LCD-016N001B-YYH-ET Datasheet

LCD-016N001B-YYH-ET
www.vishay.com
Vishay
16 x 1 Character LCD
FEATURES
• Type: Character
• Display format: 16 x 1 characters
• Built-in controller: ST 7066 or equivalent
• Duty cycle: 1/16
• 5 x 8 dots includes cursor
• + 5 V power supply
• LED can be driven by pin 1, pin 2, pin 15, pin 16, or A and K
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
ITEM
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
Module Dimension
UNIT
85.0 x 28.0 x 13.5
ITEM
SYMBOL
STANDARD VALUE
MIN.
TYP.
MAX.
Viewing Area
66.0 x 16.0
Power Supply
VDD to VSS
- 0.3
-
7.0
Dot Size
0.55 x 0.75
Input Voltage
VI
VSS
-
VDD
Dot Pitch
0.63 x 0.83
Mounting Hole
80.0 x 23.0
Character Size
3.07 x 6.56
mm
UNIT
V
Note
• VSS = 0 V, VDD = 5.0 V
ELECTRICAL CHARACTERSITICS
ITEM
SYMBOL
CONDITION
Input Voltage
VDD
Supply Current
IDD
Recommended LC Driving
Voltage for Normal Temperature
Version Module
VDD to V0
STANDARD VALUE
UNIT
MIN.
TYP.
MAX.
VDD = + 5 V
4.5
5.0
5.5
V
VDD = + 5 V
-
1.2
-
mA
5.5
- 20 °C
-
-
0 °C
-
-
-
25 °C
-
4.5
-
50 °C
-
-
-
70 °C
3.5
-
-
V
LED Forward Voltage
VF
25 °C
-
-
-
V
LED Forward Current
IF
25 °C
-
-
-
mA
EL Power Supply Current
IEL
VEL = 110 VAC, 400 Hz
-
-
-
mA
DISPLAY CHARACTER ADDRESS CODE
Display Position
DD RAM Address
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
00
01
02
03
04
05
06
07
40
41
42
43
44
45
46
47
Document Number: 37413
1
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INTERFACE PIN FUNCTION
PIN NO.
SYMBOL
FUNCTION
1
VSS
Ground
2
VDD
Supply voltage for logic (+ 5 V)
3
V0
Operating voltage for LCD (variable)
4
RS
H/L; H: data/L: instruction code
5
R/W
H/L; H: read (MPU → module)/L: write (MPU → module)
6
E
H, H → L chip enable signal
7
DB0
H/L data bus line
8
DB1
H/L data bus line
9
DB2
H/L data bus line
10
DB3
H/L data bus line
11
DB4
H/L data bus line
12
DB5
H/L data bus line
13
DB6
H/L data bus line
14
DB7
H/L data bus line
DIMENSIONS in millimeters
6.38
Pin Detail
1
A
H1 Max.
H2
25.5
K
5.08
5.5
11.46
Dot Size
13.08
A
2
16 x Ø 1.0 PTH
16 x Ø 1.8 PAD
K
13
6.56 (AA)
25.2
16.0 (VA)
14
28.0 ± 0.5
4.95
59.62 (AA)
10.72
1.4
12.69
2.54
2.5
66.0 (VA)
7.46
71.2
9.5
6.56
0.83
0.75
85.0 ± 0.5
6.9
2.0
(P2.54 x 6)
15.24
0.63
0.55
3.77
3.07
LED - B/L
4 x Ø 2.5
4 x Ø 5.0
H1
H2
4 x Ø 1.0 PTH
2.5
High
13.5
8.9
80.0
1.6
LED B/L
Document Number: 37413
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1.Module Classification Indormation
ġ ġ
ġ ġ
LCD
1.
016
N 001
B -Y Y H -ET
Brand烉Vishay Intertechnology, Inc.
2. Horizontal Format:
16 characters
3.
Display Type烉NɦCharacter Type, HɦGraphic Type
4.
Vertical Format:
5.
Model serials no.: B
6.
