Si53106

Si53106
S IX -O UTPUT PCI E G EN 3 BUFFER /Z ERO D ELAY B UFFER
Features





Six 0.7 V low-power, push-pull,
HCSL-compatible PCIe Gen 3
outputs
Individual OE HW pins for each
output clock
100 MHz /133 MHz PLL
operation, supports PCIe and
QPI
PLL bandwidth SW SMBUS
programming overrides the latch
value from HW pin
SMBus address configurable to
allow multiple buffers in a single
control network 3.3 V supply
voltage operation
 Low phase jitter (Intel QPI, PCIe
Gen 1/2/3/4 common clock
compliant
 Gen 3 SRNS Compliant
 PLL or bypass mode
 Spread spectrum tolerable
 1.05 to 3.3 V I/O supply voltage
 50 ps output-to-output skew
 Industrial Temperature:
–40 to 85 °C
 40-pin QFN
 For higher output devices or
variations of this device, contact
Silicon Labs
Ordering Information:
See page 29.
Patents pending
Applications
Server
 Storage

Datacenter
 Enterprise Switches and Routers

Description
The Si53106 is a low-power, 6-output, differential clock buffer that meets
all of the performance requirements of the Intel DB1200ZL specification.
The device is optimized for distributing reference clocks for Intel®
QuickPath Interconnect (Intel QPI), PCIe Gen 1/Gen 2/Gen 3/Gen 4,
SAS, SATA, and Intel Scalable Memory Interconnect (Intel SMI)
applications. The VCO of the device is optimized to support 100 MHz and
133 MHz operation. Each differential output has a dedicated hardware
output enable pin for maximum flexibility and power savings. Measuring
PCIe clock jitter is quick and easy with the Silicon Labs PCIe Clock Jitter
Tool. Download it for free at www.silabs.com/pcie-learningcenter.
Rev. 1.2 12/15
Copyright © 2015 by Silicon Laboratories
Si53106
Si53106
Functional Block Diagram
OE_[5:0]
6
SSC Compatible
PLL
CLK_IN
CLK_IN
100M_133
HBW_BYPASS_LBW
SA_0
SA_1
PWRGD / PWRDN
SDA
SCL
2
Control
Logic
Rev. 1.2
DIF_[5:0]
Si53106
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1. CLK_IN, CLK_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2. OE and Output Enables (Control Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3. 100M_133M—Frequency Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4. SA_0, SA_1—Address Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5. PWRGD/PWRDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.6. HBW_BYPASS_LBW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.7. Miscellaneous Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1. Input Edge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2. Termination of Differential Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1. Byte Read/Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2. Block Read/Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5. Power Filtering Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1. Ferrite Bead Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6. Pin Descriptions: 40-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
9. Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Rev. 1.2
3
Si53106
1. Electrical Specifications
Table 1. DC Operating Characteristics
VDD_A = 3.3 V±5%, VDD = 3.3 V±5%
Parameter
Symbol
Test Condition
Min
Max
Unit
VDD/VDD_A
3.3 V ±5%
3.135
3.465
V
VDD_IO
1.05 V to 3.3 V ±5%
0.9975
3.465
V
3.3 V Input High Voltage
VIH
VDD
2.0
VDD+0.3
V
3.3 V Input Low Voltage
VIL
VSS-0.3
0.8
V
3.3 V Core Supply Voltage
3.3 V I/O Supply
Input Leakage
Voltage1
Current2
IIL
0 < VIN < VDD
–5
+5
µA
3
3.3 V Input High Voltage
VIH_FS
VDD
0.7
VDD+0.3
V
3
3.3 V Input Low Voltage
VIL_FS
VSS–0.3
0.35
V
3.3 V Input Low Voltage
VIL_Tri
0
0.8
V
3.3 V Input Med Voltage
VIM_Tri
1.2
1.8
V
3.3 V Input High Voltage
VIH_Tri
2.4
VDD
V
Voltage4
VOH
IOH = –1 mA
2.4
—
V
3.3 V Output Low Voltage4
VOL
IOL = 1 mA
—
0.4
V
CIN
2.5
4.5
pF
COUT
2.5
4.5
pF
LPIN
—
7
nH
–40
85
°C
3.3 V Output High
Input Capacitance
Output
5
Capacitance5
Pin Inductance
Ambient Temperature
TA
No Airflow
Notes:
1. VDD_IO applies to the low-power NMOS push-pull HCSL compatible outputs.
2. Input Leakage Current does not include inputs with pull-up or pull-down resistors. Inputs with resistors should state
current requirements.
