUT should have a minimum pulse width of 300 ns and a
maximum period of 1000 ns. The internal clock, now sourced from CLKOUT, is divided
down by a 26 divider chain called prescaler (see Table 84). The prescaler can be set into a
known state by using bit STOP. When bit STOP is logic 1, the prescaler is reset to 0.
STOP must be cleared before the prescaler can operate again.
From a stop condition, the first 1 second increment will take place after 32 positive edges
on pin CLKOUT. Thereafter, every 64 positive edges cause a 1 second increment.
Remark: Entry into test mode is not synchronized to the internal 64 Hz clock. When
entering the test mode, no assumption as to the state of the prescaler can be made.
Operating example:
1. Set EXT_TEST test mode (register Control_1, EXT_TEST is logic 1).
2. Set bit STOP (register Control_1, STOP is logic 1).
3. Set time registers to desired value.
4. Clear STOP (register Control_1, STOP is logic 0).
5. Apply 32 clock pulses to CLKOUT.
6. Read time registers to see the first change.
7. Apply 64 clock pulses to CLKOUT.
8. Read time registers to see the second change.
Repeat 7 and 8 for additional increments.
8.15 STOP bit function
The function of the STOP bit is to allow for accurate starting of the time circuits. STOP
causes the upper part of the prescaler (F9 to F14) to be held in reset and thus no 1 Hz ticks
are generated. The time circuits can then be set and will not increment until the STOP bit
is released. STOP doesn't affect the CLKOUT signal but the output of the prescaler in the
range of 32 Hz to 1 Hz (see Figure 33).
PCF2127
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 33. STOP bit functional diagram
The lower stages of the prescaler, F0 to F8, are not reset and because the I2C-bus and the
SPI-bus are asynchronous to the crystal oscillator, the accuracy of restarting the time
circuits is between 0 and one 64 Hz cycle (0.484375 s and 0.500000 s), see Table 84 and
Figure 34.
Table 84.
First increment of time circuits after stop release
Bit
STOP
Prescaler bits[1]
F0 to F8 - F9 to F14
1 Hz tick
Time
hh:mm:ss
Comment
12:45:12
prescaler counting normally
Clock is running normally
0
010000111-010100
STOP bit is activated by user. F0 to F8 are not reset and values cannot be predicted externally
1
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1
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F0 is clocked at 32.768 kHz.
PCF2127
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PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
+]
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Fig 34. STOP bit release timing
PCF2127
Product data sheet
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Accurate RTC with integrated quartz crystal for industrial applications
9. Interfaces
The PCF2127 has an I2C-bus or SPI-bus interface using the same pins. The selection is
done using the interface selection pin IFS (see Table 85).
Table 85.
Interface selection input pin IFS
Pin
Connection
Bus interface
Reference
IFS
VSS
SPI-bus
Section 9.1
BBS
I2C-bus
Section 9.2
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To select the I2C-bus interface, pin IFS has to be
connected to pin BBS.
To select the SPI-bus interface, pin IFS has to be
connected to pin VSS.
b. I2C-bus interface selection
a. SPI-bus interface selection
Fig 35. Interface selection
9.1 SPI-bus interface
Data transfer to and from the device is made by a 3 line SPI-bus (see Table 86). The data
lines for input and output are split. The data input and output line can be connected
together to facilitate a bidirectional data bus (see Figure 36). The SPI-bus is initialized
whenever the chip enable line pin SDA/CE is inactive.
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Fig 36. SDI, SDO configurations
PCF2127
Product data sheet
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Accurate RTC with integrated quartz crystal for industrial applications
Table 86.
Serial interface
Symbol
Function
SDA/CE
Description
[1]
chip enable input;
active LOW
when HIGH, the interface is reset;
input may be higher than VDD
SCL
serial clock input
when SDA/CE is HIGH, input may float;
SDI
serial data input
when SDA/CE is HIGH, input may float;
input may be higher than VDD
input may be higher than VDD;
input data is sampled on the rising edge of
SCL
SDO
serial data output
push-pull output;
drives from VSS to Voper(int) (VBBS);
output data is changed on the falling edge of
SCL
[1]
The chip enable must not be wired permanently LOW.
9.1.1 Data transmission
The chip enable signal is used to identify the transmitted data. Each data transfer is a
whole byte, with the Most Significant Bit (MSB) sent first.
The transmission is controlled by the active LOW chip enable signal SDA/CE. The first
byte transmitted is the command byte. Subsequent bytes are either data to be written or
data to be read (see Figure 37).
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Fig 37. Data transfer overview
The command byte defines the address of the first register to be accessed and the
read/write mode. The address counter will auto increment after every access and will
reset to zero after the last valid register is accessed. The R/W bit defines if the following
bytes are read or write information.
Table 87.
Command byte definition
Bit
Symbol
7
R/W
6 to 5
SA
Value
Description
data read or write selection
0
write data
1
read data
01
subaddress;
other codes will cause the device to ignore
data transfer
4 to 0
PCF2127
Product data sheet
RA
00h to 1Dh
register address
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PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
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In this example, the Seconds register is set to 45 seconds and the Minutes register to 10 minutes.
a. Writing seconds and minutes
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b. Writing to RAM address 02h
Fig 38. SPI-bus write examples
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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64 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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In this example, the registers Months and Years are read. The pins SDI and SDO are not connected together. For this
configuration, it is important that pin SDI is never left floating. It must always be driven either HIGH or LOW. If pin SDI is left
open, high IDD currents may result.
a. Reading month and year
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b. Reading from RAM address 12h
Fig 39. SPI-bus read examples
PCF2127
Product data sheet
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Accurate RTC with integrated quartz crystal for industrial applications
9.2 I2C-bus interface
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines are
connected to a positive supply by a pull-up resistor. Data transfer is initiated only when the
bus is not busy.
9.2.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line remains
stable during the HIGH period of the clock pulse as changes in the data line at this time
are interpreted as control signals (see Figure 40).
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Fig 40. Bit transfer
9.2.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line, while the clock is HIGH, is defined as the START condition S.
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition P (see Figure 41).
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Fig 41. Definition of START and STOP conditions
Remark: For the PCF2127, a repeated START is not allowed. Therefore a STOP has to
be released before the next START.
9.2.3 System configuration
A device generating a message is a transmitter; a device receiving a message is the
receiver. The device that controls the message is the master; and the devices which are
controlled by the master are the slaves.
The PCF2127 can act as a slave transmitter and a slave receiver.
PCF2127
Product data sheet
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66 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 42. System configuration
9.2.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge
cycle.