Backlight Type烉 NɦWithout backlight
1 Line
TɦLED, White
BɦEL, Blue green
AɦLED, Amber
DɦEL, Green
RɦLED, Red
WɦEL, White
OɦLED, Orange
FɦCCFL, White
GɦLED, Green
YɦLED, Yellow Green
7.
LCD Mode烉
BɦTN Positive, Gray
TɦFSTN Negative
NɦTN Negative,
GɦSTN Positive, Gray
YɦSTN Positive, Yellow Green
MɦSTN Negative, Blue
FɦFSTN Positive
8. LCD Polarizer AɦReflective, N.T, 6:00
Type/ Temperature DɦReflective, N.T, 12:00
range/ View direction
GɦReflective, W. T, 6:00
HɦTransflective, W.T,6:00
JɦReflective, W. T, 12:00
FɦTransmissive, N.T,12:00
BɦTransflective, N.T,6:00
IɦTransmissive, W. T, 6:00
EɦTransflective, N.T.12:00
LɦTransmissive, W.T,12:00
9.
Special Code
KɦTransflective, W.T,12:00
CɦTransmissive, N.T,6:00
ET : English and European standard font
Compliant with the ROHS Directions and regulations
Document Number: 37413
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2.Precautions in use of LCD Modules
(1) Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3) Don’t disassemble the LCM.
(4) Don’t operate it above the absolute maximum rating.
(5) Don’t drop, bend or twist LCM.
(6) Soldering: only to the I/O terminals.
(7) Storage: please storage in anti-static electricity container and clean environment.
3.General Specifications
ITEM
Number of Characters:
STANDARD VALUE
UNIT
16 charactersǘ1 Lines
85.0ǘ28.0ǘ13.5(MAX)mm
mm
View area:
66.0ǘ16.0mm
mm
Active area:
59.62ǘ6.56mm
mm
Module dimension:
Dots size:
(L)0.55ǘ(W)0.75mm
Dots pitch:
(L)0.63ǘ(W)0.83mm
Character size:
(L)3.07ǘ(W)6.56mm
mm
Character pitch:
(L)3.77ǘ(W)6.56mm
mm
LCD type:
Duty:
View direction:
Backlight Type
STN, positive, Transflective, Yellow Green
1/16
6 o’clock
LED Yellow Green
Document Number: 37413
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4.Absolute Maximum Ratings
ITEM
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
T OP
-20
炼
+70
ɗ
Storage Temperature
T ST
-30
炼
+80
ɗ
Input Voltage
VI
V SS
炼
V DD
V
Supply Voltage For Logic
VDD-V SS
-0.3
炼
7
V
Supply Voltage For LCD
V DD -V 0
-0.3
炼
13
V
5.Electrical Characteristics
ITEM
Supply Voltage For Logic
Supply Voltage For LCD
SYMBOL CONDITION
V DD -V SS
V DD -V 0
MIN.
TYP.
MAX.
UNIT
炼
4.5
5.0
5.5
V
Ta=-20ɗ
炼
炼
5.5
V
Ta=25ɗ
炼
4.5
炼
V
Ta=70ɗ
3.5
炼
炼
V
Input High Vol
V IH
炼
0.7 V DD
炼
V DD
V
Input Low Vol
V IL
炼
V SS
炼
0.6
V
Output High Vol
V OH
炼
3.9
炼
炼
V
Output Low Vol.
V OL
炼
炼
炼
0.4
V
Supply Current
I DD
V DD =5V
炼
1.2
炼
mA
Document Number: 37413
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6.Optical Characteristics
ITEM
SYMBAL CONDITION
MIN.
TYP.
MAX.
UNIT
(V)ȧ
CRʁ2
20
40
deg
(H)ȴ
CRʁ2
-30
30
deg
CR
炼
3
T rise
炼
100
150
ms
T fall
炼
100
150
ms
View Angle
Contrast Ratio
炼
Response Time
6.1ġ Definitions
ˍView Anglesġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ˍContrast Ratio
Z
( Visual angle direction )
Brightness at selected state ( BS )
Brightness at non-selected state ( Bns )
Selected state
CR =
Brightness (%)
θ
LCD
X
φ
Non-selected state
Bs
Bns
Y
Operating voltage for LCD driving
( Best visual angle direction )
ˍResponse Time
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
Nonselected Condition
10 %
tr
Rise Time
td
Decay Time ( fall time tf )
Document Number: 37413
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7.Interface Pin Function
Pin No.