3. Internal voltage reference is to be used to guarantee VIH_FS and VIL_FS thresholds levels over full operating range.
4. Signal edge is required to be monotonic when transitioning through this region.
5. Ccomp capacitance based on pad metallization and silicon device capacitance. Not including pin capacitance.
Table 2. Current Consumption
TA = –40 to 85 °C; supply voltage VDD = 3.3 V ±5%
Parameter
Operating Current
Symbol
Min
Typ
Max
Unit
IDDVDD
133 MHz, VDD Rail
—
19
30
mA
IDDVDDA
133 MHz, VDDA + VDDR, PLL Mode
—
15
25
mA
IDDVDDIO
133 MHz, CL = Full Load, VDD IO Rail
—
49
65
mA
Power Down, VDD Rail
—
0.45
1
mA
IDDVDDAPD
Power Down, VDDA Rail
—
4.5
7
mA
IDDVDDIOPD
Power Down, VDD_IO Rail
—
0.23
0.5
mA
Power Down Current IDDVDDPD
4
Test Condition
Rev. 1.2
Si53106
Table 3. Output Skew, PLL Bandwidth and Peaking
TA = –40 to 85 °C; supply voltage VDD = 3.3 V ±5%
Parameter
Test Condition
Min
Typ
Max
Unit
–100
–15
100
ps
2.5
3.6
4.5
ns
CLK_IN, DIF[x:0]
Input-to-Output Delay in PLL Mode
Nominal Value1,2,3,4
CLK_IN, DIF[x:0]
Input-to-Output Delay in Bypass Mode
\Nominal Value2,4,5
CLK_IN, DIF[x:0]
Input-to-Output Delay Variation in PLL mode
Over voltage and temperature2,4,5
–100
39
100
ps
CLK_IN, DIF[x:0]
Input-to-Output Delay Variation in Bypass Mode
Over voltage and temperature2,4,5
–250
3.7
250
ps
Output-to-Output Skew across all 6 Outputs
(Common to Bypass and PLL Mode)1,2,3,4,5
0
20
50
ps
PLL Jitter Peaking
(HBW_BYPASS_LBW = 0)6
—
0.4
2.0
dB
PLL Jitter Peaking
(HBW_BYPASS_LBW = 1)6
—
0.1
2.5
dB
PLL Bandwidth
(HBW_BYPASS_LBW = 0)7
—
0.7
1.4
MHz
PLL Bandwidth
(HBW_BYPASS_LBW = 1)7
—
2
4
MHz
DIF[11:0]
Notes:
1. Measured into fixed 2 pF load cap. Input-to-output skew is measured at the first output edge following the
corresponding input.
2. Measured from differential cross-point to differential cross-point.
3. This parameter is deterministic for a given device.
4. Measured with scope averaging on to find mean value.
5. All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created
by it.
6. Measured as maximum pass band gain. At frequencies within the loop BW, highest point of magnification is called PLL
jitter peaking.
7. Measured at 3 db down or half power point.
Rev. 1.2
5
Si53106
Table 4. Clock Input Parameters
TA = –40 to 85 °C; supply voltage VDD = 3.3 V ±5%
Parameter
Input Frequency
Symbol
FIN
Test Condition
Min
Typ
Max
Unit
Bypass Mode
33
—
150
MHz
PLL Mode, 100 MHz
90
100
110
MHz
PLL Mode, 133.33 MHz
120
133.33
147
MHz
Input High Voltage- CLK_IN
VIHDIF
Differential inputs
single-ended measurement
600
800
1150
mV
Input Low Voltage- CLK_IN
VILDIF
Differential inputs
single-ended measurement
VSS –300
0
300
mV
Input Common Mode
Voltage - CLK_IN
VCOM
Common Mode Voltage Input
300
—
1000
mV
Input Amplitude- CLK_IN
VSwing
Peak to Peak
300
—
1450
Input Slew Rate- CLK_IN
IDDVDDAPD
Measured differentially
0.4
—
8
V/ns
Input Leakage Current
IIN
VIN = VDD, VIN = GND
-5
—
5
A
Input Duty Cycle
dtin
Measured from differential
waveform
45
—
55
%
Input Jitter, Cycle-Cycle
JDIFIN
Differential measurement
0
—
125
ps
Input SS Modulation Frequency
fMODIN
Triangle Wave Modulation
30
—
33
kHz
6
Rev. 1.2
Si53106
Table 5. Phase Jitter
Parameter
Phase Jitter
PLL Mode
Test Condition
Min
Typ
Max
Unit
—
29
86
ps
PCIe Gen 2 Low Band, Common Clock
F < 1.5 MHz1,3,4,5
—
2.3
3.0
ps
(RMS)
PCIe Gen 2 High Band, Common Clock
1.5 MHz < F < Nyquist1,3,4,5
—
2.4
3.1
ps
(RMS)
PCIe Gen 3, Common Clock
(PLL BW 2–4 MHz, CDR = 10 MHz)1,3,4,5
—
0.6
1.0
ps
(RMS)
PCIe Gen 3 Separate Reference No Spread, SRNS
(PLL BW of 2–4 or 2–5 MHz, CDR = 10 MHz)1,3,4,5
—
0.42
0.71
ps
(RMS)
PCIe Gen 4, Common Clock
(PLL BW of 2–4 or 2–5 MHz, CDR = 10 MHz)1,4,5,8
—
0.6
1.0
ps
(RMS)
Intel® QPI & Intel SMI
(4.8 Gbps or 6.4 Gb/s, 100 or 133 MHz, 12 UI)1,6,7
—
0.21
0.5
ps
(RMS)
Intel QPI & Intel SMI
(8 Gb/s, 100 MHz, 12 UI)1,6
—
0.13
0.3
ps
(RMS)
Intel QPI & Intel SMI
(9.6 Gb/s, 100 MHz, 12 UI)1,6
—
0.11
0.2
ps
(RMS)
PCIe Gen 1, Common Clock
1,2,3
Notes:
1. Post processed evaluation through Intel supplied Matlab* scripts. Defined for a BER of 1E-12. Measured values at a
smaller sample size have to be extrapolated to this BER target.
2. ζ = 0.54 implies a jitter peaking of 3 dB.
3. PCIe* Gen 3 filter characteristics are subject to final ratification by PCISIG. Check the PCI-SIG for the latest
specification.
4. Measured on 100 MHz PCIe output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
5. Measured on 100 MHz output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
6. Measured on 100 MHz, 133 MHz output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
7. These jitter numbers are defined for a BER of 1E-12. Measured numbers at a smaller sample size have to be
extrapolated to this BER target.
8. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.
9. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter.
