Datasheet Download

Small-sized Class-D Speaker Amplifiers
Analog Input
Monaural Class-D Speaker Amplifier
No.10101EAT05
BD5465GUL
●Description
BD5465GUL is a monaural Class-D speaker amplifier that contained ALC function for mobile phone, portable type electronic
devices etc. LC filter of speaker output is not needed, can form monaural speaker amplifier with 3 external parts. ALC, short
for Automatic Level Control, is a function that automatically adjusts up to the level of suppression of distortion (clip) of
output wave form during excessive input. The output limit level uses a control type which doesn’t follow up power supply.
The time until the limit release operation of output level is called the release time (or recovery time). This IC adopts release
time (560ms/1dB Typ.) and suits the applications which play music.
Through Class-D operation, efficiency is high low power consumption that is why it’s suitable for battery drive application.
The current consumption during shutdown when lowered to 0.01μA(Typ.), from the shutdown to the operation time is early
and at the same time pop sound is few that is why it’s also suitable in repeating active and shutdown.
●Feature
1) Contains Digital ALC (Automatic Level Control) Function
2) External Parts: 3 points
3) Ultra slim type package: 9pin WL-CSP (1.8×1.8×0.55mmMax.)
4) BD5460 / 61GUL (No ALC Function, Gain Fixed Goods) Pin Compatible Specs
BD5466 / 67 / 68GUL (ALC Function, Gain Fixed Goods) Pin Compatible Specs
5) Maximum Gain: 12 dB (Typ.) [during ALC operation, +12~-3dB@1dB Step]
6) ALC limit level control type : Fixed type doesn’t follow up power supply
7) Limit output power: 0.6W (Typ.) [VDD=3.4~5.5V, RL=8Ω]
8) ALC release (recovery) time: 560ms/1dB (Typ.)
9) Audio Analog Input (corresponds to single-end input / differential input)
10 Output LC filter free
11) Pop noise suppression circuit
12) Shutdown Function (use as mute at the same time) [low shutdown current = 0.01μA (Typ.)]
13) Contains protection circuit: output short, thermal shutdown, under voltage lockout (UVLO)
●Applications
Mobile phone, Portable audio device, PND, DSC, Note-PC etc.
●Absolute Maximum Rating(Ta=+25℃)
Parameter
Power Supply Voltage
Power Dissipation
Storage Temperature Range
SDNB Pin Input Range
IN+, IN- Pin Input Range
*
Symbol
Ratings
Unit
VDDmax / PVDDmax
7.0
V
Pd
690*
mW
Tstg
-55 ~ +150
℃
VSDNB
-0.3~VDD+0.3
V
VIN
-0.3~VDD+0.3
V
Ranges
Unit
Topr
-40 ~ +85
℃
VDD / PVDD
+2.5 ~ +5.5
V
In case Ta=+25℃ or more, 5.52 mW decrease per 1℃
When mounting Rohm Typical Board 50.0mm×58.0mm (Material: Glass Epoxy)
●Operation Range
Parameter
Temperature
Power Supply Voltage
Symbol
ALC operating Power Supply Voltage
VDDALC / PVDDALC
+3.4 ~ +5.5
V
Common Mode Input Voltage Range
VIC
+0.5 ~ VDD-0.8
V
◎ This product is not designed for protection against radioactive rays.
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© 2010 ROHM Co., Ltd. All rights reserved.
1/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Electrical Characteristic (Ta=+25℃, VDD=+3.6V, Unless specified otherwise)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
<All Device>
IC Active, No Load
VSDNB =VDD
IC Shutdown
VSDNB =GND
Circuit current (no signal)
ICC
―
3.3
6.6
mA
Circuit current (shutdown)
ISDN
―
0.01
2
μA
PO
0.4
0.6
―
W
Total harmonic distortion
THD+N
―
0.2
1
%
Maximum Gain
GMAX
11
12
13
dB
ALC Limit level
VLIM
+6
+7
+8
dBV
BTL, *1, *2
ALC Release level
VREL
+4
+5
+6
dBV
BTL, *1, *2
Switching frequency
fOSC
150
250
350
kHz
Start-up time
TON
0.73
1.02
1.71
msec
Ri
40
60
80
kΩ
Gain=12dB
H
VSDNBH
1.4
―
VDD
V
IC Active
L
VSDNBL
0
―
0.4
V
IC Shutdown
H
ISDBNH
12
24
36
μA
VSDNB =3.6V
L
ISDNBL
-5
―
5
μA
VSDNB =0V
<Audio Feature>
Limit output power
Audio input resistance
BTL, f=1kHz, RL=8Ω
THD+N≦1% , *1, *2
BTL, fin=1kHz, RL=8Ω
PO =0.4W, *1
BTL, *1
<Control Terminal>
SDNB terminal
Threshold voltage
SDNB terminal
Inflow Current
*1 Filter bandwidth for measurement: 400~30kHz, LC filter for AC measurement: L=22μH / C=1μF, BTL: Voltage between A3,C3
*2 The reference value when the device and each component is directly mounted to the Rohm typical board.
