LCD-016N001L-NFG-ET Datasheet

LCD-016N001L-NFG-ET
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16 x 1 Character LCD
FEATURES
• Type: Character
• Display format: 16 x 1 characters
• Built-in controller: ST 7066 or equivalent
• Duty cycle: 1/16
• 5 x 8 dots includes cursor
• + 5 V power supply
• LED can be driven by pin 1, pin 2, pin 15, pin 16 or A and K
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
ITEM
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
Module Dimension
UNIT
122.0 x 33.0 x 9.8 max.
Viewing Area
99.0 x 13.0
Dot Size
0.92 x 1.10
Dot Pitch
0.98 x 1.16
Mounting Hole
115.0 x 25.2
Character Size
4.84 x 8.06
mm
ITEM
SYMBOL
Power
Supply
STANDARD VALUE
MIN.
TYP.
MAX.
VDD to VSS
- 0.3
-
7.0
VI
VSS
-
VDD
Input Voltage
UNIT
V
Note
• VSS = 0 V, VDD = 5.0 V
ELECTRICAL CHARACTERISTICS
ITEM
SYMBOL
CONDITION
Input Voltage
VDD to VSS
IDD
Supply Current
Recommended LC Driving
Voltage for Normal Temperature
Version Module
VDD to V0
STANDARD VALUE
UNIT
MIN.
TYP.
MAX.
VDD = + 5 V
4.5
5.0
5.5
V
VDD = + 5 V
1.0
1.2
1.5
mA
- 20 °C
-
-
5.5
0 °C
-
-
-
25 °C
4.2
4.35
4.5
50 °C
-
-
-
V
70 °C
3.5
-
-
LED Forward Voltage
VF
25 °C
-
4.2
4.6
V
LED Forward Current
IF
25 °C
-
160
-
mA
OPTIONS
PROCESS COLOR
BACKLIGHT
TN
STN
GRAY
STN
YELLOW
STN
BLUE
FSTN
B&W
STN
COLOR
NONE
LED
EL
CCFL
x
x
x
x
x
-
x
x
x
-
For detailed information, please see the “Product Numbering System” document.
DISPLAY CHARACTER ADDRESS CODE
Display Position
DD RAM Address
Revision: 10-Jan-13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
00
01
02
03
04
05
06
07
40
41
42
43
44
45
46
47
Document Number: 37475
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INTERFACE PIN FUNCTION
PIN NO.
SYMBOL
FUNCTION
1
VSS
Ground
Supply voltage for logic (+ 5 V)
2
VDD
3
V0
Operating voltage for LCD
4
RS
H: Data, L: Instruction code
5
R/W
H: Read (MPU  module), L: Write (MPU  module)
6
E
H, H  L chip enable signal
7
DB0
H/L data bus line
8
DB1
H/L data bus line
9
DB2
H/L data bus line
10
DB3
H/L data bus line
11
DB4
H/L data bus line
12
DB5
H/L data bus line
13
DB6
H/L data bus line
14
DB7
H/L data bus line
15
A
no connection
16
K
no connection
DIMENSIONS in millimeters
1
9.8
5.2
3.3
P2.54x15=38.1
1.8
2.0
4.3
9.5
11.17
16- 1.0
15.98
4- 1.0
16
25.2
7
13
33.0 0.5
23.4
13.0(VA)
9.66(AA)
A
K
13.58
11.5
94.84
99.0(VA)
105.9
115.0
122.0 0.5
8.05
3.5
4- 3.5
1.6
EL or NO B/L
6.0
4.84
8.56
8.06
1.16
1.1
0.98
0.92
The non-specified tolerance of dimension is ± 0.3 mm.
