SC16C750B 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Rev. 05 — 17 October 2008 Product data sheet 1. General description The SC16C750B is a Universal Asynchronous Receiver and Transmitter (UART) used for serial data communications. Its principal function is to convert parallel data into serial data, and vice versa. The UART can handle serial data rates up to 3 Mbit/s. The SC16C750B is pin compatible with the TL16C750 and it will power-up to be functionally equivalent to the 16C450. Programming of control registers enables the added features of the SC16C750B. Some of these added features are the 64-byte receive and transmit FIFOs, automatic hardware flow control. The selectable auto-flow control feature significantly reduces software overload and increases system efficiency while in FIFO mode by automatically controlling serial data flow using RTS output and CTS input signals. The SC16C750B also provides DMA mode data transfers through FIFO trigger levels and the TXRDY and RXRDY signals. On-board status registers provide the user with error indications, operational status, and modem interface control. System interrupts may be tailored to meet user requirements. An internal loopback capability allows on-board diagnostics. The SC16C750B operates at 5 V, 3.3 V and 2.5 V, the industrial temperature range and is available in plastic PLCC44, LQFP64, and HVQFN32 packages. 2. Features n n n n n n n n n n n n n 1. Single channel 5 V, 3.3 V and 2.5 V operation 5 V tolerant on input only pins1 Industrial temperature range (−40 °C to +85 °C) After reset, all registers are identical to the typical 16C450 register set Capable of running with all existing generic 16C450 software Pin compatibility with the industry-standard ST16C450/550, TL16C450/550, PC16C450/550. Software compatible with SC16C750 and TL16C750 Up to 3 Mbit/s transmit/receive operation at 5 V, 2 Mbit/s at 3.3 V, and 1 Mbit/s at 2.5 V 64-byte transmit FIFO 64-byte receive FIFO with error flags Programmable auto-RTS and auto-CTS u In auto-CTS mode, CTS controls transmitter u In auto-RTS mode, receive FIFO contents and threshold control RTS Automatic hardware flow control Software selectable baud rate generator For data bus pins D7 to D0, see Table 24 “Limiting values”. SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs n n n n n n n n n n n n n n Four selectable Receive interrupt trigger levels Standard modem interface Sleep mode Standard asynchronous error and framing bits (Start, Stop, and Parity Overrun Break) Independent receiver clock input Transmit, Receive, Line Status, and data set interrupts independently controlled Fully programmable character formatting: u 5-bit, 6-bit, 7-bit, or 8-bit characters u Even, odd, or no-parity formats u 1, 11⁄2, or 2-stop bit u Baud generation (DC to 3 Mbit/s) False start-bit detection Complete status reporting capabilities 3-state output TTL drive capabilities for bidirectional data bus and control bus Line break generation and detection Internal diagnostic capabilities: u Loopback controls for communications link fault isolation Prioritized interrupt system controls Modem control functions (CTS, RTS, DSR, DTR, RI, DCD) 3. Ordering information Table 1. Ordering information Industrial: VCC = 2.5 V, 3.3 V or 5 V ± 10 %; Tamb = −40 °C to +85 °C. Type number Package Name Description Version SC16C750BIA44 PLCC44 plastic leaded chip carrier; 44 leads SOT187-2 SC16C750BIB64 LQFP64 plastic low profile quad flat package; 64 leads; 10 × 10 × 1.4 mm SOT314-2 SC16C750BIBS HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 mm SOT617-1 SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 2 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 4. Block diagram SC16C750B D0 to D7 IOR, IOR IOW, IOW RESET TRANSMIT FIFO REGISTERS TRANSMIT SHIFT REGISTER TX RECEIVE SHIFT REGISTER RX DATA BUS AND CONTROL LOGIC A0 to A2 CS0, CS1, CS2 AS REGISTER SELECT LOGIC INTERCONNECT BUS LINES AND CONTROL SIGNALS FLOW CONTROL LOGIC RECEIVE FIFO REGISTERS FLOW CONTROL LOGIC DDIS DTR RTS OUT1, OUT2 INT TXRDY RXRDY CLOCK AND BAUD RATE GENERATOR INTERRUPT CONTROL LOGIC MODEM CONTROL LOGIC CTS RI DCD DSR 002aaa588 XTAL1 RCLK XTAL2 BAUDOUT Shown for PLCC44 and LQFP64 pin assignments. Fig 1. Block diagram of SC16C750B SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 3 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 5. Pinning information n.c. 1 40 CTS D0 2 41 DSR D1 3 42 DCD D2 4 43 RI D3 5 44 VCC D4 6 5.1 Pinning D5 7 39 RESET D6 8 38 OUT1 D7 9 37 DTR RCLK 10 36 RTS RX 11 35 OUT2 SC16C750BIA44 n.c. 12 34 n.c. TX 13 33 INT AS 28 TXRDY 27 IOR 25 DDIS 26 IOR 24 n.c. 23 002aaa589 25 CTS 26 DSR 27 VCC 28 D0 29 D1 30 D2 32 D4 terminal 1 index area 31 D3 Pin configuration for PLCC44 D5 1 24 RESET D6 2 23 OUT D7 3 22 DTR RCLK 4 RX 5 TX 6 19 RXRDY CS 7 18 A0 BAUDOUT 8 17 A1 21 RTS 20 INT A2 16 IOR 14 TXRDY 15 GND 13 n.c. 12 IOW 11 XTAL1 9 SC16C750BIBS XTAL2 10 Fig 2. GND 22 29 A2 IOW 21 30 A1 BAUDOUT 17 IOW 20 31 A0 CS2 16 XTAL2 19 32 RXRDY CS1 15 XTAL1 18 CS0 14 002aaa949 Transparent top view Fig 3. Pin configuration for HVQFN32 SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 4 of 44 SC16C750B NXP Semiconductors 49 n.c. 50 D5 51 D6 52 D7 53 n.c. 54 RCLK 55 RX 56 n.c. 57 n.c. 58 TX 59 CS0 60 n.c. 61 CS1 62 CS2 63 n.c. 64 BAUDOUT 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs XTAL1 1 48 D4 XTAL2 2 47 n.c. n.c. 3 46 D3 IOW 4 45 D2 n.c. 5 44 n.c. IOW 6 43 D1 n.c. 7 42 D0 GND 8 IOR 9 41 n.c. SC16C750BIB64 40 VCC IOR 10 39 n.c. n.c. 11 38 RI DDIS 12 37 n.c. Fig 4. RESET 32 n.c. 31 OUT1 30 n.c. 29 DTR 28 n.c. 27 RTS 26 OUT2 25 n.c. 24 INT 23 n.c. 22 RXRDY 21 33 CTS A0 20 34 n.c. n.c. 16 n.c. 19 35 DSR AS 15 A1 18 36 DCD n.c. 14 A2 17 TXRDY 13 002aaa590 Pin configuration for LQFP64 5.2 Pin description Table 2. Symbol Pin description Pin Type PLCC44 LQFP64 Description HVQFN32 A2, A1, A0 29, 30, 31 17, 18, 20 16, 17, 18 I Register select. A0 to A2 are used during read and write operations to select the UART register to read from or write to. Refer to Table 3 for register addresses and refer to AS description. AS 28 15 - I Address strobe. When AS is active (LOW), A0, A1, and A2 and CS0, CS1, and CS2 drive the internal select logic directly; when AS is HIGH, the register select and chip select signals are held at the logic levels they were in when the LOW-to-HIGH transition of AS occurred. BAUDOUT 17 64 8 O Baud out. BAUDOUT is a 16× clock signal for the transmitter section of the UART. The clock rate is established by the reference oscillator frequency divided by a divisor specified in the baud rate generator divisor latches. BAUDOUT may also be used for the receiver section by tying this output to RCLK. CS0, CS1, 14, 15, CS2 16 59, 61, 62 - I CS - 7 I Chip select. When CS0 and CS1 are HIGH and CS2 is LOW, these three inputs select the UART. When any of these inputs are inactive, the UART remains inactive (refer to AS description). - SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 5 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 2. Symbol Pin description …continued Pin Type Description I Clear to send. CTS is a modem status signal. Its condition can be checked by reading bit 4 (CTS) of the Modem Status Register (MSR). MSR[3] (∆CTS) indicates that CTS has changed states since the last read from the MSR. If the modem status interrupt is enabled when CTS changes levels and the auto-CTS mode is not enabled, an interrupt is generated. CTS is also used in the auto-CTS mode to control the transmitter. PLCC44 LQFP64 HVQFN32 CTS 40 33 25 D7 to D0 9, 8, 7, 6, 5, 4, 3, 2 52, 51, 50, 3, 2, 1, 32, I/O 48, 46, 45, 31, 30, 43, 42 29, 28 Data bus. Eight data lines with 3-state outputs provide a bidirectional path for data, control and status information between the UART and the CPU. DCD 42 36 - I Data carrier detect. DCD is a modem status signal. Its condition can be checked by reading bit 7 (DCD) of the Modem Status Register (MSR). MSR[3] (∆DCD) indicates that DCD has changed states since the last read from the MSR. If the modem status interrupt is enabled when DCD changes levels, an interrupt is generated. DDIS 26 12 - O Driver disable. DDIS is active (LOW) when the CPU is reading data. When inactive (HIGH), DDIS can disable an external transceiver. DSR 41 35 26 I Data set