LCD-012N002A-NGG-ET

LCD-012N002A-NGG-ET
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12 x 2 Character LCD
FEATURES
• Type: Character
• Display format: 12 x 2 characters
• Built-in controller: HD44780 (or equivalent)
• Duty cycle: 1/16
• 5 x 8 dots includes cursor
• + 5 V power supply
• LED can be driven by pin 1, pin 2, or A and K
• Compliant to RoHS Directive 2002/95/EC
MECHANICAL DATA
ITEM
Module Dimension
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
UNIT
SYMBOL
46.0 x 14.5
Power Supply
VDD to VSS
- 0.3
-
7.0
0.45 x 0.60
Power Supply
VDD to V0
- 0.3
-
13.0
Input Voltage
VI
VSS
-
VDD
55.7 x 32.0 x 9.7 (max.)
Viewing Area
Dot Size
STANDARD VALUE
ITEM
mm
Dot Pitch
0.55 x 0.70
Mounting Hole
31.2 x 30.0
Character Size
2.65 x 5.50
MIN.
TYP.
MAX.
UNIT
V
Note
• VSS = 0 V, VDD = 5.0 V
ELECTRICAL CHARACTERISTICS
ITEM
SYMBOL
CONDITION
Input Voltage
VDD
Supply Current
IDD
Recommended LC Driving
Voltage for Normal Temperature
Version Module
VDD to V0
STANDARD VALUE
UNIT
MIN.
TYP.
MAX.
VDD = + 5 V
4.5
5.0
5.5
V
VDD = + 5 V
-
1.2
-
mA
- 20 °C
-
-
5.7
0 °C
-
-
-
25 °C
-
4.2
-
50 °C
-
-
-
70 °C
3.5
-
-
V
LED Supply Voltage
V
n/a
-
-
-
V
LED Supply Current
ILED
n/a
-
-
-
mA
DISPLAY CHARACTER ADDRESS CODE
Display Position
1
2
3
4
5
6
7
8
9
10
11
12
DD RAM Address
00
01
02
03
04
05
06
07
08
09
0A
0B
DD RAM Address
40
41
42
43
44
45
46
47
48
49
4A
4B
Revision: 20-Jul-11
1
Document Number: 37404
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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INTERFACE PIN FUNCTION
PIN NO.
SYMBOL
FUNCTION
1
VSS
Ground
2
VDD
+ 5 V supply voltage for logic
3
V0
Operating voltage for LCD (variable)
4
RS
H/L; H: data/L: instruction code
5
R/W
H/L; H: read (MPU  module)/L: Write (MPU  module)
6
E
H, H  L chip enable signal
7
DB0
H/L data bus line
8
DB1
H/L data bus line
9
DB2
H/L data bus line
10
DB3
H/L data bus line
11
DB4
H/L data bus line
12
DB5
H/L data bus line
13
DB6
H/L data bus line
14
DB7
H/L data bus line
15
A
NC
55.7 ± 0.5
51.3
2.2
4.5
4.85
8.93
46.7
46.0 (VA)
37.85 (AA)
4 x Ø 1.0 PTH
Revision: 20-Jul-11
1.0
6.20
5.50
0.70
0.60
9.0 11.5
30.0
0.55
0.45
3.0
18.96
12.25
15
1.0
17.78
(P1.27 x 14)
31.2
1.6
1.5
1.5
1
4 x R1.25
3.20
2.65
9.7 Max.
5.1
32.0 ± 0.5
24.7
17.5
14.5 (VA)
11.7 (AA)
3.65
7.25
8.75
10.15
DIMENSIONS in millimeters
Edge LED or NO B/L
Dot Size
15 x Ø 0.7 PTH
15 x Ø 1.0 PAD
2
Document Number: 37404
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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1.Module Classification Information