• A slave receiver which is addressed must generate an acknowledge after the
reception of each byte.
• Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
• The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
• A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is illustrated in Figure 43.
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Fig 43. Acknowledgement on the I2C-bus
9.2.5 I2C-bus protocol
After a start condition, a valid hardware address has to be sent to a PCF2127 device. The
appropriate I2C-bus slave address is 1010001. The entire I2C-bus slave address byte is
shown in Table 88.
PCF2127
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Accurate RTC with integrated quartz crystal for industrial applications
I2C slave address byte
Table 88.
Slave address
Bit
7
6
5
4
3
2
1
0
0
1
0
0
0
1
R/W
MSB
LSB
1
The R/W bit defines the direction of the following single or multiple byte data transfer (read
is logic 1, write is logic 0).
For the format and the timing of the START condition (S), the STOP condition (P), and the
acknowledge (A) refer to the I2C-bus specification Ref. 13 “UM10204” and the
characteristics table (Table 93). In the write mode, a data transfer is terminated by sending
a STOP condition. A repeated START (Sr) condition is not applicable.
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Fig 45. Bus protocol, reading from registers
PCF2127
Product data sheet
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68 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
69 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 47. Bus protocol, reading from RAM
9.3 Bus communication and battery backup operation
To save power during battery backup operation (see Section 8.6.1), the bus interfaces are
inactive. Therefore the communication via I2C- or SPI-bus should be terminated before
the supply of the PCF2127 is switched from VDD to VBAT.
The extra power fail detection function (see Section 8.6.3) of the PCF2127 allows early
detection of a dropping VDD. The output on pin PFO indicates to the microcontroller to
terminate the bus communication properly. When the bus communication is not
terminated in a proper way, the time counters get corrupted.
Remark: If the I2C-bus communication was terminated uncontrolled, the I2C-bus has to
be reinitialized by sending a STOP followed by a START after the device switched back
from battery backup operation to VDD supply operation.
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
10. Internal circuitry
9''
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Fig 48. Device diode protection diagram of PCF2127
11. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
71 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
12. Limiting values
Table 89. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
0.5
+6.5
V
IDD
supply current
50
+50
mA
Vi
input voltage
0.5
+6.5
V
II
input current
10
+10
mA
VO
output voltage
0.5
+6.5
V
IO
output current
at pin SDA/CE
VBAT
battery supply voltage
Ptot
total power dissipation
10
+10
mA
10
+20
mA
0.5
+6.5
V
-
300
mW
HBM
[1]
-
4000
V
CDM
[2]
-
1250
V
latch-up current
[3]
-
200
mA
Tstg
storage temperature
[4]
55
+85
C
Tamb
ambient temperature
40
+85
C
VESD
Ilu
electrostatic
discharge voltage
operating device
[1]
Pass level; Human Body Model (HBM) according to Ref. 7 “JESD22-A114”.
[2]
Pass level; Charged-Device Model (CDM), according to Ref. 8 “JESD22-C101”.
[3]
Pass level; latch-up testing according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the store and transport requirements (see Ref. 14 “UM10569”) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
13. Static characteristics
Table 90. Static characteristics
VDD = 1.8 V to 4.2 V; VSS = 0 V; Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
[1]
VDD
supply voltage
1.8
-
4.2
V
VBAT
battery supply voltage
1.8
-
4.2
V
VDD(cal)
calibration supply
voltage
-
3.3
-
V
Vlow
low voltage
-
1.2
-
V
IDD
supply current
SPI-bus (fSCL = 6.5 MHz)
-
-
800
A
I2C-bus
-
-
200
A
interface active;
supplied by VDD
(fSCL = 400 kHz)
interface inactive (fSCL = 0 Hz)[2];
TCR[1:0] = 00 (see Table 13 on page 12)
PWRMNG[2:0] = 111 (see Table 25 on page 18);
TSOFF = 1 (see Table 68 on page 50);
COF[2:0] = 111 (see Table 15 on page 14)
VDD = 1.8 V
-
470
-
nA
VDD = 3.3 V
-
700
1500
nA
VDD = 4.2 V
-
800
-
nA
PWRMNG[2:0] = 111 (see Table 25 on page 18);
TSOFF = 1 (see Table 68 on page 50);
COF[2:0] = 000 (see Table 15 on page 14)
VDD = 1.8 V
-
560
-
nA
VDD = 3.3 V
-
850
-
nA
VDD = 4.2 V
-
1050
-
nA
PWRMNG[2:0] = 000 (see Table 25 on page 18);
TSOFF = 0 (see Table 68 on page 50);
COF[2:0] = 111 (see Table 15 on page 14)
VDD or VBAT = 1.8 V
[3]
-
1750
-
nA
VDD or VBAT = 3.3 V
[3]
-
2150
-
nA
VDD or VBAT = 4.2 V
[3]
-
2350
3500
nA
PWRMNG[2:0] = 000 (see Table 25 on page 18);
TSOFF = 0 (see Table 68 on page 50);
COF[2:0] = 000 (see Table 15 on page 14)
IL(bat)
battery leakage
current
PCF2127
Product data sheet
VDD or VBAT = 1.8 V
[3]
-
1840
-
nA
VDD or VBAT = 3.3 V
[3]
-
2300
-
nA
VDD or VBAT = 4.2 V
[3]
-
2600
-
nA
-
50
100
nA
VDD is active supply;
VBAT = 3.0 V
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
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PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
Table 90. Static characteristics …continued
VDD = 1.8 V to 4.2 V; VSS = 0 V; Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Power management
Vth(sw)bat
battery switch
threshold voltage
-
2.5
-
V
Vth(bat)low
low battery threshold
voltage
-
2.5
-
V
2.25
-
2.85
V
threshold voltage on
pin PFI
-
1.25
-
V
VI
input voltage
0.5
-
VDD + 0.5
V
VIL
LOW-level input
voltage
-
-
0.25VDD
V
-
-
0.3VDD
V
0.7VDD
-
-
V
-
0
-
A
1
-
+1
A
-
-
7
pF
on pins CLKOUT, INT, RST and
PFO, referring to external pull-up
0.5
-
5.5
V
on pin BBS
1.8
-
4.2
V
on pin SDO
0.5
-
VDD + 0.5
V
Vth(PFI)
Tamb = 25 C
Inputs[4]
VIH
HIGH-level input
voltage
ILI
input leakage current
Tamb = 20 C to +85 C;
VDD > 2.0 V
VI = VDD or VSS
post ESD event
[5]
input capacitance
Ci
Outputs
output voltage
VO
VOH
HIGH output voltage
on pin SDO
0.8VDD
-
VDD
V
VOL
LOW output voltage
on pins CLKOUT, INT, RST,
SDO, and PFO
VSS
-
0.2VDD
V
IOL
LOW-level output
current
output sink current;
VOL = 0.4 V
3
17
-
mA
on all other outputs
1.0
-
-
mA
output source current;
on pin SDO;
VOH = 3.8 V;
VDD = 4.2 V
1.0
-
-
mA
-
0
-
A
1
-
+1
A
on pin SDA/CE
IOH
HIGH-level output
current
ILO
output leakage current VO = VDD or VSS
[6]
post ESD event
[1]
For reliable oscillator start-up at power-on: VDD(po)min = VDD(min) + 0.3 V.
