________________________________________________________________________ DATE: 15th July, 2010 PCN #: 2017 PCN Title: Qualification of Additional Wafer Sources or Die Shrink. Dear Customer: This is an announcement of change(s) to products that are currently being offered by Diodes Incorporated. We request that you acknowledge receipt of this notification within 30 days of the date of this PCN. If you require samples for evaluation purposes, please make a request within 30 days as well. Otherwise, samples may not be built prior to this change. Please refer to the implementation date of this change as it is stated in the attached PCN form. Please contact your local Diodes sales representative to acknowledge receipt of this PCN and for any sample requests. The changes announced in this PCN will not be implemented earlier than 90 days from the notification date stated in the attached PCN form. Previously agreed upon customer specific change process requirements or device specific requirements will be addressed separately. For questions or clarification regarding this PCN, please contact your local Diodes sales representative. Sincerely, Diodes Incorporated PCN Team Diodes Inc Form DW-064_R4 Page 1 of 3 Diodes Incorporated www.diodes.com Rel Date: 15 Feb 2010 Print Date: 7/14/10 4:25 PM ________________________________________________________________________ PRODUCT CHANGE NOTICE PCN-2017-I REV00 Notification Date: Implementation Date: Product Family: Change Type: PCN #: July 15, 2010 October 13, 2010 Discrete Semiconductors Wafer FAB Material and Wafer Fabrication Site 2017 TITLE Qualification of Additional Wafer Sources or Die Shrink DESCRIPTION OF CHANGE In order to assure continuity of supply, this PCN is being issued to notify customers of the qualification of Diodes FabTech (KFAB) and Diodes/Zetex (OFAB) wafer fabrication sites in addition to the currently qualified wafer fabrication site (Phenitec). Some select devices will be qualified with a smaller die size within the existing wafer fabrication site (Phenitec). Affected products are listed in the attached table. Full electrical characterization and high reliability testing will be completed on representative parts to ensure no change to device functionality or data sheet electrical specifications. There is no change to Form, Fit or Function. IMPACT None. PRODUCTS AFFECTED See attached table. WEB LINKS Manufacturer’s Notice: http://www.diodes.com/quality/pcns For More Information Contact: http://www.diodes.com/contacts Data Sheet: http://www.diodes.com/products DISCLAIMER Unless a Diodes Incorporated Sales representative is contacted in writing within 30 days of the posting of this notice, all changes described in this announcement are considered approved. Diodes Inc Form DW-064_R4 Page 2 of 3 Diodes Incorporated www.diodes.com Rel Date: 15 Feb 2010 Print Date: 7/14/10 4:25 PM ________________________________________________________________________ Devices to FabTech (KFAB) Devices to FabTech (KFAB) Devices to Zetex (OFAB) Devices to Shrink Die in Phenitec BZT52B6V2-7-F 1N4148WT-7 PD3Z284C22-7 DMMT5401-7-F 1N4448HLP-7 PD3Z284C24-7 DN350T05-7 BZX84B3V9-7-F 1N4448HWT-13 PD3Z284C27-7 DP350T05-7 BZX84B5V1-7-F 1N4448HWT-7 PD3Z284C2V4-7 DZT5401-13 BZX84B5V6-7-F BAS116-7-G PD3Z284C2V7-7 BAS116V-7 PD3Z284C30-7 BAS16HLP-7 PD3Z284C33-7 BAS16LP-7 PD3Z284C36-7 BAS16V-7 PD3Z284C39-7 BAV116W-7-G PD3Z284C3V0-7 BZT52C2V0-7-F PD3Z284C3V3-7 BZT52C2V0S-7-F PD3Z284C3V6-7 BZT52C2V0T-7 PD3Z284C3V9-7 BZT52C2V4LP-7 PD3Z284C4V3-7 BZT52C2V4T-7 PD3Z284C4V7-7 BZX84B8V2-7-F BZT52C2V7LP-7 BZT52C2V7T-7 BZT52C3V0LP-7 BZT52C3V0T-7 BZT52C3V0T-7-G BZT52C3V0T-7-G BZT52C3V3LP-7 BZT52C3V3T-7 BZT52C3V6LP-7 BZT52C3V6T-7 BZT52C3V9LP-7 BZT52C3V9T-7 BZT52C4V3LP-7 BZT52C4V3T-7 BZT52C4V7LP-7 BZT52C4V7T-7 BZT52C5V1T-7 BZX84C2V4-7-G MMBD4448V-7 MMBZ5225BTS-7-F PD3SD2580-7 PD3Z284C13-7 PD3Z284C15-7 PD3Z284C16-7 PD3Z284C18-7 PD3Z284C20-7 Diodes Inc Form DW-064_R4 Page 3 of 3 Diodes Incorporated www.diodes.com Rel Date: 15 Feb 2010 Print Date: 7/14/10 4:25 PM