Rev. 1.2
7
Si53106
Table 5. Phase Jitter (Continued)
Additive Phase Jitter
Bypass Mode
PCIe Gen 11,2,3
—
10
—
ps
PCIe Gen 2 Low Band
F < 1.5 MHz1,3,4,5
—
1.6
—
ps
(RMS)
PCIe Gen 2 High Band
1.5 MHz < F < Nyquist1,3,4,5
—
1.6
—
ps
(RMS)
PCIe Gen 3
(PLL BW 2–4 MHz, CDR = 10 MHz)1,3,4,5
—
0.4
—
ps
(RMS)
PCIe Gen 4, Common Clock
(PLL BW of 2–4 or 2–5 MHz, CDR = 10 MHz)1,4,5,8
—
0.4
—
ps
(RMS)
Intel QPI & Intel® SMI
(4.8 Gbps or 6.4 Gb/s, 100 or 133 MHz, 12 UI)1,6,7
—
0.12
—
ps
(RMS)
Intel QPI & Intel® SMI
(8 Gb/s, 100 MHz, 12 UI)1,6
—
0.1
—
ps
(RMS)
Intel QPI & Intel® SMI
(9.6 Gb/s, 100 MHz, 12 UI)1,6
—
0.09
—
ps
(RMS)
Notes:
1. Post processed evaluation through Intel supplied Matlab* scripts. Defined for a BER of 1E-12. Measured values at a
smaller sample size have to be extrapolated to this BER target.
2. ζ = 0.54 implies a jitter peaking of 3 dB.
3. PCIe* Gen 3 filter characteristics are subject to final ratification by PCISIG. Check the PCI-SIG for the latest
specification.
4. Measured on 100 MHz PCIe output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
5. Measured on 100 MHz output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
6. Measured on 100 MHz, 133 MHz output using the template file in the Intel-supplied Clock Jitter Tool V1.6.3.
7. These jitter numbers are defined for a BER of 1E-12. Measured numbers at a smaller sample size have to be
extrapolated to this BER target.
8. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.
9. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter.
8
Rev. 1.2
Si53106
Table 6. DIF 0.7 V AC Timing Characteristics (Non-Spread Spectrum Mode)1
Parameter
Symbol
CLK 100 MHz, 133 MHz
Min
Typ
Max
Unit
Notes
2
Clock Stabilization Time
TSTAB
—
1.5
1.8
ms
Long Term Accuracy
LACC
—
—
100
ppm
Absolute Host CLK Period (100MHz)
TABS
9.94900
—
10.05100
ns
346
Absolute Host CLK Period (133MHz)
TABS
7.44925
—
7.55075
ns
346
Edge_rate
1.0
—
4.0
V/ns
347
Rise Time Variation
∆ TRISE
—
—
125
ps
389
Fall Time Variation
∆ TFALL
—
—
125
ps
389
Rise/Fall Matching
TRISE_MAT/
TFALL_MAT
—
—
20
%
3 8 10 11
Voltage High (typ 0.7 V)
VHIGH
660
—
850
mV
3,8,12
Voltage Low (typ 0.7 V)
VLOW
–150
—
150
mV
3,8,13
Maximum Voltage
VMAX
—
—
1150
mV
8
Absolute Crossing Point Voltages
VoxABS
250
—
550
mV
3,8,14,15,
Total Variation of VCROSS Over All
Edges
Total ∆
Vox
—
—
140
mV
3,8,18
Duty Cycle
DC
45
—
55
%
3,4
Maximum Voltage (Overshoot)
Vovs
—
—
VHigh + 0.3
V
3,8,19
Maximum Voltage (Undershoot)
Vuds
—
—
VLow – 0.3
V
3,8,20
Edge Rate
Rev. 1.2
34
, ,5
, ,
, ,
, ,
, ,
, ,
, , ,
16
9
Si53106
Table 6. DIF 0.7 V AC Timing Characteristics (Non-Spread Spectrum Mode)1 (Continued)
Parameter
Ringback Voltage
Symbol
Vrb
CLK 100 MHz, 133 MHz
Min
Typ
Max
0.2
—
N/A
Unit
Notes
V
38
,
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. This is the time from the valid CLK_IN input clocks and the assertion of the PWRGD signal level at 1.8–2.0 V to the time
that stable clocks are output from the buffer chip (PLL locked).
3. Test configuration is RS = 33.2 , RP = 49.9, 2 pF for 100  transmission line; RS = 27 , RP = 42.2, 2 pF for 85 
transmission line.
4. Measurement taken from differential waveform.
5. Using frequency counter with the measurement interval equal or greater than 0.15 s, target frequencies are
99,750,00 Hz, 133,000,000 Hz.
6. The average period over any 1 µs period of time must be greater than the minimum and less than the maximum
specified period.
7. Measure taken from differential waveform on a component test board. The edge (slew) rate is measured from
–150 mV to +150 mV on the differential waveform . Scope is set to average because the scope sample clock is making
most of the dynamic wiggles along the clock edge Only valid for Rising clock and Falling CLOCK. Signal must be
monotonic through the VOL to VOH region for TRISE and TFALL.
8. Measurement taken from single-ended waveform.
9. Measured with oscilloscope, averaging off, using min max statistics. Variation is the delta between min and max.
10. Measured with oscilloscope, averaging on, The difference between the rising edge rate (average) of clock verses the
falling edge rate (average) of CLOCK.
11. Rise/Fall matching is derived using the following, 2*(TRISE - TFALL) / (TRISE + TFALL).
12. VHIGH is defined as the statistical average High value as obtained by using the Oscilloscope VHIGH Math function.
13. VLOW is defined as the statistical average Low value as obtained by using the Oscilloscope VLOW Math function.
14. Measured at crossing point where the instantaneous voltage value of the rising edge of CLK equals the falling edge of
CLK.