[2]
Timer source clock = 1⁄60 Hz, level of pins SDA/CE, SDI, and SCL is VDD or VSS.
[3]
When the device is supplied by the VBAT pin instead of the VDD pin, the current values for IBAT are as specified for IDD under the same
conditions.
[4]
The I2C-bus and SPI-bus interfaces of PCF2127 are 5 V tolerant.
[5]
Tested on sample basis.
[6]
For further information, see Figure 49.
PCF2127
Product data sheet
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74 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
13.1 Current consumption characteristics, typical
DDO
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9''9
Typical value; VOL = 0.4 V.
Fig 49. IOL on pin SDA/CE
DDM
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7HPSHUDWXUH&
CLKOUT disabled; PWRMNG[2:0] = 111; TSOFF = 1; TS input floating.
Fig 50. IDD as a function of temperature
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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75 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
DDM
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9''9
b. PWRMNG[2:0] = 000; TSOFF = 0; Tamb = 25 C; TS input floating
Fig 51. IDD as a function of VDD
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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76 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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DDD
Interface inactive; Tamb = 25 C; VBAT = 0 V; default configuration.
Description of the PWRMNG[2:0] settings, see Table 25 on page 18.
(1) VDD = 1.8 V.
(2) VDD = 3.3 V.
(3) VDD = 4.2 V.
(4) VDD or VBAT = 1.8 V.
(5) VDD or VBAT = 3.3 V.
(6) VDD or VBAT = 4.2 V.
Fig 52. Typical IDD as a function of the power management settings
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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77 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
13.2 Frequency characteristics
Table 91. Frequency characteristics
VDD = 1.8 V to 4.2 V; VSS = 0 V; Tamb = +25 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fo
output frequency
on pin CLKOUT;
VDD or VBAT = 3.3 V;
COF[2:0] = 000;
AO[3:0] = 1000
-
32.768
-
kHz
f/f
frequency stability
VDD or VBAT = 3.3 V
Tamb = 15 C to +60 C
-
3
5
ppm
Tamb = 25 C to 15 C
and
Tamb = +60 C to +65 C
-
5
10
ppm
PCF2127AT
PCF2127T
fxtal/fxtal
relative crystal
frequency variation
Tamb = 30 C to +80 C
[1][2]
-
3
8
ppm
Tamb = 40 C to 30 C
and
Tamb = +80 C to +85 C
[1][2]
-
5
15
ppm
-
-
3
ppm
first year
-
-
3
ppm
ten years
-
-
8
ppm
-
1
-
ppm/V
crystal aging
[3]
PCF2127AT
first year;
VDD or VBAT = 3.3 V
PCF2127T
f/V
[1]
frequency variation
with voltage
on pin CLKOUT
1 ppm corresponds to a time deviation of 0.0864 seconds per day.
[2]
Only valid if CLKOUT frequencies are not equal to 32.768 kHz or if CLKOUT is disabled.
[3]
Not production tested. Effects of reflow soldering are included (see Ref. 3 “AN11266”).
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
78 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
DDD
)UHTXHQF\
VWDELOLW\
SSP
SSP
SSP
SSP
7HPSHUDWXUH&
(1) Typical temperature compensated frequency response.
(2) Uncompensated typical tuning-fork crystal frequency.
Fig 53. Typical characteristic of frequency with respect to temperature of PCF2127AT
DDD
)UHTXHQF\
VWDELOLW\
SSP
SSP
SSP
SSP
7HPSHUDWXUH&
(1) Typical temperature compensated frequency response.
(2) Uncompensated typical tuning-fork crystal frequency.
Fig 54. Typical characteristic of frequency with respect to temperature of PCF2127T
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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79 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
14. Dynamic characteristics
14.1 SPI-bus timing characteristics
Table 92. SPI-bus characteristics
VDD = 1.8 V to 4.2 V; VSS = 0 V; Tamb = 40 C to +85 C, unless otherwise specified. All timing values are valid within the
operating supply voltage at ambient temperature and referenced to VIL and VIH with an input voltage swing of VSS to VDD (see
Figure 55).
Symbol
Parameter
Conditions
VDD = 1.8 V
VDD = 4.2 V
Min
Min
Max
Unit
Max
Pin SCL
fclk(SCL)
SCL clock frequency
SCL time
tSCL
tclk(H)
tclk(L)
clock HIGH time
clock LOW time
register read/write access
-
2.0
-
6.5
MHz
RAM write access
-
2.0
-
6.5
MHz
RAM read access
-
1.11
-
6.25
MHz
register read/write access
800
-
140
-
ns
RAM write access
800
-
140
-
ns
RAM read access
900
-
160
-
ns
register read/write access
100
-
70
-
ns
RAM write access
100
-
70
-
ns
RAM read access
450
-
80
-
ns
register read/write access
400
-
70
-
ns
RAM write access
400
-
70
-
ns
RAM read access
450
-
80
-
ns
tr
rise time
for SCL signal
-
100
-
100
ns
tf
fall time
for SCL signal
-
100
-
100
ns
Pin SDA/CE
tsu(CE_N)
CE_N set-up time
60
-
30
-
ns
th(CE_N)
CE_N hold time
40
-
25
-
ns
trec(CE_N)
CE_N recovery time
100
-
30
-
ns
tw(CE_N)
CE_N pulse width
-
0.99
-
0.99
s
Pin SDI
tsu
set-up time
set-up time for SDI data
70
-
20
-
ns
th
hold time
hold time for SDI data
70
-
20
-
ns
SDO read delay time
CL = 50 pF
register read access
-
225
-
55
ns
RAM read access
-
410
-
55
ns
-
90
-
25
ns
0
-
0
-
ns
Pin SDO
td(R)SDO
tdis(SDO)
SDO disable time
tt(SDI-SDO)
transition time from
SDI to SDO
[1]
[1]
to avoid bus conflict
No load value; bus is held up by bus capacitance; use RC time constant with application values.