■Shutdown control
Control terminal
Conditions
SDNB
H
IC operation (active)
L
IC stop (shutdown)
■ALC Parameter
ALC Parameter
Attack Time
(Typ.)
~1ms/1dB @ fin=100Hz
~0.5ms/1dB @ fin=1kHz
~0.05ms/1dB @ fin=10kHz
Release Time(Typ.)
Gain Switch Step (Typ.)
560ms/1dB
@ fin=100~10kHz
±1dB
The ALC automatically adjusts the audio output level, and a function that prevents the over output to the speaker. When
ALC function is working, gain switches at zero-cross point of audio output normally. If the time that audio output reaches to
zero-cross point is long, gain switches at about 1msec later (attack time), at about 25msec later (release time). So, attack
time and release time will change at audio input frequency. ALC parameter is fixed. ALC operation doesn’t correspond to
noise of impulse.
Also, ALC limit level is independent type from power supply voltage (fixed type). When power supply voltage goes down
during ALC operation, there will be a risk of generating distortion at the speaker output wave.
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© 2010 ROHM Co., Ltd. All rights reserved.
2/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Measurement Circuit Diagram
<Audio Characteristics Method of Evaluation >
■In case LC filter is not used
+Battery
C3
10uF
B1
VDD
B2
PVDD
SDNB
Shutdown Signal
Shutdown
Control
C2
150 k
(Typ.)
H : IC Active
L : IC Shutdown
BIAS
OSC
ALC
0.1uF
IN +
A1
Ri
OUT +
Rf
C3
C2
HBridge
PWM
0.1uF
OUT -
IN C1
A3
Ri
C1
Rf
BTL
A2
GND
B3
Measument Instrument
PGND
LPF
AP AUX- 0025
Audio
Precision
(AP)
■In case LC filter is used
+Battery
C3
10uF
B1
VDD
Shutdown Signal
SDNB
Shutdown
Control
C2
150k
(Typ.)
H: IC Active
L : IC Shutdown
B2
PVDD
BIAS
OSC
ALC
0. 1uF
IN +
A1
Ri
22uH
Rf
C3
C2
PWM
0. 1uF
1 uF
HBridge
1uF
IN C1
C1
A3
Ri
Rf
22uH
BTL
GND
A2
B3
PGND
Audio Precision
(AP )
Audio characteristics can be measured to insert LC filter between output pin and speaker load, if you don’t have a
measurement equipment for switching amplifier, like AUX-0025, Audio Precision.
Arrange the LC filter directly close to output pin.
In case of L=22μH, C=1μF, cut off frequency becomes:
1
1
fc 

 34kHz
2 LC 2 22 H  1F
For Inductor L, please use huge current type.
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© 2010 ROHM Co., Ltd. All rights reserved.
(Reference)TDK: SLF12575T-220M4R0
3/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●External Dimension Diagram
Top View
Bottom View
5465
Lot No.
(Unit : mm)
9pin WL-CSP(VCSP50L1)
[ 1.8×1.8×0.55mm Max, 0.5mm Pitch ]
Side View
●Block Diagram
●Pin Arrangement (Bottom View)
VDD
SDNB
B1
Shutdown
Control
C2
VDD
B2
PVDD
BIAS
OSC
Index Post
ALC
IN+
Ri
A1
OUT+
Rf
C3
PWM
IN-
HBridge
C1
C2
C3
IN-
SDNB
OUT+
B1
B2
B3
VDD
PVDD
PGND
A1
A2
A3
IN+
GND
OUT-
OUT-
C1
A3
Ri
Rf
GND A 2
B3 PGND
●Pin Explanation
Pin No.
Pin Name
A1
IN+
A2
GND
A3
OUT-
Class-D BTL output - terminal
B1
VDD
VDD terminal (signal)
B2
PVDD
VDD terminal (power)
B3
PGND
GND terminal (power)
C1
IN-
C2
SDNB
Shutdown control terminal
C3
OUT+
Class-D BTL output + terminal
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© 2010 ROHM Co., Ltd. All rights reserved.
Explanation
Audio differential input + terminal
GND terminal (signal)
Audio differential input - terminal
4/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Application circuit example
SHORT the power supply pin VDD (B1), PVDD (B2) at board pattern, then use singleness power supply.
Singleness power supply
(+2.5~+5.5V)
+Battery
C3
10 uF
Signal VDD
B1
VDD
B2
PVDD
Power VDD
Shutdown Control
Shutdown Signal
SDNB
Shutdown
Control
C2
150k
(Typ.)
