LCD-008N002A1-YYH-ET Datasheet

LCD-008N002A1-YYH-ET
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8 x 2 Character LCD
FEATURES
• Type: Character
• Display format: 8 x 2 characters
• Built-in controller: ST 7066 or equivalent
• Duty cycle: 1/16
• 5 x 8 dots includes cursor
• + 5 V power supply
• LED can be driven by pin 1, pin 2, or A and K
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
ITEM
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
Module Dimension
UNIT
58.0 x 32.0 x 13.2 max.
ITEM
SYMBOL
STANDARD VALUE
MIN.
TYP.
MAX.
Viewing Area
38.0 x 16.0
Power Supply
VDD to VSS
- 0.3
-
7.0
Dot Size
0.56 x 0.66
Input Voltage
VI
VSS
-
VDD
Dot Pitch
0.60 x 0.70
Mounting Hole
53.0 x 27.0
Character Size
2.96 x 5.56
mm
UNIT
V
Note
• VSS = 0 V, VDD = 5.0 V
ELECTRICAL CHARACTERISTICS
ITEM
SYMBOL
CONDITION
Input Voltage
VDD
Supply Current
IDD
Recommended LC Driving
Voltage for Normal Temperature
Version Module
VDD to V0
STANDARD VALUE
UNIT
MIN.
TYP.
MAX.
VDD = + 5 V
4.7
5.0
5.3
V
VDD = + 5 V
1.0
1.2
1.5
mA
5.5
- 20 °C
-
-
0 °C
-
-
-
25 °C
-
4.4
-
50 °C
-
-
-
70 °C
3.5
-
-
V
LED Forward Voltage
VF
25 °C
-
4.2
4.6
V
LED Forward Current
IF
25 °C
-
70
140
mA
EL Power Supply Current
IEL
VEL = 110 VAC, 400 Hz
-
-
5.0
mA
OPTIONS
PROCESS COLOR
BACKLIGHT
TN
STN
GRAY
STN
YELLOW
STN
BLUE
FSTN
B&W
STN
COLOR
NONE
LED
EL
CCFL
x
x
x
x
x
-
x
x
x
-
For detailed information, please see the “Product Numbering System” document.
DISPLAY CHARACTER ADDRESS CODE
Display Position
1
2
3
4
5
6
7
8
DD RAM Address
00
01
02
03
04
05
06
07
DD RAM Address
40
41
42
43
44
45
46
47
Revision: 08-Jan-13
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INTERFACE PIN FUNCTIONS
PIN NO.
SYMBOL
FUNCTION
1
VSS
Ground
2
VDD
Supply voltage for logic + 5 V
3
V0
Operating voltage for LCD (variable)
4
RS
H: Data, L: Instruction code
5
RW
H: Read (MPU  module), L: Write (MPU  module)
6
E
Chip enable signal
7
DB0
Data bus line
8
DB1
Data bus line
9
DB2
Data bus line
10
DB3
Data bus line
11
DB4
Data bus line
12
DB5
Data bus line
13
DB6
Data bus line
14
DB7
Data bus line
15
A
LED+
16
K
LED-
58.0 ± 0.5
43.2
38.0(VA)
27.81(AA)
13.2 max
2.5
7.4
10.0
15.095
A A
27.0
32.0 ± 0.5
26.2
16.0(VA)
11.5(AA)
2.9
8.0
10.25
DIMENSIONS in millimeters
K
29.0
4- 2.5 PTH
4- 5.0 PAD
53.0
2.54
2.96
1.7
0.59
1.6
LED B/L
0.60
0.56
15
16- 1.0 PTH
16- 1.8 PAD
2
The non-specified tolerance of dimension is ± 0.3 mm.
5.56
0.70
0.66
17.78
(P2.54*7)
16
1
PIN DETAIL
Revision: 08-Jan-13
0.38
7.11
2.5
K
DOT SIZE
SCALE 5/1
Document Number: 37474
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1.Module Classification Information
LCD -008 N 002 A1 -Y Y H -ET
ġ
c
d
e
f
g
h
i
j
k
1.
2.
3.
4.
5.
6.
Brand烉Vishay Intertechnology, Inc.