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
80 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
WZ&(B1
&(
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PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
81 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
14.2 I2C-bus timing characteristics
Table 93. I2C-bus characteristics
All timing characteristics are valid within the operating supply voltage and ambient temperature range and reference to 30 %
and 70 % with an input voltage swing of VSS to VDD (see Figure 56).
Symbol
Parameter
Standard mode
Fast-mode (Fm)
Min
Max
Min
Max
Unit
Pin SCL
fSCL
SCL clock frequency
0
100
0
400
kHz
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
s
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
s
Pin SDA/CE
tSU;DAT
data set-up time
250
-
100
-
ns
tHD;DAT
data hold time
0
-
0
-
ns
Pins SCL and SDA/CE
tBUF
bus free time between a STOP
and START condition
4.7
-
1.3
-
s
tSU;STO
set-up time for STOP condition
4.0
-
0.6
-
s
tHD;STA
hold time (repeated) START
condition
4.0
-
0.6
-
s
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
s
tr
rise time of both SDA and SCL
signals
[1][2][3]
-
1000
20 + 0.1Cb
300
ns
tf
fall time of both SDA and SCL
signals
[1][2][3]
-
300
20 + 0.1Cb
300
ns
tVD;ACK
data valid acknowledge time
[4]
0.1
3.45
0.1
0.9
s
tVD;DAT
data valid time
[5]
300
-
75
-
ns
tSP
pulse width of spikes that must be
suppressed by the input filter
[6]
-
50
-
50
ns
[1]
A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region of the falling edge of SCL.
[2]
Cb is the total capacitance of one bus line in pF.
[3]
The maximum tf for the SDA and SCL bus lines is 300 ns. The maximum fall time for the SDA output stage, tf is 250 ns. This allows
series protection resistors to be connected between the SDA/CE pin, the SCL pin, and the SDA/SCL bus lines without exceeding the
maximum tf.
[4]
tVD;ACK is the time of the acknowledgement signal from SCL LOW to SDA (out) LOW.
[5]
tVD;DAT is the minimum time for valid SDA (out) data following SCL LOW.
[6]
Input filters on the SDA and SCL inputs suppress noise spikes of less than 50 ns.
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
82 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 56. I2C-bus timing diagram; rise and fall times refer to 30 % and 70 %
PCF2127
Product data sheet
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Rev. 8 — 19 December 2014
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83 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
15. Application information
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Ci: In case mechanical switches are used, a capacitor of 1 nF is recommended.
R1, R2: Voltage dividers for setting the power-fail level.
RPU: For example, 10 k.
Fig 57. General application diagram
For information about application configuration, see Ref. 3 “AN11266” on page 92
16. Test information
16.1 Quality information
UL Component Recognition
This (component or material) is Recognized by UL. Representative samples of this
component have been evaluated by UL and meet applicable UL requirements.
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
84 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
17. Package outline
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PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
85 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
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Fig 59. Package outline SOT162-1 (SO16) of PCF2127T
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
86 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
18. Packing information
18.1 Tape and reel information
For tape and reel packing information, see
• Ref. 11 “SOT162-1_518” on page 92 for the PCF2127T.
• Ref. 12 “SOT163-1_518” on page 92 for the PCF2127AT.
19. Soldering
For information about soldering, see Ref. 3 “AN11266” on page 92.
19.1 Footprint information
î
î
VROGHUODQGV
RFFXSLHGDUHD
SODFHPHQWDFFXUDF\
'LPHQVLRQVLQPP
VRWBIU
Fig 60. Footprint information for reflow soldering of SOT163-1 (SO20) of PCF2127AT
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
87 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
)RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI62SDFNDJH
627
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Fig 61. Footprint information for reflow soldering of SOT162-1 (SO16) of PCF2127T
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
88 of 100
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF2127
Product data sheet
20. Appendix
20.1 Real-Time Clock selection
Table 94.
Selection of Real-Time Clocks
Type name
Alarm, Timer, Interrupt Interface IDD,
Battery Timestamp,
Watchdog
output
typical (nA) backup tamper input
Special features
Packages
PCF8563
X
1
I2C
250
-
-
-
-
SO8, TSSOP8,
HVSON10
PCF8564A
X
1
I2C
250
-
-
-
integrated oscillator caps
WLCSP
600
-
-
grade 1
high robustness,
Tamb40 C to 125 C
TSSOP8, HVSON10
Rev. 8 — 19 December 2014
All information provided in this document is subject to legal disclaimers.
PCA8565
X
1
I2C
PCA8565A
X
1
I2C
600
-
-
-
integrated oscillator caps,
Tamb40 C to 125 C
WLCSP
PCF85063
-
1
I2C
220
-
-
-
basic functions only, no
alarm
HXSON8
PCF85063A
X
1
I2C
220
-
-
-
tiny package
SO8, DFN2626-10
PCF85063B
X
1
SPI
220
-
-
-
tiny package
DFN2626-10
230
X
X
-
time stamp, battery
backup, stopwatch 1⁄100 s
SO8, TSSOP10,
TSSOP8,
DFN2626-10
X
2
PCF85263B
X
2
SPI
230
X
X
-
time stamp, battery
backup, stopwatch 1⁄100s
TSSOP10,
DFN2626-10
PCF85363A
X
2
I2C
230
X
X
-
time stamp, battery
backup, stopwatch 1⁄100s,
64 Byte RAM
TSSOP10,
DFN2626-10
PCF85363B
X
2
SPI
230
X
X
-
time stamp, battery
backup, stopwatch 1⁄100s,
64 Byte RAM
TSSOP10,
DFN2626-10
PCF8523
X
2
I2C
150
X
-
-
lowest power 150 nA in
operation, FM+ 1 MHz
SO8, HVSON8,
TSSOP14, WLCSP
PCF2123
X
1
SPI
100
-
-
-
lowest power 100 nA in
operation
TSSOP14, HVQFN16
PCF2127
X
1
I2C and
SPI
500
X
X
-
temperature
SO16
compensated, quartz built
in, calibrated, 512 Byte
RAM
PCF2127
89 of 100
© NXP Semiconductors N.V. 2014. All rights reserved.