Symbol
Level
Description
1
V SS
0V
2
V DD
5.0V
3
VO
4
RS
H/L
H:DATA, L:Instruction code
5
R/W
H/L
H:Read(MPUɦModule)L:Write(MPUɦModule)
6
E
7
DB0
H/L
Data bus line
8
DB1
H/L
Data bus line
9
DB2
H/L
Data bus line
10
DB3
H/L
Data bus line
11
DB4
H/L
Data bus line
12
DB5
H/L
Data bus line
13
DB6
H/L
Data bus line
14
DB7
H/L
Data bus line
Ground
Supply Voltage for logic
(Variable) Operating voltage for LCD
H,HɦL Chip enable signal
Document Number: 37413
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8.Contour Drawing & Block Diagram
Document Number: 37413
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction
register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for display
data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU.
The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address
information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the
register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
0
0
IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will
not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must
be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes.
capacity is 80ǘ8 bits or 80 characters.
Its extended
Below figure is the relationship between DDRAM addresses and
positions on the liquid crystal display.
High bits
Low bits
Example: DRAM addresses 4E
AC
(hexadecimal)
AC6 AC5 AC4 AC3 AC2 AC1 AC0
1
0
0
1
1
1
0
Document Number: 37413
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DDRAM Address
Display position DDRAM address
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
00
01
02
03
04
05
06
07
40
41
42
43
44
45
46
47
1-Line by 16-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5ǘ8 dot or 5ǘ10 dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 5ǘ8 dots, eight character patterns can be
written, and for 5ǘ10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the
character patterns stored in CGRAM.
Document Number: 37413
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
For 5 * 8 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
Low
0 0 0 0 * 0 0 0
0 0 0 0 * 0 0 1
0 0 0 0 * 1 1 1
CGRAM Address
5 4 3 2 1 0
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1 1 0
1 0
1 1
1 1
0 0
0 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1 1 1 1
1
1
1
0
1
0
1
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
High
0
0
1
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
High
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
Low
0
0 0 0
0 0 0
0
0
0
0 0
0
0
0
0 0
0
0
0 0
0 0 0
0 0
0
0
Character
pattern( 1 )
0 0
0 0
Character
pattern( 2 )
0 0
0 0
0 0
0 0
0 0 0 0 0
Cursor pattern
Cursor pattern
* * *
For 5 * 10 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
Low
0 0 0 0 * 0 0 0
CGRAM Address
5 4 3 2 1 0
High
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
Low
0
0
0
0
0
0 0 0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
High
0
1
0
1
0
1
0
1
0
1
0
1 1 1 1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Low
* 0 0 0 0 0
* 0 0 0 0 0
0
0
*
0 0
*
0 0 0
*
0 0 0
*
0
*
0 0 0 0
*
0 0 0 0
*
0 0 0 0
*
* 0 0 0 0 0
Character
pattern
Cursor pattern
* * * * * * * *
: " High "
Document Number: 37413
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10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG
RAM
(1)
LLLH
CG
RAM
(2)
LLHL
CG
RAM
(3)
LLHH
CG
RAM
(4)
LHLL
CG
RAM
(5)
LHLH
CG
RAM
(6)
LHHL
CG
RAM
(7)
LHHH
CG
RAM
(8)
HLLL
CG
RAM
(1)
HLLH
CG
RAM
(2)
HLHL
CG
RAM
(3)
HLHH
CG
RAM
(4)
HHLL
CG
RAM
(5)
HHLH
CG
RAM
(6)
HHHL
CG
RAM
(7)
HHHH
CG
RAM
(8)
Document Number: 37413
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11.Instruction Table
Instruction Code
Instruction
Execution time
(fosc=270Khz)
Description
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Clear Display
0
0
0
0
0
0
0
0
0
1
Write “00H” to DDRAM and set
DDRAM address to “00H” from AC
1.53ms
1.53ms
Return Home
0
0
0
0
0
0
0
0
1
炼
Set DDRAM address to “00H” from AC
and return cursor to its original position
if shifted. The contents of DDRAM are
not changed.