15. This measurement refers to the total variation from the lowest crossing point to the highest, regardless of which edge is
crossing.
16. The crossing point must meet the absolute and relative crossing point specifications simultaneously.
17. VCROSS(rel) Min and Max are derived using the following, VCROSS(rel) Min = 0.250 + 0.5 (VHAVG – 0.700), VCROSS(rel)
Max = 0.550 – 0.5 (0.700 – VHAVG), (see Figures 3-4 for further clarification).
18. VCROSS is defined as the total variation of all crossing voltages of Rising CLOCK and Falling CLOCK. This is the
maximum allowed variance in VCROSS for any particular system.
19. Overshoot is defined as the absolute value of the maximum voltage.
20. Undershoot is defined as the absolute value of the minimum voltage.
10
Rev. 1.2
Si53106
Table 7. Clock Periods Differential Clock Outputs with SSC Disabled
SSC ON
Center
Freq, MHz
Measurement Window
1 Clock
1 µs
–C–C
Jitter
AbsPer
Min
0.1 s
–SSC
–ppm
Long
Short
Term
AVG
Term AVG
Min
Min
0.1 s
Unit
0.1 s
1 µs
0 ppm
Period
Nominal
+SSC
+ppm
Short
Long
Term AVG Term AVG
Max
Max
1 Clock
+C–C
Jitter
AbsPer
Max
100.00
9.94900
9.99900
10.00000
10.00100
10.05100
ns
133.33
7.44925
7.49925
7.50000
7.50075
7.55075
ns
Table 8. Clock Periods Differential Clock Outputs with SSC Enabled
SSC ON
Center
Freq, MHz
Measurement Window
1 Clock
1 µs
0.1 s
–ppm
–SSC
Long
Short
Term
AVG
Term AVG
Min
Min
–C–C
Jitter
AbsPer
Min
0.1 s
0.1 s
Unit
1 µs
0 ppm
Period
Nominal
+SSC
+ppm
Short
Long
Term AVG Term AVG
Max
Max
1 Clock
+C–C
Jitter
AbsPer
Max
99.75
9.94900
9.99900
10.02406
10.02506
10.02607
10.05126
10.10126
ns
133.33
7.44925
7.49925
7.51805
7.51880
7.51955
7.53845
7.58845
ns
Table 9. Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
VDD/VDD_A
—
4.6
V
VDD_IO
—
4.6
V
VIH
—
4.6
V
VIL
−0.5
—
V
Storage Temperature1
ts
–65
150
°C
Input ESD protection3
ESD
2000
—
V
3.3 V Core Supply Voltage1
3.3 V I/O Supply Voltage1
3.3 V Input High Voltage
1,2
3.3 V Input Low Voltage1
Notes:
1. Consult manufacturer regarding extended operation in excess of normal dc operating parameters.
2. Maximum VIH is not to exceed maximum VDD.
3. Human body model.
Rev. 1.2
11
Si53106
2. Functional Description
2.1. CLK_IN, CLK_IN
The differential input clock can be sourced from a clock synthesizer, e.g. CK420BQ, CK509B, or CK410B+.
2.2. OE and Output Enables (Control Registers)
Each output can be individually enabled or disabled by SMBus control register bits. Additionally, each output of the
DIF[11:0] has a dedicated OE pin. The OE pins are asynchronous, asserted-low signals. The Output Enable bits in
the SMBus registers are active high and are set to enable by default. The disabled state for the Si53106 NMOS
push-pull output is Low/Low. Please note that the logic level for assertion or deassertion is different in software
than it is on hardware. This follows hardware default nomenclature for communication channels (e.g., output is
enabled if the OE# pin is pulled low) and still maintains software programming logic (e.g., output is enabled if OE
register is true). Table 10 is a truth table depicting enabling and disabling of outputs via hardware and software.
Note that, for the output to be active, the control register bit must be a 1 and the OE pin must be a 0.
Note: The assertion and deassertion of this signal is absolutely asynchronous.
Table 10. Si53106 Output Management
Inputs
OE Hardware Pins and Control Register Bits
Outputs
PLL State
PWRGD/
PWRDN
CLK_IN/
CLK_IN
SMBUS
Enable Bit
OE Pin
DIF/DIF[11:0]
FB_OUT/
FB_OUT
0
x
x
x
Low/Low
Low/Low
OFF
0
x
Low/Low
Running
ON
1
0
Running
Running
ON
1
1
Low/Low
Running
ON
1
Running
2.2.1. OE Assertion (Transition from 1 to 0)
All differential outputs that were disabled are to resume normal operation in a glitch-free manner. The latency from
the assertion to active outputs is 4 to 12 DIF clock periods.
2.2.2. OE De-Assertion (Transition from 0 to 1)
The impact of deasserting OE is that each corresponding output will transition from normal operation to disabled in
a glitch-free manner. A minimum of four valid clocks will be provided after the deassertion of OE. The maximum
latency from the deassertion to disabled outputs is 12 DIF clock periods.
2.3. 100M_133M—Frequency Selection
The Si53106 is optimized for lowest phase jitter performance at operating frequencies of 100 and 133 MHz.
100M_133M is a hardware input pin, which programs the appropriate output frequency of the differential outputs.
Note that the CLK_IN frequency must be equal to the CLK_OUT frequency; meaning Si53106 is operated in 1:1
mode only. Frequency selection can be enabled by the 100M_133M hardware pin. An external pull-up or pull-down
resistor is attached to this pin to select the input/output frequency. The functionality is summarized in Table 11.
Table 11. Frequency Program Table
100M_133M
Optimized Frequency (CLK_IN = CLK_OUT)
0
133.33 MHz
1
100.00 MHz
Note: All differential outputs transition from 100 to 133 MHz or from 133 to 100 MHz in a glitch free manner.