Horizontal Format: 8 characters
Display Type烉NɦCharacter Type, HɦGraphic Type
Vertical Format: 2 Lines
Model serials no.: A1
Backlight NɦWithout backlight
TɦLED, White
Type烉
BɦEL, Blue green
AɦLED, Amber
DɦEL, Green
RɦLED, Red
WɦEL, White
OɦLED, Orange
FɦCCFL, White
GɦLED, Green
YɦLED, Yellow Green
7. LCD
BɦTN Positive, Gray
TɦFSTN Negative
Mode烉
NɦTN Negative,
GɦSTN Positive, Gray
YɦSTN Positive, Yellow Green
MɦSTN Negative, Blue
FɦFSTN Positive
8. LCD
AɦReflective, N.T, 6:00
HɦTransflective, W.T,6:00
Polarizer
DɦReflective, N.T, 12:00
KɦTransflective, W.T,12:00
Type/
GɦReflective, W. T, 6:00
CɦTransmissive, N.T,6:00
Temperatur JɦReflective, W. T, 12:00
FɦTransmissive, N.T,12:00
e range/
BɦTransflective, N.T,6:00
IɦTransmissive, W. T, 6:00
View
EɦTransflective,
N.T.12:00
LɦTransmissive, W.T,12:00
direction
9. Special
ET : English and European standard font;
Code
Compliant with the ROHS Directions and regulations
Revision: 08-Jan-13
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2.Precautions in use of LCD Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8)Supplier has the right to change the passive components, including R3,R6 & backlight adjust
resistors. (Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.)
(9)Supplier has the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not affecting the
electrical characteristics and external dimensions, Supplier has the right to modify the version.)
3.General Specification
Item
Dimension
Unit
8 characters x 2 Lines
炼
58.0 x 32.0 x 13.2(MAX)
mm
View area
38.0 x 16.0
mm
Active area
27.81 x 11.5
mm
Dot size
0.56 x 0.66
mm
Dot pitch
0.60 x 0.70
mm
Character size
2.96 x 5.56
mm
Character pitch
3.55 x 5.94
mm
Number of Characters
Module dimension
Duty
STN Positive, Yellow Green, Transflective
(In LCD production, It will occur slightly color difference. We
can only guarantee the same color in the same batch.)
1/16
View direction
6 o’clock
Backlight Type
LED Yellow Green
LCD type
Revision: 08-Jan-13
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4.Absolute Maximum Ratings
Item
Symbol
Min
Typ
Max
Unit
Operating Temperature
T OP
-20
炼
+70
ɗ
Storage Temperature
T ST
-30
炼
+80
ɗ
Input Voltage
VI
V SS
炼
V DD
V
Supply Voltage For Logic
VDD-V SS
-0.3
炼
7
V
Supply Voltage For LCD
V DD -V 0
-0.3
炼
13
V
5.Electrical Characteristics
Item
Supply Voltage For Logic
Supply Voltage For LCD
*Note
Symbol
Condition
Min
Typ
Max
Unit
V DD -V SS
炼
4.5
5.0
5.5
V
Ta=-20ɗ
炼
炼
5.5
V
Ta=25ɗ
炼
4.4
炼
V
Ta=70ɗ
3.5
炼
炼
V
V DD -V 0
Input High Volt.
V IH
炼
0.7 V DD
炼
V DD
V
Input Low Volt.
V IL
炼
V SS
炼
0.6
V
Output High Volt.
V OH
炼
3.9
炼
炼
V
Output Low Volt.