PCF85263A
I2C
Accurate RTC with integrated quartz crystal for industrial applications
AEC-Q100
compliant
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Selection of Real-Time Clocks …continued
Alarm, Timer, Interrupt Interface IDD,
Battery Timestamp,
Watchdog
output
typical (nA) backup tamper input
AEC-Q100
compliant
Special features
PCF2127A
X
1
I2C and
SPI
500
X
PCF2129
X
1
I2C and
SPI
500
PCF2129A
X
1
I2C and
SPI
PCA2129
X
1
PCA21125
X
1
Packages
X
-
temperature
SO20
compensated, quartz built
in, calibrated, 512 Byte
RAM
X
X
-
temperature
SO16
compensated, quartz built
in, calibrated
500
X
X
-
temperature
SO20
compensated, quartz built
in, calibrated
I2C and
SPI
500
X
X
grade 3
temperature
SO16
compensated, quartz built
in, calibrated
SPI
820
-
-
grade 1
high robustness,
Tamb40 C to 125 C
TSSOP14
PCF2127
90 of 100
© NXP Semiconductors N.V. 2014. All rights reserved.
Accurate RTC with integrated quartz crystal for industrial applications
Rev. 8 — 19 December 2014
All information provided in this document is subject to legal disclaimers.
Type name
NXP Semiconductors
PCF2127
Product data sheet
Table 94.
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
21. Abbreviations
Table 95.
PCF2127
Product data sheet
Abbreviations
Acronym
Description
ACK
ACKnowledge (I2C-bus)
AM
Ante Meridiem
BCD
Binary Coded Decimal
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DC
Direct Current
GPS
Global Positioning System
HBM
Human Body Model
I2C
Inter-Integrated Circuit
IC
Integrated Circuit
LSB
Least Significant Bit
MCU
Microcontroller Unit
MSB
Most Significant Bit
PM
Post Meridiem
POR
Power-On Reset
PORO
Power-On Reset Override
PPM
Parts Per Million
RAM
Random Access Memory
RC
Resistance-Capacitance
RTC
Real Time Clock
SCL
Serial CLock line
SDA
Serial DAta line
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
TCXO
Temperature Compensated Xtal Oscillator
Xtal
crystal
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
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91 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
22. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10853 — Handling precautions of ESD sensitive devices
[3]
AN11266 — Application and soldering information for the PCF2127 industrial TCXO
RTC
[4]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[5]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[6]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[7]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[8]
JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[9]
JESD78 — IC Latch-Up Test
[10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[11] SOT162-1_518 — SO16; Reel pack; SMD, 13”, packing information
[12] SOT163-1_518 — SO20; Reel pack; SMD, 13”, packing information
[13] UM10204 — I2C-bus specification and user manual
[14] UM10569 — Store and transport requirements
[15] UM10762 — User manual for the accurate RTC demo board OM13513 containing
PCF2127T and PCF2129AT
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
92 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
23. Revision history
Table 96.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF2127 v.8
20141219
Product data sheet
-
PCF2127 v.7
Modifications:
PCF2127 v.7
•
•
•
•
•
•
Added VOH and VOL values in Table 90
Enhanced ESD HBM values
Corrected Figure 8
Enhanced description of internal operating voltage
Added register bit allocation tables
Fixed typos
20141003
Product data sheet
-
PCF2127AT v.6
PCF2127 v.3
PCF2127AT v.6
20130711
Product data sheet
-
PCF2127AT v.5
PCF2127AT v.5
20130128
Product data sheet
-
PCF2127AT v.4
PCF2127AT v.4
20121207
Product data sheet
-
PCF2127AT v.3
PCF2127AT
PCF2127AT v.3
20121004
Product data sheet
-
PCF2127A v.2
PCF2127A v.2
20100507
Product data sheet
-
PCF2127A v.1
PCF2127A v.1
20100121
Product data sheet
-
-
PCF2127T
PCF2127 v.3
20130711
Product data sheet
-
PCF2127 v.2
PCF2127 v.2
20130422
Product data sheet
-
PCF2127 v.1
PCF2127 v.1
20130212
Product data sheet
-
-
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
93 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
24. Legal information
24.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
24.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
24.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF2127
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
94 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
24.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
95 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
26. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description of PCF2127 . . . . . . . . . . . . . . . .5
Register overview . . . . . . . . . . . . . . . . . . . . . . .8
Control_1 - control and status register 1 (address
00h) bit allocation . . . . . . . . . . . . . . . . . . . . . .10
Control_1 - control and status register 1 (address
00h) bit description . . . . . . . . . . . . . . . . . . . . . .10
Control_2 - control and status register 2 (address
01h) bit allocation . . . . . . . . . . . . . . . . . . . . . . 11
Control_2 - control and status register 2 (address
01h) bit description . . . . . . . . . . . . . . . . . . . . . 11
Control_3 - control and status register 3 (address
02h) bit allocation . . . . . . . . . . . . . . . . . . . . . .12
Control_3 - control and status register 3 (address
02h) bit description . . . . . . . . . . . . . . . . . . . . . .12
CLKOUT_ctl - CLKOUT control register (address
0Fh) bit allocation . . . . . . . . . . . . . . . . . . . . . .12
CLKOUT_ctl - CLKOUT control register (address
0Fh) bit description . . . . . . . . . . . . . . . . . . . . . .12
Temperature measurement period . . . . . . . . . .13
CLKOUT frequency selection . . . . . . . . . . . . . .14
Aging_offset - crystal aging offset register
(address 19h) bit allocation . . . . . . . . . . . . . . .14
Aging_offset - crystal aging offset register
(address 19h) bit description . . . . . . . . . . . . . .14
Frequency correction at 25 °C, typical . . . . . . .15
RAM_addr_MSB - RAM address MSB register
(address 1Ah) bit allocation . . . . . . . . . . . . . . .16
RAM_addr_MSB - RAM address MSB register
(address 1Ah) bit description . . . . . . . . . . . . . .16
RAM_addr_LSB - RAM address LSB register
(address 1Bh) bit allocation . . . . . . . . . . . . . . .16
RAM_addr_LSB - RAM address LSB register
(address 1Bh) bit description . . . . . . . . . . . . . .16
RAM_wrt_cmd - RAM write command register
(address 1Ch) bit description . . . . . . . . . . . . . .16
RAM_rd_cmd - RAM read command register
(address 1Dh) bit description . . . . . . . . . . . . . .16
Power management control bit description . . .18
Output pin BBS. . . . . . . . . . . . . . . . . . . . . . . . .26
Seconds - seconds and clock integrity register
(address 03h) bit allocation . . . . . . . . . . . . . . .30