DOT SIZE
S=3:1
Revision: 10-Jan-13
Document Number: 37475
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1.Module Classification Information
ġ ġ
ġ ġ
LCD- 016 N 001 L -N F G -ET
c
d
e
f
g
h
i
j
k
1. Brand烉Vishay Intertechnology, Inc.
2. Horizontal Format: 16 characters
3. Display Type烉NɦCharacter Type, HɦGraphic Type
4. Vertical Format: 1 Line
5. Model serials no.: L
6. Backlight
NɦWithout backlight
AɦLED, Amber
Type烉
BɦEL, Blue green
RɦLED, Red
DɦEL, Green
OɦLED, Orange
WɦEL, White
GɦLED, Green
FɦCCFL, White
YɦLED, Yellow Green
7. LCD Mode烉 BɦTN Positive, Gray
TɦFSTN Negative
NɦTN Negative,
GɦSTN Positive, Gray
YɦSTN Positive, Yellow Green
MɦSTN Negative, Blue
FɦFSTN Positive
8. LCD Polarizer AɦReflective, N.T, 6:00
HɦTransflective, W.T,6:00
Type/ Temperature DɦReflective, N.T, 12:00
KɦTransflective, W.T,12:00
range/ View
GɦReflective, W. T, 6:00
CɦTransmissive, N.T,6:00
direction
JɦReflective, W. T, 12:00
FɦTransmissive, N.T,12:00
BɦTransflective, N.T,6:00
IɦTransmissive, W. T, 6:00
EɦTransflective, N.T.12:00 LɦTransmissive, W.T,12:00
9. Special Code ET : English and European standard font
Compliant with the ROHS Directions and regulations
Revision: 10-Jan-13
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2.Precautions in use of LCD Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8)Supplier has the right to change the passive components
(Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.)
(9)Supplier has the right to change the PCB Rev.
3.General Specification
Item
Dimension
Unit
16 characters x 1 Lines
炼
122.0 x 33.0 x 9.8(MAX)
mm
View area
99.0 x 13.0
mm
Active area
94.84 x 9.66
mm
Dot size
0.92 x 1.1
mm
Dot pitch
0.98 x 1.16
mm
Character size
4.84 x 8.06
mm
Character pitch
6.0 x 8.56
mm
Number of Characters
Module dimension
Duty
FSTN Positive Reflective
(In LCD production, It will occur slightly color difference. We
can only guarantee the same color in the same batch.)
1/16
View direction
6 o’clock
Backlight Type
Without backlight
LCD type
Revision: 10-Jan-13
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4.Absolute Maximum Ratings
Item
Symbol
Min
Typ
Max
Unit
Operating Temperature
T OP
-20
炼
+70
ɗ
Storage Temperature
T ST
-30
炼
+80
ɗ
Input Voltage
VI
V SS
炼
V DD
V
Supply Voltage For Logic
VDD-V SS
-0.3
炼
7
V
Supply Voltage For LCD
V DD -V 0
-0.3
炼
13
V
5.Electrical Characteristics
Item
Supply Voltage For Logic
Supply Voltage For LCD
*Note
Symbol
Condition
Min
Typ
Max
Unit
V DD -V SS
炼
4.5
5.0
5.5
V
Ta=-20ɗ
炼
炼
5.5
V
Ta=25ɗ
4.2
4.35
4.5
V
Ta=70ɗ
3.5
炼
炼
V
V DD -V 0
Input High Volt.
V IH
炼
0.7 V DD
炼
V DD
V
Input Low Volt.
V IL
炼
V SS
炼
0.6
V
Output High Volt.
V OH
炼
3.9
炼
V DD
V
Output Low Volt.