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
SH
Assign cursor moving direction and
enable the shift of entire display.
39ȫs
Display
ON/OFF
Control
0
0
0
0
0
0
1
D
C
B
Set display (D), cursor (C), and blinking
of cursor (B) on/off control bit.
39ȫs
Cursor or
Display Shift
0
0
0
0
0
1
炼
炼 control bit, and the direction, without
Function Set
Set CGRAM
Address
Set DDRAM
Address
Set cursor moving and display shift
S/C R/L
39ȫs
changing of DDRAM data.
Set interface data length
(DL:8-bit/4-bit), numbers of display line
(N:2-line/1-line)and, display font type
(F:5ǘ11 dots/5ǘ8 dots)
39ȫs
AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.
39ȫs
1
DL
N
F
炼
炼
0
0
0
0
0
0
0
1
0
0
1
AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
39ȫs
Whether during internal operation or not
can be known by reading BF. The
AC6 AC5 AC4 AC3 AC2 AC1 AC0
contents of address counter can also be
read.
0ȫs
Read Busy
Flag and
Address
0
1
BF
Write Data to
RAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0
Write data into internal RAM
(DDRAM/CGRAM).
43ȫs
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0
Read data from internal RAM
(DDRAM/CGRAM).
43ȫs
点 ”炼”烉don’t care
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12.Timing Characteristics
12.1ġ Write Operation
Ta=25ɗ, VDD=5įıV
Item
Symbol
Min
Typ
Max
Unit
Enable cycle time
TC
1200
炼
炼
ns
Enable pulse width
TPW
140
炼
炼
ns
Enable rise/fall time
TR,TF
炼
炼
25
ns
Address set-up time (RS, R/W to E)
t AS
0
炼
炼
ns
Address hold time
t AH
10
炼
炼
ns
Data set-up time
t DSW
40
炼
炼
ns
tH
10
炼
炼
ns
Data hold time
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12.2ġġ Read Operation
Ta=25ɗ, VDD=5ŗ
Item
Symbol
Min
Typ
Max
Unit
TC
1200
炼
炼
ns
TPW
140
炼
炼
ns
TR,TF
炼
炼
25
ns
Address set-up time (RS, R/W to E)
t AS
0
炼
炼
ns
Address hold time
t AH
10
炼
炼
ns
Data delay time
t DDR
炼
炼
100
ns
Data hold time
tH
10
炼
炼
ns
Enable cycle time
Enable pulse width (high level)
Enable rise/fall time
Document Number: 37413
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13.Initializing of LCM
Power on
Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
*
0
*
*
*
0
0
1
1
0
Function set
Wait for more than 39us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
1
0
*
*
*
*
0
0
N F
*
*
*
*
*
*
0
Function set
Wait for more than 39 μs
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
1
0
*
*
*
* Function set
0
*
*
*
N F
*
0
0
*
*
Wait for more than 37us
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
* *
*
0
0
*
0
0
0
0
* *
*
0
B
*
1
D C
0
Wait for more than 37 μs
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
*
*
0
0
*
0
*
0
0
0
*
*
0
0
*
*
0
0
0
1
Wait for more than 1.53ms
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
* *
0
0
0
*
0
0
0
*
0
1
* *
*
0
0
I/D SH *
Initialization ends
4-Bit Ineterface
Document Number: 37413
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Power on
Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set
0 0 0 0 1 1 N F * *
Wait for more than 39us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0 0 0 0 1 1 N F * *
Function set
Wait for more than 37us
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 1 B C
D
Wait for more than 37 μs
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 0 0 0 1
Wait for more than 1.53ms
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 0 1 I/D S
Initialization ends
8-Bit Ineterface
Document Number: 37413
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14.Reliability
Content of Reliability Test (wide temperature, -20ɗ~70ɗ)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to the
element for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
The module should be allowed to stand at 60
ɗ,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of operation
-20ɗ
25ɗ
70ɗ
30min
5min
1 cycle
Test Condition
80ɗ
200hrs
-30ɗ
200hrs
Note
2
1,2
70ɗ
200hrs
——
-20ɗ
200hrs
1
60ɗ,90%RH
96hrs
-20ɗ/70ɗ
10 cycles
1,2
——
30min
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
10~55Hz
Endurance test applying the vibration during
3
Vibration test
One cycle 60
transportation and using.
seconds to 3
directions of X,Y,Z
for
Each
15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to the ȟ
Static electricity test
——
terminal.
CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
Document Number: 37413
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15.Backlight Information
ġ
Specification
PARAMETER
SYMBOL MIN
Supply Current
ILED
104
Supply Voltage
V
4.0
Reverse Voltage
VR
MAX
UNIT
TESTġ CONDITION
195
mA
V=4.2V
4.2
4.4
V
炼
炼
炼
10
V
炼
IV
135
195
炼
CD/M2 ILED=130mA
Wave Length
Ȫp
ʇ
571
炼
nm
ILED =130mA
Life Time
炼
炼
100000 炼
Hr.
ILEDʀ
ʀ130mA
Color
Yellow Green
Luminous
Intensity
TYP
130
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
LED B\L Drive Method
1.Drive from A , K
R
A
B/L
K
Document Number: 37413
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16.Inspection Specification
NO
01
02
Item
Criterion
AQL
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
2.1 White and black spots on display ʀ0.25mm, no more than
Black or white
three white or black spots present.
spots on LCD
2.2 Densely spaced: No more than two spots or lines within 3mm
(display only)
3.1 Round type : As following drawing
ȜľĩġŹġĬġźġĪġİġijġ ġ ġ ġ
ŔŊśņġ
2.5
łŤŤŦűŵŢţŭŦġŒġŕŚġ
ġ ġ ġ ġ ġ ȜʀıįIJıġ łŤŤŦűŵġůŰġťŦůŴŦġ
ıįIJı烋Ȝʀıįijıġ
03
2.5
ıįijı烋ȜʀıįijĶġ
IJġ
LCD black
ġ
ıįijĶ烋Ȝġ
ıġ
spots, white
spots,
contamination
(non-display) 3.2 Line type : (As following drawing)
Length
Width
Acceptable Q TY
---
Wʀıįıij
LʀĴįı
0.02烋WʀıįıĴ
LʀijįĶ
---
04
ijġ
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
0.03烋WʀıįıĶġ
0.05烋W
Size Ȝ
Ȝʀıįijı
Accept no dense
2.5
2
As round type
Acceptable Q TY
Accept no dense
ıįijı烋ȜʀıįĶı
3
ıįĶı烋ȜʀIJįıı
2
IJįıı烋Ȝ
0
Total Q TY
2.5
3
Document Number: 37413
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NO
Item
05
Scratches
Vishay
Criterion
AQL
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źĻġńũŪűġŸŪťŵũġ
ŹĻġńũŪűġŭŦůŨŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġ
ŢųŦŢġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŹʀIJİĹŢġ
2.5
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
ķįIJįijġńŰųůŦųġŤųŢŤŬĻġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
śʀIJİijŵġ
IJİijŵ烋Żʀijŵġ
ġ
źĻġńũŪűġŸŪťŵũġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġ
ŢųŦŢġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŹʀIJİĹŢġ
ŹʀIJİĹŢġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵũŦġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
Document Number: 37413
