PowerDI3333-8 (Type UXC)

Package Outline Dimensions
PowerDI3333-8 (Type UXC)
D
A
D1
A1
a
E1 E
c
L
E3
E4
E2
k1
D2
k
L
b
e
PowerDI3333-8
(Type UXC)
Dim Min Max Typ
A
0.75 0.85 0.80
A1 0.00 0.05
-b
0.25 0.40 0.32
c
0.10 0.25 0.15
D
3.20 3.40 3.30
D1 2.95 3.15 3.05
D2 0.90 1.30 1.10
E
3.20 3.40 3.30
E1 2.95 3.15 3.05
E2 1.60 2.00 1.80
E3 0.95 1.35 1.15
E4 0.10 0.30 0.20
e
0.65


L
0.30 0.50 0.40
k
0.50 0.90 0.70
k1 0.13 0.53 0.33
a
0°
12°
10°
All Dimensions in mm
Suggested Pad Layout
PowerDI3333-8 (Type UXC)
X3
X2
Y2
X1
G1
G
Y1
Y3
Dimensions Value (in mm)
C
0.650
G
0.230
G1
0.600
X
0.420
X1
1.200
X2
2.370
X3
2.630
Y
0.600
Y1
1.900
Y2
2.400
Y3
3.600
Y
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2016-01-26
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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