V OL
炼
炼
炼
0.4
V
Supply Current
I DD
V DD =5V
1.0
1.2
1.5
mA
* Note: Please design the VOP adjustment circuit on customer's main board
Vdd
VR
10K~20K
Vo
LCM
Module
VSS
Revision: 10-Jan-13
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6.Optical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
(V)ȧ
CRʁ2
30
炼
60
deg
(H)ȴ
CRʁ2
-45
炼
45
deg
CR
炼
炼
5
炼
炼
T rise
炼
炼
150
200
ms
T fall
炼
炼
150
200
ms
View Angle
Contrast Ratio
Response Time
Definition of Operation Voltage (Vop)
Intensity
100炴
Definition of Response Time ( Tr , Tf )
Non-selected
Conition
Selected Wave
Non-selected Wave
Selected Conition
Non-selected
Conition
Intensity
10炴
Cr Max
Cr = Lon / Loff
90炴
100炴
Vop
Tr
Driving Voltage(V)
[positive type]
Tf
[positive type]
Conditions :
Operating Voltage : Vop
Viewing Angle(ȧ炻ȴ) : 0Ʊ炻 0Ʊ
Frame Frequency : 64 HZ
Driving Waveform : 1/N duty , 1/a bias
Definition of viewing angle(CRʁ2)
ȧb
ȧf
ȧl
ȴ= 180Ʊ
ȧr
ȴ= 90Ʊ
ȴ= 270Ʊ
ȴ= 0Ʊ
Revision: 10-Jan-13
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7.Interface Pin Function
Pin No. Symbol
Level
Description
1
V SS
0V
2
V DD
5.0V
3
VO
4
RS
H/L
H: DATA, L: Instruction code
5
R/W
H/L
H: Read(MPUɦModule) L: Write(MPUɦModule)
6
E
H,HɦL
7
DB0
H/L
Data bus line
8
DB1
H/L
Data bus line
9
DB2
H/L
Data bus line
10
DB3
H/L
Data bus line
11
DB4
H/L
Data bus line
12
DB5
H/L
Data bus line
13
DB6
H/L
Data bus line
14
DB7
H/L
Data bus line
15
A
炼
NC
16
K
炼
NC
Revision: 10-Jan-13
Ground
Supply Voltage for logic
(Variable) Operating voltage for LCD
Chip enable signal
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8.Contour Drawing &Block Diagram
P2.54x15=38.1
1.8
1
9.8
5.2
3.3
15.98
2.0
4- 1.0
16
7
13
33.0 0.5
23.4
13.0(VA)
9.66(AA)
A
25.2
4.3
9.5
11.17
16- 1.0
K
13.58
11.5
8.05
3.5
4- 3.5
94.84
99.0(VA)
105.9
115.0
122.0 0.5
1.6
EL or NO B/L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Vss
Vdd
Vo
RS
R/W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
A
K
6.0
4.84
0.98
0.92
0.3mm.
8.56
8.06
1.16
1.1
The non-specified tolerance of dimension is
DOT SIZE
S=3:1
Revision: 10-Jan-13
Document Number: 37475
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MPU
80 series
or
68 series
VR
10K~20K
Vdd
Vo
Vss
Com1~8
Controller/Com Driver
ST7066U
or
Equivalent
Bias and
Power Circuit
RS
R/W
E
DB0~DB7
Vishay
Com9~16
16X1 LCD
Seg1~40
External contrast adjustment.
Character located
DDRAM address
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
00 01 02 03 04 05 06 07 40 41 42 43 44 45 46 47
2-line display mode.
Revision: 10-Jan-13
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the
MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
0
0
IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction
will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 80ǘ8 bits or 80 characters. Below figure is the relationship between DDRAM addresses
and positions on the liquid crystal display.
High bits
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
Revision: 10-Jan-13
AC6 AC5 AC4 AC3 AC2 AC1 AC0
1
0
0
1
1
1
0
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Display position DDRAM address
1
00
2
3
4
5
6
7
8
9 10 11 12 13 14 15
01 02
03
04 05
06
07 40
41 42
43
44
45 46
16
47
2-Line by 16-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5ǘ8 dot or 5ǘ10 dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program.
For 5ǘ8 dots, eight character patterns can be
written, and for 5ǘ10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show
the character patterns stored in CGRAM.