V OL
炼
炼
炼
0.4
V
Supply Current
I DD
V DD =5V
1.0
1.2
1.5
mA
* Note: Please design the VOP adjustment circuit on customer's main board
Vdd
VR
10K~20K
Vo
LCM
Module
VSS
Revision: 08-Jan-13
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6.Optical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
(V)ȧ
CRʁ2
20
炼
40
deg
(H)ȴ
CRʁ2
-30
炼
30
deg
CR
炼
炼
3
炼
炼
T rise
炼
炼
150
200
ms
T fall
炼
炼
150
200
ms
View Angle
Contrast Ratio
Response Time
Definition of Operation Voltage (Vop)
Intensity
100炴
Definition of Response Time ( Tr , Tf )
Non-selected
Conition
Selected Wave
Non-selected Wave
Selected Conition
Non-selected
Conition
Intensity
10炴
Cr Max
Cr = Lon / Loff
90炴
100炴
Vop
Tr
Driving Voltage(V)
[positive type]
Tf
[positive type]
Conditions :
Operating Voltage : Vop
Viewing Angle(ȧ炻ȴ) : 0Ʊ炻 0Ʊ
Frame Frequency : 64 HZ
Driving Waveform : 1/N duty , 1/a bias
Definition of viewing angle(CRʁ2)
ȧb
ȧf
ȧl
ȴ= 180Ʊ
ȧr
ȴ= 90Ʊ
ȴ= 270Ʊ
ȴ= 0Ʊ
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7.Interface Pin Function
Pin No. Symbol
Level
Description
1
V SS
0V
2
V DD
5.0V
3
VO
4
RS
H/L
H: DATA, L: Instruction code
5
R/W
H/L
H: Read(MPUɦModule) L: Write(MPUɦModule)
6
E
H,HɦL
7
DB0
H/L
Data bus line
8
DB1
H/L
Data bus line
9
DB2
H/L
Data bus line
10
DB3
H/L
Data bus line
11
DB4
H/L
Data bus line
12
DB5
H/L
Data bus line
13
DB6
H/L
Data bus line
14
DB7
H/L
Data bus line
15
A
LED+
16
K
LED-
Revision: 08-Jan-13
Ground
Supply Voltage for logic
(Variable) Operating voltage for LCD
Chip enable signal
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13.2 max
2.5
7.4
10.0
15.095
58.0 0.5
43.2
38.0(VA)
27.81(AA)
A
A
K
K
27.0
32.0 0.5
26.2
16.0(VA)
11.5(AA)
2.9
8.0
10.25
8.Contour Drawing &Block Diagram
29.0
7.11
2.5
4- 2.5 PTH
4- 5.0 PAD
53.0
2.54
LED B/L
1.7
15
17.78
(P2.54*7)
16
1.6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Vss
Vdd
Vo
RS
R/W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
A
K
16- 1.0 PTH
16- 1.8 PAD
2
2.96
1
0.59
0.60
0.56
PIN DETAIL
0.38
5.56
0.70
0.66
The non-specified tolerance of dimension is ¡ À
0.3 mm .
Revision: 08-Jan-13
DOT SIZE
SCALE 5/1
Document Number: 37474
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80 series
or
68 series
VR
10K~20K
Vdd
Vo
Vss
Com1~8
Controller/Com Driver
HD44780
or
Equivalent
Bias and
Power Circuit
MPU
RS
R/W
E
DB0~DB7
Vishay
Com9~16
8X2 LCD
Seg1~40
External contrast adjustment.
Character located
DDRAM address
DDRAM address
Revision: 08-Jan-13
1 2 3 4 5 6 7 8
00 01 02 03 04 05 06 07
40 41 42 43 44 45 46 47
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the
MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
0
0
IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction
will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 80ǘ8 bits or 80 characters. Below figure is the relationship between DDRAM addresses
and positions on the liquid crystal display.
High bits
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
Revision: 08-Jan-13
AC6 AC5 AC4 AC3 AC2 AC1 AC0
1
0
0
1
1
1
0
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Display position DDRAM address
1
00
40
2
3
4
5
6
7
8
01 02
41 42
03
43
04 05 06 07
44 45 46 47
2-Line by 8-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5ǘ8 dot or 5ǘ10 dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 5ǘ8 dots, eight character patterns can be
written, and for 5ǘ10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show
the character patterns stored in CGRAM.
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
For 5 * 8 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
0 0 0 0
0 0 0 0
0 0 0 0
Low
* 0 0 0
* 0 0 1
* 1 1 1
CGRAM Address
5 4 3 2 1 0
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1 1 0
1 0
1 1
1 1
0 0
0 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1 1 1 1
1
1
1
0
1
0
1
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
High
0
0
1
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
High
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
Low
0
0 0 0
0 0 0
0
0
0
0 0
0
0
0 0
0
0
0
0
0
0
0 0
0
0
0 0
0
0
Character
pattern( 1 )
0 0
Character
pattern( 2 )
0 0
0 0
0 0
0 0
0 0 0 0 0
Cursor pattern
Cursor pattern
* * *
For 5 * 10 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
0 0 0 0
Low
* 0 0 0
CGRAM Address
5 4 3 2 1 0
High
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
Low
0
0
0
0
0
0 0 0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
High
0
1
0
1
0
1
0
1
0
1
0
1 1 1 1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Low
* 0 0 0 0 0
* 0 0 0 0 0
0
0
*
0 0
*
0 0 0
*
0 0 0
*
0
*
0 0 0 0
*
0 0 0 0
*
0 0 0 0
*
* 0 0 0 0 0
Character
pattern
Cursor pattern
* * * * * * * *
: " High "
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10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG
RAM
(1)
LLLH
CG
RAM
(2)
LLHL
CG
RAM
(3)
LLHH
CG
RAM
(4)
LHLL
CG
RAM
(5)
LHLH
CG
RAM
(6)
LHHL
CG
RAM
(7)
LHHH
CG
RAM
(8)
HLLL
CG
RAM
(1)
HLLH
CG
RAM
(2)
HLHL
CG
RAM
(3)
HLHH
CG
RAM
(4)
HHLL
CG
RAM
(5)
HHLH
CG
RAM
(6)
HHHL
CG
RAM
(7)
HHHH
CG
RAM
(8)
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11.Instruction Table
Instruction Code
Instruction
Description
RS
Execution time
(fosc=270Khz)
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Write "20H" to DDRAM. and
Clear Display
0
0
0
0
0
0
0
0
0
1
set DDRAM address to
1.52ms
"00H" from AC
Return Home
0
0
0
0
0
0
0
0
1
炼
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
SH
Display
ON/OFF
Control
0
0
0
0
0
0
1
D
C
B
Set DDRAM address to “00H” from
AC and return cursor to its original
position if shifted. The contents of
DDRAM are not changed.