H: IC Active
L: IC Shutdown
BIAS
OSC
Class-D BTL Output
ALC
Audio
Input+
0 .1 uF
IN+
A1
Ri
OUT +
Rf
C3
HBridge
PWM
Audio
Input-
0 .1 uF
IN-
OUT -
C1
A3
Ri
Rf
Signal GND
Audio Differential Input
A2
GND
B3
Power GND
PGND
Fig1. Differential Input(With Input Coupling Capacitor)
Singleness power supply(+2.5~+5.5V)
+Battery
C3
10 uF
Power VDD
Signal VDD
Shutdown Control
Shutdown Signal
B1
VDD
SDNB
Shutdown
Control
C2
H: IC Active
L: IC Shutdown
B2
150k
(Typ.)
PVDD
BIAS
OSC
Class-D BTL Output
ALC
IN+
Audio
Input +
A1
Ri
OUT +
Rf
C3
HBridge
PWM
Audio
Input -
Audio Differential Input
IN-
OUT -
C1
A3
Ri
Rf
Signal GND
GND
A2
B3
PGND
Power GND
Fig2. Differential Input(Without Input Coupling Capacitor)
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© 2010 ROHM Co., Ltd. All rights reserved.
5/19
2010.09 - Rev.A
Technical Note
BD5465GUL
Singleness power supply (+2.5~+5.5V)
+Battery
C3
10uF
Signal VDD
Shutdown Signal
B1
VDD
Shutdown Control
SDNB
Shutdown
Control
C2
150k
(Typ.)
H: IC Active
L: IC Shutdown
B2
PVDD
Power VDD
BIAS
OSC
Audio Single End Input
Audio
Class-D BTL Output
ALC
IN +
0.1uF
A1
Input
Ri
OUT +
Rf
C3
PWM
0.1uF
HBridge
IN -
OUT -
C1
A3
Ri
Rf
GND
A2
B3
PGND
Power GND
Signal GND
Fig3. Single end input (during IN+ input)
+Battery
Singleness power supply (+2.5~+5.5V)
C3
10uF
Signal VDD
VDD
Shutdown Control
Shutdown Signal
SDNB
B2 PVDD
Shutdown
Control
C2
150k
(Typ.)
H: IC Active
L: IC Shutdown
B1
Power VDD
BIAS
OSC
Class-D BTL Output
ALC
0.1uF
IN+
A1
Ri
OUT+
Rf
C3
PWM
Audio
Input
0.1uF
H Bridge
OUT-
INC1
Audio Single End Input
A3
Ri
Rf
Signal GND
GND A2
B3
PGND
Power GND
Fig4. Single end input (during IN- Input)
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© 2010 ROHM Co., Ltd. All rights reserved.
6/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●About the difference of differential input and single end input
・BD5465GUL uses full differential amplifier.
BD5465GUL is a Class-D amplifier, but, in relation to Audio Input and Output, is same with the conventional Class-AB
amplifier. For simplicity purposes of the diagram, the Class-D amplifier output stage is omitted in the following
explanation.
About the resistor, signal
on the diagram
Gives meaning to changes of gain setting by means of ALC Control.
1) Differential Input
Opposite
phase
Audio
Input
0V
IN+
A1
OUTA3
(IN+ - IN- )
Audio
Input
(OUT+ - OUT- )
0V
C1
C3
IN-
OUT+
Opposite
phase
2) Single end input (during IN+input )
Audio
Input
0V
Opposite
phase
IN+
OUT-
A1
A3
Same p
hase
(IN+ - IN- )
0V
ー
(OUT+ - OUT- )
C1
C3
IN-
ー
OUT+
IN+
ー
OUT-
3) Single end input (during IN-input )
0V
ー
A1
A3
(IN+ - IN- )
e
e phas
Opposit
Audio
Input
(OUT+ - OUT- )
0V
C1
C3
INOpposite
phase
OUT+
○About single end input
・Input is possible whether IN+ or IN- Pin.
Don’t make input pin open, through the input coupling capacitor, please connect to GND as seen on the example above.
Audio input pin should make “mute” condition, not “open” condition when you don’t input any signal.
・During single end input IN+ and IN-, there is a difference with the phase relation of input and output.
Because of differential amplifier, if input (IN+ - IN-), output(OUT+ - OUT-), the audio input and output phase relation
will become:
Phase
Audio Input ⇒ output (OUT+ - OUT-)
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© 2010 ROHM Co., Ltd. All rights reserved.
IN+ Input
IN- Input
Same phase
Opposite phase
7/19
2010.09 - Rev.A
Technical Note
BD5465GUL
○Gain calculation
【Differential Input】
【single end input】
+Battery
+Battery
Cs
Cs
VDD
Shutdown Signal
B1
VDD
B2 PVDD
Shutdown Signal
SDNB
Shutdown
Control
C2
150k
(Typ.)
