Package Outline Dimensions PowerDI3333-8 (SWP) (Type UX) D A D1 E1 A1 E 0 c Detail A Detail A L E4 E3 E2 0.050 D2 k 0.150 PowerDI3333-8 (SWP) (Type UX) Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 -b 0.25 0.40 0.32 c 0.10 0.25 0.15 D 3.20 3.40 3.30 D1 2.95 3.15 3.05 D2 2.30 2.70 2.50 E 3.20 3.40 3.30 E1 2.95 3.15 3.05 E2 1.60 2.00 1.80 E3 0.95 1.35 1.15 E4 0.10 0.30 0.20 e 0.65 k 0.50 0.90 0.70 L 0.30 0.50 0.40 θ 0° 12° 10° All Dimensions in mm L e b Suggested Pad Layout PowerDI3333-8 (SWP) (Type UX) X3 X1 X2 Y1 Y2 Y4 Y5 Y6 X4 Y3 Y C Dimensions Value (in mm) C 0.650 X 0.420 X1 0.420 X2 0.230 X3 2.600 X4 3.500 Y 0.700 Y1 0.550 Y2 1.650 Y3 0.600 Y4 2.450 Y5 0.400 Y6 3.700 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-04-27 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated