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Datasheet
Sound Processor with Built-in 3-band Equalizer
BD37542FS
Key Specifications
General Description
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BD37542FS is a sound processor with built-in 3-band
equalizer for car audio. The functions are stereo input
selector (which can switch single and ground isolation
input), input-gain control, main volume, loudness, 5ch
fader volume, LPF for subwoofer and mixing input.
Moreover, “Advanced switch circuit”, which is an
original ROHM technology, can reduce various
switching noise (ex. No-signal, low frequency like 20Hz
& large signal inputs). Also, “Advanced switch” makes
control of microcomputer easier, and can construct a
high quality car audio system.
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Features
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Reduced switching noise of input gain control,
mute, main volume, fader volume, bass, middle,
treble, loudness, mixing by using advanced switch
circuit.
Built-in differential input selector that can make
various combination of single-ended / differential
input.
Built-in ground isolation amplifier inputs, which is
ideal for external stereo input.
Built-in input gain controller reduces switching
noise for volume of a portable audio input.
Decreased the number of external components
due to built-in 3-band equalizer filter, LPF for
subwoofer. It is possible to control Q, GV, fO of
3-band equalizer, fC of LPF, and GV of loudness by
I2C BUS control.
It is possible to adjust the gain of the bass, middle,
treble up to ±20dB with 1 dB step gain adjustment.
It is equipped with output terminals for Subwoofer.
Moreover, the stereo signal output of the front and
rear can also be chosen by the I2C BUS control.
Built-in mixing input and mixing attenuator.
Energy-saving design resulting in low-current
consumption is achieved by utilizing the Bi-CMOS
process. It has the advantage in quality over
scaling down the power heat control of the internal
regulators.
Input terminals and output terminals are organized
and separately laid out to keep the signal flow in
one direction which results in simpler and smaller
PCB layout.
It is possible to control the I2C BUS by 3.3V / 5V.
Power Supply Voltage Range:
Circuit Current (No Signal):
Total Harmonic Distortion 1:
(FRONT,REAR)
Total Harmonic Distortion 2:
(SUBWOOFER)
Maximum Input Voltage:
Cross-talk Between Selectors:
Volume Control Range:
Output Noise Voltage 1:
(FRONT,REAR)
Output Noise Voltage 2:
(SUBWOOFER)
Residual Output Noise Voltage:
Operating Temperature Range:
Package
7.0V to 9.5V
38mA(Typ)
0.001%(Typ)
0.002%(Typ)
2.3Vrms (Typ)
-100dB (Typ)
+15 dB to -79dB
3.8µVrms(Typ)
4.8µVrms(Typ)
1.8µVrms(Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
SSOP-A32
13.60 mm x 7.80mm x 2.01mm
Applications
It is optimal for car audio systems. It can also be used
for audio equipment of mini Compo, micro Compo, TV,
etc.
○Product structure：Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Typical Application Circuit
BD37542FS
Pin Configuration
TOP VIEW
A1
1
32
A2
2
31
GND
B1
3
30
SDA
B2
4
29
SCL
C1
5
28
VCC
C2
6
27
OUTF1
DP1
7
26
OUTF2
DN
8
25
OUTR1
DP2
EP1
FIL
9
24
OUTR2
10
23
OUTS1
EN1
11
22
OUTS2
EN2
12
21
TEST
EP2
13
20
N.C.
MIN
14
19
MUTE
LDA1
15
18
LDA2
LDB1
16
17
LDB2
Pin Descriptions
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Pin Name
A1
A2
B1
B2
C1
C2
DP1
DN
DP2
EP1
EN1
EN2
EP2
MIN
LDA1
Description
A input terminal of 1ch
A input terminal of 2ch
B input terminal of 1ch
B input terminal of 2ch
C input terminal of 1ch
C input terminal of 2ch
D positive input terminal of 1ch
D negative input terminal
D positive input terminal of 2ch
E positive input terminal of 1ch
E negative input terminal of 1ch
E negative input terminal of 2ch
E positive input terminal of 2ch
Mixing input terminal
Loudness setting terminal of 1ch
Pin No.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Pin Name
LDB2
LDA2
MUTE
N.C.
TEST
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
VCC
SCL
SDA
GND
16
LDB1
Loudness setting terminal of 1ch
32
FIL
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TSZ22111・15・001
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Description
Loudness setting terminal of 2ch
Loudness setting terminal of 2ch
External compulsory mute terminal
No Connection
Test Pin
Subwoofer output terminal of 2ch
Subwoofer output terminal of 1ch
Rear output terminal of 2ch
Rear output terminal of 1ch
Front output terminal of 2ch
Front output terminal of 1ch
Power supply terminal
I2C Communication clock terminal
I2C Communication data terminal
GND terminal
VCC/2 terminal
TSZ02201-0C2C0E100570-1-1
16.Dec.2015 Rev.001
BD37542FS
Block Diagram
28
27
26
25
24
Fader★
29
Fader★
30
Fader★
31
Fader★
32
23
22
21
20
19
18
17
15
16
VCC
VCC/2
GND
I2C BUS LOGIC
ATT★
Fader★
Fader
■Fader
Gain:+15dB to -79dB/1dB step
Gain:+15dB～-79ｄB/1dB
step
★no pop noise
■LPF
fc=55/85/120/160Hz
Loudness
■Loudness
Gain: 20dB to 0dB/1dB step
Gain:20dB～0ｄB/1ｄB
step
★no pop noise
■3 Band P-EQ (Tone control)
Gain: +20dB to -20dB/1dB step
Gain：+20dB～-20dB/1dB
step
★no pop noise
・Bass：f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain:
+15dB to -79dB/1dB stepstep
Gain：+15dB～-79dB/1dB
★no pop noise
■Input Gain
Gain:
+20dB to -0dB/1dB step
Gain：+20dB～0dB/1dB
step
★no pop noise
LPF
★Loudness
★3 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
GND
ISO amp
100k
1
100k
2
100k
3
100k
4
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
100k
5
100k
6
GND
ISO amp
250k
7
250k
8
3/33
GND
ISO amp
250k
9
250k
10
GND
ISO amp
250k
11
250k
12
250k
13
14
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
10.0
V
Input Voltage
VIN
VCC+0.3 to GND-0.3
V
Power Dissipation
Pd
Storage Temperature
(Note 1)
W
-55 to +150
°C
0.95
Tstg
(Note 1) When mounted on the standard board (70 x 70 x 1.6 mm3), derate by 7.6mW/°C for Ta above 25°C.