H: IC Active
L: IC Shutdown
SDNB
Shutdown
Control
C2
BIAS
150k
(Typ.)
H: IC Active
L: IC Shutdown
B1
ALC
ALC
IN+
A1
Vins
Vins
Ci
Ri
IN+
A1
C3
Vins
PWM
HBridge
Ci
0.1uF
OUT-
INC1
OUT+
Rf
C3
PWM
HBridge
OUT-
INC1
Ci
Rf
GND A2
Ri
VIN
(=Vins)
A3
Ri
Ci
< Audio Source > 0.1uF
OUT+
Rf
VIN
(=2Vins)
0. 1uF
BIAS
OSC
OSC
< Audio Source> 0.1uF
B2 PVDD
A3
Ri
Rf
GND A2
B 3 PGND
B 3 PGND
When Input Level is calculated at IC typical and audio source typical, when input coupling capacitor (Ci) value is large
enough,every gain during the differential input and single end input will become:
Typical Input Level
Differential Output
IC
Audio Source
1.
Single End Output
Formula①
Formula②
Formula①
IC reference(Difference Input, Single End Input): Formula ①
VIN means the Input Voltage between IC Input Pin (IN+, IN-), VOUT means the output voltage between IC Output Pin
( OUT+, OUT- ). During differential input and single end input, the gain calculation formula at IC reference which
includes ALC operation is written below:
Gain = 20×log | VOUT/VIN | =+12~-3 (Typ.) [dB] ・・・ Formula①
2.
Audio Source reference(Differential Input) : Formula ②
When the input level of audio source is Vins, the relation with the input voltage VIN between IC input pin is written
below:
Vins = VIN / 2
During differential input, at audio source referece that includes ALC operation, gain calculation formula will become :
Gain = 20×log | VOUT / Vins | = 20×log | 2×VOUT / VIN | = +18~+3 (Typ.) [dB] ・・・Formula②
3.
Audio Source reference (Single End Input) : Formula ①
When the Input level of audio source is Vins, the relation with input voltage VIN between IC input pin (IN+,IN-)
becomes:
Vins = VIN
During single end input, at the audio source that includes ALC operation, gain calculation formula becomes:
Gain = 20×log | VOUT / Vins | = 20×log | VOUT / VIN | = +12~-3 (Typ.) [dB] ・・・ Formula①
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© 2010 ROHM Co., Ltd. All rights reserved.
8/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Audio Input Pin External LPF connection example
■External LPF connection example
st
The connection example of 1 -order LPF which is formed at Resistor RLPF and Capacitor CLPF , to the Audio Input Pin
IN+/- (A1, C1 Pin) is shown below. The cut frequency of input LPF, together with the single end input and differential input
is written below:
fcLPF = 1 / (2×π×RLPF×CLPF) [Hz]
Ex)
1)
fcLPF=10kHz ⇒ CLPF =0.01μF, RLPF=1.59kΩ
During single end input
When LPF is connected to audio input pin at single end input setting, at start-up characteristics of audio input pin IN+/-,
during start-up with unbalance (power supply ON/OFF, or shutdown ON/OFF), there is a risk that POP sound will occur
so please be careful.
When no audio input, and in order to prevent output noise, please make previous IC “mute” condition, not “open”
condition. Please refer at the same time to POP Sound countermeasure example.
+Battery
Cs
VDD B1 B2 PVDD
Shutdown Signal
H: IC Active
L: IC Shutdown
SDNB
Shutdown
Control
C2
BIAS
150k
(Typ.)
ALC
OSC
Input Impedance
Front IC
Ro
RLPF
IN+
A1
Ci
Ri
C3
CLPF
RLPF
Ci
OUT+
Rf
PWM
INC1
Pop sound countermeasure →
Rf
Ri
CLPF
HBridge
Speaker
A3
OUT-
GND A2 B3 PGND
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© 2010 ROHM Co., Ltd. All rights reserved.
9/19
2010.09 - Rev.A
Technical Note
BD5465GUL
2)
Differential Input
+Battery
Cs
VDD B1 B2 PVDD
Shutdown Signal
H: IC Active
L: IC Shutdown
SDNB
Shutdown
Control
C2
BIAS
150k
(Typ.)
ALC
Input Impedance
Front IC
Ro
OSC
LPF
Ci
RLPF
IN+
Ri
OUT +
Rf
A1
C3
CLPF
Ro
PWM
Ci
RLPF
INC1
CLPF
Ri
HBridge
A3
Rf
GND A2 B3
Speaker
PGND
OUT -
■Caution during External LPF Setting
External LPF Resistor RLPF which is composed of IC input resistor Ri, forms input impedance.