Seconds - seconds and clock integrity register
(address 03h) bit description . . . . . . . . . . . . . .30
Seconds coded in BCD format . . . . . . . . . . . .31
Minutes - minutes register (address 04h) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Minutes - minutes register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Hours - hours register (address 05h) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Hours - hours register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Days - days register (address 06h) bit
PCF2127
Product data sheet
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 35. Days - days register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 36. Weekdays - weekdays register (address 07h) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 37. Weekdays - weekdays register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 38. Weekday assignments . . . . . . . . . . . . . . . . . . 33
Table 39. Months - months register (address 08h) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 40. Months - months register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 41. Month assignments in BCD format . . . . . . . . . 34
Table 42. Years - years register (address 09h) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 43. Years - years register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 44. Second_alarm - second alarm register (address
0Ah) bit allocation . . . . . . . . . . . . . . . . . . . . . . 38
Table 45. Second_alarm - second alarm register (address
0Ah) bit description . . . . . . . . . . . . . . . . . . . . . 38
Table 46. Minute_alarm - minute alarm register (address
0Bh) bit allocation . . . . . . . . . . . . . . . . . . . . . . 38
Table 47. Minute_alarm - minute alarm register (address
0Bh) bit description . . . . . . . . . . . . . . . . . . . . . 38
Table 48. Hour_alarm - hour alarm register (address 0Ch)
bit allocation . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 49. Hour_alarm - hour alarm register (address 0Ch)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 50. Day_alarm - day alarm register (address 0Dh) bit
allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 51. Day_alarm - day alarm register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 52. Weekday_alarm - weekday alarm register
(address 0Eh) bit allocation . . . . . . . . . . . . . . 40
Table 53. Weekday_alarm - weekday alarm register
(address 0Eh) bit description . . . . . . . . . . . . . . 40
Table 54. Watchdg_tim_ctl - watchdog timer control register
(address 10h) bit allocation . . . . . . . . . . . . . . . 41
Table 55. Watchdg_tim_ctl - watchdog timer control register
(address 10h) bit description . . . . . . . . . . . . . . 41
Table 56. Watchdg_tim_val - watchdog timer value register
(address 11h) bit allocation . . . . . . . . . . . . . . . 42
Table 57. Watchdg_tim_val - watchdog timer value register
(address 11h) bit description . . . . . . . . . . . . . . 42
Table 58. Programmable watchdog timer . . . . . . . . . . . . 42
Table 59. Specification of tw(rst) . . . . . . . . . . . . . . . . . . . . 44
Table 60. First period delay for timer counter . . . . . . . . . 45
Table 61. Flag location in register Control_2 . . . . . . . . . . 46
Table 62. Example values in register Control_2 . . . . . . . 46
Table 63. Example to clear only CDTF (bit 3) . . . . . . . . . 46
Table 64. Example to clear only AF (bit 4). . . . . . . . . . . . 46
Table 65. Example to clear only MSF (bit 7) . . . . . . . . . . 47
Table 66. Example to clear both CDTF and MSF . . . . . . 47
Table 67. Timestp_ctl - timestamp control register (address
12h) bit allocation . . . . . . . . . . . . . . . . . . . . . . 50
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
96 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
Table 68. Timestp_ctl - timestamp control register (address
12h) bit description . . . . . . . . . . . . . . . . . . . . . .50
Table 69. Sec_timestp - second timestamp register
(address 13h) bit allocation . . . . . . . . . . . . . . .50
Table 70. Sec_timestp - second timestamp register
(address 13h) bit description . . . . . . . . . . . . . .50
Table 71. Min_timestp - minute timestamp register (address
14h) bit allocation . . . . . . . . . . . . . . . . . . . . . .51
Table 72. Min_timestp - minute timestamp register (address
14h) bit description . . . . . . . . . . . . . . . . . . . . .51
Table 73. Hour_timestp - hour timestamp register (address
15h) bit allocation . . . . . . . . . . . . . . . . . . . . . .51
Table 74. Hour_timestp - hour timestamp register (address
15h) bit description . . . . . . . . . . . . . . . . . . . . . .51
Table 75. Day_timestp - day timestamp register (address
16h) bit allocation . . . . . . . . . . . . . . . . . . . . . .52
Table 76. Day_timestp - day timestamp register (address
16h) bit description . . . . . . . . . . . . . . . . . . . . . .52
Table 77. Mon_timestp - month timestamp register (address
17h) bit allocation . . . . . . . . . . . . . . . . . . . . . .52
Table 78. Mon_timestp - month timestamp register (address
17h) bit description . . . . . . . . . . . . . . . . . . . . . .52
Table 79. Year_timestp - year timestamp register (address
18h) bit allocation . . . . . . . . . . . . . . . . . . . . . .52
Table 80. Year_timestp - year timestamp register (address
18h) bit description . . . . . . . . . . . . . . . . . . . . . .52
Table 81. Battery switch-over and timestamp. . . . . . . . . .53
Table 82. Effect of bits MI and SI on pin INT and bit MSF 55
Table 83. INT operation (bit TI_TP = 1) . . . . . . . . . . . . . .57
Table 84. First increment of time circuits after stop
release . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Table 85. Interface selection input pin IFS . . . . . . . . . . . .62
Table 86. Serial interface . . . . . . . . . . . . . . . . . . . . . . . . .63
Table 87. Command byte definition . . . . . . . . . . . . . . . . .63
Table 88. I2C slave address byte . . . . . . . . . . . . . . . . . . .68
Table 89. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 90. Static characteristics . . . . . . . . . . . . . . . . . . . .73
Table 91. Frequency characteristics . . . . . . . . . . . . . . . .78
Table 92. SPI-bus characteristics . . . . . . . . . . . . . . . . . . .80
Table 93. I2C-bus characteristics . . . . . . . . . . . . . . . . . . .82
Table 94. Selection of Real-Time Clocks . . . . . . . . . . . . .89
Table 95. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .91
Table 96. Revision history . . . . . . . . . . . . . . . . . . . . . . . .93
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
97 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
27. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Fig 26.
Fig 27.
Fig 28.
Fig 29.
Fig 30.
Fig 31.
Fig 32.
Fig 33.
Fig 34.
Fig 35.
Fig 36.
Fig 37.