Thermal resistance θja = 131.6(°C/W)
Material : A FR4 grass epoxy board(3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VCC
7.0
－
9.5
V
Temperature
Topr
-40
－
+85
°C
Electrical Characteristics
GENERAL
BLOCK
(Unless specified otherwise, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A1 input, Input gain 0dB, Mute
OFF, Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, Mixing OFF, Fader 0dB)
Limit
Parameter
Unit
Min
Typ
Max
Conditions
Circuit Current (No Signal)
IQ
－
38
48
mA
No signal
Voltage Gain
GV
-1.5
0
+1.5
dB
GV=20log(VOUT/VIN)
Channel Balance
CB
-1.5
0
+1.5
dB
CB = GV1-GV2
THD+N1
－
0.001
0.05
%
THD+N2
－
0.002
0.05
%
VNO1
－
3.8
15
μVrms
VNO2
－
4.8
15
μVrms
Residual Output Noise Voltage *
VNOR
－
1.8
10
μVrms
Crosstalk Between Channels *
CTC
－
-100
-90
dB
RR
－
-70
-40
dB
Input Impedance(A, B,C)
RIN_S
70
100
130
kΩ
Input Impedance(D, E)
RIN_D
175
250
325
kΩ
Maximum Input Voltage
VIM
2.1
2.3
－
Vrms
Crosstalk Between Selectors *
CTS
－
-100
-90
dB
CMRR
50
65
－
dB
Total Harmonic Distortion 1
(FRONT,REAR)
Total Harmonic Distortion 2
(SUBWOOFER)
Output Noise Voltage 1
(FRONT,REAR) *
Output Noise Voltage 2
(SUBWOOFER) *
Ripple Rejection
INPUT SELECTOR
Symbol
Common Mode Rejection Ratio *
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TSZ22111・15・001
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VOUT=1Vrms
BW=400Hz-30KHz
VOUT=1Vrms
BW=400Hz-30KHz
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
BW = IHF-A
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
VIM at THD+N(VOUT)=1％
BW=400Hz-30KHz
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
XP1 and XN input
XP2 and XN input
CMRR=20log(VIN/VOUT)
BW = IHF-A,[*X…D,E]
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
MIXING
TREBLE
MIDDLE
BASS
VOLUME
MUTE
INPUT GAIN
BLOCK
Electrical Characteristics - continued
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Input gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Input gain 20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Minimum Input Gain
GIN_MIN
-2
0
+2
dB
Maximum Input Gain
GIN_MAX
18
20
22
dB
Gain Set Error
GIN_ERR
-2
0
+2
dB
Mute Attenuation *
GMUTE
－
-105
-85
dB
Maximum Gain
GV MAX
13
15
17
dB
Maximum Attenuation *
GV_MIN
－
-100
-85
dB
Attenuation Set Error １
GV_ERR1
-2
0
+2
dB
Attenuation Set Error ２
GV_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error ３
GV_ERR3
-4
0
+4
dB
ATT=-48DB to -79DB
Maximum Boost Gain
GB_BST
18
20
22
dB
Maximum Cut Gain
GB_CUT
-22
-20
-18
dB
Gain Set Error
GB_ERR
-2
0
+2
dB
Maximum Boost Gain
GM_BST
18
20
22
dB
Maximum Cut Gain
GM_CUT
-22
-20
-18
dB
Gain Set Error
GM_ERR
-2
0
+2
dB
Maximum Boost Gain
GT_BST
18
20
22
dB
Maximum Cut Gain
GT_CUT
-22
-20
-18
dB
Gain Set Error
GT_ERR
-2
0
+2
dB
Input Impedance
RIN_M
19
27
35
kΩ
Maximum Input Voltage
VIM_M
2.0
2.2
-
Vrms
Maximum Attenuation
GMX_MIN
-
-100
-85
dB
Maximum Gain
GMX_MAX
5
7
9
dB
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GAIN=+1dB to +20dB
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
Volume = 15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Volume = -∞dB
GV=20log(VOUT/VIN)
BW = IHF-A
GAIN & ATT=+15dB to
-15dB
Gain=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=100Hz
Gain=+20dB f=1kHz
VIN=100mVrms
GM=20log (VOUT/VIN)
Gain=-20dB f=1kHz
VIN=2Vrms
GM=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=1kHz
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
Gain=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=10kHz
VIM at THD+N(VOUT)=1％
BW=400Hz-30KHz
MIX=OFF
GMX=20log(VOUT/VIN)
BW=INF-A
ATT=+6dB
GMX=20log(VOUT/VIN)
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
BLOCK
Electrical Characteristics - continued
Limit
Parameter
FADER / SUBWOOFER
Unit
Conditions
Min
Typ
Max
GF_BST
13
15
17
dB
Maximum Attenuation *