ready. DSR is a modem status signal. Its condition can be checked by reading bit 5 (DSR) of the Modem Status Register. Bit 1 (DDSR) of the MSR indicates DSR has changed levels since the last read from the MSR. If the modem status interrupt is enabled when DSR changes levels, an interrupt is generated. DTR 37 28 22 O Data terminal ready. When active (LOW), DTR informs a modem or data set that the UART is ready to establish communication. DTR is placed in the active level by setting the DTR bit of the Modem Control Register. DTR is placed in the inactive level either as a result of a Master Reset, during Loopback mode operation, or clearing the DTR bit. INT 33 23 20 O Interrupt. When active (HIGH), INT informs the CPU that the UART has an interrupt to be serviced. Four conditions that cause an interrupt to be issued are: a receiver error, received data that is available or timed out (FIFO mode only), an empty transmitter holding register or an enabled modem status interrupt. INT is reset (deactivated) either when the interrupt is serviced or as a result of a Master Reset. n.c. 34 3, 5, 7, 11, 12 14, 16, 19, 22, 24, 27, 29, 31, 34, 37, 39, 41, 44, 47, 49, 53, 56, 57, 60, 63 - not connected OUT1, OUT2 38, 35 30, 25 - O OUT - - 23 O Outputs 1 and 2. These are user-designated output terminals that are set to the active (LOW) level by setting respective Modem Control Register (MCR) bits (OUT1 and OUT2). OUT1 and OUT2 are set to inactive the (HIGH) level as a result of Master Reset, during Loopback mode operations, or by clearing bit 2 (OUT1) or bit 3 (OUT2) of the MCR. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 6 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 2. Symbol Pin description …continued Pin Type Description 4 I Receiver clock. RCLK is the 16× baud rate clock for the receiver section of the UART. 32 24 I Master Reset. When active (HIGH), RESET clears most UART registers and sets the levels of various output signals. 25 10 - I IOR 24 9 14 I Read inputs. When either IOR or IOR is active (LOW or HIGH, respectively) while the UART is selected, the CPU is allowed to read status information or data from a selected UART register. Only one of these inputs is required for the transfer of data during a read operation; the other input should be tied to its inactive level (that is, IOR tied LOW or IOR tied HIGH). RI 43 38 - I Ring indicator. RI is a modem status signal. Its condition can be checked by reading bit 6 (RI) of the Modem Status Register. Bit 2 (∆RI) of the MSR indicates that RI has changed from a LOW to a HIGH level since the last read from the MSR. If the modem status interrupt is enabled when this transition occurs, an interrupt is generated. RTS 36 26 21 O Request to send. When active, RTS informs the modem or data set that the UART is ready to receive data. RTS is set to the active level by setting the RTS Modem Control Register bit and is set to the inactive (HIGH) level either as a result of a Master Reset or during Loopback mode operations or by clearing bit 1 (RTS) of the MCR. In the auto-RTS mode, RTS is set to the inactive level by the receiver threshold control logic. RXRDY 32 21 19 O Receiver ready. Receiver Direct Memory Access (DMA) signaling is available with RXRDY. When operating in the FIFO mode, one of two types of DMA signaling can be selected using the FIFO Control Register bit 3 (FCR[3]). When operating in the 16C450 mode, only DMA mode 0 is allowed. Mode 0 supports single-transfer DMA in which a transfer is made between CPU bus cycles. Mode 1 supports multi-transfer DMA in which multiple transfers are made continuously until the receiver FIFO has been emptied. In DMA mode 0 (FCR[0] = 0 or FCR[0] = 1, FCR[3] = 0), when there is at least one character in the receiver FIFO or receiver holding register, RXRDY is active (LOW). When RXRDY has been active but there are no characters in the FIFO or holding register, RXRDY goes inactive (HIGH). In DMA mode 1 (FCR[0] = 1, FCR[3] = 1), when the trigger level or the time-out has been reached, RXRDY goes active (LOW); when it has been active but there are no more characters in the FIFO or holding register, it goes inactive (HIGH). RX 11 55 5 I Serial data input. RX is serial data input from a connected communications device. TX 13 58 6 O Serial data output. TX is composite serial data output to a connected communication device. TX is set to the marking (HIGH) level as a result of Master Reset. PLCC44 LQFP64 HVQFN32 RCLK 10 54 RESET 39 IOR SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 7 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 2. Symbol Pin description …continued Pin Type Description 15 O Transmitter ready. Transmitter DMA signaling is available with TXRDY. When operating in the FIFO mode, one of two types of DMA signaling can be selected using FCR[3]. When operating in the 16C450 mode, only DMA mode 0 is allowed. Mode 0 supports single-transfer DMA in which a transfer is made between CPU bus cycles. Mode 1 supports multi-transfer DMA in which multiple transfers are made continuously until the transmit FIFO has been filled. 40 27 Power 2.5 V, 3 V or 5 V supply voltage. 8 13 Power Ground voltage. PLCC44 LQFP64 HVQFN32 TXRDY 27 13 VCC 44 GND 22 Write inputs. When either IOW or IOW is active (LOW or HIGH, respectively) and while the UART is selected, the CPU is allowed to write control words or data into a selected UART register. Only one of these inputs is required to transfer data during a write operation; the other input should be tied to its inactive level (that is, IOW tied LOW or IOW tied HIGH). IOW 21 6 - I IOW 20 4 11 I XTAL1 18 1 9 I Crystal connection or External clock input. XTAL2[1] 19 2 10 O Crystal connection or the inversion of XTAL1 if XTAL1 is driven. [1] In Sleep mode, XTAL2 is left floating. 6. Functional description The SC16C750B provides serial asynchronous receive data synchronization, parallel-to-serial and serial-to-parallel data conversions for both the transmitter and receiver sections. These functions are necessary for converting the serial data stream into parallel data that is required with digital data systems. Synchronization for the serial data stream is accomplished by adding start and stop bits to the transmit data to form a data character (character orientated protocol). Data integrity is insured by attaching a parity bit to the data character. The parity bit is checked by the receiver for any transmission bit errors. The SC16C750B is fabricated with an advanced CMOS process to achieve low drain power and high speed requirements. The SC16C750B is an upward solution that provides 64 bytes of transmit and receive FIFO memory, instead of none in the 16C450, or 16 bytes in the 16C550. The SC16C750B is designed to work with high speed modems and shared network environments that require fast data processing time. Increased performance is realized in the SC16C750B by the larger transmit and receive FIFOs. This allows the external processor to handle more networking tasks within a given time. In addition, the four selectable levels of FIFO trigger interrupt and automatic hardware flow control is uniquely provided for maximum data throughput performance, especially when operating in a multi-channel environment. The combination of the above greatly reduces the bandwidth requirement of the external controlling CPU, increases performance, and reduces power consumption. The SC16C750B is capable of operation up to 3 Mbit/s with a 48 MHz external clock input (at 5 V). SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 8 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs The rich feature set of the SC16C750B is available through internal registers. Automatic hardware flow control, selectable transmit and receive FIFO trigger level, selectable TX and RX baud rates, modem interface controls, and a sleep mode are some of these features. 