12
Rev. 1.2
Si53106
2.4. SA_0, SA_1—Address Selection
SA_0 and SA_1 are tri-level hardware pins, which program the appropriate address for the Si53106. The two trilevel input pins that can configure the device to nine different addresses.
Table 12. SMBUS Address Table
SA_1
SA_0
SMBUS Address
L
L
D8
L
M
DA
L
H
DE
M
L
C2
M
M
C4
M
H
C6
H
L
CA
H
M
CC
H
H
CE
2.5. PWRGD/PWRDN
PWRGD is asserted high and deasserted low. Deassertion of PWRGD (pulling the signal low) is equivalent to
indicating a power-down condition. PWRGD (assertion) is used by the Si53106 to sample initial configurations,
such as frequency select condition and SA selections. After PWRGD has been asserted high for the first time, the
pin becomes a PWRDN (Power Down) pin that can be used to shut off all clocks cleanly and instruct the device to
invoke power-saving mode. PWRDN is a completely asynchronous active low input. When entering power-saving
mode, PWRDN should be asserted low prior to shutting off the input clock or power to ensure all clocks shut down
in a glitch free manner. When PWRDN is asserted low, all clocks will be disabled prior to turning off the VCO. When
PWRDN is deasserted high, all clocks will start and stop without any abnormal behavior and will meet all ac and dc
parameters.
Note: The assertion and deassertion of PWRDN is absolutely asynchronous.
Warning: Disabling of the CLK_IN input clock prior to assertion of PWRDN is an undefined mode and not recommended.
Operation in this mode may result in glitches, excessive frequency shifting, etc.
Table 13. PWRGD/PWRDN Functionality
PWRGD/
PWRDN
DIF
DIF
0
Low
Low
1
Normal
Normal
Rev. 1.2
13
Si53106
2.5.1. PWRDN Assertion
When PWRDN is sampled low by two consecutive rising edges of DIF, all differential outputs must be held LOW/
LOW on the next DIF high-to-low transition.
PWRDWN
DIF
DIF
Figure 1. PWRDN Assertion
2.5.2. PWRGD Assertion
The power-up latency is to be less than 1.8 ms. This is the time from a valid CLK_IN input clock and the assertion
of the PWRGD signal to the time that stable clocks are output from the device (PLL locked). All differential outputs
stopped in a LOW/LOW condition resulting from power down must be driven high in less than 300 µs of PWRDN
deassertion to a voltage greater than 200 mV.
Tstable
<1.8 ms
PWRGD
DIF
DIF
Tdrive_Pwrdn#
<300 µs; > 200 mV
Figure 2. PWRDG Assertion (Pwrdown—Deassertion)
14
Rev. 1.2
Si53106
2.6. HBW_BYPASS_LBW
The HBW_BYPASS_LBW pin is a tri-level function input pin (refer to Table 14 for VIL_Tri, VIM_Tri, and VIH_Tri signal
levels). It is used to select between PLL high-bandwidth, PLL bypass mode, or PLL low-bandwidth mode. In PLL
bypass mode, the input clock is passed directly to the output stage, which may result in up to 50 ps of additive
cycle-to-cycle jitter (50 ps + input jitter) on the differential outputs. In the case of PLL mode, the input clock is
passed through a PLL to reduce high-frequency jitter. The PLL HBW, BYPASS, and PLL LBW modes may be
selected by asserting the HBW_BYPASS_LBW input pin to the appropriate level described in Table 14.
Table 14. PLL Bandwidth and Readback Table
HBW_BYPASS_LBW Pin
Mode
Byte 0, Bit 7
Byte 0, Bit 6
L
LBW
0
0
M
BYPASS
0
1
H
HBW
1
1
The Si53106 has the ability to override the latch value of the PLL operating mode from hardware strap pin 5 via the
use of Byte 0 and bits 2 and 1. Byte 0 bit 3 must be set to 1 to allow the user to change Bits 2 and 1, affecting the
PLL. Bits 7 and 6 will always read back the original latched value. A warm reset of the system will have to be
accomplished if the user changes these bits.
2.7. Miscellaneous Requirements
Data Transfer Rate: 100 kbps (standard mode) is the base functionality required. Fast mode (400 kbps)
functionality is optional.
Logic Levels: SMBus logic levels are based on a percentage of VDD for the controller and other devices on the
bus. Assume all devices are based on a 3.3 V supply.
Clock Stretching: The clock buffer must not hold/stretch the SCL or SDA lines low for more than 10 ms. Clock
stretching is discouraged and should only be used as a last resort. Stretching the clock/data lines for longer than
this time puts the device in an error/time-out mode and may not be supported in all platforms. It is assumed that all
data transfers can be completed as specified without the use of clock/data stretching.
General Call: It is assumed that the clock buffer will not have to respond to the “general call.”
Electrical Characteristics: All electrical characteristics must meet the standard mode specifications found in
Section 3 of the SMBus 2.0 specification.
Pull-Up Resistors: Any internal resistor pull-ups on the SDATA and SCLK inputs must be stated in the individual
datasheet. The use of internal pull-ups on these pins of below 100 K is discouraged. Assume that the board
designer will use a single external pull-up resistor for each line and that these values are in the 5–6 k range.
Assume one SMBus device per DIMM (serial presence detect), one SMBus controller, one clock buffer, one clock
driver plus one/two more SMBus devices on the platform for capacitive loading purposes.
Input Glitch Filters: Only fast mode SMBus devices require input glitch filters to suppress bus noise. The clock
buffer is specified as a standard mode device and is not required to support this feature. However, it is considered
a good design practice to include the filters.