GF_MIN
－
-100
-90
dB
Gain Set Error
GF_ERR
-2
0
+2
dB
Gain=+1dB to +15dB
Attenuation Set Error 1
GF_ERR1
-2
0
+2
dB
ATT=-1dB to -15dB
Attenuation Set Error 2
GF_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GF_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
Output Impedance
ROUT
-
－
50
Ω
VIN =100mVrms
Maximum Output Voltage
VOM
2
2.2
－
Vrms
Maximum Gain
GL_MAX
17
20
23
dB
Gain Set Error
GL_ERR
-2
0
+2
dB
Maximum Boost Gain
LOUDNESS
Symbol
Fader=15dB
VIN=100mVrms
GF=20log(VOUT/VIN)
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
THD+N=1％
BW=400Hz-30KHz
Gain 20dB
VIN=100mVrms
GL=20log(VOUT/VIN)
Gain=+1dB to +20dB
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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TSZ22111・15・001
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
20
10
0
0
2
4
6
8
10
10
1
100Hz
0.1
0.1
0.01
0.01
0.001
0.001
Gain (dB)
Bass Gain [dB]
100k
25
20
15
10
5
10
BASS GAIN : -20dB to +20dB
/1dB step
fO : 60Hz Q : 0.5
0
-5
-10
-15
-20
-25
10
100
1k
10k
100k
Frequency [Hz]
Figure 3. Gain vs Frequency
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1
Figure 2. Total Harmonic Distortion vs Output Voltage
Gain=0dB
100
1k
10k
Frequency (Hz)
0.1
Figure
2. Thd
vs Vo
Vout
(V)
Figure 1. Circuit Current (No Signal) vs Power Supply
Voltage
10
0.001
0.01
Output Voltage : VOUT [Vrms]
Power Supply
Voltage : VCC [V]
VCC[V]
5
4
3
2
1
0
-1
-2
-3
-4
-5
1
10kHz
1kHz
Figure 4. Bass Gain vs Frequency
Figure 4. Bass Gain vs Freq
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
Vout
30
10
VIN [Vrms]
40
THD+N (%)
Iq[mA]
Circuit Current (No
Signal) : IQ [mA]
50
Total Harmonic Distortion : THD+N [%]
Typical Performance Curves
BD37542FS
Typical Performance Curves – continued
25
20
15
10
5
fO : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
10
5
0
-5
-10
Gain [dB]
Gain [dB]
25
20
15
-15
-20
-25
10
100
1k
10k
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fo : 60Hz
0
-5
-10
-15
-20
-25
100k
10
Figure Frequency
5. Bass fo vs
Freq
[Hz]
Middle Gain [dB]
Gain [dB]
Gain[dB]
fO: 500Hz
Q : 0.75
100
1k
10k
100k
25
20
15
10
5
100k
fO : 500/1k/1.5k/2.5kHz
0
-5
-10
-15
-20
-25
MIDDLE GAIN:
±20dB
Q : 0.75
10
Frequency [Hz]
100
1k
10k
100k
Frequency [Hz]
Figure 7. Middle Gain vs Frequency
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10k
Figure 6. Bass Q vs Frequency
MIDDLE GAIN :
-20dB to +20dB /1dB step
10
1k
Frequency [Hz]
Figure 5. Bass fO vs Frequency
25
20
15
10
5
0
-5
-10
-15
-20
-25
100
Figure 8. Middle fo vs Frequency
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
25
25
20
15
10
5
0
-5
-10
-15
-20
-25
Q : 0.75/1/1.25/1.5
Gain (dB)
MIDDLE GAIN :
±20dB
fO : 500Hz
10
100
1k
10k
TREBLE GAIN :
-20dB to +20dB /1dB step
fO : 7.5kHz Q : 0.75
20
Trible Gain [dB]
Gain [dB]
Typical Performance Curves – continued
15
10
5
0
-5
-10
-15
-20
-25
10
100k
100
10k
100k
Frequency [Hz]
Frequency [Hz]
Frequency (Hz)
Figure 9. Middle Q vs Frequency
Figure 10. Treble Gain vs Frequency
25
25
fO : 7.5k/10k/12.5k/15kHz
20
15
Q : 0.75/1.25
TREBLE GAIN : ±20dB
fO : 7.5kHz
20
15
TREBLE GAIN : ±20dB
Q : 0.75
10
10
5
Gain[dB]
(dB)
Gain
Gain [dB]
1k
0
-5
5
0
-10
-5
-10
-15
-15
-20
-20
-25
-25
10
100
1k
10k
100k
10
Frequency (Hz)
1k
10k
100k
Frequency [Hz]
(Hz)
Figure 12.Frequency
Treble Q vs
Frequency
Figure 11. Treble fo vs Frequency
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TSZ22111・15・001
100
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Typical Performance Curves – continued
1000
Din-Audio
出力雑音電圧
[uVrms]
Output Noise [µVrms]
出力雑音電圧[uVrms]
Output
Noise [µVrms]
1000
IHF-A
100
10
DIN-Audio
100
10
1
1
-80 -70 -60 -50 -40 -30 -20 -10 0
Volume
Gain [dB]
Volume
Gain[dB]
10 20
-20 -15 -10 -5
5
10 15 20
Figure 14. Output Noise vs Bass Gain
1000
IHF-A
Output Noise [µVrms]