LCD
012
N 002
A -N
G G -ET
1. Brand烉Vishay Intertechnology, Inc.
2. Horizontal Format: 12 characters
3. Display Type烉NɦCharacter Type, HɦGraphic Type
4. Vertical Format: 2 lines
5. Model serials no.: A
6. Backlight
NɦWithout backlight
TɦLED, White
Type烉
BɦEL, Blue green
AɦLED, Amber
DɦEL, Green
RɦLED, Red
WɦEL, White
OɦLED, Orange
FɦCCFL, White
GɦLED, Green
YɦLED, Yellow Green
7. LCD Mode烉 BɦTN Positive, Gray
TɦFSTN Negative
NɦTN Negative,
GɦSTN Positive, Gray
YɦSTN Positive, Yellow Green
MɦSTN Negative, Blue
FɦFSTN Positive
8. LCD Polarize AɦReflective, N.T, 6:00
HɦTransflective, W.T,6:00
Type/ Temperature DɦReflective, N.T, 12:00
KɦTransflective, W.T,12:00
range/ View
GɦReflective, W. T, 6:00
CɦTransmissive, N.T,6:00
direction
JɦReflective, W. T, 12:00
FɦTransmissive, N.T,12:00
BɦTransflective, N.T,6:00
IɦTransmissive, W. T, 6:00
EɦTransflective, N.T.12:00 LɦTransmissive, W.T,12:00
9. Special Code ET : English and European standard font;
Compliance with the ROHS Directions and regulations
Revision: 20-Jul-11
3
Document Number: 37404
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2.Precautions in use of LCD Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
3.General Specification
Item
Dimension
Unit
Number of Characters
12 characters x 2 Lines
炼
Module dimension
55.7 x 32.0 x 9.7(MAX)
mm
View area
46.0 x 14.5
mm
Active area
37.85 x 11.7
mm
Dot size
0.45 x 0.60
mm
Dot pitch
0.55 x 0.70
mm
Character size
2.65 x 5.50
mm
Character pitch
3.20 x 6.20
mm
LCD type
STN Positive, Gray Reflective,
Duty
1/16
View direction
6 o’clock
Backlight Type
Without backlight
Revision: 20-Jul-11
4
Document Number: 37404
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4.Absolute Maximum Ratings
Item
Symbol
Min
Typ
Max
Unit
Operating Temperature
T OP
-20
炼
+70
ɗ
Storage Temperature
T ST
-30
炼
+80
ɗ
Input Voltage
VI
V SS
炼
V DD
V
Supply Voltage For Logic
VDD-V SS
-0.3
炼
7
V
Supply Voltage For LCD
V DD -V 0
-0.3
炼
13
V
5.Electrical Characteristics
Item
Supply Voltage For Logic
Supply Voltage For LCD
Symbol
Condition
Min
Typ
Max
Unit
V DD -V SS
炼
4.5
5.0
5.5
V
Ta=-20ɗ
炼
炼
5.7
V
Ta=25ɗ
炼
4.2
炼
V
Ta=70ɗ
3.5
炼
炼
V
V DD -V 0
Input High Volt.
V IH
炼
0.7VDD
炼
V DD
V
Input Low Volt.
V IL
炼
V SS
炼
0.6
V
Output High Volt.
V OH
炼
3.9
炼
炼
V
Output Low Volt.
V OL
炼
炼
炼
0.4
V
Supply Current
I DD
V DD =5V
炼
1.2
炼
mA
Revision: 20-Jul-11
5
Document Number: 37404
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6.Optical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
(V)ȧ
CRʁ2
20
炼
40
deg
(H)ȴ
CRʁ2
-30
炼
30
deg
CR
炼
炼
3
炼
炼
T rise
炼
炼
150
200
ms
T fall
炼
炼
150
200
ms
View Angle
Contrast Ratio
Response Time
Definition of Operation Voltage (Vop)
Intensity
100炴
Definition of Response Time ( Tr , Tf )
Non-selected
Conition
Selected Wave
Non-selected Wave
Selected Conition
Non-selected
Conition
Intensity
10炴
Cr Max
Cr = Lon / Loff
90炴
100炴
Vop
Tr
Driving Voltage(V)
[positive type]
Tf
[positive type]
Conditions :
Operating Voltage : Vop
Viewing Angle(ȧ炻ȴ) : 0Ʊ炻 0Ʊ
Frame Frequency : 64 HZ
Driving Waveform : 1/N duty , 1/a bias
Definition of viewing angle(CRʁ
ʁ2)
ȧb
ȧf
ȴ= 180Ʊ
ȧl
ȧr
ȴ= 90Ʊ
ȴ= 270Ʊ
ȴ= 0Ʊ
Revision: 20-Jul-11
6
Document Number: 37404
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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7.Interface Pin Function
Pin No. Symbol
Level
Description
1
V SS
0V
2
V DD
5.0V
3
VO
4
RS
H/L
H: DATA, L: Instruction code
5
R/W
H/L
H: Read(MPUɦModule) L: Write(MPUɦModule)
6
E
H,HɦL
7
DB0
H/L
Data bus line
8
DB1
H/L
Data bus line
9
DB2
H/L
Data bus line
10
DB3
H/L
Data bus line
11
DB4
H/L
Data bus line
12
DB5
H/L
Data bus line
13
DB6
H/L
Data bus line
14
DB7
H/L
Data bus line
15
A
炼
Revision: 20-Jul-11
Ground
Supply Voltage for logic
(Variable) Operating voltage for LCD
Chip enable signal
NC
7
Document Number: 37404
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55.7 0.5
51.3
46.7
46.0(VA)
37.85(AA)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Vss
Vdd
Vo
RS
R/W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
A
The non-specified tolerance of dimension is
0.3mm.