Revision: 10-Jan-13
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
For 5 * 8 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
0 0 0 0
0 0 0 0
0 0 0 0
Low
* 0 0 0
* 0 0 1
* 1 1 1
CGRAM Address
5 4 3 2 1 0
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1 1 0
1 0
1 1
1 1
0 0
0 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1 1 1 1
1
1
1
0
1
0
1
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
High
0
0
1
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
High
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
Low
0
0 0 0
0 0 0
0
0
0
0 0
0
0
0 0
0
0
0
0
0
0
0 0
0
0
0 0
0
0
Character
pattern( 1 )
0 0
Character
pattern( 2 )
0 0
0 0
0 0
0 0
0 0 0 0 0
Cursor pattern
Cursor pattern
* * *
For 5 * 10 dot character patterns
Character Codes
( DDRAM data )
7 6 5 4 3 2 1 0
High
0 0 0 0
Low
* 0 0 0
CGRAM Address
5 4 3 2 1 0
High
Character Patterns
( CGRAM data )
7 6 5 4 3 2 1 0
Low
0
0
0
0
0
0 0 0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
High
0
1
0
1
0
1
0
1
0
1
0
1 1 1 1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Low
* 0 0 0 0 0
* 0 0 0 0 0
0
0
*
0 0
*
0 0 0
*
0 0 0
*
0
*
0 0 0 0
*
0 0 0 0
*
0 0 0 0
*
* 0 0 0 0 0
Character
pattern
Cursor pattern
* * * * * * * *
: " High "
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10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG
RAM
(1)
LLLH
CG
RAM
(2)
LLHL
CG
RAM
(3)
LLHH
CG
RAM
(4)
LHLL
CG
RAM
(5)
LHLH
CG
RAM
(6)
LHHL
CG
RAM
(7)
LHHH
CG
RAM
(8)
HLLL
CG
RAM
(1)
HLLH
CG
RAM
(2)
HLHL
CG
RAM
(3)
HLHH
CG
RAM
(4)
HHLL
CG
RAM
(5)
HHLH
CG
RAM
(6)
HHHL
CG
RAM
(7)
HHHH
CG
RAM
(8)
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11.Instruction Table
Instruction Code
Description
Instruction
RS
Execution time
(fosc=270Khz)
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Write "20H" to DDRAM. and
Clear Display
0
0
0
0
0
0
0
0
0
1
set DDRAM address to
1.52ms
"00H" from AC
Return Home
0
0
0
0
0
0
0
0
1
炼
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
SH
Display
ON/OFF
Control
0
0
0
0
0
0
1
D
C
B
Set DDRAM address to “00H” from
AC and return cursor to its original
position if shifted. The contents of
DDRAM are not changed.
Sets cursor move direction and
specifies display shift.
These operations are performed during
data write and read.
1.52ms
37ȫs
D=1:entire display on
37ȫs
C=1:cursor on
B=1:cursor position on
Set cursor moving and
Cursor or
Display Shift
0
0
0
0
0
1
S/C
R/L
炼
炼
display shift control bit, and
37ȫs
the direction, without changing
DDRAM data.
DL:interface data is 8/4 bits
Function Set
0
0
0
0
1
DL
N
F
炼
炼
37ȫs
N:number of line is 2/1
F:font size is 5x11/5x8
Set CGRAM
Address
0
0
0
Set DDRAM
Address
0
0
1
1
AC5 AC4 AC3 AC2 AC1 AC0
AC6 AC5 AC4 AC3 AC2 AC1 AC0
Set CGRAM address in
37ȫs
address counter
Set DDRAM address in
37ȫs
address counter
Whether during internal
Read Busy
Flag and
Address
0
1
BF
Write Data to
RAM
1
0
D7
AC6 AC5 AC4 AC3 AC2 AC1 AC0 operation or not can be known by
reading BF. The contents of address
counter can also be read.