6.1 Internal registers The SC16C750B provides 12 internal registers for monitoring and control. These registers are shown in Table 3. These twelve registers are similar to those already available in the standard 16C550. These registers function as data holding registers (THR/RHR), interrupt status and control registers (IER/ISR), a FIFO Control Register (FCR), line status and control registers (LCR/LSR), modem status and control registers (MCR/MSR), programmable data rate (clock) control registers (DLL/DLM), and a user accessible Scratchpad Register (SPR). Register functions are more fully described in the following paragraphs. Table 3. A2 Internal registers decoding A1 A0 READ mode WRITE mode General register set (THR/RHR, IER/ISR, MCR/MSR, FCR, LSR, SPR)[1] 0 0 0 Receive Holding Register Transmit Holding Register 0 0 1 Interrupt Enable Register Interrupt Enable Register 0 1 0 Interrupt Status Register FIFO Control Register 0 1 1 Line Control Register Line Control Register 1 0 0 Modem Control Register Modem Control Register 1 0 1 Line Status Register n/a 1 1 0 Modem Status Register n/a 1 1 1 Scratchpad Register Scratchpad Register Baud rate register set (DLL/DLM)[2] 0 0 0 LSB of Divisor Latch LSB of Divisor Latch 0 0 1 MSB of Divisor Latch MSB of Divisor Latch [1] These registers are accessible only when LCR[7] is a logic 0. [2] These registers are accessible only when LCR[7] is a logic 1. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 9 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 6.2 FIFO operation The 64-byte transmit and receive data FIFOs are enabled by the FIFO Control Register bit 0 (FCR[0]). The receiver FIFO section includes a time-out function to ensure data is delivered to the external CPU. An interrupt is generated whenever the Receive Holding Register (RHR) has not been read following the loading of a character or the receive trigger level has not been reached. Table 4. Flow control mechanism Selected trigger level (characters) INT pin activation Negate RTS Assert RTS 1 1 1 0 4 4 4 0 8 8 8 0 14 14 14 0 1 1 1 0 16 16 16 0 32 32 32 0 56 56 56 0 16-byte FIFO 64-byte FIFO 6.3 Hardware flow control When automatic hardware flow control is enabled, the SC16C750B monitors the CTS pin for a remote buffer overflow indication and controls the RTS pin for local buffer overflows. Automatic hardware flow control is selected by setting MCR[5] (RTS) and MCR[1] (CTS) to a logic 1. If CTS transitions from a logic 0 to a logic 1 indicating a flow control request, the SC16C750B will suspend TX transmissions as soon as the stop bit of the character in process is shifted out. Transmission is resumed after the CTS input returns to a logic 0, indicating more data may be sent. With the auto-RTS function enabled, an interrupt is generated when the receive FIFO reaches the programmed trigger level. The RTS pin will not be forced to a logic 1 (RTS off), until the receive FIFO reaches the next trigger level. However, the RTS pin will return to a logic 0 after the data buffer (FIFO) is emptied. However, under the above described conditions, the SC16C750B will continue to accept data until the receive FIFO is full. 6.4 Time-out interrupts When two interrupt conditions have the same priority, it is important to service these interrupts correctly. Receive Data Ready and Receive Time-Out have the same interrupt priority (when enabled by IER[0]). The receiver issues an interrupt after the number of characters have reached the programmed trigger level. In this case, the SC16C750B FIFO may hold more characters than the programmed trigger level. Following the removal of a data byte, the user should re-check LSR[0] for additional characters. A Receive Time-Out will not occur if the receive FIFO is empty. The time-out counter is reset at the center of each stop bit received or each time the receive holding register (RHR) is read. The actual time-out value is 4 character time. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 10 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 6.5 Programmable baud rate generator The SC16C750B supports high speed modem technologies that have increased input data rates by employing data compression schemes. For example, a 33.6 kbit/s modem that employs data compression may require a 115.2 kbit/s input data rate. A 128.0 kbit/s ISDN modem that supports data compression may need an input data rate of 460.8 kbit/s. A single baud rate generator is provided for the transmitter and receiver, allowing independent TX/RX channel control. The programmable baud rate generator is capable of accepting an input clock up to 48 MHz, as required for supporting a 3 Mbit/s data rate. The SC16C750B can be configured for internal or external clock operation. For internal clock oscillator operation, an industry standard microprocessor crystal (parallel resonant, 22 pF to 33 pF load) is connected externally between the XTAL1 and XTAL2 pins (see Figure 5). Alternatively, an external clock can be connected to the XTAL1 pin to clock the internal baud rate generator for standard or custom rates (see Table 5). XTAL1 XTAL2 X1 1.8432 MHz C1 22 pF XTAL1 XTAL2 X1 1.8432 MHz C2 33 pF C1 22 pF 1.5 kΩ C2 47 pF 002aaa870 Fig 5. Crystal oscillator connection The generator divides the input 16× clock by any divisor from 1 to (216 − 1). The SC16C750B divides the basic crystal or external clock by 16. The frequency of the BAUDOUT output pin is exactly 16× (16 times) of the selected baud rate (BAUDOUT = 16 Baud Rate). Customized baud rates can be achieved by selecting the proper divisor values for the MSB and LSB sections of baud rate generator. Programming the baud rate generator registers DLM (MSB) and DLL (LSB) provides a user capability for selecting the desired final baud rate. The example in Table 5 shows selectable baud rates when using a 1.8432 MHz crystal. For custom baud rates, the divisor value can be calculated using Equation 1: XTAL1 clock frequency divisor ( in decimal ) = ---------------------------------------------------------------serial data rate × 16 SC16C750B_5 Product data sheet (1) © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 11 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 5. Baud rates using 1.8432 MHz or 3.072 MHz crystal Using 1.8432 MHz crystal Desired baud rate Divisor for 16× clock 50 Using 3.072 MHz crystal Baud rate error Desired baud rate Divisor for 16× clock 2304 50 3840 75 1536 75 2560 110 1047 0.026 110 1745 0.026 134.5 857 0.058 134.5 1428 0.034 150 768 150 1280 300 384 300 640 600 192 600 320 1200 96 1200 160 1800 64 1800 107 2000 58 2000 96 2400 48 2400 80 3600 32 3600 53 4800 24 4800 40 7200 16 7200 27 9600 12 9600 20 19200 6 19200 10 38400 3 38400 5 56000 2 0.69 Baud rate error 0.312 0.628 1.23 2.86 6.6 DMA operation The SC16C750B FIFO trigger level provides additional flexibility to the user for block mode operation. The user can optionally operate the transmit and receive FIFOs in the DMA mode (FCR[3]). The DMA mode affects the state of the RXRDY and TXRDY output pins. Table 6 and Table 7 show this. Table 6. Effect of DMA mode on state of RXRDY pin Non-DMA mode DMA mode 1 = FIFO empty 0-to-1 transition when FIFO empties 0 = at least 1 byte in FIFO 1-to-0 transition when FIFO reaches trigger level, or time-out occurs Table 7. Effect of DMA mode on state of TXRDY pin Non-DMA mode DMA mode 1 = at least 1 byte in FIFO 0-to-1 transition when FIFO becomes full 0 = FIFO empty 1-to-0 transition when FIFO becomes empty SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 12 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 6.7 Sleep mode The SC16C750B is designed to operate with low power consumption. A special Sleep mode is included to further reduce power consumption (the internal oscillator driver is disabled) when the chip is not being used. With IER[4] enabled (set to a logic 1), the SC16C750B enters the Sleep mode, but resumes normal operation when a start bit is detected, a change of state of RX or on any of the modem input pins RI, CTS, DSR, DCD, or a transmit data is provided by the user. If the Sleep mode is enabled and the SC16C750B is awakened by one of the conditions described above, it will return to the Sleep mode automatically after the last character is transmitted or read by the user. In any case, the Sleep mode will not be entered while an interrupt(s) is pending. The SC16C750B will stay in the Sleep mode of operation until it is disabled by setting IER[4] to a logic 0. 