Sets cursor move direction and
specifies display shift.
These operations are performed during
data write and read.
1.52ms
37ȫs
D=1:entire display on
37ȫs
C=1:cursor on
B=1:cursor position on
Set cursor moving and
Cursor or
Display Shift
0
0
0
0
0
1
S/C
R/L
炼
Function Set
0
0
0
0
1
DL
N
F
炼
炼
display shift control bit, and
37ȫs
the direction, without changing
DDRAM data.
DL:interface data is 8/4 bits
炼
37ȫs
N:number of line is 2/1
F:font size is 5x11/5x8
Set CGRAM
Address
0
0
0
Set DDRAM
Address
0
0
1
1
AC5 AC4 AC3 AC2 AC1 AC0
AC6 AC5 AC4 AC3 AC2 AC1 AC0
Set CGRAM address in
37ȫs
address counter
Set DDRAM address in
37ȫs
address counter
Whether during internal
Read Busy
Flag and
Address
0
1
BF
Write Data to
RAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
AC6 AC5 AC4 AC3 AC2 AC1 AC0 operation or not can be known by
reading BF. The contents of address
counter can also be read.
0ȫs
Write data into internal
37ȫs
Read data from internal
37ȫs
点 ”炼”烉don’t care
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12.Timing Characteristics
12.1ġġ Writing data from MPU to ST7066U
Ta=-30~+85ɗ, VDD=5.0± 0.5V
TC
Enable Cycle Time
Pin E
1200
-
-
ns
TPW
Enable Pulse Width
Pin E
140
-
-
ns
TR,TF
Enable Rise/Fall Time
Pin E
-
-
25
ns
TAS
Address Setup Time
Pins: RS,RW,E
0
-
-
ns
TAH
Address Hold Time
Pins: RS,RW,E
10
-
-
ns
TDSW
Data Setup Time
Pins: DB0 - DB7
40
-
-
ns
TH
Data Hold Time
Pins: DB0 - DB7
10
-
-
ns
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12.2Reading data from ST7066U to MPU
Ta=-30~+85ɗ, VDD=5.0± 0.5V
Read Mode
(Reading Data from ST7066U to MPU)
TC
Enable Cycle Time
Pin E
1200
-
-
ns
TPW
Enable Pulse Width
Pin E
140
-
-
ns
TR,TF
Enable Rise/Fall Time
Pin E
-
-
25
ns
TAS
Address Setup Time
Pins: RS,RW,E
0
-
-
ns
TAH
Address Hold Time
Pins: RS,RW,E
10
-
-
ns
TDDR
Data Setup Time
Pins: DB0 - DB7
-
-
100
ns
TH
Data Hold Time
Pins: DB0 - DB7
10
-
-
ns
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13.Initializing of LCM
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Vishay
Document Number: 37474
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14.Reliability
Content of Reliability Test (wide temperature, -20ɗ~70ɗ)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to the
element for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
The module should be allowed to stand at 60
ɗ,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of
operation
-20ɗ
25ɗ
70ɗ
30min
1 cycle
5min
Test Condition
80ɗ
200hrs
-30ɗ
200hrs
Note
2
1,2
70ɗ
200hrs
——
-20ɗ
200hrs
1
60ɗ,90%RH
96hrs
-20ɗ/70ɗ
10 cycles
1,2
——
30min
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
10~55Hz
Endurance test applying the vibration during
3
Vibration test
One cycle 60
transportation and using.
seconds to 3
directions of X,Y,Z
for
Each
15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to the ȟ
Static electricity test
——
terminal.
CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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15.Backlight Information
Specification
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
TESTġġ CONDITION
Supply Current
ILED
56
70
105
mA
V=4.2V
Supply Voltage
V
4.0
4.2
4.4
V
炼
Reverse Voltage
VR
炼
炼
8
V
炼
IV
90
120
炼
CD/M2
ILED=70mA
Wave Length
Ȫp
560
570
580
nm
ILED=70mA
Life Time
炼
炼
100000
炼
Hr.
ILED=70mA
Luminous
Intensity
Color
Yellow Green
Note: The LED of B/L is drive by current only烊driving voltage is only for reference
To make driving current in safety area (waste current between minimum and
maximum).
2.Drive from pin15,pin16
R
R
A
K
B/L
LCM
ill never get Vee output from pin15)
Revision: 08-Jan-13
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16. Inspection specification
NO
01
02
Item
Criterion
AQL
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
Black or white 2.1 White and black spots on display ʀ0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
3.1 Round type : As following drawing
ȜľĩġŹġĬġźġĪġİġijġ ġ ġ ġ
ŔŊśņġ
2.5
łŤŤŦűŵŢţŭŦġŒġŕŚġ
ġ ġ ġ ġ ġ ȜʀıįIJıġ łŤŤŦűŵġůŰġťŦůŴŦġ
ıįIJı烋Ȝʀıįijıġ
03
ıįijı烋ȜʀıįijĶġ
IJġ
LCD black
ġ
ıįijĶ烋Ȝġ
ıġ
spots, white
spots,
contamination
(non-display) 3.2 Line type : (As following drawing)
Length
Width
Acceptable Q TY
--Wʀıįıij
Accept no dense
LʀĴįı 0.02烋WʀıįıĴ
2
LʀijįĶ 0.03烋WʀıįıĶġ
---
04
ijġ
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
0.05烋W
Size Ȝ
Ȝʀıįijı
Revision: 08-Jan-13
2.5
As round type
Acceptable Q TY
Accept no dense
ıįijı烋ȜʀıįĶı
3
ıįĶı烋ȜʀIJįıı
2
IJįıı烋Ȝ
0
Total Q TY
2.5
2.5
3
Document Number: 37474
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NO
Item
05
Scratches
Vishay
Criterion
AQL
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źĻġńũŪűġŸŪťŵũġ
ŹĻġńũŪűġŭŦůŨŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
2.5
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
ķįIJįijġńŰųůŦųġŤųŢŤŬĻġ
ġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
ġ
źĻġńũŪűġŸŪťŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
ŹĻġńũŪűġŭŦůŨŵũġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵũŦġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
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NO
Vishay
Item
Criterion
AQL
ŔźŮţŰŭŴġĻġ
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀıįĶŮŮġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġʀġŵġ
ķįijįijġŏŰůĮŤŰůťŶŤŵŪŷŦġűŰųŵŪŰůĻġ
06
Glass
crack
2.5
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀġōġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġʀġŵġ
ġ
˞ŊŧġŵũŦġŤũŪűűŦťġŢųŦŢġŵŰŶŤũŦŴġŵũŦġŊŕŐġŵŦųŮŪůŢŭĭġŰŷŦųġijİĴġŰŧġŵũŦġŊŕŐġŮŶŴŵġ
ųŦŮŢŪůġŢůťġţŦġŪůŴűŦŤŵŦťġŢŤŤŰųťŪůŨġŵŰġŦŭŦŤŵųŰťŦġŵŦųŮŪůŢŭġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
˞ŊŧġŵũŦġűųŰťŶŤŵġŸŪŭŭġţŦġũŦŢŵġŴŦŢŭŦťġţźġŵũŦġŤŶŴŵŰŮŦųĭġŵũŦġŢŭŪŨůŮŦůŵġŮŢųŬġ
ůŰŵġţŦġťŢŮŢŨŦťįġ
ķįijįĴġŔŶţŴŵųŢŵŦġűųŰŵŶţŦųŢůŤŦġŢůťġŪůŵŦųůŢŭġŤųŢŤŬįġ
ġ
Revision: 08-Jan-13
źĻġŸŪťŵũġ ġ
ŹĻġŭŦůŨŵũġ
źʀIJİĴōġ
ŹġʀġŢġ
ġ
Document Number: 37474
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NO
Item
07
Cracked glass
08
09
10
Backlight
elements
Bezel
PCBˣCOB
Vishay