0ȫs
Write data into internal
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
37ȫs
Read data from internal
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
37ȫs
点 ”炼”烉don’t care
Revision: 10-Jan-13
Document Number: 37475
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12.Timing Characteristics
12.1ġġ Writing data from MPU to ST7066U
Ta=-30~+85ɗ, VDD=5.0± 0.5V
TC
Enable Cycle Time
Pin E
1200
-
-
ns
TPW
Enable Pulse Width
Pin E
140
-
-
ns
TR,TF
Enable Rise/Fall Time
Pin E
-
-
25
ns
TAS
Address Setup Time
Pins: RS,RW,E
0
-
-
ns
TAH
Address Hold Time
Pins: RS,RW,E
10
-
-
ns
TDSW
Data Setup Time
Pins: DB0 - DB7
40
-
-
ns
TH
Data Hold Time
Pins: DB0 - DB7
10
-
-
ns
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12.2Reading data from ST7066U to MPU
Ta=-30~+85ɗ, VDD=5.0±
0.5V
Read Mode
(Reading Data from ST7066U to MPU)
TC
Enable Cycle Time
Pin E
1200
-
-
ns
TPW
Enable Pulse Width
Pin E
140
-
-
ns
TR,TF
Enable Rise/Fall Time
Pin E
-
-
25
ns
TAS
Address Setup Time
Pins: RS,RW,E
0
-
-
ns
TAH
Address Hold Time
Pins: RS,RW,E
10
-
-
ns
TDDR
Data Setup Time
Pins: DB0 - DB7
-
-
100
ns
TH
Data Hold Time
Pins: DB0 - DB7
10
-
-
ns
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13.Initializing of LCM
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Revision: 10-Jan-13
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Document Number: 37475
18
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14.Reliability
Content of Reliability Test (wide temperature, -20ɗ
ɗ~70ɗ)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Test Condition
Endurance test applying the high storage temperature 80ɗ
for a long time.
200hrs
Endurance test applying the high storage temperature -30ɗ
for a long time.
200hrs
Endurance test applying the electric stress (Voltage &
70ɗ
Current) and the thermal stress to the element for a
200hrs
long time.
Endurance test applying the electric stress under low -20ɗ
temperature for a long time.
200hrs
The module should be allowed to stand at 60
ɗ,90%RH max
60ɗ,90%RH
For 96hrs under no-load condition excluding the
96hrs
polarizer,
Then taking it out and drying it at normal temperature.
The sample should be allowed stand the following 10
cycles of
operation
-20ɗ/70ɗ
-20ɗ
25ɗ
70ɗ
10 cycles
30min
1 cycle
5min
Note
2
1,2
——
1
1,2
——
30min
Vibration test
Endurance test applying the vibration during
transportation and using.
Total fixed
amplitude : 1.5mm
Vibration
Frequency : 10~55Hz
3
One cycle 60 seconds
to 3 directions of
X,Y,Z for
Each 15 minutes
Static electricity test
Endurance test applying the electric stress to the
terminal.
VS=800V,RS=1.5kȟ
——
CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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15. Inspection specification
NO
01
02
Item
Criterion
AQL
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
Black or white 2.1 White and black spots on display ʀ0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
3.1 Round type : As following drawing
ȜľĩġŹġĬġźġĪġİġijġ ġ ġ ġ
ŔŊśņġ
0.65
2.5
łŤŤŦűŵŢţŭŦġŒġŕŚġ
ġ ġ ġ ġ ġ ȜʀıįIJıġ łŤŤŦűŵġůŰġťŦůŴŦġ
ıįIJı烋Ȝʀıįijıġ
03
ıįijı烋ȜʀıįijĶġ
IJġ
LCD black
ġ
ıįijĶ烋Ȝġ
ıġ
spots, white
spots,
contamination
(non-display) 3.2 Line type : (As following drawing)
Length
Width
Acceptable Q TY
--Wʀıįıij
Accept no dense
LʀĴįı 0.02烋WʀıįıĴ
2
LʀijįĶ 0.03烋WʀıįıĶġ
---
04
ijġ
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
0.05烋W
Size Ȝ
Ȝʀıįijı
Revision: 10-Jan-13
2.5
As round type
Acceptable Q TY
Accept no dense
ıįijı烋ȜʀıįĶı
3
ıįĶı烋ȜʀIJįıı
2
IJįıı烋Ȝ
0
Total Q TY
2.5
2.5
3
Document Number: 37475
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NO
Item
05
Scratches
Vishay
Criterion
AQL
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źĻġńũŪűġŸŪťŵũġ
ŹĻġńũŪűġŭŦůŨŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
2.5
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
ķįIJįijġńŰųůŦųġŤųŢŤŬĻġ
ġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
ġ
źĻġńũŪűġŸŪťŵũġ
śʀIJİijŵġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġŢųŦŢġ
ŹʀIJİĹŢġ
IJİijŵ烋Żʀijŵġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹʀIJİĹŢġ
ŹĻġńũŪűġŭŦůŨŵũġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵũŦġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
Revision: 10-Jan-13
Document Number: 37475
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NO
Vishay
Item
Criterion
AQL
ŔźŮţŰŭŴġĻġ
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀıįĶŮŮġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġʀġŵġ
ķįijįijġŏŰůĮŤŰůťŶŤŵŪŷŦġűŰųŵŪŰůĻġ
06
Glass
crack
2.5
źĻġńũŪűġŸŪťŵũġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
źʀġōġ
ŹʀIJİĹŢġ
ıġ 烋ġ Żġʀġŵġ
ġ
˞ŊŧġŵũŦġŤũŪűűŦťġŢųŦŢġŵŰŶŤũŦŴġŵũŦġŊŕŐġŵŦųŮŪůŢŭĭġŰŷŦųġijİĴġŰŧġŵũŦġŊŕŐġŮŶŴŵġ
ųŦŮŢŪůġŢůťġţŦġŪůŴűŦŤŵŦťġŢŤŤŰųťŪůŨġŵŰġŦŭŦŤŵųŰťŦġŵŦųŮŪůŢŭġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
˞ŊŧġŵũŦġűųŰťŶŤŵġŸŪŭŭġţŦġũŦŢŵġŴŦŢŭŦťġţźġŵũŦġŤŶŴŵŰŮŦųĭġŵũŦġŢŭŪŨůŮŦůŵġŮŢųŬġ
ůŰŵġţŦġťŢŮŢŨŦťįġ
ķįijįĴġŔŶţŴŵųŢŵŦġűųŰŵŶţŦųŢůŤŦġŢůťġŪůŵŦųůŢŭġŤųŢŤŬįġ
ġ
Revision: 10-Jan-13
źĻġŸŪťŵũġ ġ
ŹĻġŭŦůŨŵũġ
źʀIJİĴōġ
ŹġʀġŢġ
ġ
Document Number: 37475
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NO
Item
07
Cracked glass
08
Backlight
elements
09
10
Bezel
PCBˣCOB
Vishay
Criterion
AQL
The LCD with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged. Using
LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
9.1 Bezel may not have rust, be deformed or have fingerprints,
stains or other contamination.
9.2 Bezel must comply with job specifications.
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
11
Soldering
Revision: 10-Jan-13
X * Y<=2mm2
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections, oxidation
or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
2.5
0.65
Document Number: 37475
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NO
12
Item
General
appearance
Revision: 10-Jan-13
Vishay
Criterion
12.1 No oxidation, contamination, curves or, bends on interface
Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the interface
pin must be present or look as if it causes the interface pin to
sever.
12.6 The residual rosin or tin oil of soldering (component or chip
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.
ġ
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Document Number: 37475
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16. Material List of Components for RoHS
1. Declaration that all of or part of products (with the mark “N” in code), including, but not limited to, the
LCM, accessories or packages, manufactured and/or delivered to your company (including your
subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or
affiliated companies) do not intentionally contain any of the substances listed in all applicable EU
directives and regulations, including the following substances.
Exhibit A烉The Harmful Material List
.
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement烉
(1) Use the Sn/Ag/Cu soldering surface烊the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.烉
Reflow烉250°C, 30 seconds Max.烊
Connector soldering wave or hand soldering烉320°C, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.烉235°C ±5degrees烊
Recommended customer’s soldering temp. of connector烉280°C, 3 seconds.
17. Recommendable storage
1.
Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH
2.
3.
Do not place the module near organics solvents or corrosive gases.
Do not crush, shake, or jolt the module
Revision: 10-Jan-13
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Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000