HIR C19D 1N90 L558 P03 TR

Technical Data Sheet
High Power Infrared LED
HIR-C19D-1N90/L558-P03/TR
Features
․Small package with high efficiency
․Peak wavelength λp=855nm
․Soldering methods:SMT
․Thermal resistance (junction to lead): 11℃/W.
․Pb free
․The product itself will remain within RoHS compliant version.
Descriptions
․HIR-C19D-1N90/L558-P03/TR series is an infrared emitting diode in miniature
SMD package which is molded in a water clear silicone with
spherical top view lens.
․The device is spectrally matched with silicon photodiode,
Phototransistor.
Applications
․CCD Camera
․Infrared applied system
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Package Dimensions
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
3. Do not handle the device by the lens. Incorrect force applied to the lens may lead to the failure
of devices.
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Pad Configuration
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Forward Current
Reverse Voltage
IF
1
A
VR
5
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Junction temperature
Tj
115
ºC
Thermal resistance (junction to
leadframe)
Rth(j-L)
11
℃/W
Power Dissipation @IF=1000mA
Pd
3.7
W
Note: We suggest that customer should add the heat sink with
HIR-C19D-1N90/L558-P03/TR to exclude the heat.
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Electro-Optical Characteristics (Ta=25℃)
Parameter
Total Radiated Power
Radiant Intensity
Symbol
Po
IE
Condition
Min.
Typ.
Max.
IF=350mA
--
350
--
IF=700mA
--
700
--
IF=1A
--
1030
--
IF=350mA
150
170
--
IF=700mA
330
350
--
IF=1A
450
470
--
Unit
mW
mW/sr
Peak Wavelength
λp
IF=350mA
--
855
--
nm
Spectral Bandwidth
Δλ
IF=350mA
--
25
--
nm
IF=350mA
--
3.1
--
IF=700mA
--
3.4
--
IF=1A
--
3.7
--
Forward Voltage
VF
V
Reverse Current
IR
VR=5V
--
--
10
μA
View Angle
2θ1/2
IF=20mA
--
90
--
deg
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Typical Electro-Optical Characteristics Curves
Fig.1 Ambient Temperature
vs.
Forward Current
Fig.2 Forward Current
vs.
Forward Voltage
Fig.3 Spectral Distribution
Fig.4 Spectral Distributio n
Angular Displacement
Fig.5 Forward Current
vs.
Radiant lntensity
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Reflow Soldering Characteristics
For Reflow Process
1. C19D series are suitable for SMT processes.
2. Curing of glue in oven must be according to standard operation flow processes.
3. Reflow soldering should not be done more than twice.
4. In soldering process, stress on the LEDs during heating should be avoided.
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Package Dimensions
Note: 1. Dimensions are in millimeters
2. The tolerances unless mentioned is ±0.1mm
Carrier Tape Dimensions:
Loaded quantity 400 PCS per reel.
Note: 1. Dimensions are in millimeters
2. The tolerances unless mentioned is ±0.1mm
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Moisture Resistant Packaging
Label
Aluminum moistue-proof bag
Desiccant
Label
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks
HUE: Peak Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Notes
1. Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
2. When using this product, please observe the absolute maximum ratings and the instructions
for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for
any damage resulting from use of the product which does not comply with the absolute
maximum ratings and the instructions included in these specification sheets.
3. These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s
consent.
EVERLIGHT ELECTRONICS CO., LTD.
Tel: 886-2-2685-6688
Office: No. 6-8,Zhonghua Rd.,Shulin Dist.
Fax: 886-2-2685-6897
New Taipei City 23860,Taiwan, R.O.C
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2010, Everlight All Rights Reserved. Release Date : May. 14.2014
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Expired Period: Forever