Block diagram of PCF2127 . . . . . . . . . . . . . . . . . .3
Pin configuration for PCF2127AT (SO20) . . . . . . .4
Pin configuration for PCF2127T (SO16) . . . . . . . .4
Position of the stubs from the package assembly
process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Handling address registers . . . . . . . . . . . . . . . . . .6
Battery switch-over behavior in standard mode with
bit BIE set logic 1 (enabled) . . . . . . . . . . . . . . . . .20
Battery switch-over behavior in direct switching
mode with bit BIE set logic 1 (enabled) . . . . . . . .21
Battery switch-over circuit, simplified block
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Battery low detection behavior with bit BLIE set logic
1 (enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Typical application of the extra power fail detection
function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
PFO signal behavior when battery switch-over is
enabled in standard mode and
Vth(uvp) > (VBAT, Vth(sw)bat) . . . . . . . . . . . . . . . . . . .25
PFO signal behavior when battery switch-over is
enabled in direct switching mode
and Vth(uvp) < VBAT . . . . . . . . . . . . . . . . . . . . . . . .25
PFO signal behavior when battery switch-over is
disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Typical driving capability of VBBS: (VBBS - VDD) with
respect to the output load current IBBS . . . . . . . . .27
Power failure event due to battery discharge: reset
occurs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Dependency between POR and oscillator . . . . . .29
Power-On Reset (POR) system. . . . . . . . . . . . . .29
Power-On Reset Override (PORO) sequence, valid
for both I2C-bus and SPI-bus. . . . . . . . . . . . . . . .30
Data flow of the time function. . . . . . . . . . . . . . . .35
Access time for read/write operations . . . . . . . . .36
Alarm function block diagram. . . . . . . . . . . . . . . .37
Alarm flag timing diagram . . . . . . . . . . . . . . . . . .40
WD_CD[1:0] = 10: watchdog activates an interrupt
when timed out . . . . . . . . . . . . . . . . . . . . . . . . . .43
WD_CD[1:0] = 11: watchdog activates a reset pulse
when timed out . . . . . . . . . . . . . . . . . . . . . . . . . .44
General countdown timer behavior . . . . . . . . . . .45
Timestamp detection with two push-buttons on the
TS pin (for example, for tamper detection) . . . . .48
Interrupt block diagram . . . . . . . . . . . . . . . . . . . .54
INT example for SI and MI when TI_TP is logic 156
INT example for SI and MI when TI_TP is logic 056
Example of shortening the INT pulse by clearing the
MSF flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Example of shortening the INT pulse by clearing the
CDTF flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
AF timing diagram . . . . . . . . . . . . . . . . . . . . . . . .58
STOP bit functional diagram . . . . . . . . . . . . . . . .60
STOP bit release timing . . . . . . . . . . . . . . . . . . . .61
Interface selection . . . . . . . . . . . . . . . . . . . . . . . .62
SDI, SDO configurations . . . . . . . . . . . . . . . . . . .62
Data transfer overview . . . . . . . . . . . . . . . . . . . . .63
PCF2127
Product data sheet
Fig 38.
Fig 39.
Fig 40.
Fig 41.
Fig 42.
Fig 43.
Fig 44.
Fig 45.
Fig 46.
Fig 47.
Fig 48.
Fig 49.
Fig 50.
Fig 51.
Fig 52.
Fig 53.
Fig 54.
Fig 55.
Fig 56.
Fig 57.
Fig 58.
Fig 59.
Fig 60.
Fig 61.
SPI-bus write examples . . . . . . . . . . . . . . . . . . . 64
SPI-bus read examples. . . . . . . . . . . . . . . . . . . . 65
Bit transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Definition of START and STOP conditions . . . . . 66
System configuration. . . . . . . . . . . . . . . . . . . . . . 67
Acknowledgement on the I2C-bus. . . . . . . . . . . . 67
Bus protocol, writing to registers . . . . . . . . . . . . . 68
Bus protocol, reading from registers . . . . . . . . . . 68
Bus protocol, writing to RAM. . . . . . . . . . . . . . . . 69
Bus protocol, reading from RAM . . . . . . . . . . . . . 70
Device diode protection diagram of PCF2127 . . 71
IOL on pin SDA/CE . . . . . . . . . . . . . . . . . . . . . . . 75
IDD as a function of temperature . . . . . . . . . . . . . 75
IDD as a function of VDD . . . . . . . . . . . . . . . . . . . . 76
Typical IDD as a function of the power management
settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Typical characteristic of frequency with respect to
temperature of PCF2127AT . . . . . . . . . . . . . . . . 79
Typical characteristic of frequency with respect to
temperature of PCF2127T . . . . . . . . . . . . . . . . . 79
SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 81
I2C-bus timing diagram; rise and fall times refer to
30 % and 70 % . . . . . . . . . . . . . . . . . . . . . . . . . . 83
General application diagram . . . . . . . . . . . . . . . . 84
Package outline SOT163-1 (SO20)
of PCF2127AT. . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Package outline SOT162-1 (SO16)
of PCF2127T. . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Footprint information for reflow soldering of
SOT163-1 (SO20) of PCF2127AT. . . . . . . . . . . . 87
Footprint information for reflow soldering of
SOT162-1 (SO16) of PCF2127T. . . . . . . . . . . . . 88
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
98 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
28. Contents
1
2
3
4
4.1
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.3
8.3.1
8.3.1.1
8.3.2
8.3.3
8.4
8.4.1
8.5
8.5.1
8.5.2
8.5.3
8.5.4
8.5.5
8.5.5.1
8.5.5.2
8.6
8.6.1
8.6.1.1
8.6.1.2
8.6.1.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Register overview . . . . . . . . . . . . . . . . . . . . . . . 6
Control registers . . . . . . . . . . . . . . . . . . . . . . . 10
Register Control_1 . . . . . . . . . . . . . . . . . . . . . 10
Register Control_2 . . . . . . . . . . . . . . . . . . . . . 11
Register Control_3 . . . . . . . . . . . . . . . . . . . . . 12
Register CLKOUT_ctl . . . . . . . . . . . . . . . . . . . 12
Temperature compensated crystal oscillator . 13
Temperature measurement . . . . . . . . . . . . . . 13
OTP refresh . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Register Aging_offset . . . . . . . . . . . . . . . . . . . 14
Crystal aging correction . . . . . . . . . . . . . . . . . 14
General purpose 512 bytes static RAM . . . . . 15
Register RAM_addr_MSB . . . . . . . . . . . . . . . 16
Register RAM_addr_LSB . . . . . . . . . . . . . . . . 16