DIN-Audio
出力雑音電圧 [uVrms]
1000
Output Noise [µVrms]
0
Bass Gain
Gain [dB]
Bass
[dB]
Figure 13. Output Noise vs Volume Gain
出力雑音電圧 [uVrms]
IHF-A
100
10
DIN-Audio
IHF-A
100
10
1
1
-20 -15 -10 -5 0 5 10 15 20
TrebleGain
Gain[dB]
[dB]
Treble
-20 -15 -10 -5 0 5 10 15 20
Middle Gain
Gain [dB]
Middle
[dB]
Figure 15. Output Noise vs Middle Gain
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TSZ22111・15・001
Figure 16. Output Noise vs Treble Gain
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Typical Performance Curves – continued
2.5
0
Output Voltage : VOUT [Vrms]
最大出力[Vrms]
Output
Voltage : VOUT [Vrms]
Gain
(dB)
Gain [dB]
-10
-20
-30
-40
-50
-60
-70
2.0
1.5
1.0
0.5
0.0
10
100
1k
10k
100k
100
Frequency [Hz]
Frequency (Hz)
100000
Figure 18. Output Voltage vs RLOAD
Figure 17. CMRR vs Frequency
Figure 20. Advanced Switch 2
Figure 19. Advanced Switch 1
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TSZ22111・15・001
1000
10000
RLOAD [ohm]
出力負荷[ohm]
11/33
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Timing Chart
CONTROL SIGNAL SPECIFICATION
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
SDA
tBUF
tHD;STAT
tF
tR
tLOW
tSP
SCL
tHD;STA
P
tHD;DAT
tHIGH
tSU;DAT
tSU;STAT
tSU;STOT
Sr
S
P
Figure 21. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices (Ta=25°C, VCC=8.5V)
Fast-mode I2C-bus
Parameter
Symbol
Min
Max
400
1
SCL clock frequency
fSCL
0
2
Bus free time between a STOP and START condition
tBUF
1.3
－
Hold time (repeated) START condition. After this period, the first clock
3
tHD;STA
0.6
－
pulse is generated
4
LOW period of the SCL clock
tLOW
1.3
－
5
HIGH period of the SCL clock
tHIGH
0.6
－
6
Set-up time for a repeated START condition
tSU;STA
0.6
－
7
Data hold time:
tHD;DAT
0.06 (Note)
－
8
Data set-up time
tSU;DAT
120
－
9
Set-up time for STOP condition
tSU;STO
0.6
－
Unit
kHz
μS
μS
μS
μS
μS
μS
ns
μS
All values refer to VIH Min and VIL Max Levels (see Table 2).
(Note) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH Min of the SCL signal) in order to bridge the
undefined region of the falling edge of SCL.
For 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is full.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
10
11
12
13
14
Symbol
LOW level input voltage:
HIGH level input voltage:
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage: at 3mA sink current
Input current each I/O pin with an input voltage between 0.4V and 4.5V.
tHD;STA
ｔHD;STA
:2µs
：2us
tHD;DAT
ｔHD;DAT
：1us
:1µs
VIL
VIH
tSP
VOL1
II
Fast-mode devices
Min
Max
-0.3
+1
2.3
5
0
50
0
0.4
-10
+10
tSU;DAT
ｔSU;DAT
：1us
:1µs
Unit
V
V
ns
V
μA
tSU;STO
ｔSU;STO
：2us
:2µs
SCL
tBUF
ｔBUF
：4us
:4µs
ｔLOW
tLOW
：3us
:3µs
ｔHIGH
tHIGH
：1us
:1µs
SDA
SDA
SCL clock
frequency：250kHz
SCL clock
frequency
: 250kHz
Figure 22. A Command Timing Example in the I2C Data Transmission
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TSZ22111・15・001
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
(2) I2C BUS FORMAT
S
1bit
MSB
LSB
Slave Address
8bit
S
Slave Address
MSB
LSB
MSB
LSB
A
Select Address
A
Data
A
P
1bit
8bit
1bit
8bit
1bit 1bit
= Start condition (Recognition of start bit)
= Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select address corresponding to volume, bass or treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
A
Select Address
Data
P
(3) I2C BUS Interface Protocol
(a) Basic Format
S
Slave Address
MSB
LSB
A
Select Address
A
Data
A
MSB
LSB
MSB
LSB
P
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
Slave Address
A
Select Address
A
Data1
A
Data2
A ････
MSB
LSB
MSB
LSB
MSB
LSB
MSB
LSB
(Example) ①Data1 shall be set as data of address specified by Select Address.
②Data2 shall be set as data of address specified by Select Address +1.
③DataN shall be set as data of address specified by Select Address +N-1.
