Datasheet Download

Headphone Amplifiers
Standard
Headphone Amplifiers
BH3544F,BH3547F,BH3548F
No.15102EDT02
●Description
BH3544F, BH3547F, BH3548F are headphone amplifiers suitable for portable products. BH3544F, BH3547F, BH3548F has
a fixed gain of 6 dB. External resistors for gain setting are not needed. Package of BH3544F, BH3547F, BH3548F is
pin-to-pin compatible (SOP8), enable to replace each other easily.
BH3544F, BH3547F, BH3548F also has mute functions that make it easy to prevent pop noise when power supply turns
on/off. Moreover, thermal shutdown function is built-in.BH3544F, BH3547F can drive 16/32Ω load, BH3548F can drive
8/16/32Ω. So, BH3548F is suitable for 8Ω receiver.
●Features
1) Built-in mute function for preventing pop noise when power supply turns on/off
2) Built-in thermal shutdown function
3) BH3544F, BH3547F, BH3548F are pin-to-pin compatible
4) SOP8 small package
●Applications
TV, Desktop PC, Notebook PC, Camcorder and other equipment having headphone output
●Line up
Part No.
Supply voltage
BH3544F
BH3547F
BH3548F
+2.8 ~ +6.5
+4.5 ~ +6.5
+4.0 ~ +5.5
V
7.0
3.7
6.5
mA
Quiescent current
Amplifier gain
6
Output [RL=16Ω]
62
dB
62
mW
16 / 32
77
8/16/32
Ω
-25 ~ +75
-40 ~ +85
℃
load impedance
Operating temperature range
Unit
●Absolute maximum ratings(Ta=25°C)
Parameter
Applied voltage
Power dissipation
Storage temperature
*1
Ratings
Symbol
Unit
BH3544F,BH3547F,BH3548F
VCC
7.0
Pd
550
Tstg
V
*1
mW
-55~+125
°C
Derating is done at 5.5mW/°C above Ta=25°C. (When mounted on a 70mm×70mm×1.6mm PCB board, FR4)
●Operating conditions (Ta=25°C)
Parameter
Symbol
Supply voltage
VCC
Temperature Range
Topr
Limits
Unit
BH3544F
BH3547F
BH3548F
+2.8 ~ +6.5
+4.5 ~ +6.5
+4.0 ~ +5.5
V
-40 ~ +85
℃
-25~+75
* These product are not designed for protection against radioactive rays.
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1/8
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Electrical characteristics (Unless otherwise noted, Ta=25°C,VCC=5V,RL=32Ω,f=1kHz,BW=400~30kHz, VIN =-6dBV)
Limits(TYP.)
Parameter
Symbol
Unit
Conditions
BH3544F
BH3547F
BH3548F
Quiescent current
IQ
7
3.7
6.5
mA
VIN=0Vrms
Mute pin control voltage H
VTMH
1.6<
V
Mute OFF
Mute pin control voltage L
VTML
<0.3
V
Mute ON
Gain
GVC
6
dB
-
Gain difference between
channels
ΔGVC
0
dB
-
Total harmonic distortion
THD
0.02
0.05
0.02
%
Rated output 1
PO1
31
46
31
mW
Rated output 2
PO2
62
77
62
mW
Rated output 3
PO3
120
mW
Output noise voltage
VNO
Channel separation
CS
Mute attenuation
ATT
Ripple rejection
Input resistance
-93
-90
-87
dBV
-90
BW=20~20kHz
RL=32Ω,THD<0.1%
(BH3541F,BH3544F,BH3548F)
RL=32Ω,THD<0.3%
(BH3547F)
RL=16Ω,THD<0.1%
(BH3541F,BH3544F,BH3548F)
RL=16Ω,THD<0.5%
(BH3547F)
RL=8Ω,THD<0.25%
(BH3548F)
BW=20~20kHz,Rg=0Ω
dB
Rg=0Ω
-80
dB
Rg=0Ω
RR
-57
dB
fRR=100Hz,VRR=-20dBV
Rin
90
kΩ
-
●Reference data
BH3544F
Fig. 1 Quiescent current vs.
power supply voltage
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BH3544F
Fig. 2 in DC current vs.
power supply voltage
2/8
BH3544F
Fig. 3 Output voltage vs.