4- 1.0PTH
1.0
9.7max
5.1
11.5
2.2
4.5
4.85
8.93
3.0
9.0
30.0
32.0 0.5
24.7
17.5
14.5(VA)
11.7(AA)
3.65
7.25
8.75
10.15
8.Contour Drawing &Block Diagram
18.96
4-R1.25
12.25
15
1.0
17.78
(P1.27*14)
1.5
1.6
1.5
1
31.2
15- 0.7PTH
15- 1.0PAD
LED or NO B/L
3.20
2.65
6.20
5.50
0.70
0.60
0.55
0.45
DOT SIZE
80 series
or
68 series
RS
R/W
E
DB0~DB7
VR
10K~20K
Vdd
Vo
Vss
External contrast adjustment.
Com1~16
Controller/Com Driver
HD44780
or
Equivalent
Bias and
Power Circuit
MPU
12X2 LCD
Seg1~40
Seg41~60
Seg Driver
D
M
CL1
CL2
Vdd,Vss,V1~V5
Character located 1 2 3 4 5 6 7 8 9 10 11 12
DDRAM address 00 01 02 03 04 05 06 07 08 09 0A 0B
DDRAM address 40 41 42 43 44 45 46 47 48 49 4A 4B
Revision: 20-Jul-11
8
Document Number: 37404
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the
MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
0
0
IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction
will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 80ǘ8 bits or 80 characters. Below figure is the relationships between DDRAM addresses
and positions on the liquid crystal display.
High bits
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
Revision: 20-Jul-11
AC6 AC5 AC4 AC3 AC2 AC1 AC0
1
0
9
0
1
1
1
0
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Display position DDRAM address
1
2
3
4
5
6
7
8
9 10 11 12
00 01 02 03 04 05 06 07 08 09 0A 0B
40 41 42 43 44 45 46 47 48 49 4A 4B
2-Line by 12-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5ǘ8 dot or 5ǘ10 dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 5ǘ8 dots, eight character patterns can be
written, and for 5ǘ10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show
the character patterns stored in CGRAM.