6.8 Low power mode In Low power mode the oscillator is still running and only the clock to the UART core is cut off. This helps to reduce the operating current to about 1⁄3. The UART wakes up under the same conditions as in Sleep mode. 6.9 Loopback mode The internal loopback capability allows on-board diagnostics. In the Loopback mode, the normal modem interface pins are disconnected and reconfigured for loopback internally. MCR[3:0] register bits are used for controlling loopback diagnostic testing. In the Loopback mode, OUT1 and OUT2 in the MCR register (bit 2 and bit 3) control the modem RI and DCD inputs, respectively. MCR signals DTR and RTS (bit 0 and bit 1) are used to control the modem DSR and CTS inputs, respectively. The transmitter output (TX) and the receiver input (RX) are disconnected from their associated interface pins, and instead are connected together internally (see Figure 6). The CTS, DSR, DCD, and RI are disconnected from their normal modem control input pins, and instead are connected internally to RTS, DTR, OUT2 and OUT1. Loopback test data is entered into the Transmit Holding Register via the user data bus interface, D0 to D7. The transmit UART serializes the data and passes the serial data to the receive UART via the internal loopback connection. The receive UART converts the serial data back into parallel data that is then made available at the user data interface D0 to D7. The user optionally compares the received data to the initial transmitted data for verifying error-free operation of the UART TX/RX circuits. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 13 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs SC16C750B D0 to D7 IOR, IOR IOW, IOW RESET TRANSMIT FIFO REGISTERS TRANSMIT SHIFT REGISTER DATA BUS AND CONTROL LOGIC REGISTER SELECT LOGIC INTERCONNECT BUS LINES AND CONTROL SIGNALS FLOW CONTROL LOGIC A0 to A2 CS0, CS1, CS2 AS TX RECEIVE FIFO REGISTERS MCR[4] = 1 RECEIVE SHIFT REGISTER RX FLOW CONTROL LOGIC RTS DDIS CTS DTR INT TXRDY RXRDY CLOCK AND BAUD RATE GENERATOR INTERRUPT CONTROL LOGIC DSR MODEM CONTROL LOGIC OUT1 RI OUT2 DCD 002aaa591 XTAL1 RCLK XTAL2 BAUDOUT Shown for PLCC44 and LQFP64 pin assignments. Fig 6. Internal Loopback mode diagram SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 14 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7. Register descriptions Table 8 details the assigned bit functions for the fifteen SC16C750B internal registers. The assigned bit functions are more fully defined in Section 7.1 through Section 7.10. Table 8. SC16C750B internal registers A2 A1 A0 Register Default[1] Bit 7 General Register Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Set[2] 0 0 0 RHR XX bit 7 0 0 0 THR XX bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0 0 1 IER 00 0 0 Low power mode Sleep mode modem status interrupt receive line status interrupt transmit holding register receive holding register 0 1 0 FCR 00 RCVR trigger (MSB) RCVR trigger (LSB) 64-byte FIFO enable reserved DMA mode select XMIT FIFO reset RCVR FIFO reset FIFO enable 0 1 0 ISR 01 FIFOs enabled FIFOs enabled 64-byte FIFO enable 0 INT priority bit 2 INT priority bit 1 INT priority bit 0 INT status 0 1 1 LCR 00 divisor latch enable set break set parity even parity parity enable stop bits word length bit 1 word length bit 0 1 0 0 MCR 00 0 0 flow control enable loopback OUT2 OUT1 RTS DTR 1 0 1 LSR 60 FIFO data error trans. empty trans. holding empty break interrupt framing error parity error overrun error receive data ready 1 1 0 MSR X0 DCD RI DSR CTS ∆DCD ∆RI ∆DSR ∆CTS 1 1 1 SPR FF bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Special Register Set[3] 0 0 0 DLL XX bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0 0 1 DLM XX bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 [1] The value shown represents the register’s initialized HEX value; X = n/a. [2] These registers are accessible only when LCR[7] = 0. [3] The Special Register set is accessible only when LCR[7] is set to a logic 1. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 15 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.1 Transmit Holding Register (THR) and Receive Holding Register (RHR) The serial transmitter section consists of an 8-bit Transmit Hold Register (THR) and Transmit Shift Register (TSR). The status of the THR is provided in the Line Status Register (LSR). Writing to the THR transfers the contents of the data bus (D7 to D0) to the THR, providing that the THR or TSR is empty. The THR empty flag in the LSR register will be set to a logic 1 when the transmitter is empty or when data is transferred to the TSR. Note that a write operation can be performed when the THR empty flag is set (logic 0 = FIFO full; logic 1 = at least one FIFO location available). The serial receive section also contains an 8-bit Receive Holding Register (RHR). Receive data is removed from the SC16C750B and receive FIFO by reading the RHR register. The receive section provides a mechanism to prevent false starts. On the falling edge of a start or false start bit, an internal receiver counter starts counting clocks at the 16× clock rate. After 71⁄2 clocks, the start bit time should be shifted to the center of the start bit. At this time the start bit is sampled, and if it is still a logic 0 it is validated. Evaluating the start bit in this manner prevents the receiver from assembling a false character. Receiver status codes will be posted in the LSR. 7.2 Interrupt Enable Register (IER) The Interrupt Enable Register (IER) masks the interrupts from receiver ready, transmitter empty, line status and modem status registers. These interrupts would normally be seen on the INT output pin. Table 9. Interrupt Enable Register bits description Bit Symbol Description 7:6 IER[7:6] Not used. 5 IER[5] Low power mode. logic 0 = disable Low power mode (normal default condition) logic 1 = enable Low power mode 4 IER[4] Sleep mode. logic 0 = disable Sleep mode (normal default condition) logic 1 = enable Sleep mode. See Section 6.7 “Sleep mode” for details. 3 IER[3] Modem Status Interrupt. logic 0 = disable the modem status register interrupt (normal default condition) logic 1 = enable the modem status register interrupt 2 IER[2] Receive Line Status interrupt. This interrupt will be issued whenever a fully assembled receive character is transferred from RSR to the RHR/FIFO, i.e., data ready, LSR[0]. logic 0 = disable the receiver line status interrupt (normal default condition) logic 1 = enable the receiver line status interrupt SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 16 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 9. Interrupt Enable Register bits description …continued Bit Symbol Description 1 IER[1] Transmit Holding Register interrupt. This interrupt will be issued whenever the THR is empty, and is associated with LSR[1]. logic 0 = disable the transmitter empty interrupt (normal default condition) logic 1 = enable the transmitter empty interrupt 0 IER[0] Receive Holding Register interrupt. This interrupt will be issued when the FIFO has reached the programmed trigger level, or is cleared when the FIFO drops below the trigger level in the FIFO mode of operation. logic 0 = disable the receiver ready interrupt (normal default condition) logic 1 = enable the receiver ready interrupt 7.2.1 IER versus Receive FIFO interrupt mode operation When the receive FIFO (FCR[0] = logic 1), and receive interrupts (IER[0] = logic 1) are enabled, the receive interrupts and register status will reflect the following: • The receive data available interrupts are issued to the external CPU when the FIFO has reached the programmed trigger level. It will be cleared when the FIFO drops below the programmed trigger level. • FIFO status will also be reflected in the user accessible ISR register when the FIFO trigger level is reached. Both the ISR register status bit and the interrupt will be cleared when the FIFO drops below the trigger level. • The data ready bit (LSR[0]) is set as soon as a character is transferred from the shift register to the receive FIFO. It is reset when the FIFO is empty. 7.2.2 IER versus Receive/Transmit FIFO polled mode operation When FCR[0] = logic 1, resetting IER[3:0] enables the SC16C750B in the FIFO polled mode of operation. Since the receiver and transmitter have separate bits in the LSR, either or both can be used in the polled mode by selecting respective transmit or receive control bit(s). • • • • • LSR[0] will be a logic 1 as long as there is one byte in the receive FIFO. LSR[4:1] will provide the type of errors encountered, if any. LSR[5] will indicate when the transmit FIFO is empty. LSR[6] will indicate when both the transmit FIFO and transmit shift register are empty. LSR[7] will indicate any FIFO data errors. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 17 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.3 FIFO Control Register (FCR) This register is used to enable the FIFOs, clear the FIFOs, set the receive FIFO trigger levels, and select the DMA mode. 7.3.1 DMA mode 7.3.1.1 Mode 0 (FCR bit 3 = 0) Set and enable the interrupt for each single transmit or receive operation, and is similar to the 16C450 mode. Transmit Ready (TXRDY) will go to a logic 0 whenever an empty transmit space is available in the Transmit Holding Register (THR). Receive Ready (RXRDY) will go to a logic 0 whenever the Receive Holding Register (RHR) is loaded with a character. 7.3.1.2 Mode 1 (FCR bit 3 = 1) Set and enable the interrupt in a block mode operation. The transmit interrupt is set when the transmit FIFO is below the programmed trigger level. The receive interrupt is set when the receive FIFO fills to the programmed trigger level. However, the FIFO continues to fill regardless of the programmed level until the FIFO is full. RXRDY remains a logic 0 as long as the FIFO fill level is above the programmed trigger level. 7.3.2 FIFO mode Table 10. FIFO Control Register bits description Bit Symbol Description 7:6 FCR[7] (MSB), FCR[6] (LSB) RCVR trigger. These bits are used to set the trigger level for the receive FIFO interrupt. FCR[5] 64-byte FIFO enable. 5 An interrupt is generated when the number of characters in the FIFO equals the programmed trigger level. However, the FIFO will continue to be loaded until it is full. Refer to Table 11. logic 0 = 16-byte mode (normal default condition) logic 1 = 64-byte mode 4 FCR[4] reserved 3 FCR[3] DMA mode select. logic 0 = set DMA mode ‘0’ (normal default condition). logic 1 = set DMA mode ‘1’ Transmit operation in mode ‘0’: When the SC16C750B is in the 16C450 mode (FIFOs disabled; FCR[0] = logic 0) or in the FIFO mode (FIFOs enabled; FCR[0] = logic 1; FCR[3] = logic 0), and when there are no characters in the transmit FIFO or transmit holding register, the TXRDY pin will be a logic 0. Once active, the TXRDY pin will go to a logic 1 after the first character is loaded into the transmit holding register. Receive operation in mode ‘0’: When the SC16C750B is in 16C450 mode, or in the FIFO mode (FCR[0] = logic 1; FCR[3] = logic 0) and there is at least one character in the receive FIFO, the RXRDY pin will be a logic 0. Once active, the RXRDY pin will go to a logic 1 when there are no more characters in the receiver. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 18 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 10. Bit FIFO Control Register bits description …continued Symbol Description FCR[3] (continued) Transmit operation in mode ‘1’: When the SC16C750B is in FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1), the TXRDY pin will be a logic 1 when the transmit FIFO is completely full. It will be a logic 0 when the FIFO is emptied. Receive operation in mode ‘1’: When the SC16C750B is in FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1) and the trigger level has been reached, or a Receive Time-Out has occurred, the RXRDY pin will go to a logic 0. Once activated, it will go to a logic 1 after there are no more characters in the FIFO. 2 FCR[2] XMIT FIFO reset. logic 0 = no FIFO transmit reset (normal default condition) logic 1 = clears the contents of the transmit FIFO and resets the FIFO counter logic (the transmit shift register is not cleared or altered). This bit will return to a logic 0 after clearing the FIFO. 1 FCR[1] RCVR FIFO reset. logic 0 = no FIFO receive reset (normal default condition) logic 1 = clears the contents of the receive FIFO and resets the FIFO counter logic (the receive shift register is not cleared or altered). This bit will return to a logic 0 after clearing the FIFO. 0 FCR[0] FIFO enable. logic 0 = disable the transmit and receive FIFO (normal default condition) logic 1 = enable the transmit and receive FIFO Table 11. FCR[7] RCVR trigger levels FCR[6] RX FIFO trigger level (bytes) 16-byte operation 64-byte operation 0 0 1 1 0 1 4 16 1 0 8 32 1 1 14 56 SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 19 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.4 Interrupt Status Register (ISR) The SC16C750B provides four levels of prioritized interrupts to minimize external software interaction. The Interrupt Status Register (ISR) provides the user with four interrupt status bits. Performing a read cycle on the ISR will provide the user with the highest pending interrupt level to be serviced. No other interrupts are acknowledged until the pending interrupt is serviced. Whenever the interrupt status register is read, the interrupt status is cleared. However, it should be noted that only the current pending interrupt is cleared by the read. A lower level interrupt may be seen after re-reading the interrupt status bits. Table 12 “Interrupt source” shows the data values (bit 0 to bit 4) for the four prioritized interrupt levels and the interrupt sources associated with each of these interrupt levels. Table 12. Interrupt source Priority level ISR[3] ISR[2] ISR[1] ISR[0] Source of the interrupt 1 0 1 1 0 LSR (Receiver Line Status Register) 2 0 1 0 0 RXRDY (Received Data Ready) 2 1 1 0 0 RXRDY (Receive Data time-out) 3 0 0 1 0 TXRDY (Transmitter Holding Register Empty) 4 0 0 0 0 MSR (Modem Status Register) Table 13. Interrupt Status Register bits description Bit Symbol Description 7:6 ISR[7:6] FIFOs enabled. These bits are set to a logic 0 when the FIFO is not being used. They are set to a logic 1 when the FIFOs are enabled. logic 0 or cleared = default condition 5 ISR[5] 64-byte FIFO enable. logic 0 = 16-byte operation logic 1 = 64-byte operation 4 ISR[4] not used 3:1 ISR[3:1] INT priority bit 2 to bit 0. These bits indicate the source for a pending interrupt at interrupt priority levels 1, 2, and 3 (see Table 12). logic 0 or cleared = default condition 0 ISR[0] INT status. logic 0 = an interrupt is pending and the ISR contents may be used as a pointer to the appropriate interrupt service routine logic 1 = no interrupt pending (normal default condition) SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 20 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.5 Line Control Register (LCR) The Line Control Register is used to specify the asynchronous data communication format. The word length, the number of stop bits, and the parity are selected by writing the appropriate bits in this register. Table 14. Line Control Register bits description Bit Symbol Description 7 LCR[7] Divisor latch enable. The internal baud rate counter latch and Enhanced Feature mode enable. logic 0 = divisor latch disabled (normal default condition) logic 1 = divisor latch and enhanced feature register enabled 6 LCR[6] Set break. When enabled, the Break control bit causes a break condition to be transmitted (the TX output is forced to a logic 0 state). This condition exists until disabled by setting LCR[6] to a logic 0. logic 0 = no TX break condition (normal default condition) logic 1 = forces the transmitter output (TX) to a logic 0 for alerting the remote receiver to a line break condition 5 LCR[5] Set parity. If the parity bit is enabled, LCR[5] selects the forced parity format. Programs the parity conditions (see Table 15). logic 0 = parity is not forced (normal default condition) LCR[5] = logic 1 and LCR[4] = logic 0: parity bit is forced to a logic 1 for the transmit and receive data LCR[5] = logic 1 and LCR[4] = logic 1: parity bit is forced to a logic 0 for the transmit and receive data 4 LCR[4] Even parity. If the parity bit is enabled with LCR[3] set to a logic 1, LCR[4] selects the even or odd parity format. logic 0 = odd parity is generated by forcing an odd number of logic 1s in the transmitted data. The receiver must be programmed to check the same format (normal default condition). logic 1 = even parity is generated by forcing an even number of logic 1s in the transmitted data. The receiver must be programmed to check the same format. 