PWRDN: If a clock buffer is placed in PWRDN mode, the SDATA and SCLK inputs must be Tri-stated and the
device must retain all programming information. IDD current due to the SMBus circuitry must be characterized and
in the data sheet.
Rev. 1.2
15
Si53106
3. Test and Measurement Setup
3.1. Input Edge
Input edge rate is based on single-ended measurement. This is the minimum input edge rate at which the Si53106
is guaranteed to meet all performance specifications.
Table 15. Input Edge Rate
Frequency
Min
Max
Unit
100 MHz
0.35
N/A
V/ns
133 MHz
0.35
N/A
V/ns
3.1.1. Measurement Points for Differential
Slew_fall
Slew_rise
+150 mV
+150 mV
0.0 V
V_swing
0.0 V
-150 mV
-150 mV
Diff
Figure 3. Measurement Points for Rise Time and Fall Time
Vovs
VHigh
Vrb
Vrb
VLow
Vuds
Figure 4. Single-Ended Measurement Points for Vovs, Vuds, Vrb
16
Rev. 1.2
Si53106
TPeriod
Low Duty Cycle %
High Duty Cycle %
Skew measurement
point
0.000 V
Figure 5. Differential (CLOCK–CLOCK) Measurement Points (Tperiod, Duty Cycle, Jitter)
3.2. Termination of Differential Outputs
All differential outputs are to be tested into a 100  or 85  differential impedance transmission line. Source
terminated clocks have some inherent limitations as to the maximum trace length and frequencies that can be
supported. For CPU outputs, a maximum trace length of 10” and a maximum of 200 MHz are assumed. For SRC
clocks, a maximum trace length of 16” and maximum frequency of 100 MHz is assumed. For frequencies beyond
200 MHz, trace lengths must be restricted to avoid signal integrity problems.
Table 16. Differential Output Termination
Clock
Board Trace Impedance
Rs
Rp
Unit
DIFF Clocks—50  configuration
100
33+5%
N/A

DIFF Clocks—43  configuration
85
27+5%
N/A

3.2.1. Termination of Differential NMOS Push-Pull Type Outputs
Si53106
Clock Rs
T-Line
10" Typical
Receiver
2 pF
Source Terminated
2 pF
Clock # Rs
T-Line
10" Typical
Figure 6. 0.7 V Configuration Test Load Board Termination for NMOS Push-Pull
Rev. 1.2
17
Si53106
4. Control Registers
4.1. Byte Read/Write
Reading or writing a register in an SMBus slave device in byte mode always involves specifying the register
number.
4.1.1. Byte Read
The standard byte read is as shown in Figure 7. It is an extension of the byte write. The write start condition is
repeated; then, the slave device starts sending data, and the master acknowledges it until the last byte is sent. The
master terminates the transfer with a NAK, then a stop condition. For byte operation, the 2 x 7th bit of the
command byte must be set. For block operations, the 2 x 7th bit must be reset. If the bit is not set, the next byte
must be the byte transfer count.
1
7
T Slave
1 1
8
Wr A Command
Command
starT
Condition
1 1
7
A r Slave
Register # to
read
2 x 7 bit = 1
1 1
8
1 1
Rd A Data Byte 0 N P
repeat starT
Acknowledge
Master to
Byte Read Protocol
Not ack
stoP
Condition
Slave to
Figure 7. Byte Read Protocol
4.1.2. Byte Write
Figure 8 illustrates a simple, typical byte write. For byte operation, the 2 x 7th bit of the command byte must be set.
For block operations, the 2 x 7th bit must be reset. If the bit is not set, the next byte must be the byte transfer count.
The count can be between 1 and 32. It is not allowed to be zero or to exceed 32.
1
7
T Slave
Command
starT Condition
1 1
8
Wr A Command
Register # to
write
2 x 7 bit = 1
1
8
1 1
A Data Byte 0 A P
Acknowledge
Byte Write Protocol
Master to
Slave to
Figure 8. Byte Write Protocol
18
stoP Condition
Rev. 1.2
Si53106
4.2. Block Read/Write
4.2.1. Block Read
After the slave address is sent with the R/W condition bit set, the command byte is sent with the MSB = 0. The
slave acknowledges the register index in the command byte. The master sends a repeat start function. After the
slave acknowledges this, the slave sends the number of bytes it wants to transfer (>0 and <33). The master
acknowledges each byte except the last and sends a stop function.
1
7
T Slave
1 1
8
1 1
7
Wr A Command Code A r Slave
Command
starT
Condition
8
1
Data Byte A
1 1
Rd A
Register # to
repeat starT
read
Acknowledge
2 x 7 bit = 1
8
1
8
1 1
Data Byte 0 A Data Byte 1 N P
Master to
Slave to
Not acknowledge
stoP Condition
Block Read Protocol
Figure 9. Block Read Protocol
4.2.2. Block Write
After the slave address is sent with the R/W condition bit not set, the command byte is sent with the MSB = 0. The
lower seven bits indicate the register at which to start the transfer. If the command byte is 00h, the slave device will
be compatible with existing block mode slave devices. The next byte of a write must be the count of bytes that the
master will transfer to the slave device. The byte count must be greater than zero and less than 33. Following this
byte are the data bytes to be transferred to the slave device. The slave device always acknowledges each byte
received. The transfer is terminated after the slave sends the Ack and the master sends a stop function.