Revision: 20-Jul-11
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Document Number: 37404
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
For 5 * 8 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
Low
0 0 0 0 * 0 0 0
0 0 0 0 * 0 0 1
0 0 0 0 * 1 1 1
CGRAM Address
5 4 3 2 1 0
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1 1 0
1 0
1 1
1 1
0 0
0 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1 1 1 1
1
1
1
0
1
0
1
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
High
0
0
1
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
High
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
Low
0
0 0 0
0 0 0
0
0
0
0 0
0
0
0
0 0
0
0
0 0
0 0 0
0 0
0
0
Character
pattern( 1 )
0 0
0 0
Character
pattern( 2 )
0 0
0 0
0 0
0 0
0 0 0 0 0
Cursor pattern
Cursor pattern
* * *
For 5 * 10 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
Low
0 0 0 0 * 0 0 0
CGRAM Address
5 4 3 2 1 0
High
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
Low
0
0
0
0
0
0 0 0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
High
0
1
0
1
0
1
0
1
0
1
0
1 1 1 1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Low
* 0 0 0 0 0
* 0 0 0 0 0
0
0
*
0 0
*
0 0 0
*
0 0 0
*
0
*
0 0 0 0
*
0 0 0 0
*
0 0 0 0
*
* 0 0 0 0 0
Character
pattern
Cursor pattern
* * * * * * * *
: " High "
Revision: 20-Jul-11
11
Document Number: 37404
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10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG
RAM
(1)
LLLH
CG
RAM
(2)
LLHL
CG
RAM
(3)
LLHH
CG
RAM
(4)
LHLL
CG
RAM
(5)
LHLH
CG
RAM
(6)
LHHL
CG
RAM
(7)
LHHH
CG
RAM
(8)
HLLL
CG
RAM
(1)
HLLH
CG
RAM
(2)
HLHL
CG
RAM
(3)
HLHH
CG
RAM
(4)
HHLL
CG
RAM
(5)
HHLH
CG
RAM
(6)
HHHL
CG
RAM
(7)
HHHH
CG
RAM
(8)
Revision: 20-Jul-11
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11.Instruction Table
Instruction Code
Execution time
(fosc=270Khz)
Description
Instruction
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Clear Display
0
0
0
0
0
0
0
0
0
1
Write “00H” to DDRAM and set
DDRAM address to “00H” from AC
1.53ms
1.53ms
Return Home
0
0
0
0
0
0
0
0
1
炼
Set DDRAM address to “00H” from AC
and return cursor to its original position
if shifted. The contents of DDRAM are
not changed.
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
SH
Assign cursor moving direction and
enable the shift of entire display.
39ȫs
Display
ON/OFF
Control
0
0
0
0
0
0
1
D
C
B
Set display (D), cursor (C), and blinking
of cursor (B) on/off control bit.
39ȫs
Cursor or
Display Shift
0
0
0
0
0
1
炼
炼 control bit, and the direction, without
Function Set
Set CGRAM
Address
Set DDRAM
Address
Set cursor moving and display shift
S/C R/L
39ȫs
changing of DDRAM data.
Set interface data length
(DL:8-bit/4-bit), numbers of display line
(N:2-line/1-line)and, display font type
(F:5ǘ11 dots/5ǘ8 dots)
39ȫs
AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.
39ȫs
1
DL
N
F
炼
炼
0
0
0
0
0
0
0
1
0
0
1
AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
39ȫs
Whether during internal operation or not
can be known by reading BF. The
AC6 AC5 AC4 AC3 AC2 AC1 AC0