Mute control voltage
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Reference data (Continued)
Fig. 4 Voltage gain vs. frequency
BH3544F
Fig. 7 Total harmonic distortion vs.
output voltage (3)
10
BH3544F
Ta25C
RL32
VCC5V
1
f10kHZ
0.1
f1kHZ
0.01
f100HZ
0.001
40
30
20
10
0
10
Ta25C
RL32
VCC3V
1
f10kHZ
0.1
f1kHZ
0.01
0.001
40
f100HZ
30
20
10
0
10
OUTPUT VOLTAGE: VO (dBV)
Fig. 5 Total harmonic distortion vs.
output voltage (1)
Fig. 6 Total harmonic distortion vs.
output voltage (2)
BH3544F
Fig. 8 Total harmonic distortion vs.
output voltage (4)
BH3544F
Fig. 10 MUTE attenuation vs. frequency
Fig. 11 Ripple rejection vs. frequency
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10
OUTPUT VOLTAGE :VO (dBV)
BH3544F
© 2015 ROHM Co., Ltd. All rights reserved.
TOTAL
DISTORTION
: THD
(%) (%)
TOTALHARMONIC
HARMONIC
DISTORTION
: THD
BH3544F
TOTAL HARMONIC
DISTORTION
: THD
(%)
TOTAL
HARMONIC
DISTORTION
: THD
(%)
BH3544F
3/8
BH3544F
Fig. 9 Channel separation vs.
frequency
BH3544F
Fig. 12 Ripple rejection vs.
power supply voltage
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Block diagram
VCC
OUT2
BIAS
IN2
8
7
6
5
BIAS
90k
6dB

TSD
90k

6dB
MUTE
1
2
3
4
OUT1
MUTE
IN1
GND
Fig. 13
●Measurement circuit
SW7
1
32
16
330μ
2
V V7AC
SW5
R5
1μ
1
47μ
CVCC
2
SW8B
10μ
A IQ
1
2
VCC
BIAS
OUT2
8
7
IN2
6
VIN2
5
BIAS
SWBA
90k
VRR
+
6dB
TSD
90k
VCC
+
6dB
MUTE
32
16
SW1
1
2
1
330μ
V1AC V
2
OUT1
3
MUTE
VTM
4
IN1
R3
GND
SW3
1μ
1
2
VIN1
Fig. 14
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4/8
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Terminal Equivalent Circuit / Description
Pin
No.
Pin
Name
I /O
Equivalent circuit
Pin voltage
BH3544F, BH3548F
VCC
1
OUT1
7
OUT2
O
2.1V
(VCC=5V)
VCC
1
Output pin
1
7
7
10k
10k
VCC
VCC
2
MUTE
I
0.1V
(When open)
2
200k
VCC
VCC
IN1
5
IN2
I
2.1V
(VCC=5V)
3
3
5
I/O
2.1V
(VCC=5V)
90k
BIAS
60k
6
Bias pin
VCC
VCC
BIAS
Input pin
5
90k
BIAS
6
Mute control pin
Active:Hi
Mute:Lo (open)
2
190k
3
Function
BH3547F
BIAS
70k
6
BIAS
64k
60k
(Since the 47 µF
externally attached
capacitor also serves
as the time constant for
pop noise
countermeasures,
evaluate adequately
when changing it.)
4
GND
I
-
-
-
GND pin
8
VCC
I
-
-
-
Power supply pin
※The figure in the pin explanation and input/output equivalent circuit is reference value, it doesn’t guarantee the value.