The bigger the resistor value of LPF resistor RLPF, the more it will decrease the gain.
When the input capacitor Ci has enough large capacity value, the relation among external LPF resistor RLPF and
IC input resistor Ri and Gain will become:
Gain = 20×log | Rf / (Ri + RLPF ) |
[dB]
Input resistor Ri of BD5465GUL and resistor value of feedback resistor Rf will become the following below,
during ALC operation, changes at ±1dB step, and becomes 16 stages switch specs.
#1. Ri=60kΩ(Typ.), Rf=240kΩ(Typ.)@Gain=12dB
#2. Ri=66kΩ(Typ.), Rf=234kΩ(Typ.)@Gain=11dB
#3. Ri=72kΩ(Typ.), Rf=228kΩ(Typ.)@Gain=10dB
↓
#15. Ri=167kΩ(Typ.), Rf=133kΩ(Typ.)@Gain=-2dB
#16. Ri=176kΩ(Typ.), Rf=124kΩ(Typ.)@Gain=-3dB
Also with the driver ability of previous IC step, after checking, constant setting of external LPF and Resistor RLPF.
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© 2010 ROHM Co., Ltd. All rights reserved.
10/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Evaluation Board Circuit Diagram
Connect to GND
Connect to Power Supply
(VDD=+2.5~5.5V)
VDD
C3
10uF
VDD
VDD B1
B2
PVDD
SDNB
Shutdown Signal
Shutdown
Control
C2
H: IC Active
BIAS
150k
(Typ.)
L: IC Shutdown
OSC
Audio Input
ALC
Audio
Input+
IN+
0.1uF
Ri
OUT+
Rf
A1
C3
C2
Differential
Input
PWM
Audio
Input-
0.1uF
HBridge
OUT-
INC1
Ri
B D5 4 6 5 GU L
A3
Rf
C1
GND A2
Connect to input signal
B3 PGND
GND
Connect to Speaker
* Power Supply terminals VDD(B1), PVDD(B2) are SHORT in the board pattern and use a single power.
●Evaluation Board Parts List
Qty.
Item
Description
SMD Size
Manufacturer/
Part Number
2
C1, C2
Capacitor, 0.1μF
0603
Murata
GRM188R71C104KA01D
1
C3
Capacitor, 10μF
A (3216)
ROHM
TCFGA1A106M8R
1
S1
Slide Switch
4mm X 10.2mm
NKK
SS-12SDP2
1
U1
IC, BD5465GUL,
Mono Class-D Audio Amplifier
1.8mm X 1.8mm
WLCSP Package
ROHM
BD5465GUL
1
PCB1
Printed-Circuit Board,
BD5465GUL EVM
―
―
●About the external part
①Input coupling capacitor (C1, C2)
Input coupling capacitor is 0.1μF.
Input impedance during maximum gain 12dB is 60kΩ (Typ.). A high-pass filter is composed by the input coupling
capacitor and the input impedance.
Cut-off frequency “fc” by the formula below, through input coupling capacitor C1(=C2) and input impedance Ri.
1
fc 
ٛHz
2  Ri  C1
In case of Ri=60kΩ, C1(=C2)=0.1μF, cut-off frequency is about 26.5Hz
②Power Supply Decoupling Capacitor (C3)
Power Supply Decoupling Capacitor is 10uF. When the capacity value of Power Supply Decoupling Capacitor is
made small, it will have an influence to the audio characteristics. When making it small, be careful with the audio
characteristics at actual application. ESR (equivalent series resistor) is low enough; please use capacitor with
capacity value of 1μF or more.
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© 2010 ROHM Co., Ltd. All rights reserved.
11/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Evaluation Board PCB Layer
TOP Layer Silk Pattern
B D5 4 6 5 GU L
TOP Layer
Bottom Layer
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© 2010 ROHM Co., Ltd. All rights reserved.
12/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●About IC Thermal Design
The IC Characteristics has a big relation with the temperature that will be used, to exceed the maximum tolerance junction
temperature, can deteriorate and destroy it. Instant destruction and long-time operation, from these 2 standpoints, there is a
need to be careful with regards to IC thermal. Please be careful with the next points.
The absolute maximum rating of IC shows the maximum junction temperature (TjMAX.) or the operation temperature range
(Topr), so refer to this value, use Pd-Ta characteristics (Thermal reduction ratio curve). If input signal is excessive at a state
where heat radiation is not sufficient, there will be TSD(Thermal Shutdown)
For TSD, the chip temperature operates at around 180℃, releases if it’s around 120℃ or less. Since the aim is to prevent
damage on the chip, please be careful because the long use time at the vicinity where TSD operates can deteriorate the
dependency of the IC.