contents of address counter can also be
read.
0ȫs
Read Busy
Flag and
Address
0
1
BF
Write Data to
RAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0
Write data into internal RAM
(DDRAM/CGRAM).
43ȫs
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0
Read data from internal RAM
(DDRAM/CGRAM).
43ȫs
点 ”炼”烉don’t care
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12.Timing Characteristics
12.1ġġ Write Operation
Ta=25ɗ, VDD=5įıV
Item
Symbol
Min
Typ
Max
Unit
Enable cycle time
TC
1200
炼
炼
ns
Enable pulse width
TPW
140
炼
炼
ns
Enable rise/fall time
TR,TF
炼
炼
25
ns
Address set-up time (RS, R/W to E)
t AS
0
炼
炼
ns
Address hold time
t AH
10
炼
炼
ns
Data set-up time
t DSW
40
炼
炼
ns
tH
10
炼
炼
ns
Data hold time
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12.2ġġ Read Operation
Ta=25ɗ, VDD=5ŗ
Item
Symbol
Min
Typ
Max
Unit
TC
1200
炼
炼
ns
TPW
140
炼
炼
ns
TR,TF
炼
炼
25
ns
Address set-up time (RS, R/W to E)
t AS
0
炼
炼
ns
Address hold time
t AH
10
炼
炼
ns
Data delay time
t DDR
炼
炼
100
ns
Data hold time
tH
10
炼
炼
ns
Enable cycle time
Enable pulse width (high level)
Enable rise/fall time
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13.Initializing of LCM
Power on
Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
1
1
0
*
*
*
*
0
Function set
Wait for more than 39us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5
0
0
0
1
0
0
N F
0
DB3 DB2 DB1 DB0
*
*
*
0
*
*
*
*
*
Function set
Wait for more than 39 µs
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
*
*
* Function set
0
0
1
0
*
*
*
*
*
N F
0
*
*
0
Wait for more than 37us
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
* *
*
0
0
*
0
0
0
0
* *
*
B
*
0
0
1
D C
Wait for more than 37 µs
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
*
*
*
0
0
0
0
0
0
*
*
*
*
0
0
0
0
1
*
0
Wait for more than 1.53ms
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
* *
*
0
0
0
0
0
0
*
0
1
* *
*
0
0
I/D SH *
Initialization ends
4-Bit Interface
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Power on
Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set
0 0 0 0 1 1 N F * *
Wait for more than 39us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0 0 0 0 1 1 N F * *
Function set
Wait for more than 37us
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 1 B C
D
Wait for more than 37 µs
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 0 0 0 1
Wait for more than 1.53ms
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 0 1 I/D S
Initialization ends
8-Bit Interface
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14.Reliability
Content of Reliability Test (wide temperature, -20ɗ~70ɗ)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to the
element for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
The module should be allowed to stand at 60
ɗ,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of
operation
-20ɗ
25ɗ
70ɗ
30min
5min
1 cycle
Test Condition
80ɗ
200hrs
-30ɗ
200hrs
Note
2
1,2
70ɗ
200hrs
——
-20ɗ
200hrs
1
60ɗ,90%RH
96hrs
-20ɗ/70ɗ
10 cycles
1,2
——
30min
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