S
DataN
MSB
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
S Slave Address A
Select Address1 A Data
A Select Address 2 A Data
A
MSB
LSB MSB
LSB MSB LSB
MSB
LSB MSB LSB
A P
LSB
P
（Note）If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
(4) Slave Address
MSB
A6
1
A5
0
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A4
0
A3
0
A2
0
13/33
A1
0
A0
0
LSB
R/W
0
80H
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
(5) Select Address & Data
Select
Address
(hex)
Items
Initial setup 1
01
Initial setup 2
02
Initial setup 3
03
Input Selector
05
Input gain
06
Volume gain
Fader 1ch Front
Fader 2ch Front
Fader 1ch Rear
Fader 2ch Rear
Fader Subwoofer
Mixing
Bass setup
Middle setup
Treble setup
20
28
29
2A
2B
2C
30
41
44
47
Bass gain
51
Middle gain
54
Treble gain
57
Loudness Gain
System Reset
75
FE
Data
MSB
D7
Advanced
switch
ON/OFF
LPF
Phase
0
Full-diff
Type
Mute
ON/OFF
0
0
0
Bass
Boost/
Cut
Middle
Boost/
Cut
Treble
Boost/
Cut
0
1
D6
0
0
D5
D4
Advanced switch time
of Input Gain/Volume
Tone/Fader/Loudness
Mixing
Subwoofer Output
Select
0
LSB
D3
D2
0
1
0
D1
Advanced switch
time of Mute
Subwoofer LPF fC
0
0
0
0
Input selector
0
0
Input Gain
0
0
Volume Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Mixing Gain / Attenuation
Bass fO
0
Middle fO
0
Treble fO
0
0
0
0
1
0
0
0
0
Bass Gain
0
0
Middle Gain
0
0
Treble Gain
0
0
0
Bass Q
Middle Q
0
Treble Q
0
Loudness Hicut
0
0
D0
Loudness Gain
0
0
1
: Advanced switch
Note
1.
The Advance Switch works in the latch part while changing from one function to another.
2.
Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as
shown below.
→01→02→03→05→06→20→28→29→2A→2B→2C
→30→41→44→47→51→54→57→75
3.
Advanced switch is not used for the function of input selector, subwoofer output select, etc. Therefore, please apply
mute on the side when changing these settings.
4.
When using mute function of this IC at the time of changing input selector, please switch mute ON/OFF while
waiting for advanced-mute time.
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TSZ22111・15・001
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 01 (hex)
Time
MSB
D7
0.6msec
1.0msec
1.4msec
3.2msec
Advanced
Switch
ON/OFF
Time
MSB
D7
4.7 msec
7.1 msec
11.2 msec
14.4 msec
Advanced
Switch
ON/OFF
Mode
MSB
D7
OFF
0
ON
1
Advanced switch time of Mute
D6
D5
D4
D3
D2
D1
0
Advanced switch time
0
of Input gain/Volume
0
0
1
Tone/Fader/Loudness
1
Mixing
1
LSB
D0
0
1
0
1
Advanced switch time of Input
gain/Volume/Tone/Fader/
LSB
Loudness/Mixing
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
Advanced switch
0
0
1
Time of Mute
1
0
1
1
D6
0
Advanced switch ON/OFF
LSB
D5
D4
D3
D2
D1
D0
Advanced switch time
of Input gain/Volume
Advanced switch
0
1
Tone/Fader/Loudness
Time of Mute
Mixing
Select address 02(hex)
fc
MSB
D7
OFF
55Hz
85Hz
120Hz
160Hz
Prohibition
LPF
Phase
Mode
MSB
D7
LPF
Front
Rear
Prohibition
LPF
Phase
Phase
MSB
D7
0°
0
180°
1
Subwoofer LPF fc
D6
0
D6
0
D6
0
D5
D4
Subwoofer Output
Select
D3
0
D2
0
0
0
0
1
D1
0
0
1
1
0
Other setting
LSB
D0
0
1
0
1
0
Subwoofer Output Select
LSB
D5
D4
D3
D2
D1
D0
0
0
0
1
0
Subwoofer LPF fc
1
0
1
1
D5
LPF Phase
D4
D3
Subwoofer output
select
0
D2
D1
LSB
D0
Subwoofer LPF fc
: Initial condition
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 05(hex)
MSB
Input Selector
OUTF1 OUTF2
D7
D6
D5
D4
D3
D2
D1
A
A1
A2
0
0
0
0
B
B1
B2
0
0
0
0
C
C1
C2
0
0
0
1
D single
DP1
DP2
0
0
0
1
E1 single
EP1
EN1
0
1
0
1
FullE2 single
EN2
EP2
0
1
0
1
diff bias
0
0
type
A diff
A1
B1
0
1
1
1
select
C diff
B2
C2
1
0
0
0
D diff
DP1
DP2
0
0
1
1
E full diff
EP1
EP2
0
1
0
0
Input SHORT
0
1
0
0
Prohibition
Other setting
Input SHORT : The input impedance of each input terminal is lowered from 100kΩ(Typ) to 6 kΩ(Typ).
(For quick charge of coupling capacitor)
Mode
Mode
MSB
Negative Input
Bias
D7
0
1
D6
Full-diff Bias Type Select
D5
D4
D3
D2
D1
0
0
LSB
D0
0
1
0
1
0
1
1
0
0
0
1
LSB
D0
Input Selector
: Initial condition
EP1
Negative input type
10
1ch
1ch signal input
For Ground –isolation type.