Thermal Reduction Ratio Curve
Reference Data
VCSP50L1
2.0
Measurement Condition : ROHM Typical Board Mount
Board Size : 50mmx58mm
Power Dissipation Pd(W)
1.5
1.0
0.69W
θja =
181.8℃/W
0.5
0.0
0
25
50
75
85
100
125
150
Perimeter Temperature Ta(℃)
Note : This value is the real measurement, but not the guaranteed value.
The value of power dissipation changes based on the board that will be mounted.
The power dissipation of main IC during the heat dissipation design of many mounted boards, will become bigger than
the value of the above graph.
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13/19
2010.09 - Rev.A
Technical Note
BD5465GUL
Evaluation data - Typical Characteristics (1/4)
●Evaluation data – Typical characteristics (1/4)
Efficiency - Output power
f=1kHz, RL=4Ω+33uH
Efficiency - Output power
f=1kHz, RL=8Ω+33uH
90
90
80
80
VDD = 5.0V
VDD = 3.6V
60
70
VDD = 2.5V
Efficiency [%]
Efficiency [%]
70
50
40
VDD=2.5V
30
VDD=3.6V
20
VDD = 3.6V
60
50
40
VDD=2.5V
VDD=3.6V
VDD=5.0V
30
20
VDD=5.0V
10
10
0
0
0.1
0.2
0.3
0.4
Po [W]
0.5
0.6
0.7
0
0.8
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Po [W]
Fig.5
Figure.1
400
VDD = 5.0V
350
300
100
Icc [mA]
VDD = 3.6V
150
1.1 1.2 1.3
Supply Current vs Output power
f=1kHz, RL=4Ω+33uH
450
VDD = 5.0V
200
1
Fig.6
Figure.2
Supply Current vs Output power
f=1kHz, RL=8Ω+33uH
250
Icc [mA]
VDD = 5.0V
VDD = 2.5V
VDD = 2.5V
VDD=2.5V
200
VDD = 2.5V
150
VDD=3.6V
50
VDD = 3.6V
250
VDD=2.5V
VDD=3.6V
VDD=5.0V
100
VDD=5.0V
50
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
0.8
0
Output Power [W]
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Output Power [W]
Fig.7
Figure.3
1
1.1 1.2 1.3
Figure.4
Fig.8
Power dissipation vs Output power
f=1kHz, RL=8Ω+33uH
Power dissipation vs Output power
f=1kHz, RL=4Ω+33uH
0.40
0.15
0.35
0.30
VDD = 5.0V
VDD = 5.0V
0.1
0.25
Pd [W]
Pd [W]
VDD = 3.6V
VDD = 2.5V
VDD=2.5V
VDD=3.6V
VDD=5.0V
0.05
VDD = 3.6V
0.20
VDD = 2.5V
0.15
VDD=2.5V
VDD=3.6V
0.10
VDD=5.0V
0.05
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00
0.8
0
Output Power [W]
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Output Power [W]
1
Figure.5
Fig.9
Figure.6
Fig.10
Supply Current vs Power Supply
RL=No load, No signal
Shutdown Current vs Power Supply
RL=No load, No signal
6.0
5.0
1.1 1.2 1.3
4.5
5.0
4.0
3.5
ISDN [μA]
ICC [mA]
4.0
3.0
2.0
3.0
2.5
2.0
1.5
1.0
1.0
0.5
0.0
0
1
2
3
VDD [V]
4
5
0.0
6
0
Figure.7
Fig.11
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© 2010 ROHM Co., Ltd. All rights reserved.