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5/8
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Application circuit
C7
330 µ
+
VCC
C8
10 µ
VCC
+
+
BIAS
OUT2
8
C6
47µ
7
C5
1µ
R5
VIN2
IN2
6
5
BIAS
90k
6dB
TSD
90k
6dB
MUTE
C1
330µ
+
VMUTE
H : Active
L : Mute
1
2
OUT1
R2 100k
3
4
MUTE
IN1
C2
1µ
R3
GND
C3
1µ
VIN1
Fig. 15
●Description of external components
1) Input coupling capacitors (C3, C5)
These are determined according to the lower cutoff frequency fc. Moreover, since lowering the capacitance can cause
the occurrence of pop noise, when changing this, determine it after adequate checking.
Since the input impedance is 90kΩ, these are found by the expressions below, although drift, temperature
characteristics, and other considerations are necessary. (Layered ceramic capacitors are recommended.)
C3(C5)=1/(2π× 90kΩ×fc)
2) Bias capacitor (C6)
When VCC=5V, 47μF is recommended. Since lowering the capacitance too much can cause worsening of electrical
characteristics or the occurrence of pop noise, when changing this, determine it after checking this adequately.
3) Mute pin pop noise countermeasures (R2, C2)
Since BH3544F,BH3548F have an impedance of 190kΩ against GND and the BH3547F has 200kΩ, it may be
impossible to cancel mute mode if R2 is made too large.
4) Output coupling capacitors (C1, C7)
These are determined by the lower cutoff frequency. If RL is the output load resistance (assuming a resistance RX is
put in for output protection or current restriction), these are found by the expression below.
C1(C7)=1/(2π×(RL+Rx)× fc)
5) Input gain adjustment resistances (R3, R5)
Externally attached resistances (R3, R5) make input gain adjustment possible. The gain found by the expression
below can be set.
GVC=6+20log(90kΩ/(90kΩ+R3[R5])) [dB]
When input gain is not accommodated, these resistors have no use.
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6/8
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Notes for use
1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
when using them. When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only
for static characteristics but also including transient characteristics.
3) Absolute maximum ratings
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be
damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you think of a case in
which absolute maximum ratings are exceeded, enforce fuses or other physical safety measures and investigate how
not to apply the conditions under which absolute maximum ratings are exceeded to the LSI.
4) GND potential
Make the GND pin voltage such that it is the lowest voltage even when operating below it. Actually confirm that the
voltage of each pin does not become a lower voltage than the GND pin, including transient phenomena.
5) Thermal design
Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in
actual states of use.
6) Shorts between pins and misinstallation
When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI.
If it is misinstalled and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a
foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and a GND.
7) Operation in strong magnetic fields
Adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction.
8) Pop noise countermeasures
In order to prevent the pop noise that occurs when the power supply turns ON or OFF, make the rise and fall with
reference to the timing diagram shown below.
1)BH3544F/ BH3548F
Rise time
VCC
A
PLAY period
B
A
Rise time
C
OUT
MUTE
Fig. 16
(A):Mute period (Use as pop noise countermeasure when power supply turns ON/OFF by makingVMUTE=Lo.)
(B):Mute cancellation period (This has a time constant because it is used by the externally attached C2 and R2 as
a pop noise countermeasure on mute cancellation, so be careful of the timing.)
(C):Mute start time (As on cancellation, this has a time constant.)
(MUTE period)
2)BH3547F
(Rise time)
(PLAY period)
(Fall period)
(B)
VCC
(A)
Vmute
SG
(I
t
OUT
Fig. 17
(A):Before VCC rise (or at the same time as VCC) make mute cancelled (VMUTE=Hi).
(B):Soft mute period (This time can be set by externally attached R2 and C2)
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7/8
2015.06 - Rev.D
Technical Note
BH3544F,BH3547F,BH3548F
●Ordering part number
B
H
3
Part No.
5
4
4
F
-
E
Package
F: SOP8
Part No.
3544
3547
3548
2
Packaging and forming specification
E2: Embossed tape and reel
SOP8
<Tape and Reel information>
7
6
5
6.2±0.3
4.4±0.2
0.3MIN
8
+6°
4° −4°
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2015.06 - Rev.D
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
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ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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H2S, NH3, SO2, and NO2
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[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
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[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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All information and data including but not limited to application example contained in this document is for reference
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1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
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3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001