EN1
1ch
Differential
11
EN2
12
EP2
2ch
2ch signal input
Bias type
13
EP1
1ch
For differential amplifier type
2ch
Differential
1ch signal input
10
EN1
1ch
Differential
11
EN2
12
2ch
2ch signal input
EP2
2ch
Differential
13
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 06 (hex)
Mode
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
MSB
D7
Mute
ON/OFF
D6
D5
0
0
Input Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
1
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
1
：
1
：
1
：
1
Mute ON/OFF
D4
D3
D2
D1
：
1
Prohibition
Mode
OFF
ON
MSB
D7
0
1
D6
D5
0
0
-∞dB
：
1
1
：
1
1
D0
Input Gain
Select address 20, 28, 29, 2A, 2B, 2C (hex)
MSB
Vol, Fader Gain
Gain & ATT
D7
D6
D5
D4
0
0
0
0
0
0
0
0
Prohibition
：
：
：
：
0
1
1
1
15dB
0
1
1
1
14dB
0
1
1
1
13dB
0
1
1
1
：
：
：
：
：
-77dB
1
1
0
0
-78dB
1
1
0
0
-79dB
1
1
0
0
1
1
0
1
Prohibition
LSB
：
1
1
：
1
1
/ Attenuation
D3
D2
D1
0
0
0
0
0
0
LSB
D0
0
1
：
0
0
0
0
：
0
0
0
0
：
0
0
1
1
：
0
1
0
1
：
1
1
1
0
：
1
1
1
0
：
0
1
1
0
：
1
0
1
0
：
1
1
：
1
1
：
1
1
：
0
1
: Initial condition
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 30(hex)
Gain & ATT
Prohibition
7dB
6dB
5dB
：
-77dB
-78dB
-79dB
Prohibition
MIX OFF
MSB
D7
0
0
D6
0
0
Mixing Gain / Attenuation
D5
D4
D3
D2
0
0
0
0
0
0
0
0
D1
0
0
LSB
D0
0
1
：
0
0
0
0
：
1
1
1
1
：
1
1
1
1
：
1
1
1
1
：
1
1
1
1
：
0
0
0
0
：
0
0
1
1
：
0
1
0
1
：
1
1
1
1
：
1
1
1
1
：
0
0
0
0
：
0
0
0
1
：
1
1
1
0
：
1
1
1
0
：
0
1
1
0
：
1
0
1
0
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
0
1
D7
D6
D5
Bass
D4
0
0
Select address 41(hex)
Q factor
0.5
1.0
1.5
2.0
fO
60Hz
80Hz
100Hz
120Hz
MSB
Bass fO
MSB
D7
D6
0
0
Q factor
D3
D2
D5
0
0
1
1
0
Bass
D4
0
1
0
1
fO
D3
0
0
LSB
D1
0
0
1
1
D0
0
1
0
1
LSB
D2
D1
D0
Bass
Q factor
0
Select address 44(hex)
Q factor
0.75
1.0
1.25
1.5
fO
500Hz
1kHz
1.5kHz
2.5kHz
D7
D6
Middle
D5
D4
0
0
Middle fO
MSB
MSB
D7
D6
0
0
D5
0
0
1
1
Q factor
D3
D2
0
Middle
fO
D4
D3
0
1
0
0
1
0
LSB
D1
0
0
1
1
D0
0
1
0
1
LSB
D2
0
D1
D0
Middle
Q factor
: Initial condition
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 47 (hex)
Q factor
0.75
1.25
fO
7.5kHz
10kHz
12.5kHz
15kHz
D7
D6
Treble
D5
D4
0
0
Treble fO
MSB
MSB
D7
D6
0
0
Select address 51, 54, 57 (hex)
MSB
Gain
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
Bass/
11dB
Middle/
12dB
Treble
Boost
13dB
/cut
14dB
15dB
16dB
17dB
18dB
19dB
20dB
D5
0
0
1
1
D6
D5
0
0
Prohibition
Mode
Boost
Cut
MSB
D7
0
1
Q factor
D3
D2
Treble
D4
0
1
0
1
0
fO
D3
0
Bass/Middle/Treble Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
：
：
1
1
1
1
LSB
D1
0
0
D2
D1
D0
0
0
Treble
Q factor
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
：
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
：
1
1
LSB
Bass/Middle/Treble Boost/Cut
D6
D5
D4
D3
D2
D1
0
0
D0
0
1
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
0
1
LSB
D0
Bass/Middle/Treble Gain
:Initial condition
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TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
BD37542FS
Select address 75 (hex)
MSB
D7
Mode
Hicut1
Hicut2
Hicut3
Hicut4
0
MSB
Gain
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
0
Prohibition
D6
0
0
1
1
D5
0
1
0
1
Loudness Hicut
D4
D3
D2
LSB
D0
Loudness Gain
Loudness Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
Loudness Hicut
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
：
：
1
1
D6
D1
D5
LSB
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
：
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
：
1
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
1
: Initial condition
(6) About Power ON Reset
Built-in IC initialization is made during power ON of the supply voltage. Please send initial data to all addresses at
supply voltage on. And please turn on mute until this initial data is sent.
Parameter
Rise Time of VCC
VCC Voltage of
Release Power ON
Reset
Symbol
Limit
Unit
Min
Typ
Max
tRISE
33
－
－
µsec
VPOR
－
4.1
－
V
Conditions
VCC rise time from 0V to 5V
(7) About External Compulsory Mute Terminal
It is possible to force mute externally by setting an input voltage to the MUTE terminal.
Mute Voltage Condition
Mode
GND to 1.0V
MUTE ON
2.3V to VCC
MUTE OFF
Establish the voltage of MUTE in the condition you want to set.
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Application Information
1.
Function and Specifications
Function
Specifications
・Stereo input
Input
selector
Input gain
Mute
Volume
・Single-End/Diff/Full-Diff
(Possible to set the number of single-end/diff/full-diff as follows )
Single-End
Differential
Full-Differential
Mode 1
0
3
1
Mode 2
1
2
1
Mode 3
3
1
1
Mode 4
4
0
1
Mode 5
5
1
0
Mode 6
6
0
0
Table.1 Combination of input selector
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Bass
・Q=0.5, 1, 1.5, 2
・fO=60, 80, 100, 120Hz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Middle
・Q=0.75, 1, 1.25, 1.5
・fO =500, 1k, 1.5k 2.5kHz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Treble
・Q=0.75, 1.25
・fO =7.5k, 10k, 12.5k, 15kHz
・Possible to use “Advanced switch” for prevention of switching noise.