1
2
3
VDD [V]
4
5
6
Figure.8
Fig.12
14/19
2010.09 - Rev.A
Technical Note
BD5465GUL
Evaluation
data - characteristics
Typical Characteristics
(2/4)
●Evaluation
data – Typical
(2/4)
Output power vs Load Resistance
THD+N=1%, f=1kHz, 400Hz-30kHz BPF
2.0
Output Power vs Power Supply
RL=8Ω, f=1kHz, 400Hz-30kHz BPF
0.8
VDD=2.5V
VDD=3.6V
VDD=5.0V
1.8
1.6
0.7
Output Power [W]
Output Power [W]
1.4
1.2
1.0
VDD = 5.0V
0.8
VDD = 3.6V
0.6
VDD = 2.5V
0.6
0.5
0.4
0.3
0.2
0.4
THD+N≦1%
0.1
0.2
0.0
0.0
4
8
12
16
20
24
28
32
2.5
3.0
3.5
4.0
VDD[V]
RL[Ω]
Fig.13
Figure.9
100
4.5
5.0
5.5
Fig.14
Figure.10
Total Harmonic Distortion + Noise vs Output Power
RL=8Ω, f=1kHz, 400Hz-30kHz BPF
Total Harmonic Distortion + Noise vs Output Power
RL=4Ω, f=1kHz, 400Hz-30kHz BPF
VDD = 2.5V
VDD = 3.6V
VDD = 5.0V
100
10
VDD = 2.5V
VDD = 3.6V
VDD = 5.0V
THD+N [%]
THD+N [%]
10
VDD = 2.5V
1
VDD = 2.5V
VDD = 3.6V
1
VDD = 3.6V
VDD = 5.0V
VDD = 5.0V
0.1
0.01
0.10
Output Power [W]
0.1
0.01
1.00
1
10
Fig.15
Figure.11
Fig.16
Figure.12
Total Harmonic Distortion + Noise vs Frequency
VDD=5.0V RL=8Ω, 400Hz-30kHzBPF
Total Harmonic Distortion + Noise vs Frequency
VDD=3.6V RL=8Ω, 400Hz-30kHzBPF
10
10
Po=25mW
Po=100mW
Po=250mW
THD+N [%]
Po=25mW
Po=100mW
Po=250mW
THD+N [%]
0.1
Output Power [W]
1
Po = 25mW
Po = 100mW
1
Po = 25mW
Po = 100mW
Po = 250mW
Po = 250mW
0.1
0.1
10
100
1k
Frequency [Hz]
10k
100k
Figure.13
Fig.17
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© 2010 ROHM Co., Ltd. All rights reserved.
10
100
1k
Frequency [Hz]
10k
100k
Figure.14
Fig.18
15/19
2010.09 - Rev.A
Technical Note
BD5465GUL
Characteristics
(3/4)
Evaluation
- Typical
●Evaluation
data – data
Typical
characteristics
(3/4)
Total Harmonic Distortion + Noise vs Frequency
VDD=2.5V RL=8Ω, 400Hz-30kHzBPF
Total Harmonic Distortion + Noise vs Frequency
RL=8Ω, Po=125mW, 400Hz-30kHz BPF
10
10
Po=25mW
Po=100mW
Po=250mW
VDD=2.5V
VDD=3.6V
VDD=5.0V
Po = 100mW
VDD = 5.0V
1
THD+N [%]
THD+N [%]
1
Po = 25mW
0.1
VDD = 3.6V
0.1
Po = 150mW
VDD = 2.5V
0.01
0.01
10
100
1k
Frequency [Hz]
10k
100k
10
100
Fig.19
Figure.15
VDD = 5.0V
10
Gain [dB]
10
Gain [dB]
12
12
8
6
VDD = 3.6V
VDD=2.5V
VDD=3.6V
VDD=5.0V
2
100k
Gain_vs_Frequency
RL=4Ω, Vin=0.5Vpp, 400Hz-30kHz BPF
14
VDD = 5.0V
4
10k
Figure.16
Fig.20
Gain vs Frequency
RL=8Ω, Vin=0.5Vpp, 400Hz-30kHz BPF
14
1k
Frequency [Hz]
8
6
4
VDD = 2.5V
VDD=2.5V
VDD=3.6V
VDD=5.0V
2
VDD = 3.6V
VDD = 2.5V
0
0
10
100
1k
Frequency [Hz]
10k
10
100k
Fig.21
Figure.17
100
1k
Frequency [Hz]
10k
100k
Figure.18
Fig.22
Output Power vs Input Level @ sweep up
RL=8Ω, f=1kHz, 400Hz-30kHz BPF
10
VDD = 5.0V
Output Power [W]
VDD = 3.6V
1
100m
VDD = 2.5V
10m
VDD = 2.5V
VDD = 3.6V
VDD = 5.0V
1m
-30
-25
-20
-15
-10
Vin [dBV]
-5
0
5
Fig.23
Figure.19
Total Harmonic Distortion + Noise vs Input Level @ sweep up
RL=8Ω,f=1kHz, 400Hz-30kHz BPF
100
VDD = 2.5V
VDD = 3.6V
VDD = 5.0V
THD+N [%]
10
1
VDD = 2.5V
VDD = 3.6V
VDD = 5.0V
0.1
-30
-25
-20
-15
-10
Vin [dBV]
-5
0
5
Fig.24
Figure.20
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© 2010 ROHM Co., Ltd. All rights reserved.
16/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Evaluation
data – Typical
(4/4)
(4/4)
Evaluation
datacharacteristics
- Typical Characteristics
ALC Limit Operation Waveform
f=1kHz
ALC Release Operation Waveform
f=1kHz
2V / Div.
2V / Div.
INPUT
INPUT
OUTPUT
OUTPUT
-1
0
1
2
3
4
Time [msec]
5
6
7
-0.4
0
0.4
0.8
1.2
Figure.21
Fig.25
1.6
2
Time [sec]
2.4
2.8
3.2
3.6
Figure.22
Fig.26
Waveform during Start-up
Waveform during Shutdown
1V / Div.