Register RAM_wrt_cmd . . . . . . . . . . . . . . . . . 16
Register RAM_rd_cmd . . . . . . . . . . . . . . . . . . 16
Operation examples . . . . . . . . . . . . . . . . . . . . 17
Writing to the RAM . . . . . . . . . . . . . . . . . . . . . 17
Reading from the RAM . . . . . . . . . . . . . . . . . . 17
Power management functions . . . . . . . . . . . . 17
Battery switch-over function . . . . . . . . . . . . . . 19
Standard mode . . . . . . . . . . . . . . . . . . . . . . . . 20
Direct switching mode . . . . . . . . . . . . . . . . . . 21
Battery switch-over disabled: only one power
supply (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.6.1.4
Battery switch-over architecture . . . . . . . . . . . 22
8.6.2
Battery low detection function. . . . . . . . . . . . . 22
8.6.3
Extra power fail detection function . . . . . . . . . 23
8.6.3.1
Extra power fail detection when the battery
switch-over function is enabled . . . . . . . . . . . 24
8.6.3.2
Extra power fail detection when the battery
switch-over function is disabled . . . . . . . . . . . 26
8.6.4
Battery backup supply . . . . . . . . . . . . . . . . . . 26
8.7
Oscillator stop detection function . . . . . . . . . . 27
8.8
8.8.1
8.8.2
8.9
8.9.1
8.9.2
8.9.3
8.9.4
8.9.5
8.9.6
8.9.7
8.9.8
8.10
8.10.1
8.10.2
8.10.3
8.10.4
8.10.5
8.10.6
8.11
8.11.1
8.11.2
8.11.3
8.11.4
8.11.5
8.11.6
8.12
8.12.1
8.12.2
8.12.3
8.12.3.1
8.12.3.2
8.12.3.3
8.12.3.4
8.12.3.5
8.12.3.6
8.12.3.7
8.12.4
8.13
8.13.1
8.13.2
8.13.3
8.13.4
8.13.5
8.13.6
8.13.7
Reset function . . . . . . . . . . . . . . . . . . . . . . . . 28
Power-On Reset (POR) . . . . . . . . . . . . . . . . . 28
Power-On Reset Override (PORO) . . . . . . . . 29
Time and date function. . . . . . . . . . . . . . . . . . 30
Register Seconds. . . . . . . . . . . . . . . . . . . . . . 30
Register Minutes . . . . . . . . . . . . . . . . . . . . . . 31
Register Hours . . . . . . . . . . . . . . . . . . . . . . . . 32
Register Days . . . . . . . . . . . . . . . . . . . . . . . . 32
Register Weekdays . . . . . . . . . . . . . . . . . . . . 33
Register Months. . . . . . . . . . . . . . . . . . . . . . . 34
Register Years . . . . . . . . . . . . . . . . . . . . . . . . 35
Setting and reading the time . . . . . . . . . . . . . 35
Alarm function . . . . . . . . . . . . . . . . . . . . . . . . 37
Register Second_alarm . . . . . . . . . . . . . . . . . 38
Register Minute_alarm. . . . . . . . . . . . . . . . . . 38
Register Hour_alarm . . . . . . . . . . . . . . . . . . . 39
Register Day_alarm . . . . . . . . . . . . . . . . . . . . 39
Register Weekday_alarm. . . . . . . . . . . . . . . . 40
Alarm flag. . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Timer functions. . . . . . . . . . . . . . . . . . . . . . . . 40
Register Watchdg_tim_ctl . . . . . . . . . . . . . . . 41
Register Watchdg_tim_val . . . . . . . . . . . . . . . 42
Watchdog timer function . . . . . . . . . . . . . . . . 42
Countdown timer function . . . . . . . . . . . . . . . 44
Pre-defined timers: second and minute
interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Clearing flags . . . . . . . . . . . . . . . . . . . . . . . . . 46
Timestamp function . . . . . . . . . . . . . . . . . . . . 48
Timestamp flag. . . . . . . . . . . . . . . . . . . . . . . . 48
Timestamp mode . . . . . . . . . . . . . . . . . . . . . . 49
Timestamp registers. . . . . . . . . . . . . . . . . . . . 50
Register Timestp_ctl . . . . . . . . . . . . . . . . . . . 50
Register Sec_timestp. . . . . . . . . . . . . . . . . . . 50
Register Min_timestp . . . . . . . . . . . . . . . . . . . 51
Register Hour_timestp . . . . . . . . . . . . . . . . . . 51
Register Day_timestp. . . . . . . . . . . . . . . . . . . 52
Register Mon_timestp . . . . . . . . . . . . . . . . . . 52
Register Year_timestp . . . . . . . . . . . . . . . . . . 52
Dependency between Battery switch-over and
timestamp . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Interrupt output, INT. . . . . . . . . . . . . . . . . . . . 54
Minute and second interrupts. . . . . . . . . . . . . 55
Countdown timer interrupts . . . . . . . . . . . . . . 56
INT pulse shortening . . . . . . . . . . . . . . . . . . . 56
Watchdog timer interrupts . . . . . . . . . . . . . . . 58
Alarm interrupts . . . . . . . . . . . . . . . . . . . . . . . 58
Timestamp interrupts . . . . . . . . . . . . . . . . . . . 58
Battery switch-over interrupts . . . . . . . . . . . . 58
continued >>
PCF2127
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 19 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
99 of 100
PCF2127
NXP Semiconductors
Accurate RTC with integrated quartz crystal for industrial applications
8.13.8
8.14
8.15
9
9.1
9.1.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.3
10
11
12
13
13.1
13.2
14
14.1
14.2
15
16
16.1
17
18
18.1
19
19.1
20
20.1
21
22
23
24
24.1
24.2
24.3
24.4
25
26
27
28
Battery low detection interrupts . . . . . . . . . . .
External clock test mode . . . . . . . . . . . . . . . .
STOP bit function . . . . . . . . . . . . . . . . . . . . . .
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI-bus interface . . . . . . . . . . . . . . . . . . . . . .
Data transmission . . . . . . . . . . . . . . . . . . . . . .
I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . .
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . .
START and STOP conditions . . . . . . . . . . . . .
System configuration . . . . . . . . . . . . . . . . . . .
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . .
Bus communication and battery backup
operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . .
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics. . . . . . . . . . . . . . . . . . . .
Current consumption characteristics, typical .
Frequency characteristics. . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
SPI-bus timing characteristics . . . . . . . . . . . .
I2C-bus timing characteristics . . . . . . . . . . . . .
Application information. . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . . .
Quality information . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . .
Tape and reel information . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Footprint information. . . . . . . . . . . . . . . . . . . .
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real-Time Clock selection . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
References . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 December 2014
Document identifier: PCF2127