Endurance test applying the vibration during
10~55Hz
Vibration test
3
transportation and using.
One cycle 60
seconds to 3
directions of X,Y,Z
for
Each
15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to the ȟ
Static electricity test
——
terminal.
CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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15. Inspection specification
NO
01
02
03
04
Item
Criterion
AQL
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
Black or white 2.1 White and black spots on display ʀ0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
2.5
3.1 Round type : As following drawing
ȜľĩġŹġĬġźġĪġİġijġ ġ ġ ġ
ŔŊśņġ
łŤŤŦűŵŢţŭŦġŒġŕŚġ
ġ ġ ġ ġ ġ ȜʀıįIJıġ łŤŤŦűŵġůŰġťŦůŴŦġ
ıįIJı烋Ȝʀıįijıġ
ijġ
ıįijı烋ȜʀıįijĶġ
IJġ
ıįijĶ烋Ȝġ
ıġ
ġ
LCD black
spots, white
spots,
contamination
3.2 Line type : (As following drawing)
(non-display)
Length
Width
--Wʀıįıij
LʀĴįı 0.02烋WʀıįıĴ
LʀijįĶ 0.03烋WʀıįıĶġ
--0.05烋W
Polarizer
bubbles
Revision: 20-Jul-11
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size Ȝ
Ȝʀıįijı
ıįijı烋ȜʀıįĶı
ıįĶı烋ȜʀIJįıı
IJįıı烋Ȝ
Total Q TY
2.5
Acceptable Q TY
Accept no dense
2.5
2
As round type
Acceptable Q TY
Accept no dense
3
2
0
3
19
2.5
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NO
05
Item
Scratches
Vishay
Criterion
Follow NO.3 LCD black spots, white spots, contamination
AQL
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źĻġńũŪűġŸŪťŵũġ
ŹĻġńũŪűġŭŦůŨŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
ķįIJįijġńŰųůŦųġŤųŢŤŬĻġ
2.5
ġ
ġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źĻġńũŪűġŸŪťŵũġ
ŹĻġńũŪűġŭŦůŨŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵũŦġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
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NO
Vishay
Item
Criterion
AQL
ŔźŮţŰŭŴġĻġ
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
źʀıįĶŮŮġ
ŹʀIJİĹŢġ
ķįijįijġŏŰůĮŤŰůťŶŤŵŪŷŦġűŰųŵŪŰůĻġ
06
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
ıġ 烋ġ Żġʀġŵġ
Glass
crack
2.5
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀġōġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġʀġŵġ
˞ŊŧġŵũŦġŤũŪűűŦťġŢųŦŢġŵŰŶŤũŦŴġŵũŦġŊŕŐġŵŦųŮŪůŢŭĭġŰŷŦųġijİĴġŰŧġŵũŦġŊŕŐġŮŶŴŵġ
ųŦŮŢŪůġŢůťġţŦġŪůŴűŦŤŵŦťġŢŤŤŰųťŪůŨġŵŰġŦŭŦŤŵųŰťŦġŵŦųŮŪůŢŭġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
˞ŊŧġŵũŦġűųŰťŶŤŵġŸŪŭŭġţŦġũŦŢŵġŴŦŢŭŦťġţźġŵũŦġŤŶŴŵŰŮŦųĭġŵũŦġŢŭŪŨůŮŦůŵġŮŢųŬġ
ůŰŵġţŦġťŢŮŢŨŦťįġ
ķįijįĴġŔŶţŴŵųŢŵŦġűųŰŵŶţŦųŢůŤŦġŢůťġŪůŵŦųůŢŭġŤųŢŤŬįġ
źĻġŸŪťŵũġ ġ
źʀIJİĴōġ
ġ
Revision: 20-Jul-11
ġ
ŹĻġŭŦůŨŵũġ
ŹġʀġŢġ
ġ
21
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NO
Item
07
Cracked glass
08
09
10
Backlight
elements
Bezel
PCBˣCOB
Vishay
Criterion
ŕũŦġōńŅġŸŪŵũġŦŹŵŦůŴŪŷŦġŤųŢŤŬġŪŴġůŰŵġŢŤŤŦűŵŢţŭŦįġ
ġ
ĹįIJġŊŭŭŶŮŪůŢŵŪŰůġŴŰŶųŤŦġŧŭŪŤŬŦųŴġŸũŦůġŭŪŵįġ
ĹįijġŔűŰŵŴġŰųġŴŤųŢŵŤũŦťġŵũŢŵġŢűűŦŢųġŸũŦůġŭŪŵġŮŶŴŵġţŦġūŶťŨŦťįġŖŴŪůŨġ
ōńŅġŴűŰŵĭġŭŪůŦŴġŢůťġŤŰůŵŢŮŪůŢŵŪŰůġŴŵŢůťŢųťŴįġ
ĹįĴġŃŢŤŬŭŪŨũŵġťŰŦŴůȽŵġŭŪŨũŵġŰųġŤŰŭŰųġŸųŰůŨįġ
ġ
ġ
ĺįIJġŃŦŻŦŭġŮŢźġůŰŵġũŢŷŦġųŶŴŵĭġţŦġťŦŧŰųŮŦťġŰųġũŢŷŦġŧŪůŨŦųűųŪůŵŴĭġŴŵŢŪůŴġ
ŰųġŰŵũŦųġŤŰůŵŢŮŪůŢŵŪŰůįġ
ĺįijġŃŦŻŦŭġŮŶŴŵġŤŰŮűŭźġŸŪŵũġūŰţġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
