X2-DFN1010-6 (Type C)

Package Outline Dimensions
X2-DFN1010-6 (Type C)
A
A1
Seating Plane
D
X2-DFN1010-6
(Type C)
Dim Min Max
Typ
A
-
0.35
-
A1
0.04
b
0.12 0.20
0.15
D
0.95 1.050 1.00
E
0.95 1.050 1.00
e
0.35 BSC
e1
0.55 BSC
L3 0.27 0.30
0.30
L3a 0.32 0.40
0.35
All Dimensions in mm
L3(5x)
e
L3a
e1
E
(Pin #1 ID)
b
Suggested Pad Layout
X2-DFN1010-6 (Type C)
X1
C
Y(4x)
Y2
Y3
G
G1
Y1
Pin1
Dimensions
C
G
G1
X
X1
Y
Y1
Y2
Y3
Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on
application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired
for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
2016-01-26
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Package Outline Dimensions
Suggested Pad Layout
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