1
7
1 1
T Slave Address Wr A
Command bit
starT
Condition
8
Command
Register # to
write
2 x 7 bit = 0
1
A
Master to
Slave to
Acknowledge
1
8
1
8
1 1
8
Byte Count = 2 A Data Byte 0 A Data Byte 1 A P
stoP Condition
Block Write Protocol
Figure 10. Block Write Protocol
Rev. 1.2
19
Si53106
4.3. Control Registers
Table 17. Byte 0: Frequency Select, Output Enable, PLL Mode Control Register
Bit
Description
If Bit = 0
If Bit = 1
Type
Default
Output(s)
Affected
0
100M_133M#
Frequency Select
133 MHz
100 MHz
R
Latched at
power up
DIF[11:0]
1
PLL Mode 0
RW
1
2
PLL Mode 1
See PLL Operating Mode
Readback Table
RW
1
3
PLL Software Enable
HW Latch
RW
0
4
Reserved
0
5
Reserved
0
6
PLL Mode 0
See PLL Operating Mode
Readback Table
R
Latched at
power up
7
PLL Mode 1
See PLL Operating Mode
Readback Table
R
Latched at
power up
SMBUS
Control
Note: Byte 0, bit_[3:1] are BW PLL SW enable for the DB1200ZL. Setting bit 3 to 1 allows the user to override the Latch value
from pin 5 via use of bits 2 and 1. Use the values from the PLL Operating Mode Readback Table. Note that Bits 7 and 6
will keep the value originally latched on pin 5. A warm reset of the system will have to be accomplished if the user
changes these bits.
20
Rev. 1.2
Si53106
Table 18. Byte 1: Output Enable Control Register
Bit
Description
If Bit = 0
If Bit = 1
Type
Default
Output(s)
Affected
0
Reserved
1
Output Enable DIF0
Low/Low
Enabled
RW
1
DIF0
2
Output Enable DIF1
Low/Low
Enabled
RW
1
DIF1
3
Reserved
0
4
Reserved
0
5
Output Enable DIF2
Low/Low
Enabled
RW
1
DIF2
6
Output Enable DIF3
Low/Low
Enabled
RW
1
DIF3
7
Reserved
0
0
Rev. 1.2
21
Si53106
Table 19. Byte 2: Output Enable Control Register
Bit
Description
If Bit = 0
If Bit = 1
Type
Default
Output(s)
Affected
0
Output Enable for DI4
Low/Low
Enabled
RW
1
DIF4
1
Reserved
2
Output Enable for DI5
3
Reserved
0
4
Reserved
0
5
Reserved
0
6
Reserved
0
7
Reserved
0
0
Low/Low
Enabled
RW
1
DIF5
Table 20. Byte 3: Reserved Control Register
22
Bit
Description
If Bit = 0
0
Reserved
0
1
Reserved
0
2
Reserved
0
3
Reserved
0
4
Reserved
0
5
Reserved
0
6
Reserved
0
7
Reserved
0
Rev. 1.2
If Bit = 1
Type
Default
Output(s)
Affected
Si53106
Table 21. Byte 4: Reserved Control Register
Bit
Description
If Bit = 0
If Bit = 1
Type
Default
0
Reserved
0
1
Reserved
0
2
Reserved
0
3
Reserved
0
4
Reserved
0
5
Reserved
0
6
Reserved
0
7
Reserved
0
Output(s)
Affected
Table 22. Byte 5: Vendor/Revision Identification Control Register
Bit
Description
0
If Bit = 0
If Bit = 1
Type
Default
Default
Vendor ID Bit 0
R
Vendor Specific
0
1
Vendor ID Bit 1
R
Vendor Specific
0
2
Vendor ID Bit 2
R
Vendor Specific
0
3
Vendor ID Bit 3
R
Vendor Specific
1
4
Revision Code Bit 0
R
Vendor Specific
0
5
Revision Code Bit 1
R
Vendor Specific
0
6
Revision Code Bit 2
R
Vendor Specific
0
7
Revision Code Bit 3
R
Vendor Specific
0
Table 23. Byte 6: Device ID Control Register
Bit
Description
If Bit = 0
If Bit = 1
0
Device ID 0
R
0
1
Device ID 1
R
0
2
Device ID 2
R
0
3
Device ID 3
R
0
4
Device ID 4
R
0
5
Device ID 5
R
0
6
Device ID 6
R
0
7
Device ID 7 (MSB)
R
0
Rev. 1.2
Type
Default
Default
23
Si53106
Table 24. Byte 7: Byte Count Register
24
Bit
Description
0
If Bit = 0
If Bit = 1
Type
Default
BC0 - Writing to this register configures how many bytes will be
read back
RW
0
1
BC1 -Writing to this register configures how many bytes will be
read back
RW
0
2
BC2 -Writing to this register configures how many bytes will be
read back
RW
0
3
BC3 -Writing to this register configures how many bytes will be
read back
RW
1
4
BC4 -Writing to this register configures how many bytes will be
read back
RW
0
5
Reserved
0
6
Reserved
0
7
Reserved
0
Rev. 1.2
Output(s)
Affected
Si53106
5. Power Filtering Example
5.1. Ferrite Bead Power Filtering
Silicon Labs recommends using a ferrite bead with characteristics matching Murata BLM15EG221SN1.
Figure 11. Recommended of Si53106 Power Filtering
Rev. 1.2
25
Si53106
OE_4
DIF_4
DIF_4
40
39
38
37
36
35
34
33
32
31
GNDA
VDDA
OE_5
DIF_5
DIF_5
VDD
NC
6. Pin Descriptions: 40-Pin QFN
Si53106
Connect epad
Pin41 to GND
NC
NC
NC
OE_0
DIF_0
DIF_0
VDD
DIF_1
DIF_1
OE_1
26
30
29
28
27
26
VDD_IO
OE_3
DIF_3
DIF_3
NC
25 VDD
24 DIF_2
23 DIF_2
22 OE_2
21 VDD_IO
11
12
13
14
15
16
17
18
19
20
100M_133M 1
HBW_BYPASS_LBW 2
PWRGD / PWRDN 3
VDDR 4
CLK_IN 5
CLK_IN 6
SA_0 7
SDA 8
SCL 9
SA_1 10
Rev. 1.2
Si53106
Table 25. Si53106 40-Pin QFN Descriptions
Pin #
Name
Type
Description
1
100M_133M
I,SE
3.3 V tolerant inputs for input/output frequency selection. An external pullup or pull-down resistor is attached to this pin to select the input/output
frequency.