3 LCR[3] Parity enable. Parity or no parity can be selected via this bit. logic 0 = no parity (normal default condition) logic 1 = a parity bit is generated during the transmission, receiver checks the data and parity for transmission errors 2 LCR[2] Stop bits. The length of stop bit is specified by this bit in conjunction with the programmed word length (see Table 16). logic 0 or cleared = default condition 1:0 LCR[1:0] Word length bit 1, bit 0. These two bits specify the word length to be transmitted or received (see Table 17). logic 0 or cleared = default condition SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 21 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 15. LCR[5] parity selection LCR[5] LCR[4] LCR[3] Parity selection X X 0 no parity 0 0 1 odd parity 0 1 1 even parity 1 0 1 force parity ‘1’ 1 1 1 forced parity ‘0’ Table 16. LCR[2] stop bit length LCR[2] Word length (bits) Stop bit length (bit times) 0 5, 6, 7, 8 1 1 5 11⁄2 1 6, 7, 8 2 Table 17. LCR[1:0] word length LCR[1] LCR[0] Word length (bits) 0 0 5 0 1 6 1 0 7 1 1 8 SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 22 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.6 Modem Control Register (MCR) This register controls the interface with the modem or a peripheral device. Table 18. Modem Control Register bits description Bit Symbol Description 7 MCR[7] reserved; set to 0 6 MCR[6] reserved; set to 0 5 MCR[5] AFE. This bit is the auto flow control enable. When this bit is set, the auto flow control is enabled. 4 MCR[4] Loopback. Enable the local Loopback mode (diagnostics). In this mode the transmitter output (TX) and the receiver input (RX), CTS, DSR, DCD, and RI are disconnected from the SC16C750B I/O pins. Internally the modem data and control pins are connected into a loopback data configuration (see Figure 6). In this mode, the receiver and transmitter interrupts remain fully operational. The Modem Control Interrupts are also operational, but the interrupts’ sources are switched to the lower four bits of the Modem Control. Interrupts continue to be controlled by the IER register. logic 0 = disable Loopback mode (normal default condition) logic 1 = enable local Loopback mode (diagnostics) 3 MCR[3] OUT2, INT enable. Used to control the modem DCD signal in the Loopback mode. logic 0 = set OUT2 to HIGH. In the Loopback mode, sets OUT2 (DCD) internally to a logic 1. logic 1 = set OUT2 to LOW. In the Loopback mode, sets OUT2 (DCD) internally to a logic 0. 2 MCR[2] OUT1. This bit is used in the Loopback mode only. In the Loopback mode, this bit is used to write the state of the modem RI interface signal via OUT1. 1 MCR[1] RTS logic 0 = force RTS output to a logic 1 (normal default condition) logic 1 = force RTS output to a logic 0 0 MCR[0] DTR logic 0 = force DTR output to a logic 1 (normal default condition) logic 1 = force DTR output to a logic 0 The flow control can be configured by programming MCR[1] and MCR[5] as shown in Table 19. Table 19. Flow control configuration MCR[5] (AFE) MCR[1] (RTS) 1 1 auto RTS and CTS enabled 1 0 auto CTS only enabled 0 X auto RTS and CTS disabled SC16C750B_5 Product data sheet Flow configuration © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 23 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.7 Line Status Register (LSR) This register provides the status of data transfers between the SC16C750B and the CPU. Table 20. Line Status Register bits description Bit Symbol Description 7 LSR[7] FIFO data error. logic 0 = no error (normal default condition) logic 1 = at least one parity error, framing error or break indication is in the current FIFO data. This bit is cleared when LSR register is read. 6 LSR[6] THR and TSR empty. This bit is the Transmit Empty indicator. This bit is set to a logic 1 whenever the transmit holding register and the transmit shift register are both empty. It is reset to logic 0 whenever either the THR or TSR contains a data character. In the FIFO mode, this bit is set to logic 1 whenever the transmit FIFO and transmit shift register are both empty. 5 LSR[5] THR empty. This bit is the Transmit Holding Register Empty indicator. This bit indicates that the UART is ready to accept a new character for transmission. In addition, this bit causes the UART to issue an interrupt to CPU when the THR interrupt enable is set. The THR bit is set to a logic 1 when a character is transferred from the transmit holding register into the transmitter shift register. The bit is reset to a logic 0 concurrently with the loading of the transmitter holding register by the CPU. In the FIFO mode, this bit is set when the transmit FIFO is empty; it is cleared when at least 1 byte is written to the transmit FIFO. 4 LSR[4] Break interrupt. logic 0 = no break condition (normal default condition) logic 1 = the receiver received a break signal (RX was a logic 0 for one character frame time). In the FIFO mode, only one break character is loaded into the FIFO. 3 LSR[3] Framing error. logic 0 = no framing error (normal default condition) logic 1 = framing error. The receive character did not have a valid stop bit(s). In the FIFO mode, this error is associated with the character at the top of the FIFO. 2 LSR[2] Parity error. logic 0 = no parity error (normal default condition) logic 1 = parity error. The receive character does not have correct parity information and is suspect. In the FIFO mode, this error is associated with the character at the top of the FIFO. 1 LSR[1] Overrun error. logic 0 = no overrun error (normal default condition) logic 1 = overrun error. A data overrun error occurred in the receive shift register. This happens when additional data arrives while the FIFO is full. In this case, the previous data in the shift register is overwritten. Note that under this condition, the data byte in the receive shift register is not transferred into the FIFO, therefore the data in the FIFO is not corrupted by the error. 0 LSR[0] Receive data ready. logic 0 = no data in receive holding register or FIFO (normal default condition) logic 1 = data has been received and is saved in the receive holding register or FIFO SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 24 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.8 Modem Status Register (MSR) This register provides the current state of the control interface signals from the modem, or other peripheral device to which the SC16C750B is connected. Four bits of this register are used to indicate the changed information. These bits are set to a logic 1 whenever a control input from the modem changes state. These bits are set to a logic 0 whenever the CPU reads this register. Table 21. Modem Status Register bits description Bit Symbol Description 7 MSR[7] Data Carrier Detect. DCD (active HIGH, logic 1). Normally this bit is the complement of the DCD input. In the Loopback mode this bit is equivalent to the OUT2 bit in the MCR register. 6 MSR[6] Ring Indicator. RI (active HIGH, logic 1). Normally this bit is the complement of the RI input. In the Loopback mode this bit is equivalent to the OUT1 bit in the MCR register. 5 MSR[5] Data Set Ready. DSR (active HIGH, logic 1). Normally this bit is the complement of the DSR input. In Loopback mode this bit is equivalent to the DTR bit in the MCR register. 4 MSR[4] Clear To Send. CTS. CTS functions as hardware flow control signal input if it is enabled via MCR[5]. Flow control (when enabled) allows starting and stopping the transmissions based on the external modem CTS signal. A logic 1 at the CTS pin will stop SC16C750B transmissions as soon as current character has finished transmission. Normally MSR[4] is the complement of the CTS input. However, in the Loopback mode, this bit is equivalent to the RTS bit in the MCR register. 3 MSR[3] ∆DCD [1] logic 0 = no DCD change (normal default condition) logic 1 = the DCD input to the SC16C750B has changed state since the last time it was read. A modem Status Interrupt will be generated. 2 MSR[2] ∆RI [1] logic 0 = no RI change (normal default condition) logic 1 = the RI input to the SC16C750B has changed from a logic 0 to a logic 1. A modem Status Interrupt will be generated. 1 MSR[1] ∆DSR [1] logic 0 = no DSR change (normal default condition) logic 1 = the DSR input to the SC16C750B has changed state since the last time it was read. A modem Status Interrupt will be generated. 