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NO
Vishay
Item
Criterion
AQL
ŔźŮţŰŭŴġĻġ
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀıįĶŮŮġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġ ʀġ ŵġ
ķįijįijġŏŰůĮŤŰůťŶŤŵŪŷŦġűŰųŵŪŰůĻġ
06
Glass
crack
2.5
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀġ ōġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġ ʀġ ŵġ
ġ
˞ŊŧġŵũŦġŤũŪűűŦťġŢųŦŢġŵŰŶŤũŦŴġŵũŦġŊŕŐġŵŦųŮŪůŢŭĭġŰŷŦųġijİĴġŰŧġŵũŦġŊŕŐġŮŶŴŵġ
ųŦŮŢŪůġŢůťġţŦġŪůŴűŦŤŵŦťġŢŤŤŰųťŪůŨġŵŰġŦŭŦŤŵųŰťŦġŵŦųŮŪůŢŭġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
˞ŊŧġŵũŦġűųŰťŶŤŵġŸŪŭŭġţŦġũŦŢŵġŴŦŢŭŦťġţźġŵũŦġŤŶŴŵŰŮŦųĭġŵũŦġŢŭŪŨůŮŦůŵġŮŢųŬġ
ůŰŵġţŦġťŢŮŢŨŦťįġ
ķįijįĴġŔŶţŴŵųŢŵŦġűųŰŵŶţŦųŢůŤŦġŢůťġŪůŵŦųůŢŭġŤųŢŤŬįġ
ġ
źĻġŸŪťŵũġ ġ
ŹĻġŭŦůŨŵũġ
źʀIJİĴōġ
Źġ ʀġ Ţġ
ġ
Document Number: 37413
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NO
Item
07
Cracked glass
08
Backlight
elements
09
10
Bezel
PCBˣCOB
Vishay
Criterion
AQL
ŕũŦġōńŅġŸŪŵũġŦŹŵŦůŴŪŷŦġŤųŢŤŬġŪŴġůŰŵġŢŤŤŦűŵŢţŭŦįġ
2.5
ĹįIJġŊŭŭŶŮŪůŢŵŪŰůġŴŰŶųŤŦġŧŭŪŤŬŦųŴġŸũŦůġŭŪŵįġ
ĹįijġŔűŰŵŴġŰųġŴŤųŢŵŤũŦťġŵũŢŵġŢűűŦŢųġŸũŦůġŭŪŵġŮŶŴŵġţŦġūŶťŨŦťįġŖŴŪůŨġ
ōńŅġŴűŰŵĭġŭŪůŦŴġŢůťġŤŰůŵŢŮŪůŢŵŪŰůġŴŵŢůťŢųťŴįġ
ĹįĴġŃŢŤŬŭŪŨũŵġťŰŦŴůȽŵȽŵġŭŪŨũŵġŰųġŤŰŭŰųġŸųŰůŨįġ
ĺįIJġŃŦŻŦŭġŮŢźġůŰŵġũŢŷŦġųŶŴŵĭġţŦġťŦŧŰųŮŦťġŰųġũŢŷŦġŧŪůŨŦųűųŪůŵŴĭġŴŵŢŪůŴġ
ŰųġŰŵũŦųġŤŰůŵŢŮŪůŢŵŪŰůįġ
ĺįijġŃŦŻŦŭġŮŶŴŵġŤŰŮűŭźġŸŪŵũġūŰţġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
IJıįIJġńŐŃġŴŦŢŭġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŭŢųŨŦųġŵũŢůġıįijŮŮġŰųġ
ŤŰůŵŢŮŪůŢŵŪŰůįġ
IJıįijġńŐŃġŴŦŢŭġŴŶųŧŢŤŦġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŵũųŰŶŨũġŵŰġŵũŦġŊńįġ
IJıįĴġThe height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
IJıįĺ The Scraping testing standard for Copper Coating of PCB
0.65
2.5
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
X * Y<=2mm2ġ
IJIJįIJġŏŰġŶůĮŮŦŭŵŦťġŴŰŭťŦųġűŢŴŵŦġŮŢźġţŦġűųŦŴŦůŵġŰůġŵũŦġőńŃįġ
IJIJįijġŏŰġŤŰŭťġŴŰŭťŦųġūŰŪůŵŴĭġŮŪŴŴŪůŨġŴŰŭťŦųġŤŰůůŦŤŵŪŰůŴĭġŰŹŪťŢŵŪŰůġŰųġ
ŪŤŪŤŭŦįġ
IJIJįĴġŏŰġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġőńŃįġ
IJIJįĵġŏŰġŴũŰųŵġŤŪųŤŶŪŵŴġŪůġŤŰŮűŰůŦůŵŴġŰůġőńŃįġ
Y
11
Soldering
NO
Item
12
General
appearance
Criterion
ġ
IJijįIJġŏŰġŰŹŪťŢŵŪŰůĭġŤŰůŵŢŮŪůŢŵŪŰůĭġŤŶųŷŦŴġŰųĭġţŦůťŴġŰůġŪůŵŦųŧŢŤŦġőŪůġ
ĩŐōŃĪġŰŧġŕńőįġ
IJijįijġŏŰġŤųŢŤŬŴġŰůġŪůŵŦųŧŢŤŦġűŪůġĩŐōŃĪġŰŧġŕńőįġ