Fader
Loudness
LPF
・+15dB to -79dB(1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・20dB to 0dB(1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
・fC=55/85/120Hz/160Hz, pass
・Phase shift (0°/180°)
・Monaural input
Mixing
・+7dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
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2.
Volume / Fader Volume / Mixing Attenuation Data
(dB)
D7
D6
D5
D4
D3
+15
0
1
1
1
0
+14
0
1
1
1
0
+13
0
1
1
1
0
+12
0
1
1
1
0
+11
0
1
1
1
0
+10
0
1
1
1
0
+9
0
1
1
1
0
+8
0
1
1
1
1
+7
0
1
1
1
1
+6
0
1
1
1
1
+5
0
1
1
1
1
+4
0
1
1
1
1
+3
0
1
1
1
1
+2
0
1
1
1
1
+1
0
1
1
1
1
0
1
0
0
0
0
-1
1
0
0
0
0
-2
1
0
0
0
0
-3
1
0
0
0
0
-4
1
0
0
0
0
-5
1
0
0
0
0
-6
1
0
0
0
0
-7
1
0
0
0
0
-8
1
0
0
0
1
-9
1
0
0
0
1
-10
1
0
0
0
1
-11
1
0
0
0
1
-12
1
0
0
0
1
-13
1
0
0
0
1
-14
1
0
0
0
1
-15
1
0
0
0
1
-16
1
0
0
1
0
-17
1
0
0
1
0
-18
1
0
0
1
0
-19
1
0
0
1
0
-20
1
0
0
1
0
-21
1
0
0
1
0
-22
1
0
0
1
0
-23
1
0
0
1
0
-24
1
0
0
1
1
-25
1
0
0
1
1
-26
1
0
0
1
1
-27
1
0
0
1
1
-28
1
0
0
1
1
-29
1
0
0
1
1
-30
1
0
0
1
1
-31
1
0
0
1
1
-32
1
0
1
0
0
Mixing Adjustable range is +7dB to -∞dB.
D2
D1
D0
(dB)
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
：Initial condition
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BD37542FS
3.
Application Circuit
FIL
GND
SDA
SCL
10μ
VCC
MUTE
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
0.1μ
10μ
10μ
10μ
10μ
10μ
10μ
10μ
TEST
28
27
26
25
24
Fader★
29
Fader★
30
Fader★
31
Fader★
32
23
22
21
20
19
18
17
15
16
VCC
VCC/2
GND
I2C BUS LOGIC
ATT★
Fader★
■Fader
Fader
Gain:+15dB
to -79dB/1dB stepstep
Gain:+15dB～-79ｄB/1dB
★no pop noise
■LPF
fc=55/85/120/160Hz
Loudness
■Loudness
Gain: 20dB to 0dB/1dB step
Gain:20dB～0ｄB/1ｄB
step
★no pop noise
■3 Band P-EQ (Tone control)
Gain:
+20dB to -20dB/1dB stepstep
Gain：+20dB～-20dB/1dB
★no pop noise
・Bass：f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain:
+15dB to -79dB/1dB stepstep
Gain：+15dB～-79dB/1dB
★no pop noise
■Input Gain
Gain:
+20dB to -0dB/1dB step
Gain：+20dB～0dB/1dB
step
★no pop noise
LPF
★Loudness
★3 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
GND
ISO amp
100k
1
100k
2
2.2μ
100k
3
2.2μ
Single1
GND Isolation2
100k
4
2.2μ
100k
5
2.2μ
Single2
100k
6
2.2μ
250k
7
2.2μ
Single3
GND Isolation3
(Note)
About single inputIsolation2,3に切換可能
1 to 3, it is possible to change from
※Single1～3はGND
single
input to
GND
Isolation
2,3.
（About
single
input
1～3, input
it is possible
to change from
single input to GND Isolation input 2,3.）
GND
ISO amp
250k
8
2.2μ
GND
ISO amp
250k
10
9
10μ
250k
2.2μ
GND Isolation1 or
Single4
GND
ISO amp
250k
11
2.2μ
250k
12
10μ
13
2.2μ
Full Differential or
Single5, Single6
250k
2.2μ
14
2.2μ
MIN
(Note)
GNDFull
Isolation1
and Full Differential, it is possible to change from
※GNDAbout
Isolation1,
DifferentialはSingle4～6に切換可能
differential input to single input 4 to 6.
（About GND Isolation1 and Full Differential, it is possible
to change from differential input to single input 4～6.）
Unit
R : [Ω]
C : [F]
Figure 23. BD37543FS
Notes on wiring
①Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
②GND lines shall be one-point connected.
③Wiring pattern of Digital shall be away from that of analog unit and crosstalk shall not be acceptable.
④If possible, SDA and SCL lines of I2C BUS shall not be parallel.
The lines shall be shielded, if they are adjacent to each other.
⑤If possible, analog input lines should not be parallel. The lines should be shielded, if they are adjacent to each other.
⑥About TEST pin (Pin 21), please leave it OPEN.
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Power Dissipation
About the thermal design of the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-A32
1.5
measurement Condition : ROHM Standard board
board Size : 70 x 70 x 1.6 (mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
Power Dissipation : Pd (W)
0.95W
1.0
θja = 131.6°C/W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature : Ta (°C)
Figure 24. Temperature Derating Curve
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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BD37542FS
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal Description
A terminal for signal input.
The input impedance is 100kΩ(typ).