0 MSR[0] ∆CTS [1] logic 0 = no CTS change (normal default condition) logic 1 = the CTS input to the SC16C750B has changed state since the last time it was read. A modem Status Interrupt will be generated. [1] Whenever any MSR[0:3] is set to logic 1, a Modem Status Interrupt will be generated. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 25 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 7.9 Scratchpad Register (SPR) The SC16C750B provides a temporary data register to store 8 bits of user information. 7.10 SC16C750B external reset conditions Table 22. Reset state for registers Register Reset state IER IER[7:0] = 0 ISR ISR[7:1] = 0; ISR[0] = 1 LCR LCR[7:0] = 0 MCR MCR[7:0] = 0 LSR LSR[7] = 0; LSR[6:5] = 1; LSR[4:0] = 0 MSR MSR[7:4] = input signals; MSR[3:0] = 0 FCR FCR[7:0] = 0 Table 23. Reset state for outputs Output Reset state TX HIGH RTS HIGH DTR HIGH RXRDY HIGH (STD mode) TXRDY LOW (STD mode) INT LOW (STD mode) 8. Limiting values Table 24. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage Vn voltage on any other pin Max Unit - 7 V at D7 to D0 pins GND − 0.3 VCC + 0.3 V at input only pins GND − 0.3 5.3 V operating −40 +85 °C Tamb ambient temperature Tstg storage temperature −65 +150 °C Ptot/pack total power dissipation per package - 500 mW SC16C750B_5 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 26 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 9. Static characteristics Table 25. Static characteristics Tamb = −40 °C to +85 °C; tolerance of VCC = ± 10 %, unless otherwise specified. Symbol Parameter Conditions VCC = 2.5 V VCC = 3.3 V VCC = 5.0 V Min Max Min Max Min Unit Max VIL(clk) clock LOW-level input voltage −0.3 0.45 −0.3 0.6 −0.5 0.6 V VIH(clk) clock HIGH-level input voltage 1.8 VCC 2.4 VCC 3.0 VCC V VIL LOW-level input voltage −0.3 0.65 −0.3 0.8 −0.5 0.8 V VIH HIGH-level input voltage 1.6 - 2.0 - 2.2 VCC V IOL = 5 mA (data bus) - - - - - 0.4 V IOL = 4 mA (other outputs) - - - 0.4 - - V IOL = 2 mA (data bus) - 0.4 - - - - V IOL = 1.6 mA (other outputs) - 0.4 - - - - V IOH = −5 mA (data bus) - - - - 2.4 - V IOH = −1 mA (other outputs) - - 2.0 - - - V IOH = −800 µA (data bus) 1.85 - - - - - V IOH = −400 µA (other outputs) 1.85 - - - - - V LOW-level output voltage VOL VOH HIGH-level output voltage on all outputs [1] ILIL LOW-level input leakage current - ±10 - ±10 - ±10 µA IL(clk) clock leakage current - ±30 - ±30 - ±30 µA ICC(AV) average supply current - 3.5 - 4.5 - 4.5 mA ICC(sleep) sleep mode supply current - 50 - 50 - 50 µA ICC(lp) low-power mode supply current - 1.0 - 1.5 - 1.5 mA Ci input capacitance - 5 - 5 - 5 pF Rpu(int) internal pull-up resistance 500 - 500 - 500 - kΩ [2] [1] Except for XTAL2, VOL = 1 V typically. [2] Sleep current might be higher if there is activity on the UART data bus during Sleep mode. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 27 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 10. Dynamic characteristics Table 26. Dynamic characteristics Tamb = −40 °C to +85 °C; tolerance of VCC = ± 10 %, unless otherwise specified. Symbol Parameter Conditions VCC = 2.5 V VCC = 3.3 V VCC = 5.0 V Min Max Min Max Min Max Unit tw1 clock pulse duration 15 - 13 - 10 - ns tw2 clock pulse duration 15 - 13 - 10 - ns - 16 - 32 - 48 45 - 35 - 25 - ns [1] fXTAL1 frequency on pin XTAL1 t4w address strobe width t5s address set-up time 5 - 5 - 1 - ns t5h address hold time 5 - 5 - 5 - ns t6s chip select set-up time to AS 10 - 5 - 0 - ns t6h address hold time 0 - 0 - 0 - ns [2] MHz t6s' address set-up time 10 - 10 - 5 - ns t6h chip select hold time 0 - 0 - 0 - ns t7d IOR delay from chip select 10 - 10 - 10 - ns t7w IOR strobe width 77 - 26 - 23 - ns t7h chip select hold time from IOR 0 - 0 - 0 - ns t7h' address hold time 5 - 5 - 5 - ns t8d IOR delay from address 10 - 10 - 10 - ns t9d read cycle delay 20 - 20 - 20 - ns 25 pF load [2] 25 pF load t11d IOR to DDIS delay 25 pF load - 100 - 35 - 30 ns t12d delay from IOR to data 25 pF load - 77 - 26 - 23 ns t12h data disable time 25 pF load - 15 - 15 - 15 ns t13d IOW delay from chip select 10 - 10 - 10 - ns t13w IOW strobe width 20 - 20 - 15 - ns t13h chip select hold time from IOW 0 - 0 - 0 - ns t14d IOW delay from address 10 - 10 - 10 - ns t15d write cycle delay 25 - 25 - 20 - ns t16s data set-up time 20 - 20 - 15 - ns t16h data hold time 15 - 5 - 5 - ns t17d delay from IOW to output 25 pF load - 100 - 33 - 29 ns t18d delay to set interrupt from Modem input 25 pF load - 100 - 24 - 23 ns t19d delay to reset interrupt from IOR 25 pF load - 100 - 24 - 23 ns t20d delay from stop to set interrupt - 1TRCLK - 1TRCLK - 1TRCLK s t21d delay from IOR to reset interrupt - 100 - 29 - 28 ns t22d delay from start to set interrupt - 100 - 45 - 40 ns t23d delay from IOW to transmit start [3] 25 pF load [3] 8TRCLK 24TRCLK 8TRCLK 24TRCLK 8TRCLK 24TRCLK s SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 28 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs Table 26. Dynamic characteristics …continued Tamb = −40 °C to +85 °C; tolerance of VCC = ± 10 %, unless otherwise specified. Symbol Parameter Conditions VCC = 2.5 V VCC = 3.3 V VCC = 5.0 V Unit Min Max Min Max Min Max - 100 - 45 - 40 ns - 1TRCLK - 1TRCLK - 1TRCLK s - 100 - 45 - 40 ns t24d delay from IOW to reset interrupt t25d delay from stop to set RXRDY t26d delay from IOR to reset RXRDY t27d delay from IOW to set TXRDY - 100 - 45 - 40 ns t28d delay from start to reset TXRDY [3] - 8TRCLK - 8TRCLK - 8TRCLK s tRESET Reset pulse width [4] 100 - 40 - 40 - ns N [3] baud rate divisor 1 216 −1 1 216 −1 [1] Applies to external clock, crystal oscillator max 24 MHz. [2] Applicable only when AS is tied LOW. [3] RCLK is an internal signal derived from Divisor Latch LSB (DLL) and Divisor Latch MSB (DLM) divisor latches. [4] Reset pulse must happen when these signals are inactive: CS, CS2, CS1, CS0, IOR, IOR, IOW, IOW. 1 216 −1 10.1 Timing diagrams t4w AS t5s t5h valid address A0 to A2 t6s t6h CS2 CS1, CS0 valid t7d t7h t7w t8d t9d active IOR, IOR t11d t11h active DDIS t12h t12d D0 to D7 data 002aaa331 Fig 7. General read timing when using AS signal SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 29 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs t4w AS t5s t5h valid address A0 to A2 t6s t6h CS2 CS1, CS0 valid t13d t13h t13w t14d t15d active IOW, IOW t16s t16h data D0 to D7 002aaa332 Fig 8. General write timing when using AS signal valid address A0 to A2 valid address t6s' CS active t7h' t9d active t12h t12d D0 to D7 t7w active t7w IOR t6s' t7h' t12d t12h data 002aaa333 Fig 9. General read timing when AS is tied to GND SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 30 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs valid address A0 to A2 valid address t6s' t7h' active CS t7h' t6s' active t13w t13w t15d active IOW t16h t16s t16s t16h data D0 to D7 002aaa334 Fig 10. General write timing when AS is tied to GND IOW active t17d RTS DTR change of state change of state DCD CTS DSR change of state change of state t18d INT t18d active active active t19d IOR active active active t18d change of state RI 002aaa111 Fig 11. Modem input/output timing SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 31 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs tw2 tw1 EXTERNAL CLOCK 002aaa112 tw3 1 f XTAL1 = ------t w3 Fig 12. External clock timing start bit RX parity bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 stop bit next data start bit D7 5 data bits 6 data bits 7 data bits t20d active INT t21d active IOR 16 baud rate clock 002aaa113 Fig 13. Receive timing SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 32 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs start bit D0 RX parity bit data bits (0 to 7) D1 D2 D3 D4 D5 D6 stop bit next data start bit D7 t25d active data ready RXRDY t26d active IOR 002aaa114 Fig 14. Receive ready timing in non-FIFO mode start bit RX parity bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 stop bit D7 first byte that reaches the trigger level t25d active data ready RXRDY t26d active IOR 002aaa115 Fig 15. Receive ready timing in FIFO mode SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 33 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs start bit TX parity bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 stop bit next data start bit D7 5 data bits 6 data bits 7 data bits active transmitter ready INT t22d t24d t23d IOW active active 16 baud rate clock 002aaa116 Fig 16. Transmit timing start bit D0 TX IOW active D0 to D7 byte #1 parity bit data bits (0 to 7) D1 D2 D3 D4 D5 D6 stop bit next data start bit D7 transmitter ready t27d active TXRDY t28d transmitter not ready 002aaa129 Fig 17. Transmit ready timing in non-FIFO mode SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 34 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs start bit data bits (0 to 7) D0 TX parity bit D1 D2 D3 D4 D5 D6 stop bit D7 5 data bits 6 data bits 7 data bits IOW active t28d D0 to D7 byte #16 or byte #64 t27d TXRDY FIFO full 002aaa118 Fig 18. Transmit ready timing in FIFO mode (DMA mode ‘1’) SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 35 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 11. Package outline PLCC44: plastic leaded chip carrier; 44 leads SOT187-2 eD eE y X 39 A 29 28 40 bp ZE b1 w M 44 1 E HE pin 1 index A A4 A1 e (A 3) 6 β 18 Lp k 7 detail X 17 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions) A4 A1 e UNIT A A3 D(1) E(1) eD eE HD bp b1 max. min. 4.57 4.19 mm inches 0.81 0.66 HE k 16.66 16.66 16.00 16.00 17.65 17.65 1.22 1.27 16.51 16.51 14.99 14.99 17.40 17.40 1.07 0.51 0.25 3.05 0.53 0.33 0.180 0.02 0.165 0.01 0.12 0.021 0.032 0.656 0.656 0.05 0.013 0.026 0.650 0.650 0.63 0.59 0.63 0.59 Lp v w y 1.44 1.02 0.18 0.18 0.1 ZD(1) ZE(1) max. max. 2.16 β 2.16 45 o 0.695 0.695 0.048 0.057 0.007 0.007 0.004 0.085 0.085 0.685 0.685 0.042 0.040 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT187-2 112E10 MS-018 EDR-7319 EUROPEAN PROJECTION ISSUE DATE 99-12-27 01-11-14 Fig 19. Package outline SOT187-2 (PLCC44) SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 36 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 16 y y1 C v M C A B w M C b 9 L 17 8 e e2 Eh 1/2 e 1 terminal 1 index area 24 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.1 4.9 3.25 2.95 5.1 4.9 3.25 2.95 0.5 3.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT617-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-18 Fig 20. Package outline SOT617-1 (HVQFN32) SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 37 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM θ bp pin 1 index 64 Lp L 17 detail X 16 1 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 θ 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT314-2 136E10 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 21. Package outline SOT314-2 (LQFP64) SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 38 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 12. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 12.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 12.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 12.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 39 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 12.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 22) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 27 and 28 Table 27. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 28. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 22. SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 40 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 22. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 13. Abbreviations Table 29. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor CPU Central Processing Unit DLL Divisor Latch LSB DLM Divisor Latch MSB DMA Direct Memory Access FIFO First In, First Out ISDN Integrated Service Digital Network LSB Least Significant Bit MSB Most Significant Bit TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver and Transmitter SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 41 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 14. Revision history Table 30. Revision history Document ID Release date Data sheet status Change notice Supersedes SC16C750B_5 20081017 Product data sheet - SC16C750B_4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. • Section 2 “Features”, 3rd bullet item re-written; added Footnote 1 Figure 3 “Pin configuration for HVQFN32”: corrected pin 7 signal name from “CS2” to “CS” Table 2 “Pin description”, description of RI: changed from “... has transitioned from a LOW to a HIGH ...” to “... has changed from a LOW to a HIGH ...” Table 24 “Limiting values”: – symbol Vn split to show 2 separate conditions: “at D7 to D0 pins” and “at input only pins” • Table 25 “Static characteristics”: – Symbol/parameter changed from “VIL(CK), LOW-level clock input voltage” to “VIL(clk), clock LOW-level input voltage” – Symbol/parameter changed from “VIH(CK), HIGH-level clock input voltage” to “VIH(clk), clock HIGH-level input voltage” – Symbol changed from “ICL” to “IL(clk)” – Table note [1]: changed from “Except for x2, ...” to “Except for XTAL2, ...” • Table 26 “Dynamic characteristics”: – Symbol “tw2, t2w” changed to 2 separate symbols, “tw1” and “tw2” – Table note [4]: added “CS” to list of signals which must be inactive when reset pulse happens • SC16C750B_4 Updated soldering information 20060825 Product data sheet - SC16C750B-03 SC16C750B-03 20041213 (9397 750 14453) Product data - SC16C750B-02 SC16C750B-02 20040527 (9397 750 13318) Product data - SC16C750B-01 SC16C750B-01 20040329 (9397 750 11969) Product data - - SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 42 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] SC16C750B_5 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 05 — 17 October 2008 43 of 44 SC16C750B NXP Semiconductors 5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs 17. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 7.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 8 Internal registers. . . . . . . . . . . . . . . . . . . . . . . . 9 FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 10 Hardware flow control . . . . . . . . . . . . . . . . . . . 10 Time-out interrupts . . . . . . . . . . . . . . . . . . . . . 10 Programmable baud rate generator . . . . . . . . 11 DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 12 Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Low power mode . . . . . . . . . . . . . . . . . . . . . . 13 Loopback mode . . . . . . . . . . . . . . . . . . . . . . . 13 Register descriptions . . . . . . . . . . . . . . . . . . . 15 Transmit Holding Register (THR) and Receive Holding Register (RHR) . . . . . . . . . . 16 7.2 Interrupt Enable Register (IER) . . . . . . . . . . . 16 7.2.1 IER versus Receive FIFO interrupt mode operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.2.2 IER versus Receive/Transmit FIFO polled mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17 7.3 FIFO Control Register (FCR) . . . . . . . . . . . . . 18 7.3.1 DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3.1.1 Mode 0 (FCR bit 3 = 0) . . . . . . . . . . . . . . . . . . 18 7.3.1.2 Mode 1 (FCR bit 3 = 1) . . . . . . . . . . . . . . . . . . 18 7.3.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.4 Interrupt Status Register (ISR) . . . . . . . . . . . . 20 7.5 Line Control Register (LCR) . . . . . . . . . . . . . . 21 7.6 Modem Control Register (MCR) . . . . . . . . . . . 23 7.7 Line Status Register (LSR) . . . . . . . . . . . . . . . 24 7.8 Modem Status Register (MSR). . . . . . . . . . . . 25 7.9 Scratchpad Register (SPR) . . . . . . . . . . . . . . 26 7.10 SC16C750B external reset conditions . . . . . . 26 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 26 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 27 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 28 10.1 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 29 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 36 12 Soldering of SMD packages . . . . . . . . . . . . . . 39 12.1 Introduction to soldering . . . . . . . . . . . . . . . . . 39 12.2 Wave and reflow soldering . . . . . . . . . . . . . . . 39 12.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 39 12.4 13 14 15 15.1 15.2 15.3 15.4 16 17 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 41 42 43 43 43 43 43 43 44 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 October 2008 Document identifier: SC16C750B_5