1V / Div.
INPUT
INPUT
OUTPUT
Ton ( Wake-up Time )
OUTPUT
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-0.2
0
0.2
0.4
0.6
Time [msec]
Time [msec]
Figure.23
Fig.27
Figure.24
Fig.28
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© 2010 ROHM Co., Ltd. All rights reserved.
17/19
0.8
1
1.2
1.4
2010.09 - Rev.A
Technical Note
BD5465GUL
●Notes for use
(1) The numerical value and the data of the mention are a design representative value and are not the one which guarantees
the value.
(2) It is convinced that it should recommend application circuit example but in case of use, we request the confirmation of the
characteristic more sufficiently. When changing an external part fixed number and becoming use, it considers sprawl of
the external part and our company's LSI including the transition characteristic in addition to the stillness characteristic and
so on, see and fix an enough margin.
(3) Absolute maximum ratings
This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other
parameters are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings.
If it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and
determine ways to avoid exceeding the IC's absolute maximum ratings.
(4) GND terminal’s potential
Try to set the minimum voltage for GND terminal’s potential, regardless of the operation mode.
(5) Shorting between pins and mounting errors
When mounting the IC chip on a board, be very careful to set the chip's orientation and position precisely. When the
power is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs
(due to a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND.
(6) Operation in strong magnetic fields
Note with caution that operation faults may occur when this IC operates in a strong magnetic field.
(7) Thermal design
Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use
modes, because this IC is power amplifier. When excessive signal inputs which the heat dissipation is insufficient
condition, it is possible that thermal shutdown circuit is active.
(8) Thermal shutdown circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax=+150℃, and is not intended to
protect and secure an electrical appliance.
(9) Load of the output terminal
This IC corresponds to dynamic speaker load, and doesn't correspond to the load except for dynamic speakers. When
using speaker load 8Ω or less (especially 4Ω), there will be a risk of generating distortion at the speaker output wave form
during ALC limit operation.
(10) The short protection of the output terminal
This IC is built in the short protection for a protection of output transistors. When the short protection is operated, output
terminal become Hi-Z condition and is stopped with latch. Once output is stopped with latch, output does not recover
automatically by canceling the short-circuiting condition. The condition of stopping with latch is cancelled, when power
supply or mute signal is turned off and turned on again.
(11) Operation Range
The rated operating power supply voltage range (VDD=+2.5V~+5.5V) and the rated operating temperature range
(Ta=-40℃~+85℃) are the range by which basic circuit functions is operated. Characteristics and rated output power are
not guaranteed in all power supply voltage ranges or temperature ranges.
(12) Electrical Characteristics
Every audio characteristics list of the limit output power, total harmonic distortion, maximum gain, ALC limit level, ALC
release level etc. shows the typical characteristics of the device, highly dependent to the board lay-out, parts to be used,
power supply. The value when the device and each component are directly mounted to the board of Rohm.
(13) Power Supply
Since the Power Supply Pin for signal (VDD) and power supply for Power (PVDD) is SHORT at internal, short the board
pattern, then use a single power supply. Also, the power supply line of class-D speaker amplifier flows big peak energy. It
will influence the audio characteristics based on the capacity value of power supply decoupling capacitor, arrangement.
For the power supply decoupling capacitor, please arrange appropriately the low capacity (1μF or more) of ESR
(equivalent series resistor) directly near to IC Pin.
(14) ALC (Automatic Level Control) Function
The ALC automatically adjusts the audio output level, and a function that prevents the over output to the speaker. When
ALC function is working, gain switches at zero-cross point of audio output normally. If the time that audio output reaches
to zero-cross point is long, gain switches at about 1msec later (attack time), at about 25msec later (release time). So,
attack time and release time will change at audio input frequency. ALC parameter is fixed. ALC operation doesn’t
correspond to noise of impulse.
Also, ALC limit level is independent type from power supply voltage (fixed type). When power supply voltage goes down
during ALC operation, there will be a risk of generating distortion at the speaker output wave.
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18/19
2010.09 - Rev.A
Technical Note
BD5465GUL
●Ordering part number
B
D
5
Part No.
4
6
5
Part No.
G
U
L
-
Package
GUL: VCSP50L1
E
2
Packaging and forming specification
E2: Embossed tape and reel
VCSP50L1(BD5465GUL)
<Tape and Reel information>
1.8±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
0.1±0.05
1.8±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(φ0.15)INDEX POST
A
C
B
B
A
1
0.4±0.05
2
P=0.5×2
0.06 S
9-φ0.25±0.05
0.05 A B
0.4±0.05
S
3
1pin
P=0.5×2
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
Reel
19/19
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.09 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001