VCC
1
A1
2
A2
3
B1
4
B2
5
C1
6
C2
4.25
100kΩ
GND
Input terminal available to
Single/Differential mode.
The input impedance is 250kΩ(Typ).
VCC
7
DP1
8
DN
9
DP2
10
EP1
11
EN1
12
EN2
13
EP2
4.25
250 kΩ
GND
The loudness characteristic setting
terminal.
VCC
15
LDA1
18
LDA2
4.25
1.65V
GND
The loudness characteristic setting
terminal.
VCC
16
LDB1
17
LDB2
4.25
GND
A terminal for external compulsory
mute. If terminal voltage is High level, the
mute is OFF. And if the terminal voltage is
Low level, the mute is on.
VCC
0.58×VCC
250kΩ
19
MUTE
－
1.65V
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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I/O Equivalent Circuits – continued
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal Description
VCC
22
A terminal for fader and Subwoofer output.
OUTS2
23
OUTS1
24
OUTR2
25
OUTR1
26
OUTF2
27
OUTF1
28
VCC
4.25
GND
Power supply terminal.
8.5
A terminal for clock input of I2C BUS
communication.
VCC
29
SCL
－
1.65V
GND
A terminal for data input of I2C BUS
communication.
VCC
30
SDA
－
1.65V
GND
Ground terminal.
31
GND
0
1/2 VCC terminal.
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
VCC
50k
32
FIL
4.25
50k
GND
VCC
14
MIN
A terminal for signal input.
The input impedance is 27kΩ (Typ).
4.25
27KΩ
GND
21
TEST
-
TEST terminal
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 25. Example of monolithic IC structure
13. About Signal Input
(a) About Input Coupling Capacitor Constant Value
The constant value of input coupling capacitor C(F) is decided with respect to the input impedance R IN(Ω) at
the input signal terminal of the IC. The first HPF characteristic of RC is composed.
G〔dB〕
C〔F〕
0
RIN
〔Ω〕
A(f)
ＳＳＨ
f〔Hz〕
INPUT
A f  
2 fCRIN 2
2
1  2 fCRIN 
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
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Operational Notes – continued
14. About Mute Terminal (Pin 19) when Power Supply is OFF
There should be no applied voltage across the Mute terminal (Pin 19) when power-supply is OFF.
If in case voltage is supplied to mute terminal, please insert a series resistor (about 2.2kΩ) to Mute terminal.
(Please refer to Application Circuit Diagram.)
15. About TEST Pin
TEST Pin should be left as OPEN.
Pin 21 is TEST Pin.
16. About MIX
(1)
About Specification of Fader -∞ at MIX ON.
Mix_signal is added to Main_signal after Fader_Gain(+15dB to -79dB) like the figure. When Fader is set at -∞,
the signal after a MIX signal is added is done with MUTE because the -∞ circuit of Fader is in the step after
the addition circuit.
+15dB to -79dB
+7dB to -79dB
Figure 26. About Front Fader and MIX
(2)
About Advanced Switching of MIX_Gain/ATT
When advanced switching of MIX_Gain/ATT works, MIX goes a switching movement that it passes through the
state of MIX_OFF like in B figure below (from current settingof MIX_Gain/ATT to MIX_OFF to a target setting of
MIX_Gain/ATT).
A
Fader_Gain/ATT 0dB to -6dB
advanced switching
B
MIX_Gain/ATT 0dB to -6dB
advanced switching
Figure 27. Advanced Switching Movement when MIX_Gain/ATT is Changed
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BD37542FS
Operational Notes – continued
17. About the External Parts Setting of Loudness Circuit
This IC is equipped with a Loudness circuit.
The Loudness gain is fixed inside the IC but its frequency characteristic can be changed freely by adjusting the
external part filter. The circuit composition of the Loudness part is shown below. Incidentally, when not using the
Loudness circuit, please short the pins between LDA1(Pin 15) and LDB1(Pin 16), and between LDA2(Pin 18) and
LDB2(Pin 17), so as to avoid the inner amplifier inputs to become floating.
Loudness
LDA1
LDB1
15
LDB2
16
56k
R2
17
18
56k
R1
1000p
4.7k
R1
1000p
C1
R3
LDA2
C1
4.7k
4.7k
0.047μ
R2
4.7k
R3
0.047μ
C2
C2
Figure 28. About the External Parts Setting of Loudness Circuit
The Loudness frequency characteristics are decided according to Figure 28. G_LOUD can be made 20dB when
external parts used are the same with Figure 28 (the recommended value). G_LOUD is the amount of effect of
Loudness when Loudness Gain is set at 20dB (P.20).
When Loudness frequency characteristics are changed, each parameter (Gain, Frequency) shown in Figure 28 can
be decided using the following approximate equation below.
(Note) Design fc2 value more than one digit bigger than fc1 to get effect on Loudness.
Loudness cut-off frequency
fc1 
1
2πC 2 R1  R 3 
Hz
fc2 
1
2πC1 R 2  R 3 
Hz
Loudness Gain (The amount of effect of Loudness)
 R3 

G_LOUD  20 log 
 R1  R3 
dB


R3

G_HICUT  20 log 
R
//
R

R
3 
 1 2
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BD37542FS
Ordering Information
B
D
3
7
5
Part Number
4
2
F
S
Package
FS: SSOP-A32
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A32 (TOP VIEW)
Part Number Marking
BD37542FS
LOT Number
1PIN MARK
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BD37542FS
Physical Dimension, Tape and Reel Information
Package Name
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SSOP-A32
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BD37542FS
Revision History
Date
Revision
16.Dec.2015
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001