Criterion
ŕũŦġōńŅġŸŪŵũġŦŹŵŦůŴŪŷŦġŤųŢŤŬġŪŴġůŰŵġŢŤŤŦűŵŢţŭŦįġ
ġ
ĹįIJġŊŭŭŶŮŪůŢŵŪŰůġŴŰŶųŤŦġŧŭŪŤŬŦųŴġŸũŦůġŭŪŵįġ
ĹįijġŔűŰŵŴġŰųġŴŤųŢŵŤũŦťġŵũŢŵġŢűűŦŢųġŸũŦůġŭŪŵġŮŶŴŵġţŦġūŶťŨŦťįġŖŴŪůŨġ
ōńŅġŴűŰŵĭġŭŪůŦŴġŢůťġŤŰůŵŢŮŪůŢŵŪŰůġŴŵŢůťŢųťŴįġ
ĹįĴġŃŢŤŬŭŪŨũŵġťŰŦŴůȽŵġŭŪŨũŵġŰųġŤŰŭŰųġŸųŰůŨįġ
ġ
ġ
ĺįIJġŃŦŻŦŭġŮŢźġůŰŵġũŢŷŦġųŶŴŵĭġţŦġťŦŧŰųŮŦťġŰųġũŢŷŦġŧŪůŨŦųűųŪůŵŴĭġŴŵŢŪůŴġ
ŰųġŰŵũŦųġŤŰůŵŢŮŪůŢŵŪŰůįġ
ĺįijġŃŦŻŦŭġŮŶŴŵġŤŰŮűŭźġŸŪŵũġūŰţġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
ġ
ġ
IJıįIJġńŐŃġŴŦŢŭġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŭŢųŨŦųġŵũŢůġıįijŮŮġŰųġ
ŤŰůŵŢŮŪůŢŵŪŰůįġ
IJıįijġńŐŃġŴŦŢŭġŴŶųŧŢŤŦġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŵũųŰŶŨũġŵŰġŵũŦġŊńįġ
IJıįĴġThe height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
IJıįĺ The Scraping testing standard for Copper Coating of PCB
AQL
2.5
0.65
2.5
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
11
Soldering
Revision: 08-Jan-13
X * Y<=2mm2ġ
ġ
IJIJįIJġŏŰġŶůĮŮŦŭŵŦťġŴŰŭťŦųġűŢŴŵŦġŮŢźġţŦġűųŦŴŦůŵġŰůġŵũŦġőńŃįġ
IJIJįijġŏŰġŤŰŭťġŴŰŭťŦųġūŰŪůŵŴĭġŮŪŴŴŪůŨġŴŰŭťŦųġŤŰůůŦŤŵŪŰůŴĭġŰŹŪťŢŵŪŰůġŰųġ
ŪŤŪŤŭŦįġ
IJIJįĴġŏŰġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġőńŃįġ
IJIJįĵġŏŰġŴũŰųŵġŤŪųŤŶŪŵŴġŪůġŤŰŮűŰůŦůŵŴġŰůġőńŃįġ
ġ
2.5
2.5
2.5
0.65
Document Number: 37474
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NO
12
Vishay
Item
Criterion
General
appearance
12.1 No oxidation, contamination, curves or, bends on interface
Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the interface
pin must be present or look as if it causes the interface pin to
sever.
12.6 The residual rosin or tin oil of soldering (component or chip
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.
Revision: 08-Jan-13
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
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17. Material List of Components for RoHS
1. Declaration that all of or part of products (with the mark “N” in code), including, but not limited to,
the LCM, accessories or packages, manufactured and/or delivered to your company (including your
subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or
affiliated companies) do not intentionally contain any of the substances listed in all applicable EU
directives and regulations, including the following substances.
Exhibit A烉The Harmful Material List
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
100
1000
1000
1000
1000
1000
Value
ppm
ppm
ppm
ppm
ppm
ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement烉
(1) Use the Sn/Ag/Cu soldering surface烊the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.烉
Reflow烉250C, 30 seconds Max.烊
Connector soldering wave or hand soldering烉320C, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.烉235±5C烊
Recommended customer’s soldering temp. of connector烉280C, 3 seconds.
18. Recommendable storage
1.
2.
3.
Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH
Do not place the module near organics solvents or corrosive gases.
Do not crush, shake, or jolt the module
Revision: 08-Jan-13
Document Number: 37474
26
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Revision: 02-Oct-12
1
Document Number: 91000