IJijįĴġŏŰġŤŰůŵŢŮŪůŢŵŪŰůĭġŴŰŭťŦųġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġűųŰťŶŤŵįġ
IJijįĵġŕũŦġŊńġŰůġŵũŦġŕńőġŮŢźġůŰŵġţŦġťŢŮŢŨŦťĭġŤŪųŤŶŪŵŴįġ
IJijįĶġŕũŦġŶűűŦųŮŰŴŵġŦťŨŦġŰŧġŵũŦġűųŰŵŦŤŵŪŷŦġŴŵųŪűġŰůġŵũŦġŪůŵŦųŧŢŤŦġűŪůġ
ŮŶŴŵġţŦġűųŦŴŦůŵġŰųġŭŰŰŬġŢŴġŪŧġŪŵġŤŢŶŴŦŴġŵũŦġŪůŵŦųŧŢŤŦġűŪůġŵŰġ
ŴŦŷŦųįġ
IJijįķġŕũŦġųŦŴŪťŶŢŭġųŰŴŪůġŰųġŵŪůġŰŪŭġŰŧġŴŰŭťŦųŪůŨġĩŤŰŮűŰůŦůŵġŰųġŤũŪűġ
ŤŰŮűŰůŦůŵĪġŪŴġůŰŵġţŶųůŦťġŪůŵŰġţųŰŸůġŰųġţŭŢŤŬġŤŰŭŰųįġ
IJijįĸġŔŦŢŭŢůŵġŰůġŵŰűġŰŧġŵũŦġŊŕŐġŤŪųŤŶŪŵġũŢŴġůŰŵġũŢųťŦůŦťįġ
2.5
2.5
2.5
0.65
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
Document Number: 37413
23
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 08-Jan-13
LCD-016N001B-YYH-ET
www.vishay.com
IJijįĹġőŪůġŵźűŦġŮŶŴŵġŮŢŵŤũġŵźűŦġŪůġŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
IJijįĺġōńŅġűŪůġŭŰŰŴŦġŰųġŮŪŴŴŪůŨġűŪůŴįġ
IJijįIJıġőųŰťŶŤŵġűŢŤŬŢŨŪůŨġŮŶŴŵġŵũŦġŴŢŮŦġŢŴġŴűŦŤŪŧŪŦťġŰůġűŢŤŬŢŨŪůŨġ
ŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
IJijįIJIJġőųŰťŶŤŵġťŪŮŦůŴŪŰůġŢůťġŴŵųŶŤŵŶųŦġŮŶŴŵġŤŰůŧŰųŮġŵŰġűųŰťŶŤŵġ
ŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
ġ
Vishay
0.65
Document Number: 37413
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For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 08-Jan-13
LCD-016N001B-YYH-ET
www.vishay.com
Vishay
17.Material List of Components for RoHS
1. Declaration that all of or part of products (with the mark “N” in code), including, but not limited to, the
LCM, accessories or packages, manufactured and/or delivered to your company (including your
subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or
affiliated companies) do not intentionally contain any of the substances listed in all applicable EU
directives and regulations, including the following substances.
Exhibit A烉The Harmful Material List
.
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement烉
(1) Use the Sn/Ag/Cu soldering surface烊the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.烉
Reflow烉250C, 30 seconds Max.烊
Connector soldering wave or hand soldering烉320C, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.烉235C±5 degrees烊
Recommended customer’s soldering temp. of connector烉280C, 3 seconds.
Document Number: 37413
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For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 08-Jan-13
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000