ġ
ġ
IJıįIJġńŐŃġŴŦŢŭġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŭŢųŨŦųġŵũŢůġıįijŮŮġŰųġ
ŤŰůŵŢŮŪůŢŵŪŰůįġ
IJıįijġńŐŃġŴŦŢŭġŴŶųŧŢŤŦġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŵũųŰŶŨũġŵŰġŵũŦġŊńįġ
IJıįĴġThe height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
IJıįĺ The Scraping testing standard for Copper Coating of PCB
AQL
2.5
0.65
2.5
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
X * Y<=2mm2ġ
2.5
2.5
11
Soldering
Revision: 20-Jul-11
ġ
IJIJįIJġŏŰġŶůĮŮŦŭŵŦťġŴŰŭťŦųġűŢŴŵŦġŮŢźġţŦġűųŦŴŦůŵġŰůġŵũŦġőńŃįġ
IJIJįijġŏŰġŤŰŭťġŴŰŭťŦųġūŰŪůŵŴĭġŮŪŴŴŪůŨġŴŰŭťŦųġŤŰůůŦŤŵŪŰůŴĭġŰŹŪťŢŵŪŰůġŰųġ
ŪŤŪŤŭŦįġ
IJIJįĴġŏŰġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġőńŃįġ
IJIJįĵġŏŰġŴũŰųŵġŤŪųŤŶŪŵŴġŪůġŤŰŮűŰůŦůŵŴġŰůġőńŃįġ
ġ
22
2.5
0.65
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NO
12
Item
General
appearance
Revision: 20-Jul-11
Vishay
Criterion
ġ
IJijįIJġŏŰġŰŹŪťŢŵŪŰůĭġŤŰůŵŢŮŪůŢŵŪŰůĭġŤŶųŷŦŴġŰųĭġţŦůťŴġŰůġŪůŵŦųŧŢŤŦġőŪůġ
ĩŐōŃĪġŰŧġŕńőįġ
IJijįijġŏŰġŤųŢŤŬŴġŰůġŪůŵŦųŧŢŤŦġűŪůġĩŐōŃĪġŰŧġŕńőįġ
IJijįĴġŏŰġŤŰůŵŢŮŪůŢŵŪŰůĭġŴŰŭťŦųġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġűųŰťŶŤŵįġ
IJijįĵġŕũŦġŊńġŰůġŵũŦġŕńőġŮŢźġůŰŵġţŦġťŢŮŢŨŦťĭġŤŪųŤŶŪŵŴįġ
IJijįĶġŕũŦġŶűűŦųŮŰŴŵġŦťŨŦġŰŧġŵũŦġűųŰŵŦŤŵŪŷŦġŴŵųŪűġŰůġŵũŦġŪůŵŦųŧŢŤŦġűŪůġ
ŮŶŴŵġţŦġűųŦŴŦůŵġŰųġŭŰŰŬġŢŴġŪŧġŪŵġŤŢŶŴŦġŵũŦġŪůŵŦųŧŢŤŦġűŪůġŵŰġŴŦŷŦųįġ
IJijįķġŕũŦġųŦŴŪťŶŢŭġųŰŴŪůġŰųġŵŪůġŰŪŭġŰŧġŴŰŭťŦųŪůŨġĩŤŰŮűŰůŦůŵġŰųġŤũŪűġ
ŤŰŮűŰůŦůŵĪġŪŴġůŰŵġţŶųůŦťġŪůŵŰġţųŰŸůġŰųġţŭŢŤŬġŤŰŭŰųįġ
IJijįĸġŔŦŢŭŢůŵġŰůġŵŰűġŰŧġŵũŦġŊŕŐġŤŪųŤŶŪŵġũŢŴġůŰŵġũŢųťŦůŦťįġ
IJijįĹġőŪůġŵźűŦġŮŶŴŵġŮŢŵŤũġŵźűŦġŪůġŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
IJijįĺġōńŅġűŪůġŭŰŰŴŦġŰųġŮŪŴŴŪůŨġűŪůŴįġ
IJijįIJıġőųŰťŶŤŵġűŢŤŬŢŨŪůŨġŮŶŴŵġŵũŦġŴŢŮŦġŢŴġŴűŦŤŪŧŪŦťġŰůġűŢŤŬŢŨŪůŨġ
ŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
IJijįIJIJġőųŰťŶŤŵġťŪŮŦůŴŪŰůġŢůťġŴŵųŶŤŵŶųŦġŮŶŴŵġŤŰůŧŰųŮġŵŰġűųŰťŶŤŵġ
ŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
ġ
23
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Document Number: 37404
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LCD-012N002A-NGG-ET
www.vishay.com
Vishay
16. Material List of Components for RoHS
1. Declaration that all of or part of products (with the mark “N” in code), including, but not limited to, the
LCM, accessories or packages, manufactured and/or delivered to your company (including your
subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or
affiliated companies) do not intentionally contain any of the substances listed in all applicable EU
directives and regulations, including the following substances.
Exhibit A烉The Harmful Material List
.
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement烉
(1) Use the Sn/Ag/Cu soldering surface烊the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.烉
Reflow烉250C, 30 seconds Max.烊
Connector soldering wave or hand soldering烉320C, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.烉235C±5 degrees烊
Recommended customer’s soldering temp. of connector烉280C, 3 seconds.
Revision: 20-Jul-11
24
Document Number: 37404
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000