High = 100 MHz output
Low = 133 MHz output
2
HBW_BYPASS_LBW
I, SE
Tri-Level input for selecting the PLL bandwidth or bypass mode.
High = High BW mode
Med = Bypass mode
Low = Low BW mode
3
PWRGD/PWRDN
I
4
VDDR
VDD
5
CLK_IN
I, DIF 0.7 V Differential input.
6
CLK_IN
I, DIF 0.7 V Differential input.
7
SA_0
I,PU
8
SDA
I/O
Open collector SMBus data.
9
SCL
I/O
SMBus slave clock input.
10
SA_1
I,PU
11
NC
I/O
No connect. There are active signals on pin 11and 12, do not connect
anything to these pins.
12
NC
I/O
No connect. There are active signals on pin 11 and 12, do not connect
anything to these pins.
13
NC
-
14
OE_0
I, SE
15
DIF_0
O, DIF 0.7 V Differential clock output. Default is 1:1.
16
DIF_0
O, DIF 0.7 V Differential clock output. Default is 1:1.
17
VDD
18
DIF_1
O, DIF 0.7 V Differential clock output. Default is 1:1.
19
DIF_1
O, DIF 0.7 V Differential clock output. Default is 1:1.
20
OE_1
I, SE
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
21
VDD_IO
VDD
Power supply for differential outputs.
22
OE_2
I, SE
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
23
DIF_2
3.3 V LVTTL input to power up or power down the device.
3.3 V power supply for differential input receiver. This VDDR should be
treated as an analog power rail and filtered appropriately.
3.3 V LVTTL input selecting the address. Tri-level input.
3.3 V LVTTL input selecting the address. Tri-level input.
Do not connect this pin to anything.
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
3.3 V 3.3 V power supply for outputs.
O, DIF 0.7 V Differential clock outputs. Default is 1:1.
Rev. 1.2
27
Si53106
Table 25. Si53106 40-Pin QFN Descriptions
Pin #
Name
24
DIF_2
25
VDD
26
NC
27
DIF_3
O, DIF 0.7 V Differential clock output. Default is 1:1.
28
DIF_3
O, DIF 0.7 V Differential clock output. Default is 1:1.
29
OE_3
I, SE
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
30
VDD_IO
VDD
Power supply for differential outputs.
31
DIF_4
O, DIF 0.7 V Differential clock output. Default is 1:1.
32
DIF_4
O, DIF 0.7 V Differential clock output. Default is 1:1.
33
OE_4
I, SE
34
NC
-
35
VDD
36
DIF_5
O, DIF 0.7 V Differential clock output. Default is 1:1.
37
DIF_5
O, DIF 0.7 V Differential clock output. Default is 1:1.
38
OE_5
I, SE
39
VDDA
3.3 V 3.3 V power supply for outputs.
40
GNDA
GND
Ground for outputs.
41
GND
GND
Connect epad to ground.
28
Type
Description
O, DIF 0.7 V Differential clock output. Default is 1:1.
3.3 V 3.3 V power supply for output.
-
Do not connect this pin to anything.
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
Do not connect this pin to anything.
3.3 V 3.3 V power supply for outputs.
3.3 V LVTTL active low input for enabling differential outputs (default).
Controls the corresponding output pair. Internal pull-down.
Rev. 1.2
Si53106
7. Ordering Guide
Part Number
Package Type
Temperature
Si53106-A01AGM
40-pin QFN
Extended, –40 to 85 C
Si53106-A01AGMR
40-pin QFN—Tape and Reel
Extended, –40 to 85 C
Lead-free
Rev. 1.2
29
Si53106
8. Package Outline
Figure 12 illustrates the package details for the Si53106. Table 26 lists the values for the dimensions shown in the
illustration.
Figure 12. 40-Pin Quad Flat No Lead (QFN) Package
Table 26. Package Diagram Dimensions
Dimension
Min
Nom
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
b
0.15
0.20
0.25
D
D2
5.00 BSC.
2.65
2.80
e
0.40 BSC.
E
5.00 BSC.
2.95
E2
2.65
2.80
2.95
L
0.30
0.40
0.50
aaa
0.10
bbb
0.07
ccc
0.1
ddd
0.05
eee
0.08
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-220
30
Rev. 1.2
Si53106
9. Land Pattern
Figure 13 illustrates the recommended land pattern details for the Si53106 in a 40-pin QFN package. Table 27 lists
the values for the dimensions shown in the illustration.
Figure 13. Land Pattern
Rev. 1.2
31
Si53106
Table 27. PCB Land Pattern Dimensions
Dimension
Min
Max
C1
4.80
4.90
C2
4.80
4.90
E
0.40 BSC
X1
0.15
0.20
X2
2.85
2.95
Y1
0.75
0.85
Y2
2.85
2.95
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 m minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.0 mm square openings on a 1.4 mm pitch should be used for the center ground pad.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
32
Rev. 1.2
Si53106
DOCUMENT CHANGE LIST
Revision 1.1 to Revision 1.2
Updated Features on page 1.
Updated Description on page 1.
 Updated specs in Table 5, “Phase Jitter,” on page 7.


Rev. 1.2
33
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